Chip comprehensive test system based on multifunctional integration

Abstract

The invention relates to the technical field of chip comprehensive testing, in particular to a chip comprehensive testing system based on multifunctional integration. Comprising a feeding mechanism, a receiving mechanism, a magnetic suspension guide rail, a follow-up testing head mechanism, a testing table, five testing sliding seats, a horizontal electric cylinder lead screw, a vertical plate, a vertical electric cylinder lead screw, a testing adsorption head, a preheating plate, a preheating mechanism, four testing fixing frames, four testing flying cameras, a testing rotating table, a testing placing table, a cleaning brush and a cleaning telescopic rod. By integrating the feeding mechanism, the receiving mechanism, the magnetic suspension guide rail, the follow-up testing head mechanism and the testing table into a whole, the situation that chips need to be transferred for multiple times due to the fact that traditional feeding, testing and receiving are conducted through independent equipment is changed, the testing rotary tables in the four testing fixing frames can continuously conduct chip testing, and the testing efficiency is improved. The four testing mechanisms and the follow-up testing head mechanism provide multiple testing functions, different testing requirements of the chip are met, and the testing efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip comprehensive testing, and in particular to a chip comprehensive testing system based on multi-functional integration. Background Art

[0002] With the continuous advancement of information technology, the chip industry has ushered in unprecedented development opportunities. Modern electronic devices have increasingly higher requirements for chip performance and quality, which has prompted the continuous development of chip testing technology. Existing chip testing technology has covered a variety of methods such as analog testing, digital testing, and mixed signal testing. These methods can comprehensively detect the function, performance, and reliability of the chip, providing a strong guarantee for the quality of the chip. Through preset test processes and test parameters, the existing chip testing system can automatically perform test tasks and generate corresponding test reports, greatly improving test efficiency and accuracy. At the same time, some advanced test systems also have certain scalability and flexibility, and can upgrade functions and adjust test processes according to actual needs, so as to better meet the needs of chip testing.

[0003] However, during the chip testing process, traditional testing equipment has a single testing method and cannot meet multiple testing functions. At the same time, loading, testing and receiving are all separate equipment, so the chips need to be transferred between multiple processes, which reduces testing efficiency. Summary of the invention

[0004] The purpose of the present invention is to provide a chip comprehensive testing system based on multi-functional integration, aiming to solve the technical problem in the prior art that in the chip testing process, traditional testing equipment has a single testing mode and cannot meet multiple testing functions. At the same time, loading, testing and receiving are all separate equipment, so the chip needs to be transferred between multiple processes, thereby reducing the testing efficiency.

[0005] To achieve the above object, a chip comprehensive test system based on multi-functional integration adopted by the present invention includes a loading mechanism, a unloading mechanism, a magnetic levitation guide rail, a follow-up test head mechanism and a test bench. Five test sliders adapted to the magnetic levitation guide rail are arranged on the magnetic levitation guide rail. A horizontal electric cylinder screw rod is arranged on the test slider. A vertical plate is arranged at the mobile end of the horizontal electric cylinder screw rod. A vertical electric cylinder screw rod is arranged on one side of the vertical plate. A test suction head is arranged at the mobile end of the vertical electric cylinder screw rod. A preheating plate is arranged at one end of the vertical plate. A preheating mechanism is arranged inside the preheating plate. The preheating plate has heating holes, and the test suction head extends into the heating holes. The magnetic levitation guide rail is fixedly connected to the test bench and is located on the other side of the test bench. The follow-up test head mechanism is fixedly connected to the test bench and is located on one side of the test bench. The loading mechanism is arranged at one end of the corresponding vertical electric cylinder screw rod. The unloading mechanism is arranged at one end of the corresponding vertical electric cylinder screw rod, and the loading mechanism and the unloading mechanism are symmetrically arranged at both ends of the test bench.

[0006] Wherein, four test fixing frames and four test flying shooting cameras are arranged on the test bench. A test rotating table is arranged in the test fixing frame through a rotating motor. Test placing tables are arranged at both ends of the test rotating table. A cleaning brush is arranged at one end of the test rotating table. A cleaning telescopic rod is arranged at the other end of the test rotating table. A cleaning needle paper is arranged at the output end of the cleaning telescopic rod. Four test mechanisms are arranged on one side of the test bench, and the test end of the follow-up test bench is connected to the test end of the corresponding test mechanism.

[0007] Wherein, the follow-up test head mechanism includes a follow-up test component, a follow-up electric cylinder screw rod and a follow-up fixing table. A follow-up test head is arranged at the test end of the follow-up test component. The follow-up test component is fixedly connected to the follow-up electric cylinder screw rod and is located at the mobile end of the follow-up electric cylinder screw rod. The follow-up electric cylinder screw rod is fixedly connected to the follow-up fixing table and is located inside the follow-up fixing table. The follow-up test component is located above the follow-up fixing table. The follow-up fixing table is also fixedly connected to the test bench and is located on one side of the test bench.

[0008] Wherein, the preheating mechanism includes a ceramic heating ring and a conduction plate. An air groove is arranged on the upper end surface of the conduction plate. An air inlet joint is communicated and arranged at one end of the air groove, and the air inlet joint extends to the preheating plate. A preheating groove is communicated and arranged at the other end of the air groove. The ceramic heating ring is arranged between the conduction plate and the preheating plate, and the ceramic heating ring is powered on for heating. The conduction plate is fixedly connected to the preheating plate and is located below the preheating plate.

[0009] Among them, the loading mechanism includes a material taking mechanism, a wafer cassette, a film expanding and loading table, and a workbench. One side of the film expanding and loading table is provided with a film expanding rotation motor and a film expanding lifting motor. The middle of the film expanding and loading table has a through hole. A plurality of film expanding lifting screw sleeves are rotatably arranged on the film expanding and loading table through bearings. A film expanding lifting screw is arranged in the internal thread of the film expanding lifting screw sleeve. A film expanding lifting plate is arranged on a plurality of the film expanding lifting screws. A film expanding placing table is rotatably arranged in the film expanding lifting plate. The film expanding placing table has a C-shaped clamping groove inside. A synchronous belt and a synchronous pulley are used for transmission between the output end of the film expanding rotation motor and the film expanding placing table, and between the output end of the film expanding lifting motor and a plurality of the film expanding lifting screw sleeves.

