Equipment for evaluating bonding strength

Abstract

The invention provides equipment for evaluating bonding strength, and belongs to the technical field of semiconductor production. Comprising a base; the carrier is mounted on the base and used for fixing a to-be-evaluated sample, and the to-be-evaluated sample comprises at least two objects which are combined together; the two stand columns are arranged on the base at a preset interval; the moving assembly is connected with the two stand columns respectively, and a cutter is installed on the moving assembly; the first driving mechanism is connected with the movement assembly, and the first driving mechanism is used for driving the movement assembly to drive the cutter to move in the vertical direction so as to be inserted into the to-be-evaluated sample or be far away from the to-be-evaluated sample; the displacement sensor is arranged on the movement assembly and used for detecting displacement information of the movement assembly; the force sensor is used for detecting stress information of the motion assembly; and the controller is used for acquiring the displacement information and the stress information, and evaluating the bonding strength of the to-be-evaluated sample according to the displacement information and the stress information. According to the technical scheme, the bonding strength can be accurately evaluated.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor production, and particularly to a device for evaluating bonding strength. Background Art

[0002] Wafer bonding is an important process in the production of semiconductor structure products, and the bonding strength is a key quality parameter of the bonded products. Therefore, evaluating the bonding strength is crucial in the production and manufacturing of bonded products.

[0003] In the prior art, the insertion method is usually used to evaluate the bonding strength. As Figure 1 shown, in this method, a blade needs to be inserted into the bonding gap, and then the bonding strength is evaluated by measuring the height of the bonded product surface after the blade is inserted ( Figure 1 in which, L represents the displacement of the blade inserted into the bonding gap, and h0, h1, h2, and h3 represent the heights at different positions on the product surface, and h0 < h1 = h2 = h3). However, in this evaluation method, it is difficult to accurately measure the height of the product surface, resulting in errors in the evaluation results of the bonding strength. Summary of the Invention

[0004] The present invention provides a device for evaluating bonding strength, which can accurately evaluate the bonding strength.

[0005] In order to achieve the above object, the technical solution adopted in the embodiment of the present invention is:

[0006] A device for evaluating bonding strength, comprising:

[0007] A base;

[0008] A carrier mounted on the base, the carrier being used for fixing a specimen to be evaluated, the specimen to be evaluated including at least two objects bonded together;

[0009] Two columns spaced apart by a preset distance on the base;

[0010] A motion assembly connected to the two columns respectively, a tool being mounted on the motion assembly;

[0011] A first driving mechanism connected to the motion assembly, the first driving mechanism being used for driving the motion assembly to drive the tool to move in the vertical direction to insert into the specimen to be evaluated or move away from the specimen to be evaluated;

[0012] A displacement sensor provided on the motion assembly, the displacement sensor being used for detecting the displacement information of the motion assembly;

[0013] A force sensor provided on the motion assembly, the force sensor being used for detecting the force information of the motion assembly;

[0014] A controller is configured to obtain the displacement information and the force information, and evaluate the bonding strength of the specimen to be evaluated according to the displacement information, the force information, and a target mapping relationship, where the target mapping relationship is a mapping relationship between displacement, force, and bonding strength obtained through mechanical analysis.

[0015] In some embodiments, when evaluating the bonding strength of the specimen to be evaluated according to the displacement information, the force information, and the target mapping relationship, the controller is specifically configured to:

[0016] Select N data from the displacement information and the force information respectively to obtain N pairs of data, where N is a positive integer greater than or equal to 2, and each pair of data includes: a displacement data derived from the displacement information, and a force data in the force information that has the same time identifier as the displacement data;

[0017] Taking displacement as the X-axis and force as the Y-axis, plot an initial curve according to the N pairs of data;

[0018] Select a partial curve whose change trend conforms to the target mapping relationship from the initial curve as the target curve;

[0019] Perform exponential regression analysis on the target curve to obtain an exponential function expression corresponding to the target curve, and use the amplitude coefficient in the exponential function expression as the bonding strength of the specimen to be evaluated.

