Electromagnetic device having a multi-thickness element and method for manufacturing an electromagnetic device

Abstract

The present disclosure proposes an electromagnetic device having a multi-thickness element and a method of manufacturing an electromagnetic device having a multi-thickness element. More specifically, an electromagnetic device having conductive elements and pins of multiple thicknesses is provided. The invention provides a template for manufacturing an electromagnetic device. The template is formed through an extrusion process, a thinning process, a forging and pressing process, a 3D printing process or a machining process. A multi-thickness electromagnetic device may include a conductive element having an increased thickness region and one or more pins having at least one reduced thickness region having a thickness less than a thickness of the increased thickness region. An electromagnetic device may be provided, the electromagnetic device comprising: a conductive element of increased thickness wrapped in a body formed from a core material; and a pin or a pin portion which has a reduced thickness and is connected to the conductive element.

Description

[0001] This application is a divisional application of the patent application for invention titled "Electromagnetic Device with Multi-Thickness Elements and Method of Manufacturing an Electromagnetic Device with Multi-Thickness Elements" with application number "202280054670.4" filed on February 5, 2024.

[0002] Cross - reference to related applications

[0003] This application claims the benefit of U.S. Patent Application Serial No. 17 / 351,782, filed on June 18, 2021, which is incorporated herein by reference in its entirety as if fully set forth herein. Technical Field

[0004] This application relates to the field of electronic components, and more particularly, to electromagnetic devices having multi - thickness elements (e.g., conductive elements and pins for devices such as inductors), methods of manufacturing multi - thickness electromagnetic devices, and electromagnetic devices formed using the multi - thickness templates described herein. Background Art

[0005] Electromagnetic devices (such as inductors) are generally passive two - terminal electronic components. An inductor generally includes a conductor (such as a wire) wound into a coil. When current flows through the coil, energy is temporarily stored in the magnetic field of the coil. When the current flowing through the inductor changes, according to Faraday's law of electromagnetic induction, a time - varying magnetic field induces a voltage in the conductor.

[0006] Some known inductors generally have a core of magnetic material with a conductor (such as a wound coil) disposed therein, and sometimes the conductor is formed as a wound coil. Examples of known inductors include U.S. Patent No. 6,198,375 ("Inductor Coil Structure") and U.S. Patent No. 6,204,744 ("High - Current, Low - Profile Inductor"), the entire contents of which are incorporated herein by reference.

[0007] Typically, it is necessary to form, set, or adjust the performance characteristics of an electromagnetic device by changing the characteristics or parameters of certain elements (such as wires or coils). Many electromagnetic devices use wound coils formed of conductive material. The characteristics of such devices can be adjusted by increasing the number of turns of the coil, thereby increasing the number of coil windings. Thus, this arrangement requires special and careful mechanical adjustment.

[0008] The design of electromagnetic devices that require the coil to be formed as a laminated layer or a folded layer requires additional processing and adjustment. Designs that require different components to be welded together may require additional processing and adjustment and have weaknesses.

[0009] The design of an electromagnetic device with a relatively thick pin portion has the potential to cause the core surrounding the pin to crack when the pin is bent around the core.

[0010] A simple and cost-effective method is needed to produce consistent electromagnetic devices (e.g., inductors) with a lower direct current resistance (DCR).

[0011] There is also a need to fabricate an electromagnetic device (e.g., inductor) in which the electromagnetic device is formed in a manner that improves its performance.

[0012] There is also a need to fabricate an electromagnetic device (e.g., inductor) in which a conductive element (e.g., a coil or wire) can have varying dimensions but is not wound or formed from a wound wire. SUMMARY OF THE INVENTION

[0013] Disclosed herein are electromagnetic devices having multi-thickness conductive elements and leads, and methods of making, forming, or otherwise fabricating multi-thickness electromagnetic devices.

[0014] As used herein, the term "multi-thickness" can refer to having more than one thickness, at least two different thicknesses, multiple thicknesses, varying thicknesses, or multiple different thicknesses. In some aspects, the thickness can be measured along a length, width, or height, depending on the orientation of the electromagnetic device or lead frame. As used herein, the term "multi-thickness electromagnetic device" refers to an electromagnetic device having a coil, conductor, or conductive element and one or more leads, wherein the coil, conductor, or conductive element and the one or more leads have varying thicknesses or different thicknesses, as described in more detail herein. For example, the coil, conductor, or conductive element can have a first thickness, one of the leads can have a second thickness, another of the leads can have a third thickness, and the first thickness is different from the second thickness, and / or the first thickness is different from the third thickness.

[0015] According to one aspect of the present invention, an electromagnetic device includes a conductive element formed of a conductive material, the conductive element being connected to a first lead and a second lead. The conductive element has a first thickness, the first lead has a second thickness, and the second lead has a third thickness. The first thickness can be different from the second thickness. The first thickness can be different from the third thickness. The first thickness can be greater than the second thickness. The first thickness can be greater than the third thickness. The conductive element can be of various shapes.

[0016] A method for fabricating an electromagnetic device according to one aspect of the present invention includes the steps of: providing a conductive material; and forming the conductive material into a conductive element having a first thickness, a first lead portion having a second thickness, and a second lead portion including a third thickness, wherein the first thickness is greater than the second thickness, and wherein the first thickness is greater than the third thickness. The method can also optionally include pressing a body around the conductive element, at least a portion of the first lead, and at least a portion of the second lead.

[0017] The method of making a template for forming a multi - thickness electromagnetic device according to one aspect of the present invention includes the steps of: providing a conductive material; and forming the conductive material into a multi - thickness template, the multi - thickness template including a conductive element having a first thickness, a first lead portion having a second thickness, and a second lead portion including a third thickness, wherein the first thickness is greater than the second thickness, and wherein the first thickness is greater than the second thickness. The template can take the form of a lead frame.

[0018] According to one aspect of the present invention, a method for making a template for a multi - thickness electromagnetic device is provided. The method may include extruding a conductive material into a multi - thickness metal extrusion or sheet having regions of varying thickness or height. The extruded conductive material is a single, continuous, joined, or integral piece of conductive material (e.g., conductive metal). Preferably, the thickness of the region of increasing thickness (e.g., the generally central region of the extruded conductive material) is greater than the thickness of the outer or side regions or portions and / or leads of the extruded conductive material. The multi - thickness extruded conductive material can be electroplated, for example, nickel - plated as a first layer and tin - plated as a second or outer layer. The multi - thickness extruded conductive material is stamped into a multi - thickness template of the desired shape, the multi - thickness template having a conductive element connected to a first lead and a second lead. Thus, the stamped multi - thickness template includes a formed region, which can be regarded as a coil, a coil region, or a wire region, and is generally referred to as a "conductive element". The conductive element is generally formed in the region of increasing thickness of the template at the center or inner region of the template. The conductive element, the first lead, and the second lead are all formed from a single, continuous, joined, or integral piece of conductive material.