[0010] Among them, a loading support is arranged on one side of the workbench. One end of the loading support is provided with a loading electric cylinder screw rod. A loading placing plate is arranged on the moving end of the loading electric cylinder screw rod. A loading clamping jaw electric cylinder screw rod is arranged on the loading support. A loading clamping jaw plate is arranged on the moving end of the loading clamping jaw electric cylinder screw rod. A loading clamping jaw mechanism is arranged at one end of the loading clamping jaw plate. A lifting platform is arranged in the middle of the workbench. A thimble mechanism and a Y-direction moving mechanism are arranged on the lifting platform. An X-direction moving mechanism is arranged above the Y-direction moving mechanism. A lifting frame is arranged on the moving end of the X-direction moving mechanism. The wafer cassette is placed on the loading placing plate. The film expanding and loading table is fixedly connected to the lifting frame and is located on the lifting frame. And the loading clamping jaw mechanism is located above the film expanding and loading table. The workbench is arranged at one end of the test bench.

[0011] Among them, the thimble mechanism includes a thimble rod, a thimble sleeve, a thimble support plate, and a thimble electric cylinder screw rod. A thimble body is arranged on the thimble rod. A negative pressure channel is arranged inside the thimble rod. One end of the negative pressure channel communicates with a plurality of negative pressure connection holes. The other end of the negative pressure channel communicates with a negative pressure interface. A thimble wheel is arranged below the thimble rod. A thimble cap is arranged above the thimble sleeve. The thimble cap has a thimble hole and a plurality of negative pressure suction holes. And the negative pressure suction holes are communicated with the negative pressure connection holes. One end of the thimble support plate is provided with a thimble motor. A track plate is arranged at the output end of the thimble motor. The thimble rod is slidably arranged in the thimble sleeve through a thimble spring. And the thimble cap extends above the thimble rod. The thimble wheel and the negative pressure interface extend below the thimble rod. The thimble sleeve is fixedly connected to the thimble support plate and is located at one end of the thimble support plate. And the thimble wheel abuts against the track plate and is located on the track plate. The thimble support plate is fixedly connected to the thimble electric cylinder screw rod and is located on the moving end of the thimble electric cylinder screw rod. The thimble electric cylinder screw rod is fixedly connected to the lifting platform and is located on the lifting platform.

[0012] Among them, the material taking mechanism includes a material taking electric cylinder screw rod and a material taking mounting frame. A material taking fixing plate is arranged at the moving end of the material taking electric cylinder screw rod. Two material taking air cylinders are arranged on the material taking fixing plate. A material taking negative pressure suction nozzle is arranged at the output end of the material taking air cylinder. A support table is arranged on the other side of the workbench. A first material taking guide rail and a second material taking guide rail are arranged on the support table. A first material taking sliding seat is slidably arranged on the first material taking guide rail. A first middle turntable is arranged on the first material taking sliding seat. A second material taking sliding seat is slidably arranged on the second material taking guide rail. A transfer electric cylinder screw rod is arranged on the second material taking sliding seat. A second middle turntable is arranged at the moving end of the transfer electric cylinder screw rod. The material taking electric cylinder screw rod is fixedly connected to the support table and is located on one side of the support table. The material taking mounting frame is fixedly connected to the support table and is located on the support table and also on the side of the second material taking guide rail away from the first material taking guide rail, and the first middle turntable is arranged at one end of the corresponding vertical electric cylinder screw rod.

[0013] Among them, the material receiving mechanism includes a material receiving guide rail, a material receiving rotating motor and a material receiving table. Two material receiving sliding seats are slidably arranged above the material receiving guide rail. A transverse electric cylinder screw rod is arranged on each of the two material receiving sliding seats. A material receiving electric cylinder screw rod is arranged at the moving end of the transverse electric cylinder screw rod, and a material receiving suction nozzle is arranged at the moving end of the material receiving electric cylinder screw rod. A material receiving rotating disk is arranged at the output end of the material receiving rotating motor. Material receiving seats are arranged at both ends of the material receiving rotating disk. A material receiving middle turntable is arranged on the material receiving seat. A material receiving clamping jaw electric cylinder screw rod is arranged at one end of the material receiving table. A material receiving clamping jaw plate is arranged at the moving end of the material receiving clamping jaw electric cylinder screw rod. A material receiving clamping jaw mechanism is arranged at one end of the material receiving clamping jaw plate. A material receiving transfer carrier table is arranged at the other end of the material receiving table.

[0014] Among them, a longitudinal moving mechanism is arranged in the middle of the material receiving table. A material receiving support is arranged at the moving end of the longitudinal moving mechanism. A material receiving support plate is arranged above the material receiving support. A material receiving film expanding table is arranged above the material receiving support plate. A material receiving film expanding plate is arranged inside the material receiving film expanding table. Two C-shaped cavities are formed inside the material receiving film expanding plate, and vacuum suction heads are arranged in the two C-shaped cavities. A basket lifting electric cylinder screw rod is arranged on one side of the material receiving table. A basket placing plate is arranged at the moving end of the basket lifting electric cylinder screw rod. A wafer basket is arranged on the basket placing plate. The material receiving guide rail is fixedly connected to the material receiving table and is located on the other side of the material receiving table. The material receiving rotating motor is arranged at the other end of the material receiving table. The material receiving table is arranged at the other end of the test table, and the corresponding material receiving middle turntable is located at one end of the corresponding vertical electric cylinder screw rod.

[0015] A chip comprehensive testing system based on multi-functional integration of the present invention includes a feeding mechanism, a collecting mechanism, a magnetic levitation guide rail, a follow-up test head mechanism and a test bench. Five test sliders adapted to the magnetic levitation guide rail are arranged on the magnetic levitation guide rail. A horizontal electric cylinder screw rod is arranged on the test slider. A vertical plate is arranged at the mobile end of the horizontal electric cylinder screw rod. A vertical electric cylinder screw rod is arranged on one side of the vertical plate. A test suction head is arranged at the mobile end of the vertical electric cylinder screw rod. A preheating plate is arranged at one end of the vertical plate. A preheating mechanism is arranged inside the preheating plate. The preheating plate has heating holes. Four test fixing frames and four test flying shooting cameras are arranged on the test bench. A test rotating table is arranged in the test fixing frame through a rotating motor. Test placing tables are arranged at both ends of the test rotating table. And a cleaning brush is arranged at one end of the test rotating table. A cleaning telescopic rod is arranged at the other end of the test rotating table. A cleaning needle paper is arranged at the output end of the cleaning telescopic rod. Four test mechanisms are arranged on one side of the test bench. By integrating the feeding mechanism, the collecting mechanism, the magnetic levitation guide rail, the follow-up test head mechanism and the test bench into one body, the situation that traditional feeding, testing and collecting are separate devices and the chips need to be transferred multiple times is changed. The test slider on the magnetic levitation guide rail cooperates with the horizontal and vertical electric cylinder screw rods and the test suction head to achieve precise positioning and testing. The test rotating tables in the four test fixing frames on the test bench have test placing tables at both ends, and can continuously perform chip testing. And the cleaning brush and the cleaning needle paper are equipped to ensure the cleanliness of the test environment. The four test mechanisms cooperate with the follow-up test head mechanism to provide multiple test functions, meet different test requirements of the chips, and effectively improve the test efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0017] Figure 1 It is a schematic external structure diagram of the chip comprehensive testing system based on multi-functional integration of the present invention.