[0020] In some embodiments, the moving component includes:

[0021] Two parallel guide rails are respectively arranged on the two columns, and a slider is arranged on each guide rail;

[0022] A cross beam is arranged between the two columns, and two ends of the cross beam are respectively connected to the sliders on the two guide rails;

[0023] A tool clamping part is arranged on one side of the cross beam facing the base, and the tool is installed on the tool clamping part and partially extends outside the tool clamping part;

[0024] Wherein, the first driving mechanism is connected to the cross beam, and the first driving mechanism is configured to drive the cross beam to move in the vertical direction along the guide rail to drive the tool to move in the vertical direction.

[0025] In some embodiments, the force sensor is arranged inside the cross beam.

[0026] In some embodiments, the carrier includes:

[0027] The lower base plate is fixedly installed on the base.

[0028] The specimen chuck is arranged on one side of the lower base plate away from the base, and the chuck is used to clamp the specimen to be evaluated.

[0029] In some embodiments, a chute is formed on the lower base plate, and the specimen chuck includes:

[0030] A fixed chuck fixedly installed on the lower base plate;

[0031] A movable chuck is movably connected to the lower base plate through the chute;

[0032] A second driving mechanism is connected to the movable chuck, and the second driving mechanism is used to drive the movable chuck to move along the chute so that the movable chuck approaches or moves away from the fixed chuck;

[0033] A fastener is used to connect the movable chuck and the fixed chuck together.

[0034] In some embodiments, the chute is recessed on one side of the lower base plate away from the base, and a connecting block matching the chute is arranged on one side of the movable chuck facing the lower base plate.

[0035] In some embodiments, a first mounting hole is formed in the movable chuck, and a second mounting hole is formed in the fixed chuck;

[0036] Wherein, the first mounting hole and the second mounting hole are coaxially arranged, and threads are provided in both the first mounting hole and the second mounting hole;

[0037] Threads matching the first mounting hole and the second mounting hole are provided on the outer surface of the fastener, and the fastener passes through the first mounting hole and the second mounting hole to connect the movable chuck and the fixed chuck together.

[0038] In some embodiments, a pre-tightening groove is further formed on the lower base plate, and the pre-tightening groove is used to fix the specimen to be evaluated, and a part of the specimen to be evaluated is inserted into the pre-tightening groove.

[0039] In some embodiments, the tool is aligned with the pre-tightening groove.

[0040] In some embodiments, the device for evaluating the bonding strength further includes:

[0041] A fixed beam fixedly connected between the two columns.

[0042] The beneficial effects of the present invention are:

[0043] In this embodiment, the first driving mechanism can drive the moving component to drive the tool to move in the vertical direction to insert into the sample to be evaluated and separate the sample to be evaluated. During this process, the displacement information of the moving component is detected by a displacement sensor, and the force information of the moving component is detected by a force sensor. The controller can obtain the displacement information and the force information, and evaluate the bonding strength of the sample to be evaluated in combination with the mapping relationship between displacement, force and bonding strength. Description of the Drawings

[0044] Figure 1 Schematic diagram showing the evaluation of bonding strength by the insertion method in the prior art;

[0045] Figure 2 Schematic diagram of the overall structure of the device for evaluating bonding strength according to an embodiment of the present invention;

[0046] Figure 3 Partial schematic diagram when the device for evaluating bonding strength according to an embodiment of the present invention is working;

[0047] Figure 4 Schematic diagram of the structure of the carrier according to an embodiment of the present invention;

[0048] Figure 5-1 Side view of the structure of the sample to be evaluated according to an embodiment of the present invention;

[0049] Figure 5-2 Front view of the structure of the sample to be evaluated according to an embodiment of the present invention;

[0050] Figure 6 Side view of the structure of the tool according to an embodiment of the present invention;

[0051] Figure 7 Front view of the structure of the tool according to an embodiment of the present invention;

[0052] Figure 8 Schematic diagram of parameters in the bonding strength evaluation test according to an embodiment of the present invention;

[0053] Figure 9 Schematic diagram of the force analysis of the tool in the bonding strength evaluation test according to an embodiment of the present invention;

[0054] Figure 10 One of the schematic diagrams of the relationship curve between force and displacement according to an embodiment of the present invention;

[0055] Figure 11 Another schematic diagram of the relationship curve between force and displacement according to an embodiment of the present invention. Detailed Description of the Invention

[0056] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the described embodiments of the present invention fall within the scope of protection of the present invention.

