Optical function board, preparation method thereof and backlight module

Abstract

The invention provides an optical function plate, a preparation method thereof and a backlight module. The preparation method of the optical function plate comprises the following steps: obtaining the optical film and the diffusion plate; performing lamination treatment on the optical film and the diffusion plate so that the optical film and the diffusion plate are laminated to form a pretreated optical function plate; and carrying out discontinuous welding operation on the pretreated optical function board to form discontinuous welding lines on the pretreated optical function board, and arranging the welding lines around the periphery of the pretreated optical function board to obtain the optical function board. According to the preparation method of the optical function board, the structure can be simplified, the fixing stability can be ensured, and the generation of light spots can be reduced so as to ensure the display effect.

Description

Technical Field

[0001] The present invention relates to the technical field of liquid crystal display, and particularly to an optical functional plate, a preparation method thereof, and a backlight module. Background Art

[0002] For the assembly of large-size optical films, the following three methods are mostly adopted:

[0003] First: The diffusion plate and the optical film are stacked in sequence, and then the OC and the cover plate are assembled in sequence to complete the combination of the whole machine optical display module. When using this method, it is necessary to consider the fixing method of the optical film during placement, as well as the limitation of the relative position between the diffusion plate and the optical film. Therefore, it is necessary to design and add some mechanisms and parts for fixing to prevent displacement and dropping. The structure is complex, making the assembly process cumbersome and inefficient, and it is impossible to further reduce the production cost;

[0004] Second: The diffusion plate and the optical film are bonded together with glue or tape, and then the OC and the cover plate are assembled in sequence to complete the combination of the whole machine optical display module. For example, in the utility model patent application with the application number CN201320464112.3, although this method pre-bonds the diffusion plate and the optical film together, it can reduce the complexity of the mechanical structure. However, during the process of adhesively placing the optical film on the diffusion film, it is difficult to avoid the phenomenon that the glue or tape adheres to other positions, resulting in film internal contamination, which leads to poor display effects. Moreover, the glue or tape is prone to aging, affecting the fixing stability of the diffusion plate and the optical film;

[0005] Third: The diffusion plate and the optical film are welded together, and then the 0C and the cover plate are assembled in sequence to complete the combination of the whole machine optical display module. For example, in the utility model patent application with the application number CN 202022289683.0, this method better ensures the fixing stability of the diffusion plate and the optical film. However, due to the different thermal expansion or contraction stresses of the materials of the diffusion plate and the optical film, and even a large difference, when the edges of the diffusion plate and the optical film are welded into an integral structure by welding, during use, the optical film will bulge, and then light spots will be generated, affecting the liquid crystal display effect. Summary of the Invention

[0006] The purpose of the present invention is to overcome the deficiencies in the prior art, and provide an optical functional plate, a preparation method thereof, and a backlight module that can simplify the structure, ensure the fixing stability, and reduce the generation of light spots to ensure the display effect.

[0007] The purpose of the present invention is achieved through the following technical solutions:

[0008] A preparation process of an optical functional plate includes the following steps:

[0009] Obtain an optical film and a diffusion plate;

[0010] Stack the optical film and the diffusion plate so that the optical film and the diffusion plate are stacked to form a preprocessed optical functional plate;

[0011] Perform a discontinuous welding operation on the preprocessed optical functional plate to form discontinuous welding lines on the preprocessed optical functional plate, and the welding lines are arranged around the periphery of the preprocessed optical functional plate to obtain an optical functional plate.

[0012] In one embodiment, performing a discontinuous welding operation on the preprocessed optical functional plate includes the following steps:

[0013] Obtain the heat source information of the optical film, and the heat source information includes the number of heat sources and the heat source distribution area;

[0014] Set heat - avoiding welding zones according to the heat source information. Each heat - avoiding welding zone is located between every two adjacent heat source distribution areas, and the heat - avoiding welding zone is located at the periphery of the optical functional plate;

[0015] Perform welding treatment on the heat - avoiding welding zones to form welding lines at each heat - avoiding welding zone.

[0016] In one embodiment, the specific operation of performing welding treatment on the heat - avoiding welding zones is:

[0017] Perform pulsed welding treatment on the heat - avoiding welding zones so that the optical film forms convex solder joints diffusing from the optical film towards the diffusion plate at each heat - avoiding welding zone, and is fusion - welded to the diffusion plate to form the welding lines.