[0018] Figure 2 It is a front view of the internal structure of the chip comprehensive testing system based on multi-functional integration of the present invention.

[0019] Figure 3 It is a schematic internal structure diagram of the feeding mechanism in the chip comprehensive testing system based on multi-functional integration of the present invention.

[0020] Figure 4It is the front view of the wafer cassette, the loading and film expanding table, and the workbench in the chip comprehensive test system based on multi-functional integration of the present invention.

[0021] Figure 5 It is the rear view of the wafer cassette, the loading and film expanding table, and the workbench in the chip comprehensive test system based on multi-functional integration of the present invention.

[0022] Figure 6 It is the front view of the loading and film expanding table in the chip comprehensive test system based on multi-functional integration of the present invention.

[0023] Figure 7 It is the side view of the loading and film expanding table in the chip comprehensive test system based on multi-functional integration of the present invention.

[0024] Figure 8 It is of the present invention Figure 7 The sectional view taken along line A-A.

[0025] Figure 9 It is of the present invention Figure 7 The sectional view taken along line B-B.

[0026] Figure 10 It is the front view of the loading jaw mechanism in the chip comprehensive test system based on multi-functional integration of the present invention.

[0027] Figure 11 It is the rear view of the loading jaw mechanism in the chip comprehensive test system based on multi-functional integration of the present invention.

[0028] Figure 12 It is the sectional view of the ejector pin mechanism in the chip comprehensive test system based on multi-functional integration of the present invention.

[0029] Figure 13 It is of the present invention Figure 12 The partial enlarged view at D.

[0030] Figure 14 It is of the present invention Figure 12 The partial enlarged view at E.

[0031] Figure 15 It is the front view of the pick-up mechanism in the chip comprehensive test system based on multi-functional integration of the present invention.

[0032] Figure 16 It is of the present invention Figure 15 The partial enlarged view at F.

[0033] Figure 17 It is the rear view of the pick-up mechanism in the chip comprehensive test system based on multi-functional integration of the present invention.

[0034] Figure 18It is a schematic structural diagram of the magnetic levitation guide rail, the follow-up test head mechanism, and the test bench in the chip comprehensive test system based on multi-functional integration of the present invention.

[0035] Figure 19 It is a schematic structural diagram of the test fixing frame in the chip comprehensive test system based on multi-functional integration of the present invention.

[0036] Figure 20 It is a schematic structural diagram of the test slide, the horizontal electric cylinder screw rod, and the vertical electric cylinder screw rod in the chip comprehensive test system based on multi-functional integration of the present invention.

[0037] Figure 21 It is a bottom view of the test mechanism in the chip comprehensive test system based on multi-functional integration of the present invention.

[0038] Figure 22 It is a top view of the test mechanism in the chip comprehensive test system based on multi-functional integration of the present invention.

[0039] Figure 23 It is a schematic structural diagram of the follow-up test head mechanism in the chip comprehensive test system based on multi-functional integration of the present invention.

[0040] Figure 24 It is a disassembled schematic diagram of the preheating mechanism in the chip comprehensive test system based on multi-functional integration of the present invention.

[0041] Figure 25 It is a front view of the material receiving mechanism in the chip comprehensive test system based on multi-functional integration of the present invention.

[0042] Figure 26 It is a rear view of the material receiving mechanism in the chip comprehensive test system based on multi-functional integration of the present invention.

[0043] Figure 27 It is a schematic structural diagram of the material receiving electric cylinder screw rod and the material receiving slide in the chip comprehensive test system based on multi-functional integration of the present invention.

[0044] Figure 28 It is a schematic structural diagram of the longitudinal moving mechanism and the material receiving support plate in the chip comprehensive test system based on multi-functional integration of the present invention.

[0045] Figure 29 It is a schematic structural diagram of the material receiving rotating disk in the chip comprehensive test system based on multi-functional integration of the present invention.

