A patch fixture for integrated circuit packaging

Abstract

The present application relates to the technical field of chip placement machines, and discloses a chip placement jig for integrated circuit packaging, including a movable component, the movable component being movably connected to the nozzle component, and the movable component including a movable part, a rubber ring, a clamping part and a telescopic part, the bottom end of the movable part is provided with a movable groove, and the movable part is movably clamped to the rubber ring through the movable groove. The present invention separates the nozzle component from the movable component, so that the rubber ring is movably connected to the outside of the nozzle component. After completing a placement operation, the rubber ring moves along the outer wall of the nozzle component under the control of the telescopic part. Due to the shape design of the nozzle component, the rubber ring is pushed by the nozzle component and rotates along the cross-section of the rubber ring, and cooperates with the shape design of the movable part to effectively clean the dust adhered to the surface of the rubber ring, so that when the rubber ring contacts the bare chip later, it is ensured that the rubber ring does not affect the cleanliness of the bare chip and that the rubber ring can smoothly absorb the bare chip.

Description

Technical Field

[0001] The present application relates to the technical field of chip placement machines, and in particular to a chip placement jig for integrated circuit packaging. Background Art

[0002] Integrated circuit packaging is the process of encapsulating a chip into a housing with mechanical strength and temperature resistance. It not only provides physical protection for the chip, but also provides the chip with appropriate pin layout and connections so that the chip can be effectively connected to other electronic devices or systems.

[0003] The chip placement jig is a core device in integrated circuit packaging, used to precisely attach bare chips to the package substrate or lead frame. Its performance directly impacts the yield of integrated circuit packaging. The chip placement jig includes a feeding mechanism, a dispensing mechanism, and a placement mechanism. The feeding mechanism transports the bare chip and package substrate to the workstation, and the dispensing mechanism applies glue to the package substrate. The placement mechanism then uses a nozzle to pick up the bare chip, transport it, and place it on the package substrate, ensuring a firm bond between the bare chip and the package substrate. Finally, the package substrate, after the chip placement process, is transported to the next step.

[0004] However, existing patch jigs still have some defects during use: in order to improve the protection of the bare chip surface and enhance the stability and accuracy of suction, a rubber ring is often set at the bottom of the suction nozzle. However, due to the frequent use of the suction nozzle, dust in the air adheres to the surface of the rubber ring and erodes the rubber ring. As a result, when the dust-adhered surface of the rubber ring contacts the bare chip, it not only affects the cleanliness of the bare chip, but also causes the risk of air leakage at the contact position, making it impossible for the suction nozzle with the rubber ring to smoothly suck the bare chip; secondly, because the rubber ring is frequently pressed in the opposite direction by the bare chip, it may be compressed and deformed and unable to return to its original state, thereby affecting the subsequent placement of the bare chip. Summary of the Invention

[0005] The present application proposes a patch jig for integrated circuit packaging, which has the advantages of using a nozzle assembly to apply thrust to a rubber ring, which can not only fully clean the dust on the rubber ring, but also restore the state of the rubber ring in time, so as to solve the problems caused by the frequent use of the rubber ring.

[0006] To achieve the above objectives, the present application adopts the following technical solution: a patch fixture for integrated circuit packaging, comprising:

[0007] A suction component and a suction nozzle component, wherein the bottom end of the suction component is threadedly sleeved with the top end of the suction nozzle component;

[0008] A movable component, which is movably connected to the suction nozzle component, and the movable component includes a movable part, a rubber ring, a clamping part and a telescopic part. A movable groove is provided at the bottom end of the movable part, and the movable part is movably clamped to the rubber ring through the movable groove. The outside of the movable part is fixedly connected with four clamping parts, and the four clamping parts are evenly arranged around the movable part. The lower end of the telescopic part is movably connected to the inside of the clamping part, and the upper end of the telescopic part is fixedly connected to the bottom end of the adsorption component. When the rubber ring moves on the outer wall of the suction nozzle assembly, the suction nozzle assembly pushes the rubber ring to rotate, which not only cleans the dust on the surface of the rubber ring, but also prompts the rubber ring to restore its expanded state.

[0009] Furthermore, the cross-sectional shape of the bottom end of the suction nozzle assembly is an inverted isosceles triangle.

[0010] Furthermore, the cross-section of the rubber ring is circular, the width and height of the movable part are larger than the radius of the rubber ring and smaller than the diameter of the rubber ring, and the movable part is located obliquely above the rubber ring.