[0018] An optical functional plate is prepared by the preparation method of the optical functional plate in any of the above - mentioned embodiments. It is characterized in that the optical functional plate includes an optical film and a diffusion plate which are stacked, and discontinuous welding lines are formed around the periphery of the optical film so that the optical film is fusion - welded to the diffusion plate.

[0019] In one embodiment, a plurality of heat - source corresponding zones are provided on the optical functional plate, a heat - avoiding welding zone is provided between every two adjacent heat - source corresponding zones, each heat - avoiding welding zone is located at the periphery of the optical film, and each heat - avoiding welding zone is used to form the welding lines.

[0020] In one embodiment, the heat - avoiding welding zone is used to form convex solder joints diffusing from the optical film towards the diffusion plate and is fusion - welded to the diffusion plate to form the welding lines.

[0021] In one embodiment, the height of the raised solder joint is 0.1 mm to 0.3 mm.

[0022] In one embodiment, the shortest straight-line distance between the heat-insulating solder region and the adjacent heat source corresponding region is greater than or equal to 2 cm.

[0023] In one embodiment, the longest straight-line distance between the bonding wire and the adjacent heat source corresponding region is less than or equal to 8 cm.

[0024] In one embodiment, the distance between the heat-insulating solder region and the heat source corresponding region increases with the increase in the area of the heat source corresponding region.

[0025] In one embodiment, the diffusion plate is a polymethyl methacrylate diffusion plate, a polycarbonate diffusion plate, or a polystyrene diffusion plate.

[0026] In one embodiment, the thickness of the optical film is 100 μm to 600 μm.

[0027] In one embodiment, the thickness of the diffusion plate is greater than 0.3 mm.

[0028] A backlight module includes the optical functional plate according to any one of the above embodiments.

[0029] Compared with the prior art, the present invention has at least the following advantages:

[0030] In the preparation process of the optical functional plate of the present invention, the optically stacked optical film and the diffusion plate are discontinuously welded, so that discontinuous bonding wires are formed on the pre-treated optical functional plate, that is, multiple segments of bonding wires are formed on the pre-treated optical functional plate. The multiple segments of bonding wires are arranged around the periphery of the pre-treated optical functional plate. Each adjacent two segments of bonding wires at each edge of the optical film are spaced at the ends but linearly continuous, that is, the extending directions of all the bonding wires at each edge of the optical film are the same but discontinuous. In this way, the arrangement of the bonding wires preferably ensures the welding and fixing strength of the optical film to the diffusion plate, realizes the simplification of the structure, and the un-welded parts between the bonding wires do not thermally expand when the optical film is welded to the diffusion plate, effectively reducing the difference in the overall cooling shrinkage stress of the optical film, thereby preferably reducing the wrinkles and warping of the optical functional plate, and thus preferably reducing the generation of light spots and ensuring the display effect. Description of the Drawings

[0031] To more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the embodiments. It should be understood that the following drawings only show some embodiments of the present invention, and thus should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0032] Figure 1 Flow chart of the preparation process of the optical functional board according to an embodiment of the present invention;

[0033] Figure 2 Schematic structural diagram of the optical functional board according to an embodiment of the present invention;

[0034] Figure 3 For Figure 2 Partial cross-sectional view of the shown optical functional board;

[0035] Figure 4 Physical diagram of the backlight module according to an embodiment of the present invention;

[0036] Figure 5 Physical diagram of the optical functional board according to an embodiment of the present invention. Detailed implementation manners

[0037] To facilitate the understanding of the present invention, the following will describe the present invention more comprehensively with reference to the relevant drawings. The preferred embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0038] It should be noted that when an element is referred to as "fixed to" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for the purpose of illustration and do not represent the only embodiments.

[0039] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present invention belongs. The terms used in the description of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0040] The present application provides a preparation process for an optical functional plate. The preparation process for the above-mentioned optical functional plate includes the following steps: obtaining an optical film and a diffusion plate; performing a lamination process on the optical film and the diffusion plate so that the optical film and the diffusion plate are laminated to form a preprocessed optical functional plate; performing a discontinuous welding operation on the preprocessed optical functional plate to form discontinuous solder lines on the preprocessed optical functional plate, and the solder lines are arranged around the periphery of the preprocessed optical functional plate to obtain the optical functional plate.

