Welding control method and apparatus
By detecting weld parameters and adjusting welding parameters in real time, the problem of inconsistent weld quality in welded plates was solved, achieving uniformity of weld quality and improved product yield.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHOUGANG GROUP CO LTD
- Filing Date
- 2025-04-09
- Publication Date
- 2026-05-12
AI Technical Summary
During the welding process of welded plates, it is difficult to ensure the consistency of weld quality, resulting in poor quality of the welded plates.
By detecting weld parameters such as weld reinforcement and weld gap, target welding parameters such as welding speed and wire feed speed are determined according to preset correspondences, and the welding process of the welding execution structure is adjusted in real time to ensure weld uniformity.
This improved the consistency of weld quality and increased product yield.
Smart Images
Figure CN120286802B_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of welding technology, and in particular relates to a welding control method and equipment. Background Technology
[0002] Welded plates can be made by welding together plates of different thicknesses and strengths, and then forming product parts through hot stamping. Therefore, they are widely used in various fields, such as the automotive industry.
[0003] During the welding process, it is difficult to make the edges of the mating surfaces of the two plates completely straight or smooth, which makes it difficult to ensure the consistency of the weld quality and may result in poor quality of the welded plates. Summary of the Invention
[0004] The embodiments of this application provide a welding control method and equipment, which can at least to some extent improve weld uniformity, ensure weld quality, and improve product yield.
[0005] Other features and advantages of this application will become apparent from the following detailed description, or may be learned in part from practice of this application.
[0006] According to a first aspect of the embodiments of this application, a welding control method is provided, the method comprising:
[0007] During the welding process of the first welding plate and the second welding plate, the target weld parameters are detected. The target weld parameters include: the weld reinforcement at the previous welding position and / or the weld gap at the next welding position. In the length direction of the weld of the first welding plate and the second welding plate, the previous welding position and the next welding position are adjacent to each other.
[0008] Based on a preset correspondence, target welding parameters corresponding to the target weld parameters are determined, including: target welding speed and / or target wire feed speed;
[0009] Based on the target welding parameters, the welding execution structure is controlled to perform welding at the next welding position.
[0010] Optionally, the correspondence includes a first correspondence, and determining the target welding parameters corresponding to the target weld parameters according to the preset correspondence includes:
[0011] Based on the first correspondence, the welding speed and / or wire feeding speed corresponding to the weld reinforcement height are determined, wherein the weld reinforcement height is positively correlated with the target welding speed and the weld reinforcement height is negatively correlated with the target wire feeding speed.
[0012] Optionally, the first correspondence is determined based on the following formula (1) and / or formula (2):
[0013]
[0014] Wherein, v1 represents the target welding speed, n1 represents the first correction coefficient, v0 represents the preset initial welding speed, h represents the weld reinforcement height detected at the previous welding position, and h0 represents the preset target weld reinforcement height; and / or
[0015]
[0016] Wherein, ω1 represents the target wire feeding speed, n2 represents the second correction coefficient, and ω0 represents the preset initial wire feeding speed.
[0017] Optionally, the correspondence includes a second correspondence, and determining the target welding parameters corresponding to the target weld parameters according to the preset correspondence includes:
[0018] Based on the second correspondence, the welding speed and / or wire feeding speed corresponding to the weld gap are determined, wherein the weld gap is negatively correlated with the target welding speed and positively correlated with the target wire feeding speed.
[0019] Optionally, the second correspondence is determined based on the following formula (3) and / or formula (4):
[0020]
[0021] Wherein, v1 represents the target welding speed, n3 represents the third correction coefficient, v0 represents the preset initial welding speed, J0 represents the preset target weld gap, and J represents the weld gap detected at the next welding position; and / or
[0022]
[0023] Wherein, ω1 represents the target wire feeding speed, n4 represents the fourth correction coefficient, and ω0 represents the preset initial wire feeding speed.
[0024] Optionally, after controlling the welding execution structure to perform weld at the subsequent weld position according to the target welding parameters, the method further includes:
[0025] When the welded plate is placed in a hot stamping die, the welded plate is processed based on the hot stamping process;
[0026] The welded plate refers to the first welded plate and the second welded plate after being welded together. The hot stamping die is provided with multiple cooling channels, which are used to cool the welded plate after hot stamping.
