Method for dissolving and separating waste circuit board filling material by chemical solvent method

Abstract

The invention relates to the technical field of waste electronic waste recovery treatment, in particular to a method for dissolving and separating a waste circuit board filling material through a chemical solvent method. The method comprises the following steps: cutting the waste circuit board, and drying to obtain a sample; placing the sample in a composite solvent for reaction, and obtaining a solid-liquid mixture after the reaction is finished; filtering the solid-liquid mixture to obtain a solid and filtrate; the composite solvent is a mixed solution of an ionic liquid and an organic solvent. According to the method, effective separation of different components of the waste circuit board and efficient decomposition of organic components are achieved, the disassembly efficiency of the circuit board is improved, the physical properties of other component materials can be reserved to a great extent, the decomposed resin component can be used as other chemical raw materials, toxic and harmful substances are hardly generated, the method is environmentally friendly, and the method is suitable for industrial production. The method is an effective method for recycling the waste circuit board material.

Description

Technical Field

[0001] The present invention relates to the technical field of recycling and treatment of waste electronic waste, and particularly to a method for dissolving and separating the filling materials of waste circuit boards by a chemical solvent method. Background Art

[0003] At present, a large number of methods have been applied to the recycling of waste circuit boards and certain achievements have been made. However, most of the research is limited to the downstream treatment of WPCBs for recycling metals using different pyrometallurgical, hydrometallurgical or biohydrometallurgical recycling technologies, and the important in-depth understanding of pretreatment has not been fully developed. By pretreating the circuit boards, the metal materials and non-metal materials of the circuit boards can be separated, thereby improving the overall recovery rate of the circuit board materials. For the treatment methods of waste circuit boards, there are mainly mechanical treatment technologies, hydrometallurgical technologies, biological treatment technologies and supercritical treatment technologies, etc. The mechanical treatment technology has a lower cost, but during the mechanical crushing process, there will be a certain amount of dust containing glass fibers and resins, and a certain amount of toxic gases will be accompanied, causing serious dust pollution. The hydrometallurgical technology can not only obtain metals such as gold and silver with high grade and high recovery rate, but also has a lower cost and less waste gas emissions. However, its chemical reagent consumption is large, the process is complex, and a large amount of acidic or alkaline wastewater will be generated, causing serious secondary pollution; the biological treatment technology has the advantages of simple process, low cost, convenient operation, etc. However, due to reasons such as long leaching time, low leaching rate and microorganisms being easily contaminated or even dying, it has not been truly put into use yet. The supercritical treatment technology is still in the initial research stage because of the harsh requirements for treatment conditions and relatively high requirements for equipment, resulting in high economic costs.

[0004] In summary, it is very necessary to provide a new method that can effectively separate different components in the circuit board. Summary of the Invention

[0005] Based on the above, the present invention provides a method for dissolving and separating the filling materials of waste circuit boards by a chemical solvent method. The method of the present invention can effectively separate different components of waste circuit boards while achieving efficient decomposition of organic components, improving the disassembly efficiency of circuit boards, and is an effective method for recycling waste circuit board materials.

[0006] To achieve the above object, the present invention provides the following solution:

[0007] The present invention provides a method for dissolving and separating the filling materials of waste circuit boards by a chemical solvent method, comprising the following steps:

[0008] Cut and dry the waste circuit board to obtain a sample;

[0009] Place the sample in a composite solvent for reaction, and obtain a solid-liquid mixture after the reaction ends;

[0010] Filter the solid-liquid mixture to obtain the solid and the filtrate;

[0011] The composite solvent is a mixture of an ionic liquid and an organic solvent;

[0012] The ionic liquid is one or more of 1-butyl-3-methylimidazolium tetrafluoroborate, 1-butyl-3-methylimidazolium chloride, 1-butyl-3-methylimidazolium bromide, 1-ethyl-3-methylimidazolium tetrafluoroborate, 1-butyl-2,3-dimethylimidazolium hydroxide, 1-ethyl-3-methylimidazolium acetate, 1-butyl-3-methylimidazolium hydroxide, 1-butyl-4-methylpyridinium chloride, 1-butyl-4-methylpyridinium bromide, 1-ethyl-3-methylpyridinium hydroxide, 1-hexyl-3-methylpyridinium chloride, and diethyl phosphate of 1-butyl-3-methylpyridine;

[0013] The organic solvent is one or more of toluene, dimethylacetamide, 4-dimethylaminopyridine, 1,3-dimethyl-2-imidazolidinone, dimethyl sulfoxide, N-methylpyrrolidone, and dimethylformamide.

