Probe card and probe

Abstract

The invention provides a probe card and a probe, which can preheat the probe card while keeping the interval between the probe card and the top of a suction cup fixed. The probe includes a plurality of inspection chambers, each of the plurality of inspection chambers including a probe card, a suction cup top, and a temperature adjustment portion. The probe card has a plurality of probes. A wafer can be placed on the top of the sucker. The temperature adjusting part adjusts the temperature of the top of the sucker. And at least one of the probe card and the suction cup top includes a gap adjustment member that maintains a gap between the probe card and the suction cup top to be fixed. The probe preheats the probe card by means of the heat of the chuck top, the temperature of which is adjusted by the temperature adjustment unit, in a state in which the wafer is not placed on the chuck top and in a state in which the probe card and the chuck top are in contact with each other with the space adjustment member therebetween.

Description

[0001] This application is a divisional application of the application with the application date of June 18, 2020, application number 202010560918.7, and invention title "Preheating Method of Detector and Probe Card". Technical Field

[0002] The present disclosure relates to a preheating method of a detector and a probe card. Background Art

[0003] As an example of an inspection device for inspecting a wafer on which a plurality of semiconductor devices are formed, a detector can be cited. The detector includes a probe card having a plurality of probes as columnar contact terminals. The detector abuts the wafer against the probe card, so that each probe contacts an electrode pad or a solder bump of a semiconductor device. The detector causes current to flow from each probe to the circuit of the semiconductor device connected to each electrode pad and each solder bump, thereby inspecting the conduction state and the like of the circuit.

[0004] Prior Art Documents

[0005] Patent Documents

[0006] Patent Document 1: Japanese Patent Application Laid-Open No. 2017-069428 Summary of the Invention

[0007] Problems to be Solved by the Invention

[0008] The present disclosure provides a preheating method of a detector and a probe card, which can preheat the probe card while keeping the interval between the probe card and the top of the chuck fixed.

[0009] Solutions to Solve the Problems

[0010] A detector according to one technical solution of the present disclosure includes a plurality of inspection chambers. Each of the plurality of inspection chambers includes a probe card, a top of a chuck, and a temperature adjustment unit. The probe card has a plurality of probes. The top of the chuck can carry a wafer. The temperature adjustment unit adjusts the temperature of the top of the chuck. In addition, at least one of the probe card and the top of the chuck includes a gap adjustment member that keeps the gap between the probe card and the top of the chuck fixed. In a state where no wafer is placed on the top of the chuck and in a state where the probe card and the top of the chuck are in contact with each other through the gap adjustment member, the detector preheats the probe card by the heat of the top of the chuck whose temperature has been adjusted by the temperature adjustment unit.

[0011] A probe card according to another technical solution of the present disclosure has a plurality of probes, and a gap adjustment member is provided on a surface having the plurality of probes.

[0012] Another technical solution of the present disclosure is a detector including the above-mentioned probe card.

[0013] Effect of the Invention

[0014] By adopting the present disclosure, the interval between the probe card and the top of the chuck can be kept fixed to preheat the probe card. Description of the Drawings

[0015] Figure 1 FIG. is an example of a detector showing a first embodiment of the present disclosure.

[0016] Figure 2 is along Figure 1 Cross-sectional view taken along line II-II of

[0017] Figure 3 FIG. is an example of the structure of the detector in a state where no wafer is placed on the top of the chuck in the first embodiment.

[0018] Figure 4 FIG. is an example of the structure of the detector in a state where a wafer is placed on the top of the chuck in the first embodiment.

[0019] Figure 5 FIG. is an example of a flowchart of a method for preheating the probe card in the first embodiment.

[0020] Figure 6 FIG. is an example of the structure of the interval adjusting member.

[0021] Figure 7 FIG. is an example of the structure of the interval adjusting member.

[0022] Figure 8 FIG. is an example of the structure of the interval adjusting member.

[0023] Figure 9 FIG. is an example of a cross-section of the structure of the interval adjusting member.

[0024] Figure 10 FIG. is an example of a cross-section of the structure of the interval adjusting member.

[0025] Figure 11 FIG. is an example of the structure of the detector in a state where no wafer is placed on the top of the chuck in the second embodiment.

[0026] Figure 12 FIG. is an example of the structure of the detector in a state where a wafer is placed on the top of the chuck in the second embodiment. Detailed Description of the Invention

[0027] Hereinafter, embodiments of a detector and a method for preheating a probe card according to the present disclosure will be described in detail with reference to the drawings. It should be noted that the following embodiments are not intended to limit the disclosed technology.