[0011] Furthermore, the adsorption component includes:

[0012] An air pump, the bottom end of the air pump being fixedly sleeved with the upper end of the telescopic member;

[0013] The air pipe, wherein the middle portion of the bottom end of the air pump is fixedly connected to the top end of the air pipe, and the bottom end of the air pipe is movably connected to the inner ring of the upper end of the nozzle assembly;

[0014] The connecting ring is fixedly connected to the bottom end of the air pump located outside the air pipe and the top end of the connecting ring, and the inner ring of the connecting ring is threadedly sleeved with the outer ring of the upper end of the nozzle assembly.

[0015] Because the life of the rubber ring is shorter than that of the nozzle assembly, the rubber ring needs to be replaced regularly. Due to the separate design of the nozzle assembly and the movable assembly, the replacement of the rubber ring will not cause damage to the bottom end of the nozzle assembly. Therefore, there is no need to pay special attention to the nozzle assembly during replacement, which effectively improves the convenience of replacing the rubber ring and effectively extends the service life of the nozzle assembly, saving time and effort.

[0016] Through the separate design of the suction nozzle assembly and the movable assembly, when the suction nozzle assembly moves up and loses contact with the bare chip, the rubber ring continues to contact the bare chip under the control of the telescopic part, so that the bare chip is flexibly pressed by the rubber ring, thereby effectively enhancing the connection strength between the bare chip and the packaging substrate while ensuring that the bare chip is not damaged.

[0017] Furthermore, the adsorption component, the nozzle component and the movable component are components of a mounting mechanism, and the mounting mechanism further includes:

[0018] A moving block, the moving block being arranged at the top;

[0019] A fixed plate, wherein the bottom end of the movable block is movably connected to the fixed plate via bolts;

[0020] The rotating assembly comprises a fixing cavity formed in the middle of the fixing plate, and the fixing plate is movably connected to the rotating assembly through the fixing cavity;

[0021] A connecting plate is provided below the fixed plate, and the top end of the connecting plate is movably connected to the bottom end of the rotating assembly;

[0022] A connecting piece, wherein a side wall of the connecting plate is provided with an annular groove, one end of the connecting piece is fixedly sleeved with the fixed plate, and the other end of the connecting piece is movably engaged with the annular groove of the connecting plate;

[0023] A lifting assembly, the lifting assembly comprising a hydraulic cylinder and a hydraulic shaft, the top end of the hydraulic cylinder being movably connected to the bottom end of the connecting plate via bolts, the bottom end of the hydraulic cylinder being movably sleeved to the top end of the hydraulic shaft, and the bottom end of the hydraulic shaft being movably connected to the top end of the adsorption assembly via bolts;

[0024] A deformation component is fixedly arranged between the top end of the movable part and the bottom end of the air pump.

[0025] Furthermore, the deformation component includes:

[0026] A deformable membrane, wherein the top end of the deformable membrane is fixedly connected to the bottom end of the air pump, and the bottom end of the deformable membrane is fixedly connected to the top end of the movable part, the inner ring of the deformable membrane is movably connected to the outer ring of the nozzle assembly, and the wall surface of the deformable membrane is provided with a plurality of groups of vent holes, and the setting heights of two adjacent groups of vent holes are different;

[0027] The support member has a support cavity inside the deformable membrane without the vent hole, and the deformable membrane is movably connected to a group of support members through the support cavity. The number of support members in a group is four, and one end of the support member is fixedly connected to the movable member or the air pump. The two symmetrically arranged support members move in the same direction, and the two adjacent support members move in opposite directions.

[0028] By arranging a deformation component between the top of the movable part and the bottom of the adsorption component, when the suction nozzle assembly moves up and disengages from the bare chip, the movable component does not disengage from the bare chip, and the distance between the top of the movable part and the bottom of the adsorption component is increased, the deformation component is stretched and the vent is opened. At this time, when the suction nozzle assembly performs an exhaust operation, the gas flow is effectively discharged to the bare chip and the packaging substrate, accelerating the heat dissipation between the two, shortening the glue fixing time, and further enhancing the connection firmness between the bare chip and the packaging substrate. When the distance between the top of the movable part and the bottom of the adsorption component is reduced, the deformation component is compressed and the vent is closed, so that the deformation component can clean and protect the outer surface of the suction nozzle assembly, effectively ensuring that the outer surface of the suction nozzle assembly is not contaminated with dust, thereby preparing for the subsequent suction nozzle assembly to push the rubber ring to rotate in a clean state, further enhancing the cleaning effect of the rubber ring.