[0046] 101 - Wafer cassette, 102 - Loading film expanding table, 103 - Workbench, 104 - Film expanding rotating motor, 105 - Film expanding lifting motor, 106 - Through hole, 107 - Film expanding lifting thread sleeve, 108 - Film expanding lifting screw rod, 109 - Film expanding lifting plate, 110 - Film expanding placement table, 111 - C-shaped card slot, 112 - Synchronous belt, 113 - Synchronous pulley, 114 - Loading bracket, 115 - Loading electric cylinder screw rod, 116 - Loading placement plate, 117 - Loading gripper electric cylinder screw rod, 118 - Loading gripper plate, 119 - Loading gripper mechanism, 120 - Lifting table, 121 - Thimble mechanism, 122 - Y-direction moving mechanism, 123 - X-direction moving mechanism, 124 - Lifting frame, 125 - Loading finger cylinder, 126 - Loading gripper sliding seat, 127 - Loading gripper fixed seat, 128 - Loading gripper fixing plate, 129 - Loading upper gripper, 130 - Loading gripper stopper, 131 - Loading lower gripper, 132 - Loading gripper positioning pin, 133 - Loading gripper micro optical fiber, 134 - Loading gripper photoelectric sensor, 135 - Loading gripper buffer spring, 136 - Support table, 137 - Centering and guiding mechanism, 138 - Thimble rod, 139 - Thimble sleeve, 140 - Thimble support plate, 141 - Thimble electric cylinder screw rod, 142 - Thimble body, 143 - Negative pressure channel, 144 - Negative pressure connection hole, 145 - Negative pressure interface, 146 - Thimble wheel, 147 - Thimble cap, 148 - Thimble hole, 149 - Negative pressure suction hole, 150 - Thimble motor, 151 - Trajectory disc, 152 - Thimble spring, 153 - Material taking electric cylinder screw rod, 154 - Material taking mounting frame, 155 - Material taking fixing plate, 156 - Material taking cylinder, 157 - Material taking negative pressure suction nozzle, 158 - First material taking guide rail, 159 - Second material taking guide rail, 160 - First material taking sliding seat, 161 - Second material taking sliding seat, 162 - Transfer electric cylinder screw rod, 163 - Second middle turntable, 164 - First middle turntable, 201 - Magnetic levitation guide rail, 202 - Follow-up test head mechanism, 203 - Test bench, 204 - Test sliding seat, 205 - Horizontal electric cylinder screw rod, 206 - Vertical plate, 207 - Vertical electric cylinder screw rod, 208 - Test adsorption head, 209 - Preheating plate, 210 - Preheating mechanism, 211 - Heating hole, 212 - Test fixing frame, 213 - Rotating motor, 214 - Test rotating table, 215 - Test placement table, 216 - Cleaning brush, 217 - Cleaning telescopic rod, 218 - Needle cleaning paper, 219 - Test mechanism, 220 - Follow-up test component, 221 - Follow-up electric cylinder screw rod, 222 - Follow-up fixed table, 223 - Follow-up test head, 224 - Ceramic heating ring, 225 - Conduction plate, 226 - Air groove, 227 - Air inlet joint, 228 - Test position, 229 - Test mounting plate, 230 - Test fixing sleeve, 231 - Test needle, 232 - Test slide bar, 233 - Test cross plate, 235 - Test telescopic rod, 236 - Test flying shooting camera, 301 - Unloading guide rail, 302 - Unloading rotating motor, 303 - Unloading table304 - Material Receiving Slide, 305 - Material Receiving Electric Cylinder Screw Rod, 306 - Material Receiving Suction Nozzle, 307 - Material Receiving Rotary Disk, 308 - Material Receiving Seat, 309 - Material Receiving Middle Rotary Disk, 310 - Material Receiving Claw Electric Cylinder Screw Rod, 311 - Material Receiving Claw Plate, 312 - Material Receiving Claw Mechanism, 313 - Material Receiving Transfer Carrier Table, 314 - Longitudinal Moving Mechanism, 315 - Material Receiving Support, 316 - Material Receiving Support Plate, 317 - Material Receiving Film Expanding Table, 318 - Material Receiving Film Expanding Plate, 319 - C-shaped Cavity, 320 - Basket Lifting Electric Cylinder Screw Rod, 321 - Basket Placing Plate, 322 - Wafer Basket, 323 - Transverse Electric Cylinder Screw Rod. Detailed Embodiment

[0047] The embodiments of the present invention will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

[0048] Please refer to Figures 1 to 29 , the present invention provides a chip comprehensive test system based on multi-functional integration, including a feeding mechanism, a material receiving mechanism, a magnetic levitation guide rail 201, a follow-up test head 223 mechanism 202, and a test bench 203. There are five test sliders 204 adapted to the magnetic levitation guide rail 201 provided on the magnetic levitation guide rail 201. A horizontal electric cylinder screw rod 205 is provided on the test slider 204. A vertical plate 206 is provided at the mobile end of the horizontal electric cylinder screw rod 205. A vertical electric cylinder screw rod 207 is provided on one side of the vertical plate 206. A test suction head 208 is provided at the mobile end of the vertical electric cylinder screw rod 207. One end of the vertical plate 206 is provided with a preheating plate 209. A preheating mechanism 210 is provided inside the preheating plate 209. There are heating holes 211 on the preheating plate 209, and the test suction head 208 extends into the heating holes 211. The magnetic levitation guide rail 201 is fixedly connected to the test bench 203 and is located on the other side of the test bench 203. The follow-up test head 223 mechanism 202 is fixedly connected to the test bench 203 and is located on one side of the test bench 203. The feeding mechanism is provided at one end of the corresponding vertical electric cylinder screw rod 207. The material receiving mechanism is provided at one end of the corresponding vertical electric cylinder screw rod 207, and the feeding mechanism and the material receiving mechanism are symmetrically arranged at both ends of the test bench 203.

[0049] Further, four test fixing frames 212 and four test flying shooting cameras 236 are arranged on the test bench 203. A test rotating table 214 is arranged in the test fixing frame 212 through a rotating motor 213. Test placing tables 215 are arranged at both ends of the test rotating table 214. A cleaning brush 216 is arranged at one end of the test rotating table 214, and a cleaning telescopic rod 217 is arranged at the other end of the test rotating table 214. A cleaning needle paper 218 is arranged at the output end of the cleaning telescopic rod 217. Four test mechanisms 219 are arranged on one side of the test bench 203, and the test end of the follow-up test bench 203 is connected to the test end of the corresponding test mechanism 219.

[0050] In this embodiment, by integrating components such as the magnetic levitation guide rail 201, the follow-up test head 223 mechanism 202, and the test bench 203, efficient and accurate testing of the chip is achieved. The test slide 204 on the magnetic levitation guide rail 201 can smoothly and quickly move the test adsorption head 208 between the preheating plate 209 and the test mechanism 219, improving the test efficiency. At the same time, the design of the preheating plate 209 enables the chip to reach the required temperature before testing, thus ensuring the accuracy of the test. In addition, the test rotating table 214 and the cleaning mechanism on the test bench 203 can automatically complete actions such as placing, rotating, and cleaning the chip, further improving the automation degree of the test.

[0051] Further, the follow-up test head 223 mechanism 202 includes a follow-up test component 220, a follow-up electric cylinder screw 221, and a follow-up fixed table 222. The test end of the follow-up test component 220 is provided with a follow-up test head 223. The follow-up test component 220 is fixedly connected to the follow-up electric cylinder screw and is located at the mobile end of the follow-up electric cylinder screw 221. The follow-up electric cylinder screw 221 is fixedly connected to the follow-up fixed table 222 and is located inside the follow-up fixed table 222. The follow-up test component 220 is located above the follow-up fixed table 222. The follow-up fixed table 222 is also fixedly connected to the test bench 203 and is located on one side of the test bench 203.

[0052] In this embodiment, through the cooperation of the follow-up test component 220, the follow-up electric cylinder screw 221, and the follow-up fixed table 222, when a dynamic test is performed on one of the test mechanisms 219 in the device, since some dynamic tests require connecting a rigid board, the follow-up test component 220 can move along with the rigid board, thus providing flexibility.

[0053] Furthermore, the preheating mechanism 210 includes a ceramic heating ring 224 and a conduction plate 225. The upper end surface of the conduction plate 225 has an air groove 226. One end of the air groove 226 is communicatively connected with an air inlet joint 227, and the air inlet joint 227 extends to the preheating plate 209. The other end of the air groove 226 is communicatively connected with a preheating groove. The ceramic heating ring 224 is arranged between the conduction plate 225 and the preheating plate 209, and the ceramic heating ring 224 is powered on for heating. The conduction plate 225 is fixedly connected to the preheating plate 209 and is located below the preheating plate 209.