[0028] In recent years, in order to improve the inspection efficiency of wafers, a detector has been developed which includes a plurality of inspection chambers and is capable of inspecting semiconductor devices of wafers in other inspection chambers while the wafers are being conveyed to one inspection chamber by means of a conveying device. In the case of this detector, when bringing the wafer into contact with the probe card, the wafer is placed on top of the chuck, and the space between the probe card and the top of the chuck is evacuated to a vacuum so that the wafer abuts against the probe card. Here, when bringing the wafer into contact with the probe card, the top of the chuck is placed on the stage, and the stage moves the top of the chuck toward the probe card. After that, the top of the chuck is attracted toward the probe card and separated from the stage.

[0029] However, in recent years, the inspection conditions during wafer inspection have become complicated. In particular, inspections are frequently carried out in high-temperature environments and low-temperature environments. In this case, before inspecting the wafer, it is desirable to preheat the probe card to the temperature at which the inspection is to be carried out. The preheating of the probe card is performed, for example, by using radiant heat from the top of the chuck, so the positional relationship between the probe card and the top of the chuck becomes important. Therefore, it is expected that the probe card is preheated while maintaining a fixed interval between the probe card and the top of the chuck.

[0030] [Structure of the detector]

[0031] Figure 1 is a diagram showing an example of the detector according to the first embodiment of the present disclosure. In addition, Figure 2 is a cross-sectional view taken along line II-II of Figure 1 . Figure 1 and Figure 2 The detector 10 shown has: an inspection area 12 which inspects the electrical characteristics of each semiconductor device of the wafer W; a housing area 13 which houses the wafer W; and a conveyance area 14 which is provided between the inspection area 12 and the housing area 13.

[0032] A plurality of testers 15 as wafer inspection interfaces are arranged in the inspection area 12, and a plurality of inspection chambers 12a corresponding to the respective testers 15 are provided in the inspection area 12. Specifically, the inspection area 12 has a three-layer structure of a tester row composed of a plurality of testers arranged horizontally, and one tester-side camera 16 is respectively arranged corresponding to each tester row. Each tester-side camera 16 can move horizontally along the corresponding tester row, is located in front of each tester 15, and confirms the position of the wafer W and the like and the degree of inclination of the top of the chuck 29.

[0033] The accommodation area 13 is divided into a plurality of accommodation spaces 17. In each accommodation space 17, an entrance 17a, an aligner 17b, a loader 17c, and a controller 17d are arranged. The entrance 17a receives a FOUP (Front Opening Unified Pod), which is a container for accommodating a plurality of wafers. The aligner 17b performs wafer alignment. The loader 17c sends in and out a probe card 19. The controller 17d controls the operations of the respective components.

[0034] The transfer area 14 is provided with a transfer device 18 that can move freely between the inspection area 12 and the accommodation area 13. The transfer device 18 takes out the wafer W from the entrance 17a and transports it to each inspection chamber 12a, and transports the wafer W whose electrical characteristics inspection of semiconductor devices has been completed from each inspection chamber 12a to the entrance 17a.

[0035] When the transfer device 18 transports a wafer W between an inspection chamber 12a and the entrance 17a, other inspection chambers 12a can perform the electrical characteristics inspection of other semiconductor devices of other wafers W, so the inspection efficiency of the wafers can be improved.

[0036] Figure 3 It is a diagram showing an example of the structure of the detector in the state where no wafer is placed on the top of the chuck in the first embodiment. Among them, Figure 3 It shows the state where no wafer W is placed to preheat the probe card 19. That is, Figure 3 It shows the state where the top 29 of the chuck abuts against the gap adjusting member 70 provided on the probe card 19, Figure 3 The structure of the inspection chamber 12a is mainly shown by a cross-sectional view. In addition, Figure 4 It is a diagram showing an example of the structure of the detector in the state where a wafer is placed on the top of the chuck in the first embodiment. That is, Figure 4 It shows the state where the wafer W abuts against the probe card 19, Figure 4 The structure of the inspection chamber 12a is mainly shown by a cross-sectional view.

[0037] In Figure 3 and Figure 4 The tester 15 is arranged on the spring bracket 20, and the spring bracket 20 is fixed to the device bracket (not shown). The probe card 19 is assembled at the lower part of the spring bracket 20. The flange 22 is configured to surround the probe card 19.

