Integrated server cooling mechanism

Abstract

The invention provides an integrated server cooling mechanism, and relates to the technical field of computers, the integrated server cooling mechanism comprises a server, a diversion air cooling assembly is arranged at the rear end in the server and located in the middle of a hard disk pack, and an adjusting assembly is arranged at the front end of the inner wall of the server and located in the middle of the hard disk pack. The flow guide air cooling assembly comprises two flow guide arc plates which are symmetrically and evenly distributed and fixedly installed in the server, two side arc plates are symmetrically and evenly arranged at the front end in the server, a positioning frame plate is fixedly connected to the middle of the rear end of the inner wall of the server, and a draught fan is fixedly connected to the middle of the positioning frame plate. The two side arc plates and the flow guide arc plate which are symmetrically distributed are matched with the inner wall of the server to form the Y-shaped air channel, airflow dispersed and guided out by the fan is concentrated and guided to the processor and the memory bank, and therefore the trend of the airflow can be controlled through the Y-shaped air channel, the dispersed airflow is guided in a directive mode, and the service life of the server is prolonged. And the heat dissipation effect on the internal hardware equipment of the server is improved.

Description

Technical Field

[0001] The present invention relates to the field of computer technology, and more particularly, to an integrated server cooling mechanism. Background Art

[0002] An integrated server is a server device that highly integrates modules such as computing, storage, and networking. It usually adopts a modular design (such as blade servers, hyper-converged architectures) to improve density, simplify management, and save space. To enable the device to work for a long time, a cooling mechanism is installed inside it. The cooling mechanism is a key guarantee for the integrated server to maintain high performance, stable operation, and long-term reliability.

[0003] As an important guarantee for the stable operation of an integrated server, an air-cooling structure is usually installed inside the server to dissipate heat from hardware devices through forced air circulation. However, during actual operation, the air flow passing through the server interior often shows a disordered and dispersed state, lacking effective flow guidance. Moreover, due to the different workloads of the server's various hardware components, the heat generation distribution is uneven, and the existing air-cooling air flow cannot perform targeted enhanced heat dissipation for high-temperature areas, resulting in difficulty in effectively eliminating local hot spots, thereby reducing the heat dissipation efficiency of the overall air-cooling system.

[0004] For example: The "Heat Dissipation Device and Server of a Server" disclosed in the Chinese invention patent (application number: 202210605737.0), its specification discloses: The present invention provides a heat dissipation device and server of a server. The device includes: an auxiliary cooling mechanism is arranged at the bottom of the first electric cylinder, and the first electric cylinder is arranged at the four corners of the bottom of the server body. The auxiliary cooling mechanism includes a heat dissipation metal plate connected to the side wall of the server. A connection groove is arranged on the heat dissipation metal plate, and the connection groove has a coolant flowing out from the auxiliary cooling mechanism; a swinging air-dissipating mechanism is arranged at the top of the air duct, and the air duct is arranged at the top of the server body. The swinging air-dissipating mechanism is configured to introduce air into the swinging air-dissipating mechanism via a heat dissipation fan, and evenly blow the air on the top of the server body through the swinging of the swinging air-dissipating mechanism. By using the solution of the present invention, the heat dissipation range of the server can be expanded, the heat dissipation effect can be improved, the situation that the internal electronic components of the server are damaged due to the inability to dissipate heat from the server in time can be effectively avoided, the normal use of the server can be guaranteed, and the service life of the server can be extended; the above patent can prove the defects existing in the prior art.

[0005] Therefore, we make improvements in this regard and propose an integrated server cooling mechanism. Summary of the Invention

[0006] The object of the present invention is to address the problem that the air flow passing through the server interior often shows a disordered and dispersed state and lacks effective flow guidance currently.

[0007] To achieve the above-mentioned invention object, the present invention provides an integrated server cooling mechanism to improve the above problems.