[0029] Furthermore, it also includes:

[0030] A working mechanism, comprising a working table and an outer body, wherein the working table is fixedly arranged at the inner bottom end of the outer body;

[0031] A first feeding mechanism and a second feeding mechanism, wherein the top of the workbench is respectively provided with the first feeding mechanism and the second feeding mechanism, and the first feeding mechanism is used to convey bare chips, and the second feeding mechanism is used to convey package substrates;

[0032] The moving mechanism is fixedly provided on the top inner portion of the outer body, and the mounting mechanism is movably connected to the moving mechanism.

[0033] Furthermore, the first feeding mechanism and the second feeding mechanism both include:

[0034] A guide rail, wherein the guide rail is fixedly arranged on the top of the workbench, and the guide rail area below the moving mechanism and the placement mechanism is the working point;

[0035] A loading piece is movably provided on the top of the guide rail, and the loading piece can be used to load a bare chip or a package substrate;

[0036] Camera modules are arranged on both sides of the guide rail in the working point area, and the camera modules can be adjusted in height.

[0037] Furthermore, the moving mechanism includes:

[0038] A movable housing, the top end of which is fixedly connected to the inner top end of the outer body;

[0039] a servo motor, wherein a side wall of the servo motor is fixedly connected to an outer side wall of the outer body;

[0040] A screw rod, one end of which is movably connected to the servo motor, and the other end of which is movably sleeved with the end of the moving shell, the screw rod located inside the moving shell is movably sleeved with the moving block, and the outer wall of the moving block is adapted to the inner wall of the moving shell.

[0041] The beneficial effects of the present invention are as follows:

[0042] The present application provides a patch jig for integrated circuit packaging, which is provided with a nozzle assembly and a movable assembly, and the movable assembly is composed of a movable part, a rubber ring, a clamping part and a telescopic part. The nozzle assembly and the movable assembly are designed separately, so that the rubber ring is movably sleeved on the outside of the nozzle assembly. After completing a placement operation, the rubber ring moves along the outer wall of the nozzle assembly under the control of the telescopic part. Due to the shape design of the nozzle assembly, the rubber ring is pushed by the nozzle assembly and rotates along the cross-section of the rubber ring. Combined with the shape design of the movable part, dust adhering to the surface of the rubber ring is effectively cleaned, so that when the rubber ring subsequently contacts the bare chip, it is ensured that the rubber ring does not affect the cleanliness of the bare chip and that the rubber ring can smoothly absorb the bare chip. In addition, the operation of using the nozzle assembly to push the rubber ring to rotate can vibrate the rubber ring, which helps the rubber ring to restore to its original state in time with the help of external force, and effectively prevents the rubber ring from being compressed and deformed, which affects the subsequent removal and placement of the bare chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only embodiments of the present invention. Those skilled in the art can also derive other drawings based on the provided drawings without inventive work.

[0044] Figure 1 It is a three-dimensional structural diagram of the whole of the present invention;

[0045] Figure 2 It is a cross-sectional three-dimensional structural diagram of the entire present invention;

[0046] Figure 3 For the present invention Figure 2 A magnified structural diagram;

[0047] Figure 4 For the present invention Figure 2 The enlarged structure diagram at B;

[0048] Figure 5 For the present invention Figure 2 The enlarged structure diagram at C;

[0049] Figure 6 It is a three-dimensional structural diagram of the present invention;

[0050] Figure 7 This is a three-dimensional structural diagram of the present invention when it is disassembled;

[0051] Figure 8 It is a three-dimensional structural diagram of the moving mechanism and the mounting mechanism in the present invention;

[0052] Figure 9 It is a three-dimensional structural diagram of the moving mechanism in the present invention;

[0053] Figure 10 It is a three-dimensional structural diagram of the mounting mechanism in the present invention;

[0054] Figure 11 This is a three-dimensional structural diagram of the mounting mechanism of the present invention when it is disassembled;

[0055] Figure 12 A three-dimensional structural diagram of the fixed plate, rotating assembly, connecting plate and connecting member in the present invention;

[0056] Figure 13 It is a cross-sectional three-dimensional structural diagram of the fixed plate, rotating assembly, connecting plate and connecting member in the present invention;

[0057] Figure 14 A three-dimensional structural diagram of the lifting assembly, adsorption assembly and nozzle assembly in the present invention;

[0058] Figure 15 It is a cross-sectional three-dimensional structural diagram of the lifting assembly, adsorption assembly and nozzle assembly in the present invention;

[0059] Figure 16 It is a three-dimensional structural diagram of the movable component in the present invention;

[0060] Figure 17 It is a cross-sectional three-dimensional structural diagram of the movable component in the present invention;

[0061] Figure 18 is a cross-sectional three-dimensional structural diagram of the deformation component in the present invention;

[0062] Figure 19 For the present invention Figure 18 The enlarged structural diagram at point D is shown in FIG.

