Workpiece stage and semiconductor inspection apparatus

Abstract

The application provides a workpiece carrier and a semiconductor detection device. The workpiece carrier comprises a lifting assembly, a jacking assembly, a reversing assembly and a driving mechanism. The lifting assembly comprises a lifting inclined surface and a bearing surface opposite to each other in the height direction of the workpiece carrier. The jacking assembly is provided with a jacking inclined surface at the bottom and a supporting column at the top. The jacking inclined surface intersects with the lifting inclined surface. The reversing assembly is in sliding fit with the lifting assembly and the jacking assembly. The driving mechanism comprises a transmission member and a linear driving member. The transmission member is in abutment with the lifting inclined surface and the jacking inclined surface. The linear driving member is connected with the transmission member and the driving direction intersects with the guiding direction of the reversing assembly. The lifting assembly and the jacking assembly share one driving mechanism, which is simple in structure, smooth in transmission and capable of realizing the precise cooperative operation of the lifting assembly and the jacking assembly.

Description

Technical Field

[0001] This application belongs to the field of semiconductor technology, and in particular relates to a workpiece stage and semiconductor testing equipment. Background Technology

[0002] In semiconductor testing equipment, a motion stage can precisely position wafers in the height direction. The motion stage is equipped with a lifting mechanism and a carrier plate, both of which can be raised and lowered. Wafers transported by an external transfer robot can be placed onto the carrier plate by the lifting mechanism, or the lifting mechanism can lift the wafers from the carrier plate for removal by the external transfer robot.

[0003] In some technologies, the lifting mechanism and the support plate are raised and lowered independently, and their coordinated operation is a problem that needs to be solved by those skilled in the art. Summary of the Invention

[0004] This application provides a workpiece stage and a semiconductor testing device. The workpiece stage can achieve precise coordinated operation of the lifting component and the jacking component.

[0005] In a first aspect, embodiments of this application provide a workpiece platform, comprising a lifting assembly, a lifting component, a reversing assembly, and a driving mechanism. The lifting assembly includes a lifting ramp and a bearing surface opposite each other in the height direction of the workpiece platform. The lifting assembly has a lifting ramp at its bottom and a support column at its top, and the inclined surface where the lifting ramp is located intersects with the inclined surface where the lifting ramp is located. The reversing assembly slides with the lifting assembly and the lifting component to reverse the movement trajectory of the lifting assembly and the lifting component. The driving mechanism includes a transmission component and a linear drive component. The transmission component abuts against the lifting ramp and the lifting ramp, and the linear drive component is connected to the transmission component and its driving direction intersects with the guiding direction of the reversing assembly. The transmission component pushes the lifting ramp and the lifting ramp along the driving direction based on the driving force of the linear drive component. The lifting assembly and the lifting assembly abut against the reversing assembly under the action of the pushing force, reversing the pushing force along the driving direction to the pushing force in the guiding direction and sliding relative to each other in the guiding direction.

[0006] In some embodiments, the lifting ramp is tilted in the opposite direction to the jacking ramp.

[0007] In some embodiments, the angle between the lifting ramp and the driving direction is in the range of 10° to 35°, and the angle between the jacking ramp and the driving direction is in the range of 10° to 35°.

[0008] In some embodiments, the transmission component includes a lifting transmission component, which has a transmission surface at the top and a sliding surface at the bottom. The transmission surface is in contact with the lifting inclined surface, and the angle between the sliding surface and the transmission surface is less than 45°. The transmission surface is used to push the lifting inclined surface to translate, and the sliding surface is used to slide along the driving direction.

[0009] In some embodiments, the transmission component further includes a lifting transmission component, which includes a lifting seat and a lifting ball. The lifting seat is disposed on the lifting transmission component, and the lifting ball is rotatably disposed on the lifting seat. The lifting ball is in contact with the lifting inclined surface and is used to push the lifting inclined surface to translate.

[0010] In some embodiments, the lifting seat is connected to the lifting transmission component via an adjusting rod. The adjusting rod is rotatably mounted on the lifting transmission component and threadedly connected to the lifting seat. The adjusting rod is arranged parallel to the driving direction and is used to fix and adjust the position of the lifting seat.

[0011] In some embodiments, the workpiece stage further includes a base, on which the reversing assembly is provided. The reversing assembly includes a lifting guide and a lifting guide. The lifting guide is slidably engaged with the lifting assembly, and the lifting guide is slidably engaged with the lifting assembly. The lifting guide and the lifting guide are arranged parallel to each other, and the guiding direction is perpendicular to the driving direction.

[0012] In some embodiments, the lifting assembly has a lifting engagement portion on one side perpendicular to the driving direction, and the lifting engagement portion slides in engagement with the lifting guide.

[0013] In some embodiments, the bottom of the lifting assembly is provided with a lifting engagement portion, which is slidably engaged with the lifting guide member.

[0014] In some embodiments, the base is provided with a reset member, which is connected to the lifting assembly and is used to provide a pulling force for the lifting assembly to move toward the base.

