DDR4 chip test method, electronic equipment and storage medium

Abstract

The invention discloses a DDR4 chip testing method, electronic equipment and a storage medium, and relates to the technical field of chip testing. The method comprises the steps that a moving mechanism drives each mechanical arm to grab two DDR4 chips to be tested and move the DDR4 chips to the position above a pressing device; the moving mechanism drives each mechanical arm to descend, so that the mechanical arm downwards presses one side of the press-fit sheet, and after the other side of the press-fit sheet is lifted, the mechanical arm places the DDR4 chip in the mounting cavity; the moving mechanism drives each mechanical arm to ascend, so that the mechanical arms release one side of the press-fit sheet, the other side of the press-fit sheet presses downwards, the DDR4 chip is fixed, and the DDR4 chip is connected with the conductive column; the test mother board drives the test daughter board to test the DDR4 chip to obtain a test result; and the test mother board sends a test result to the upper computer through the communication board. According to the method provided by the embodiment of the invention, the DDR4 chip is more convenient to mount and dismount, and the test efficiency can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip testing, and in particular to a DDR4 chip testing method, an electronic device, and a storage medium. Background Art

[0002] DDR4, namely Double Data Rate 4th Generation Synchronous Dynamic Random Access Memory, is the fourth-generation double data rate synchronous dynamic random access memory and is a high-speed computer memory specification. Compared with its predecessor DDR3, DDR4 has significant improvements in terms of speed, power consumption, capacity, etc. During the production process of DDR4 chips, it is necessary to test them to verify whether their various functions are normal. In the prior art, when testing DDR4 chips, the DDR4 chips are usually soldered to a test circuit board, and the chips are tested through the test circuit board. However, in this way, when testing, the DDR4 chips need to be soldered to the test circuit board, and the installation and disassembly of the DDR4 chips are inconvenient, the test efficiency is low, and batch testing of DDR4 chips cannot be achieved. Summary of the Invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. For this purpose, the present invention provides a DDR4 chip testing method, an electronic device, and a storage medium, which can improve the testing efficiency of DDR4 chips.

[0004] In a first aspect, a DDR4 chip testing method according to an embodiment of the present invention is applied to a DDR4 chip testing system. The DDR4 chip testing system includes a test machine platform. A plurality of test tracks are arranged side by side in the test machine platform. Each test track is provided with a test mother board. A plurality of test daughter boards are arranged on the test mother board. Each test daughter board is provided with two installation areas. Each installation area is provided with a pressing device. The pressing device is provided with an installation chamber. A conductive adhesive is arranged in the installation chamber. The conductive adhesive is provided with an elastic insulating layer and a plurality of conductive columns penetrating through the elastic insulating layer. Pressing sheets are hinged on both sides of the installation chamber. A moving mechanism and a plurality of robotic arms are further arranged in the test machine platform. The robotic arms are arranged on the moving mechanism. The robotic arms correspond to the test tracks one by one;

[0005] The method includes:

[0006] The moving mechanism drives each robotic arm to grab two DDR4 chips to be tested and move them above the pressing device;

[0007] The moving mechanism drives each robotic arm to descend, causing the robotic arm to press one side of the pressing piece, and after the other side of the pressing piece is lifted, the robotic arm places the DDR4 chip in the installation chamber;

[0008] The moving mechanism drives each robotic arm to ascend, causing the robotic arm to release one side of the pressing piece, and the other side of the pressing piece presses down to fix the DDR4 chip, enabling the DDR4 chip to be connected to the conductive post;

[0009] The test motherboard drives the test daughter board to test the DDR4 chip to obtain test results;

[0010] The test motherboard sends the test results to the host computer through the communication board.

[0011] According to some embodiments of the present invention, the test motherboard includes:

[0012] A main control module;

[0013] A relay module, electrically connected to the main control module and the test daughter board respectively, and the main control module controls the power on and off of the test daughter board through the relay module;

[0014] A current sampling module, electrically connected to the main control module and the test daughter board respectively, and the main control module controls the current sampling module to sample the current of the DDR4 chip;

[0015] A display module, electrically connected to the main control module, and the main control module drives the display screen through the display module to display the test results on the display screen;

[0016] A first power module for supplying power to the test motherboard;

[0017] A first interface module, and the test motherboard is electrically connected to the test daughter board and the communication board through the first interface module.

[0018] According to some embodiments of the present invention, the test daughter board includes:

[0019] An S905X4 control module for testing the DDR4 chip to obtain test results;

[0020] A data storage module, electrically connected to the S905X4 control module;

[0021] A second power module for supplying power to the test daughter board;

[0022] A second interface module, and the test daughter board is electrically connected to the test motherboard through the second interface module.

[0023] According to some embodiments of the present invention, the communication board includes:

[0024] MCU control module;

[0025] Network interface module, electrically connected to the MCU control module, the network interface module is used for converting network port communication and SPI communication, and the communication board is connected to the host computer through the network interface module;

[0026] The third power supply module is used to supply power to the communication board;

[0027] The third interface module, and the communication board is electrically connected to the test mother board through the third interface module.

[0028] According to some embodiments of the present invention, the pressing device includes a positioning block and a pressing block. The positioning block is arranged in the installation area, the installation chamber and the conductive adhesive are arranged on the positioning block, the conductive column corresponds to the test pin of the DDR4 chip, the pressing block is arranged on the positioning block, the pressing block is provided with a through hole communicating with the installation chamber, notches are arranged on both sides of the through hole, hinge rods are arranged in the notches, the pressing sheet includes a pressing part and a pressing part, the hinge rod passes through the connection part of the pressing part and the pressing part, in the normal state, the pressing part is in a state of inclining downward, when the pressing part is pressed downward, the pressing part is lifted, and when the pressing part is released, the pressing part is pressed downward.