[0008] Specifically, this application is as follows:

[0009] An integrated server cooling mechanism includes a server. At the bottom of one side inside the server, there is a processor. On the other side inside the server, there is a memory module. At the rear end inside the server, there is a hard disk group. At the rear end inside the server, there is a diversion air-cooling component, and it is in the middle of the hard disk group. At the front end of the inner wall of the server, there is an adjustment component. The diversion air-cooling component includes two diversion arc plates symmetrically and evenly distributed and fixedly installed inside the server. At the front end inside the server, there are two side arc plates symmetrically and evenly arranged. In the middle of the rear end of the inner wall of the server, there is a positioning frame plate fixedly connected, and a fan is fixedly connected in the middle of the positioning frame plate.

[0010] As a preferred technical solution of this application, in the middle of the tails of the two diversion arc plates, there is a middle arc mesh plate fixedly connected. At both ends behind the middle arc mesh plate, there are arc-shaped mesh plates fixedly connected, and the two arc-shaped mesh plates are in the middle of the hard disk group.

[0011] As a preferred technical solution of this application, at the bottom ends on both sides of the side arc plate, there are positioning buckles fixedly connected, and the bottom ends of the positioning buckles are fixedly installed at the bottom end inside the server.

[0012] As a preferred technical solution of this application, the adjustment component includes a flow splitting plate arranged between the two diversion arc plates. On one side of the flow splitting plate close to the front end of the inner wall of the server, there is a rotating shaft. At both ends of the flow splitting plate close to one end of the middle arc mesh plate, there are semi-circular magnets fixedly connected. Near the semi-circular magnets, there are columnar magnets, and the magnetic poles between the opposite surfaces of the semi-circular magnets and the columnar magnets repel each other.

[0013] As a preferred technical solution of this application, at both ends of the rotating shaft, there are limit frames movably installed, and the ends of the limit frames far from the flow splitting plate are fixedly installed at the front end of the inner wall of the server.

[0014] As a preferred technical solution of this application, an extension cylinder is sleeved on the outer wall of the columnar magnet. At one end of the extension cylinder far from the columnar magnet, an airbag is fixedly connected to the inner wall, and at the other end of the extension cylinder, there is a spiral water-cooling component.

[0015] As a preferred technical solution of this application, on the upper surface and the lower surface of the inner wall of the extension cylinder close to one end of the columnar magnet, there are a number of groove frames fixedly connected in a straight line and evenly distributed. Inside the groove frames, there are cylindrical rolling balls, and they are in contact with the outer wall of the columnar magnet.

[0016] As a preferred technical solution of the present application, the spiral water-cooling assembly includes a spiral pipe fixedly installed at one end of the extension cylinder away from the flow distribution plate. A number of heat-conducting plates are evenly distributed at the bottom end of the spiral pipe. One group of the heat-conducting plates is directly above the processor, and the other group of the heat-conducting plates is between the memory modules.

[0017] As a preferred technical solution of the present application, two support frames are fixedly connected to the lower surface of the spiral pipe in a symmetric and evenly distributed manner. The bottom ends of the support frames are installed at the bottom end of the inner wall of the server, and a filling valve port is provided in the middle of the upper surface of the spiral pipe.

[0018] As a preferred technical solution of the present application, a connector plate is provided at the rear end of the server, heat dissipation windows are provided at the rear ends of both sides of the server, and handles are fixedly connected to both sides of the rear end of the connector plate.

[0019] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0020] In the solution of the present application:

[0021] 1. In order to solve the problem that the airflow flowing through the server interior often presents a disordered and dispersed state and lacks effective flow direction guidance in the prior art, in the present application, two symmetrically distributed side arc plates and a diversion arc plate are used in cooperation with the inner wall of the server to form a Y-shaped air duct, concentrating the airflow dispersed by the fan and guiding it to the processor and the memory modules. Thus, the flow direction of the airflow can be controlled by the Y-shaped air duct, and the dispersed airflow can be directionally guided, increasing its heat dissipation effect on the internal hardware devices of the server.