[0027] Optionally, the cooling rate of the cooling channel on the welded plate is negatively correlated with the target parameter of the cooling channel, wherein the target parameter is the target minimum distance between the outer edge of the cooling channel and the surface of the hot stamping die;
[0028] The minimum distance to the target is determined based on the following steps:
[0029] Acquisition steps: Perform hot stamping simulation test on the hot stamping die, and after the test is completed, obtain the temperature of the die surface area corresponding to each cooling channel, as well as the temperature difference and temperature ratio between the temperature of each die surface area and the average temperature of the die surface.
[0030] Adjustment steps: For each cooling channel, within a preset minimum distance range, the minimum distance is adjusted based on the initial minimum distance according to the temperature ratio. After the minimum distance of each cooling channel is adjusted, the acquisition step is executed again.
[0031] Determination Step: Repeat the acquisition step and the adjustment step until the average temperature of the mold surface is less than or equal to the preset temperature, and the maximum temperature difference between the temperatures of each mold surface area is less than or equal to the preset temperature difference. Then, take the minimum distance of each cooling channel in this step as the target minimum distance for each of them.
[0032] Optionally, adjusting the minimum distance based on the temperature ratio includes:
[0033] Based on the temperature ratio, the minimum distance is adjusted according to the following formula (5):
[0034] h2 = h1 × (1 - B); (5)
[0035] Where h2 represents the minimum distance after adjustment, h1 represents the minimum distance before adjustment, and B represents the temperature ratio.
[0036] Optionally, the preset minimum distance range is 2mm-15mm, the preset temperature is 200 degrees Celsius, and the preset temperature difference is 30 degrees Celsius.
[0037] According to a second aspect of the embodiments of this application, an electronic device is provided, including one or more processors and one or more memories, wherein at least one piece of program code is stored in the one or more memories, the at least one piece of program code being loaded and executed by the one or more processors to perform the operations performed as described in any of the methods of the first aspect.
[0038] According to a third aspect of the embodiments of this application, a computer-readable storage medium is provided, the computer-readable storage medium storing at least one computer program instruction, the at least one computer program instruction being loaded and executed by a processor to perform the operation as described in any of the methods in the first aspect.
[0039] The one or more technical solutions provided in the embodiments of the present invention achieve at least the following technical effects or advantages:
[0040] The welding control method of this application detects target weld parameters during the welding process of a first welding plate and a second welding plate. These target weld parameters include the weld reinforcement height at the previous welding position and / or the weld gap at the subsequent welding position. The previous and subsequent welding positions are adjacent to each other along the length of the welds of the first and second welding plates. Based on a preset correspondence, target welding parameters corresponding to the target weld parameters are determined. These target welding parameters include a target welding speed and / or a target wire feed speed. Based on the target welding parameters, the welding execution structure is controlled to perform welding at the subsequent welding position. Therefore, in the welding process of two welding plates, this embodiment adjusts the target welding parameters at the subsequent welding position in real time according to the target weld parameters, improving weld uniformity, ensuring weld quality, and increasing product yield.
[0041] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description
[0042] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. It is obvious that the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort. In the drawings:
[0043] Figure 1 A flowchart of a welding control method according to an embodiment of this application is shown;
[0044] Figure 2 A partial cross-sectional structural schematic diagram of a hot stamping die according to an embodiment of this application is shown;
[0045] Figure 3 A schematic diagram of the structure of a computer system suitable for implementing the electronic device of the present application is shown. Detailed Implementation
[0046] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.
[0047] Furthermore, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to give a thorough understanding of embodiments of this application. However, those skilled in the art will recognize that the technical solutions of this application can be practiced without one or more of the specific details, or other methods, components, apparatuses, steps, etc., can be employed. In other instances, well-known methods, apparatuses, implementations, or operations are not shown or described in detail to avoid obscuring various aspects of this application.
[0048] The block diagrams shown in the accompanying drawings are merely functional entities and do not necessarily correspond to physically independent entities. That is, these functional entities can be implemented in software, in one or more hardware modules or integrated circuits, or in different models and / or processor devices and / or microcontroller devices.
