Preheating method of detector and probe card

Abstract

The invention provides a probe and a preheating method of a probe card, which can preheat the probe card while keeping the interval between the probe card and the top of a suction cup fixed. The probe includes a plurality of inspection chambers, each of the plurality of inspection chambers including a probe card, a suction cup top, and a temperature adjustment portion. The probe card has a plurality of probes. A wafer can be placed on the top of the sucker. The temperature adjusting part adjusts the temperature of the top of the sucker. And at least one of the probe card and the suction cup top includes a gap adjustment member that maintains a gap between the probe card and the suction cup top to be fixed. The probe preheats the probe card by means of the heat of the chuck top, the temperature of which is adjusted by the temperature adjustment unit, in a state in which the wafer is not placed on the chuck top and in a state in which the probe card and the chuck top are in contact with each other with the space adjustment member therebetween.

Description

[0001] This application is a divisional application of the application with the application date of June 18, 2020, application number 202010560918.7, and invention name "Preheating Method of Detector and Probe Card". Technical Field

[0002] The present disclosure relates to a preheating method of a detector and a probe card. Background Art

[0003] As an example of an inspection device for inspecting a wafer on which a plurality of semiconductor devices are formed, a detector can be cited. The detector includes a probe card having a plurality of probes as columnar contact terminals. The detector abuts the wafer against the probe card so that each probe contacts an electrode pad or a solder bump of a semiconductor device. The detector causes current to flow from each probe to the circuit of the semiconductor device connected to each electrode pad and each solder bump, thereby inspecting the conduction state and the like of the circuit.

[0004] Prior Art Documents

[0005] Patent Documents

[0006] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2017-069428 Summary of the Invention

[0007] Problems to be Solved by the Invention

[0008] The present disclosure provides a preheating method of a detector and a probe card, which can preheat the probe card while keeping the interval between the probe card and the top of the chuck fixed.

[0009] Solutions to the Problems

[0010] A detector according to one technical solution of the present disclosure includes a plurality of inspection chambers. Each of the plurality of inspection chambers includes a probe card, a top of a chuck, and a temperature adjustment unit. The probe card has a plurality of probes. The top of the chuck can carry a wafer. The temperature adjustment unit adjusts the temperature of the top of the chuck. In addition, at least one of the probe card and the top of the chuck includes a spacing adjustment member that keeps the interval between the probe card and the top of the chuck fixed. In a state where no wafer is placed on the top of the chuck and in a state where the probe card and the top of the chuck are in contact with each other through the spacing adjustment member, the detector preheats the probe card by means of the heat of the top of the chuck whose temperature has been adjusted by the temperature adjustment unit.

[0011] Another technical solution of the detector disclosed in the present invention includes multiple inspection chambers, wherein each of the multiple inspection chambers includes: a probe card assembly part, which is used to assemble a probe card with multiple probes; a suction cup top, which can carry a wafer; a temperature adjustment part, which adjusts the temperature of the suction cup top; and a spacing adjustment member, which keeps the spacing between the probe card assembled on the probe card assembly part and the suction cup top fixed, and when no wafer is placed on the suction cup top and when the probe card and the suction cup top are in contact with each other via the spacing adjustment member, the probe card is preheated by means of the heat of the suction cup top that has been temperature adjusted by the temperature adjustment member, wherein, when the spacing between the probe card and the suction cup top in a state where no wafer is placed is kept fixed by means of the spacing adjustment member, the spacing between the probe card and the suction cup top in a state where no wafer is placed is narrower than the spacing between the probe card and the suction cup top in a state where a wafer is placed.