[0014] In the present invention, the cutting method can be manual or mechanical cutting.

[0015] In a preferred embodiment of the present invention, the mass ratio of the ionic liquid to the organic solvent is (0.1-1):1.

[0016] In a preferred embodiment of the present invention, the liquid-solid ratio of the composite solvent to the sample is (7-90) mL:1 g.

[0017] In a preferred embodiment of the present invention, if the mass ratio of the ionic liquid to the organic solvent is too low, the decomposition efficiency will decrease; if it is too high, the viscosity of the system will increase and the cost of the system will increase. Only when the parameters are within the range described in the present invention, the degradation effect of the system is the best.

[0018] In a preferred embodiment of the present invention, the temperature of the reaction is 100°C to 250°C, the time is 1 h to 20 h, and the pressure is 1 to 15 MPa.

[0019] In a preferred embodiment of the present invention, the reaction time is 4 to 6 h; more preferably, it can be 4 h, 5 h, or 6 h.

[0020] In a preferred embodiment of the present invention, the drying temperature is 65°C - 150°C and the time is 5 h - 24 h.

[0021] In a preferred embodiment of the present invention, after filtration, the steps further include washing the obtained solid and drying it at 70°C - 120°C for 3h - 15h.

[0022] In a preferred embodiment of the present invention, if the reaction temperature, reaction time, and reaction pressure are too low, the three-dimensional cross-linked structure of the thermosetting resin cannot be destroyed, resulting in a decrease in the resin dissolution rate. If the reaction temperature, reaction time, and reaction pressure are too high, the experimental environment becomes too harsh and the system cost increases.

[0023] The waste circuit board mainly consists of a substrate, a conductive layer, and electronic components; the filling material of the substrate is mainly a mixture of thermosetting resin and glass fiber; the content of the organic component in the filling material is 20% - 50%.

[0024] The filling material is located in the copper-clad laminate layer of the waste circuit board.

[0025] The present invention realizes the effective separation of different components of the waste circuit board and the efficient decomposition of the organic components, improves the disassembly efficiency of the circuit board, and can largely retain the physical properties of other component materials (the action of the composite solvent of the present invention is only directed at the organic matter in the circuit board and will not cause chemical reactions with other components in the material, so the physical properties of other component materials can be largely retained). The decomposed resin component can be used as other chemical raw materials, hardly producing toxic and harmful substances, being environmentally friendly, and being an effective method for recycling waste circuit board materials.

[0026] The present invention discloses the following technical effects:

[0027] The present invention uses ionic liquid - organic solvent to dissolve the organic components in the waste circuit board, thereby effectively separating different components and having a high degradation rate. The ionic liquid used in the reaction process has good thermal stability and excellent catalytic degradation effect on thermosetting resin. After the reaction, the circuit board can be effectively separated, which is beneficial to the subsequent recovery of metals in the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0029] Figure 1 It is a process flow diagram of the present invention for dissolving and separating the filling material of the waste circuit board by the chemical solvent method.

[0030] Figure 2This is a photo of the waste circuit board before and after decomposition in Embodiment 1 of the present invention. Detailed Embodiments

[0031] Now, various exemplary embodiments of the present invention will be described in detail. This detailed description should not be considered as a limitation of the present invention, but rather as a more detailed description of certain aspects, features, and implementation schemes of the present invention.

[0032] It should be understood that the terms used in the present invention are only for describing specific embodiments and are not used to limit the present invention. Additionally, for the numerical ranges in the present invention, it should be understood that each intermediate value between the upper and lower limits of the range is also specifically disclosed. Any intermediate value within any stated value or stated range, as well as each smaller range between any other stated value or intermediate value within the stated range, is also included in the present invention. The upper and lower limits of these smaller ranges may be independently included or excluded from the range.

[0033] Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present invention pertains. Although the present invention only describes preferred methods and materials, any methods and materials similar or equivalent to those described herein can also be used in the implementation or testing of the present invention. All documents mentioned in this specification are incorporated by reference to disclose and describe the methods and / or materials related to the documents. In case of conflict with any incorporated document, the content of this specification shall prevail.

[0034] Without departing from the scope or spirit of the present invention, various improvements and changes can be made to the specific embodiments of the present invention specification, which are obvious to those skilled in the art. Other embodiments obtained from the specification of the present invention are obvious to those skilled in the art. The specification and embodiments of the present invention are merely exemplary.