[0022] 2. By using a columnar magnet to push the flow distribution plate equipped with a semi-circular magnet, it is offset with the rotation axis, changing the gap between its diversion arc plate and the flow distribution plate. More airflow will flow to the side with a larger gap between the flow distribution plate and the diversion arc plate, performing air cooling on the hardware with a high working temperature in the corresponding space. Thus, the airflow flowing inside the server can be adjusted and guided, making the airflow tend to the hardware with a higher working temperature, ensuring its efficient heat dissipation for the hardware devices in the server.

[0023] 3. The heat generated during the working process of the hardware is conducted by the heat-conducting plate above the hardware and transferred to the water in the spiral pipe, and the water absorbs the heat. Thus, water cooling can be realized for the hardware inside the server, improving its heat dissipation effect.

[0024] 4. During the water-cooling heat dissipation process, the water in the spiral pipe receives the heat transferred upward by the heat conduction plate, and is used to cool down the hardware working at high temperature, thereby realizing the water-cooling operation. During the adjustment process, the water in the spiral pipe generates gas after being heated, causing the gas in the extension cylinder and the spiral pipe to increase. The gas expands the airbag, pushing the columnar magnet to move, changing the deflection angle of the flow dividing plate, thereby adjusting the flow distribution of the air flow, so that it can be flexibly switched between the water-cooling heat dissipation structure and the adjustment structure, improving the heat dissipation effect of the server interior. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 FIG. is a schematic diagram of the overall structure of the integrated server cooling mechanism provided by the present application;

[0026] Figure 2 FIG. is a schematic diagram of the internal structure of the integrated server cooling mechanism provided by the present application Figure 1 ;

[0027] Figure 3 FIG. is a second schematic diagram of the internal structure of the integrated server cooling mechanism provided by the present application;

[0028] Figure 4 FIG. is a schematic diagram of the structure of the spiral water-cooling component in the integrated server cooling mechanism provided by the present application;

[0029] Figure 5 FIG. is a schematic diagram of the partial sectional structure of the adjustment component in the integrated server cooling mechanism provided by the present application;

[0030] Figure 6 FIG. is a schematic diagram of the partial structure of the adjustment component in the integrated server cooling mechanism provided by the present application;

[0031] Figure 7 FIG. is a schematic diagram of the air flow of the adjustment component in the integrated server cooling mechanism provided by the present application Figure 1 ;

[0032] Figure 8 FIG. is a schematic diagram of the air flow of the adjustment component in the integrated server cooling mechanism provided by the present application Figure 2 ;

[0033] Figure 9 FIG. is a schematic diagram of the air flow of the adjustment component in the integrated server cooling mechanism provided by the present application Figure 3 .

[0034] Labels in the figure:

[0035] 1. Server; 2. Heat dissipation window; 3. Connector board; 4. Handle; 5. Diversion air-cooling component; 501. Positioning frame board; 502. Fan; 503. Diversion arc board; 504. Arc-shaped mesh board; 505. Side arc board; 506. Positioning buckle; 507. Middle arc mesh board; 6. Memory module; 7. Adjustment component; 701. Shunt board; 702. Rotating shaft; 703. Limiting frame; 704. Semi-circular magnet; 705. Airbag; 706. Groove frame; 707. Cylindrical ball; 708. Columnar magnet; 709. Extension tube; 8. Spiral water-cooling component; 801. Spiral pipe; 802. Support frame; 803. Heat conduction board; 804. Filling valve port; 9. Hard disk group; 10. Processor. Detailed implementation manners

[0036] In order to enable those skilled in the art to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0037] As described in the background art, the air flow flowing through the server interior often presents a disordered and dispersed state, lacking effective flow direction guidance, and due to the workload differences of the server's various hardware components, the heat generation distribution is not uniform. The existing air-cooling air flow cannot perform directional enhanced heat dissipation for high-temperature areas, resulting in difficult effective elimination of local hot spots, thereby reducing the heat dissipation efficiency of the overall air-cooling system.