[0057] To solve the above technical problems, an embodiment of the present invention provides a device for evaluating bonding strength, which can accurately evaluate the bonding strength.

[0058] As Figure 2 shown, an embodiment of the present invention provides a device for evaluating bonding strength, including:

[0059] a base 1, a carrier 2, two columns 4, a motion assembly 5, a first driving mechanism, a displacement sensor, a force sensor, and a controller.

[0060] Among them, as Figure 3 shown, the carrier 2 is mounted on the base 1, and the carrier 2 is used to fix the specimen to be evaluated 3, and the specimen to be evaluated 3 includes at least two objects bonded together.

[0061] It should be noted that the above specimen to be evaluated 3 may specifically be a Bonding Wafer (that is, a bonded wafer), and a Bonding Wafer refers to two or more wafers bonded together by physical or chemical methods during the manufacturing process.

[0062] In the following embodiments, the specimen to be evaluated 3 is a Bonding Wafer (such as a wafer bonded by a room-temperature bonding process) as an example for illustration.

[0063] The two columns 4 are arranged on the base 1 at a preset distance apart.

[0064] The motion assembly 5 is respectively connected to the two columns 4, and a tool 6 is mounted on the motion assembly 5. As Figure 3 shown, here, the tool 6 is used to apply a load to the specimen to be evaluated 3 so as to split the specimen to be evaluated 3, that is, to separate different wafers from the bonding position of two or more wafers on the Bonding Wafer.

[0065] The first driving mechanism is connected to the motion assembly 5, and the first driving mechanism is used to drive the motion assembly 5 to drive the tool 6 to move in the vertical direction to insert into the specimen to be evaluated 3 or away from the specimen to be evaluated 3, and the vertical direction is perpendicular to the horizontal plane.

[0066] A displacement sensor is disposed on the moving component 5, and the displacement sensor is used to detect the displacement information of the moving component 5. Specifically, a displacement sensor with a resolution less than 0.001 mm can be adopted to ensure the detection accuracy.

[0067] A force sensor is disposed on the moving component 5, and the force sensor is used to detect the force information of the moving component 5. Specifically, a force sensor with a resolution less than 0.001 N can be adopted to ensure the detection accuracy.

[0068] A controller is configured to obtain the displacement information and the force information, and evaluate the bonding strength of the specimen 3 to be evaluated according to the displacement information, the force information, and a target mapping relationship, where the target mapping relationship is a mapping relationship between displacement, force, and bonding strength obtained through mechanical analysis.

[0069] It should be noted that the controller can also control the first driving mechanism to drive the moving component 5 to drive the tool 6 to move in the vertical direction.

[0070] In this embodiment, the first driving mechanism can drive the moving component 5 to drive the tool 6 to move in the vertical direction to insert into the specimen 3 to be evaluated and separate the specimen 3 to be evaluated. During this process, the displacement information of the moving component is detected by the displacement sensor, and the force information of the moving component is detected by the force sensor. The controller can obtain the displacement information and the force information, and combine the mapping relationship between displacement, force, and bonding strength to evaluate the bonding strength of the specimen 3 to be evaluated.

[0071] In some embodiments, the moving component 5 includes: two guide rails 501, a cross beam 502, and a tool clamping portion 503.

[0072] Among them, the two mutually parallel guide rails 501 are respectively disposed on the two columns 4, and a slider is disposed on each guide rail.

[0073] The cross beam 502 is disposed between the two columns 4, and two ends of the cross beam 502 are respectively connected to the sliders on the two guide rails 501.

[0074] The tool clamping portion 503 is disposed on one side of the cross beam 502 facing the base 1, and the tool 6 is installed on the tool clamping portion 503 and partially extends outside the tool clamping portion 503.

[0075] Among them, the first driving mechanism is connected to the cross beam 502, and the first driving mechanism is used to drive the cross beam 502 to move in the vertical direction along the guide rail 501 to drive the tool 6 to move in the vertical direction.

[0076] In some embodiments, the force sensor is disposed inside the cross beam 502.