[0054] In this embodiment, through the cooperation of the ceramic heating ring 224 and the conduction plate 225, uniform heating and rapid temperature rise of the chip are achieved. At the same time, the design of the air groove 226 and the preheating groove enables the gas during the heating process to be discharged smoothly to preheat the chip.

[0055] Furthermore, the loading mechanism includes a material taking mechanism, a wafer cassette 101, a film expanding and loading table 102, and a workbench 103. One side of the film expanding and loading table 102 is provided with a film expanding rotation motor 104 and a film expanding lifting motor 105. The middle of the film expanding and loading table 102 has a through hole 106. A plurality of film expanding lifting screw sleeves 107 are rotatably arranged on the film expanding and loading table 102 through bearings. A film expanding lifting screw 108 is threadedly arranged in the film expanding lifting screw sleeve 107. A film expanding lifting plate 109 is arranged on the plurality of film expanding lifting screws 108. A film expanding placing table 110 is rotatably arranged in the film expanding lifting plate 109. The film expanding placing table 110 has a C-shaped clamping groove 111. A synchronous belt 112 and a synchronous pulley 113 are used for transmission between the output end of the film expanding rotation motor 104 and the film expanding placing table 110, and between the output end of the film expanding lifting motor 105 and the plurality of film expanding lifting screw sleeves 107.

[0056] Further, a loading bracket 114 is provided on one side of the workbench 103. One end of the loading bracket 114 is provided with a loading electric cylinder screw rod 115. The moving end of the loading electric cylinder screw rod 115 is provided with a loading placement plate 116. A loading jaw electric cylinder screw rod 117 is provided on the loading bracket 114. The moving end of the loading jaw electric cylinder screw rod 117 is provided with a loading jaw plate 118. One end of the loading jaw plate 118 is provided with a loading jaw mechanism 119. A lifting platform 120 is provided in the middle of the workbench 103. A thimble mechanism 121 and a Y-direction moving mechanism 122 are provided on the lifting platform 120. An X-direction moving mechanism 123 is provided above the Y-direction moving mechanism 122. The moving end of the X-direction moving mechanism 123 is provided with a lifting frame 124. The wafer cassette 101 is placed on the loading placement plate 116. The loading film expanding platform 102 is fixedly connected to the lifting frame 124 and is located on the lifting frame 124. And the loading jaw mechanism 119 is located above the loading film expanding platform 102. The workbench 103 is arranged at one end of the test bench 203.

[0057] In this embodiment, by the cooperation of the film expanding rotating motor 104 and the film expanding lifting motor 105, the position and angle of the film expanding placement table 110 can be flexibly adjusted to meet the film expanding requirements of different specifications of wafer cassettes 101; the loading bracket 114 on one side of the workbench 103 cooperates with the loading electric cylinder screw rod 115 and the loading jaw electric cylinder screw rod 117, and the positions of the loading placement plate 116 and the loading jaw plate 118 can be accurately controlled, so that the wafer cassette 101 can be accurately placed and the loading jaw mechanism 119 can accurately grasp the chip; the thimble mechanism 121, the Y-direction moving mechanism and the X-direction moving mechanism on the lifting platform 120 cooperate with each other, and the chip can be flexibly moved and positioned in multiple directions, facilitating subsequent test operations, and improving the automation degree and accuracy of chip loading.

[0058] Further, the thimble mechanism 121 includes a thimble rod 138, a thimble sleeve 139, a thimble support plate 140, and a thimble electric cylinder screw 141. A thimble body 142 is provided on the thimble rod 138. A negative pressure channel 143 is provided inside the thimble rod 138. One end of the negative pressure channel 143 communicates with a plurality of negative pressure connection holes 144, and the other end of the negative pressure channel 143 communicates with a negative pressure interface 145. A thimble wheel 146 is provided below the thimble rod 138. A thimble cap 147 is provided above the thimble sleeve 139. The thimble cap 147 has a thimble hole 148 and a plurality of negative pressure suction holes 149, and the negative pressure suction holes 149 communicate with the negative pressure connection holes 144. One end of the thimble support plate 140 is provided with a thimble motor 150. The output end of the thimble motor 150 is provided with a track disk 151. The thimble rod 138 is slidably arranged in the thimble sleeve 139 through a thimble spring 152, and the thimble cap 147 extends above the thimble rod 138. The thimble wheel 146 and the negative pressure interface 145 extend below the thimble rod 138. The thimble sleeve 139 is fixedly connected to the thimble support plate 140 and is located at one end of the thimble support plate 140. The thimble wheel 146 abuts against the track disk 151 and is located on the track disk 151. The thimble support plate 140 is fixedly connected to the thimble electric cylinder screw 141 and is located at the mobile end of the thimble electric cylinder screw 141. The thimble electric cylinder screw 141 is fixedly connected to the lifting table 120 and is located on the lifting table 120.

[0059] In this embodiment, through the cooperation of the negative pressure channel 143, the negative pressure connection holes 144, and the negative pressure suction holes 149, negative pressure can be generated when the thimble body 142 contacts the chip, and the chip can be adsorbed on the thimble cap 147, which is convenient for the thimble body 142 to accurately pick up. The thimble motor 150 drives the thimble wheel 146 to rotate through the track disk 151, and then drives the thimble rod 138 to slide up and down in the thimble sleeve 139, realizing the lifting movement of the thimble body 142. The contact pressure between the chip and the feeding film expanding table 102 or other components can be accurately controlled. The thimble spring 152 plays a buffering role to avoid excessive impact force when the thimble body 142 collides with the chip. The entire thimble mechanism 121 has a simple structure and flexible movement, and can effectively improve the accuracy of chip feeding and positioning.