[0019] In another aspect of the present invention, a method for making a multi - thickness template for an electromagnetic device is provided. The method includes providing a metal plate or sheet or strip of conductive material having a uniform initial thickness or height. The conductive material is a single, continuous, joined, or integral piece of conductive material. A metal thinning or cutting process is performed on the conductive material using a cutting tool having different - sized surfaces (e.g., a blade having a cutting surface of a first height and at least one non - cutting surface of a smaller second height) to produce a multi - thickness metal sheet. The conductive material can be electroplated, for example, nickel - plated as a first layer and tin - plated as a second or outer layer. The conductive material is stamped into a template of the desired shape, the template having a conductive element connected to a first lead and a second lead. The thickness of the conductive element (associated with the region of increasing thickness of the multi - thickness template) is greater than the thickness of the outer or side regions and / or leads of the multi - thickness template.

[0020] In another aspect of the present invention, a method of making a multi-thickness template for an electromagnetic device is provided. The method includes providing a sheet or strip of metal or conductive material having a uniform starting thickness or height. The conductive material is a single, continuous, connected, or integral piece of conductive material, e.g., a metal sheet. The conductive material can be electroplated, e.g., nickel plated as a first layer and tin plated as a second or outer layer. The conductive material is stamped into a template that includes conductive elements of a desired shape and leads extending from the conductive elements. To produce a multi-thickness template in which the thickness of the conductive elements is greater than the thickness of the outer or side regions of the conductive material and / or the leads, selected outer regions of the template (which can include the leads) can be flattened by methods such as forging or pressing. In this way, the selected outer regions have a reduced thickness or height compared to the thickness or height of the conductive elements.

[0021] In one aspect of the present invention, the conductive elements have a reduced thickness compared to the thickness of a first lead and / or compared to the thickness of a second lead. In such an aspect of the present invention, a method similar to the method described above can be performed such that the conductive elements have a reduced thickness and the first lead or the second lead has an increased thickness compared to the thickness of the conductive elements.

[0022] In one aspect of the present invention, an electromagnetic device can be formed using the template disclosed herein.

[0023] In one aspect of the present invention, an electromagnetic device can be formed having only conductive elements and lead portions of different thicknesses without any additional core (magnetic core body) or core material (magnetic core material) forming a body around the conductive elements or lead portions.

[0024] An electromagnetic device according to one aspect of the present invention can include a compressed and / or molded powder core or body or core formed from magnetic powder, e.g., compressed and / or molded around the conductive elements and portions of the conductive elements (e.g., lead portions adjacent to the conductive elements). The leads can then be positioned and bent around an outer surface of the body to form contact points at one outer surface of the body. Preferably, portions of the leads are positioned along a bottom surface of the body to form surface mount leads. In other aspects, the leads are not bent in this way.

[0025] The conductive material can be formed into conductive elements having a specific shape (e.g., serpentine or meandering), or can be formed into an "S" shape, or other shapes having curved or curvilinear regions, such as circular, oval, or omega (Ω) shaped. The conductive elements can be formed into a selected shape, such as generally rectangular or beam rectangular, "I" shaped or "H" shaped, "barbell" shaped, or other selected shapes. The body of the electromagnetic device surrounds the conductive elements and can be pressed around the conductive elements, leaving leads extending from one or more surfaces of the body.

[0026] It should be noted that the conductive element of the present invention can be formed without winding or providing multiple layers of wires or coils. Aspects of the present invention provide a non-wound conductive element having a shape with regions of increased thickness or height, and formed as an integral piece with the attached pins by extruding, stamping, pressing, and / or cutting a metal sheet. Preferably, the conductive element has no interruptions or breaks along the path from one pin to the other pin. The conductive element is not wound, and no part of it passes above or below, or crosses above or below, another part of the conductive element.

[0027] It will be understood that other conductive materials known in the art, such as other materials for coils or conductive elements in electromagnetic devices, may also be used without departing from the teachings of the present invention. If required for a particular application, insulating materials may also be used around or between parts of the conductive element and / or the pins.

[0028] The pin portions may be arranged along a substantially straight path or be substantially in the same plane, and may have a selected height and width.

[0029] The pins and the conductive element may be formed simultaneously during the manufacturing process. The conductive element does not have to be bonded to the pins, for example, by soldering.

[0030] By applying the teachings described herein, an electromagnetic device having multiple thicknesses of conductive material provided in a single, continuous, or integral piece can be formed.

[0031] The portion of the coil region or conductive element with increased thickness functions to reduce the direct current resistance (DCR) of the inductor.

[0032] The reduction in thickness of the outer portions (such as the pin portions) makes it easier to form the pins. In addition, the pin portions formed according to aspects of the present invention increase the solderable surface area of the pin portions and also improve the shock and vibration performance by enhancing the mounting stability of the component. Furthermore, the formed pin portions also improve the heat conduction between the electromagnetic device and the circuit board (e.g., printed circuit board (PCB)) on which the device is mounted. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The above aspects of the present invention, and many attendant advantages, will be more readily understood from the following detailed description when taken in conjunction with the accompanying drawings:

[0034] Figure 1A An isometric view of a partially transparent electromagnetic device according to one aspect of the present invention is shown;

[0035] Figure 1B As shown in Figure 1ATop view of a partially transparent electromagnetic device according to one aspect of the present invention;

[0036] Figure 1C Shows as Figure 1A Side view of a partially transparent electromagnetic device according to one aspect of the present invention;

[0037] Figure 2A Isometric view of a partially transparent electromagnetic device according to one aspect of the present invention;

[0038] Figure 2B Shows as Figure 2A Top view of a partially transparent electromagnetic device according to one aspect of the present invention;

[0039] Figure 2C Shows as Figure 2A Side view of a partially transparent electromagnetic device according to one aspect of the present invention;

[0040] Figure 3 Shows a flowchart that demonstrates a method for fabricating a multi - thickness template and an electromagnetic device according to one aspect of the present invention;

[0041] Figure 4 Shows a metal sheet formed of a conductive material according to various aspects of the present invention;

[0042] Figure 5A Shows a multi - thickness metal sheet according to one aspect of the present invention;

[0043] Figure 5B Shows Figure 5A Side view of the multi - thickness metal sheet;

[0044] Figure 6 Shows a multi - thickness template according to one aspect of the present invention;

[0045] Figure 7 Shows a multi - thickness template according to one aspect of the present invention, with a body formed around multiple regions of the template;