[0063] In the figure: 1. working mechanism; 11. workbench; 12. outer body; 2a. first feeding mechanism; 2b. second feeding mechanism; 21. guide rail; 22. loading part; 23. camera module; 3. moving mechanism; 31. moving shell; 32. servo motor; 33. screw rod; 4. mounting mechanism; 41. moving block; 42. fixed plate; 43. rotating assembly; 44. connecting plate; 45. connecting part; 5. lifting assembly; 51. hydraulic cylinder; 52. hydraulic shaft; 6. adsorption assembly; 61. air pump; 62. air pipe; 63. connecting ring; 7. nozzle assembly; 8. movable assembly; 81. movable part; 82. rubber ring; 83. clamping part; 84. telescopic part; 9. deformation assembly; 91. deformation membrane; 92. supporting part. DETAILED DESCRIPTION

[0064] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0065] Embodiment 1, a patch fixture for integrated circuit packaging, comprising a workbench 11 and an outer body 12, such as Figure 1-Figure 2 The workbench 11 and the outer body 12 together constitute the working mechanism 1, and the workbench 11 is fixedly arranged at the inner bottom end of the outer body 12. The protection design of the outer body 12 for the workbench 11 effectively reduces the probability of dust falling to the top of the workbench 11.

[0066] like Figure 2 The top of the outer body 12 is fixedly provided with a moving mechanism 3, which includes a moving housing 31, a servo motor 32 and a screw rod 33. Figure 8-Figure 9 The top of the movable shell 31 is fixedly connected to the inner top of the outer body 12, the side wall of the servo motor 32 is fixedly connected to the outer side wall of the outer body 12, one end of the screw rod 33 is movably connected to the servo motor 32, and the other end of the screw rod 33 is movably connected to the end of the movable shell 31. The movable mechanism 3 can drive the mounting mechanism 4 to perform high-precision horizontal movement.

[0067] like Figure 2 、 Figure 4-Figure 5 The placement mechanism 4 is movably connected to the moving mechanism 3. The placement mechanism 4 includes a moving block 41, a fixed plate 42, a rotating assembly 43, a connecting plate 44, a connecting piece 45, a lifting assembly 5, an adsorption assembly 6, a nozzle assembly 7 and a movable assembly 8. Figure 10 、 Figure 11, the moving block 41 is set at the top and is the key component connecting the placement mechanism 4 and the moving mechanism 3. The screw rod 33 located inside the moving housing 31 is movably connected to the moving block 41, and the outer wall of the moving block 41 is adapted to the inner wall of the moving housing 31. When the servo motor 32 is started, the screw rod 33 can rotate, thereby driving the moving block 41 to move horizontally along the moving housing 31. In addition, for the placement mechanism 4, in order to improve efficiency, the components below the moving block 41 can be set to multiple groups according to actual conditions, that is, a multi-head parallel design can be adopted, such as Figure 11-13 The bottom end of the moving block 41 is movably connected to the fixed plate 42 by a bolt, and a fixing cavity is provided in the middle of the fixing plate 42, and the fixing plate 42 is movably engaged with the rotating assembly 43 through the fixing cavity. The fixing plate 42 is used to effectively stably set the rotating assembly 43 below the moving block 41, and the setting of the rotating assembly 43 can enable the mounting mechanism 4 to have the function of rotating angle, so that the angle of the bare chip can be adjusted to achieve precise alignment of the bare chip with the packaging substrate. A connecting plate 44 is provided below the fixing plate 42, and the top of the connecting plate 44 is movably engaged with the bottom end of the rotating assembly 43. When the rotating assembly 43 is started and rotated, the connecting plate 44 is synchronously driven to rotate, so that the components below it connected to the connecting plate 44 can rotate. The side wall of the connecting plate 44 is provided with an annular groove, one end of the connecting member 45 is fixedly sleeved with the fixing plate 42, and the other end of the connecting member 45 is movably engaged with the annular groove of the connecting plate 44, and the connecting member 45 is used to connect the fixing plate 42 and the connecting plate 44, effectively ensuring the stability of the connecting plate 44 set below the fixing plate 42.

[0068] like Figure 11 、 Figure 14-15 The lifting assembly 5 includes a hydraulic cylinder 51 and a hydraulic shaft 52. The top of the hydraulic cylinder 51 is movably connected to the bottom end of the connecting plate 44 through bolts, and the bottom end of the hydraulic cylinder 51 is movably socketed with the top end of the hydraulic shaft 52. The bottom end of the hydraulic shaft 52 is movably connected to the top end of the adsorption assembly 6 through bolts. The design of the hydraulic cylinder 51 and the hydraulic shaft 52 enables the mounting mechanism 4 to have the function of lifting and lowering, thereby driving the components below it connected to the lifting assembly 5 to be able to lift and lower.