[0012] A detector of another technical solution of the present disclosure includes multiple inspection chambers, wherein each of the multiple inspection chambers includes: a suction cup top, which can load a wafer; a spring frame, a probe card with multiple probes is mounted on the spring frame; and a temperature adjustment unit, which adjusts the temperature of the suction cup top, the spring frame including a spacing adjustment component, which keeps the spacing between the probe card and the suction cup top fixed, and preheats the probe card with the heat of the suction cup top that has been temperature-adjusted by the temperature adjustment unit when no wafer is loaded on the suction cup top and when the spring frame and the suction cup top are in contact with each other via the spacing adjustment component, wherein when the spacing between the probe card and the suction cup top in a state where no wafer is loaded is kept fixed by the spacing adjustment component, the spacing between the probe card and the suction cup top in a state where no wafer is loaded is narrower than the spacing between the probe card and the suction cup top in a state where a wafer is loaded.

[0013] Another technical solution disclosed in the present invention is a method for preheating a probe card, which is a probe card of a detector for inspecting wafers, wherein the method for preheating the probe card has the following steps: transporting a top of a suction cup for holding a wafer and not placing a wafer to a probe card assembly part, wherein the probe card assembly part is used to assemble a probe card having a probe for contacting the wafer; and preheating the probe card using the heat of the top of the suction cup while keeping the interval between the probe card and the top of the suction cup in a state where the wafer is not placed fixed by means of a spacing adjustment member in a manner that is narrower than the interval between the probe card and the top of the suction cup in a state where the wafer is placed.

[0014] Effects of the Invention

[0015] By adopting the present disclosure, the interval between the probe card and the top of the chuck can be kept fixed to preheat the probe card. Description of the Drawings

[0016] Figure 1 FIG. is a diagram showing an example of a detector according to the first embodiment of the present disclosure.

[0017] Figure 2 is along Figure 1 A cross-sectional view taken along line II-II.

[0018] Figure 3 FIG. is a diagram showing an example of the structure of the detector in the state where no wafer is placed on the top of the chuck according to the first embodiment.

[0019] Figure 4 FIG. is a diagram showing an example of the structure of the detector in the state where a wafer is placed on the top of the chuck according to the first embodiment.

[0020] Figure 5 FIG. is a flowchart showing an example of a method for preheating a probe card according to the first embodiment.

[0021] Figure 6 FIG. is a diagram showing an example of the structure of the interval adjusting member.

[0022] Figure 7 FIG. is a diagram showing an example of the structure of the interval adjusting member.

[0023] Figure 8 FIG. is a diagram showing an example of the structure of the interval adjusting member.

[0024] Figure 9 FIG. is a diagram showing an example of a cross-section of the structure of the interval adjusting member.

[0025] Figure 10 FIG. is a diagram showing an example of a cross-section of the structure of the interval adjusting member.

[0026] Figure 11 FIG. is a diagram showing an example of the structure of the detector in the state where no wafer is placed on the top of the chuck according to the second embodiment.

[0027] Figure 12 FIG. is a diagram showing an example of the structure of the detector in the state where a wafer is placed on the top of the chuck according to the second embodiment. Detailed Description of the Embodiment

[0028] Hereinafter, embodiments of a method for preheating a disclosed detector and a probe card will be described in detail with reference to the drawings. Among them, the following embodiments are not intended to limit the disclosed technology.

[0029] In recent years, in order to improve the inspection efficiency of wafers, a detector has been developed. The detector includes a plurality of inspection chambers and is capable of inspecting semiconductor devices of wafers in other inspection chambers while the wafers are being transported to one inspection chamber by means of a transport device. In the case of this detector, when bringing the wafer into contact with the probe card, the wafer is placed on top of the chuck, and the space between the probe card and the top of the chuck is evacuated to a vacuum, so that the wafer abuts against the probe card. Here, when bringing the wafer into contact with the probe card, the top of the chuck is placed on the stage, and the stage moves the top of the chuck toward the probe card. After that, the top of the chuck is attracted toward the probe card and separated from the stage.