[0015] Secondly, embodiments of this application provide a semiconductor testing device, which includes the workpiece stage described in any of the above embodiments.

[0016] This application provides a workpiece stage and a semiconductor testing device. The workpiece stage includes a lifting assembly, a jacking assembly, a reversing assembly, and a drive mechanism. The drive mechanism includes a transmission component and a linear drive component. The transmission component, based on the driving force of the linear drive component and under the action of the reversing assembly, allows the support column to slide relative to the bearing surface, thereby enabling the support column to lift the workpiece from or place the workpiece onto the bearing surface. The lifting assembly and the jacking assembly share a single drive mechanism, resulting in a simple structure, smooth transmission, and precise coordinated operation between the lifting assembly and the jacking assembly. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the workpiece stage from one viewpoint, representing some embodiments of this application.

[0019] Figure 2 This is a schematic diagram showing the disassembled structure of the workpiece stage according to some embodiments of this application;

[0020] Figure 3 This is a schematic diagram of the workpiece stage from another perspective, representing some embodiments of this application.

[0021] Figure 4 This is a schematic diagram of the lifting component from one perspective in some embodiments of this application;

[0022] Figure 5 This is a schematic diagram of the lifting component from one perspective in some embodiments of this application;

[0023] Figure 6 This is a schematic diagram of the drive mechanism of some embodiments of this application from one perspective;

[0024] Figure 7 This is a schematic diagram of the drive mechanism of some embodiments of this application from another perspective;

[0025] Figure 8 For the purposes of this application Figure 7 A magnified view of a section at point I.

[0026] In the attached diagram:

[0027] 1-Base; 11-Reversing assembly; 111-Lifting guide; 112-Topping guide; 12-Reset component; 2-Lifting assembly; 21-Lifting ramp; 22-Bearing surface; 23-Lifting mating part; 3-Topping assembly; 31-Topping ramp; 32-Support column; 33-Topping mating part; 4-Drive mechanism; 41-Linear drive component; 42-Lifting transmission component; 421-Transmission surface; 422-Sliding surface; 43-Topping transmission component; 431-Topping seat; 432-Topping ball; 44-Adjusting rod; X-Drive direction; Y-Guide direction. Detailed Implementation

[0028] The features and exemplary embodiments of various aspects of this application will be described in detail below. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain this application and not to limit it. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples.

[0029] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0030] In semiconductor testing equipment, a motion stage can precisely position wafers in the vertical direction. The motion stage is equipped with a lifting mechanism and an electrostatic chuck, both of which can move up and down in the vertical direction to exchange wafers with external components. During wafer exchange, an external transfer robot hands the wafer to the lifting mechanism, which then places the wafer on the electrostatic chuck or lifts it from the chuck and hands it to the external transfer robot.

[0031] In some technologies, the electrostatic chuck and the lifting mechanism are independently controlled. The lifting mechanism is driven by a motor outside the vacuum chamber of the semiconductor testing equipment, achieving vacuum sealing through a bellows. This drives a lifting rod (which can be a lead screw, with its nut connected to the lifting mechanism) inside the vacuum chamber. The lifting rod lifts the lifting mechanism (which consists of two guide rails, a lifting column mounting base, and three lifting columns). Driven by the lifting rod, the lifting mechanism moves up and down along the slide table. The lifting columns can lift or place the wafer from the top of the electrostatic chuck, enabling wafer transport in the height direction. The electrostatic chuck itself is driven by a separate mechanism.

[0032] While this technology achieves some degree of wafer lifting and lowering in a vacuum environment, it suffers from several drawbacks. The structure is complex, involving the design of both the inner and outer parts of the vacuum chamber. It is prone to jamming, as the electrostatic card drive mechanism and lifting mechanism must be arranged in the same space, resulting in a complex layout and poor transmission. Furthermore, the transmission efficiency is low, as the motor of the lifting mechanism is located outside the vacuum chamber, leading to power loss and reduced transmission efficiency. Synchronization is also poor, as the coordinated operation of the two drive mechanisms is easily affected by power fluctuations and transmission wear. Therefore, this technology is prone to jamming, misalignment, or damage during wafer transfer due to improper coordination, affecting the accuracy and stability of wafer transfer.

[0033] To improve the transfer accuracy and stability of wafers, the drive mechanisms of the electrostatic chuck and lifting mechanism can be improved so that they share a single drive mechanism. This improves the coordination between the electrostatic chuck and the lifting mechanism, reduces space occupation and power loss, simplifies the drive mechanism, and thus improves the transfer accuracy and stability of wafers.