[0029] According to some embodiments of the present invention, the robotic arm includes two liftable chip suction cups arranged at intervals, and pressing blocks are arranged on both sides of each chip suction cup, and the pressing blocks protrude downward from the surface of the chip suction cup; the moving mechanism drives each robotic arm to descend, so that the robotic arm presses one side of the pressing sheet, after the other side of the pressing sheet is lifted, the step of the robotic arm placing the DDR4 chip in the installation chamber includes:

[0030] The moving mechanism drives the robotic arm to descend, so that the pressing block of the robotic arm presses the pressing part of the pressing sheet, and the pressing part is lifted;

[0031] After the pressing part is lifted, the chip suction cup descends to place the DDR4 chip in the installation chamber;

[0032] The chip suction cup rises and resets.

[0033] According to some embodiments of the present invention, the pressing device is further provided with an adjusting mechanism. The adjusting mechanism includes an adjusting rod and an adjusting block connected to the adjusting rod. The adjusting block is disposed on the surface of the pressing block. The adjusting block is provided with a threaded post, and the pressing block is provided with a threaded hole. The threaded post is in threaded connection with the threaded hole, and the adjusting block is connected to the adjusting rod through the threaded post. An indicating arrow is provided on the adjusting block, and scale lines are provided on the surface of the pressing block. The method further includes:

[0034] Obtain the thickness of the DDR4 chip;

[0035] According to the thickness of the DDR4 chip, rotate the adjusting block to make the indicating arrow point to the corresponding scale line to adjust the height of the adjusting rod;

[0036] When the moving mechanism drives each robotic arm to rise and the pressing block of the robotic arm leaves the pressing portion, the pressing portion rebounds to the adjusting rod, and the pressing portion presses the DDR4 chip.

[0037] According to some embodiments of the present invention, a loading conveyor belt is provided on one side of the testing machine table, an unloading conveyor belt is provided on the other side of the testing machine table, a transfer conveyor belt is provided on the testing machine table, and a plurality of telescopic blocking rods are provided on the transfer conveyor belt. Each blocking rod corresponds to one testing track;

[0038] The DDR4 chip testing method further includes:

[0039] The loading conveyor belt conveys the chip tray to the transfer conveyor belt; a plurality of mounting grooves are provided on the chip tray, and each mounting groove houses a DDR4 chip to be tested. A corresponding indicator light is provided on one side of each mounting groove;

[0040] When the transfer conveyor belt moves the chip tray to one side of the corresponding testing track, the blocking rod extends to block the chip tray from moving forward, the transfer conveyor belt stops running, and the blocking rod resets;

[0041] After all the DDR4 chips on the chip tray are grabbed by the robotic arm and tested, the transfer conveyor belt runs to transfer the chip tray to the unloading conveyor belt;

[0042] When there is a DDR4 chip that fails the test, the indicator light of the corresponding mounting groove lights up.

[0043] In a second aspect, an electronic device according to an embodiment of the present invention includes:

[0044] A memory for storing program instructions;

[0045] A processor, configured to call program instructions stored in the memory and execute the DDR4 chip testing method described in the embodiment of the first aspect according to the obtained program instructions.

[0046] In a third aspect, according to an embodiment of the present invention, a storage medium stores computer-executable instructions, and the computer-executable instructions are used to cause a computer to execute the DDR4 chip testing method described in the embodiment of the first aspect.

[0047] The DDR4 chip testing method, electronic device, and storage medium according to the embodiments of the present invention have at least the following beneficial effects: The robotic arm can grab two DDR4 chips simultaneously each time, place them in the pressing device, and realize the connection with the test daughter board. At the same time, each test mother board is connected to multiple test daughter boards, and the test mother board can control the test processes of multiple test daughter boards simultaneously, thereby improving the test efficiency; the robotic arm can directly grab the DDR4 chip and place it in the pressing device, and fix the DDR4 chip with the help of the pressing device, without fixing the DDR4 chip on the test daughter board by means such as welding, making the placement and disassembly of the DDR4 chip more convenient and further improving the test efficiency.

[0048] The additional aspects and advantages of the present invention will be partly given in the following description, partly will become obvious from the following description, or will be understood through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] The above and / or additional aspects and advantages of the present invention will become obvious and easy to understand from the description of the embodiments in conjunction with the following drawings, wherein:

[0050] Figure 1 is a flowchart of the steps of the DDR4 chip testing method according to an embodiment of the present invention;

[0051] Figure 2 is a schematic structural diagram of a test machine according to an embodiment of the present invention;

[0052] Figure 3 is a schematic structural diagram of a test mother board and a test daughter board according to an embodiment of the present invention;

[0053] Figure 4 is a schematic structural diagram of a pressing device according to an embodiment of the present invention;

[0054] Figure 5 is a schematic structural diagram of a moving mechanism and a robotic arm according to an embodiment of the present invention;

[0055] Figure 6 is a circuit schematic diagram of a main control module according to an embodiment of the present invention;

[0056] Figure 7 Circuit schematic diagram of the relay module according to an embodiment of the present invention;

[0057] Figure 8 Circuit schematic diagram of the current sampling module according to an embodiment of the present invention;

[0058] Figure 9 Circuit schematic diagram of the display module according to an embodiment of the present invention;

[0059] Figure 10 Circuit schematic diagram of the first interface module according to an embodiment of the present invention;

[0060] Figures 11 to 14 Circuit schematic diagram of the S905X4 control module according to an embodiment of the present invention;

[0061] Figure 15 Circuit schematic diagram of the data storage module according to an embodiment of the present invention;

[0062] Figure 16 Circuit schematic diagram of the DDR4 module according to an embodiment of the present invention;

[0063] Figure 17 Circuit schematic diagram of the second interface module according to an embodiment of the present invention;

[0064] Figure 18 Circuit schematic diagram of the MCU control module according to an embodiment of the present invention;

[0065] Figure 19 Circuit schematic diagram of the network interface module according to an embodiment of the present invention;

[0066] Figure 20 Circuit schematic diagram of the third power supply module according to an embodiment of the present invention;

[0067] Figure 21 Circuit schematic diagram of the third interface module according to an embodiment of the present invention. Detailed implementation manners

[0068] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present application, and should not be construed as a limitation to the present application. For the step numbers in the following embodiments, they are only set for the convenience of explanation and illustration, and no limitation is imposed on the order between the steps. The execution order of each step in the embodiments can be adaptively adjusted according to the understanding of those skilled in the art.