[0069] like Figure 11 、 Figure 14-15 The adsorption component 6 includes an air pump 61, an air pipe 62 and a connecting ring 63. The middle part of the bottom end of the air pump 61 is fixedly connected to the top end of the air pipe 62, and the bottom end of the air pipe 62 is movably connected to the inner ring of the upper end of the suction nozzle assembly 7. The air pump 61 can be used to exhaust and inhale toward the suction nozzle assembly 7 through the air pipe 62. The bottom end of the air pump 61 located outside the air pipe 62 is fixedly connected to the top end of the connecting ring 63, and the inner ring of the connecting ring 63 is threadedly connected to the outer ring of the upper end of the suction nozzle assembly 7, so that the adsorption component 6 and the suction nozzle assembly 7 are assembled, which is convenient for disassembly and replacement of the suction nozzle assembly 7.

[0070] like Figure 11 、 Figure 14-15 The cross-sectional shape of the bottom end of the suction nozzle assembly 7 is an inverted isosceles triangle, and the suction nozzle assembly 7 is made of ceramic material, which effectively reduces the possibility of hard contact between the bottom surface of the suction nozzle assembly 7 and the bare chip. When the bare chip needs to be sucked, the bottom surface of the suction nozzle assembly 7 is moved to be flush with the bottom surface of the rubber ring 82. At this time, the inner ring side wall of the rubber ring 82 is effectively in contact with the outer side wall of the suction nozzle assembly 7, and the bottom surface of the rubber ring 82 will be in contact with the top surface of the bare chip, so that the suction nozzle assembly 7 and the bare chip are in a sealed state, and then the rubber ring 82 can be used to achieve the suction nozzle assembly 7 to fully and stably suck the bare chip.

[0071] like Figure 11 、 Figure 16-17 The movable assembly 8 is movably connected to the suction nozzle assembly 7, and the movable assembly 8 includes a movable part 81, a rubber ring 82, a clamping part 83 and a telescopic part 84. A movable groove is provided at the bottom end of the movable part 81, and the movable part 81 is movably clamped with the rubber ring 82 through the movable groove. The cross-sectional shape of the rubber ring 82 is circular. When the inner ring of the rubber ring 82 is acted upon by the thrust of the suction nozzle assembly 7, the rubber ring 82 will rotate along its cross-sectional shape. The width and height of the movable part 81 are larger than the radius of the rubber ring 82 and smaller than the diameter of the rubber ring 82. The movable part 81 is located at an obliquely upper position of the rubber ring 82, thereby ensuring that the movable part 81 is stably clamped with the rubber ring 82 to prevent the rubber ring 82 from detaching from the movable part 81, and ensuring that the rubber ring 82 is fully fitted with the suction nozzle assembly 7 and the bare chip respectively to prevent the risk of air leakage. The external fixed connection of the movable part 81 has four The clamping parts 83 are evenly arranged around the movable part 81. The lower end of the telescopic part 84 is movably sleeved with the internal part of the clamping part 83, and the upper end of the telescopic part 84 is fixedly connected to the bottom end of the air pump 61, so that the movable component 8 can be stably set on the adsorption component 6. In addition, the telescopic part 84 is composed of a telescopic pump, a telescopic rod and a bolt. Specifically, one end of the telescopic rod is movably connected to the telescopic pump, and the telescopic pump can be used to control the movement of the telescopic rod. The other end of the telescopic rod is movably connected to the bolt, and the bolt design can be used to simply fix the telescopic rod to the movable part 81 and the clamping part 83. In summary, by utilizing the separate design of the suction nozzle assembly 7 and the movable assembly 8, when the rubber ring 82 moves on the outer wall of the suction nozzle assembly 7, the suction nozzle assembly 7 can push the rubber ring 82 to rotate by itself, which can effectively clean the dust adhering to the surface of the rubber ring 82 and effectively promote the rubber ring 82 to restore the expanded state.