[0038] The probe card 19 has: a disk-shaped main body 24; a plurality of electrodes (not shown), which are arranged on substantially one plane of the upper surface of the main body 24; and a plurality of probes 25, which are arranged to protrude downward from the lower surface of the main body 24. Each electrode is connected to a corresponding probe 25. When the wafer W abuts against the probe card 19, each probe 25 contacts the electrode pads and solder bumps of each semiconductor device formed on the wafer W.

[0039] In addition, the probe card 19 has a gap adjustment member 70 that maintains a fixed gap between the probe card 19 and the top 29 of the chuck when the wafer W is not placed on the top 29 of the chuck. The gap adjustment member 70 is, for example, in the shape of a pin and is made of stainless steel, aluminum, or copper, and three or more are provided on the lower surface of the probe card 19. Among them, the gap adjustment member 70 can also be, for example, a resin such as a material called PEEK (Poly Ether Ether Ketone), other materials, alloys, etc. The length relationship of the gap adjustment member 70 is longer than the probe 25 and shorter than the gap between the lower surface of the main body 24 of the probe card 19 and the upper surface of the top 29 of the chuck in a state where the probe 25 is in contact with the wafer W when the wafer W is placed on the top 29 of the chuck.

[0040] That is, as Figure 3 shown, in a state where the wafer W is not placed, the gap adjustment member 70 abuts against the top 29 of the chuck. On the other hand, as Figure 4 shown, in a state where the wafer W is placed on the top 29 of the chuck, the gap adjustment member 70 is in a state where a gap is left between the gap adjustment member 70 and the top 29 of the chuck. In other words, in a state where the wafer W is not placed on the top 29 of the chuck, the probe 25 does not contact the top 29 of the chuck, and in a state where the wafer W is placed on the top 29 of the chuck, the probe 25 contacts the wafer W.

[0041] The spring holder 20 has: a main body 26, which is substantially flat; and a plurality of spring pin socket insertion holes 27, which are a plurality of through holes penetrating through the vicinity of the central portion of the main body 26, and a spring pin socket 28 formed by arranging a plurality of spring pins is fitted and inserted into each spring pin socket insertion hole 27. The spring pin socket 28 is connected to an inspection circuit (not shown) of the tester 15 and contacts a plurality of electrodes on the upper surface of the main body 24 of the probe card 19 assembled to the spring holder 20. The spring pin socket 28 causes current to flow to each probe 25 of the probe card 19 connected to the electrode, and causes the current flowing from the circuits of the respective semiconductor devices of the wafer W through each probe 25 to flow toward the inspection circuit.

[0042] The flange 22 has an upper flange 22a and a lower flange 22b. In addition, the flange 22 has a cylindrical bellows 23 between the upper flange 22a and the lower flange 22b. The upper flange 22a is engaged with the spring holder 20 and sealed using a sealant or the like. The lower flange 22b is movable relative to the spring holder 20 in the vertical direction.

[0043] Before the lower flange 22b abuts against the top 29 of the suction cup, under the action of its own weight, it moves downward so that the lower surface of the lower flange 22b is positioned below the tip of each probe 25 of the probe card 19. The bellows 23 is a corrugated structure made of metal and is configured to be telescopically movable in the vertical direction. The lower end of the bellows 23 is in close contact with the upper surface of the lower flange 22b, and the upper end of the bellows 23 is in close contact with the lower surface of the upper flange 22a.

[0044] The space between the spring holder 20 and the base 21 of the tester 15 is sealed by a sealing member 30, and this space is evacuated to a vacuum so that the base 21 is assembled to the spring holder 20. The space between the spring holder 20 and the probe card 19 is also sealed by a sealing member 31, and this space is evacuated to a vacuum so that the probe card 19 is assembled to the spring holder 20.

[0045] The transfer device 18 has an aligner 32. The top 29 of the suction cup is placed on the aligner 32, and the wafer W is placed on the upper surface of the top 29 of the suction cup. Among them, in Figure 3 , the wafer W is not placed, and the placement position is indicated by a dotted line. The top 29 of the suction cup is vacuum adsorbed to the aligner 32, and the wafer W is vacuum adsorbed to the top 29 of the suction cup. Therefore, it is possible to prevent the wafer W from relatively moving with respect to the transfer device 18 when the transfer device 18 moves. Among them, the holding method of the top 29 of the suction cup and the wafer W is not limited to vacuum adsorption, and any method that can prevent the relative movement of the top 29 of the suction cup and the wafer W with respect to the aligner 32 is acceptable. For example, it can also be electromagnetic adsorption or holding by a jig. Among them, a step 29a is formed at the peripheral portion of the upper surface of the top 29 of the suction cup, and a sealing member 33 is disposed on the step 29a.