[0060] Further, the material taking mechanism includes a material taking electric cylinder screw rod, a material taking mounting bracket 154 and a support table 136. A material taking fixing plate 155 is arranged at the movable end of the material taking electric cylinder screw rod. Two material taking air cylinders 156 are arranged on the material taking fixing plate 155. A material taking negative pressure suction nozzle 157 is arranged at the output end of the material taking air cylinder 156. A support table 136 is arranged on the other side of the workbench 103. A first material taking guide rail 158 and a second material taking guide rail 159 are arranged on the support table 136. A first material taking sliding seat 160 is slidably arranged on the first material taking guide rail 158. A first middle turntable 164 is arranged on the first material taking sliding seat 160. A second material taking sliding seat 161 is slidably arranged on the second material taking guide rail 159. A transfer electric cylinder screw rod 162 is arranged on the second material taking sliding seat 161. A second middle turntable 163 is arranged at the movable end of the transfer electric cylinder screw rod 162. The material taking electric cylinder screw rod is fixedly connected to the support table 136 and is located on one side of the support table 136. The material taking mounting bracket 154 is fixedly connected to the support table 136 and is located on the support table 136 and also on the side of the second material taking guide rail 159 away from the first material taking guide rail 158. And the first middle turntable 164 is arranged at one end of the corresponding vertical electric cylinder screw rod 207.

[0061] In this embodiment, by driving the material taking fixing plate 155 to move through the material taking electric cylinder screw rod, cooperating with the two material taking air cylinders 156 and the material taking negative pressure suction nozzle 157, the chip sucking action can be completed flexibly and efficiently, the chip can be positioned from different positions, and the positioning accuracy can be improved. The first material taking guide rail 158, the second material taking guide rail 159 and the corresponding sliding seats and middle turntables on the support table 136 provide a hardware basis for the transfer of the chip at different positions, which helps to realize the automatic operation of chip material taking and improve the material taking efficiency and accuracy.

[0062] Further, the material receiving mechanism includes a material receiving guide rail 301, a material receiving rotating motor 302 and a material receiving table 303. Two material receiving sliding seats 304 are slidably arranged above the material receiving guide rail 301. A transverse electric cylinder screw rod 323 is arranged on each of the two material receiving sliding seats 304. A material receiving electric cylinder screw rod 305 is arranged at the movable end of the transverse electric cylinder screw rod 323. And a material receiving suction nozzle 306 is arranged at the movable end of the material receiving electric cylinder screw rod 305. A material receiving rotating disk 307 is arranged at the output end of the material receiving rotating motor 302. Material receiving seats 308 are arranged at both ends of the material receiving rotating disk 307. A material receiving middle turntable 309 is arranged on the material receiving seat 308. A material receiving clamping jaw electric cylinder screw rod 310 is arranged at one end of the material receiving table 303. A material receiving clamping jaw plate 311 is arranged at the movable end of the material receiving clamping jaw electric cylinder screw rod 310. A material receiving clamping jaw mechanism 312 is arranged at one end of the material receiving clamping jaw plate 311. A material receiving transfer carrier table 313 is arranged at the other end of the material receiving table 303.

[0063] Further, a longitudinal movement mechanism 314 is provided in the middle of the material receiving table 303. A material receiving support 315 is provided at the moving end of the longitudinal movement mechanism 314. A material receiving support plate 316 is provided above the material receiving support 315. A material receiving film expanding table 317 is provided above the material receiving support plate 316. A material receiving film expanding plate 318 is provided inside the material receiving film expanding table 317. Two C-shaped cavities 319 are formed inside the material receiving film expanding plate 318, and vacuum suction heads are provided in the two C-shaped cavities 319. A basket electric cylinder screw 320 is provided on one side of the material receiving table 303. A basket placing plate 321 is provided at the moving end of the basket electric cylinder screw 320. A wafer basket 322 is provided on the basket placing plate 321. The material receiving guide rail 301 is fixedly connected to the material receiving table 303 and is located on the other side of the material receiving table 303. The material receiving rotating motor 302 is provided at the other end of the material receiving table 303. The material receiving table is provided at the other end of the test table, and the corresponding material receiving middle turntable 309 is located at one end of the corresponding vertical electric cylinder screw 207.

[0064] In this embodiment, through the cooperation of the material receiving guide rail 301 and the material receiving sliding seat 304, the lateral electric cylinder screw 323 drives the material receiving electric cylinder screw 305 to drive the material receiving suction nozzle 306 to move flexibly, and can accurately suck chips at different positions. The material receiving rotating motor 302 drives the material receiving rotating disk 307 to rotate, driving the two ends of the material receiving seats 308 to switch between different workstations, improving the material receiving efficiency. The material receiving middle turntable 309 facilitates the transfer of chips. The material receiving jaw electric cylinder screw 310 and the material receiving jaw mechanism 312 cooperate to realize the clamping operation of the chips. The material receiving transfer carrier table 313 can be used for chip transfer. The longitudinal movement mechanism 314 drives the material receiving support 315 and related components to move longitudinally to adapt to the material receiving requirements at different heights. The material receiving film expanding table 317 and the internal vacuum suction heads can position and fix the chip tray. The basket electric cylinder screw 320 and the basket placing plate 321 cooperate to realize the lifting of the wafer basket 322, facilitating the storage and picking of chips. The overall structure realizes the automation and high efficiency of the chip material receiving process.

[0065] Furthermore, the loading gripper mechanism 119 includes a loading finger cylinder 125, a loading gripper sliding seat 126, a loading gripper fixed seat 127, and a loading gripper fixing plate 128. One output end of the loading finger cylinder 125 is provided with an upper loading gripper 129. One end of the upper loading gripper 129 is provided with a loading gripper stopper 130. The other output end of the loading finger cylinder 125 is provided with a lower loading gripper 131. Two loading gripper positioning pins 132 are provided on the lower loading gripper 131, and the two loading gripper positioning pins 132 penetrate through one end of the upper loading gripper 129. A loading gripper micro optical fiber 133 is provided below the lower loading gripper 131. A loading gripper photoelectric sensor 134 and a loading gripper buffer spring 135 are provided below the loading gripper fixing plate 128. The loading finger cylinder 125 is fixedly connected to the loading gripper sliding seat 126 and is located below the loading gripper sliding seat 126. The loading gripper sliding seat 126 is slidably connected to the loading gripper fixed seat 127 and is located below the loading gripper fixed seat 127. The loading gripper fixed seat 127 is fixedly connected to the loading gripper fixing plate 128 and is located below the loading gripper fixing plate 128. The loading gripper buffer spring 135 is connected to one side of the loading gripper sliding seat 126. The loading gripper fixing plate 128 is provided at one end of the loading gripper plate 118. The unloading gripper mechanism 312 has the same structure as the loading gripper mechanism 119.