[0069] In the description of the present invention, it should be understood that with respect to the orientation description, such as the orientations or positional relationships indicated by up, down, front, back, left, right, etc., they are based on the orientations or positional relationships shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention.

[0070] The terms "first", "second", "third", "fourth", etc. in the specification, claims and drawings of the present invention are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally further includes steps or units not listed, or optionally further includes other steps or units inherent to these processes, methods, products or devices.

[0071] Referring to "embodiments" in the present invention means that the specific features, structures or characteristics described in connection with the embodiments can be included in at least one embodiment of the present invention. The occurrence of this phrase at various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0072] In the production process of DDR4 chips, it is necessary to test them to verify whether their various functions are normal. In the prior art, when testing DDR4 chips, usually the DDR4 chips are soldered on a test circuit board, and the chips are tested through the test circuit board. However, in this way, when testing, the DDR4 chips need to be soldered on the test circuit board, and the installation and disassembly of the DDR4 chips are inconvenient, the test efficiency is low, and batch testing of the DDR4 chips cannot be achieved.

[0073] For this reason, the embodiments of the present invention provide a DDR4 chip testing method, an electronic device, and a storage medium. Each time the robotic arm can simultaneously grab two DDR4 chips and place them in a pressing device to achieve connection with a test daughter board. At the same time, each test mother board is connected to multiple test daughter boards, and the test mother board can simultaneously control the test processes of multiple test daughter boards, thereby improving the test efficiency; the robotic arm can directly grab the DDR4 chips and place them in the pressing device, and the pressing device is used to fix the DDR4 chips, without using methods such as soldering to fix the DDR4 chips on the test daughter board, thereby making the placement and disassembly of the DDR4 chips more convenient and further improving the test efficiency.

[0074] The following will describe in detail the DDR4 chip testing method, electronic device, and storage medium according to the embodiments of the present invention with reference to the accompanying drawings.

[0075] On the one hand, an embodiment of the present invention provides a DDR4 chip testing system. As Figures 2 to 5 shown, the DDR4 chip testing system includes a testing machine platform 100. A plurality of testing tracks 110 are arranged side by side in the testing machine platform 100. At least one testing mother board 400 is placed on each testing track 110. A plurality of testing daughter boards 500 are provided on the testing mother board 400. Each testing daughter board 500 is provided with two mounting areas. Each mounting area is provided with a pressing device 600. The pressing device 600 is provided with a mounting chamber 630. A conductive adhesive 640 is arranged in the mounting chamber 630. The conductive adhesive 640 is provided with an elastic insulating layer 641 and a plurality of conductive columns 642 penetrating through the elastic insulating layer 641. Pressing sheets 670 are hinged on both sides of the mounting chamber 630. A moving mechanism 200 and a plurality of robotic arms 300 are further arranged in the testing machine platform 100. The moving mechanism 200 is located above the testing tracks 110. The robotic arms 300 are arranged on the moving mechanism 200. The robotic arms 300 correspond to the testing tracks 110 one by one.

[0076] Specifically, as Figure 3 shown, in this example, each testing mother board 400 can be provided with three (or other quantities) testing daughter boards 500. The testing daughter boards 500 are used to test the DDR4 chips. The testing mother board 400 is used to control the power on and off of the testing daughter boards 500 and obtain the test results of the testing daughter boards 500. At the same time, the testing mother board 400 is also connected to a communication board, and the communication board is connected to a host computer. After the testing mother board 400 obtains the test results, it sends the test results to the host computer through the communication board, so that the customer can obtain the test results. As Figure 3 and Figure 4As shown, on the test daughter board 500, a test circuit and two installation areas are provided. Each installation area is provided with a pressing device 600. Among them, an installation chamber 630 is provided inside the pressing device 600, and the installation chamber 630 is used to place the DDR4 chip. Inside the installation chamber 630, a conductive adhesive 640 is provided. The conductive adhesive 640 is provided with an elastic insulating layer 641 and a plurality of conductive posts 642 penetrating through the elastic insulating layer 641. When the DDR4 chip is placed in the installation chamber 630, each test pin of the DDR4 chip is connected to the corresponding conductive post 642, and the DDR4 chip is connected to the test circuit on the test daughter board 500 through the conductive posts 642, enabling the test daughter board 500 to test the DDR4 chip. At the same time, in order to ensure the stable connection between the DDR4 chip and the conductive adhesive 640, after the DDR4 chip is placed in the installation chamber 630, it is also necessary to press the DDR4 chip tightly through the pressing sheet 670 to ensure the normal connection between the DDR4 chip and the conductive adhesive 640. The elastic insulating layer 641 plays a role in buffering and protecting the DDR4 chip, preventing the DDR4 chip from being damaged by the pressing sheet 670.