[0046] Figure 8 Shows a multi - thickness template according to one aspect of the present invention;

[0047] Figure 9 Shows a flowchart that demonstrates a method for fabricating a multi - thickness template and an electromagnetic device according to one aspect of the present invention;

[0048] Figure 10 Shows a blade for performing a thinning process on a metal sheet to form a multi - thickness metal sheet;

[0049] Figure 11 A flowchart is shown which illustrates a method for fabricating a multi-thickness template and an electromagnetic device according to one aspect of the present invention;

[0050] Figure 12 A template according to one aspect of the present invention is shown;

[0051] Figure 13 A detailed view of a multi-thickness template according to one aspect of the present invention is shown, the template having flattened (crushed) pin portions;

[0052] Figure 14 An isometric view of an electromagnetic device according to one aspect of the present invention is shown;

[0053] Figure 15 An isometric view of an electromagnetic device or a template according to one aspect of the present invention is shown; and

[0054] Figure 16 A template according to one aspect of the present invention is shown. Detailed Description

[0055] Certain terms used in the following description are for convenience only and are not limiting. The words "right", "left", "top", and "bottom" denote directions in the indicated figures. The words "a" and "an" as used in the claims and corresponding portions of the specification refer to one or more of the indicated items unless otherwise specifically stated. The term includes the specifically mentioned words, their derivatives, and words of similar import. The phrase "at least one" followed by two or more listed items, such as "A, B, or C", refers to any one of A, B, or C, and any combination thereof. It should be noted that the partial transparency shown in some figures is for explanatory, illustrative, and demonstrative purposes only and does not indicate that the element itself is transparent in its final manufactured form.

[0056] Figures 1A-1C An example of an electromagnetic device 100 that can be formed according to one aspect of the present invention is shown, the electromagnetic device 100 including a conductive element 150 having a selected shape. The conductive element may also be referred to as a "coil" or a "coil region". In Figures 1A-1C One illustrated embodiment, the conductive element 150 includes a serpentine or meandering conductive element, from Figure 1A and Figure 1BViewed in the direction of, or from above or below, the conductive element is an "S-style" conductive element, an "S-shaped" conductive element, or an "S-style conductive element". The first bent portion C1 has a first end 152 (also referred to as a "pin portion") extending from adjacent to one pin 140a and a second end 153, and the first bent portion C1 bends around the center of the conductive element 150. The second bent portion C2 has a first end 155 (also referred to as a "pin portion") extending from the other pin 140b and a second end 154, and the second bent portion bends around the center of the conductive element 150 in a direction opposite to that of the first bent portion C1. Each bent portion forms an arc surrounding the central portion of the conductive element 150. Each bent portion can travel along a circumferential path around the central region of the device. A similar shape configuration of an electromagnetic device is shown and described in U.S. Patent No. 10,854,367, the entire content of which is incorporated herein by reference as if fully set forth herein. The conductive element 150 has a central portion 151 that extends generally diagonally (across) and between the second end 153 and the second end 154 and connects the second end 153 to the second end 154 and preferably can pass through the central region of the conductive element. The central portion 151 is generally straight.

[0057] The S-style conductive element or "S" shape is a display of one aspect of the present invention. The present invention also contemplates other configurations, including arcuate, Z-shaped conductive element configurations, or N-shaped conductive element configurations. Bent or straight conductive elements are also contemplated by the present invention and are within the scope of the present invention. A conductive element configuration that extends along a meandering path between pins and in which a portion of the conductive element passes through the midline or central portion of the conductive element or electromagnetic body will be considered a "serpentine" conductive element. For example, but not limited to, S-shaped conductive elements, Z-shaped conductive elements, N-shaped conductive elements, and conductive elements of other shapes having a meandering path that travels from one pin to another are all considered "serpentine" conductive elements. The shape of the conductive element 150 can be designed to optimize the path length to fit the available space within the electromagnetic device while minimizing resistance and maximizing inductance. The shape of the conductive element 150 can be designed to increase the ratio of the space used to the available space within the electromagnetic body. In one embodiment of the present invention, the conductive element 150 has a top surface or upper surface that is preferably flat and is oriented substantially in a plane. A serpentine conductive element can be considered a coil or coil region, but is distinct from a "wound" conductive element formed by a wire or piece of conductive material that is wound around and surrounds the central portion or axis of an electromagnetic core.

[0058] As Figures 1A-1CAs shown, the illustrated electromagnetic device 100 has a length L1 that travels along the X1-X2 axis or direction, where X1 points in a first direction and X2 is a second direction opposite the first direction; a length L2 that travels along the Y1-Y2 axis or direction, where Y1 points in a third direction and Y2 points in a fourth direction opposite the third direction; and a first thickness H1 (or height when viewed from the side as shown) that travels along the Z1-Z2 axis or direction, where Z1 points in a fifth direction and Z2 points in a sixth direction opposite the fifth direction. For ease of reference, the Z1-Z2 axis is referred to as the "thickness". For ease of reference, one or more regions of the conductive element having an increased thickness or height may be referred to as "thickness-increase regions". Figure 1C As shown, the side view when viewed from the side as shown.

[0059] According to one aspect of the present invention, as Figure 1C shown, the conductive element 150 has a thickness-increase region 159, as Figure 1C shown, the thickness-increase region 159 has a first thickness T1 that is increased compared to the second thickness T2 and the third thickness T3 of the partial conductive material (e.g., pins 140a, 140b) along the Z1-Z2 axis, and includes pin portions 156, 157 that are adjacent to the outer ends 174, 175 of the conductive element 150. In this configuration, the conductive element 150 having an "S" shape substantially entirely includes the thickness-increase region 159. It can be understood that the portion of the conductive element having a thickness-increase region may also be less than the entire conductive element having an "S" shape. For example, the conductive element may be formed to have a thicker portion and a thinner portion, where each thicker portion includes a thickness-increase region. In this configuration, the pin 140a has a thickness T2 along substantially the entire length of the pin 140a, and the pin 140b has a thickness T3 along substantially the entire length of the pin.

[0060] As Figures 1A-1CAs shown, in one aspect of the present invention, a finished electromagnetic device such as inductor 100 may include a body 133 (also referred to as a core) shown in a partially transparent form, which is formed to surround, press on, or otherwise accommodate or enclose a conductive element and at least a portion of the leads. The body may be formed into a first body portion 110 and a second body portion 120. The first body portion 110 and the second body portion 120 clamp the conductive element 150 and portions of the leads 140a, 140b, are pressed (compressed) around the conductive element 150 and portions of the leads 140a, 140b, or otherwise accommodate or enclose the conductive element 150 and portions of the leads 140a, 140b to form the finished inductor 100. When compressed (pressed) around the conductive element and portions of the leads, the first body portion 110 and the second body portion 120 may form and be regarded as a single integral compressed body, and may be simply referred to as the "body" or "core".