[0066] In this embodiment, the upper loading gripper 129 and the lower loading gripper 131 are driven by the loading finger cylinder 125 to perform opening and closing actions, so as to grasp chips of different sizes. The loading gripper stopper 130 on the upper loading gripper 129 can prevent the chips from falling. The loading gripper positioning pins 132 on the lower loading gripper 131 can ensure the alignment of the upper loading gripper 129 and the lower loading gripper 131, improving the grasping stability. The loading gripper micro optical fiber 133 can be used to detect whether the chips are grasped in place. The loading gripper photoelectric sensor 134 can further ensure the accuracy of the gripper action. The loading gripper sliding seat 126 is slidably connected to the loading gripper fixed seat 127. Cooperating with the loading gripper buffer spring 135, it can buffer the impact force when the gripper grasps the chips, avoid chip damage, and improve the reliability and stability of the operation of the loading gripper mechanism 119.

[0067] Further, the test mechanism 219 includes a test position 228, a test mounting plate 229, and two test fixing sleeves 230. A plurality of test needles 231 are provided at the test end of the test position 228. Test sliding rods 232 are provided at both ends of the test mounting plate 229. A test cross plate 233 is provided below the two test sliding rods 232. A test telescopic rod 235 is provided below the test cross plate 233. The test position 228 is fixedly connected to the test mounting plate 229, is located above the test mounting plate 229, and the plurality of test needles 231 extend to the lower end surface of the test mounting plate 229. The two test sliding rods 232 are respectively slidably connected to the corresponding test fixing sleeves 230 and are located within the test fixing sleeves 230. The output end of the test telescopic rod 235 is provided on one side of the test bench 203. The follow-up test assembly 220 is fixedly connected to the corresponding test mounting plate 229 and is located outside the test mounting plate 229. The test position 228 is connected to the follow-up test head 223. The two test fixing sleeves 230 are respectively fixedly connected to the test bench 203 and are located on one side of the test bench 203.

[0068] Further, the material taking mechanism is arranged on the support table 136. A centering and guiding mechanism 137 is arranged between the support table 136 and the loading bracket 114, and the centering and guiding mechanism 137 is also located on the other side of the loading film expanding table 102.

[0069] In the present invention, the crystal disk is grabbed into the C-shaped card slot 111 by the loading jaw mechanism 119. Subsequently, the chip in the crystal disk is lifted by the ejector pin mechanism 121. The material taking negative pressure suction nozzle 157 adsorbs and moves the lifted chip into the second middle turntable 163. The second middle turntable 163 moves to the lower part of the test suction head 208 of the first vertical electric cylinder screw rod 207 under the action of the second material taking guide rail 159 and the transfer electric cylinder screw rod 162. At this time, the test suction head 208 adsorbs and moves the chip into the first test fixing frame 212 for testing. Subsequently, after passing through different performance tests of the four test fixing frames 212 in sequence, the test suction head 208 of the last vertical electric cylinder screw rod 207 moves the tested chip into the corresponding receiving rotating disk 307. Subsequently, it is adsorbed and moved onto the receiving transfer carrier table 313 by the receiving suction nozzle 306 of one of the receiving electric cylinder screw rods 305. The receiving suction nozzle 306 of the other receiving electric cylinder screw rod 305 adsorbs and moves the chip on the receiving transfer carrier table 313 into the crystal disk in the C-shaped cavity 319. After the crystal disk is filled with chips, finally, the crystal disk is moved into the wafer basket 322 by the receiving jaw mechanism 312.

[0070] The above-disclosed is only a preferred embodiment of the present invention. Of course, it cannot be used to limit the scope of the rights of the present invention. Those of ordinary skill in the art can understand all or part of the processes of implementing the above embodiments, and the equivalent changes made according to the claims of the present invention still fall within the scope covered by the invention.

Claims

1. A chip comprehensive test system based on multifunctional integration, characterized in that: It includes a feeding mechanism, a receiving mechanism, a magnetic levitation guide rail, a follow-up test head mechanism and a test bench, wherein five test slides adapted to the magnetic levitation guide rail are arranged on the magnetic levitation guide rail, a horizontal electric cylinder screw is arranged on the test slide, a vertical plate is arranged at the movable end of the horizontal electric cylinder screw, a vertical electric cylinder screw is arranged on one side of the vertical plate, a test adsorption head is arranged at the movable end of the vertical electric cylinder screw, a preheating plate is arranged at one end of the vertical plate, a preheating mechanism is arranged in the preheating plate, a heating hole is provided on the preheating plate, and the test adsorption head extends into the heating hole, the magnetic levitation guide rail is fixedly connected to the test bench and is located on the other side of the test bench, the follow-up test head mechanism is fixedly connected to the test bench and is located on one side of the test bench, the feeding mechanism is arranged at one end of the corresponding vertical electric cylinder screw, the receiving mechanism is arranged at one end of the corresponding vertical electric cylinder screw, and the feeding mechanism and the receiving mechanism are symmetrically arranged at both ends of the test bench.

2. The chip comprehensive test system based on multifunctional integration as claimed in claim 1, characterized in that: Four test fixing frames and four test flying cameras are arranged on the test bench, a test rotating table is arranged in the test fixing frame through a rotating motor, test placing tables are arranged at both ends of the test rotating table, a cleaning brush is arranged at one end of the test rotating table, a cleaning telescopic rod is arranged at the other end of the test rotating table, and needle cleaning paper is arranged at the output end of the cleaning telescopic rod, four test mechanisms are arranged on one side of the test bench, and the test end of the follow-up test bench is connected to the corresponding test end of the test mechanism.

3. The chip comprehensive test system based on multifunctional integration as claimed in claim 2, characterized in that: The servo test head mechanism includes a servo test assembly, a servo electric cylinder lead screw and a servo fixed platform. The test end of the servo test assembly is provided with a servo test head. The servo test assembly is fixedly connected to the servo electric cylinder lead screw and is located at the moving end of the servo electric cylinder lead screw. The servo electric cylinder lead screw is fixedly connected to the servo fixed platform and is located inside the servo fixed platform. The servo test assembly is located above the servo fixed platform. The servo fixed platform is also fixedly connected to the test platform and is located on one side of the test platform.

4. The chip comprehensive test system based on multifunctional integration as claimed in claim 3, characterized in that: The preheating mechanism includes a ceramic heating ring and a conduction plate, the upper end surface of the conduction plate is provided with an air groove, one end of the air groove is connected to an air inlet joint, and the air inlet joint extends to the preheating plate, the other end of the air groove is connected to a preheating groove, the ceramic heating ring is arranged between the conduction plate and the preheating plate, and the ceramic heating ring is electrically heated, the conduction plate is fixedly connected to the preheating plate, and is located below the preheating plate.

