Film probe card structure

Abstract

The invention relates to the field of chip testing, in particular to a film probe card structure. The film probe card structure comprises a connecting piece, a flexible film, a fixing piece, a conductive piece, a conductive layer and a plurality of probes, the side portion of the flexible thin film is attached to the bottom face of the connecting piece through the fixing piece, the conductive layer is arranged on the top face of the flexible thin film, the conductive piece is installed on the connecting piece and located above the side portion of the flexible thin film, and the side portion of the conductive layer is located between the conductive piece and the flexible thin film. The side part of the conductive layer is in gapless contact and conductive connection with the conductive piece, the plurality of probes are arranged on the bottom surface of the middle part of the flexible film at intervals, and the probes are in conductive connection with the conductive layer. Due to the fact that conductive connection is achieved between the side portion of the conductive layer and the conductive piece in a gapless contact mode, welding spots do not appear between the side portion of the conductive layer and the conductive piece, transient impedance abrupt change caused by the existence of the welding spots cannot happen to electric signals in the transmission process, and reflection and flowing of the electric signals are effectively prevented.

Description

Technical Field

[0001] The present invention relates to the field of chip testing, and particularly to a structure of a thin film probe card. Background Art

[0002] In a traditional test probe card, a conductive member is fixedly installed on a flexible film by welding, and a conductive layer on the flexible film is electrically connected to the conductive member. However, when the electrical signal of the conductive layer passes through the solder joint between the flexible film and the conductive member, due to the sudden increase in impedance at the solder joint, phenomena such as reflection and crosstalk of the electrical signal of the conductive layer will occur, resulting in loss of the electrical signal of the conductive layer and reduction of signal accuracy. Summary of the Invention

[0003] The purpose of the present invention is to overcome the problem that the electrical signal is reflected and crosstalked due to the solder joint between the conductive layer and the conductive member in the prior art.

[0004] To achieve the above purpose, the present invention provides a structure of a thin film probe card, which includes a connecting member, a flexible film, a fixing member, a conductive member, a conductive layer and a plurality of probes; the side of the flexible film is attached to the bottom surface of the connecting member through the fixing member, the conductive layer is arranged on the top surface of the flexible film, the conductive member is installed on the connecting member and located above the side of the flexible film, the side of the conductive layer is located between the conductive member and the flexible film, there is no gap between the side of the conductive layer and the conductive member and they are electrically connected, and a plurality of probes are installed at intervals on the bottom surface of the middle part of the flexible film, and the probes are electrically connected to the conductive layer.

[0005] In some embodiments, the conductive member has an outer side edge, the outer side edge faces away from the middle of the flexible film, the plane where the outer side edge is located is a signal boundary, and the distribution range of the conductive layer does not exceed the signal boundary.

[0006] In some embodiments, the conductive layer extends along the extending direction of the flexible film and is attached to the top surface of the flexible film.

[0007] In some embodiments, the top surface of the side of the conductive layer is attached to the bottom surface of the conductive member.

[0008] In some embodiments, the conductive layer is a conductive trace of the flexible film.

[0009] In some embodiments, the fixing member passes through the flexible film, and the fixing member fixes the flexible film to the bottom surface of the connecting member by locking or welding.

[0010] In some embodiments, the fixing member is isolated or insulated from the conductive layer.

[0011] In some embodiments, the connecting member has a first connecting side portion and a second connecting side portion. The first connecting side portion faces the middle of the flexible film, and the second connecting side portion faces away from the middle of the flexible film. The conductive member is located between the first connecting side portion and the second connecting side portion. At least one fixing member is provided on each of the first connecting side portion and the second connecting side portion, and the fixing member provided on the first connecting side portion and the fixing member provided on the second connecting side portion are configured to tension and fix the side portion of the flexible film.

[0012] In some embodiments, the distance between the conductive member and the fixing member on the first connecting side portion is a first distance, and the distance between the conductive member and the fixing member on the second connecting side portion is a second distance. The first distance is greater than the second distance; and / or, the diameter of the fixing member on the first connecting side portion is greater than the diameter of the fixing member on the second connecting side portion.

[0013] In some embodiments, a grounding layer for shielding interference signals is provided on the bottom surface of the flexible film.