[0046] In addition, the top 29 of the suction cup is provided with a flow path 50 and a heater 51 inside. Refrigerant is supplied from a cooling unit (not shown) to the flow path 50. After the refrigerant supplied to the flow path 50 flows in the flow path 50, it returns to the cooling unit. The heater 51 is connected to a heater power supply (not shown), and this heater power supply supplies power to the heater 51 to heat the top 29 of the suction cup. The temperature of the top 29 of the suction cup is adjusted by the cooling achieved by the refrigerant circulating in the flow path 50 and the heating achieved by the heater 51.

[0047] The transfer device 18 can move downward below the probe card 19 in the inspection chamber 12a to oppose the wafer W placed on the top 29 of the suction cup to the probe card 19, and can move the wafer W toward the probe card 19. The space S is when the spacer 70 abuts against the placement surface of the top 29 of the suction cup ( Figure 3 ), or when the top 29 of the suction cup abuts against the lower flange 22b and the wafer W abuts against the probe card 19 ( Figure 4)The formed space. The space S is sealed by the bellows 23 and the sealing member 33. In the space S, the space S is evacuated through the vacuum pipe 26a, so that the top of the chuck 29 is held on the side of the probe card 19. Herein, the holding method of the top of the chuck 29 is not limited to vacuum adsorption, as long as it is a method capable of forming the space S. For example, it can also be electromagnetic adsorption or holding by a jig. Among them, the movement of the conveying device 18 is controlled by the controller 17d, and the controller 17d grasps the position and movement amount of the conveying device 18.

[0048] The aligner 32 adjusts the relative position and inclination of the top of the chuck 29 with respect to the probe card 19. Temperature adjustment parts such as the flow path 50 and the heater 51 are used to achieve inspections in high-temperature environments and low-temperature environments. Therefore, the aligner 32 performs adjustments of the position and inclination accompanied by the deformation of the probe card 19 and the top of the chuck 29 due to the heat release from the heater 51 and the heat absorption to the flow path 50 during inspections in high-temperature environments and low-temperature environments. Among them, for the temperature range of the top of the chuck 29, for example, a range of 130°C to -30°C can be cited.

[0049] The aligner 32 has a base corresponding to each of the X, Y, and Z directions and guide members in the form of rails. Each base can move along each guide member. A substantially disc-shaped chuck base is provided on the Z slider provided on the Z base. The chuck base has a chuck top adsorption surface on the upper surface, and the top of the chuck 29 is vacuum-adsorbed on the chuck top adsorption surface. Thus, the top of the chuck 29 is placed and assembled on the aligner 32. At this time, positioning pins, positioning blocks, etc. are used to specify the position of the top of the chuck 29 relative to the chuck base.

[0050] In addition, the aligner 32 has an upper confirmation camera for confirming the degree of inclination of the probe card 19 and the socket 20. In addition, the aligner 32 can use an actuator to lift and lower the chuck base to adjust the inclination of the placed top of the chuck 29.

[0051] [Preheating method of probe card]

[0052] Next, the preheating method of the probe card of the first embodiment will be described. Figure 5 It is a flowchart showing an example of the preheating method of the probe card of the first embodiment.

[0053] The probe card 19 is conveyed from the loader 17c to the inspection chamber 12a where the probe card is to be preheated by using the conveying device 18. The probe card 19 is vacuum-adsorbed from the conveying device 18 to the socket 20 (step S1).

[0054] Next, the transfer device 18 is used to transfer the chuck top 29 to the probe card 19 to be preheated. At this time, the chuck top 29 is in a state where no wafer is placed. The transfer device 18 is used to transfer the chuck top 29 to the lower part of the probe card 19. The chuck top 29 is raised so that the chuck top 29 abuts against the gap adjusting member 70 of the probe card 19. Then, the chuck top 29 is vacuum adsorbed to the probe card 19 side (step S2). At this time, the gap between the chuck top 29 and the probe card 19 is kept fixed by the gap adjusting member 70.