[0041] In the above-mentioned preparation process for the optical functional plate, the optically laminated film and the diffusion plate are subjected to discontinuous welding, so that discontinuous solder lines are formed on the preprocessed optical functional plate, that is, multiple segments of solder lines are formed on the preprocessed optical functional plate. The multiple segments of solder lines are arranged around the periphery of the preprocessed optical functional plate. For each adjacent two segments of solder lines at each edge of the optical film, the head and the tail are spaced but linearly continuous, that is, the extending directions of all the solder lines at each edge of the optical film are the same but discontinuous. In this way, the arrangement of the solder lines preferably ensures the welding and fixing strength of the optical film to the diffusion plate, realizes the simplification of the structure, and the non-welded parts between the solder lines do not undergo thermal expansion when the optical film is welded to the diffusion plate, effectively reducing the overall cooling shrinkage stress difference of the optical film, thereby preferably reducing the wrinkles and warping of the optical functional plate, and thus preferably reducing the generation of light spots and ensuring the display effect.

[0042] To better understand the preparation process for the optical functional plate of the present application, the following further explains the preparation process for the optical functional plate of the present application:

[0043] Please refer to Figure 1 , the preparation process for the optical functional plate in one embodiment includes the following steps:

[0044] S100. Obtain an optical film and a diffusion plate.

[0045] S200. Perform a lamination process on the optical film and the diffusion plate so that the optical film and the diffusion plate are laminated to form a preprocessed optical functional plate. It can be understood that the obtained optical film and diffusion plate are subjected to a lamination process to preferably ensure the accurate arrangement of the relative positions of the optical film and the diffusion plate.

[0046] S300. Perform a discontinuous welding operation on the preprocessed optical functional board to form discontinuous welding lines on the preprocessed optical functional board, and the welding lines are arranged around the periphery of the preprocessed optical functional board to obtain the optical functional board. It can be understood that the laminated optical film and the diffusion plate are discontinuously welded, so that discontinuous welding lines are formed on the preprocessed optical functional board, that is, multiple welding lines are formed on the preprocessed optical functional board. The multiple welding lines are arranged around the periphery of the preprocessed optical functional board. For each adjacent two welding lines on each edge of the optical film, the head and tail are spaced but linearly continuous, that is, the extending directions of all the welding lines on each edge of the optical film are the same but discontinuous. In this way, the arrangement of the welding lines preferably ensures the welding and fixing strength of the optical film to the diffusion plate, realizes the simplification of the structure, and the un-welded parts between the welding lines do not undergo thermal expansion when the optical film is welded to the diffusion plate, effectively reducing the difference in the cooling shrinkage stress of the overall optical film, thereby preferably reducing the bulging of the optical film, preferably reducing the generation of light spots, and further ensuring the display effect.

[0047] In the above preparation process of the optical functional board, the laminated optical film and the diffusion plate are discontinuously welded, so that discontinuous welding lines are formed on the preprocessed optical functional board, that is, multiple welding lines are formed on the preprocessed optical functional board. The multiple welding lines are arranged around the periphery of the preprocessed optical functional board. For each adjacent two welding lines on each edge of the optical film, the head and tail are spaced but linearly continuous, that is, the extending directions of all the welding lines on each edge of the optical film are the same but discontinuous. In this way, the arrangement of the welding lines preferably ensures the welding and fixing strength of the optical film to the diffusion plate, realizes the simplification of the structure, and the un-welded parts between the welding lines do not undergo thermal expansion when the optical film is welded to the diffusion plate, effectively reducing the difference in the cooling shrinkage stress of the overall optical film, thereby preferably reducing the wrinkles and warping of the optical functional board, and thus preferably reducing the generation of light spots and ensuring the display effect.

[0048] It should be noted that although discontinuous welding lines are formed on the optical functional board, effectively reducing the wrinkles and warping of the optical functional board, due to the thinning of liquid crystal displays, the distance between the optical functional board and heat sources in the backlight module is relatively close, such as heat-generating components like LED lamp beads and driver ICs. Considering the large difference in the thermal expansion stress between the optical film and the diffusion plate in the optical functional board, it is further likely to cause wrinkles and warping of the optical functional board during use, generating light spots, which has a great impact on the display effect. In order to better reduce the generation of light spots and further ensure the display effect, in one of the embodiments, the discontinuous welding operation on the preprocessed optical functional board includes the following steps:

[0049] S310. Obtain the heat source information of the optical film, where the heat source information includes the number of heat sources and the heat source distribution area.