[0034] Based on the above considerations, this application designs a workpiece stage, such as... Figure 1 As shown, the workpiece platform includes a lifting assembly 2, a jacking assembly 3, a reversing assembly 11, and a drive mechanism 4. Figure 2 , Figure 4 and Figure 5As shown, the lifting assembly 2 includes a lifting ramp 21 and a bearing surface 22 that are opposite each other in the height direction of the workpiece platform; the lifting assembly 3 has a lifting ramp 31 at the bottom and a support column 32 at the top, and the inclined surface where the lifting ramp 31 is located intersects with the inclined surface where the lifting ramp 21 is located. The reversing assembly 11 is slidably engaged with the lifting assembly 2 and the lifting assembly 3, and is used to reverse the movement trajectory of the lifting assembly 2 and the lifting assembly 3. The drive mechanism 4 includes a transmission component and a linear drive component 41. The transmission component abuts against the lifting ramp 21 and the lifting ramp 31, and the linear drive component 41 is connected to the transmission component and its driving direction X intersects with the guiding direction Y of the reversing assembly 11. The transmission component, driven by the linear drive component 41, pushes the lifting ramp 21 and the jacking ramp 31 along the driving direction X. The lifting component 2 and the jacking component 3, under the action of the driving force, abut against the reversing component 11, converting the driving force along the driving direction X to the driving force in the guiding direction Y and sliding relative to each other in the guiding direction Y. This allows the support column 32 to lift the workpiece from the bearing surface 22 or place the workpiece on the bearing surface 22. The workpiece can be a wafer (the following description uses a wafer as an example).

[0035] In the workpiece platform height direction, the lifting assembly 2 has a bearing surface 22 at the top and a lifting ramp 21 at the bottom, while the lifting assembly 3 has a support column 32 at the top and a lifting ramp 31 at the bottom. The inclined surfaces of the lifting ramp 31 and the lifting ramp 21 intersect. When the transmission component drives the lifting assembly 2 and the lifting assembly 3 to rise and fall based on the driving force of the linear drive component 41 and the force of the reversing component 11, the rising and falling amplitudes of the two are different. Therefore, the support column 32 can translate relative to the bearing surface 22, thereby lifting the wafer from the bearing surface 22 or placing the wafer transferred from the outside onto the bearing surface 22.

[0036] For example, the inclination direction of the lifting ramp 21 and the jacking ramp 31 can be opposite, such as... Figure 3 As shown, in the driving direction X, the tilt angle of the lifting assembly 2 is R1, and the tilt angle of the lifting assembly 3 is R2. When the transmission component simultaneously pushes the lifting ramp 21 and the lifting ramp 31, under the action of the reversing assembly 11, the translation direction of the lifting assembly 3 is opposite to that of the lifting assembly 2. That is, when the lifting assembly 3 rises, the lifting assembly 2 falls; when the lifting assembly 2 rises, the lifting assembly 3 falls. The support column 32 can rise and fall relative to the bearing surface 22, thereby placing wafers on or removing wafers from the bearing surface 22.

[0037] For example, the lifting ramp 21 and the jacking ramp 31 can have the same inclination direction. Taking the path of the transmission member moving away from the linear drive member 41 in the driving direction X as a reference, the angle between the lifting ramp 21 and this reference is smaller than the angle between the jacking ramp 31 and this reference, and the angle between the jacking ramp 31 and this reference is less than 90°. That is, the inclination range of the jacking ramp 31 is greater than that of the lifting ramp 21. When the transmission member simultaneously pushes the lifting ramp 21 and the jacking ramp 31, under the action of the reversing assembly 11, the jacking assembly 3 and the lifting assembly 2 rise and fall synchronously, and the rising and falling range of the jacking assembly 3 is greater than that of the lifting assembly 2. Therefore, the support column 32 can rise and fall relative to the bearing surface 22.

[0038] The lifting assembly 2 is a component that can move the wafer up and down in the guide direction Y. The lifting assembly 2 can be an integrated design or a separate design. The lifting assembly 2 slides in conjunction with the reversing assembly 11 and can slide along the guide direction Y under the guidance of the reversing assembly 11. The lifting ramp 21 is the surface on the lifting assembly 2 that mates with the transmission component, and the transmission component pushes the lifting assembly 2 through the lifting ramp 21. The bearing surface 22 can be the top surface of the electrostatic chuck, and the lifting assembly 2 adheres to the wafer through the bearing surface 22. The part of the lifting assembly 2 that connects to the electrostatic chuck can also be equipped with piezoelectric ceramic, and the piezoelectric effect of the piezoelectric ceramic can be used to achieve fine adjustment of the electrostatic chuck.

[0039] The lifting assembly 3 is used to lift or place the wafer on the support surface 22. The lifting assembly 3 is slidably engaged with the reversing assembly 11 and can slide along the guiding direction Y under the guidance of the reversing assembly 11. The bottom of the lifting assembly 3 has a lifting ramp 31, which is a surface on the lifting assembly 3 that cooperates with the transmission component. The transmission component pushes the lifting assembly 3 through the lifting ramp 31. The top of the lifting assembly 3 has support columns 32, which are components of the lifting assembly 3 that support the wafer. For example, there can be three support columns 32. The electrostatic chuck has three through holes, and the three support columns 32 are located in the three through holes respectively. When the support columns 32 are raised or lowered relative to the electrostatic chuck, the wafer can be placed on or removed from the support surface 22. The support columns 32 can be made of lightweight, high-strength materials (e.g., polyetheretherketone) to reduce weight and increase response speed. The top of the support post 32 is the surface that contacts the wafer, and it can be covered with a soft material (such as silicone) to prevent scratching the wafer.