[0014] In some embodiments, the grounding layer is attached to the bottom surface of the flexible film and extends along the extending direction of the flexible film.

[0015] In some embodiments, the grounding layer includes a first extending portion, and the first extending portion extends from the middle edge of the flexible film to the side portion of the flexible film.

[0016] In some embodiments, the grounding layer includes a second extending portion, and the second extending portion extends in the middle of the flexible film. The second extending portion is provided with a plurality of avoiding holes that penetrate and extend, and a plurality of probes respectively pass through the plurality of avoiding holes. The second extending portion is electrically connected to the first extending portion.

[0017] In some embodiments, the thin film probe card structure further includes a carrying mechanism. The carrying mechanism is located below the side portion of the flexible film, and the carrying mechanism is attached to the bottom surface of the side portion of the flexible film. The carrying mechanism is fixedly connected to the connecting member.

[0018] In some embodiments, the carrying mechanism includes a carrying seat. The top surface of the carrying seat is attached to the bottom surface of the side portion of the flexible film. The carrying seat is fixedly connected to the connecting member through a fixing member, and the fixing member extends to the middle of the carrying seat in its thickness direction.

[0019] In some embodiments, an installation groove is provided at the top of the carrying seat, and an elastic member is provided in the installation groove. The elastic member is located directly below the conductive member. The top surface of the elastic member contacts the bottom surface of the side portion of the flexible film, and the elastic member can apply an elastic force to the side portion of the flexible film to make the side portion of the conductive layer and the conductive member fit tightly.

[0020] The above technical solutions of the present invention have the following beneficial effects:

[0021] The fixing member fixes the side portions of the flexible film to the bottom surface of the connecting member through the fixing member. The conductive layer is disposed on the top surface of the flexible film, and the side portions of the conductive layer are located between the conductive member and the flexible film. The side portions of the conductive layer can be firmly fixed between the conductive member and the flexible film along with the side portions of the flexible film. The probe is electrically connected to the conductive layer, and the side portions of the conductive layer are electrically connected to the conductive member. Therefore, the probe, the conductive layer, and the conductive member form an electrical signal transmission path. Since the side portions of the conductive layer are electrically connected to the conductive member in a gapless contact manner, that is, not by welding, there will be no solder joints between the side portions of the conductive layer and the conductive member. Therefore, the electrical signal will not be affected by the transient impedance mutation caused by the existence of solder joints during the transmission process, effectively preventing the electrical signal from reflecting and straying, improving the accuracy of the electrical signal, and thus improving the test accuracy. Description of the Drawings

[0022] Figure 1 is a schematic diagram of the structure of a thin film probe card in an embodiment of the present invention;

[0023] Figure 2 is a partial schematic diagram of the arrangement of the conductive layer and the grounding layer in an embodiment of the present invention;

[0024] Figure 3 is a partial schematic diagram of the arrangement of the conductive layer and the grounding layer in another embodiment of the present invention;

[0025] Figure 4 is a distribution schematic diagram of the bearing mechanism in an embodiment of the present invention;

[0026] Figure 5 is a distribution schematic diagram of the fixing member in an embodiment of the present invention;

[0027] Figure 6 is a distribution schematic diagram of the fixing member in another embodiment of the present invention.

[0028] Description of the Reference Numerals

[0029] 1. Connecting member; 11. First connecting side portion; 12. Second connecting side portion;

[0030] 2. Flexible film;

[0031] 3. Fixing member; 31. First fixing member; 32. Second fixing member;

[0032] 4. Conductive member; 41. Signal boundary;

[0033] 5. Conductive layer;

[0034] 6. Probe;

[0035] 7. Grounding layer; 71. First extension portion; 72. Second extension portion; 73. Avoidance hole;

[0036] 8. Carrier mechanism; 81. Carrier base; 82. Elastic member. Detailed implementation manner

[0037] The features and exemplary embodiments of various aspects of the present invention will be described in detail below. In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present invention, rather than limiting the present invention. For those skilled in the art, the present invention can be implemented without some of these specific details. The following description of the embodiments is only to provide a better understanding of the present invention by showing examples of the present invention.