[0050] It can be understood that the heat source distribution area corresponds to the heat-generating components in the optical film and the backlight module, such as heat-generating components like LED beads and driving ICs. Thus, the sizes of the heat source distribution areas are different, the same, or partially the same, and the heat source distribution area is information determined through the design of the backlight module and before the processing of the backlight module.

[0051] S330. Set heat-avoiding solder areas according to the heat source information. Each heat-avoiding solder area is located between every two adjacent heat source distribution areas, and the heat-avoiding solder area is located at the periphery of the optical functional board.

[0052] It can be understood that the heat-avoiding solder areas are set according to the heat source distribution areas and the number of heat source distributions. Each heat-avoiding solder area is located between every two adjacent heat source distribution areas, and the heat-avoiding solder area is located at the periphery of the optical functional board, so that the subsequent wire bonding is formed between every two adjacent heat source distribution areas, that is, the wire bonding is formed at the periphery of the optical functional board, and the wire bonding is formed between the area corresponding to the periphery of the optical functional board and the heat source distribution area, realizing that the wire bonding avoids the heat source setting.

[0053] S350. Perform welding treatment on the heat-avoiding solder areas to form wire bonds at each heat-avoiding solder area.

[0054] It can be understood that since the optical film corresponding to the heat source on the optical functional board is prone to thermal expansion during use, and the degree of thermal expansion of the optical film is greater than that of the diffusion plate. Thus, relatively large deformation stresses are applied to the wire bonds at the parts corresponding to partial areas of the heat source, resulting in relatively serious wrinkles and warping at the wire bond areas. Therefore, in this application, in order to further reduce the wrinkles and warping of the optical functional board, wire bonds are formed on the heat-avoiding solder areas, that is, the wire bonds are formed between two heat source distribution areas and preferably avoid the heat source distribution areas, that is, no wire bonds are formed at the parts of the optical functional board corresponding to the heat source, and the entire optical functional board corresponding to the unbonded part between every two adjacent wire bonds is used as the part for evenly distributing the thermal expansion stress of the optical functional board, that is, it promotes the entire optical functional board corresponding to the unbonded part between every two adjacent wire bonds to make a transition buffer for the deformation caused by the thermal expansion stress of the optical functional board, that is, it promotes the thermal expansion stress to be dispersed on the entire optical functional board corresponding to the unbonded part between every two adjacent wire bonds, avoiding the bulge of the optical film in the unbonded part of the optical functional board due to relatively large local stress, effectively reducing the occurrence of light leakage, and effectively reducing the generation of wrinkles and warping of the optical functional board, ensuring the display effect.

[0055] The heat - avoiding welding areas are set according to the heat - source distribution regions and the number of heat - source distributions. Each heat - avoiding welding area is located between every two adjacent heat - source distribution regions and at the periphery of the optical functional board. That is, the welding wires are formed between two heat - source distribution regions and are well - set to avoid the heat - source distribution regions. That is, the optical functional board does not form welding wires at the parts corresponding to the heat sources. And the whole of the optical functional board corresponding to the non - welded part between every two adjacent welding wires serves as the even - sharing part of the thermal expansion stress of the optical functional board. That is, it promotes the whole of the optical functional board corresponding to the non - welded part between every two adjacent welding wires to make a transition buffer for the deformation caused by the thermal expansion stress of the optical functional board. That is, it promotes the thermal expansion stress to be dispersed on the whole of the optical functional board corresponding to the non - welded part between every two adjacent welding wires, avoiding the bulging of the optical film in the non - welded part of the optical functional board caused by large local stress, effectively reducing the occurrence of light leakage, and effectively reducing the generation of wrinkles and warping of the optical functional board, ensuring the display effect.

[0056] In one embodiment, the distance between the heat - avoiding welding area and the heat - source distribution region increases as the area of the heat - source distribution region increases.