[0049] The flowcharts shown in the accompanying drawings are merely illustrative and do not necessarily include all content and operations / steps, nor do they necessarily have to be performed in the described order. For example, some operations / steps can be broken down, while others can be combined or partially combined; therefore, the actual execution order may change depending on the specific circumstances.
[0050] It should also be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such uses of these terms can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described.
[0051] Welded plates can be made by welding together plates of different thicknesses and strengths, and forming product parts through hot stamping. These parts have excellent lightweight and impact resistance, and are therefore widely used in various fields, such as the automotive industry.
[0052] In traditional laser wire filler welding, the stability of weld quality plays a crucial role. Improving weld quality and ensuring the consistency of weld joint performance are of great significance for increasing product yield.
[0053] Typically, blanking is required before welding, and then the sheet metal is mounted on a fixture. Existing blanking processes include mechanical blanking and laser blanking. After blanking, the sheared edges are prone to defects, such as insufficient smoothness or evenness, which can lead to variations in the weld reinforcement during welding, making it difficult to guarantee consistent weld joint quality. Therefore, in some processes, the splicing edges of the sheets are sheared again before welding two sheets to improve their smoothness. Furthermore, because the splicing edges are uneven during blanking, even with constant welding parameters, it is difficult to ensure consistent weld reinforcement and weld joint performance.
[0054] In view of this, embodiments of this application provide a welding control method that can improve weld uniformity to a certain extent, ensure weld quality, and improve product yield.
[0055] See Figure 1 The flowchart of the welding control method according to an embodiment of this application is shown.
[0056] like Figure 1 As shown, according to a first aspect of the embodiments of this application, a welding control method is provided. The method can be executed by a controller of the welding process, such as an industrial computer deployed at the welding process site. The method includes, but is not limited to, steps S1-S3:
[0057] Step S1. During the welding process of the first welding plate and the second welding plate, the target weld parameters are detected. The target weld parameters include: the weld reinforcement at the previous welding position and / or the weld gap at the next welding position. In the length direction of the weld of the first welding plate and the second welding plate, the previous welding position and the next welding position are adjacent to each other.
[0058] Understandably, before welding the first and second welding plates together, blanking is required, for example, by mechanical blanking or laser blanking. Then, the two welding plates are mounted on a fixture, and the joint edges of the two welding plates are made as smooth as possible to ensure the quality of subsequent welding.
[0059] It should be noted that, taking the laser-filled wire welding process as an example, during the welding of two welding plates, the welding actuator (e.g., a laser welding machine) uses a laser to irradiate the welding material filling the weld along the length of the weld. The welding material forms a molten pool, and after the molten pool solidifies, a welded joint is formed. Based on this, the previous welding position in the embodiments of this application can refer to the position where the molten pool solidifies last (i.e., the position that just solidifies during inspection).
[0060] Understandably, by detecting the weld reinforcement at the previous welding position, the welding speed and / or wire feeding speed at the next welding position can be adjusted to avoid the weld reinforcement at the next welding position being too large or too small, thus ensuring the consistency of the welded joint.
[0061] In addition, by detecting the weld gap at the next welding position, for example by using optical equipment or radar to detect the gap value of the welding plates before welding the molten pool, the splicing speed and / or wire feeding speed at the next welding position can be adjusted. This can also prevent the weld reinforcement at the next welding position from being too large or too small, thus ensuring the consistency of the welded joint.
[0062] Step S2. Determine the target welding parameters corresponding to the target weld parameters according to the preset correspondence relationship. The target welding parameters include: target welding speed and / or target wire feed speed.
[0063] In some embodiments, the correspondence includes a first correspondence, and determining the target welding parameters corresponding to the target weld parameters according to the preset correspondence includes:
[0064] Based on the first correspondence, the welding speed and / or wire feeding speed corresponding to the weld reinforcement height are determined, wherein the weld reinforcement height is positively correlated with the target welding speed and the weld reinforcement height is negatively correlated with the target wire feeding speed.