[0035] Regarding the use of "comprising", "including", "having", "containing", etc. in this article, they are all open-ended terms, meaning including but not limited to.

[0036] The waste circuit board filling material belongs to an adhesive material in the waste circuit board, mainly a thermosetting resin and glass fiber composite material. The present invention provides a method for dissolving and separating the waste circuit board filling material by chemical solvent method, using a composite solvent composed of ionic liquid and organic solvent to dissolve the organic components in the filling material, so as to achieve the effective separation of each component in the waste circuit board.

[0037] The technical solutions described in the present invention are all conventional solutions in the art unless otherwise specified. The reagents or raw materials used are all purchased from commercial channels or have been made public unless otherwise specified.

[0038] The meanings represented by the English abbreviations involved in the present invention:

[0039] [Bmim]BF4: 1-butyl-3-methylimidazolium tetrafluoroborate;

[0040] [Bmim]Cl: 1-butyl-3-methylimidazolium chloride;

[0041] [Bmim]Br: 1-butyl-3-methylimidazolium bromide;

[0042] [Emim]BF4: 1-ethyl-3-methylimidazolium tetrafluoroborate;

[0043] [Bdmim]OH: 1-butyl-2,3-dimethylimidazolium hydroxide;

[0044] [Emim][OAc]: 1-ethyl-3-methylimidazolium acetate;

[0045] [Emim]Cl: 1-ethyl-3-methylimidazolium chloride;

[0046] [BMPy]Cl: 1-butyl-4-methylpyridinium chloride;

[0047] [BMPy]Br: 1-butyl-4-methylpyridinium bromide;

[0048] [EMPy]OH: 1-ethyl-3-methylpyridinium hydroxide;

[0049] [HMPy]Cl: 1-hexyl-3-methylpyridinium chloride;

[0050] [BMPy][DEP]: 1-butyl-3-methylpyridinium diethyl phosphate;

[0051] DMI: 1,3-dimethyl-2-imidazolidinone;

[0052] DMSO: dimethyl sulfoxide;

[0053] DMAP: 4-dimethylaminopyridine;

[0054] NMP: N-methylpyrrolidone;

[0055] DMF: dimethylformamide;

[0056] DMAc; dimethylacetamide.

[0057] The waste printed circuit boards used in the embodiments of the present invention are waste printed circuit boards, mainly composed of a substrate and a conductive layer (copper foil); the substrate filling material is mainly a mixture of a thermosetting resin and glass fiber; the content of the organic component (i.e., the thermosetting resin) in the filling material is 36.1%.

[0058] In the present invention, the calculation formula for the dissolution rate of the organic component is as follows:

[0059] η = (m1 - m2) / rm1 × 100%; where η is the dissolution rate of the organic component in the filling material, with the unit of %; m1 is the initial weight of the sample after drying, with the unit of g; m2 is the mass of the solid-phase product after drying, with the unit of g; r is the proportion of the organic component content in the filling material, with the unit of %.

[0060] The technical solutions provided by the present invention will be described in detail below in conjunction with the embodiments, but they should not be construed as limiting the protection scope of the present invention. The circuit board used in this embodiment is a waste printed circuit board. It has been verified that the waste circuit boards in other electronic devices can also use the technical solutions provided by the present invention to achieve the separation effect of different components.

[0061] Example 1

[0062] (1) Cut the waste circuit board into the size required for the reaction (3mm × 3mm × 1.6mm), and weigh it after drying in an environment of 79°C for 15h.

[0063] (2) Take an appropriate amount of the cut sample (mass m1 = 30g), put it into the reactor, add the composite solvent into the reactor according to the ratio of [Bmim]BF4(g):DMI(g) = 0.35:1 and the liquid-to-material ratio of 15mL / g, heat it to 175°C under stirring conditions, and keep it for 5 hours. After the reaction is completed, cool it to obtain a solid-liquid mixture.

[0064] (3) Filter the solid-liquid mixture and rinse it with pure water. Place the obtained solid-phase product in an oven at 90°C and dry it for 12h, then take it out and weigh it (mass m2 = 19.714g). Calculate the dissolution rate of the organic component in the filling material as 94.98% using the above calculation formula.

[0065] Example 2

[0066] (1) Cut the waste circuit board into the size required for the reaction (3mm*3mm*1.6mm), and weigh it after drying in an environment of 79°C for 15h.

[0067] (2) Take an appropriate amount of the cut sample (mass m1 = 30g), put it into the reactor, add the composite solvent into the reactor according to the ratio of [Emim][OAc](g):DMSO(g) = 0.30:1 and the liquid-to-material ratio of 15mL / g, heat it to 170°C under stirring conditions, and keep it for 5 hours. After the reaction is completed, cool it to obtain a solid-liquid mixture.