[0038] To solve this technical problem, the present invention provides an integrated server cooling mechanism, which is applied to the field of computer technology.

[0039] In order to enable those skilled in the art to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0040] It should be noted that, without conflict, the embodiments in the present invention and the features and technical solutions in the embodiments may be combined with each other.

[0041] It should be noted that similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0042] Example 1, please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 andFigure 6 , An integrated server cooling mechanism, including a server 1. At the bottom on one side inside the server 1, there is a processor 10. On the other side inside the server 1, there is a memory module 6. At the rear end inside the server 1, there is a hard disk group 9. At the rear end inside the server 1, there is a diversion air-cooling component 5, and it is in the middle of the hard disk group 9. At the front end of the inner wall of the server 1, there is an adjustment component 7. The diversion air-cooling component 5 includes two diversion arc plates 503 that are symmetrically and evenly distributed and fixedly installed inside the server 1. At the front end inside the server 1, there are two side arc plates 505 symmetrically and evenly arranged. In the middle of the rear end of the inner wall of the server 1, there is a positioning frame plate 501 fixedly connected. In the middle of the positioning frame plate 501, there is a fan 502 fixedly connected. During the operation of the server 1, the devices inside will generate heat. In order to ensure that it can work for a long time, the fan 502 is started to drive the air flow to flow, vertically blowing towards the two diversion arc plates 503. Part of the air flows past the two sides of the two diversion arc plates 503 and blows towards the hard disk groups 9 on both sides. Part of the air passes through the middle of the two diversion arc plates 503 and blows towards the two side arc plates 505 distributed at the front end inside the server 1, and cooperates with the inner wall of the server 1 to form a Y-shaped air duct, so that the air flow generated by the fan 502 is divided into two parts and concentratedly guided to the processor 10 and the memory module 6.

[0043] Through the two symmetrically distributed side arc plates 505 and the diversion arc plates 503, they cooperate with the inner wall of the server 1 to form a Y-shaped air duct, concentrating the air flow dispersed by the fan 502 and guiding it to the processor 10 and the memory module 6. Thus, the direction of the air flow can be controlled by the Y-shaped air duct, and the dispersed air flow can be directionally guided, increasing the heat dissipation effect on the internal hardware devices of the server.

[0044] Furthermore, as Figure 2 shown in Figure 3 , in the middle of the rear ends of the two diversion arc plates 503, there is a middle arc mesh plate 507 fixedly connected. At both ends behind the middle arc mesh plate 507, there are arc mesh plates 504 fixedly connected, and the two arc mesh plates 504 are in the middle of the hard disk group 9. The middle arc mesh plate 507 is used to filter the air flow entering the two diversion arc plates 503, and the two arc mesh plates 504 at the rear end of the middle arc mesh plate 507 filter the air flow blowing towards the hard disk group 9 to prevent the air flow from carrying dust;

[0045] Furthermore, as Figure 2 shown in Figure 3 , at both bottom ends on both sides of the side arc plate 505, there are positioning buckles 506 fixedly connected. The bottom ends of the positioning buckles 506 are fixedly installed at the bottom end inside the server 1. The side arc plate 505 is positioned in the server 1 through the positioning buckles 506 to prevent it from shifting.