[0030] However, in recent years, the inspection conditions during wafer inspection have become complicated. In particular, inspections are frequently carried out in high-temperature environments and low-temperature environments. In this case, before inspecting the wafer, it is desirable to preheat the probe card, and the preheating sets the probe card to the temperature at which the inspection is to be carried out. The preheating of the probe card is performed, for example, using radiant heat from the top of the chuck, so the positional relationship between the probe card and the top of the chuck becomes important. Therefore, it is expected that the interval between the probe card and the top of the chuck is kept fixed during the preheating of the probe card.

[0031] [Structure of the detector]

[0032] Figure 1 is a diagram showing an example of the detector according to the first embodiment of the present disclosure. In addition, Figure 2 is a cross-sectional view taken along line II-II of Figure 1 . Figure 1 and Figure 2 The detector 10 shown has: an inspection area 12 that inspects the electrical characteristics of each semiconductor device of the wafer W; a storage area 13 that stores the wafer W; and a transport area 14 that is provided between the inspection area 12 and the storage area 13.

[0033] A plurality of testers 15 as wafer inspection interfaces are arranged in the inspection area 12, and a plurality of inspection chambers 12a corresponding to the respective testers 15 are provided in the inspection area 12. Specifically, the inspection area 12 has a three-layer structure of tester columns composed of a plurality of testers arranged horizontally, and one tester-side camera 16 is arranged corresponding to each tester column. Each tester-side camera 16 can move horizontally along the corresponding tester column, is located in front of each tester 15, and confirms the position of the wafer W and the like and the degree of inclination of the top of the chuck 29.

[0034] The accommodation area 13 is divided into a plurality of accommodation spaces 17. In each accommodation space 17, an entrance 17a, an aligner 17b, a loader 17c, and a controller 17d are arranged. The entrance 17a receives a FOUP (Front Opening Unified Pod), which is a container for accommodating a plurality of wafers. The aligner 17b performs wafer alignment. The loader 17c sends in and out a probe card 19. The controller 17d controls the operations of the respective components.

[0035] The conveyance area 14 is provided with a conveyance device 18 that can move freely between the inspection area 12 and the accommodation area 13. The conveyance device 18 takes out the wafer W from the entrance 17a and conveys it to each inspection chamber 12a, and conveys the wafer W, for which the electrical characteristics inspection of semiconductor devices has been completed, from each inspection chamber 12a to the entrance 17a.

[0036] When the conveyance device 18 conveys a wafer W between one inspection chamber 12a and the entrance 17a, other inspection chambers 12a can perform the electrical characteristics inspection of other semiconductor devices of other wafers W. Therefore, the inspection efficiency of the wafers can be improved.

[0037] Figure 3 It is a diagram showing an example of the structure of the detector in a state where no wafer is placed on the top of the chuck in the first embodiment. Among them, Figure 3 It shows a state where no wafer W is placed to preheat the probe card 19. That is, Figure 3 It shows a state where the top 29 of the chuck abuts against the gap adjustment member 70 provided on the probe card 19, Figure 3 The structure of the inspection chamber 12a is mainly shown by a cross-sectional view. In addition, Figure 4 It is a diagram showing an example of the structure of the detector in a state where a wafer is placed on the top of the chuck in the first embodiment. That is, Figure 4 It shows a state where the wafer W abuts against the probe card 19, Figure 4 The structure of the inspection chamber 12a is mainly shown by a cross-sectional view.

[0038] In Figure 3 and Figure 4 the tester 15 is arranged on the spring bracket 20, and the spring bracket 20 is fixed to a device bracket (not shown). The probe card 19 is assembled to the lower part of the spring bracket 20. The flange 22 is arranged to surround the probe card 19.

[0039] The probe card 19 has: a disc-shaped main body 24; a plurality of electrodes (not shown), which are arranged on substantially one plane of the upper surface of the main body 24; and a plurality of probes 25, which are arranged to protrude downward from the lower surface of the main body 24. Each electrode is connected to the corresponding probe 25. When the wafer W abuts against the probe card 19, each probe 25 comes into contact with the electrode pads and solder bumps of each semiconductor device formed on the wafer W.