[0077] As Figure 4 shown, in this example, the pressing device 600 includes a positioning block 610 and a pressing block 620. The positioning block 610 is arranged in the installation area, and the positioning block 610 is provided with an installation chamber 630 and a conductive adhesive 640. The pressing block 620 is arranged on the positioning block 610. The pressing block 620 is provided with a through hole 650 communicating with the installation chamber 630. Notches 660 are arranged on both sides of the through hole 650, and hinge rods 653 are arranged in the notches 660. The pressing sheet 670 includes a pressing part 672 and a pressing portion 671. The hinge rod 653 passes through the connection between the pressing part 672 and the pressing portion 671. In the normal state, the pressing portion 671 is in an inclined downward state. When the pressing part 672 is pressed downward, the pressing portion 671 is lifted. When the pressing part 672 is released, the pressing portion 671 is pressed downward. When the DDR4 chip is to be placed into the installation chamber 630, in order to prevent the pressing sheet 670 from interfering with the placement of the DDR4 chip, it is necessary to press the pressing part 672 to lift the pressing portion 671, leaving a space for placing the DDR4 chip in the installation chamber 630. After the DDR4 chip is placed, the pressing part 672 is released to press the DDR4 chip tightly.

[0078] As Figure 5As shown, in this example, the robotic arm 300 includes two vertically movable chip suction cups 310 arranged at intervals. On both sides of each chip suction cup 310, there are pressing blocks 320, and the pressing blocks 320 protrude downward from the surface of the chip suction cup 310. The moving mechanism 200 is used to drive the robotic arm 300 to move in the XYZ-axis directions. The moving mechanism 200 can drive the robotic arm 300 to move to the chip tray 700. After the robotic arm 300 descends to a certain extent, the chip suction cup 310 continues to descend to pick up the DDR4 chips to be tested from the chip tray 700. Then the chip suction cup 310 resets, and the robotic arm 300 resets. After the moving mechanism 200 drives the robotic arm 300 to move above the pressing device 600, it then drives the robotic arm 300 to descend, so that the pressing block 320 presses down on the pressing part 672, thereby causing the pressing part 671 to lift up. The chip suction cup 310 descends to place the DDR4 chips in the installation chamber 630. Then, the chip suction cup 310 resets, and the robotic arm 300 resets. Since the robotic arm is provided with two chip suction cups 310, two DDR4 chips can be simultaneously picked up each time and placed in two pressing devices 600 of the same test sub-board 500, thereby improving the test efficiency. After all the DDR4 chips are placed and pressed on the test sub-boards 500, the test motherboard 400 controls the test sub-boards 500 to test the DDR4 chips, obtains the test results, and sends the test results to the host computer through the communication board.

[0079] As Figure 4As shown, in some embodiments of the present application, the pressing device 600 is further provided with an adjusting mechanism. The adjusting mechanism includes an adjusting rod 682 and an adjusting block 681 connected to the adjusting rod 682. The adjusting block 681 is disposed on the surface of the pressing block 620. The adjusting block 681 is provided with a threaded post, and the pressing block 620 is provided with a threaded hole. The threaded post is threadedly connected to the threaded hole, and the adjusting block 681 is connected to the adjusting rod 682 through the threaded post. An indicating arrow is provided on the adjusting block 681, and scale lines are provided on the surface of the pressing block 620. Before placing the DDR4 chip, first determine its thickness, and then rotate the adjusting block 681 according to the thickness of the DDR4 chip to adjust the height of the adjusting block 681. It should be noted that the adjusting block 681 is used to set the initial position of the pressing portion 672. The lower the height of the adjusting block 681, the lower the height that the pressing portion 672 can rebound when the robotic arm 300 releases the pressing portion 672, and the smaller the degree that the pressing portion 671 can press down; the higher the height of the adjusting block 681, the higher the height that the pressing portion 672 can rebound when the robotic arm 300 releases the pressing portion 672, and the greater the degree that the pressing portion 671 can press down. Therefore, when the thickness of the DDR4 chip is relatively large, in order to avoid damaging the DDR4 chip due to the large pressing degree of the pressing portion 671, it is necessary to lower the height of the adjusting rod 682; when the thickness of the DDR4 chip is relatively small, it is necessary to increase the height of the adjusting rod 682 so that the pressing portion 671 can press the DDR4 chip. At the same time, an indicating arrow is provided on the adjusting block 681, and scale lines are provided on the surface of the pressing block 620. Through the scale line pointed by the indicating arrow, the degree of adjustment can be visually determined to ensure that the height of the adjusting rod 682 meets the requirements.

[0080] In some embodiments of the present application, a loading conveyor belt is provided on one side of the testing machine 100, an unloading conveyor belt is provided on the other side of the testing machine 100, and the testing machine 100 is provided with a transfer conveyor belt. A number of retractable stop bars are provided on the transfer conveyor belt, and each stop bar corresponds to a testing track 110. Among them, the loading conveyor belt is used to convey the chip tray 700 to the transfer conveyor belt. Multiple mounting grooves are provided on the chip tray, and each mounting groove contains a DDR4 chip to be tested. A corresponding indicator light is provided on one side of each mounting groove; when the transfer conveyor belt is used to move the chip tray 700 to one side of the corresponding testing track 110, the stop bar extends to block the chip tray 700 from moving forward, the transfer conveyor belt stops running, and the stop bar resets; after the robotic arm 300 grabs all the DDR4 chips on the chip tray 700 and completes the test, the transfer conveyor belt runs to transfer the chip tray 700 to the unloading conveyor belt; when there is a DDR4 chip that fails the test, the indicator light of the corresponding mounting groove lights up, so that the user can visually see the DDR4 chip that fails the test.