[0072] Example 2, based on Example 1, Figure 2 、 Figure 5 The mounting mechanism 4 further includes a deformation component 9, a deformation component 9 is fixedly provided between the top of the movable member 81 and the bottom of the air pump 61, and the deformation component 9 includes a deformation film 91 and a support member 92, as shown in FIG. Figure 11 、 Figure 18-19The top of the deformable membrane 91 is fixedly connected to the bottom of the air pump 61, and the bottom of the deformable membrane 91 is fixedly connected to the top of the movable part 81. The stretching and compression of the deformable membrane 91 can be achieved by changing the distance between the top of the movable part 81 and the bottom of the air pump 61. The inner ring of the deformable membrane 91 is movably sleeved with the outer ring of the suction nozzle assembly 7. The deformable membrane 91 can be used to protect the outer surface of the suction nozzle assembly 7, effectively ensuring that the outer surface of the suction nozzle assembly 7 is not contaminated with dust, thereby preparing for the subsequent suction nozzle assembly 7 to push the rubber ring 82 to rotate in a clean state, further enhancing the cleaning effect of the rubber ring 82, and the wall surface of the deformable membrane 91 is provided with a plurality of groups of vent holes, and the setting heights of the two adjacent groups of vent holes are different. The vent holes can be used to accurately discharge the gas flow to the bare chip and the packaging substrate, accelerating the flow between the two. To dissipate heat, shorten the glue fixing time, and further enhance the connection firmness between the bare chip and the packaging substrate, a support cavity is opened inside the deformable membrane 91 without a vent, and the deformable membrane 91 is movably connected to a group of support members 92 through the support cavity. The number of a group of support members 92 is four, and one end of the support member 92 is fixedly connected to the movable member 81 or the air pump 61. The two symmetrically arranged support members 92 move in the same direction, and the two adjacent support members 92 move in opposite directions. When the deformable membrane 91 contracts, the two adjacent support members 92 are in a state of moving toward each other. When the deformable membrane 91 stretches, the two adjacent support members 92 are in a state of moving away from each other, so that the support members 92 can always support the deformable membrane 91 and ensure the stability of the setting of the deformable membrane 91, effectively preventing the deformable membrane 91 from excessive deformation and affecting its service life.

[0073] Example 3, based on Example 2, a patch fixture for integrated circuit packaging, further comprising a first feeding mechanism 2a and a second feeding mechanism 2b, such as Figure 1-Figure 3 、 Figure 6 The top of the workbench 11 is provided with a first feeding mechanism 2a and a second feeding mechanism 2b, and the first feeding mechanism 2a is used to convey the bare chip, and the second feeding mechanism 2b is used to convey the package substrate. The first feeding mechanism 2a and the second feeding mechanism 2b are both composed of a guide rail 21, a loading part 22 and a camera module 23. Figure 7The guide rail 21 is fixedly arranged at the top of the workbench 11, and the area of the guide rail 21 below the moving mechanism 3 and the mounting mechanism 4 is the working point. The working point is the position where the bare chip and the package substrate are mounted. The top of the guide rail 21 is movably provided with a loading part 22, and the loading part 22 can load the bare chip or the package substrate. The loading part 22 is composed of a loading platform that can move along the guide rail 21, a loading ring that carries and fixes the workpiece, and a pin module that lifts the workpiece. The design of the loading part 22 can transport the bare chip and the package substrate, and cooperate with the moving mechanism 3 and the mounting mechanism 4 to perform the mounting operation on the bare chip and the package substrate. It should be noted that the size of the loading part 22 should be consistent with the size of the bare chip and the packaging substrate, so as to ensure the stability of the transportation of the bare chip and the packaging substrate. Camera modules 23 are provided on both sides of the guide rail 21 located in the working point area, and the camera module 23 can adjust the height, so that the position and angle of the bare chip and the packaging substrate can be identified respectively, and based on image matching and coordinate compensation, the deviation during mounting can be corrected in time. A glue dispensing mechanism is also provided in the working mechanism 1. The glue dispensing mechanism can apply glue to the packaging substrate located in the second feeding mechanism 2b under the operation of the control system, so that the target position of the packaging substrate is coated with glue.

[0074] The working principle of the method of use of the present invention is as follows:

[0075] Before performing the patch operation, the two loading members 22 are first used to transport the bare chip and the package substrate to the working point position of the guide rail 21 respectively, and then the glue dispensing mechanism performs the glue dispensing operation on the package substrate.