[0038] In a traditional test probe card, the conductive member is installed and fixed to the flexible film by welding, and the conductive layer on the flexible film is electrically connected to the conductive member. The electrical signal can be transmitted from the conductive layer to the conductive member, and the electrical signal will pass through the solder joint between the conductive layer and the conductive member. However, there are material differences between both the conductive layer and the conductive member and the solder joint, and there are often parts with structural mutations on the surface of the solder joint. At least these reasons result in a situation of transient impedance mutation at the solder joint. When the electrical signal is transmitted along the transmission line, the electrical signal will be affected by transient impedance at each position on the transmission path; if the transient impedance received by the electrical signal is constant, the electrical signal will be stably transmitted; but if the transient impedance received by the electrical signal suddenly changes somewhere, the electrical signal will be reflected and diverted, resulting in a decrease in the accuracy of the electrical signal. Due to the situation of transient impedance mutation at the solder joint, the electrical signal often reflects and diverts at the solder joint, resulting in a decrease in the accuracy of the electrical signal, thereby leading to a decrease in the test accuracy. Based on this background, the present invention proposes a solution.

[0039] As Figures 1 to 4 shown, the present invention provides a thin film probe card structure, which includes a connecting member 1, a flexible film 2, a fixing member 3, a conductive member 4, a conductive layer 5 and a plurality of probes 6. The side part of the flexible film 2 is attached to the bottom surface of the connecting member 1 through the fixing member 3. The conductive layer 5 is arranged on the top surface of the flexible film 2. The conductive member 4 is installed on the connecting member 1 and is located above the side part of the flexible film 2. The side part of the conductive layer 5 is located between the conductive member 4 and the flexible film 2. The side part of the conductive layer 5 is in non-gap contact and electrically connected to the conductive member 4. A plurality of probes 6 are installed at intervals on the bottom surface of the middle part of the flexible film 2, and the probes 6 are electrically connected to the conductive layer 5.

[0040] Specifically, the fixing member 3 fixes the side portion of the flexible film 2 to the bottom surface of the connecting member 1 through the fixing member 3. The conductive layer 5 is disposed on the top surface of the flexible film 2, and the side portion of the conductive layer 5 is located between the conductive member 4 and the flexible film 2. The side portion of the conductive layer 5 can be firmly fixed between the conductive member 4 and the flexible film 2 along with the side portion of the flexible film 2. The probe 6 is electrically connected to the conductive layer 5, and the side portion of the conductive layer 5 is electrically connected to the conductive member 4. Therefore, the probe 6, the conductive layer 5, and the conductive member 4 form an electrical signal transmission path. Since the side portion of the conductive layer 5 is electrically connected to the conductive member 4 by means of gapless contact, that is, not by welding, there will be no solder joints between the side portion of the conductive layer 5 and the conductive member 4. Therefore, the electrical signal will not be affected by the transient impedance mutation caused by the existence of solder joints during the transmission process, effectively preventing the electrical signal from being reflected and flowing erratically, improving the accuracy of the electrical signal, and thus improving the test accuracy.

[0041] As Figures 1 to 4 shown, in some embodiments of the present invention, the conductive member 4 has an outer side edge facing away from the middle of the flexible film 2, and the plane where the outer side edge is located is the signal boundary 41. The distribution range of the conductive layer 5 does not exceed the signal boundary 41.

[0042] Specifically, the conductive layer 5 extends toward the signal boundary 41, but the conductive layer 5 does not exceed the signal boundary 41, avoiding the formation of antenna effects or edge effects at the end of the conductive layer 5, etc. Further, it can avoid signal flow or signal reflection at the connection position between the conductive layer 5 and the conductive member 4, enabling the electrical signal to be stably transmitted.

[0043] As Figures 1 to 4 shown, in some embodiments of the present invention, the conductive layer 5 extends along the extension direction of the flexible film 2 and adheres to the top surface of the flexible film 2.

[0044] Specifically, the conductive layer 5 can be disposed on the top surface of the flexible film 2 by means of etching or deposition, etc., so as to achieve good adhesion between the conductive layer 5 and the flexible film 2. Since the conductive layer 5 adheres to the top surface of the flexible film 2, the position of the conductive layer 5 is relatively stable during signal testing, which helps to stably transmit the electrical signal.