[0077] Specifically, a piezoelectric force sensor may be used as the force sensor. When the tool 6 applies a load to the specimen 3 to be evaluated, a reaction force from the specimen 3 to be evaluated is received. This reaction force is transmitted to the cross beam 502 through the tool holder 503. The piezoelectric force sensor disposed inside the cross beam 502 generates electric charges based on the piezoelectric effect when subjected to an external force, and the amount of the electric charges is proportional to the reaction force. Therefore, the force sensor can calculate the magnitude of the force by measuring the amount of the electric charges, and use the information of this force as the force information detected by the force sensor. This force information can, to a certain extent, reflect the force condition on the tool 6 from the specimen 3 to be evaluated.

[0078] In addition, it should be noted that a displacement sensor (specifically, a grating scale may be used) can be fixed on the cross beam 502 to directly measure the movement of the cross beam 502.

[0079] In some embodiments, the carrier 2 includes a lower base plate 201 and a specimen chuck 202. Among them, the lower base plate 201 is fixedly installed on the base 1; the specimen chuck 202 is disposed on a side of the lower base plate 201 away from the base 1, and the chuck is used for clamping the specimen 3 to be evaluated.

[0080] As Figure 4 shown, in some embodiments, a chute 2011 is formed on the lower base plate 201, and the specimen chuck 202 includes a fixed chuck 2021, a movable chuck 2022, a second driving mechanism, and a fastener 2023.

[0081] Among them, the fixed chuck 2021 is fixedly installed on the lower base plate 201.

[0082] The movable chuck 2022 is movably connected to the lower base plate 201 through the chute 2011.

[0083] The second driving mechanism is connected to the movable chuck 2022, and the second driving mechanism is used to drive the movable chuck 2022 to move along the chute 2011 so that the movable chuck 2022 approaches or moves away from the fixed chuck 2021.

[0084] The fastener 2023 is used to connect the movable chuck 2022 and the fixed chuck 2021 together.

[0085] As Figure 4As shown, in the vehicle 2, the lower bottom plate 201 is assembled on the base 1, and the fixed chuck 2021 is fixedly installed on the lower bottom plate 201, and the position of the fixed chuck 2021 is not adjustable. The fixed chuck 2021 can cooperate with the movable chuck 2022 to clamp the sample 3 to be evaluated together, so as to fix the sample 3 to be evaluated.

[0086] It should be noted that the tool clamping part 503 is similar in structure to the vehicle 2 as Figure 4 shown, and the way the tool clamping part 503 clamps the tool 6 is similar to the way the vehicle 2 clamps the sample 3 to be evaluated, which will not be elaborated here.

[0087] In some embodiments, the sliding groove 2011 is recessed on one side of the lower bottom plate 201 away from the base 1, and a sliding block matching the sliding groove 2011 is arranged on one side of the movable chuck 2022 facing the lower bottom plate 201.

[0088] In some embodiments, a first mounting hole is formed in the movable chuck 2022, and a second mounting hole is formed in the fixed chuck 2021; wherein, the first mounting hole and the second mounting hole are coaxially arranged, and threads are provided in both the first mounting hole and the second mounting hole; the outer surface of the fastener 2023 is provided with threads matching the first mounting hole and the second mounting hole, and the fastener 2023 passes through the first mounting hole and the second mounting hole to connect the movable chuck 2022 and the fixed chuck 2021 together.

[0089] In some embodiments, a pre-tightening groove 2012 is further formed on the lower bottom plate 201, and the pre-tightening groove 2012 is used to fix the sample 3 to be evaluated, and a part of the sample 3 to be evaluated is inserted into the pre-tightening groove 2012.

[0090] It should be noted that when performing the bonding strength evaluation test on the sample 3 to be evaluated, the sample 3 to be evaluated can be pre-placed in the pre-tightening groove 2012 in advance. The size of the pre-tightening groove 2012 matches the cross-sectional size of the sample 3 to be evaluated, which can ensure effective pre-tightening of the sample 3 to be evaluated. After pre-tightening, the controller can control the second driving mechanism to push the movable chuck 2022 to move along the sliding groove 2011 towards the fixed chuck 2021, gradually approaching the fixed chuck 2021. Finally, the fastener 2023 is tightened on the movable chuck 2022 and the fixed chuck 2021 to fix the movable chuck 2022 and the fixed chuck 2021 together. In this way, the clamping of the sample 3 to be evaluated is completed.