[0040] In addition, the probe card 19 has a spacing adjustment member 70 that maintains a fixed spacing between the probe card 19 and the top of the chuck 29 when a wafer W is not placed on the top of the chuck 29. The spacing adjustment member 70 is, for example, in the shape of a pin and is made of stainless steel, aluminum, or copper, and there are three or more provided on the lower surface of the probe card 19. Among them, the spacing adjustment member 70 can also be, for example, a resin such as a material called PEEK (Poly Ether Ether Ketone), other materials, alloys, etc. The length relationship of the spacing adjustment member 70 is that it is longer than the probe 25 and shorter than the spacing between the lower surface of the main body 24 of the probe card 19 and the upper surface of the top of the chuck 29 in a state where the probe 25 is in contact with the wafer W when the wafer W is placed on the top of the chuck 29.

[0041] That is, as Figure 3 shown, in a state where the wafer W is not placed, the spacing adjustment member 70 abuts against the top of the chuck 29. On the other hand, as Figure 4 shown, in a state where the wafer W is placed on the top of the chuck 29, the spacing adjustment member 70 is in a state where a gap is left between the spacing adjustment member 70 and the top of the chuck 29. In other words, in a state where the wafer W is not placed on the top of the chuck 29, the probe 25 does not contact the top of the chuck 29, and in a state where the wafer W is placed on the top of the chuck 29, the probe 25 contacts the wafer W.

[0042] The spring holder 20 has: a main body 26, which is substantially flat; and a plurality of spring pin socket insertion holes 27, which are a plurality of through holes penetrating through the vicinity of the central portion of the main body 26, and a spring pin socket 28 formed by arranging a plurality of spring pins is inserted and fitted into each spring pin socket insertion hole 27. The spring pin socket 28 is connected to an inspection circuit (not shown) of the tester 15 and is in contact with a plurality of electrodes on the upper surface of the main body 24 of the probe card 19 assembled to the spring holder 20. The spring pin socket 28 allows current to flow to each probe 25 of the probe card 19 connected to the electrode, and allows the current flowing from the circuits of the respective semiconductor devices of the wafer W through each probe 25 to flow toward the inspection circuit.

[0043] The flange 22 has an upper flange 22a and a lower flange 22b. In addition, the flange 22 has a cylindrical bellows 23 between the upper flange 22a and the lower flange 22b. The upper flange 22a is engaged with the spring holder 20 and sealed using a sealant or the like. The lower flange 22b is movable up and down relative to the spring holder 20.

[0044] Before the lower flange 22b abuts against the top of the suction cup 29, under the action of its own weight, it moves downward so that the lower surface of the lower flange 22b is located below the tips of the respective probes 25 of the probe card 19. The bellows 23 is a corrugated structure made of metal and is configured to be telescopic in the vertical direction. The lower end of the bellows 23 is in close contact with the upper surface of the lower flange 22b, and the upper end of the bellows 23 is in close contact with the lower surface of the upper flange 22a.

[0045] The space between the spring holder 20 and the base 21 of the tester 15 is sealed by a sealing member 30, and this space is evacuated to a vacuum so that the base 21 is assembled to the spring holder 20. The space between the spring holder 20 and the probe card 19 is also sealed by a sealing member 31, and this space is evacuated to a vacuum so that the probe card 19 is assembled to the spring holder 20.

[0046] The transfer device 18 has an aligner 32. The top of the suction cup 29 is placed on the aligner 32, and the wafer W is placed on the upper surface of the top of the suction cup 29. Among them, in Figure 3 , the wafer W is not placed, and the placement position is indicated by a dotted line. The top of the suction cup 29 is vacuum adsorbed to the aligner 32, and the wafer W is vacuum adsorbed to the top of the suction cup 29. Therefore, relative movement of the wafer W with respect to the transfer device 18 can be prevented when the transfer device 18 moves. Among them, the holding method of the top of the suction cup 29 and the wafer W is not limited to vacuum adsorption, and any method that can prevent relative movement of the top of the suction cup 29 and the wafer W with respect to the aligner 32 is acceptable. For example, it can also be electromagnetic adsorption or holding with a jig. Among them, a step 29a is formed at the peripheral portion of the upper surface of the top of the suction cup 29, and a sealing member 33 is arranged at the step 29a.