[0061] The body 133 may be formed of a magnetic material including a ferromagnetic material and may be formed to have an upper or top surface 134 and an opposite lower or bottom surface 135, a first side surface 136 and an opposite second side surface 137, and a first lateral side 170 adjacent to the first lead 140a and an opposite second lateral side 172 adjacent to the second lead 140b. The body may include, for example, iron, metal alloys, and / or ferrites, combinations of these materials, or other materials known in the art of electromagnetic devices for forming such bodies. The first body portion 110 and the second body portion 120 may be composed of iron powder or similar materials. Other acceptable materials known in the art of electromagnetic devices (such as known magnetic materials) may also be used to form the body or body portions. For example, the body may use a magnetic molding material as described in U.S. Patent No. 6,198,375 ("Electromagnetic Conductive Element Structure") and U.S. Patent No. 6,204,744 ("High Current, Low Profile Inductor"), which magnetic molding material includes iron powder, filler, resin, and lubricant, the entire contents of the above U.S. patents being incorporated herein by reference as if fully set forth herein. The body 133 may be formed of a magnetic material powder including one or more of the following materials: iron, iron alloys, and / or ferrites and / or combinations of these materials. For example, the body 133 may be composed of iron, metal alloy, or ferrite, combinations of these materials, or other materials known in the art of inductors for forming such bodies. Each material listed or referenced in U.S. Patent No. 6,198,375 and U.S. Patent No. 6,204,744 (including any combination of these materials) and any equivalents known in the relevant art are generally referred to as "a core material (magnetic core material)" or "core materials". Although it is conceivable that the first body portion 110 and the second body portion 120 are formed of the same core material in a similar manner, the first body portion 110 and the second body portion 120 may be formed using different processes and of different core materials, which is known in the art.

[0062] The conductive material regions located between the thickness increasing region T1 and the outer lateral sides 170, 172 of the body 133 may be regarded as the starting portions of the leads 140a and 140b, or the transition portions of the conductive element 150, which starting or transition portions have a smaller thickness or height and extend between the thickness increasing region and each of the lateral sides 170, 172. For ease of reference, these regions are referred to as the first inner lead portion 156 and the second inner lead portion 157, which portions will be included within or otherwise surrounded by the body 133 as further described.

[0063] The first body portion 110 and the second body portion 120 surround the conductive element and portions of the leads and can be compression or overmolded around the conductive element 150, and initially leave exposed portions of the leads 140a, 140b until these exposed portions are folded under the first body portion 110, and the final state of these exposed portions is shown in the partially transparent examples of FIGS. 1 and 2. As Figures 1A-1C shown, in a finished electromagnetic device or "component", each lead 140a, 140b can have a portion that travels along or otherwise extends along the side or side surface of the first body portion 110. As Figures 1A-1C shown, the first lead 140a can terminate at a surface mount contact portion 130a, and the second lead 140b can terminate at a surface mount contact portion 130b, with each lead 140a and 140b bent under the lower surface 135 of the body 133 (which can be the first body portion 110).

[0064] It is contemplated that an electromagnetic device in accordance with aspects of the present invention can be formed as a coreless body, such as where its leads are bent to form surface mount terminals. Figure 14 An example is shown. Figure 15 A similar coreless device is shown, where its leads are straight or unbent and extend straight outwards from the conductive element or at an angle. Thus, Figure 14 and Figure 15 show examples of finished electromagnetic devices that can include the multi-thickness conductive element and lead portions described, but without any core material or core body surrounding these elements. The electromagnetic device 100' can include a conductive element 150' having a serpentine shape. The first bent portion C1' has a first end 152' (also referred to as a "lead portion") extending adjacent to one lead 140a' and a second end 153', and the first bent portion C1' bends around the center of the conductive element 150'. The second bent portion C2' has a first end 155' (also referred to as a "lead portion") extending from the other lead 140b' and a second end 154', and the second bent portion bends around the center of the conductive element 150' in a direction opposite to that of the first bent portion C1'. Each bent portion forms an arc that surrounds the central portion of the conductive element 150'. Each bent portion can travel along a circumferential path around the central region of the device. The central portion 151' of the conductive element 150' extends generally diagonally across and between the second end 153' and the second end 154' and connects the second end 153' to the second end 154', and preferably can pass through the central region of the conductive element. The central portion 151' is generally straight. The first inner lead portion 156' is adjacent to the first end 152'. The second inner lead portion 157' is adjacent to the second end 155'. The conductive element 150' has a thickness increasing region 159'. In Figure 15In [description], pins 140a’ and 140b’ are shown as extending straight outwards from conductive element 150’. In Figure 14 In [description], pins 140a’ and 140b’ are bent to form surface mount pin portions 130a’ and 130b’. In Figure 15 In [description], the thickness increasing region of conductive element 150’ has a first thickness TH1B that is greater than a second thickness TH2B near outer end 174’ and a third thickness TH3B near outer end 175’.

[0065] Pins 140a and 140b may have the same uniform thickness or substantially the same uniform thickness along their entire lengths.

[0066] In another aspect of the present invention, Figures 2A-2C An example of an electromagnetic device 200 that can be formed according to one aspect of the present invention is shown. The electromagnetic device 200 includes a shaped conductive element 250. In Figures 2A-2C In the exemplary device shown, the conductive element 250 includes a substantially straight conductive element that, when viewed from the top as Figure 2B shown, is arranged as an “I” or “H”-shaped conductive element, or a conductive element having a “barbell” shape. Such a conductive element can further be regarded as or referred to as a coil. In this arrangement, the central portion 252 of the conductive element 250 has a width W1 along the Y1 - Y2 axis or direction (as Figures 2A-2C shown), the first side portion 253 has an outer width W2 along the Y1 - Y2 axis or direction (as Figures 2A-2C shown), the outer width W2 is greater than the width W1, and the second side portion 254, which is on the side of the device 200 opposite to the first side portion 253, has an outer width W3 along the Y1 - Y2 axis or direction (as Figure 3 shown), the outer width W3 is greater than the width W1, and may be the same as the width W2. The conductive element 250 may have a generally rectangular shape between the first side portion 253 and the second side portion 254.