5. The chip comprehensive test system based on multifunctional integration as claimed in claim 4, characterized in that: The feeding mechanism includes a material taking mechanism, a wafer cassette, a film expanding and feeding table, and a workbench. A film expanding rotary motor and a film expanding lifting motor are arranged on one side of the film expanding and feeding table. The middle of the film expanding and feeding table has a through hole. A plurality of film expanding lifting screw sleeves are rotatably arranged on the film expanding and feeding table through bearings. A film expanding lifting screw is arranged in the internal thread of the film expanding lifting screw sleeve. A film expanding lifting plate is arranged on the plurality of film expanding lifting screws. A film expanding placing table is rotatably arranged in the film expanding lifting plate. The film expanding placing table has a C-shaped clamping groove. The output end of the film expanding rotary motor and the film expanding placing table, and the output end of the film expanding lifting motor and the plurality of film expanding lifting screw sleeves are all driven by a synchronous belt and a synchronous pulley.

6. The integrated multifunctional chip comprehensive testing system according to claim 5, wherein A feeding support is arranged on one side of the workbench. A feeding electric cylinder screw rod is arranged at one end of the feeding support. A feeding placing plate is arranged at the moving end of the feeding electric cylinder screw rod. A feeding clamping jaw electric cylinder screw rod is arranged on the feeding support. A feeding clamping jaw plate is arranged at the moving end of the feeding clamping jaw electric cylinder screw rod. A feeding clamping jaw mechanism is arranged at one end of the feeding clamping jaw plate. A lifting table is arranged in the middle of the workbench. A thimble mechanism and a Y-direction moving mechanism are arranged on the lifting table. An X-direction moving mechanism is arranged above the Y-direction moving mechanism. A lifting frame is arranged at the moving end of the X-direction moving mechanism. The wafer cassette is placed on the feeding placing plate. The film expanding and feeding table is fixedly connected to the lifting frame and is located on the lifting frame. And the feeding clamping jaw mechanism is located above the film expanding and feeding table. The workbench is arranged at one end of the testing table.

7. The integrated multifunctional chip comprehensive testing system according to claim 6, wherein The thimble mechanism includes a thimble rod, a thimble sleeve, a thimble support plate, and a thimble electric cylinder screw rod. A thimble body is arranged on the thimble rod. A negative pressure channel is arranged in the thimble rod. One end of the negative pressure channel communicates with a plurality of negative pressure connection holes. The other end of the negative pressure channel communicates with a negative pressure interface. A thimble wheel is arranged below the thimble rod. A thimble cap is arranged above the thimble sleeve. The thimble cap has a thimble hole and a plurality of negative pressure suction holes. And the negative pressure suction holes are communicated with the negative pressure connection holes. A thimble motor is arranged at one end of the thimble support plate. A track disk is arranged at the output end of the thimble motor. The thimble rod is slidably arranged in the thimble sleeve through a thimble spring. And the thimble cap extends above the thimble rod. The thimble wheel and the negative pressure interface extend below the thimble rod. The thimble sleeve is fixedly connected to the thimble support plate and is located at one end of the thimble support plate. And the thimble wheel abuts against the track disk and is located on the track disk. The thimble support plate is fixedly connected to the thimble electric cylinder screw rod and is located at the moving end of the thimble electric cylinder screw rod. The thimble electric cylinder screw rod is fixedly connected to the lifting table and is located on the lifting table.

8. The integrated chip comprehensive test system based on multi-function integration according to claim 7, characterized in that the material taking mechanism includes a material taking electric cylinder screw rod and a material taking mounting frame. A material taking fixing plate is arranged at the moving end of the material taking electric cylinder screw rod. Two material taking air cylinders are arranged on the material taking fixing plate. A material taking negative pressure suction nozzle is arranged at the output end of the material taking air cylinder. A support table is arranged on the other side of the workbench. A first material taking guide rail and a second material taking guide rail are arranged on the support table. A first material taking sliding seat is slidably arranged on the first material taking guide rail. A first middle turntable is arranged on the first material taking sliding seat. A second material taking sliding seat is slidably arranged on the second material taking guide rail. A transfer electric cylinder screw rod is arranged on the second material taking sliding seat. A second middle turntable is arranged at the moving end of the transfer electric cylinder screw rod. The material taking electric cylinder screw rod is fixedly connected to the support table and is located on one side of the support table. The material taking mounting frame is fixedly connected to the support table and is located on the support table and also on the side of the second material taking guide rail away from the first material taking guide rail, and the first middle turntable is arranged at one end of the corresponding vertical electric cylinder screw rod.

9. The integrated chip comprehensive test system based on multi-function integration according to claim 8, characterized in that the material receiving mechanism includes a material receiving guide rail, a material receiving rotating motor and a material receiving table. Two material receiving sliding seats are slidably arranged above the material receiving guide rail. A transverse electric cylinder screw rod is arranged on each of the two material receiving sliding seats. A material receiving electric cylinder screw rod is arranged at the moving end of the transverse electric cylinder screw rod, and a material receiving suction nozzle is arranged at the moving end of the material receiving electric cylinder screw rod. A material receiving rotating disc is arranged at the output end of the material receiving rotating motor. Material receiving seats are arranged at both ends of the material receiving rotating disc. A material receiving middle turntable is arranged on the material receiving seat. A material receiving clamping jaw electric cylinder screw rod is arranged at one end of the material receiving table. A material receiving clamping jaw plate is arranged at the moving end of the material receiving clamping jaw electric cylinder screw rod. A material receiving clamping jaw mechanism is arranged at one end of the material receiving clamping jaw plate. A material receiving transfer carrier table is arranged at the other end of the material receiving table.

10. The integrated chip comprehensive test system based on multi-function integration according to claim 9, characterized in that a longitudinal moving mechanism is arranged in the middle of the material receiving table. A material receiving support is arranged at the moving end of the longitudinal moving mechanism. A material receiving support plate is arranged above the material receiving support. A material receiving film expanding table is arranged above the material receiving support plate. A material receiving film expanding plate is arranged in the material receiving film expanding table. Two C-shaped cavities are arranged in the material receiving film expanding plate, and vacuum suction heads are arranged in the two C-shaped cavities. A basket lifting electric cylinder screw rod is arranged on one side of the material receiving table. A basket placing plate is arranged at the moving end of the basket lifting electric cylinder screw rod. A wafer basket is arranged on the basket placing plate. The material receiving guide rail is fixedly connected to the material receiving table and is located on the other side of the material receiving table. The material receiving rotating motor is arranged at the other end of the material receiving table. The material receiving table is arranged at the other end of the test table, and the corresponding material receiving middle turntable is located at one end of the corresponding vertical electric cylinder screw rod.

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