[0068] (3) Filter the solid-liquid mixture and rinse it with pure water. Place the obtained solid-phase product in an oven at 90 °C and dry it for 12 h, then take it out and weigh it (mass m2 = 19.446 g). Calculate the dissolution rate of the organic components in the filler material using the calculation formula, and the result is 97.45%.

[0069] Example 3

[0070] (1) Cut the waste circuit board into the size required for the reaction (3 mm * 3 mm * 1.6 mm), dry it in an environment at 79 °C for 15 h, and then weigh it.

[0071] (2) Take an appropriate amount of the cut sample (mass m1 = 30 g) and put it into the reactor. Add the composite solvent to the reactor according to the ratio of [Bmim]Cl (g): DMI (g) = 0.42:1 and a liquid-to-material ratio of 15 mL / g. Heat it to 175 °C under stirring conditions and continue for 5 hours. After the reaction is completed, cool it to obtain a solid-liquid mixture.

[0072] (3) Filter the solid-liquid mixture and rinse it with pure water. Place the obtained solid-phase product in an oven at 90 °C and dry it for 12 h, then take it out and weigh it (mass m2 = 19.953 g). Calculate the dissolution rate of the organic components in the filler material using the calculation formula, and the result is 92.77%.

[0073] Example 4

[0074] (1) Cut the waste circuit board into the size required for the reaction (3 mm * 3 mm * 1.6 mm), dry it in an environment at 79 °C for 15 h, and then weigh it.

[0075] (2) Take an appropriate amount of the cut sample (mass m1 = 30 g) and put it into the reactor. Add the composite solvent to the reactor according to the ratio of [Bdmim]OH (g): DMAP (g) = 0.38:1 and a liquid-to-material ratio of 15 mL / g. Heat it to 165 °C under stirring conditions and continue for 5 hours. After the reaction is completed, cool it to obtain a solid-liquid mixture.

[0076] (3) Filter the solid-liquid mixture and rinse it with pure water. Place the obtained solid-phase product in an oven at 90 °C and dry it for 12 h, then take it out and weigh it (mass m2 = 19.892 g). Calculate the dissolution rate of the organic components in the filler material using the calculation formula, and the result is 93.33%.

[0077] Example 5

[0078] (1) Cut the waste circuit board into the size required for the reaction (3 mm * 3 mm * 1.6 mm), dry it in an environment at 79 °C for 15 h, and then weigh it.

[0079] (2) Take an appropriate amount of the cut samples (mass m1 = 30 g), put them into the reactor, add the composite solvent into the reactor according to the ratio of [Bmim]Br(g):NMP(g) = 0.35:1 and the liquid-to-material ratio of 15 mL / g, heat to 170 °C under stirring conditions, and keep it for 5 hours. After the reaction is completed, cool it to obtain a solid-liquid mixture.

[0080] (3) Filter the solid-liquid mixture and rinse it with pure water. Place the obtained solid-phase product in an oven at 90 °C and dry it for 12 h, then take it out and weigh it (mass m2 = 19.547 g). Calculate the dissolution rate of the organic components in the filler material to be 96.52% using the calculation formula.

[0081] Example 6

[0082] (1) Cut the waste circuit board into the required size for the reaction (3 mm * 3 mm * 1.6 mm), dry it in an environment at 79 °C for 15 h, and then weigh it.

[0083] (2) Take an appropriate amount of the cut samples (mass m1 = 30 g), put them into the reactor, add the composite solvent into the reactor according to the ratio of [Bmim]OH(g):DMF(g) = 0.30:1 and the liquid-to-material ratio of 15 mL / g, heat to 170 °C under stirring conditions, and keep it for 5 hours. After the reaction is completed, cool it to obtain a solid-liquid mixture.

[0084] (3) Filter the solid-liquid mixture and rinse it with pure water. Place the obtained solid-phase product in an oven at 90 °C and dry it for 12 h, then take it out and weigh it (mass m2 = 21.845 g). Calculate the dissolution rate of the organic components in the filler material to be 75.3% using the calculation formula.

[0085] Example 7

[0086] (1) Cut the waste circuit board into the required size for the reaction (3 mm * 3 mm * 1.6 mm), dry it in an environment at 79 °C for 15 h, and then weigh it.