[0065] For example, when the weld reinforcement at the previous welding position exceeds a preset reinforcement range (which may vary depending on the sheet material, for example, it may be less than or equal to 3mm), the larger the weld reinforcement, the higher the target welding speed. As the welding speed increases, less welding material enters the weld per unit time, thereby reducing the weld reinforcement at the subsequent position to ensure the consistency of the welded joint. Conversely, when the weld reinforcement at the previous welding position is below the preset reinforcement range, the smaller the weld reinforcement, the lower the target welding speed. As the welding speed decreases, more welding material enters the weld per unit time, thereby increasing the weld reinforcement at the subsequent position to ensure the consistency of the welded joint.
[0066] For example, when the weld reinforcement at the previous welding position exceeds the preset reinforcement range, the larger the weld reinforcement, the lower the target wire feed speed. As the wire feed speed decreases, less welding material enters the weld per unit time, thereby reducing the weld reinforcement at the subsequent position to ensure the consistency of the welded joint. Conversely, when the weld reinforcement at the previous welding position is below the preset reinforcement range, the smaller the weld reinforcement, the higher the target wire feed speed. As the wire feed speed increases, more welding material enters the weld per unit time, thereby increasing the weld reinforcement at the subsequent position to ensure the consistency of the welded joint.
[0067] In some embodiments, the first correspondence is determined based on the following formula (1) and / or formula (2):
[0068]
[0069] Wherein, v1 represents the target welding speed, n1 represents the first correction coefficient, v0 represents the preset initial welding speed, h represents the weld reinforcement height detected at the previous welding position, and h0 represents the preset target weld reinforcement height; and / or
[0070]
[0071] Wherein, ω1 represents the target wire feeding speed, n2 represents the second correction coefficient, and ω0 represents the preset initial wire feeding speed.
[0072] For example: During welding, the height h of the weld pool after solidification is detected to be 20%, while the actual required height h0 is 14%. At this time, the initial welding speed v0 is 3 m / min, the first correction coefficient is set to 1, and the target welding speed v1 is calculated to be 4.3 m / min using formula (1). Therefore, the welding speed at the next welding position is 4.3 m / min. It is understandable that as the welding speed increases, the height h will decrease, and further adjustments to the welding speed may be necessary.
[0073] For example: During welding, the weld pool solidification height h is detected to be 20%, while the actual required weld pool height h0 is 14%. At this time, the initial wire feed speed ω0 is 2 m / min, the second correction coefficient is set to 1, and the target wire feed speed ω1 is calculated to be 1.4 m / min using formula (2). Then, the wire feed speed at the next welding position is 1.4 m / min. It is understandable that as the wire feed speed decreases, the weld pool height will decrease, and further adjustments to the wire feed speed may be necessary.
[0074] Step S3. Based on the target welding parameters, control the welding execution structure to perform welding at the next welding position.
[0075] In some embodiments, the correspondence includes a second correspondence, and determining the target welding parameters corresponding to the target weld parameters according to the preset correspondence includes:
[0076] Based on the second correspondence, the welding speed and / or wire feeding speed corresponding to the weld gap are determined, wherein the weld gap is negatively correlated with the target welding speed and positively correlated with the target wire feeding speed.
[0077] For example, a larger weld gap at a subsequent weld joint results in a lower target welding speed. As the welding speed decreases, less welding material enters the weld per unit time, thus reducing the weld reinforcement at the subsequent joint and ensuring the consistency of the welded joint. Conversely, a smaller weld gap at a subsequent weld joint results in a higher target welding speed. As the welding speed increases, more welding material enters the weld per unit time, thus increasing the weld reinforcement at the subsequent weld joint.
[0078] For example, a larger weld gap at a subsequent welding position corresponds to a higher target wire feed speed. As the wire feed speed increases, more welding material enters the weld per unit time, thus increasing the weld reinforcement at the subsequent position and ensuring the consistency of the welded joint. Conversely, a smaller weld gap at a subsequent welding position corresponds to a lower target wire feed speed. As the wire feed speed decreases, less welding material enters the weld per unit time, thus reducing the weld reinforcement at the subsequent welding position.