[0076] When performing the patch operation, the moving mechanism 3 first drives the placement mechanism 4 to move to the top of the first feeding mechanism 2a. At this time, the rubber ring 82 is controlled by the telescopic part 84 to move to the bottom position of the suction nozzle assembly 7, and the inner ring of the rubber ring 82 is in contact with the outer ring of the suction nozzle assembly 7. Then, the suction nozzle assembly 7 and the movable assembly 8 are jointly controlled by the lifting assembly 5 to move downward and contact the top surface of the bare chip, so that a relatively sealed environment is generated between the bare chip and the suction nozzle assembly 7 and the movable assembly 8. At this time, the adsorption assembly 6 starts to inhale air, thereby realizing the negative pressure absorption of the bare chip by the suction nozzle assembly 7. Then, the suction nozzle assembly 7 and the movable assembly 8 first drive the bare chip to move upward under the control of the lifting assembly 5, and then move to the top of the second feeding mechanism 2b under the drive of the moving mechanism 3, and then carry the bare chip downward under the control of the lifting assembly 5, and finally place the bare chip on the top surface of the packaging substrate.

[0077] Then the adsorption component 6 stops working, and the negative pressure environment inside it disappears. At this time, the lifting component 5 drives the suction nozzle component 7 and the movable component 8 to move upward, and the telescopic part 84 drives the rubber ring 82 to move downward, so that when the suction nozzle component 7 moves up and disengages from the bare chip, the rubber ring 82 continues to resist the bare chip under the control of the telescopic part 84, so that the bare chip is flexibly pressed by the rubber ring 82, thereby effectively enhancing the connection strength between the bare chip and the packaging substrate while ensuring that the bare chip is not damaged. In addition, the rubber ring 82 continues to apply flexible pressing force to the bare chip, and when the suction nozzle assembly 7 stops moving upward, the distance between the top of the movable part 81 and the bottom of the adsorption component 6 is enlarged, so that the deformation component 9 is stretched and the vent is opened. At this time, the adsorption component 6 starts and exhausts, effectively discharging the gas flow to the bare chip and the packaging substrate, accelerating the heat dissipation between the two, shortening the glue fixing time, and further enhancing the connection strength between the bare chip and the packaging substrate.

[0078] After the patch operation is completed, the rubber ring 82 continues to move upward under the control of the telescopic member 84 until it moves to the middle position of the suction nozzle assembly 7. During this process, due to the shape design of the suction nozzle assembly 7, the rubber ring 82 is pushed by the suction nozzle assembly 7 and rotates along the cross-section of the rubber ring 82. Combined with the shape design of the movable member 81, the dust adhering to the surface of the rubber ring 82 is effectively cleaned. Therefore, when the rubber ring 82 contacts the bare chip later, it is ensured that the rubber ring 82 does not affect the cleanliness of the bare chip and that the rubber ring 82 can smoothly absorb the bare chip. In addition, the operation of pushing the rubber ring 82 to rotate by the suction nozzle assembly 7 can vibrate the rubber ring 82, which helps the rubber ring 82 to restore to its original state in time with the help of external force, and effectively prevents the rubber ring 82 from being compressed and deformed and affecting the subsequent placement of the bare chip.

[0079] The above description of the disclosed embodiments is intended to enable one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not limited to the embodiments shown herein but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A patch fixture for integrated circuit packaging, characterized in that: include: An adsorption component (6) and a suction nozzle component (7), wherein the bottom end of the adsorption component (6) is threadedly sleeved with the top end of the suction nozzle component (7); A movable component (8), wherein the movable component (8) is movably connected to the suction nozzle component (7), and the movable component (8) includes a movable part (81), a rubber ring (82), a clamping part (83) and a telescopic part (84). The bottom end of the movable part (81) is provided with a movable groove, and the movable part (81) is movably clamped with the rubber ring (82) through the movable groove. The outside of the movable part (81) is fixedly connected with four clamping parts (83), and the four clamping parts (83) are evenly arranged around the movable part (81). The lower end of the telescopic part (84) is movably connected to the inside of the clamping part (83), and the upper end of the telescopic part (84) is fixedly connected to the bottom end of the adsorption component (6). When the rubber ring (82) moves on the outer wall of the suction nozzle component (7), the suction nozzle component (7) pushes the rubber ring (82) to rotate, which not only cleans the dust on the surface of the rubber ring (82) but also prompts the rubber ring (82) to restore the expanded state.

2. The chip fixture for integrated circuit packaging according to claim 1, characterized in that: The bottom end cross-sectional shape of the suction nozzle assembly (7) is an inverted isosceles triangle.

3. The chip fixture for integrated circuit packaging according to claim 2, characterized in that: The cross-sectional shape of the rubber ring (82) is circular, the width and height of the movable part (81) are larger than the radius of the rubber ring (82) and smaller than the diameter of the rubber ring (82), and the movable part (81) is located obliquely above the rubber ring (82).