[0040] The reversing component 11 slides with the lifting component 2, restricting the movement trajectory of the lifting component 2 and causing it to translate in the guide direction Y. The reversing component 11 also slides with the lifting component 3, restricting its movement trajectory and causing it to translate in the guide direction Y. The guide direction Y of the reversing component 11 intersects with the driving direction X of the linear drive component 41. When the linear drive component 41 drives the transmission component to apply force to the lifting ramp 31 and the lifting ramp 21 along the driving direction X, the reversing component 11 converts the movement trajectories of the lifting component 3 and the lifting component 2 into translation along the guide direction Y, thereby achieving reversal. For example, the reversing component 11 can be multiple guide rails. Some guide rails constrain the lifting component 3, causing it to slide along the guide direction Y; other guide rails constrain the lifting component 2, causing it to slide along the guide direction Y. The angle between the guide direction Y and the driving direction X can be an acute angle or a right angle.

[0041] The drive mechanism 4 is a mechanism that applies force to the lifting assembly 2 and the lifting assembly 3, and is the power source for the lifting and lowering motion of the lifting assembly 2 and the lifting assembly 3. The linear drive member 41 is a power element that pushes the transmission member to translate along the driving direction X. Exemplarily, the linear drive member 41 can be a linear motor, a cylinder, or a hydraulic cylinder. Preferably, the linear drive member 41 is a linear motor or a combination of a motor and a lead screw, which can improve motion accuracy. The transmission member is a component that slides along the driving direction X under the driving force of the linear drive member 41, transmitting the driving force of the transmission member to the lifting assembly 2 and the lifting assembly 3, forming a thrust on the lifting ramp 21 and the lifting ramp 31. The transmission member abuts against the lifting ramp 21 and the lifting ramp 31, and can slide relative to the lifting ramp 21 and the lifting ramp 31. The transmission member and the lifting ramp 21 and / or the lifting ramp 31 can be any one of point contact, line contact, surface contact, or a combination thereof, capable of applying synchronous thrust to the lifting ramp 21 and the lifting ramp 31.

[0042] In the technical solution of this application embodiment, when the linear drive 41 drives the transmission component along the driving direction X, the transmission component can simultaneously apply thrust to the lifting ramp 21 and the lifting ramp 31. Under the action of the reversing component 11, the lifting assembly 2 and the lifting assembly 3 can move up and down along the guiding direction Y, thereby enabling the support column 32 to lift the wafer from the bearing surface 22 or place the wafer onto the bearing surface 22. The lifting assembly 2 and the lifting assembly 3 of the workpiece stage share a single drive mechanism 4, which enables precise coordinated operation of the lifting assembly 2 and the lifting assembly 3, simplifies the structure, reduces space occupation, and when applied to semiconductor testing equipment, the drive mechanism 4 can be arranged inside the vacuum chamber to improve the smoothness and efficiency of transmission, achieving efficient, stable, and high-precision transmission of the wafer.

[0043] like Figure 2 and Figure 3As shown, according to some embodiments of this application, optionally, the tilting direction of the lifting ramp 21 is opposite to that of the jacking ramp 31.

[0044] like Figure 3 As shown, in the driving direction X, the tilt angle of the lifting component 2 is R1, and the tilt angle of the lifting component 3 is R2. R1 can be equal to R2, or they can be different. Preferably, both R2 and R2 are less than 45°, which can improve the lifting accuracy of the lifting component 2 and the lifting component 3 during transmission.

[0045] In the technical solution of this application embodiment, the lifting ramp 21 and the lifting ramp 31 have opposite inclination directions. When the lifting component 2 rises, the lifting component 3 falls, and when the lifting component 3 rises, the lifting component 2 falls. The movement directions of the bearing surface 22 and the support column 32 are always opposite, which can improve the relative speed of the lifting component 2 and the lifting component 3 when they rise and fall, improve the efficiency of the lifting component 2 and the lifting component 3 in interacting with the wafer, and thus improve the wafer transmission efficiency.

[0046] like Figure 2 and Figure 3 As shown, according to some embodiments of this application, optionally, the angle between the lifting ramp 21 and the driving direction X is in the range of 10° to 35°, and the angle between the lifting ramp 31 and the driving direction X is in the range of 10° to 35°.

[0047] The angle between the lifting ramp 21 and the driving direction X is also the tilt angle R1 of the lifting ramp 21, and the angle between the jacking ramp 31 and the driving direction X is also the tilt angle R2 of the jacking ramp 31.

[0048] For example, the angle of R1 can be any value among 10°, 15°, 20°, 25°, 30°, and 35°, or any intermediate value between any two adjacent values ​​mentioned above. The angle of R2 can be any value among 10°, 15°, 20°, 25°, 30°, and 35°, or any intermediate value between any two adjacent values ​​mentioned above.

[0049] Preferably, the angles of R1 and / or R2 can be any value among 20°, 21°, 22°, 23°, 24°, and 25°, or any intermediate value between any two adjacent values ​​mentioned above.