[0047] In addition, the top of the suction cup 29 is provided with a flow path 50 and a heater 51 inside. Refrigerant is supplied from a cooling unit (not shown) to the flow path 50. After the refrigerant supplied to the flow path 50 flows in the flow path 50, it returns to the cooling unit. The heater 51 is connected to a heater power supply (not shown), and this heater power supply supplies power to the heater 51 to heat the top of the suction cup 29. The temperature of the top of the suction cup 29 is adjusted by cooling achieved by the refrigerant circulating in the flow path 50 and heating achieved by the heater 51.

[0048] The transfer device 18 can move downward below the probe card 19 in the inspection chamber 12a to oppose the wafer W placed on the top of the suction cup 29 to the probe card 19, and can move the wafer W toward the probe card 19. The space S is when the spacer 70 abuts against the placement surface of the top of the suction cup 29 ( Figure 3 ), or when the top of the suction cup 29 abuts against the lower flange 22b and the wafer W abuts against the probe card 19 ( Figure 4)The formed space. The space S is sealed by the bellows 23 and the sealing member 33. In the space S, the space S is evacuated by means of the vacuum pipe 26a, so that the top of the suction cup 29 is held on the probe card 19 side. Among them, the holding method of the top of the suction cup 29 is not limited to vacuum adsorption, as long as it is a method capable of forming the space S. For example, it can also be electromagnetic adsorption or holding by a fixture. Among them, the movement of the conveying device 18 is controlled by the controller 17d, and the controller 17d grasps the position and movement amount of the conveying device 18.

[0049] The aligner 32 adjusts the relative position and inclination of the top of the suction cup 29 with respect to the probe card 19. Temperature adjustment parts such as the flow path 50 and the heater 51 are used to realize inspections in high-temperature environments and low-temperature environments. Therefore, when the aligner 32 performs inspections in high-temperature environments and low-temperature environments, it adjusts the position and inclination accompanied by the deformation of the probe card 19 and the top of the suction cup 29 due to the heat release from the heater 51 and the heat absorption from the flow path 50. Among them, for the temperature range of the top of the suction cup 29, a range of, for example, 130 °C to -30 °C can be cited.

[0050] The aligner 32 has bases corresponding to the X, Y, and Z directions and guide members in the shape of rails. Each base can move along each guide member. A suction cup base in the shape of a substantially circular plate is provided on the Z slider provided on the Z base. The suction cup base has a suction cup top adsorption surface on the upper surface, and the top of the suction cup 29 is vacuum adsorbed on the suction cup top adsorption surface. Thus, the top of the suction cup 29 is placed and assembled on the aligner 32. At this time, positioning pins, positioning blocks, etc. are used to define the position of the top of the suction cup 29 relative to the suction cup base.

[0051] In addition, the aligner 32 has an upper confirmation camera for confirming the degree of inclination of the probe card 19 and the socket 20. In addition, the aligner 32 can use an actuator to lift and lower the suction cup base, thereby adjusting the inclination of the placed top of the suction cup 29.

[0052] [Preheating method of probe card]

[0053] Next, the preheating method of the probe card of the first embodiment will be described. Figure 5 It is a flowchart showing an example of the preheating method of the probe card of the first embodiment.

[0054] The probe card 19 is conveyed from the loader 17c to the inspection chamber 12a where the probe card is to be preheated by using the conveying device 18. The probe card 19 is vacuum adsorbed from the conveying device 18 to the socket 20 (step S1).