[0055] The transfer device 18 is retracted from the inspection chamber 12a, and a cooling unit and a heater power supply (not shown) connected to the flow path 50 and the heater 51 are controlled to start preheating the probe card (step S3).

[0056] When the preheating of the probe card is completed, the transfer device 18 is used to transfer the chuck top 29 from the inspection chamber 12a, and the wafer W is placed on the chuck top 29. The chuck top 29 on which the wafer W is placed is transferred to the inspection chamber 12a, and the wafer W and the chuck top 29 are vacuum adsorbed to the socket 20 (step S4). The wafer W is inspected (step S5), and after the inspection is completed, the transfer device 18 is used to transfer the wafer W to, for example, the inlet 17a.

[0057] In this way, the interval between the probe card 19 and the chuck top 29 can be kept fixed to preheat the probe card 19. In addition, since the interval between the probe card 19 and the chuck top 29 is kept fixed, the preheating time of the probe card can be stably performed in any inspection chamber 12a.

[0058] [Modification example of the gap adjusting member]

[0059] Next, a modification example of the gap adjusting member 70 will be described. Figures 6 to 8 It is a diagram showing an example of the structure of the gap adjusting member. Figure 9 And Figure 10 It is a diagram showing an example of the cross section of the structure of the gap adjusting member. As Figures 6 to 8 shown, the gap adjusting members 70a to 70c are arranged from the lower surface of the main body 24 of the probe card 19 toward the front side in the drawing. In Figure 9 And Figure 10 In the case of the cross section of the probe card 19 shown, the gap adjusting members 70a to 70c are arranged from the lower surface of the main body 24 toward the lower side in the drawing. Figure 6 The gap adjusting member 70a shown is an example of the case where it is arranged in a circular ring shape on the outer peripheral side of the probe card 19. Figure 7 The gap adjusting member 70b shown is an example of the case where three arc-shaped gap adjusting members 70b are arranged on the outer peripheral side of the probe card 19. Figure 8The illustrated spacer adjustment member 70c is an example of a case where two linear spacer adjustment members 70c are arranged at positions symmetric with respect to the center axis of the probe card 19.

[0060] Figure 9 The cross-section showing the spacer adjustment member has a linear shape. Additionally, Figure 10 The cross-section showing the spacer adjustment member has an inverted T shape. Among them, as a modified example of the spacer adjustment member 70, it is not limited to the spacer adjustment members 70a to 70c, and other shapes and arrangements may also be possible.

[0061] [Second Embodiment of the Structure of the Probe]

[0062] In the case of the first embodiment, the spacer adjustment member 70 provided on the probe card 19 is used to keep the distance between the chuck top 29 and the probe card 19 fixed. However, the spacer adjustment member may be provided on the socket, and the implementation form in this case will be described as the second embodiment. Among them, the same reference numerals are used for the same structures as those in the first embodiment, and the description of the repeated structures and operations is omitted.

[0063] Compared with the first embodiment, the second embodiment has a socket 80 and a chuck top 89 to replace the socket 20 and the chuck top 29. Figure 11 It is a diagram showing an example of the structure of the probe in the state where no wafer is placed on the chuck top in the second embodiment. Among them, Figure 11 It shows the state where the wafer W is not placed to preheat the probe card 19. Additionally, Figure 12 It is a diagram showing an example of the structure of the probe in the state where a wafer is placed on the chuck top in the second embodiment.

[0064] As shown in Figure 11 and Figure 12 the socket 80 has: a main body 86, which is substantially flat; and a plurality of spring pin socket insertion holes 87, which are a plurality of through holes penetrating through the vicinity of the central portion of the main body 86. A spring pin socket 28 formed by arranging a plurality of spring pins is fitted and inserted into each spring pin socket insertion hole 87. Additionally, the socket 80 has a spacer adjustment member 82 for keeping the distance between the chuck top 89 and the probe card 19 fixed. Further, the socket 80 has: a vacuum pipe 86a for evacuating the space S to a vacuum; and an air pipe 86b for fixing the spacer adjustment member 82.

[0065] The interval adjustment member 82 can move up and down freely and is fixed at an arbitrary position by the pressure of the air duct 86b. In addition to the interval adjustment member 82, the interval adjustment unit 81 further includes a distance sensor 83 that measures the distance between the spring holder 80 and the top of the suction cup 89. The distance sensor 83 is a non-contact sensor such as an eddy current type sensor.