[0079] In some embodiments, the second correspondence is determined based on the following formula (3) and / or formula (4):
[0080]
[0081] Wherein, v1 represents the target welding speed, n3 represents the third correction coefficient, v0 represents the preset initial welding speed, J0 represents the preset target weld gap, and J represents the weld gap detected at the next welding position; and / or
[0082]
[0083] Wherein, ω1 represents the target wire feeding speed, n4 represents the fourth correction coefficient, and ω0 represents the preset initial wire feeding speed.
[0084] For example, during the welding process, it was detected that the gap between the two welding plates to be welded was 0.21 mm in front of the weld pool, while the actual gap between the two weld plates was set to 0.2 mm. At this time, the initial welding speed v0 was 3 m / min, the third correction coefficient was set to 1, and the target welding speed v1 was calculated to be 2.86 m / min using formula (3). Subsequently, it was set that when welding reached the 0.21 mm gap position, the welding speed would be 2.86 m / min. As the welding speed decreased, more wire would be filled into the gap, thereby avoiding excessively low reinforcement and ensuring the uniformity of reinforcement and weld quality.
[0085] For example, during the welding process, it is detected that the gap between the two welding plates to be welded is 0.21 mm in front of the weld pool. The actual gap between the two welding plates is set to 0.2 mm. At this time, the wire feeding speed ω0 is 2 m / min, the fourth correction coefficient is set to 1, and the target wire feeding speed ω1 is calculated to be 2.1 m / min by formula (4). Then, it is set that when welding reaches the 0.21 mm gap position, the wire feeding speed is 2.1 m / min. As the wire feeding speed increases, more wire will be filled into the gap, thereby avoiding the reinforcement height being too low and ensuring the uniformity of the reinforcement height and weld quality.
[0086] See Figure 2 The diagram shows a partial cross-sectional structural schematic of a hot stamping die according to an embodiment of this application.
[0087] In some embodiments, after controlling the welding execution structure to perform weld joint welding at the subsequent weld joint position according to the target welding parameters, the method further includes:
[0088] When the welded plate is placed in the hot stamping die 1, the welded plate is processed based on the hot stamping process; wherein, the welded plate is the first welded plate and the second welded plate after being welded together, and the hot stamping die 1 is provided with a plurality of cooling water channels 2, which are used to cool the welded plate after hot stamping.
[0089] In the hot forming process, the hot stamping die 1 is responsible for cooling and quenching the high-temperature sheet metal. Setting up cooling channels 2 inside the hot stamping die 1 is an effective way to achieve this function. The hot stamping die 1 is typically designed with an insert structure, with cooling channels 2 arranged inside the inserts. The inserts are fixed to a water distribution plate in a structural sequence, and the water distribution plate supplies water to each insert separately, forming an independent cooling circulation system for each insert. The cooling channels 2 inside the inserts can be conformal channels.
[0090] In some embodiments, the cooling rate of the cooling channel 2 on the welded plate is negatively correlated with the target parameter of the cooling channel 2, which is the target minimum distance H between the outer edge of the cooling channel 2 and the surface of the hot stamping die 1.
[0091] It is understood that each cooling channel 2 is located inside the hot stamping die 1, and the specific location of the cooling channel 2 directly affects the cooling capacity of the die, and thus the cooling capacity of the hot stamped parts in the die. In the embodiments of this application, the cooling channel can be a conformal channel, for example, arranged along the length of the die. The minimum distance between the outer edge (outer edge) of the cooling channel and the hot stamping die 1 is H. The smaller H is, the higher the cooling rate; the larger H is, the lower the cooling rate.
[0092] In some embodiments, the minimum target distance is determined based on the following steps:
[0093] Acquisition steps: Perform hot stamping simulation test on the hot stamping die, and after the test is completed, obtain the temperature of the die surface area corresponding to each cooling channel, as well as the temperature difference and temperature ratio between the temperature of each die surface area and the average temperature of the die surface.
[0094] Adjustment steps: For each cooling channel, within a preset minimum distance range, the minimum distance is adjusted based on the initial minimum distance according to the temperature ratio. After the minimum distance of each cooling channel is adjusted, the acquisition step is executed again.