[0081] In some embodiments of the present application, the circuit design on the test motherboard 400 is as follows Figures 6 to 10 shown. The test motherboard includes a main control module 410, a relay module 420, a current sampling module 430, a display module 440, a first power module (not shown in the figure), and a first interface module 450. Among them, the relay module 420 is electrically connected to the main control module 410 and the test daughter board 500 respectively. The main control module 410 controls the power on and off of the test daughter board 500 through the relay module 420. The current sampling module 430 is electrically connected to the main control module 410 and the test daughter board 500 respectively. The main control module 410 controls the current sampling module 430 to sample the current of the DDR4 chip. The display module 440 is electrically connected to the main control module 410. The main control module 410 drives the display screen through the display module 440 to display the test results on the display screen. The first power module is used to supply power to the test motherboard 400. The test motherboard 400 is electrically connected to the test daughter board 500 and the communication board through the first interface module 450. Among them, as Figure 6 shown, the main control module 410 includes an MCU chip U20 (models such as STM32F103RET6 can be used), which is the control center of the test motherboard 400, controls the power on situation of the test daughter board 500, and performs data communication and data processing. The relay module 420 adopts a mechanical structure and is controlled by the main control module 410 to be turned on and off to realize the power on and off of the test daughter board 500. The current sampling module 430 uses a high-precision sampling chip to sample the current of the DDR4 chip when testing the DDR4 chip. The display module 440 is used to drive the display screen for display. The first power module is used to provide power for the entire test motherboard 400. As Figure 10 shown, the first interface module 450 uses a connector J8 to connect to the communication board and a connector J12 to connect to the test daughter board 500.

[0082] In some embodiments of the present application, the circuit design of the test daughter board 500 is as follows Figures 11 to 17 shown. The test daughter board 500 includes an S905X4 control module, a data storage module, a second power module, and a second interface module. The circuit design of the S905X4 control module is as Figures 11 to 14 shown. The S905X4 control module is composed of an S905X4 chip and is the control center of the entire test daughter board 500, used to test the DDR4 chip and obtain test results. The data storage module is electrically connected to the S905X4 control module. The circuit design of the data storage module is as Figure 15 shown. The data storage module is composed of an EMMC chip and is the data storage module of the entire test daughter board 500. The second power module data is used to supply power to the entire test daughter board 500. The circuit design of the second interface module is as Figure 17 shown. The test daughter board 500 is electrically connected to the test motherboard 400 through the second interface module.Figure 16 It is a DDR4 module, used to connect to a DDR4 chip and test the DDR4 chip.

[0083] In some embodiments of the present application, the circuit design of the communication board is as Figures 18 to 21 shown. The communication board includes: an MCU control module, a network interface module, a third power module, and a third interface module. Among them, the circuit design of the MCU control module is as Figure 18 shown, which includes an MCU chip U45 (models such as STM32F103RET6 can be used). The MCU control module is the control center of the communication board and is responsible for processing communication data; the circuit design of the network interface module is as Figure 19 shown. The network interface module is electrically connected to the MCU control module. The network interface module is used for the conversion between network interface communication and SPI communication. The communication board is connected to the host computer through the network interface module; the circuit design of the third power module is as Figure 20 shown, and is used to supply power to the communication board; the circuit design of the third interface module is as Figure 21 shown. The communication board is electrically connected to the test motherboard 400 through the third interface module.

[0084] On the other hand, based on the above DDR4 chip test system, an embodiment of the present invention proposes a DDR4 chip test method, as Figure 1 shown. The method includes the following steps:

[0085] Step S100: The moving mechanism 200 drives each robotic arm 300 to grab two DDR4 chips to be tested and move them above the pressing device 600;

[0086] Specifically, as Figure 5 shown. In this example, the robotic arm 300 includes two liftable chip suction cups 310 arranged at intervals. On both sides of each chip suction cup 310, there are pressing blocks 320, and the pressing blocks 320 protrude downward from the surface of the chip suction cup 310. The moving mechanism 200 is used to drive the robotic arm 300 to move in the XYZ axis directions. The moving mechanism 200 can drive the robotic arm 300 to move to the chip tray 700. After the robotic arm 300 descends to a certain extent, the chip suction cup 310 continues to descend to grab the DDR4 chip to be tested from the chip tray 700, then the chip suction cup 310 resets, the robotic arm 300 resets, and the moving mechanism 200 drives the robotic arm 300 to move above the pressing device 600.

[0087] Step S200: The moving mechanism 200 drives each robotic arm 300 to descend, so that one side of the pressing piece 670 is pressed down by the robotic arm 300, and after the other side of the pressing piece 670 is lifted, the robotic arm 300 places the DDR4 chip in the installation chamber 630;

[0088] Specifically, asFigure 4 As shown in the figure, in this example, the pressing device 600 includes a positioning block 610 and a pressing block 620. The positioning block 610 is disposed in the installation area, and the positioning block 610 is provided with an installation chamber 630 and a conductive adhesive 640. The pressing block 620 is disposed on the positioning block 610. The pressing block 620 is provided with a through hole 650 communicating with the installation chamber 630. Both sides of the through hole 650 are provided with notches 660, and a hinge rod 653 is disposed in the notches 660. The pressing sheet 670 includes a pressing portion 672 and a pressing portion 671. The hinge rod 653 passes through the connection between the pressing portion 672 and the pressing portion 671. In the normal state, the pressing portion 671 is in a state of inclining downward. When the pressing portion 672 is pressed downward, the pressing portion 671 is lifted. When the pressing portion 672 is released, the pressing portion 671 is pressed downward. The above step S200 specifically includes the following steps:

[0089] Step S210: The moving mechanism 200 drives the robotic arm 300 to descend, so that the pressing block 320 of the robotic arm 300 presses the pressing portion 672 of the pressing sheet 670, and the pressing portion 671 is lifted;

[0090] Step S220: After the pressing portion 671 is lifted, the chip suction cup 310 descends to place the DDR4 chip in the installation chamber 630;

[0091] Step S230: The chip suction cup 310 rises and resets, and the moving mechanism 200 drives the robotic arm 300 to rise, so that the pressing block 320 of the robotic arm 300 leaves the pressing portion 672, and the pressing portion 671 is pressed downward to fix the DDR4 chip.