[0050] In the technical solution of this application embodiment, the lifting ramp 21 and the lifting ramp 31 are both at an angle ranging from 10° to 35° with the driving direction X. This not only improves the motion accuracy of the lifting assembly 2 and the lifting assembly 3, but also facilitates the transmission components to push the lifting ramp 21 and the lifting ramp 31, thereby improving the smoothness of transmission.

[0051] like Figure 2 , Figure 6 and Figure 7As shown, according to some embodiments of this application, optionally, the transmission component includes a lifting transmission component 42. The lifting transmission component 42 has a transmission surface 421 at the top and a sliding surface 422 at the bottom. The transmission surface 421 is in contact with the lifting inclined surface 21, and the angle between the sliding surface 422 and the transmission surface 421 is less than 45°. The transmission surface 421 is used to push the lifting inclined surface 21 to translate, and the sliding surface 422 is used to slide along the transmission direction.

[0052] The lifting assembly 2 is a component that drives the wafer to move up and down. When the workpiece stage is used in semiconductor testing equipment, the lifting assembly 2 has a significant impact on the accuracy and stability of the wafer's movement in the height direction. The transmission component pushes the lifting assembly 2 through the lifting transmission component 42. When the lifting rotating component is driven by the linear drive component 41, it applies a thrust to the lifting inclined surface 21 through the transmission surface 421.

[0053] For example, the lifting transmission component 42 can be a wedge-shaped platform with a hollowed-out center and transmission surfaces 421 at both ends. The linear drive component 41 is a linear motor, and the lifting transmission component 42 is fixedly connected to the nut of the linear motor (e.g., welded). The sliding surface 422 is parallel to the driving direction X, causing the lifting transmission component 42 to translate in the driving direction X.

[0054] In the technical solution of this application embodiment, the sliding surface 422 can limit the lifting transmission component 42, preventing it from rotating and causing it to translate in the driving direction X. The transmission surface 421 is in contact with the lifting inclined surface 21, and the contact between them is surface contact, which can increase the contact area and thus improve the smoothness of the transmission, enabling the lifting assembly 2 to drive the wafer to move up and down smoothly. The angle between the sliding surface 422 and the transmission surface 421 is less than 45°, and the displacement of the lifting transmission component 42 in the driving direction X is greater than the displacement of the lifting assembly 2 in the guiding direction Y during transmission, which can improve the motion accuracy of the lifting assembly 2.

[0055] like Figure 2 and Figure 5 As shown, according to some embodiments of this application, optionally, the transmission component further includes a lifting transmission component 43, which includes a lifting seat 431 and a lifting ball 432. The lifting seat 431 is disposed on the lifting transmission component 42, and the lifting ball 432 is rotatably disposed on the lifting seat 431. The lifting ball 432 is in contact with the lifting inclined surface 31 and is used to push the lifting inclined surface 31 to translate.

[0056] The lifting seat 431 can be fixedly mounted on the lifting transmission component 42. For example, the lifting seat 431 can be welded to the lifting transmission component 42, or the lifting seat 431 can be a part of the lifting transmission component 42 and integrally formed with the lifting transmission component 42. The lifting seat 431 can also be movably mounted on the lifting transmission component 42, and its installation position on the lifting transmission component 42 can be adjusted.

[0057] For example, the lifting seat 431 is disposed between the transmission surfaces 421 at both ends of the lifting transmission member 42. The lifting ball 432 can rotate 360° within the lifting seat 431 and abuts against the lifting ramp 31. To reduce friction, grease can be used for lubrication between the lifting ball 432 and the lifting seat 431, and a lubricating layer can also be provided on the lifting ramp 31.

[0058] In the technical solution of this application embodiment, the lifting transmission component 43 provides thrust to the lifting assembly 3 through the lifting ball 432, pushing the lifting assembly 3 to translate along the guide direction Y. The lifting ball 432 and the lifting inclined surface 31 are in point contact, which can reduce the contact area, thereby reducing friction and improving smoothness; the lifting ball 432 and the lifting inclined surface 31 are in rolling friction, which can further reduce friction and improve the smoothness of transmission.

[0059] like Figure 7 and Figure 8 As shown, according to some embodiments of this application, optionally, the lifting seat 431 and the lifting transmission component 42 are connected by an adjusting rod 44. The adjusting rod 44 is rotatably mounted on the lifting transmission component 42 and threadedly connected to the lifting seat 431. The adjusting rod 44 is arranged parallel to the driving direction X and is used to fix and adjust the position of the lifting seat 431.

[0060] The installation position of the lifting seat 431 on the lifting transmission component 42 determines the initial position of the support column 32 and the bearing surface 22. If the lifting seat 431 cannot be adjusted on the lifting transmission component 42, it is necessary to ensure the assembly accuracy of the lifting seat 431 and the lifting transmission component 42, which will cause difficulties in parts processing and assembly.