[0067] As Figures 2A-2C shown, according to one aspect of the present invention, the conductive element 250 has a thickness increasing region 259, as Figure 2CAs shown, the thickness-increasing region 259 has a first thickness T1' that is increased compared to the second thickness T2' and the third thickness T3' of other portions of the conductive material, such as the pin portions (including the first inner pin portion 255 and the second inner pin portion 257) adjacent to the outer ends 274, 275 of the conductive element 250, along the Z1-Z2 axis or direction. In this configuration, substantially all of the conductive element having a "barbell" shape can have the increased first thickness T1'. It can be understood that the portion of the conductive element having the thickness-increasing region can also be less than all of the conductive element having a "barbell" shape. It should be noted that the conductive element 250 is not wound around an axis.

[0068] Although the finished electromagnetic device according to the present invention can be formed without a core body, as Figures 2A-2C shown, in one aspect of the present invention, a finished electromagnetic device 200 such as an inductor can include a body 233 or a core body, which is shown in a partially transparent manner and formed around, pressed onto, or otherwise accommodating or surrounding the conductive element 250 and at least a portion of the pins 240a, 240b. The body 233 can be formed to have an upper surface or top surface 234 and an opposite lower surface or bottom surface 235, a first side surface 236 and an opposite second side surface 237, and a first lateral side surface 270 adjacent to the first pin 240a (or "pin portion") and an opposite second lateral side surface 272 adjacent to the second pin 240b (or "pin portion"). The body can be formed as a first body portion 210 and a second body portion 220. The first body portion 210 and the second body portion 220 clamp the conductive element 150 and the portions of the pins 240a and 240b, press around the conductive element 150 and the portions of the pins 240a and 240b, or otherwise accommodate the conductive element 150 and the portions of the pins 240a and 240b to form the finished inductor 200. When compressed around the conductive element and the portions of the pins, the first body portion 210 and the second body portion 220 can be regarded as a single integral compressed body formed of one or more core materials.

[0069] The first body portion 210 and the second body portion 220 surround the conductive element and the portions of the pins and can be compression molded or overmolded around the conductive element 250, initially leaving exposed portions of the pins 240a and 240b until these exposed portions are folded under the first body portion 210, Figures 2A-2C and the final state of these exposed portions is shown in the partially transparent example of Figures 2A-2C shown. As Figures 2A-2CAs shown, the first pin 240a can terminate at the first contact portion 230a, and the second pin 240b can terminate at the second contact portion 230b, with each contact portion being bent below the lower surface 235 of the body 233 (such as the first body portion 210).

[0070] A method for fabricating Figures 1A-2C or Figures 14-16 the electromagnetic device exemplarily shown in Figures 1A-2C or Figures 14-16 a similar electromagnetic device having multi - thickness elements or a multi - thickness template for forming the electromagnetic device shown in

[0071] In one aspect of the present invention, the flowchart provided in Figure 3 shows a method for fabricating an electromagnetic device.

[0072] In step 1010, a conductive material is provided. The conductive material can be heated to form a molten conductive material, which will be shaped as described herein. Examples of conductive materials that can be used include, but are not limited to, copper, steel, aluminum, zinc, bronze, or combinations or alloys of these materials. Further examples of conductive materials that can be used include conductive materials provided in the form of wires such as copper wires, aluminum wires, and platinum wires.

[0073] In step 1012, the conductive material (e.g., the heated or molten conductive material) is extruded through a metal extrusion process (e.g., by extruding the heated or molten conductive material through an opening of a selected shape) to form a multi - thickness sheet. The extrusion process can include forcing the molten or heated conductive material (such as a metal) through a die having a desired profile or shape. Figure 5A and Figure 5B shows a multi - thickness sheet 310 having a central region 312, a first outer portion 316, and a second outer portion 320. The central region 312 has a thickness - increasing region 314 having an increased first thickness TH1. The first outer portion 316 is adjacent to the first side 318 of the thickness - increasing region 314 and has a second thickness TH2 less than the thickness TH1. The second outer portion 320 is adjacent to the second side 329 of the thickness - increasing region 314 and has a third thickness TH3 less than the thickness TH1. As shown, the first outer portion 316 and the second outer portion 320 can be located on opposite sides of the thickness - increasing region 314. As further described, the multi - thickness sheet 310 is used to form a template.

[0074] In step 1014, the multi-thickness sheet 310 can be electroplated using electroplating or a similar process. Among them, nickel plating is the first layer, and tin is applied on top of the nickel as the second layer. Known electroplating methods can be used to apply the nickel layer and the tin layer. These layers can improve solderability.

[0075] In step 1016, the multi-thickness sheet 310 is stamped or otherwise processed or formed to form a multi-thickness template 322 for an electromagnetic device as shown in Figures 1A-1C . Figure 6 The multi-thickness template 322 with the conductive element 150 is shown. The conductive element 150 has an arrangement as shown in Figures 1A-1C , but it can be understood that conductive elements of various shapes can be formed without departing from the teachings herein. When stamped or otherwise processed, the template 322 includes a thickness-increased area that is associated with the thickness-increased area 314 of the increased thickness TH1 of the multi-thickness sheet 310 used to form the template 322. The conductive element 150 can be located at the center or inner area of the template.

[0076] Although Figure 6 shows more than one conductive element by way of example, a template with only a single conductive element provided therein can also be provided. In addition, the template can also be provided with more than two or any number of conductive elements.

[0077] It should be noted that steps 1014 and 1016 can be performed in any order. For example, the multi-thickness sheet 310 can be formed into the multi-thickness template 322 according to step 1016 and then electroplated according to step 1014.

[0078] As shown in Figure 6 , the template 322 includes pins 140a, 140b connected to the conductive element 150. Among them, the areas where the pins 140a, 140b are formed are associated with the first outer portion 316 having a thickness TH2 and the second outer portion 320a having a third thickness TH3. Therefore, the thicknesses of both pins 140a and 140b are smaller than the increased thickness TH1 of the conductive element 150. The first inner pin portion 156 and the second inner pin portion 157 adjacent to the conductive element 150 can facilitate (for example, by bending) the formation of the pins. Due to the reduced thickness of the pins, these areas are easier to bend and form surface mount pins without cracking or breaking. As shown in Figure 1B and Figure 6 , the widths of the pins 140a, 140b along the Y1 - Y2 axis or direction can be smaller than the width of the conductive element 150.

[0079] For example, as shown in Figures 1A-1C and Figure 6As shown, the width (along the Y1 - Y2 axis or direction) of the first inner pin portion 156 of the first pin 140a and the second inner portion 157 of the second pin 140b can be narrower or smaller than the width of other portions of the pins 140a, 140b (e.g., the first surface - mount contact portion 130a and the second surface - mount contact portion 130b).

[0080] The upper surface of the conductive element 150 can be formed to be substantially in a plane or along a plane. The lower surface of the conductive element 150 can be formed to be substantially in a plane or along a plane. The upper or lower surface of the conductive element can be substantially flat.