[0057] It should be noted that actually, non - continuous welding is used to form non - continuous welding wires on the optical functional board. The non - welded part of the optical functional board is located between two welding wires. Under the influence of the wrinkles and warping of the welded part, it is easier for relative movement or easier for the local gap to increase between the optical film corresponding to the non - welded part between the welding wires and the diffusion plate. In this way, it is easy to cause the serious aggravation of the light - leakage problem. In order to reduce the occurrence of light spots and light leakage and then ensure the display effect, in one embodiment, the heat - avoiding welding area is subjected to welding treatment. The specific operation is as follows:

[0058] The heat - avoiding welding area is subjected to pulse welding treatment, so that the optical film forms raised solder joints diffusing from the optical film towards the diffusion plate at each heat - avoiding welding area and is fusion - welded to the diffusion plate to form welding wires.

[0059] It can be understood that the welding wires are formed in the heat - avoiding welding areas by means of pulse welding. Specifically, the optical film forms convex solder joints that spread from the optical film towards the diffusion plate at each heat - avoiding welding area, and the convex solder joints are fusion - welded to the diffusion plate to form welding wires. In fact, the welding wires are formed by the fusion - welding connection of the convex solder joints to the diffusion plate. The convex solder joints are fusion - welded at the diffusion plate, making the convex solder joints appear as an integral structure with the optical film and the diffusion plate. That is, at the good welding wires, the optical film and the diffusion plate are closely attached together. During the pulse welding process, there is no obvious thermal melting and diffusion of the whole optical film. Only when melting, the convex solder joints spread from the optical film towards the diffusion plate direction, and the heat is preferentially directed to the diffusion plate, which better reduces the thermal deformation of the optical film, further reduces the wrinkles and warping at the welding wires, and then ensures the control of the gap between the optical film and the diffusion plate in the un - welded part located between the welding wires, reduces the occurrence of light spots and light leakage, and further ensures the display effect. Moreover, the welding wires are fusion - welded to the diffusion plate through the convex solder joints, which can better ensure the welding strength, that is, better ensure the fixing strength of the optical functional plate.

[0060] It should be noted that if the bonding wires are not arranged to avoid the area corresponding to the periphery of the optical functional board and the heat source distribution area, they will be affected by the heat source in the heat source distribution area, and relatively large warping and wrinkling will occur at the corresponding bonding wires. Combined with the discontinuous bonding wires, relatively large bulges will occur at the periphery of the unbonded optical functional board adjacent to the corresponding bonding wires, greatly increasing the occurrence of light leakage. Therefore, generally, discontinuous bonding wires are rarely formed on the optical functional board. In this application, the bonding wires are formed to avoid the area corresponding to the periphery of the optical functional board and the heat source distribution area. On the one hand, it preferably reduces the distribution range of the bonding wires on the optical functional board, and thus preliminarily reduces the warping and wrinkling of the optical functional board; on the other hand, it preferably avoids the part with relatively large stress at the bonding wires, and thus further reduces the warping and wrinkling of the optical functional board. However, just like this, since discontinuous bonding wires are formed on the optical functional board, actually, compared with the case where continuous bonding wires are formed by continuous welding at the periphery of the optical functional board, the formation of discontinuous bonding wires on the optical functional board is more likely to cause light leakage. This is mainly because the warping and wrinkling at the bonding wires are more likely to cause relative displacement of the unbonded part at the periphery of the optical functional board, and are more likely to increase the gap between the optical film and the diffusion plate in the optical functional board. In this application, the bonding wires are arranged to avoid the area corresponding to the periphery of the optical functional board and the heat source distribution area. First, it reduces the warping and wrinkling at the bonding wires. Second, it makes the optical film form convex solder joints that diffuse from the optical film towards the diffusion plate at each heat-avoiding bonding area, and fuse-weld to the diffusion plate to form bonding wires, that is, the convex solder joints are fuse-welded at the diffusion plate, making the convex solder joints appear as an integral structure with the optical film and the diffusion plate. That is, at the good bonding wires, the optical film and the diffusion plate are closely attached together. During the pulse welding process, there is no obvious thermal melting and diffusion of the whole optical film. Only when melting, the convex solder joints diffuse from the optical film towards the diffusion plate direction, and the heat is preferentially directed to the diffusion plate, preferably reducing the thermal deformation of the optical film and further reducing the wrinkling and warping at the bonding wires. In this way, it ensures the control of the gap between the optical film and the diffusion plate at the unbonded part between the bonding wires, and ensures the control of the relative displacement between the optical film and the diffusion plate at the unbonded part between the bonding wires, and thus preferably reduces the occurrence of light spots and light leakage, ensuring the display effect.