[0066] When the top of the suction cup 89 is vacuum adsorbed to the spring holder 80, based on the distance measured by the distance sensor 83, the interval adjustment member 82 is fixed at a predetermined distance. Among them, for the interval adjustment member 82, each distance sensor 83 can be used to fix the plurality of interval adjustment members 82 one by one. In addition, the interval adjustment member 82 is fixed at a distance (position) where the probe 25 does not contact the upper surface of the top of the suction cup 89 when the wafer W is not placed on the top of the suction cup 89 ( Figure 11 ). On the other hand, the interval adjustment member 82 is fixed at a distance (position) where the wafer W contacts the probe 25 when the wafer W is placed on the top of the suction cup 89 ( Figure 12 ).

[0067] The top of the suction cup 89 is vacuum adsorbed to the aligner 32, and the wafer W is vacuum adsorbed to the top of the suction cup 89. A groove 89a is formed at the peripheral edge of the upper surface of the top of the suction cup 89, and a sealing member 33 is disposed in the groove 89a. In addition, the height of the outermost peripheral portion 89b of the top of the suction cup 89 is the same as the height of the adsorption surface for adsorbing the wafer W, and the outermost peripheral portion 89b abuts against the interval adjustment member 82.

[0068] The space S is formed when the interval adjustment member 82 abuts against the outermost peripheral portion 89b of the top of the suction cup 89 to reach a set distance ( Figure 11 ), or when the top of the suction cup 89 abuts against the lower flange 22b and the wafer W abuts against the probe card 19 ( Figure 12 ). The space S is sealed by the bellows 23 and the sealing member 33. For the space S, the space S is evacuated to a vacuum, thereby holding the top of the suction cup 89 on the side of the probe card 19.

[0069] In this way, in the case of the second embodiment, the probe card 19 and the top of the suction cup 89 can be held parallel to preheat the probe card 19. In addition, the position of the top of the suction cup 89 during preheating the probe card 19 can be specified.

[0070] As described above, according to the first embodiment, the prober 10 includes a plurality of inspection chambers 12a, wherein each of the plurality of inspection chambers includes a probe card 19, a suction cup top 29, and a temperature adjustment unit. The probe card 19 includes a plurality of probes 25. The suction cup top 29 can carry a wafer W. The temperature adjustment unit adjusts the temperature of the suction cup top 29. In addition, at least one of the probe card 19 and the suction cup top 29 includes a spacing adjustment member 70 that keeps the spacing between the probe card 19 and the suction cup top 29 fixed. In a state where the suction cup top 29 does not carry a wafer W, and in a state where the probe card 19 and the suction cup top 29 are in contact with each other via the spacing adjustment member 70, the prober 10 preheats the probe card 19 by means of the heat of the suction cup top 29 whose temperature has been adjusted by the temperature adjustment unit. As a result, the probe card 19 can be preheated.

[0071] According to the second embodiment, the prober 10 includes a plurality of inspection chambers 12a, wherein each of the plurality of inspection chambers 12a includes a probe card 19, a suction cup top 89, a spring holder 80, and a temperature adjustment unit. The probe card 19 includes a plurality of probes 25. The suction cup top 89 can be loaded with a wafer W. The spring holder 80 supports the probe card 19. The temperature adjustment unit adjusts the temperature of the suction cup top 89. In addition, the spring holder 80 includes a spacing adjustment member 82 that keeps the spacing between the probe card 19 and the suction cup top 89 fixed. In a state where the suction cup top 89 does not load the wafer W, and in a state where the spring holder 80 and the suction cup top 89 are in contact with each other via the spacing adjustment member 82, the prober 10 preheats the probe card 19 by means of the heat of the suction cup top 89 whose temperature has been adjusted by the temperature adjustment unit. As a result, the probe card 19 can be preheated while the probe card 19 and the suction cup top 89 are kept parallel.

[0072] It should be noted that all aspects of the embodiments disclosed herein are examples and are not intended to limit the present invention. The embodiments described above may be omitted, replaced, or modified in various forms without departing from the claims and the gist thereof.

Claims

1. A probe card having a plurality of probes, wherein, the probe card is provided with a spacing adjustment member on the surface having the plurality of probes.

2. The probe card according to claim 1, wherein, the spacing adjustment member is in the shape of a pin, a ring, an arc or a straight line.

3. The probe card according to claim 1 or 2, wherein, the spacing adjustment member is a resin of polyether ether ketone material, other materials, or an alloy.

4. A detector comprising the probe card according to claim 1.

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