[0055] Next, the transfer device 18 is used to transfer the chuck top 29 to the probe card 19 to be preheated. At this time, the chuck top 29 is in a state where no wafer is placed. The transfer device 18 is used to transfer the chuck top 29 to the lower part of the probe card 19. The chuck top 29 is raised so that the chuck top 29 abuts against the gap adjusting member 70 of the probe card 19. Then, the chuck top 29 is vacuum adsorbed to the probe card 19 side (step S2). At this time, the gap between the chuck top 29 and the probe card 19 is kept fixed by the gap adjusting member 70.

[0056] The transfer device 18 is retracted from the inspection chamber 12a, and a cooling unit and a heater power supply (not shown) connected to the flow path 50 and the heater 51 are controlled to start preheating the probe card (step S3).

[0057] When the preheating of the probe card is completed, the transfer device 18 is used to transfer the chuck top 29 from the inspection chamber 12a, and the wafer W is placed on the chuck top 29. The chuck top 29 on which the wafer W is placed is transferred to the inspection chamber 12a, and the wafer W and the chuck top 29 are vacuum adsorbed to the socket 20 (step S4). The wafer W is inspected (step S5), and after the inspection is completed, the transfer device 18 is used to transfer the wafer W to, for example, the inlet 17a.

[0058] In this way, the interval between the probe card 19 and the chuck top 29 can be kept fixed to preheat the probe card 19. In addition, since the interval between the probe card 19 and the chuck top 29 is kept fixed, the preheating time of the probe card can be made stable in any inspection chamber 12a.

[0059] [Modification example of the gap adjusting member]

[0060] Next, a modification example of the gap adjusting member 70 will be described. Figures 6 to 8 It is a diagram showing an example of the structure of the gap adjusting member. Figure 9 and Figure 10 It is a diagram showing an example of the cross section of the structure of the gap adjusting member. As Figures 6 to 8 shown, the gap adjusting members 70a to 70c are arranged from the lower surface of the main body 24 of the probe card 19 toward the front side in the figure. In Figure 9 and Figure 10 in the case of the cross section of the probe card 19 shown, the gap adjusting members 70a to 70c are arranged from the lower surface of the main body 24 toward the lower part in the figure. Figure 6 The gap adjusting member 70a shown is an example in which it is arranged in a circular ring shape on the outer peripheral side of the probe card 19. Figure 7 The gap adjusting member 70b shown is an example in which three arc-shaped gap adjusting members 70b are arranged on the outer peripheral side of the probe card 19. Figure 8The illustrated spacer adjustment member 70c is an example of a case where two linear spacer adjustment members 70c are arranged at positions symmetric with respect to the center axis of the probe card 19.

[0061] Figure 9 The cross-section showing the spacer adjustment member has a linear shape. Additionally, Figure 10 The cross-section showing the spacer adjustment member has an inverted T shape. Among them, as a modified example of the spacer adjustment member 70, it is not limited to the spacer adjustment members 70a to 70c, and other shapes and arrangements are also possible.

[0062] [Second Embodiment of the Structure of the Probe]

[0063] In the case of the first embodiment, the spacer adjustment member 70 provided on the probe card 19 is used to keep the distance between the chuck top 29 and the probe card 19 fixed. However, the spacer adjustment member can also be provided on the socket, and the implementation form in this case will be described as the second embodiment. Among them, the same reference numerals are used for the same structures as those in the first embodiment, and the description of the repeated structures and operations is omitted.

[0064] Compared with the first embodiment, the second embodiment has a socket 80 and a chuck top 89, instead of the socket 20 and the chuck top 29. Figure 11 This is a diagram showing an example of the structure of the probe in the state where no wafer is placed on the chuck top in the second embodiment. Among them, Figure 11 It shows the state where no wafer W is placed to preheat the probe card 19. Additionally, Figure 12 This is a diagram showing an example of the structure of the probe in the state where a wafer is placed on the chuck top in the second embodiment.