[0081] The pins 140a, 140a can be formed to have an upper or lower surface that is substantially in a plane or along a plane. The upper or lower surface of the pins 140a, 140b can be substantially flat.

[0082] As Figure 6 shown, the template 322 can be formed as a pin - frame and can include at least first and second carrier tapes 324, 326 at opposite outer portions of the pin - frame 322. The carrier tapes 324, 326 can have a series of holes 328 for alignment with associated manufacturing equipment. Thus, the carrier tapes 324, 326 can be considered optional.

[0083] It should be noted that the conductive element 150, the pins 140a, 140b, and the carrier tapes 324, 326 (if present) are all formed from the same piece of conductive material, which has been pre - formed such that the conductive element 150 has a thickness that is increased compared to the thickness of the pins 140a, 140b. The conductive element 150 is formed in a pre - selected shape without winding or turning a metal strip or wire. No part of the conductive element 150 crosses above or below another part of the conductive element 150. The inductance of the electromagnetic device taught herein can be adjusted in the following ways, for example: changing the thickness, width, shape, or other dimensions of the conductive element; changing the core material; increasing or decreasing the thickness of the core material; changing the density of the core material, e.g., by hot - pressing or cold - pressing; and / or positioning the conductive element within the core body.

[0084] It should be further noted that Figure 15 also can be considered to show a template of an electromagnetic device, which can be further formed, for example, by trimming or bending the pins 140a’, 140b’. In this case, the template can be formed by stamping a multi - thickness conductive material into Figure 15 the shape shown in

[0085] In step 1018, when the device has a core, one or more core materials (preferably, core materials composed of powders of iron and / or ferrite) are pressed around the conductive element 150 and the partial leads 140a, 140b (including the first inner lead portion 156 and the second inner lead portion 157) to form the body 133. To form the body 133, the electroplated template 322 can be inserted into a press, in which one or more core materials will be pressed into a desired shape around the coil portion of the lead frame, for example, generally rectangular, but as shown, the shape can include rounded corners or rounded edges. Figure 7 The template 322 is shown, and the body formed around the conductive element 150 and the partial leads 140a, 140b is shown, where the body 133 is shown in a partially transparent manner. It should be noted that if an electromagnetic device without a core is to be formed, step 1018 can be optional.

[0086] In step 1020, the portion of the template adjacent to the leads is trimmed to a selected size and positioned around the body 133 to form surface-mount leads, which are ideal for modern circuit board assembly processes. At least a portion of each lead 140a, 140b is positioned along the side surface of the body 133, and at least the ends 130 of the leads 140a, 140b are bent under and along a portion of the bottom surface 135 of the body 133. As previously mentioned, an example of the finished electromagnetic device 100 is shown in Figure 1A shown.

[0087] Figure 8 The template 330 is shown, and the template 330 can be formed according to the Figure 3 steps shown and is associated with an electromagnetic device having a conductive element 250 as shown in Figures 2A-2C shown. As shown in Figure 8 shown, the template 330 includes the conductive element 250, and the conductive element 250 includes a straight conductive element, which, when viewed from the top, is arranged as an "I" or "H" shaped conductive element, or a conductive element having a "barbell" shape. The template can be formed according to the steps outlined and described previously in Figure 3 shown. In step 1016, the selected shape of the conductive element 250 is shown in Figures 2A-2C shown.

[0088] As shown in Figure 8As shown, the template 330 includes a conductive element 250 and pins 240a, 240b. For example, if the template 330 is formed as a lead frame, carrier tapes 332, 334 may be provided. The conductive element 250 and the pins 240a, 240b are both formed from the same single piece of conductive material. The carrier tapes 332, 334 may have a series of holes 336 for alignment with associated manufacturing equipment. The conductive element 250 may be formed to have a thickness-increased region 280 having a thickness TH1a. The first pin 240a has a thickness TH2a, and the second pin 240b has a third thickness TH3a. Thus, the thicknesses of the pins 240a, 240b are both less than the increased thickness TH1a of the conductive element 150. The thicknesses of the first inner pin portion 255 and the second inner pin portion 257 adjacent to the conductive element 150 are reduced to facilitate (e.g., by bending) the formation of the pins. Due to the reduced thickness of the pins, these regions are more easily bent and formed into surface mount pins without cracking or breaking. For example, as Figure 2B and Figure 8 shown, the widths (along the Y1 - Y2 axis or direction) of the first inner pin portion 255 and the second inner pin portion 257 may be narrower or smaller than the widths of other portions of the pins 240a, 240b (e.g., the first surface mount contact portion 230a or the second surface mount contact portion 230b).

[0089] In various aspects of the present invention, a thinning or cutting process may also be used to fabricate electromagnetic devices. The thinning process uses a cutting blade to remove material.

[0090] In one aspect of the present invention, by Figure 9 The provided flowchart shows a method for fabricating an electromagnetic device. In step 2010, a sheet of conductive material is provided as a starting material, which may be formed from a conductive material (e.g., by a rolling or pressing process). Figure 4 An example sheet 300 of conductive material is shown. The use of the term "sheet" is also to understand the concept of using a sheet or plate or strip of a piece of conductive material as a starting material for forming the template of the present invention. Preferably, the sheet 300 of conductive material is composed of a metal such as copper. Examples of conductive materials that can be used to form the sheet 300 include, but are not limited to, copper, steel, aluminum, zinc, bronze, or combinations or alloys of these materials. The thickness of the metal sheet can be selected as the thickness of the thickness-increased region of the conductive element to be formed from the sheet. It is further contemplated that the conductive material may be formed or provided as or may start as a rod, wire, or other arrangement or shape that can be processed or formed according to the teachings herein without departing from the various aspects of the present invention. Thus, while a sheet is used as an example, other conductive materials having other shapes may also be used to form the electromagnetic device as shown and described.

[0091] In step 2012, a thinning process is performed, wherein a sheet is cut using a blade to form a multi-thickness sheet 410.

[0092] Figure 10 Shown is a cutting blade 437 having a raised central cutting portion 439 as shown in the process of cutting a sheet of conductive material to form a multi-thickness sheet 410. The resulting multi-thickness sheet 410 has: a central region 412 provided as a thickness-increasing region, the central region 412 having an increased thickness; a first outer portion 416 adjacent to a first side 418 of the thickness-increasing region 414, the first outer portion 416 having a second thickness less than the thickness of the central region 412; a second outer portion 420 adjacent to a second side 422 of the thickness-increasing region 414, the second outer portion 420 having a third thickness less than the thickness of the central region but which may be equal to the thickness of the first outer portion 416. As shown, the first outer portion 416 and the second outer portion 420 may be located on opposite sides of the thickness-increasing region 414. As further described, the multi-thickness sheet 410 is used to form a template.