[0046] Example 2 further optimizes the integrated server cooling mechanism provided in Example 1. Specifically, as Figure 1 ,Figure 2 , Figure 3 , Figure 5 As shown in Figure 6 , the adjusting component 7 includes a flow dividing plate 701 provided between two diversion arc plates 503. A rotating shaft 702 is provided on one side of the front end of the inner wall of the server 1 close to the flow dividing plate 701. On both sides of one end of the flow dividing plate 701 close to the middle arc mesh plate 507, semi-circular magnets 704 are fixedly connected. Columnar magnets 708 are provided near the semi-circular magnets 704, and the magnetic poles between the opposite surfaces of the semi-circular magnets 704 and the columnar magnets 708 repel each other. The flow dividing plate 701 is erected between the two side arc plates 505 to further divide and guide the air flow. After being pushed by one side of the columnar magnet 708, and cooperating with the magnetic repulsion force between the semi-circular magnet 704, the flow dividing plate 701 is pushed and offset with the rotating shaft 702 as the axis. The gap between the flow dividing plate 701 and one of the diversion arc plates 503 is reduced, while the gap between the other side is increased, so that the evenly guided air flow is changed, and more air flow flows toward the end with the larger gap, so as to guide the air flow to the hardware that is at a relatively high temperature.

[0047] The flow dividing plate 701 equipped with the semi-circular magnet 704 is pushed by the columnar magnet 708, so that it is offset with the rotating shaft 702 as the axis, changing the gap between the diversion arc plate 503 and the flow dividing plate 701. More air flow flows toward the side with the larger gap between the flow dividing plate 701 and the diversion arc plate 503, and air cooling is performed on the hardware with a high working temperature in the corresponding space. Thus, the air flow flowing inside the server 1 can be adjusted and guided, so that the air flow is biased toward the hardware with a higher working temperature, ensuring efficient heat dissipation for the hardware devices in the server 1.

[0048] Furthermore, as shown in Figure 2 , As shown in Figure 6 , both ends of the rotating shaft 702 are movably installed with limit frames 703. One end of the limit frame 703 away from the flow dividing plate 701 is fixedly installed at the front end of the inner wall of the server 1. The rotating shaft 702 is positioned at the front end of the inner wall of the server 1 through the limit frame 703, so that the rotating shaft 702 is far away from the semi-circular magnet 704, increasing its force arm, so that it can push the flow dividing plate 701 to rotate and offset with the rotating shaft 702 with less force.

[0049] Furthermore, as shown in Figure 5 , As shown in , an extension cylinder 709 is sleeved on the outer wall of the columnar magnet 708. An airbag 705 is fixedly connected to the inner wall of one end of the extension cylinder 709 away from the columnar magnet 708. By the inflation of the airbag 705, the columnar magnet 708 in the extension cylinder 709 is pushed to move outward, providing power for the offset of the flow dividing plate 701. A spiral water cooling component 8 is provided at the other end of the extension cylinder 709.

[0050] Furthermore, as shown in Figure 5 , Figure 5 ​​​​​​As shown in the figure, on the upper and lower surfaces of the inner wall of one end of the extension cylinder 709 close to the columnar magnet 708, a number of groove frames 706 are fixedly connected in a straight line and evenly distributed. The inner wall of the groove frame 706 is provided with columnar balls 707, which are in contact with the outer wall of the columnar magnet 708. The columnar magnet 708 moves in the extension cylinder 709, and the movement of the columnar balls 707 drives the columnar balls 707 to roll in the groove frame 706, so that the sliding friction between the columnar magnet 708 and the extension cylinder 709 is converted into rolling friction, reducing the friction force therebetween.

[0051] Example 3 further optimizes the integrated server cooling mechanism provided in Example 1 or 2. Specifically, as Figure 2 、 Figure 3 and Figure 4 shown, the spiral water-cooling component 8 includes a spiral pipe 801 fixedly installed at one end of the extension cylinder 709 away from the shunt plate 701. A number of heat conduction plates 803 are evenly distributed at the bottom end of the spiral pipe 801. One group of heat conduction plates 803 is directly above the processor 10, and the other group of heat conduction plates 803 is between the memory modules 6. The side of the extension cylinder 709 close to the spiral pipe 801 and the inside of the spiral pipe 801 are filled with liquid water separated by the air bag 705. When the processor 10 or the memory module 6 generates heat during operation, the heat is transmitted upward by the heat conduction plate 803 and directed to the spiral pipe 801 installed above the heat conduction plate 803, causing the water inside to absorb heat and generate gas, which pushes the air bag 705 to expand outward, thereby performing water-cooling heat dissipation for the hardware working inside the server 1.