[0045] In some embodiments of the present invention, the top surface of the side portion of the conductive layer 5 is in contact with the bottom surface of the conductive member 4, so that the distance between the top surface of the side portion of the conductive layer 5 and the bottom surface of the conductive member 4 is zero, thereby achieving gapless contact.

[0046] In some embodiments of the present invention, the conductive layer 5 is a conductive trace of the flexible film 2, and the electrical signal can be transmitted along the probe 6, the conductive layer 5, and the conductive member 4.

[0047] AsFigures 1 to 6 As shown, in some embodiments of the present invention, the fixing member 3 passes through the flexible film 2, and the fixing member 3 fixes the flexible film 2 to the bottom surface of the connecting member 1 by locking or welding, so that the conductive layer 5 can be clamped and fixed between the conductive member 4 and the flexible film 2, thereby maintaining good gapless contact between the conductive layer 5 and the conductive member 4.

[0048] As Figures 5 to 6 shown, in some embodiments of the present invention, the fixing member 3 is isolated or insulated from the conductive layer 5 to avoid the fixing member 3 interfering with the transmission of electrical signals.

[0049] Specifically, the fixing member 3 can pass through the flexible film 2 while being isolated from the conductive layer 5. Of course, the fixing member 3 can also pass through both the conductive layer 5 and the flexible film 2 at the same time, and the outer periphery of the fixing member 3 is wrapped with an insulating material to achieve insulated connection between the fixing member 3 and the conductive layer 5.

[0050] During the signal testing process, the probe 6 presses on the chip under test. Based on the reaction force of the chip under test, the probe 6 drives the middle part of the flexible film 2 to move upward. The upward movement of the middle part of the flexible film 2 may cause the side part of the flexible film 2 to move or deform, resulting in a small gap between the side part of the conductive layer 5 and the conductive member 4. This small gap will cause a sudden change in the transient impedance at this position. However, the present invention can avoid this problem through the following solutions. As Figures 1 to 4 shown, in some embodiments of the present invention, the connecting member 1 has a first connecting side part 11 and a second connecting side part 12. The first connecting side part 11 faces the middle part of the flexible film 2, and the second connecting side part 12 faces away from the middle part of the flexible film 2. The conductive member 4 is located between the first connecting side part 11 and the second connecting side part 12. At least one fixing member 3 is provided on each of the first connecting side part 11 and the second connecting side part 12, and the fixing member 3 provided on the first connecting side part 11 and the fixing member 3 provided on the second connecting side part 12 are configured to tension and fix the side part of the flexible film 2.

[0051] Specifically, the fixing member 3 provided on the first connecting side part 11 is defined as the first fixing member 31, and the fixing member 3 provided on the second connecting side part 12 is defined as the second fixing member 32. The first fixing member 31 and the second fixing member 32 can tension and fix the side part of the flexible film 2, so that the side part of the flexible film 2 and the side part of the conductive layer 5 always remain flat and are not affected by the upward movement of the middle part of the flexible film 2, thereby maintaining good gapless contact between the top surface of the side part of the conductive layer 5 and the bottom surface of the conductive member 4. Moreover, the influence of the upward movement of the middle part of the flexible film 2 is at most transmitted to the first fixing member 31 and will not continue to be transmitted to the conductive member 4.

[0052] In some embodiments, the number of the first fixing members 31 and the second fixing members 32 is two respectively. The two first fixing members 31 are spaced apart in the width direction of the conductive layer 5, and the two second fixing members 32 are spaced apart in the width direction of the conductive layer 5.

[0053] As Figures 1 to 6 shown, in some embodiments of the present invention, the distance between the conductive member 4 and the fixing member 3 on the first connection side portion 11 is a first distance a, and the distance between the conductive member 4 and the fixing member 3 on the second connection side portion 12 is a second distance b. The first distance a is greater than the second distance b.