[0091] In some embodiments, the tool 6 is aligned with the pre-tightening groove 2012.

[0092] It should be noted that as Figure 5-1As shown, the edge of the Bonding Wafer can be cut into small pieces as shown in Figure 5-2 (with a size of approximately 30mm * 40mm). When conducting a bonding strength evaluation test on the sample 3 to be evaluated, the cutting tool 6 is inserted along the circular arc of the Bonding Wafer edge.

[0093] As shown in Figure 6 - Figure 7 , in some specific alternative embodiments, the tip 601 of the cutting tool 6 is slightly inclined, that is, the thickness of one end of the cutting tool 6 shows a gradually decreasing trend, so that the two end faces of the cutting tool 6 are slightly inclined at the tip 601, and the inclination angle is approximately about 1°, and the thinnest part of the cutting tool 6 is about 0.1mm. In addition, the width of the cutting tool 6 can be determined according to the actual situation. For example, the cutting tool 6 can be prepared as a blade with a width of about 20mm.

[0094] In this embodiment, as shown in Figure 3 , when the device conducts a bonding strength evaluation test on the sample 3 to be evaluated, the controller controls the first driving mechanism to drive the crossbeam 502 to move downward, driving the tool clamping part 503 to move downward. The cutting tool 6 is driven by the tool clamping part 503 and moves downward in the vertical direction at a constant rate. The tip 601 of the cutting tool 6 is aligned with the middle gap (that is, the joint of different wafers) of the sample 3 to be evaluated (such as the Bonding Wafer), so that the tip 601 just touches the sample 3 to be evaluated. At this time, the force of the force sensor should be less than 0.1N; zero the displacement sensor, and the cutting tool 6 continues to move downward at a rate of 0.1mm / min. After moving downward by 0.5mm, the rate is adjusted to 0.2mm / min until the sample 3 to be evaluated is split to a certain extent (here, the maximum displacement can be preset to 2mm, that is, from the moment the tip 601 just touches the sample 3 to be evaluated until the cutting tool 6 stops moving downward, the maximum displacement of the cutting tool 6 is 2mm) (or until the sample 3 to be evaluated is separated) or the sample breaks; record the force and displacement values feedback by the two sensors during the test, and draw the relationship curve of force and displacement in the test accordingly.

[0095] It should be noted that, similar to general mechanical tests, the bonding strength evaluation in the embodiments of the present invention can be carried out by fitting the relationship curve.

[0096] In some embodiments, when evaluating the bonding strength of the specimen 3 to be evaluated according to the displacement information, the force information, and the target mapping relationship, the controller is specifically configured to: respectively select N data from the displacement information and the force information to obtain N pairs of data, where N is a positive integer greater than or equal to 2, and each pair of data includes: a displacement data from the displacement information and a force data in the force information that has the same time identifier as the displacement data; with displacement as the X-axis and force as the Y-axis, draw an initial curve according to the N pairs of data; select a partial curve whose change trend conforms to the target mapping relationship from the initial curve as the target curve; perform exponential regression analysis on the target curve to obtain the exponential function expression corresponding to the target curve, and use the amplitude coefficient in the exponential function expression as the bonding strength of the specimen 3 to be evaluated.

[0097] Here, the time identifier of the displacement data is used to identify the moment when the displacement sensor detects and obtains the displacement data, and the time identifier of the force data is used to identify the moment when the force sensor detects and obtains the force data.

[0098] Next, a specific example of evaluating the bonding strength through the curve of force and displacement will be given.

[0099] Here, the mechanical analysis and derivation process of the target mapping relationship will be introduced first:

[0100] As Figure 8 shown, according to Griffith fracture theory and simple bent beam theory, the bonding strength can be expressed as:

[0101] where γ represents the bonding strength; F represents the tensile force; L represents the displacement information (the length of the separated part of the specimen 3 to be evaluated in the horizontal direction, corresponding to the displacement of the tool 6 advancing in the specimen 3 to be evaluated starting from when the tip 601 just touches the specimen 3 to be evaluated in the embodiments of the present invention); E represents Young's modulus (for example: for single-crystalline silicon with a crystal orientation of

[100] , its corresponding Young's modulus is 180 GPa); b represents the width of the specimen 3 to be evaluated; 2t represents the thickness of the specimen 3 to be evaluated.