[0065] As shown in Figure 11 and Figure 12 the socket 80 has: a main body 86, which is substantially flat; and a plurality of spring pin socket insertion holes 87, which are a plurality of through holes penetrating through the vicinity of the central portion of the main body 86, and a spring pin socket 28 formed by arranging a plurality of spring pins is fitted and inserted into each spring pin socket insertion hole 87. Additionally, the socket 80 has a spacer adjustment member 82, which is used to keep the distance between the chuck top 89 and the probe card 19 fixed. Furthermore, the socket 80 has: a vacuum pipe 86a, which is used to suck the space S into a vacuum; and an air pipe 86b, which is used to fix the spacer adjustment member 82.

[0066] The spacing adjustment member 82 can move up and down freely and is fixed at an arbitrary position by the pressure of the air duct 86b. In addition to the spacing adjustment member 82, the spacing adjustment unit 81 further includes a distance sensor 83 for measuring the distance between the susceptor 80 and the top of the chuck 89. The distance sensor 83 is a non-contact sensor such as an eddy current type sensor, for example.

[0067] When the top of the chuck 89 is vacuum adsorbed to the susceptor 80, the spacing adjustment member 82 is fixed at a predetermined distance based on the distance measured by the distance sensor 83. Among them, for the spacing adjustment member 82, each distance sensor 83 can be used to fix the plurality of spacing adjustment members 82 one by one. In addition, the spacing adjustment member 82 is fixed at a distance (position) where the probe 25 does not contact the upper surface of the top of the chuck 89 when the wafer W is not placed on the top of the chuck 89 ( Figure 11 ). On the other hand, the spacing adjustment member 82 is fixed at a distance (position) where the wafer W contacts the probe 25 when the wafer W is placed on the top of the chuck 89 ( Figure 12 ).

[0068] The top of the chuck 89 is vacuum adsorbed to the aligner 32, and the wafer W is vacuum adsorbed to the top of the chuck 89. A groove 89a is formed at the peripheral edge of the upper surface of the top of the chuck 89, and a sealing member 33 is disposed in the groove 89a. In addition, the height of the outermost peripheral portion 89b of the top of the chuck 89 is the same as the height of the adsorption surface for adsorbing the wafer W, and the outermost peripheral portion 89b abuts against the spacing adjustment member 82.

[0069] The space S is formed when the spacing adjustment member 82 abuts against the outermost peripheral portion 89b of the top of the chuck 89 to reach a set distance ( Figure 11 ), or when the top of the chuck 89 abuts against the lower flange 22b and the wafer W abuts against the probe card 19 ( Figure 12 ). The space S is sealed by the bellows 23 and the sealing member 33. For the space S, the space S is evacuated to a vacuum, thereby holding the top of the chuck 89 on the side of the probe card 19.

[0070] In this way, in the case of the second embodiment, the probe card 19 and the top of the chuck 89 can be held parallel to preheat the probe card 19. In addition, the position of the top of the chuck 89 in the case of preheating the probe card 19 can be specified.

[0071] As described above, according to the first embodiment, the detector 10 includes a plurality of inspection chambers 12a. Each of the plurality of inspection chambers includes a probe card 19, a chuck top 29, and a temperature adjustment unit. The probe card 19 has a plurality of probes 25. The chuck top 29 is capable of mounting a wafer W. The temperature adjustment unit adjusts the temperature of the chuck top 29. In addition, at least one of the probe card 19 and the chuck top 29 includes a gap adjustment member 70 that keeps the gap between the probe card 19 and the chuck top 29 fixed. In a state where the wafer W is not mounted on the chuck top 29 and in a state where the probe card 19 and the chuck top 29 are in contact with each other with the gap adjustment member 70 therebetween, the detector 10 preheats the probe card 19 by the heat of the chuck top 29 whose temperature has been adjusted by the temperature adjustment unit. As a result, preheating of the probe card 19 can be performed.