[0095] Determination Step: Repeat the acquisition step and the adjustment step until the average temperature of the mold surface is less than or equal to the preset temperature, and the maximum temperature difference between the temperatures of each mold surface area is less than or equal to the preset temperature difference. Then, take the minimum distance of each cooling channel in this step as the target minimum distance for each of them.
[0096] In some embodiments, adjusting the minimum distance according to the temperature ratio includes:
[0097] Based on the temperature ratio, the minimum distance is adjusted according to the following formula (5):
[0098] h2 = h1 × (1 - B); (5)
[0099] Where h2 represents the minimum distance after adjustment, h1 represents the minimum distance before adjustment, and B represents the temperature ratio.
[0100] In some embodiments, the preset minimum distance range is 2mm-15mm, the preset temperature is 200 degrees Celsius, and the preset temperature difference is 30 degrees Celsius.
[0101] For example, after the hot stamping die design is completed, hot stamping simulation tests, such as simulation analysis, are required. Simulation analysis includes die formability analysis and part (the sheet metal to be processed placed in the die, such as the welded plate mentioned above) cooling analysis. After simulation, the surface temperatures of the part and the die (die surface temperature) can be obtained. Based on the temperature analysis results, the parameters of the cooling channels can be optimized, such as the minimum distance optimization mentioned above, thereby improving the temperature uniformity of the hot stamped parts. The more uniform the part temperature, the more uniform the performance of the part after quenching, and the better the part quality.
[0102] For example, after the hot stamping simulation is completed, the temperature T of the mold surface area corresponding to the cooling channels in the simulation model is measured. The cooling channels of the insert cross-section are numbered sequentially as 1, 2, 3, ..., n. The shortest distances between the outer edge of each cooling channel and the mold surface are H1, H2, H3, ..., Hn, respectively. When the hot stamping simulation is completed, the temperatures of the mold surface area corresponding to each cooling channel are T1, T2, T3, ..., Tn, respectively.
[0103] After the hot stamping simulation is completed, the average temperature Tm of the die surface corresponding to the temperature T of the die surface area for different cooling channels is first calculated, where Tm = (T1 + T2 + ... + Tn) / n. Then, the temperature difference and temperature ratio between the temperature T of each die surface area and the average die surface temperature Tm are calculated. Taking cooling channel H1 as an example, the temperature difference Tc = T1 - Tm, and the temperature ratio B = Tc / Tm.
[0104] Subsequently, the minimum distance H between the outer edge of the cooling channel and the mold surface is optimized. For each cooling channel, within a preset minimum distance range, such as 2mm≤H≤15mm or 3mm≤H≤14mm, based on the initial minimum distance, such as 8mm, the minimum distance is adjusted according to the temperature ratio B, for example: h2=h1×(1-B). The minimum distance of each cooling channel is adjusted in turn, and the acquisition step is executed again after the minimum distance of each cooling channel is adjusted, until the average temperature Tm of the mold surface is less than or equal to the preset temperature, such as 200 degrees Celsius, and the maximum temperature difference between the temperatures of each mold surface area is less than or equal to the preset temperature difference, such as 30 degrees Celsius. The minimum distance of each channel in this step is taken as the target minimum distance for each channel.
[0105] For example, the initial minimum distance of the first water channel H1 (numbered 1) is 8mm. After mold hot stamping simulation, the mold surface temperature distribution is detected. The detection shows that the average mold surface temperature Tm is 205℃, the temperature T1 of the mold surface area corresponding to the first water channel is 220℃, and the maximum temperature difference is 36℃. At this time, the temperature ratio B = (220-205) / 205 = 7.3%. Based on this ratio, optimization yields h11 (the minimum distance of the first water channel after the first adjustment) = 8 × (1-7.3%) = 7.416mm. This process is repeated for all water channels. After optimization, simulation analysis is performed again. The average mold surface temperature Tm is reduced to 186℃, the maximum temperature difference is 26℃, and the optimized mold surface temperature T11 of the first water channel is 190℃. Optimization improves the uniformity of the mold surface temperature and enhances the mold's cooling capacity.
[0106] According to a second aspect of the embodiments of this application, an electronic device is provided, including one or more processors and one or more memories, wherein at least one piece of program code is stored in the one or more memories, and the at least one piece of program code is loaded and executed by the one or more processors to perform the operation as performed by any of the methods in the first aspect.