[0052] The heat generated during the operation of the hardware is conducted through the heat conduction plate 803 above the hardware and transferred to the water in the spiral pipe 801. The water absorbs the heat, so that water-cooling heat dissipation can be realized for the hardware inside the server 1, improving its heat dissipation effect.

[0053] Furthermore, as Figure 2 and Figure 4 shown, two support frames 802 are fixedly connected to the lower surface of the spiral pipe 801 in a symmetric and evenly distributed manner. The bottom ends of the support frames 802 are installed at the bottom end of the inner wall of the server 1. A filling valve port 804 is provided in the middle of the upper surface of the spiral pipe 801, and water is injected into the spiral pipe 801 through the filling valve port 804.

[0054] Furthermore, as Figure 1 shown, a connection plate 3 is provided at the rear end of the server 1, and heat dissipation windows 2 are provided at the rear ends of both sides of the server 1. Handles 4 are fixedly connected to both sides of the rear end of the connection plate 3. The connection with the device is realized through the connection plate 3, and the heat dissipation windows 2 cooperate with the air flow to be introduced and exported.

[0055] The usage process of the integrated server cooling mechanism provided by the present invention is as follows:

[0056] Working principle: Server 1 is connected to the device and powered to operate. The internal hard disk group 9, processor 10, memory module 6 cooperate with other structures to work.

[0057] Initial air cooling: Start the fan 502 to drive the airflow to flow, vertically blowing towards the two diversion arc plates 503. Part of the airflow blows past the two sides of the two diversion arc plates 503 and towards the hard disk groups 9 on both sides. Part of the airflow passes through the middle of the two diversion arc plates 503 and blows towards the two side arc plates 505 distributed at the front end inside Server 1, cooperating with the inner wall of Server 1 to form a Y-shaped air duct. And a flow dividing plate 701 is installed in the Y-shaped air duct, so that the airflow generated by the fan 502 is divided into two parts and concentratedly guided to the processor 10 and the memory module 6, as shown in the appendix Figure 7 ;

[0058] Water cooling assistance: In the extension cylinder 709, both the side close to the spiral pipe 801 and the inside of the spiral pipe 801 separated by the airbag 705 are filled with liquid water. When the processor 10 or the memory module 6 generates heat during operation, the heat is transferred upward by the heat conducting plate 803 and guided to the spiral pipe 801 installed above the heat conducting plate 803, causing the water inside to absorb heat and generate gas, which pushes the airbag 705 to expand outward, thereby providing water cooling for the hardware working inside Server 1.