[0102] It should be noted that the force application method of the tool 6 on the specimen 3 to be evaluated in the bonding strength evaluation test of the embodiments of the present invention is different from the force application method of the tensile force shown in Figure 8 (specifically, the tensile force F shown in Figure 8 pulls the specimen 3 to be evaluated apart, while in the embodiments of the present invention, the tool 6 squeezes the bonding gap of the specimen 3 to be evaluated to separate the specimen 3 to be evaluated). As Figure 9 shown, it is a schematic diagram of the force analysis of the tool 6 during the bonding strength evaluation test in the embodiments of the present invention, Ff Denote the force on the tool 6. Since the angle of the tool 6 is very small (about 1°, cos1° is approximately equal to 1, sin1° is approximately equal to 0), thus, the force on the tool 6 is approximately equal to F load , and the force balance equation can be expressed as F load = 2μF. Where, F load denotes the force on the tool 6, and μ is the friction coefficient (the literature value of the friction coefficient of monocrystalline silicon is 0.16).

[0103] As can be seen from the above analysis, as Figure 9 shown, combining with the formula and F load = 2μF, it can be obtained that:

[0104] In a specific embodiment, the friction coefficient (μ) is 0.16, the Young's modulus (E) is 180 GPa, the width (b) of the specimen 3 to be evaluated is 30 mm, the thickness (2t) of the specimen 3 to be evaluated is 40 mm, and the displacement information (L) is 2 mm. Substituting into the formula gives the expression of the target mapping relationship as:

[0105] It should be noted that for the relationship curve of force and displacement (i.e., the initial curve) drawn according to the force and displacement values fed back by two sensors in the test in the embodiments of the present invention, the drawing process mainly includes: selecting N data from the displacement information and the force information respectively. The N displacement data derived from the displacement information and the N force data derived from the force information are in one-to-one correspondence, specifically manifested in that the time of the displacement data (i.e., the time stamp of the displacement data) and the time of the force data (i.e., the time stamp of the displacement data) are the same. Thus, the corresponding displacement data and force information form a set of data pairs, and N sets of data pairs can be obtained; with displacement as the X-axis and force as the Y-axis, according to the N sets of data pairs, the initial curve is drawn.

[0106] It should be noted that after the initial curve is drawn, it is necessary to further select the curve segment of this relationship curve (i.e., the initial curve) that satisfies the above relationship (i.e., the expression of the target mapping relationship ) for calculation to obtain the accurate bonding strength.

[0107] For example, as Figure 10 shown, it is a schematic diagram of the relationship curve of force and displacement in the embodiments of the present invention. It is necessary to select the latter half of this relationship curve for curve fitting. Specifically, the curve in the range of x from 0.7 mm to 1.5 mm (i.e., the target curve, see the curve shown in Figure 11 ) can be selected for exponential fitting (i.e., exponential regression analysis) to obtain Figure 11The exponential function expression corresponding to the target curves of force and displacement is: y = 53.737x 0.969 . Where, y represents the ordinate of the relationship curve: force (i.e., F′, unit: N), and x represents the ordinate of the relationship curve: displacement (unit: mm). The requirement for successful fitting is that the confidence level R 2 needs to satisfy: R 2 > 0.9, and the exponent 0.969 is within the range of -0.95 to -1.1, meeting the confidence level requirement.

[0108] As Figure 11 shown, the fitting coefficient (i.e., amplitude coefficient) of the curves of force and displacement is approximately 53.74. It should be noted that this fitting coefficient can characterize the bonding strength of the specimen 3 to be evaluated in this test. When this coefficient is larger, it means it is not easy to insert into the bonding gap of the specimen 3 to be evaluated, that is, the bonding strength of the specimen 3 to be evaluated is larger.