[0054] Specifically, the fixing member 3 provided on the first connection side portion 11 is defined as the first fixing member 31, and the fixing member 3 provided on the second connection side portion 12 is defined as the second fixing member 32. By this setting method, the first fixing member 31 is far away from the conductive member 4, which helps to keep the influence of the upward movement of the middle part of the flexible film 2 as far away from the conductive member 4 as possible; at the same time, the second fixing member 32 is far away from the conductive member 4, which helps to keep the tight and gapless contact between the conductive member 4 and the side portion of the conductive layer 5.

[0055] In some embodiments of the present invention, the diameter of the fixing member 3 on the first connection side portion 11 is larger than the diameter of the fixing member 3 on the second connection side portion 12.

[0056] Specifically, the fixing member 3 provided on the first connection side portion 11 is defined as the first fixing member 31, and the fixing member 3 provided on the second connection side portion 12 is defined as the second fixing member 32. The diameter of the first fixing member 31 is larger than the diameter of the second fixing member 32, so that the fixing effect of the flexible film 2 at the first fixing member 31 is better, and it can more effectively prevent the side portion of the flexible film 2 from being affected by its middle part.

[0057] As Figures 2 to 4 shown, in some embodiments of the present invention, a grounding layer 7 for shielding interference signals is provided on the bottom surface of the flexible film 2. The grounding layer 7 can shield the interference signals in the test area and prevent the electrical signals in the probe 6, the conductive layer 5 and the conductive member 4 from being interfered.

[0058] As Figures 2 to 4 shown, in some embodiments of the present invention, the grounding layer 7 is attached to the bottom surface of the flexible film 2 and extends along the extension direction of the flexible film 2.

[0059] Specifically, the grounding layer 7 can be provided on the bottom surface of the flexible film 2 by means of etching or deposition, so that the grounding layer 7 and the flexible film 2 are in good fit.

[0060] As Figures 2 to 4As shown, in some embodiments of the present invention, the grounding layer 7 includes a first extension portion 71, and the first extension portion 71 extends from the middle edge of the flexible film 2 to the side of the flexible film 2. The first extension portion 71 has a large extension range and can effectively shield interference signals.

[0061] As Figure 3 and Figure 4 As shown, in some embodiments of the present invention, the grounding layer 7 includes a second extension portion 72, and the second extension portion 72 extends in the middle of the flexible film 2. The second extension portion 72 is provided with a plurality of avoidance holes 73 that penetrate and extend, and a plurality of probes 6 pass through the plurality of avoidance holes 73 one by one. The second extension portion 72 is electrically connected to the first extension portion 71. The second extension portion 72 can form an interference signal shield for the middle of the flexible film 2, and the second extension portion 72 and the first extension portion 71 can achieve an interference signal shield for the entire section of the conductive layer 5.

[0062] Of course, insulation is formed between the grounding layer 7 and the probes 6. For example, the aperture of the avoidance hole 73 is larger than the diameter of the probe 6, so that the grounding layer 7 and the probes 6 are isolated from each other. Another example is that an insulating material is provided on the hole wall of the avoidance hole 73, and the insulating material surrounds the probe 6.

[0063] As Figure 4 As shown, in some embodiments of the present invention, the thin film probe card structure further includes a carrying mechanism 8. The carrying mechanism 8 is located below the side of the flexible film 2, and the carrying mechanism 8 is attached to the bottom surface of the side of the flexible film 2. The carrying mechanism 8 is fixedly connected to the connecting member 1.

[0064] Specifically, the carrying mechanism 8 is connected to the connecting member 1 through fixing members 3 (such as a first fixing member 31 and a second fixing member 32), and the carrying mechanism 8 is located below the connecting member 1. The carrying mechanism 8 can appropriately press or support the side of the flexible film 2, so that the side of the flexible film 2 remains flat. On the one hand, it is convenient for the first fixing member 31 and the second fixing member 32 to tension and fix the side of the flexible film 2. On the other hand, it prevents the side of the flexible film 2 from bending and deforming under its own weight.

[0065] In some embodiments, the carrying mechanism 8 can be connected to the connecting member 1 through devices such as fasteners or clamping members, so that the flexible film 2 is detachable.

[0066] In some embodiments, the carrying mechanism 8 can be a frame structure or a hollow shell structure connected by a plurality of rods, and the present invention does not make any limitations.