[0092] Specifically, when the robotic arm 300 is located above the pressing device 600, the robotic arm 300 is driven to descend, so that the pressing block 320 presses the pressing portion 672 downward, and then the pressing portion 671 is lifted. The chip suction cup 310 descends to place the DDR4 chip in the installation chamber 630, and then the chip suction cup 310 resets.

[0093] Step S300: The moving mechanism 200 drives each robotic arm 300 to rise, so that the robotic arm 300 releases one side of the pressing sheet 670, and the other side of the pressing sheet 670 is pressed downward to fix the DDR4 chip and connect the DDR4 chip to the conductive column 642;

[0094] Specifically, after the chip suction cup 310 places the DDR4 chip in the installation chamber 630 and resets, the robotic arm 300 rises and resets, thereby releasing the pressing portion 672, so that the pressing portion 671 is pressed downward to press the DDR4 chip. Since the robotic arm is provided with two chip suction cups 310, two DDR4 chips can be simultaneously sucked each time and placed in two pressing devices 600 of the same test sub-board 500, thereby improving the test efficiency.

[0095] Step S400: The test motherboard 400 drives the test daughter board 500 to test the DDR4 chips and obtains the test results;

[0096] Step S500: The test motherboard 500 sends the test results to the host computer through the communication board.

[0097] According to the DDR4 chip test method of the embodiments of the present invention, the robotic arm 300 can grasp two DDR4 chips simultaneously each time, place them in the pressing device 600 to achieve connection with the test daughter board 500. At the same time, each test motherboard 400 is connected to multiple test daughter boards 500, and the test motherboard 400 can control the test processes of multiple test daughter boards 500 simultaneously, thereby improving the test efficiency; the robotic arm 300 can directly grasp the DDR4 chips and place them in the pressing device 600, and fix the DDR4 chips with the help of the pressing device 600, without using welding or other methods to fix the DDR4 chips on the test daughter board 500, making the placement and disassembly of the DDR4 chips more convenient and further improving the test efficiency.

[0098] Further, as Figure 4 shown, in some embodiments of the present application, the pressing device 600 is further provided with an adjusting mechanism. The adjusting mechanism includes an adjusting rod 682 and an adjusting block 681 connected to the adjusting rod 682. The adjusting block 681 is arranged on the surface of the pressing block 620. The adjusting block 681 is provided with a threaded column, and the pressing block 620 is provided with a threaded hole. The threaded column is in threaded connection with the threaded hole, and the adjusting block 681 is connected to the adjusting rod 682 through the threaded column. An indicating arrow is arranged on the adjusting block 681, and scale lines are arranged on the surface of the pressing block 620. The DDR4 chip test method of the embodiments of the present application further includes the following steps:

[0099] Obtain the thickness of the DDR4 chip;

[0100] According to the thickness of the DDR4 chip, rotate the adjusting block 681 to make the indicating arrow point to the corresponding scale line to adjust the height of the adjusting rod 682;

[0101] When the moving mechanism 200 drives each robotic arm 300 to rise and the pressing block 320 of the robotic arm 300 leaves the pressing part 672, the pressing part 672 rebounds to the adjusting rod 682, and the pressing part 671 presses the DDR4 chip.

[0102] Before placing the DDR4 chip, first determine its thickness, and then rotate the adjusting block 681 according to the thickness of the DDR4 chip to adjust the height of the adjusting block 681. It should be noted that the adjusting block 681 is used to set the initial position of the pressing part 672. The lower the height of the adjusting block 681, the lower the height that the pressing part 672 can rebound when the robotic arm 300 releases the pressing part 672, and the smaller the degree that the pressing part 671 can press down; the higher the height of the adjusting block 681, the higher the height that the pressing part 672 can rebound when the robotic arm 300 releases the pressing part 672, and the greater the degree that the pressing part 671 can press down. Therefore, when the thickness of the DDR4 chip is relatively large, in order to avoid the pressing part 671 pressing down too much and damaging the DDR4 chip, it is necessary to lower the height of the adjusting rod 682; when the thickness of the DDR4 chip is relatively small, it is necessary to increase the height of the adjusting rod 682 so that the pressing part 671 can press the DDR4 chip. At the same time, an indicating arrow is provided on the adjusting block 681, and scale lines are provided on the surface of the pressing block 620. Through the scale line pointed to by the indicating arrow, the degree of adjustment can be visually determined to ensure that the height of the adjusting rod 682 meets the requirements.

[0103] In some embodiments of the present application, a loading conveyor belt is provided on one side of the testing machine platform 100, an unloading conveyor belt is provided on the other side of the testing machine platform 100, the testing machine platform 100 is provided with a transfer conveyor belt, and a plurality of telescopic stop bars are provided on the transfer conveyor belt, and each stop bar corresponds to a testing track 110. Among them, the loading conveyor belt is used to convey the chip tray 700 to the transfer conveyor belt. A plurality of mounting grooves are provided on the chip tray, and each mounting groove is provided with a DDR4 chip to be tested, and a corresponding indicator light is provided on one side of each mounting groove. The DDR4 chip testing method of the embodiments of the present application further includes the following steps:

[0104] The loading conveyor belt conveys the chip tray 700 to the transfer conveyor belt;

[0105] When the transfer conveyor belt moves the chip tray 700 to one side of the corresponding testing track 110, the stop bar extends to block the chip tray 700 from moving forward, the transfer conveyor belt stops running, and the stop bar resets;

[0106] After the robotic arm 300 grabs all the DDR4 chips on the chip tray 700 for testing, the transfer conveyor belt runs to transfer the chip tray 700 to the unloading conveyor belt;

[0107] When there is a DDR4 chip that fails the test, the indicator light of the corresponding mounting groove lights up.