[0093] In step 2014, the multi-thickness sheet may be electroplated using electroplating or a similar process, nickel being plated as the first layer and then tin being plated on top of the nickel as the second layer.

[0094] In step 2016, the multi-thickness sheet 410 is stamped or otherwise processed to form a multi-thickness template for use in an Figures 1A-1C electromagnetic device as shown. At this stage, the process may provide a multi-thickness template as Figure 6 shown.

[0095] In step 2018, one or more core materials (preferably core materials composed of powders of iron and / or ferrite) are pressed around the conductive element and part of the pins (including the first inner pin portion and the second inner pin portion) to form a body. At this stage, the Figure 7 shown shows a body 133 formed around part of the template. If no core is required, step 2018 may be optional.

[0096] In step 2020, the part of the template adjacent to the pins is trimmed to a selected size and positioned around the body to form surface-mount pins, which are ideal for modern circuit board assembly processes. At least part of each pin is positioned along the side surface of the body, and at least the end of the pin is bent under and along part of the bottom surface of the body. As previously described, an exemplary final electromagnetic device 100 is shown in Figure 1A this.

[0097] The thinning process can also be used to form a structure having Figures 2A-2CThe electromagnetic design of the shown arrangement. The thinning process can also be used to form conductive elements having various shapes, sizes, orientations, and / or arrangements.

[0098] Forging and / or pressing and / or flattening (squashing) processes can also be used to form electromagnetic devices according to various aspects of the present invention.

[0099] In one aspect of the present invention, the Figure 11 flowchart provided in shows a method for fabricating an electromagnetic device. In step 3010, a sheet of conductive material is provided as a starting material. Figure 4 Sheet 300 shown in shows such an exemplary sheet of conductive material.

[0100] In step 3012, the sheet can be electroplated using electroplating or a similar process, nickel being plated as the first layer and then tin being plated on top of the nickel as the second layer. In this regard, the thickness of the sheet is uniform at this process stage. As further discussed, this thickness represents the increased thickness of the conductive element.

[0101] In step 3014, stamping or other machining processes are performed to form a template with a uniform thickness.

[0102] Figure 12 Shows a template 500 in the process of being formed, the template 500 including a formed conductive element 520, a first lead 530a, and a second lead 530b, the formed conductive element 520, the first lead 530a, and the second lead 530b all being formed from the same single piece of conductive material that forms the sheet. If the template 500 is formed as a lead frame, carrier tapes 540, 542 can be provided. The carrier tapes 540, 542 can have a series of holes 544 for alignment with associated manufacturing equipment.

[0103] To obtain a multi-thickness template, in step 3016, the first lead 530a and the second lead 530b or portions of each lead are flattened, for example by forging or pressing.

[0104] Figure 13 Shows a detailed view of a portion of the template 500, in which the first lead 530a and the second lead 530b are flattened or compressed so that the thickness of the leads is reduced compared to the thickness of the conductive element 520. Different processes (e.g., stamping, rolling, roll forming, or milling) can be used to produce the thickness-reduced portions.

[0105] After flattening the first pin 530a and the second pin 530b, the central region 512 of the conductive element 520 of the template 500 is formed into a thickness-increased region 514 having the thickness of the original sheet, the thickness of the first pin 530a is reduced and is less than the thickness of the central region 512, the thickness of the second pin 530b is reduced and is less than the thickness of the central region 512, but may be the same as the thickness of the first pin 530a. The thicknesses of the carrier tapes 540, 542 may be the same as the thickness of the conductive element 520 if these regions are not flattened.

[0106] In step 3018, one or more core materials (preferably core materials composed of powders of iron and / or ferrite) are pressed around the conductive element 520 and the partial pins 530a, 530b to form a body 546. To form the body 546, the electroplated template 500 may be inserted into a press, in which one or more core materials will be pressed into a desired shape around the coil portion of the lead frame, for example, generally rectangular, but as shown in the figure, the shape may include rounded corners or rounded edges. At this stage, the arrangement of the pin body and the frame is similar to that described previously. Figure 7 If no core is required, step 3018 may be optional.

[0107] In step 3020, the portion of the template adjacent to the pins is trimmed to a selected size and positioned around the body 546 to form surface-mount pins, which is ideal for modern circuit board assembly processes. At least a portion of each of the pins 530a, 530b is positioned along the side surface of the body 133, and at least the ends of the pins 530a, 530b are bent under and along a portion of the bottom surface of the body 546.

[0108] It is conceivable that the steps used in Figure 11 may be employed to form a template including a conductive element, the conductive element being composed of straight conductive elements (e.g., Figures 2A-2C the conductive elements in

[0109] In addition, it is also possible to start from a template with a substantially uniform thickness (as shown in Figure 12 ) and form a conductive element having a thickness-increased region by electroplating to thicken the conductive element 520. For example, copper may be electroplated above or on top of the conductive element 520 until a certain thickness is reached. This "thickening" process may be accomplished by, for example, 3D printing the electroplating material or by depositing a metal onto the conductive element 520 using methods known in the metalworking industry (such as sputtering, etc.).

[0110] The method described herein can also be used to form an electromagnetic device having a shaped conductive element having a reduced thickness compared to the thickness of one or more pins. For example, referring to Figure 3 , as step 1012, an extrusion process can form a multi-thickness sheet where the central portion of the sheet has a reduced thickness and the outer side of the sheet has a greater thickness than the central portion. Further by way of example, referring to Figure 9 , in step 2012, a thinning process can form a multi-thickness sheet where the central portion of the sheet has a reduced thickness and the outer side of the sheet has a greater thickness than the central portion. Further by way of example, referring to Figure 11 , in step 3016, a flattening process can flatten the conductive element rather than the pins, thereby forming a conductive element having a reduced thickness compared to the pins.

[0111] Thus, as shown in the example of Figure 16 , the template 700 is stamped from a single piece of conductive material having a uniform thickness, such as the sheet shown in Figure 4 . A stamping or other forming process forms a conductive element 750 (which can be a serpentine conductive element), a first pin 740a, and a second pin 740a, and the conductive element 750, the first pin 740a, and the second pin 740a are all formed from the same single piece of conductive material. In this regard, the conductive element 750 is stamped, pressed, forged, or thinned to produce an electromagnetic device where the thickness of the conductive element is smaller compared to the pins 740a, 740b. The conductive element 750 can be serpentine, barbell-shaped, or other selected shapes, or can be generally flat, with one or more of its surfaces along or within a plane. The pins 740a, 740b can be bent or trimmed according to methods known in the art or the methods described herein. A core can be molded around the conductive element 750 and a portion of the pins.