[0067] As Figure 4As shown, in some embodiments of the present invention, the carrier mechanism 8 includes a carrier base 81. The top surface of the carrier base 81 is attached to the bottom surface of the side portion of the flexible film 2. The carrier base 81 is fixedly connected to the connecting member 1 through a fixing member 3, and the fixing member 3 extends to the middle of the carrier base 81 in its thickness direction.

[0068] Specifically, the carrier base 81 is connected to the connecting member 1 through a fixing member 3 (such as a first fixing member 31 and a second fixing member 32), and the carrier base 81 is located below the connecting member 1. The top surface of the carrier base 81 is a flat surface, which is convenient for pressing or supporting the side portion of the flexible film 2.

[0069] In some embodiments, the connection between the fixing member 3 and the carrier base 81 can be achieved by means such as threaded connection or interference fit, so that the flexible film 2 is convenient for disassembly. Of course, other connection forms can also be adopted between the fixing member 3 and the carrier base 81, and the present invention does not make a limitation.

[0070] As Figure 4 shown, in some embodiments of the present invention, an installation groove is provided at the top of the carrier base 81. An elastic member 82 is provided in the installation groove. The elastic member 82 is located directly below the conductive member 4. The top surface of the elastic member 82 contacts the bottom surface of the side portion of the flexible film 2, and the elastic member 82 can apply an elastic force to the side portion of the flexible film 2 to make the side portion of the conductive layer 5 in close contact with the conductive member 4.

[0071] Specifically, the elastic member 82 installed in the installation groove is in a compressed state, and the top surface of the elastic member 82 is flush with the top surface of the carrier base 81 to prevent a gap from being generated between the carrier base 81 and the side portion of the flexible film 2. The elastic member 82 can apply an elastic force to the side portion of the flexible film 2, so that the side portion of the conductive layer 5 is in close contact with the conductive member 4, and further, a gapless contact is maintained between the side portion of the conductive layer 5 and the conductive member 4.

[0072] In some embodiments, the elastic member 82 can be an elastic plastic part, rubber part or metal part, etc. For example, it can be a solid plastic block, a hollow rubber block or a spiral spring, etc., and the present invention does not make a limitation. In some embodiments, when the elastic member 82 is a metal part, the part of the elastic member 82 in contact with the flexible film 2 also has an insulating layer.

[0073] In some embodiments, as Figure 4 shown, the top surface of the carrier base 81 is attached to the bottom surface of the first extension portion 71 of the ground layer 7.

[0074] In some embodiments, as Figure 4 shown, the top surface of the elastic member 82 contacts the bottom surface of the first extension portion 71 of the ground layer 7.

[0075] In this article, specific examples are used to elaborate on the principles and implementation modes of the present invention. The description of the above examples is only for helping to understand the method of the present invention and its core idea. The above is only the preferred implementation mode of the present invention. It should be noted that due to the limited nature of literal expression and objectively infinite specific structures, for those of ordinary skill in the art in this technical field, without departing from the principle of the present invention, several improvements, retouches or changes can also be made, and the above technical features can also be combined in an appropriate manner; these improvements, retouches, changes or combinations, or directly applying the concept and technical solution of the present invention to other occasions without improvement, shall all be regarded as the protection scope of the present invention.

Claims

1. A thin film probe card structure, characterized in that, It includes a connecting member (1), a flexible film (2), a fixing member (3), a conductive member (4), a conductive layer (5), and a plurality of probes (6); The side portion of the flexible film (2) is attached to the bottom surface of the connecting member (1) through the fixing member (3). The conductive layer (5) is disposed on the top surface of the flexible film (2). The conductive member (4) is mounted on the connecting member (1) and is located above the side portion of the flexible film (2). The side portion of the conductive layer (5) is located between the conductive member (4) and the flexible film (2). The side portion of the conductive layer (5) is in non-gap contact and electrically connected with the conductive member (4). A plurality of the probes (6) are spaced and mounted on the bottom surface of the middle portion of the flexible film (2), and the probes (6) are electrically connected with the conductive layer (5).