[0059] Adjustment control: When the water inside the spiral duct 801 is heated, gas is generated. Due to the temperature, the gas is insoluble in water at this time, and it then pushes the airbag 705 to expand outward, pushing the columnar magnet 708 in the extension cylinder 709 to move outward. At the same time, it drives the cylindrical ball 707 in the groove holder 706 to rotate, and cooperates with the columnar magnet 708 to be smoothly exported. At the other end of the columnar magnet 708, there is a semi-circular magnet 704 that repels it. Moving the columnar magnet 708 closer to the flow divider 701, and the repulsive force between the semi-circular magnet 704 and the columnar magnet 708 always exists, which then pushes the flow divider 701 to rotate around the rotating shaft 702 connected by the limit frame 703, and changes the direction of the airflow distribution and flow. Its flow distribution state has three types. The force generated by the water in the spiral duct 801 above the memory module 6 being heated to produce gas on the airbag 705 is F1. The magnetic repulsive force between the columnar magnet 708 in the extension cylinder 709 at the other end of this spiral duct 801 and the adjacent semi-circular magnet 704 is F2. The force generated by the water in the spiral duct 801 above the processor 10 being heated to produce gas on the airbag 705 is F3. The magnetic repulsive force between the columnar magnet 708 in the extension cylinder 709 at the other end of this spiral duct 801 and the adjacent semi-circular magnet 704 is F4. Among them, the wind force generated by the fan 502 is F5. When the temperatures generated by the processor 10 and the memory module 6 are the same, the heat transferred from the heat conduction plate 803 to the spiral duct 801 is the same, and the force of the water in the spiral duct 801 on the expansion of the airbag 705 is the same, making the forces generated by them the same, that is, F1 = F3. The repulsive forces between the two groups of columnar magnets 708 and semi-circular magnets 704 are the same, that is, F2 = F4. And at this time, the flow divider 701 is in the exact middle of the server 1 without deflection, that is, F5 = 0. The overall structural force-bearing structure is F1 + F2 = F3 + F4, making the airflow be evenly divided and guided by the vertically distributed flow divider 701 to the processor 10 and the memory module 6, as shown in the appendix Figure 7 As shown, when the temperature generated by the memory module 6 is higher than that of the processor 10, the forces received by the airbag 705 in the corresponding extension cylinder 709 are not equal, that is, F1 is greater than F2. The columnar magnet 708 in the extension cylinder 709 above the memory module 6 then pushes the flow divider 701 installed with the semi-circular magnet 704 to deflect around the rotating shaft 702. When the flow divider 701 stops deflecting, the flow divider 701 receives the wind force F5 generated by the fan 502. At this time, the overall structural force-bearing structure is F1 + F2 + F5 = F3 + F4, making the airflow be guided by the flow divider 701 on the side biased towards the processor 10, so that the airflow guided to the side of the memory module 6 is more than that on the side of the processor 10, as shown in the appendix Figure 8As shown, conversely, more air flows to the side of the processor 10 than to the side of the memory module 6, for biased heat dissipation. When the temperature generated by the processor 10 is extremely high, the forces received by the airbag 705 in the extension tube 709 are not equal, that is, F1 is less than F2. The columnar magnet 708 in the extension tube 709 above the processor 10 then pushes the flow dividing plate 701 equipped with the semi-circular magnet 704 to deflect around the rotating shaft 702. The flow dividing plate 701 then receives the wind force F5 generated by the blower 502. At this time, the force structure of its overall structure is F1 + F2 < F5 + F3 + F4. The end of the flow dividing plate 701 away from the rotating shaft 702 then impacts on the flow guiding arc plate 503 on the side close to the memory module 6, thus closing the air duct on the side of the memory module 6 and causing all the air flowing through the two flow guiding arc plates 503 to be directed to the processor 10, as shown in the appendix Figure 9 As shown, conversely, all the air is directed to the memory module 6 for centralized heat dissipation. When the temperature between the processor 10 and the memory module 6 returns to normal or reaches an equal state, at this time F1 + F2 = F3 + F4, and the blower 502 stops rotating, then the flow dividing plate 701 is brought back to a state perpendicular to the inner wall of the server 1. After the server 1 stops working, the temperature returns to normal, and the water vapor condenses back into liquid water again, and the air pressure inside the spiral pipe 801 returns to its original state.

[0060] In the present invention, unless otherwise clearly defined and limited, terms such as "installed", "connected", "linked", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection, an electrical connection, or communication with each other; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the internal communication of two components or the interaction relationship between two components, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0061] Obviously, the embodiments described above are only a part of the embodiments of the present invention, rather than all the embodiments. The accompanying drawings show the preferred embodiments of the present invention, but do not limit the patent scope of the present invention. The present invention can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosed content of the present invention more thorough and comprehensive. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions recorded in the foregoing specific embodiments, or perform equivalent replacements for some of the technical features. Any equivalent structures directly or indirectly using the content of the specification and drawings of the present invention in other related technical fields are equally within the scope of the patent protection of the present invention.