[0112] The conductive material or sheet of conductive material can be formed such that the region for forming the conductive element has a different hardness from the region for forming the first pin portion or the second pin portion. For example, a first portion of the conductive material can have a first hardness (e.g., medium hard), and a second portion of the conductive material can have a second hardness (e.g., annealed soft). Alternatively, a first portion of the conductive material can have a first hardness (e.g., Vickers hardness 100HV10), and a second portion of the conductive material can have a second hardness (e.g., Vickers hardness 30HV10).

[0113] It is understood that, depending on the process used to form the conductive element, the surface of the conductive element and / or the pin described herein may be slightly or somewhat rounded, arched, or curved, and the side edges may be rounded, curved, or arched. Acceptable metals for forming the conductive element and the pin may be copper, aluminum, platinum, or other metals known in the art as electromagnetic conductive elements. As used herein, "flat" means "substantially flat", that is, substantially flat within normal manufacturing tolerances. It is understood that the flat surface of the conductive element and / or the pin may be slightly or somewhat rounded, arched, curved, or wavy depending on the process used to form the conductive element, and the side edges may be slightly or somewhat rounded, arched, curved, or wavy, but are still considered "flat".

[0114] The increased thickness portion or region of the conductive element described herein can reduce the direct current resistance (DCR) of an electromagnetic device (such as an inductor) including such a conductive element.

[0115] The template described herein can provide multiple thicknesses in a single integral piece. The template described herein can also be formed by 3D printing technology.

[0116] The thickness reduction region of the pin or pin portion of the template facilitates the formation of the pin (e.g., by shaping and / or bending). In addition, the thinner but wider pin portion can improve heat conduction when mounted on a circuit board, and due to the width of the surface mount pin or terminal, the mounting strength can be further improved to resist shock and vibration.

[0117] It is understood that the above is for illustration only and not any limitation. Without departing from the spirit and scope of the present invention, various alternatives and modifications to the described embodiments can be envisioned. After the present invention has been described in detail, those skilled in the art should understand that many physical changes can be made without changing the creative concepts and principles embodied in the present invention, and only some of these changes are exemplified in the specific embodiments of the present invention. In addition, it can also be understood that many embodiments only include a part of the preferred embodiments, and these embodiments do not change the concepts and principles embodied therein. Therefore, the embodiments and alternative configurations of the present invention should be considered exemplary and / or illustrative in all respects and not restrictive, and the scope of the present invention is indicated by the appended claims rather than the above description. Therefore, all alternative embodiments and changes to the embodiments of the present invention within the meaning and equivalent scope of the said claims should be included therein.

Claims

1. A method for manufacturing an inductor, the method comprising the following steps: Providing a conductive material; Forming the conductive material into a sheet having a uniform thickness; And Forming the sheet into a template by: Forming a first portion of the sheet into a coil region, Forming a second portion of the sheet into a first lead portion adjacent to a first side of the coil region, Forming a third portion of the sheet into a second lead portion adjacent to a second side of the coil region, Wherein each of the coil region, the first lead portion, and the second lead portion has a thickness between a top surface and a bottom surface of the template, and wherein the coil region, the first lead portion, and the second lead portion are formed as part of the template such that one of the thicknesses is different from at least one of the other thicknesses; Separating the first lead portion from the template; and Separating the second lead portion from the template.

2. The method according to claim 1, the method further comprising reducing the thickness of the first lead portion relative to the thickness of the coil region and reducing the thickness of the second lead portion relative to the thickness of the coil region.

3. The method according to claim 2, the method further comprising forming a core around the coil region and a portion of the first lead portion and a portion of the second lead portion, thereby leaving an exposed portion of the first lead portion and an exposed portion of the second lead portion.

4. The method according to claim 3, wherein, The core is formed before separating the first lead portion and the second lead portion from the template.

5. The method according to claim 3, the method further comprising extending a portion of the exposed portion of the first lead portion along an outer surface of the core and extending a portion of the exposed portion of the second lead portion along an outer surface of the core.

6. The method according to claim 2, wherein The step of reducing the thickness of the first lead portion includes flattening or compressing a portion of the first lead portion.

7. The method according to claim 2, wherein, The step of reducing the thickness of the second lead portion includes flattening or compressing a portion of the second lead portion.

8. The method according to claim 2, wherein, The sheet has a thickness between a top surface and a bottom surface of the sheet, and the coil region has the same thickness as the thickness of the sheet.

9. The method according to claim 2, wherein, At least a portion of the template is formed by stamping the sheet.

10. The method according to claim 2, wherein The coil region has a serpentine shape, a rectangular shape, an I shape, an H shape, or a barbell shape.

11. The method according to claim 2, wherein, The coil region, the first lead portion, and the second lead portion are formed from a continuous, non-wound piece of conductive material.

12. The method according to claim 1, the method further comprising reducing the thickness of the coil region relative to the thickness of the first lead portion and relative to the thickness of the second lead portion, Among them, The coil region, the first pin portion, and the second pin portion each have a width perpendicular to their thickness, and wherein, when part of the template, the width of the first pin portion adjacent to the coil region is less than the width of the coil region measured at its widest point, and wherein the width of the second pin portion adjacent to the coil region is less than the width of the coil region measured at its widest point; and A core is formed, the core including a magnetic material surrounding the coil region and portions of the first pin portion and the second pin portion, leaving exposed portions of the first pin portion and the second pin portion.

13. The method according to claim 12, the method further comprising extending a portion of the exposed portion of the first pin portion along an outer surface of the core and extending a portion of the exposed portion of the second pin portion along the outer surface of the core.

14. The method according to claim 12, wherein The step of reducing the thickness of the coil region includes flattening or compressing a portion of the first pin portion.

15. The method according to claim 12, wherein, The sheet has a thickness, and the first pin portion and the second pin portion have the same thickness as the thickness of the sheet.

16. The method according to claim 12, wherein, At least a portion of the template is formed by stamping the sheet.

17. The method according to claim 12, wherein, The coil region has a serpentine shape, a rectangular shape, an I-shape, an H-shape, or a barbell shape.

18. The method according to claim 12, wherein, The coil region, the first pin portion, and the second pin portion are formed from a continuous, non-wound piece of conductive material.

19. The method according to claim 1, the method further comprising increasing the thickness of the coil region relative to the thickness of the first pin portion and relative to the thickness of the second pin portion by performing a thickening process including electroplating, 3D printing, or sputtering on the coil region.

20. The method according to claim 19, the method further comprising forming a core around the coil region and portions of the first pin portion and the second pin portion, leaving exposed portions of the first pin portion and the second pin portion.

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