[0107] See Figure 3 This is a schematic diagram of the structure of a computer system suitable for implementing the electronic device of the present application.
[0108] like Figure 3 As shown, the electronic device 400 is manifested in the form of a general-purpose computing device. The components of the electronic device 400 may include, but are not limited to: at least one processing unit 410, at least one storage unit 420, and a bus 430 connecting different system components (including storage unit 420 and processing unit 410).
[0109] The storage unit stores program code, which can be executed by the processing unit 410, causing the processing unit 410 to perform the steps described in the "Embodiment Method" section above according to various exemplary embodiments of this application.
[0110] Storage unit 420 may include readable media in the form of volatile storage units, such as random access memory (RAM) 421 and / or cache 422, and may further include read-only memory (ROM) 423.
[0111] Storage unit 420 may also include a program / utility 424 having a set (at least one) of program modules 425, such program modules 425 including but not limited to: an operating system, one or more application programs, other program modules, and program data, each or some combination of these examples may include an implementation of a network environment.
[0112] Bus 430 can represent one or more of several types of bus structures, including a memory cell bus or memory cell controller, a peripheral bus, a graphics acceleration port, a processing unit, or a local bus using any of the various bus structures.
[0113] Electronic device 400 can also communicate with one or more external devices 500 (e.g., keyboard, pointing device, Bluetooth device, etc.), one or more devices that enable a user to interact with electronic device 400, and / or any device that enables electronic device 400 to communicate with one or more other computing devices (e.g., router, modem, etc.). This communication can be performed through I / O (input / output) interface 450, which can also be connected to display unit 440 to display the communication content. Furthermore, electronic device 400 can communicate with one or more networks (e.g., local area network (LAN), wide area network (WAN), and / or public network, such as the Internet) via network adapter 460. As shown, network adapter 460 communicates with other modules of electronic device 400 via bus 430. It should be understood that, although not shown in the figures, other hardware and / or software modules can be used in conjunction with electronic device 400, including but not limited to: microcode, device drivers, redundant processing units, external disk drive arrays, RAID systems, tape drives, and data backup storage systems.
[0114] The functions described herein can be implemented in hardware, software executed by a processor, firmware, or any combination thereof. If implemented in software executed by a processor, the functions can be stored as one or more instructions or codes on or transmitted via a computer-readable medium. Other examples and embodiments are within the scope and spirit of this invention and the appended claims. For example, due to the nature of software, the functions described above can be implemented using software executed by a processor, hardware, firmware, hardwired, or any combination thereof. Furthermore, the functional units can be integrated into a single processing unit, or each unit can exist physically separately, or two or more units can be integrated into a single unit.
[0115] In the several embodiments provided in this application, it should be understood that the disclosed technical content can be implemented in other ways. The device embodiments described above are merely illustrative; for example, the division of units can be a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the displayed or discussed mutual couplings, direct couplings, or communication connections may be through some interfaces; indirect couplings or communication connections between units or modules may be electrical or other forms.
[0116] The units described as separate components may or may not be physically separate. Similarly, the components of the control device may or may not be physical units; that is, they may be located in one place or distributed across multiple units. Some or all of the units can be selected to achieve the purpose of this embodiment, depending on actual needs.
[0117] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this invention, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, read-only memory (ROM), random access memory (RAM), portable hard drives, magnetic disks, or optical disks.
[0118] According to a third aspect of the embodiments of this application, a computer-readable storage medium is provided, the computer-readable storage medium storing at least one computer program instruction, the at least one computer program instruction being loaded and executed by a processor to perform the operation as described in any of the methods in the first aspect.
[0119] Computer-readable storage media may be portable compact disc read-only memory (CD-ROM) and include program code, and may run on a terminal device, such as a personal computer. However, the computer-readable storage medium of this application is not limited thereto. In this application, the readable storage medium may be any tangible medium that contains or stores a program that may be used by or in conjunction with an instruction execution system, apparatus, or device.
[0120] A readable storage medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples (a non-exhaustive list) of readable storage media include: an electrical connection having one or more wires, a portable disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage device, magnetic storage device, or any suitable combination thereof.