[0061] When the lifting seat 431 is movably connected to the lifting transmission component 42, the installation position of the lifting seat 431 on the lifting transmission component 42 is adjustable. Specifically, the lifting seat 431 abuts against the lifting transmission component 42, and when the adjusting rod 44 is rotated, the threaded connection length between the lifting seat 431 and the adjusting rod 44 can be adjusted, thereby adjusting the installation position of the lifting seat 431 on the lifting transmission component 42.

[0062] For example, there can be two adjusting rods 44 to improve adjustment accuracy and reliability during fixing. Furthermore, a nut can also be threaded onto the adjusting rod 44, and when it is necessary to fix the lifting seat 431, the nut is pressed against the lifting seat 431 to achieve double nut fastening.

[0063] In the technical solution of this application embodiment, the lifting seat 431 and the lifting transmission component 42 are connected by an adjusting rod 44. The adjusting rod 44 is arranged parallel to the driving direction X, which can adjust the installation position of the lifting seat 431 on the lifting transmission component 42, thereby reducing the requirements for parts processing and assembly, and enabling flexible adjustment of the lifting transmission component 43.

[0064] like Figure 2 and Figure 3 As shown, according to some embodiments of this application, optionally, the workpiece platform further includes a base 1, and a reversing assembly 11 is provided on the base 1. The reversing assembly 11 includes a lifting guide 111 and a lifting guide 112. The lifting guide 111 is slidably engaged with the lifting assembly 2, and the lifting guide 112 is slidably engaged with the lifting assembly 3. The lifting guide 111 and the lifting guide 112 are arranged in parallel, and the guiding direction Y is perpendicular to the driving direction X.

[0065] Exemplarily, the base 1 may include a rectangular base plate on which a reversing assembly 11 is disposed, thereby forming the base 1. The drive mechanism 4 may be mounted on the base 1. The lifting guide 111 may be a guide rail, or a guide rail may be disposed on the lifting guide 111. The lifting guide 112 may be a guide rail, or a guide rail may be disposed on the lifting guide 112. The number of lifting guides 111 and / or lifting guides 112 may be one or more.

[0066] In the technical solution of this application embodiment, the workpiece stage is provided with a base 1, which can improve the integration of the workpiece stage and make the base 1 the supporting component of the entire workpiece stage. The lifting guide 111 and the top lifting guide 112 are arranged in parallel, which can improve the movement accuracy of the lifting assembly 2 and the top lifting assembly 3, so that the wafer is only subjected to the force in the guiding direction Y, reducing wafer offset and slippage. The guiding direction Y is arranged perpendicular to the driving direction X, and the reversing assembly 11 can realize a 90° reversal of the lifting assembly 2 and the top lifting assembly 3, which facilitates structural design and simplifies the transmission form.

[0067] like Figure 2 and Figure 4 As shown, according to some embodiments of this application, optionally, the lifting assembly 2 is provided with a lifting engagement part 23 on the side perpendicular to the driving direction X, and the lifting engagement part 23 is slidably engaged with the lifting guide 111.

[0068] The lifting engagement part 23 can be a portion of the lifting assembly 2, or it can be a component mounted on the lifting assembly 2 and slidingly engaging with the lifting guide 111. For example, the lifting guide 111 can be a guide rail, and the lifting engagement part 23 can be a slider, with the lifting engagement part 23 slidingly engaging with the lifting guide 111. There are two lifting engagement parts 23.

[0069] The linear drive 41 can be a linear motor. The power element (motor) of the linear motor is located at one end of the lifting assembly 2, and the lifting mating part 23 is located at the opposite end. When the lifting transmission member 42 pushes the lifting assembly 2, the force generated by the lifting mating part 23 on the lifting guide member 111 is pressure, and no force is generated intersecting the plane containing the driving direction X and the guiding direction Y.

[0070] In the technical solution of this application embodiment, the lifting mating part 23 is located on the side of the lifting assembly 2 perpendicular to the driving direction X. When the lifting assembly 2 is lifted, the lifting mating part 23 applies pressure along the driving direction X to the lifting guide 111, which can reduce the impact of the gap existing when the lifting mating part 23 and the lifting guide 111 slide together on the motion accuracy of the lifting assembly 2, thereby improving the wafer transmission accuracy.

[0071] like Figure 2 and Figure 5 As shown, according to some embodiments of this application, optionally, the bottom of the lifting assembly 3 is provided with a lifting engagement part 33, which is slidably engaged with the lifting guide 112.

[0072] For example, the lifting guide 112 can be a guide rail, and the lifting mating part 33 can be a slider. The lifting guide 112 and the lifting mating part 33 are in sliding engagement. There can be four lifting mating parts 33, which are located at the four corners of the lifting ramp 31.

[0073] In the technical solution of this application embodiment, the lifting mating part 33 is located at the bottom of the lifting assembly 3, and the lifting inclined surface 31 is also located at the bottom of the lifting assembly 3. When the lifting assembly 3 is raised or lowered, the lifting transmission member 43 applies a thrust to the lifting inclined surface 31, and the lifting mating part 33 applies a thrust to the lifting guide member 112. The force on the lifting assembly 3 is located at the bottom of the lifting assembly 3, which can improve the force balance of the lifting assembly 3, thereby improving the movement accuracy of the lifting assembly 3.