[0109] As an optional embodiment of the present invention, one or more bonding strength thresholds can be set according to experience, and the bonding strength of the specimen 3 to be evaluated can be evaluated according to the thresholds to obtain an evaluation result. Here, taking the setting of two thresholds as an example, the two thresholds are the first threshold (such as 48) and the second threshold (such as 51.2). In this way, if this coefficient is less than or equal to 48, it means the bonding strength of the specimen 3 to be evaluated is small, that is, the bonding strength of the specimen 3 to be evaluated does not meet the requirements; if this coefficient is greater than 48 and less than or equal to 51.2, it means the bonding strength of the specimen 3 to be evaluated is moderate, that is, the bonding strength of the specimen 3 to be evaluated meets the requirements; if this coefficient is greater than 51.2, it means the bonding strength of the specimen 3 to be evaluated is large, that is, the bonding strength of the specimen 3 to be evaluated is excellent. It can be understood that the evaluation process of the bonding strength here is only an example and does not constitute a limitation to the present invention.

[0110] In some embodiments, the device for evaluating the bonding strength further includes: a fixed beam 7, fixedly connected between the two columns 4.

[0111] It should be noted that the fixed beam 7 can strengthen the stability of the connection between the two columns 4 and ensure the reliability of the structure of the device in the embodiments of the present invention.

[0112] In this embodiment, the controller can control the first driving mechanism to drive the cross beam 502 to drive the tool clamping part 503 to move, so as to drive the tool 6 clamped on the tool clamping part 503 to move in the vertical direction, so that the tool 6 is inserted into the sample 3 to be evaluated. The tool 6 applies a load to the sample 3 to be evaluated to separate the sample 3 to be evaluated. During this process, the displacement sensor and the force sensor respectively feedback the force information and displacement information of the moving component. The controller obtains the displacement information detected by the displacement sensor and the force information detected by the force sensor, and can form a relationship curve of force and displacement based on this. Further, the bonding strength of the sample 3 to be evaluated can be evaluated through the relationship curve of force and displacement. In this way, the bonding strength of the sample 3 to be evaluated can be effectively evaluated, and the problem of difficult height measurement in the existing evaluation method is avoided, and the evaluation error caused by difficult height measurement is avoided.

[0113] It should be noted that the embodiments in this specification are all described in a progressive manner. The same or similar parts among the embodiments can be referred to each other, and the differences between each embodiment and other embodiments are emphasized. In particular, for the method embodiment, since it is basically similar to the product embodiment, the description is relatively simple, and the relevant parts can be referred to the description of the product embodiment.

[0114] Unless otherwise defined, the technical terms or scientific terms used in this disclosure should have the ordinary meaning understood by those of ordinary skill in the field to which this disclosure belongs. The "first", "second" and similar terms used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. The terms such as "including" or "comprising" mean that the elements or objects appearing before this term cover the elements or objects listed after this term and their equivalents, without excluding other elements or objects. The terms such as "connected" or "coupled" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The terms such as "upper", "lower", "left" and "right" are only used to represent relative position relationships. When the absolute position of the object to be described changes, the relative position relationship may also change accordingly.

[0115] It can be understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, the element can be "directly" on or under the other element, or there may be intermediate elements.

[0116] In the description of the above embodiments, specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0117] As described above, it is only the specific implementation manner of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present disclosure can easily think of changes or substitutions, which should all be covered within the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims described above.

Claims

1. An apparatus for evaluating bonding strength, characterized in that, Comprising: Base (1); Vehicle (2), mounted on the base (1), the vehicle (2) being used to fix the specimen to be evaluated (3), the specimen to be evaluated (3) comprising at least two objects joined together; Two columns (4), the two columns (4) being arranged on the base (1) at a preset distance apart; Moving assembly (5), respectively connected to the two columns (4), a cutting tool (6) being mounted on the moving assembly (5); First driving mechanism, connected to the moving assembly (5), the first driving mechanism being used to drive the moving assembly (5) to drive the cutting tool (6) to move in the vertical direction so as to insert into the specimen to be evaluated (3) or move away from the specimen to be evaluated (3); Displacement sensor, arranged on the moving assembly (5), the displacement sensor being used to detect the displacement information of the moving assembly (5); Force sensor, arranged on the moving assembly (5), the force sensor being used to detect the force information of the moving assembly (5); Controller, used to obtain the displacement information and the force information, and evaluate the bonding strength of the specimen to be evaluated (3) according to the displacement information, the force information and the target mapping relationship, the target mapping relationship being the mapping relationship between displacement, force and bonding strength obtained through mechanical analysis.