[0121] Program code for performing the operations of this application can be written in any combination of one or more programming languages, including object-oriented programming languages such as Java and C++, and conventional procedural programming languages such as C or similar languages. The program code can execute entirely on the user's computing device, partially on the user's computing device, as a standalone software package, partially on the user's computing device and partially on a remote computing device, or entirely on a remote computing device or server. In cases involving remote computing devices, the remote computing device can be connected to the user's computing device via any type of network, including a local area network (LAN) or a wide area network (WAN), or it can be connected to an external computing device (e.g., via the Internet using an Internet service provider).
[0122] The above description is merely an embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of the claims of this application.
Claims
1. A welding control method, characterized in that, The method includes: During the welding process of the first welding plate and the second welding plate, the target weld parameters are detected. The target weld parameters include: the weld reinforcement at the previous welding position. In the length direction of the weld of the first welding plate and the second welding plate, the previous welding position and the next welding position are adjacent to each other. Based on a preset correspondence, target welding parameters corresponding to the target weld parameters are determined, including: target welding speed and / or target wire feed speed; Based on the target welding parameters, the welding execution structure is controlled to perform welding at the next welding position; The correspondence includes a first correspondence, and determining the target welding parameters corresponding to the target weld parameters according to the preset correspondence includes: Based on the first correspondence, the welding speed and / or wire feeding speed corresponding to the weld reinforcement height are determined, wherein the weld reinforcement height is positively correlated with the target welding speed and negatively correlated with the target wire feeding speed; The first correspondence is determined based on the following formula (1) and / or formula (2): Official (1) in, Indicates the target welding speed, This represents the first correction factor. This indicates the preset initial welding speed. This indicates the weld reinforcement height detected at the previous welding position. Indicates the preset target weld reinforcement height; and / or Official (2) in, This indicates the target wire feeding speed. This represents the second correction factor. This indicates the preset initial wire feeding speed.
2. The method according to claim 1, characterized in that, After controlling the welding execution structure to perform weld at the subsequent weld position according to the target welding parameters, the method further includes: When the welded plate is placed in a hot stamping die, the welded plate is processed based on the hot stamping process; The welded plate refers to the first welded plate and the second welded plate after being welded together. The hot stamping die is provided with multiple cooling channels, which are used to cool the welded plate after hot stamping.
3. The method according to claim 2, characterized in that, The cooling rate of the cooling channel on the welded plate is negatively correlated with the target parameter of the cooling channel, which is the target minimum distance between the outer edge of the cooling channel and the surface of the hot stamping die. The minimum distance to the target is determined based on the following steps: Acquisition steps: Perform hot stamping simulation test on the hot stamping die, and after the test is completed, obtain the temperature of the die surface area corresponding to each cooling channel, as well as the temperature difference and temperature ratio between the temperature of each die surface area and the average temperature of the die surface. Adjustment steps: For each cooling channel, within a preset minimum distance range, the minimum distance is adjusted based on the initial minimum distance according to the temperature ratio. After the minimum distance of each cooling channel is adjusted, the acquisition step is executed again. Determination Step: Repeat the acquisition step and the adjustment step until the average temperature of the mold surface is less than or equal to the preset temperature, and the maximum temperature difference between the temperatures of each mold surface area is less than or equal to the preset temperature difference. Then, take the minimum distance of each cooling channel in this step as the target minimum distance for each of them.
4. The method according to claim 3, characterized in that, The adjustment of the minimum distance based on the temperature ratio includes: Based on the temperature ratio, the minimum distance is adjusted according to the following formula (5): h2 = h1 × (1 - B); (5) Where h2 represents the minimum distance after adjustment, h1 represents the minimum distance before adjustment, and B represents the temperature ratio.
5. The method according to claim 3, characterized in that, The preset minimum distance range is 2mm-15mm, the preset temperature is 200 degrees Celsius, and the preset temperature difference is 30 degrees Celsius.
6. An electronic device comprising one or more processors and one or more memories, wherein at least one piece of program code is stored in the one or more memories, the at least one piece of program code being loaded and executed by the one or more processors to perform an operation as described in any one of 1-5.