2. The thin film probe card structure according to claim 1, wherein The conductive member (4) has an outer side edge, the outer side edge faces away from the middle portion of the flexible film (2), the plane where the outer side edge is located is a signal boundary (41), and the distribution range of the conductive layer (5) does not exceed the signal boundary (41).

3. The thin film probe card structure according to claim 1, wherein, The conductive layer (5) extends along the extending direction of the flexible film (2) and is attached to the top surface of the flexible film (2).

4. The structure of the thin film probe card according to claim 3, wherein The top surface of the side portion of the conductive layer (5) is attached to the bottom surface of the conductive member (4).

5. The structure of the thin film probe card according to claim 1, wherein, The conductive layer (5) is a conductive trace of the flexible film (2).

6. The thin film probe card structure according to claim 1, characterized in that, The fixing member (3) passes through the flexible film (2), and the fixing member (3) fixes the flexible film (2) to the bottom surface of the connecting member (1) in a locking or welding manner.

7. The thin film probe card structure according to claim 1, wherein The fixing member (3) is isolated or insulated from the conductive layer (5).

8. The thin film probe card structure according to claim 1, wherein, The connecting member (1) has a first connection side portion (11) and a second connection side portion (12). The first connection side portion (11) faces the middle portion of the flexible film (2), the second connection side portion (12) faces away from the middle portion of the flexible film (2). The conductive member (4) is located between the first connection side portion (11) and the second connection side portion (12). At least one fixing member (3) is respectively provided on the first connection side portion (11) and the second connection side portion (12), and the fixing member (3) provided on the first connection side portion (11) and the fixing member (3) provided on the second connection side portion (12) are configured to tension and fix the side portion of the flexible film (2).

9. The thin film probe card structure according to claim 8, wherein, The distance between the conductive member (4) and the fixing member (3) on the first connection side portion (11) is a first distance, the distance between the conductive member (4) and the fixing member (3) on the second connection side portion (12) is a second distance, and the first distance is greater than the second distance; and / or, the diameter of the fixing member (3) on the first connection side portion (11) is greater than the diameter of the fixing member (3) on the second connection side portion (12).

10. The thin film probe card structure according to any one of claims 1-9, characterized in that, The bottom surface of the flexible film (2) is provided with a ground layer (7) for shielding interference signals.

11. The thin film probe card structure according to claim 10, wherein, The grounding layer (7) is attached to the bottom surface of the flexible film (2) and extends along the extending direction of the flexible film (2).

12. The thin film probe card structure according to claim 11, wherein, The grounding layer (7) includes a first extension portion (71), and the first extension portion (71) extends from the middle edge of the flexible film (2) to the side portion of the flexible film (2).

13. The thin film probe card structure according to claim 12, characterized in that, The grounding layer (7) includes a second extension portion (72), and the second extension portion (72) extends in the middle of the flexible film (2). The second extension portion (72) is provided with a plurality of avoidance holes (73) extending therethrough. A plurality of the probes (6) respectively pass through the plurality of avoidance holes (73), and the second extension portion (72) is electrically connected to the first extension portion (71).

14. The thin film probe card structure according to claim 1, wherein, The film probe card structure further includes a carrying mechanism (8). The carrying mechanism (8) is located below the side portion of the flexible film (2), and the carrying mechanism (8) is attached to the bottom surface of the side portion of the flexible film (2). The carrying mechanism (8) is fixedly connected to the connecting member (1).

15. The structure of the thin film probe card according to claim 14, wherein, The carrying mechanism (8) includes a carrying seat (81). The top surface of the carrying seat (81) is attached to the bottom surface of the side portion of the flexible film (2). The carrying seat (81) is fixedly connected to the connecting member (1) through the fixing member (3), and the fixing member (3) extends to the middle of the carrying seat (81) in its thickness direction.

16. The structure of the thin film probe card according to claim 15, wherein An installation groove is provided at the top of the carrying seat (81). An elastic member (82) is provided in the installation groove. The elastic member (82) is located directly below the conductive member (4). The top surface of the elastic member (82) contacts the bottom surface of the side portion of the flexible film (2), and the elastic member (82) can apply an elastic force to the side portion of the flexible film (2) to make the side portion of the conductive layer (5) and the conductive member (4) fit tightly together.

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