[0074] like Figure 2 and Figure 3 As shown, according to some embodiments of this application, optionally, a reset member 12 is provided on the base 1, and the reset member 12 is connected to the lifting assembly 2 to provide a pulling force for the lifting assembly 2 to move toward the base 1.

[0075] The lifting assembly 23 is located on one side of the lifting component 2. Since the lifting component 2 has its own weight, the pressure exerted by the lifting assembly 23 on the lifting guide 111 at the bottom is greater than the pressure exerted by the lifting assembly 23 on the lifting guide 111 at the top when it descends. Therefore, there is a risk that the lifting component 2 may be blocked.

[0076] The reset member 12 is a component connecting the lifting assembly 2 and the base 1. The reset member 12 itself can undergo elastic deformation and bear tensile force between the base 1 and the lifting assembly 2. For example, the reset member 12 can be a tension spring, with one end connected to the base 1 and the other end connected to the bottom of the lifting assembly 2. Preferably, the connection between the reset member 12 and the lifting assembly 2 is located near the lifting guide member 111.

[0077] In the technical solution of this application embodiment, the reset member 12 is connected between the base 1 and the lifting component 2, which can provide the lifting component 2 with a pulling force to move towards the base 1, thereby improving the smoothness of the descent of the lifting component 2, eliminating the hidden danger of the lifting component 2 being blocked, and improving the smoothness of wafer transmission.

[0078] According to some embodiments of this application, this application also provides a semiconductor testing device, including a workpiece stage of any of the above solutions.

[0079] The workpiece stage can serve as a platform or part of a semiconductor inspection device. It receives wafers from an external transport robot and moves the wafers up and down for the semiconductor inspection device to inspect them. After the semiconductor inspection device has finished inspecting the wafers, the workpiece stage can transport the wafers to the external transport robot, thus removing the wafers.

[0080] In the technical solution of this application embodiment, the semiconductor testing equipment includes a workpiece stage, and therefore the semiconductor testing equipment has all the advantages of the workpiece stage in the above embodiment.

[0081] like Figures 1 to 7 As shown, the working process of the workpiece stage is described in detail below with a specific embodiment:

[0082] The workpiece stage includes a lifting assembly 2, a top-lifting assembly 3, a reversing assembly 11, and a drive mechanism 4. The lifting assembly 2 includes a lifting ramp 21 and a bearing surface 22, with the bearing surface 22 located on an electrostatic chuck. The top-lifting assembly 3 includes a top-lifting ramp 31 and support columns 32. Multiple support columns 32 are located at the top of the top of the top-lifting assembly 3 and can be arranged in a circular array on the top of the top-lifting assembly 3. For example, three support columns 32 are arranged in a circular array with adjacent support columns at a 120° angle, providing stable support for the wafer. The lifting ramp 21 of the lifting assembly 2 and the top-lifting ramp 31 of the top-lifting assembly 3 are inclined in opposite directions. The reversing assembly 11 is part of the base 1 and includes a lifting guide 111 and a top-lifting guide 112. The lifting guide 111 and the top-lifting guide 112 are arranged parallel to each other and both are parallel to the guiding direction Y. The guiding direction Y is perpendicular to the driving direction X. The drive mechanism 4 includes a transmission component and a linear drive component 41. The transmission component includes a lifting transmission component 42 and a jacking transmission component 43. The jacking transmission component 43 is mounted on the lifting transmission component 42 and moves synchronously with the lifting transmission component 42. The linear drive component 41 is a combination of a motor and a ball screw.

[0083] When wafers need to be transferred, the motor drives the ball screw to rotate. The nut of the ball screw is fixedly connected to the lifting transmission component 42, which can drive the lifting transmission component 42 and the lifting transmission component 43 to slide synchronously along the driving direction X. The lifting transmission component 42 is in transmission cooperation with the lifting assembly 2, and the lifting transmission component 43 is in transmission cooperation with the lifting assembly 3. The transmission surface 421 is in sliding cooperation with the lifting inclined surface 21, and the lifting ball 432 slides along the lifting inclined surface 31. When the lifting assembly 2 descends, the lifting assembly 3 rises, and the support column 32 extends from above the bearing surface 22. When the top surface of the support column 32 is higher than the bearing surface 22, the wafer can be lifted from the bearing surface 22, and the wafer is separated from the bearing surface 22. Conversely, when the lifting assembly 2 rises, the lifting assembly 3 descends, and the support column 32 descends below the bearing surface 22. When the top surface of the support column 32 is lower than the bearing surface 22, the wafer is separated from the support column 32, thereby placing the wafer on the bearing surface 22.

[0084] When semiconductor inspection equipment interacts with the outside world to transfer wafers, the external transfer robot can transfer wafers to the semiconductor inspection equipment by rotation, and its rotation axis is parallel to the guide direction Y.