2. The device for evaluating bonding strength according to claim 1, wherein When the controller evaluates the bonding strength of the specimen to be evaluated (3) according to the displacement information, the force information and the target mapping relationship, it is specifically used for: Selecting N data respectively from the displacement information and the force information to obtain N pairs of data, where N is a positive integer greater than or equal to 2, and each pair of data contains: a displacement data derived from the displacement information, and a force data in the force information having the same time identifier as the displacement data; Taking displacement as the X-axis and force as the Y-axis, and drawing an initial curve according to the N pairs of data; Selecting a partial curve whose change trend conforms to the target mapping relationship from the initial curve as the target curve; Performing exponential regression analysis on the target curve to obtain the exponential function expression corresponding to the target curve, and taking the amplitude coefficient in the exponential function expression as the bonding strength of the specimen to be evaluated (3).

3. The device for evaluating bond strength according to claim 1, characterized in that, The vehicle (2) comprises: Lower bottom plate (201), fixedly mounted on the base (1); Specimen chuck (202), arranged on the side of the lower bottom plate (201) away from the base (1), the chuck being used to clamp the specimen to be evaluated (3).

4. The device for evaluating bond strength according to claim 3, characterized in that, A chute (2011) is formed on the lower bottom plate (201), and the specimen chuck (202) comprises: Fixed chuck (2021), fixedly mounted on the lower bottom plate (201); Movable chuck (2022), movably connected to the lower bottom plate (201) through the chute (2011); A second driving mechanism, connected to the movable chuck (2022), for driving the movable chuck (2022) to move along the chute (2011) so that the movable chuck (2022) approaches or moves away from the fixed chuck (2021); A fastener (2023) for connecting the movable chuck (2022) and the fixed chuck (2021) together.

5. The device for evaluating bonding strength according to claim 4, wherein The chute (2011) is recessed on one side of the lower base plate (201) away from the base (1), and a connecting block matching the chute (2011) is provided on one side of the movable chuck (2022) facing the lower base plate (201).

6. The device for evaluating bond strength according to claim 4, characterized in that, A first mounting hole is provided on the movable chuck (2022), and a second mounting hole is provided on the fixed chuck (2021); wherein, the first mounting hole and the second mounting hole are coaxially arranged, and threads are provided in both the first mounting hole and the second mounting hole; The outer surface of the fastener (2023) is provided with threads matching the first mounting hole and the second mounting hole, and the fastener (2023) passes through the first mounting hole and the second mounting hole to connect the movable chuck (2022) and the fixed chuck (2021) together.

7. The device for evaluating bonding strength according to claim 3, wherein A pre-tightening groove (2012) is further provided on the lower base plate (201), and the pre-tightening groove (2012) is used for fixing the specimen to be evaluated (3), and a part of the specimen to be evaluated (3) is inserted into the pre-tightening groove (2012).

8. The device for evaluating bonding strength according to claim 7, characterized in that, The tool (6) is aligned with the pre-tightening groove (2012).

9. The device for evaluating bond strength according to claim 1, characterized in that, The movement assembly (5) includes: Two mutually parallel guide rails (501), respectively arranged on the two columns (4), and a slider is arranged on each guide rail; A cross beam (502), arranged between the two columns (4), and two ends of the cross beam (502) are respectively connected to the sliders on the two guide rails (501); A tool clamping part (503), arranged on one side of the cross beam (502) facing the base (1), and the tool (6) is installed on the tool clamping part (503) and partially extends out of the tool clamping part (503); wherein, the first driving mechanism is connected to the cross beam (502), and the first driving mechanism is used for driving the cross beam (502) to move along the guide rail (501) in the vertical direction to drive the tool (6) to move in the vertical direction.

10. The device for evaluating bonding strength according to claim 9, characterized in that, The force sensor is arranged inside the cross beam (502).

11. The device for evaluating bonding strength according to claim 1, characterized in that, It further includes: A fixed beam (7), fixedly connected between the two columns (4).

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