[0061] This application also provides an optical functional board, which is prepared by the preparation method of the optical functional board in any of the above embodiments. The above optical functional board includes an optically laminated film and a diffusion plate which are laminated, and discontinuous bonding wires are formed around the periphery of the optically laminated film to fuse-weld the optically laminated film to the diffusion plate.

[0062] For the above-mentioned optical functional plate, a discontinuous solder line is formed around the periphery of the optically laminated film and the diffusion plate, that is, the head and tail of every two adjacent solder lines on each edge of the optical functional plate are spaced apart but linearly continuous, that is, the extending directions of all the solder lines on each edge of the optical functional plate are the same but discontinuous. In this way, the setting of the solder line preferably ensures the welding and fixing strength of the optically laminated film to the diffusion plate, achieving the simplification of the structure. The un-welded parts between the solder lines do not undergo thermal expansion when the optically laminated film is welded to the diffusion plate, effectively reducing the difference in the overall cooling shrinkage stress of the optically laminated film, and further preferably reducing the wrinkles and warping of the optical functional plate, thereby preferably reducing the generation of light spots and ensuring the display effect.

[0063] To better understand the optical functional plate of the present application, the following further explains the optical functional plate of the present application:

[0064] Please refer to Figures 2 to 3 simultaneously. An optical functional plate 10 in an embodiment includes an optically laminated film 100 and a diffusion plate 200 arranged in a laminated manner. A discontinuous solder line (not shown in the figure) is formed around the periphery of the optically laminated film 100 to weld the optically laminated film 100 to the diffusion plate 200 by fusion.

[0065] For the above-mentioned optical functional plate 10, a discontinuous solder line is formed around the periphery of the optically laminated film 100 and the diffusion plate 200 arranged in a laminated manner, that is, the head and tail of every two adjacent solder lines on each edge of the optical functional plate 10 are spaced apart but linearly continuous, that is, the extending directions of all the solder lines on each edge of the optical functional plate 10 are the same but discontinuous. In this way, the setting of the solder line preferably ensures the welding and fixing strength of the optically laminated film 100 to the diffusion plate 200, achieving the simplification of the structure. The un-welded parts between the solder lines do not undergo thermal expansion when the optically laminated film 100 is welded to the diffusion plate 200, effectively reducing the difference in the overall cooling shrinkage stress of the optically laminated film 100, and further preferably reducing the wrinkles and warping of the optical functional plate 10, thereby preferably reducing the generation of light spots and ensuring the display effect.

[0066] Please refer to Figures 2 to 3, in one embodiment, a plurality of heat source corresponding regions 101 are provided on the optical functional board 10. A heat - avoiding soldering region 102 is provided between every two adjacent heat source corresponding regions 101. Each heat - avoiding soldering region 102 is located at the periphery of the optical film 100, and each heat - avoiding soldering region 102 is used to form a bonding wire (not shown in the figure). It can be understood that since the optical film 100 corresponding to the heat source on the optical functional board 10 is prone to thermal expansion during use, and the degree of thermal expansion of the optical film 100 is greater than that of the diffusion plate 200. In this way, relatively large deformation stresses are applied to the bonding wires at the parts corresponding to the partial regions of the heat source, causing serious wrinkles and warping at the bonding wire locations. Therefore, in this application, in order to further reduce the wrinkles and warping of the optical functional board 10, the bonding wires are formed on the heat - avoiding soldering regions 102, that is, the bonding wires are formed between two heat source distribution regions and are preferably arranged to avoid the heat source distribution regions. That is, no bonding wires are formed at the parts of the optical functional board 10 corresponding to the heat source. And the entire optical functional board 10 corresponding to the un - welded part between every two adjacent bonding wires is used as the stress - sharing part of the thermal expansion stress of the optical functional board 10. That is, it promotes the overall optical functional board 10 corresponding to the un - welded part between every two adjacent bonding wires to make a transition buffer for the deformation caused by the thermal expansion stress of the optical functional board 10. That is, it promotes the thermal expansion stress to be dispersed over the entire optical functional board 10 corresponding to the un - welded part between every two adjacent bonding wires, avoiding large local stresses that cause the optical film 100 in the un - welded part of the optical functional board 10 to bulge, effectively reducing the occurrence of light leakage, and effectively reducing the generation of wrinkles and warping of the optical functional board 10, ensuring the display effect.