[0108] Through the loading conveyor belt, transfer conveyor belt and unloading conveyor belt, the automatic loading and unloading of the chip tray 700 can be realized, thereby improving the testing efficiency of DDR4 chips; when there are DDR4 chips that fail the test, the indicator lights of the corresponding mounting slots are lit, so that users can intuitively see the DDR4 chips that fail the test.

[0109] On the other hand, an embodiment of the present invention also provides an electronic device, including:

[0110] A memory for storing program instructions;

[0111] A processor for calling the program instructions stored in the memory and executing the above-mentioned DDR4 chip testing method according to the obtained program instructions.

[0112] Among them, the processor can be implemented in the form of a general-purpose central processing unit (CPU), a microprocessor, an application-specific integrated circuit (ASIC), or one or more integrated circuits, etc., and is used to execute relevant programs to implement the technical solutions provided by the embodiments of the present application;

[0113] The memory can be implemented in the form of a read-only memory (ROM), a static storage device, a dynamic storage device, or a random access memory (RAM), etc. The memory can store an operating system and other application programs. When implementing the technical solutions provided by the embodiments of this specification through software or firmware, the relevant program codes are stored in the memory and are called by the processor to execute the gear shifting control method of the bicycle electronic transmission provided by the embodiments of the present application; the memory and the processor can be connected through a bus, etc.

[0114] On the other hand, an embodiment of the present invention also provides a storage medium, which is a computer-readable storage medium. The storage medium stores a computer program, and when the computer program is executed by a processor, the above-mentioned DDR4 chip testing method is implemented.

[0115] A memory, as a non-transitory computer-readable storage medium, can be used to store non-transitory software programs and non-transitory computer-executable programs. In addition, the memory may include high-speed random access memory, and may also include non-transitory memory, such as at least one magnetic disk storage device, a flash memory device, or other non-transitory solid-state storage devices. In some embodiments, the memory may optionally include memories remotely located relative to the processor, and these remote memories can be connected to the processor through a network. Examples of the above networks include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof. The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separated, and may be located in one place, or may be distributed to multiple network units. Some or all of the modules can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0116] Although specific embodiments are described herein, those of ordinary skill in the art will recognize that many other modifications or alternative embodiments are also within the scope of the present disclosure. For example, any one of the functions and / or processing capabilities described in connection with a particular device or component can be performed by any other device or component. Additionally, although various exemplary specific implementations and architectures have been described in accordance with embodiments of the present disclosure, those of ordinary skill in the art will recognize that many other modifications to the exemplary specific implementations and architectures described herein are also within the scope of the present disclosure.

[0117] Certain aspects of the present disclosure have been described above with reference to block diagrams and flowcharts of systems, methods, systems, and / or computer program products according to exemplary embodiments. It should be understood that one or more blocks in the block diagrams and flowcharts, and combinations of blocks in the block diagrams and flowcharts, can be implemented respectively by executing computer-executable program instructions. Similarly, according to some embodiments, some blocks in the block diagrams and flowcharts may not need to be executed in the order shown, or may not need to be executed at all. Additionally, additional components and / or operations beyond those shown in the blocks of the block diagrams and flowcharts may exist in certain embodiments.

[0118] Therefore, the blocks in the block diagrams and flowcharts support combinations of devices for performing the specified functions, combinations of elements or steps for performing the specified functions, and program instruction devices for performing the specified functions. It should also be understood that each block in the block diagrams and flowcharts, and combinations of blocks in the block diagrams and flowcharts, can be implemented by a dedicated hardware computer system that performs a specific function, element, or step, or a combination of dedicated hardware and computer instructions.

[0119] The program modules, applications, etc. described herein may include one or more software components, including, for example, software objects, methods, data structures, etc. Each such software component may include computer-executable instructions that, upon execution, cause at least a portion of the functions described herein (e.g., one or more operations of the exemplary methods described herein) to be performed.

[0120] The software components may be encoded in any of a variety of programming languages. An exemplary programming language may be a low-level programming language, such as an assembly language associated with a particular hardware architecture and / or operating system platform. Software components including assembly language instructions may need to be converted by an assembler into executable machine code before being executed by the hardware architecture and / or platform. Another exemplary programming language may be a higher-level programming language that may be portable across multiple architectures. Software components including higher-level programming languages may need to be converted by an interpreter or compiler into an intermediate representation before execution. Other examples of programming languages include, but are not limited to, macro languages, shell or command languages, job control languages, scripting languages, database query or search languages, or report writing languages. In one or more exemplary embodiments, a software component containing instructions in one of the above examples of programming languages may be executed directly by the operating system or other software components without first being converted into another form.

[0121] The software components may be stored as files or other data storage constructs. Software components having similar types or related functions may be stored together in, for example, a particular directory, folder, or library. The software components may be static (e.g., preset or fixed) or dynamic (e.g., created or modified at execution time).

[0122] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the scope of knowledge possessed by those of ordinary skill in the art.

Claims

1. A DDR4 chip testing method, characterized in that, Applied to a DDR4 chip test system, the DDR4 chip test system includes a test machine platform. Inside the test machine platform, a plurality of test tracks are arranged side by side. Each test track is provided with a test mother board. The test mother board is provided with a plurality of test daughter boards. Each test daughter board is provided with two installation areas. Each installation area is provided with a pressing device. The pressing device is provided with an installation chamber. Inside the installation chamber, there is a conductive adhesive. The conductive adhesive is provided with an elastic insulating layer and a plurality of conductive columns penetrating through the elastic insulating layer. On both sides of the installation chamber, pressing pieces are hingedly arranged. Inside the test machine platform, there is also a moving mechanism and a plurality of robotic arms. The robotic arms are arranged on the moving mechanism, and the robotic arms correspond to the test tracks one by one; The method includes: The moving mechanism drives each robotic arm to grab two DDR4 chips to be tested and move above the pressing device; The moving mechanism drives each robotic arm to descend, so that the robotic arm presses one side of the pressing piece. After the other side of the pressing piece is lifted, the robotic arm places the DDR4 chip in the installation chamber; The moving mechanism drives each robotic arm to rise, so that the robotic arm releases one side of the pressing piece, and the other side of the pressing piece presses down to fix the DDR4 chip, so that the DDR4 chip is connected to the conductive column; The test mother board drives the test daughter board to test the DDR4 chip to obtain a test result; The test mother board sends the test result to the host computer through the communication board.