[0085] When the workpiece stage receives the wafer, firstly, the lifting assembly 2 descends, the top lifting assembly 3 rises, and the support column 32 is lifted by the external transfer robot, which then rotates away. Next, the top lifting assembly 3 descends, the lifting assembly 2 rises, the wafer is lifted by the bearing surface 22 and adsorbed onto the bearing surface 22, thus separating the wafer from the support column 32. Finally, the lifting assembly 2 moves the wafer to the working distance of the semiconductor testing equipment, allowing the wafer to be tested by the semiconductor testing equipment.

[0086] When the workpiece stage transfers wafers to the external transfer robot, firstly, the lifting assembly 3 rises, the lifting assembly 2 falls, and the support column 32 lifts the wafer from the bearing surface 22 to a position higher than the receiving position of the external transfer robot (the wafer receiving position); then, the lifting assembly 3 falls, the lifting assembly 2 rises, and the wafer falls onto the external transfer robot; finally, the support column 32 continues to fall to a height lower than the external transfer robot, and the external transfer robot departs, completing the wafer transfer. Repeated interaction between the workpiece stage and the external transfer robot enables wafer input and output.

[0087] The above description is merely a specific implementation of this application. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, modules, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here. It should be understood that the protection scope of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the protection scope of this application.

Claims

1. A workpiece stage, characterized in that, include: The lifting assembly (2) includes a lifting ramp (21) and a bearing surface (22) opposite each other in the height direction of the workpiece platform. The lifting assembly (3) has a lifting ramp (31) at the bottom and a support column (32) at the top. The inclined surface where the lifting ramp (31) is located intersects with the inclined surface where the lifting ramp (21) is located. The reversing component (11) slides in cooperation with the lifting component (2) and the jacking component (3) to reverse the movement trajectory of the lifting component (2) and the movement trajectory of the jacking component (3); The drive mechanism (4) includes a transmission component and a linear drive component (41). The transmission component abuts against the lifting ramp (21) and the jacking ramp (31). The linear drive component (41) is connected to the transmission component, and its driving direction (X) intersects with the guiding direction (Y) of the reversing assembly (11). The transmission component includes a lifting transmission component (42) and a jacking transmission component (43). The lifting transmission component (42) has a transmission surface (421) at the top and a sliding surface (422) at the bottom. The transmission surface (421) is perpendicular to the lifting ramp (21) and the jacking ramp (31). 21) Fitting, the transmission surface (421) is used to push the lifting inclined surface (21) to translate, the sliding surface (422) is used to slide along the driving direction (X), the lifting transmission component (43) includes a lifting seat (431) and a lifting ball (432), the lifting seat (431) is disposed on the lifting transmission component (42), the lifting ball (432) is rotatably disposed on the lifting seat (431), the lifting ball (432) fits with the lifting inclined surface (31) and is used to push the lifting inclined surface (31) to translate; The transmission component pushes the lifting ramp (21) and the jacking ramp (31) along the driving direction (X) based on the driving force of the linear drive component (41). The lifting component (2) and the jacking component (3) abut against the reversing component (11) under the action of the driving force, and the driving force along the driving direction (X) is reversed to the driving force in the guiding direction (Y) and slides relative to each other in the guiding direction (Y).

2. The workpiece stage according to claim 1, characterized in that, The lifting ramp (21) has the opposite inclination direction to the jacking ramp (31).

3. The workpiece stage according to claim 2, characterized in that, The angle between the lifting ramp (21) and the driving direction (X) is in the range of 10° to 35°, and the angle between the jacking ramp (31) and the driving direction (X) is in the range of 10° to 35°.

4. The workpiece stage according to claim 1, characterized in that, The angle between the sliding surface (422) and the transmission surface (421) is less than 45°.

5. The workpiece stage according to claim 1, characterized in that, The lifting seat (431) is connected to the lifting transmission component (42) via an adjusting rod (44). The adjusting rod (44) is rotatably mounted on the lifting transmission component (42) and threadedly connected to the lifting seat (431). The adjusting rod (44) is parallel to the driving direction (X) and is used to fix and adjust the position of the lifting seat (431).

6. The workpiece stage according to claim 1, characterized in that, It also includes a base (1), on which the reversing assembly (11) is provided. The reversing assembly (11) includes a lifting guide (111) and a lifting guide (112). The lifting guide (111) is slidably engaged with the lifting assembly (2), and the lifting guide (112) is slidably engaged with the lifting assembly (3). The lifting guide (111) and the lifting guide (112) are arranged parallel to each other, and the guiding direction (Y) is perpendicular to the driving direction (X).

7. The workpiece stage according to claim 6, characterized in that, The lifting assembly (2) has a lifting engagement part (23) on one side perpendicular to the driving direction (X), and the lifting engagement part (23) slides with the lifting guide (111).

8. The workpiece stage according to claim 6, characterized in that, The bottom of the lifting assembly (3) is provided with a lifting engagement part (33), which is in sliding engagement with the lifting guide (112).

9. The workpiece stage according to claim 6, characterized in that, The base (1) is provided with a reset member (12), which is connected to the lifting assembly (2) and is used to provide the lifting assembly (2) with a pulling force to move toward the base (1).

10. A semiconductor testing device, characterized in that, Includes the workpiece stage as described in any one of claims 1 to 9.

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