Claims

1. An integrated server cooling mechanism, comprising a server (1), wherein a processor (10) is provided at the bottom on one side inside the server (1), a memory module (6) is provided on the other side inside the server (1), and a hard disk group (9) is provided at the rear end inside the server (1), characterized in that, Inside the server (1), a diversion air-cooling component (5) is provided at the rear end inside and is located in the middle of the hard disk group (9). At the front end of the inner wall of the server (1), an adjustment component (7) is provided. The diversion air-cooling component (5) includes two diversion arc plates (503) that are symmetrically and evenly distributed and fixedly installed inside the server (1). At the front end inside the server (1), two side arc plates (505) are symmetrically and evenly provided. In the middle of the rear end of the inner wall of the server (1), a positioning frame plate (501) is fixedly connected. In the middle of the positioning frame plate (501), a fan (502) is fixedly connected.

2. The integrated server cooling mechanism according to claim 1, wherein In the middle of the tails of the two diversion arc plates (503), a middle arc mesh plate (507) is fixedly connected. At both ends behind the middle arc mesh plate (507), arc-shaped mesh plates (504) are fixedly connected, and the two arc-shaped mesh plates (504) are located in the middle of the hard disk group (9).

3. An integrated server cooling mechanism according to claim 2, characterized in that, At the bottom ends on both sides of the side arc plate (505), positioning buckles (506) are fixedly connected, and the bottom ends of the positioning buckles (506) are fixedly installed at the bottom end inside the server (1).

4. An integrated server cooling mechanism according to claim 1, wherein The adjustment component (7) includes a flow splitting plate (701) provided between the two diversion arc plates (503). On the side of the flow splitting plate (701) close to the front end of the inner wall of the server (1), a rotating shaft (702) is provided. At both ends of the flow splitting plate (701) close to one end of the middle arc mesh plate (507), semi-circular magnets (704) are fixedly connected. Near the semi-circular magnets (704), columnar magnets (708) are provided, and the magnetic poles between the opposite surfaces of the semi-circular magnets (704) and the columnar magnets (708) repel each other.

5. An integrated server cooling mechanism according to claim 4, characterized in that, At both ends of the rotating shaft (702), limit frames (703) are movably installed, and the ends of the limit frames (703) far from the flow splitting plate (701) are fixedly installed at the front end of the inner wall of the server (1).

6. The integrated server cooling mechanism according to claim 4, characterized in that, The outer wall of the columnar magnet (708) is sleeved with an extension cylinder (709). At the end of the extension cylinder (709) far from the columnar magnet (708), an airbag (705) is fixedly connected to the inner wall, and a spiral water-cooling component (8) is provided at the other end of the extension cylinder (709).

7. An integrated server cooling mechanism according to claim 6, wherein, On the upper surface and the lower surface of the inner wall of the extension cylinder (709) close to one end of the columnar magnet (708), a number of groove frames (706) are fixedly connected in a straight line and evenly distributed. Inside the groove frames (706), cylindrical balls (707) are provided and are in contact with the outer wall of the columnar magnet (708).

8. An integrated server cooling mechanism according to claim 6, wherein The spiral water-cooling component (8) includes a spiral pipe (801) fixedly installed at the end of the extension cylinder (709) far from the flow splitting plate (701). At the bottom end of the spiral pipe (801), a number of heat conduction plates (803) are evenly distributed. One group of the heat conduction plates (803) is directly above the processor (10), and the other group of the heat conduction plates (803) is between the memory modules (6).

9. An integrated server cooling mechanism according to claim 8, wherein, On the lower surface of the spiral pipe (801), two support frames (802) are symmetrically and evenly fixedly connected. The bottom ends of the support frames (802) are installed at the bottom end of the inner wall of the server (1). In the middle of the upper surface of the spiral pipe (801), a filling valve port (804) is provided.

10. An integrated server cooling mechanism according to claim 1, characterized in that, A connector board (3) is provided at the rear end of the server (1), heat dissipation windows (2) are provided at the rear ends on both sides of the server (1), and handles (4) are fixedly connected to both sides of the rear end of the connector board (3).

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