2. The DDR4 chip testing method according to claim 1, characterized in that The test mother board includes: A main control module; A relay module, electrically connected to the main control module and the test daughter board respectively. The main control module controls the power on and off of the test daughter board through the relay module; A current sampling module, electrically connected to the main control module and the test daughter board respectively. The main control module controls the current sampling module to sample the current of the DDR4 chip; A display module, electrically connected to the main control module. The main control module drives a display screen through the display module to display the test result on the display screen; A first power supply module for supplying power to the test mother board; A first interface module. The test mother board is electrically connected to the test daughter board and the communication board through the first interface module.

3. The DDR4 chip testing method according to claim 1, characterized in that, The test daughter board includes: An S905X4 control module for testing the DDR4 chip to obtain a test result; A data storage module, electrically connected to the S905X4 control module; A second power supply module for supplying power to the test daughter board; A second interface module. The test daughter board is electrically connected to the test mother board through the second interface module.

4. The DDR4 chip testing method according to claim 1, characterized in that The communication board includes: An MCU control module; A network interface module, electrically connected to the MCU control module. The network interface module is used for the conversion between network communication and SPI communication. The communication board is connected to the host computer through the network interface module; A third power supply module for supplying power to the communication board; A third interface module. The communication board is electrically connected to the test mother board through the third interface module.

5. The DDR4 chip testing method according to claim 1, characterized in that The pressing device includes a positioning block and a pressing block. The positioning block is disposed in the installation area. The installation chamber and the conductive adhesive are arranged on the positioning block. The conductive column corresponds to the test pin of the DDR4 chip. The pressing block is disposed on the positioning block. The pressing block is provided with a through hole communicating with the installation chamber. Notches are arranged on both sides of the through hole. Hinge rods are arranged in the notches. The pressing sheet includes a pressing portion and a pressing part. The hinge rod passes through the connection between the pressing portion and the pressing part. In the normal state, the pressing part is in a downwardly inclined state. When the pressing portion is pressed downward, the pressing part is lifted. When the pressing portion is released, the pressing part presses downward.

6. The DDR4 chip testing method according to claim 5, characterized in that, The robotic arm includes two liftable chip suction cups arranged at intervals. Pressing blocks are arranged on both sides of each chip suction cup. The pressing blocks protrude downward from the surface of the chip suction cup. The moving mechanism drives each robotic arm to descend, so that the robotic arm presses one side of the pressing sheet, and after the other side of the pressing sheet is lifted, the step of the robotic arm placing the DDR4 chip in the installation chamber includes: The moving mechanism drives the robotic arm to descend, so that the pressing block of the robotic arm presses the pressing portion of the pressing sheet, and the pressing part is lifted. After the pressing part is lifted, the chip suction cup descends to place the DDR4 chip in the installation chamber. The chip suction cup rises and resets.

7. The DDR4 chip testing method according to claim 6, characterized in that, The pressing device is further provided with an adjusting mechanism. The adjusting mechanism includes an adjusting rod and an adjusting block connected to the adjusting rod. The adjusting block is disposed on the surface of the pressing block. The adjusting block is provided with a threaded post. The pressing block is provided with a threaded hole. The threaded post is threadedly connected to the threaded hole. And the adjusting block is connected to the adjusting rod through the threaded post. An indicating arrow is arranged on the adjusting block. Scale lines are arranged on the surface of the pressing block. The method further includes: Obtaining the thickness of the DDR4 chip. According to the thickness of the DDR4 chip, rotate the adjusting block to make the indicating arrow point to the corresponding scale line to adjust the height of the adjusting rod. When the moving mechanism drives each robotic arm to rise and the pressing block of the robotic arm leaves the pressing portion, the pressing portion rebounds to the adjusting rod, so that the pressing part presses the DDR4 chip.

8. The DDR4 chip testing method according to claim 6, characterized in that, A feeding conveyor belt is arranged on one side of the test machine platform. A discharging conveyor belt is arranged on the other side of the test machine platform. The test machine platform is provided with a transfer conveyor belt. A plurality of telescopic stop bars are arranged on the transfer conveyor belt. Each stop bar corresponds to one test track. The DDR4 chip testing method further includes: The feeding conveyor belt conveys a chip tray to the transfer conveyor belt. A plurality of installation slots are arranged on the chip tray. Each installation slot places the DDR4 chip to be tested. A corresponding indicator light is arranged on one side of each installation slot. When the transfer conveyor belt moves the chip tray to one side of the corresponding test track, the stop bar extends to block the chip tray from moving forward continuously. The transfer conveyor belt stops running, and the stop bar resets. After the robotic arm grabs and tests all the DDR4 chips on the chip tray, the transfer conveyor belt runs to transfer the chip tray to the discharging conveyor belt. When there are DDR4 chips that fail the test, the indicator lights of the corresponding mounting slots are lit.

9. An electronic device, characterized in that, Comprising: A memory for storing program instructions. A processor for calling the program instructions stored in the memory and executing the DDR4 chip test method according to any one of claims 1-8 according to the obtained program instructions.

10. A storage medium, characterized in that, The storage medium stores computer-executable instructions for causing a computer to execute the DDR4 chip test method according to any one of claims 1-8.

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