[0072] In addition, according to the second embodiment, the detector 10 includes a plurality of inspection chambers 12a. Each of the plurality of inspection chambers 12a includes a probe card 19, a chuck top 89, a spring holder 80, and a temperature adjustment unit. The probe card 19 has a plurality of probes 25. The chuck top 89 is capable of mounting a wafer W. The spring holder 80 supports the probe card 19. The temperature adjustment unit adjusts the temperature of the chuck top 89. In addition, the spring holder 80 includes a gap adjustment member 82 that keeps the gap between the probe card 19 and the chuck top 89 fixed. In a state where the wafer W is not mounted on the chuck top 89 and in a state where the spring holder 80 and the chuck top 89 are in contact with each other with the gap adjustment member 82 therebetween, the detector 10 preheats the probe card 19 by the heat of the chuck top 89 whose temperature has been adjusted by the temperature adjustment unit. As a result, preheating of the probe card 19 can be performed while keeping the probe card 19 and the chuck top 89 parallel to each other.

[0073] It should be noted that all aspects of the embodiments disclosed this time are examples and are not intended to limit the present invention. The above-described embodiments can also be omitted, replaced, and changed in various forms without departing from the claims and their gist.

Claims

1. A detector, the detector comprising a plurality of inspection chambers, wherein, each of the plurality of inspection chambers comprises: a probe card assembly part for assembling a probe card having a plurality of probes; a top of a chuck capable of placing a wafer thereon; a temperature adjustment part for adjusting the temperature of the top of the chuck; and a spacing adjustment member for keeping the spacing between the probe card assembled to the probe card assembly part and the top of the chuck fixed, in a state where no wafer is placed on the top of the chuck and in a state where the probe card and the top of the chuck are in contact with each other across the spacing adjustment member, preheating of the probe card is performed by means of the heat of the top of the chuck whose temperature has been adjusted by the temperature adjustment part, wherein, when the spacing between the probe card and the top of the chuck in a state where no wafer is placed is kept fixed by the spacing adjustment member, the spacing between the probe card and the top of the chuck in a state where no wafer is placed is narrower than the spacing between the probe card and the top of the chuck in a state where a wafer is placed.

2. The detector according to claim 1, wherein, the length relationship of the spacing adjustment member is longer than the probe and shorter than the spacing between the probe card and the top of the chuck in a state where the probe is in contact with the wafer when a wafer is placed on the top of the chuck.

3. The detector according to claim 1 or 2, wherein, the spacing adjustment member is in a pin shape, a circular ring shape, an arc shape or a straight line shape.

4. A detector, the detector comprising a plurality of inspection chambers, wherein, each of the plurality of inspection chambers comprises: a top of a chuck capable of placing a wafer thereon; a spring holder to which a probe card having a plurality of probes is assembled; and a temperature adjustment part for adjusting the temperature of the top of the chuck, the spring holder includes a spacing adjustment member for keeping the spacing between the probe card and the top of the chuck fixed, in a state where no wafer is placed on the top of the chuck and in a state where the spring holder and the top of the chuck are in contact with each other across the spacing adjustment member, preheating of the probe card is performed by means of the heat of the top of the chuck whose temperature has been adjusted by the temperature adjustment part, wherein, when the spacing between the probe card and the top of the chuck in a state where no wafer is placed is kept fixed by the spacing adjustment member, the spacing between the probe card and the top of the chuck in a state where no wafer is placed is narrower than the spacing between the probe card and the top of the chuck in a state where a wafer is placed.

5. A method for preheating a probe card, the probe card being a probe card of a detector for inspecting a wafer, wherein, the method for preheating the probe card has the following steps: feeding a top of a chuck for holding a wafer and in a state where no wafer is placed to a probe card assembly part, the probe card assembly part being for assembling a probe card formed with probes for contacting the wafer; and The probe card is preheated using the heat of the top of the chuck while the interval between the probe card and the top of the chuck in a state where no wafer is placed is kept fixed by an interval adjustment member in a manner narrower than the interval between the probe card and the top of the chuck in a state where a wafer is placed.

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