[0087] (2) Take an appropriate amount of the cut samples (mass m1 = 30 g), put them into the reactor, add the composite solvent into the reactor according to the ratio of [Emim]BF4(g):DMAc(g) = 0.31:1 and the liquid-to-material ratio of 15 mL / g, heat to 170 °C under stirring conditions, and keep it for 5 hours. After the reaction is completed, cool it to obtain a solid-liquid mixture.

[0088] (3) Filter the solid-liquid mixture and rinse it with pure water. Place the obtained solid-phase product in an oven at 90 °C and dry it for 12 h, then take it out and weigh it (mass m2 = 21.04 g). Calculate the dissolution rate of the organic components in the filler material to be 82.73% using the calculation formula.

[0089] Example 8

[0090] (1) Cut the waste circuit board into the size required for the reaction (3 mm * 3 mm * 1.6 mm), and dry it in an environment of 79 °C for 15 h and then weigh it.

[0091] (2) Take an appropriate amount of the cut sample (mass m1 = 30 g), put it into the reactor, add the composite solvent into the reactor according to the ratio of [BMPy][DEP] (g): DMSO (g) = 0.35: 1 and a liquid-to-material ratio of 15 mL / g, heat it to 170 °C under stirring conditions for 5 hours. After the reaction is completed, cool it to obtain a solid-liquid mixture.

[0092] (3) Filter the solid-liquid mixture and rinse it with pure water. Place the obtained solid-phase product in an oven at 90 °C and dry it for 12 h, then take it out and weigh it (mass m2 = 21.31 g). Calculate the dissolution rate of the organic components in the filling material to be 80.24% using the calculation formula.

[0093] Example 9

[0094] (1) Cut the waste circuit board into the size required for the reaction (3 mm * 3 mm * 1.6 mm), and dry it in an environment of 79 °C for 15 h and then weigh it.

[0095] (2) Take an appropriate amount of the cut sample (mass m1 = 30 g), put it into the reactor, add the composite solvent into the reactor according to the ratio of [BMPy]Cl (g): DMI (g) = 0.34: 1 and a liquid-to-material ratio of 15 mL / g, heat it to 170 °C under stirring conditions for 5 hours. After the reaction is completed, cool it to obtain a solid-liquid mixture.

[0096] (3) Filter the solid-liquid mixture and rinse it with pure water. Place the obtained solid-phase product in an oven at 90 °C and dry it for 12 h, then take it out and weigh it (mass m2 = 21.649 g). Calculate the dissolution rate of the organic components in the filling material to be 77.11% using the calculation formula.

[0097] Example 10

[0098] (1) Cut the waste circuit board into the size required for the reaction (3 mm * 3 mm * 1.6 mm), and dry it in an environment of 79 °C for 15 h and then weigh it.

[0099] (2) Take an appropriate amount of the cut sample (mass m1 = 30 g), put it into the reactor, add the composite solvent into the reactor according to the ratio of [BMPy]Br (g): DMF (g) = 0.35: 1 and a liquid-to-material ratio of 15 mL / g, heat it to 170 °C under stirring conditions for 5 hours. After the reaction is completed, cool it to obtain a solid-liquid mixture.

[0100] (3) Filter the solid-liquid mixture and rinse it with pure water. Place the obtained solid-phase product in an oven at 90 °C and dry it for 12 h, then take it out and weigh it (mass m2 = 22.409 g). Calculate the dissolution rate of the organic components in the filler material using the calculation formula, and the result is 70.09%.

[0101] Example 11

[0102] (1) Cut the waste circuit board into the size required for the reaction (3 mm * 3 mm * 1.6 mm), and dry it in an environment at 79 °C for 15 h, then weigh it.

[0103] (2) Take an appropriate amount of the cut sample (mass m1 = 30 g) and put it into the reactor. Add the composite solvent into the reactor according to the ratio of [EMPy]OH(g):DMAc(g) = 0.35:1 and a liquid-to-material ratio of 15 mL / g. Heat it to 170 °C under stirring conditions and keep it for 5 hours. After the reaction ends, cool it to obtain a solid-liquid mixture.

[0104] (3) Filter the solid-liquid mixture and rinse it with pure water. Place the obtained solid-phase product in an oven at 90 °C and dry it for 12 h, then take it out and weigh it (mass m2 = 19.840 g). Calculate the dissolution rate of the organic components in the filler material using the calculation formula, and the result is 93.81%.

[0105] Example 12

[0106] (1) Cut the waste circuit board into the size required for the reaction (3 mm * 3 mm * 1.6 mm), and dry it in an environment at 79 °C for 15 h, then weigh it.