[0067] In one embodiment, the heat - avoiding soldering region is used to form convex solder joints that diffuse from the optical film towards the diffusion plate and are fusion - welded to the diffusion plate to form bonding wires. It can be understood that convex solder joints that diffuse from the optical film towards the diffusion plate are formed at each heat - avoiding soldering region of the optical film, and the convex solder joints are fusion - welded to the diffusion plate to form bonding wires. In fact, the bonding wires are formed by the fusion - welding of the convex solder joints to the diffusion plate. The convex solder joints are fusion - welded at the diffusion plate, making the convex solder joints appear as an integral structure with the optical film and the diffusion plate. That is, at the bonding wire locations, the optical film and the diffusion plate are closely attached together. During the pulse welding process, there is no obvious thermal melting and diffusion of the entire optical film. Only when melting, the convex solder joints diffuse from the optical film towards the diffusion plate direction, and the heat is preferentially directed to the diffusion plate, which preferably reduces the thermal deformation of the optical film, further reducing the wrinkles and warping at the bonding wire locations. Furthermore, it ensures the control of the gap between the optical film and the diffusion plate in the un - welded part located between the bonding wires, reducing the occurrence of light spots and light leakage, and further ensuring the display effect. And the bonding wires are fusion - welded to the diffusion plate through the convex solder joints, which can preferably ensure the welding strength, that is, preferably ensure the fixing strength of the optical functional board.

[0068] In one embodiment, the height of the raised solder joint is 0.1 mm to 0.3 mm, which preferably ensures the welding strength, that is, preferably ensures the fixing strength of the optical functional board.

[0069] In one embodiment, the distance between the heat avoidance welding area and the heat source corresponding area increases with the increase of the area of the heat source corresponding area. Further, the distance between two adjacent heat avoidance welding areas increases by 0.5 cm to 2 cm for every 5 square centimeters to 10 square centimeters of the area of the corresponding heat source corresponding area, that is, the distance between two adjacent heat avoidance welding areas changes with the area of the heat source corresponding area located between the two adjacent heat avoidance welding areas, and the change rule is to increase by 0.5 cm to 2 cm for every 5 square centimeters to 10 square centimeters, which preferably ensures the welding strength, that is, preferably ensures the fixing strength of the optical functional board, and preferably reduces the occurrence of light leakage, and effectively reduces the generation of wrinkles and warping of the optical functional board, ensuring the display effect.

[0070] In one embodiment, the shortest straight-line distance a between the bonding wire and the adjacent heat source corresponding area is greater than or equal to 2 cm. Further, the longest straight-line distance a between the bonding wire and the adjacent heat source corresponding area is less than or equal to 8 cm. Further, the shortest straight-line distance b between two adjacent heat avoidance welding areas is greater than or equal to 4 cm. Further, the length of each bonding wire is greater than or equal to 2 cm, which preferably ensures the welding strength, that is, preferably ensures the fixing strength of the optical functional board, and preferably reduces the occurrence of light leakage, and effectively reduces the generation of wrinkles and warping of the optical functional board, ensuring the display effect.

[0071] In one embodiment, the optical film is a polyethylene terephthalate optical film.

[0072] In one embodiment, the diffusion plate is a polymethyl methacrylate diffusion plate, a polycarbonate diffusion plate, or a polystyrene diffusion plate.

[0073] In one embodiment, the thickness of the optical film is 100 μm to 600 μm.

[0074] In one embodiment, the thickness of the diffusion plate is greater than 0.3 mm.

[0075] It should be noted that the defective rate of the optical functional board within the above parameter range prepared by the above preparation process of the optical functional board can reach the effect of less than 0.02%.

[0076] This application also provides a backlight module, including the optical functional board of any of the above embodiments. Please refer to Figure 4 , which shows a physical diagram of the backlight module, on which the distribution of some heat sources can be seen. Further, please refer to Figures 2 to 3, in this embodiment, the optical functional plate 10 includes an optically film 100 and a diffusion plate 200 which are stacked. A discontinuous solder line is formed around the periphery of the optically film 100 so that the optically film 100 is fusion-welded to the diffusion plate 200. Please also refer to Figure 5 , which shows a physical diagram of the optical functional plate. There are no visible wrinkles or warps on the surface, and the adhesion between the optically film and the diffusion plate is relatively good.

[0077] Compared with the prior art, the present invention has at least the following advantages:

[0078] In the preparation process of the optical functional plate 10 of the present invention, the stacked optically film 100 and diffusion plate 200 are discontinuously welded, so that discontinuous solder lines are formed during the pretreatment of the optical functional plate 10, that is, multiple solder lines are formed on the pretreated optical functional plate 10. The multiple solder lines are arranged around the periphery of the pretreated optical functional plate 10. Each adjacent two solder lines at each edge of the optically film 100 are spaced at the ends but linearly continuous, that is, the extending directions of all the solder lines at each edge of the optically film 100 are the same but discontinuous. In this way, the arrangement of the solder lines preferably ensures the welding and fixing strength of the optically film 100 to the diffusion plate 200, realizes the simplification of the structure, and the non-welded parts between the solder lines do not undergo thermal expansion when the optically film 100 is welded to the diffusion plate 200, effectively reducing the difference in the cooling shrinkage stress of the whole optically film 100, thereby preferably reducing the wrinkles and warps of the optical functional plate 10, and thus preferably reducing the generation of light spots and ensuring the display effect.

[0079] The above embodiments only represent several implementation manners of the present invention, and the description thereof is relatively specific and detailed, but it should not be construed as a limitation to the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several deformations and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the invention patent shall be subject to the appended claims.

Claims

1. A preparation process of an optical functional plate, characterized in that, It includes the following steps: Obtain an optical film and a diffusion plate; Perform a lamination process on the optical film and the diffusion plate so that the optical film and the diffusion plate are laminated to form a pre-treated optical functional plate; Perform a discontinuous welding operation on the pre-treated optical functional plate to form discontinuous welding lines on the pre-treated optical functional plate, and the welding lines are arranged around the periphery of the pre-treated optical functional plate to obtain an optical functional plate.

2. The manufacturing process of the optical functional plate according to claim 1, characterized in that, Performing a discontinuous welding operation on the pre-treated optical functional plate includes the following steps: Obtain the heat source information of the optical film, and the heat source information includes the number of heat sources and the heat source distribution area; Set heat-insulated welding areas according to the heat source information, and each heat-insulated welding area is located between every two adjacent heat source distribution areas, and the heat-insulated welding area is located at the periphery of the optical functional plate; Perform a welding process on the heat-insulated welding area to form a welding line at each heat-insulated welding area.

3. The preparation process of the optical functional board according to claim 2, characterized in that, The specific operation of performing a welding process on the heat-insulated welding area is: Perform a pulsed welding process on the heat-insulated welding area so that the optical film forms a raised solder joint diffusing from the optical film towards the diffusion plate at each heat-insulated welding area, and is fusion-welded to the diffusion plate to form the welding line.

4. An optical functional plate, which is prepared by the preparation method of the optical functional plate according to any one of claims 1 to 5, characterized in that, The optical functional plate includes an optical film and a diffusion plate which are laminated, and a discontinuous welding line is formed around the periphery of the optical film so that the optical film is fusion-welded to the diffusion plate.

5. The optical functional board according to claim 4, wherein, A plurality of heat source corresponding areas are provided on the optical functional plate, a heat-insulated welding area is provided between every two adjacent heat source corresponding areas, each heat-insulated welding area is located at the periphery of the optical film, and each heat-insulated welding area is used to form the welding line.

6. The optical functional board according to claim 5, wherein The heat-insulated welding area is used to form a raised solder joint diffusing from the optical film towards the diffusion plate and is fusion-welded to the diffusion plate to form the welding line.

7. The optical functional board according to claim 6, wherein, The height of the raised solder joint is 0.1 mm to 0.3 mm; and / or The shortest straight-line distance between the heat-insulated welding area and the adjacent heat source corresponding area is greater than or equal to 2 cm; and / or The longest straight-line distance between the welding line and the adjacent heat source corresponding area is less than or equal to 8 cm.

8. The optical functional plate according to claim 4, characterized in that, The distance between the heat-insulated welding area and the heat source corresponding area increases with the increase of the area of the heat source corresponding area.

9. The optical functional board according to claim 4, wherein The diffusion plate is a polymethyl methacrylate diffusion plate, a polycarbonate diffusion plate, a polystyrene diffusion plate; and / or The thickness of the optical film is 100 μm to 600 μm; and / or The thickness of the diffusion plate is greater than 0.3 mm.

10. A backlight module includes the optical functional plate according to any one of claims 6 to 9.

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