[0107] (2) Take an appropriate amount of the cut sample (mass m1 = 30 g) and put it into the reactor. Add the composite solvent into the reactor according to the ratio of [HMPy]Cl(g):DMSO(g) = 0.40:1 and a liquid-to-material ratio of 15 mL / g. Heat it to 170 °C under stirring conditions and keep it for 5 hours. After the reaction ends, cool it to obtain a solid-liquid mixture.

[0108] (3) Filter the solid-liquid mixture and rinse it with pure water. Place the obtained solid-phase product in an oven at 90 °C and dry it for 12 h, then take it out and weigh it (mass m2 = 20.777 g). Calculate the dissolution rate of the organic components in the filler material using the calculation formula, and the result is 85.16%.

[0109] Comparative Example 1

[0110] The difference from Example 1 is only that the addition of the ionic liquid [Bmim]BF4 in step (2) is omitted, and the other steps and parameters are the same as those in Example 1. In this comparative example, m2 = 29.504 g; calculate the dissolution rate of the organic components in the filler material of this comparative example using the calculation formula, and the result is 4.58%.

[0111] Comparative Example 2

[0112] It is only different from Example 1 in that the addition of the organic solvent DMI in step (2) is omitted, and the remaining steps and parameters are the same as those in Example 1. In this comparative example, m2 = 29.959 g; the dissolution rate of the organic components in the filling material of this comparative example is calculated to be 0.38% using the calculation formula.

[0113] The above-described embodiments are only descriptions of the preferred modes of the present invention, and do not limit the scope of the present invention. Without departing from the design spirit of the present invention, various deformations and improvements made by those of ordinary skill in the art to the technical solutions of the present invention shall fall within the protection scope determined by the claims of the present invention.

Claims

1. A method for dissolving and separating waste circuit board filling materials by a chemical solvent method, characterized in that It includes the following steps: Cut and dry the waste circuit board to obtain a sample; Place the sample in a composite solvent for reaction, and obtain a solid-liquid mixture after the reaction ends; Filter the solid-liquid mixture to obtain a solid and a filtrate; The composite solvent is a mixture of an ionic liquid and an organic solvent; The ionic liquid is one or more of 1-butyl-3-methylimidazolium tetrafluoroborate, 1-butyl-3-methylimidazolium chloride, 1-butyl-3-methylimidazolium bromide, 1-ethyl-3-methylimidazolium tetrafluoroborate, 1-butyl-2,3-dimethylimidazolium hydroxide, 1-ethyl-3-methylimidazolium acetate, 1-butyl-3-methylimidazolium hydroxide, 1-butyl-4-methylpyridinium chloride, 1-butyl-4-methylpyridinium bromide, 1-ethyl-3-methylpyridinium hydroxide, 1-hexyl-3-methylpyridinium chloride, and 1-butyl-3-methylpyridinium diethyl phosphate; The organic solvent is one or more of toluene, dimethylacetamide, 4-dimethylaminopyridine, 1,3-dimethyl-2-imidazolidinone, dimethyl sulfoxide, N-methylpyrrolidone, and dimethylformamide; 2. The method for dissolving and separating waste circuit board filling materials by the chemical solvent method according to claim 1, characterized in that The mass ratio of the ionic liquid to the organic solvent is (0.1-1):1; 3. The method for dissolving and separating waste circuit board filling materials by the chemical solvent method according to claim 1, characterized in that, The liquid-solid ratio of the composite solvent to the sample is (7-90) mL:1 g; 4. The method for dissolving and separating waste circuit board filling materials by the chemical solvent method according to claim 1, wherein, The temperature of the reaction is 100°C to 250°C, the time is 1 h to 20 h, and the pressure is 1 to 15 MPa; 5. The method for dissolving and separating waste circuit board filling materials by the chemical solvent method according to claim 1, characterized in that, The temperature of the drying is 65°C - 150°C, and the time is 5 h - 24 h; 6. The method for dissolving and separating waste circuit board filling materials by the chemical solvent method according to claim 1, characterized in that, After the filtration, it further includes the steps of washing the obtained solid and drying it at 70°C - 120°C for 3 h - 15 h; 7. The method for dissolving and separating the waste circuit board filling material by the chemical solvent method according to claim 1, wherein, The waste circuit board is mainly composed of a substrate, a conductive layer, and electronic components; the filling material of the substrate is a mixture of a thermosetting resin and glass fiber; the content of the organic component in the filling material is 20% - 50%.

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