4. The chip fixture for integrated circuit packaging according to claim 3, characterized in that: The adsorption component (6) comprises: An air pump (61), wherein the bottom end of the air pump (61) is fixedly sleeved with the upper end of the telescopic member (84); The air pipe (62) is fixedly connected to the middle of the bottom end of the air pump (61) and the top end of the air pipe (62), and the bottom end of the air pipe (62) is movably connected to the inner ring of the upper end of the suction nozzle assembly (7); The connecting ring (63) is fixedly connected to the bottom end of the air pump (61) outside the air pipe (62) and the top end of the connecting ring (63), and the inner ring of the connecting ring (63) is threadedly sleeved with the outer ring of the upper end of the suction nozzle assembly (7).

5. The chip fixture for integrated circuit packaging according to claim 4, characterized in that: The adsorption component (6), the suction nozzle component (7) and the movable component (8) are components of the mounting mechanism (4), and the mounting mechanism (4) further comprises: A moving block (41), wherein the moving block (41) is arranged at the top; A fixed plate (42), wherein the bottom end of the movable block (41) is movably connected to the fixed plate (42) via bolts; A rotating assembly (43), wherein a fixing cavity is provided in the middle of the fixing plate (42), and the fixing plate (42) is movably engaged with the rotating assembly (43) through the fixing cavity; A connecting plate (44), wherein the connecting plate (44) is provided below the fixed plate (42), and the top end of the connecting plate (44) is movably engaged with the bottom end of the rotating assembly (43); A connecting piece (45), wherein a side wall of the connecting plate (44) is provided with an annular groove, one end of the connecting piece (45) is fixedly sleeved with the fixed plate (42), and the other end of the connecting piece (45) is movably engaged with the annular groove of the connecting plate (44); A lifting assembly (5), the lifting assembly (5) comprising a hydraulic cylinder (51) and a hydraulic shaft (52), the top end of the hydraulic cylinder (51) being movably connected to the bottom end of the connecting plate (44) via a bolt, the bottom end of the hydraulic cylinder (51) being movably sleeved to the top end of the hydraulic shaft (52), and the bottom end of the hydraulic shaft (52) being movably connected to the top end of the adsorption assembly (6) via a bolt; A deformation component (9) is fixedly provided between the top end of the movable part (81) and the bottom end of the air pump (61).

6. The chip fixture for integrated circuit packaging according to claim 5, characterized in that: The deformation component (9) comprises: A deformable membrane (91), wherein the top end of the deformable membrane (91) is fixedly connected to the bottom end of the air pump (61), and the bottom end of the deformable membrane (91) is fixedly connected to the top end of the movable member (81), the inner ring of the deformable membrane (91) is movably sleeved with the outer ring of the suction nozzle assembly (7), and the wall surface of the deformable membrane (91) is provided with a plurality of groups of vent holes, and the setting heights of two adjacent groups of vent holes are different; The support member (92) is provided with a support cavity inside the deformable membrane (91) without the vent hole, and the deformable membrane (91) is movably connected to a group of support members (92) through the support cavity. The number of the support members (92) in a group is four, and one end of the support member (92) is fixedly connected to the movable member (81) or the air pump (61). The two symmetrically arranged support members (92) move in the same direction, and the two adjacent support members (92) move in opposite directions.

7. The chip fixture for integrated circuit packaging according to claim 6, characterized in that: Also includes: A working mechanism (1), the working mechanism (1) comprising a working table (11) and an outer body (12), wherein the working table (11) is fixedly arranged at the inner bottom end of the outer body (12); A first feeding mechanism (2a) and a second feeding mechanism (2b), wherein the top of the workbench (11) is respectively provided with the first feeding mechanism (2a) and the second feeding mechanism (2b), and the first feeding mechanism (2a) is used to convey bare chips, and the second feeding mechanism (2b) is used to convey package substrates; A moving mechanism (3) is fixedly provided on the top end of the interior of the outer body (12), and the mounting mechanism (4) is movably connected to the moving mechanism (3).

8. The chip fixture for integrated circuit packaging according to claim 7, characterized in that: The first feeding mechanism (2a) and the second feeding mechanism (2b) both include: A guide rail (21), wherein the guide rail (21) is fixedly arranged at the top of the workbench (11), and the area of the guide rail (21) located below the moving mechanism (3) and the mounting mechanism (4) is a working point; A loading member (22), wherein the top end of the guide rail (21) is movably provided with the loading member (22), and the loading member (22) can load a bare chip or a package substrate; A camera module (23) is provided on both sides of the guide rail (21) located in the working point area, and the camera module (23) is height-adjustable.

9. The chip jig for integrated circuit packaging according to claim 8, characterized in that: The moving mechanism (3) comprises: A movable housing (31), wherein the top end of the movable housing (31) is fixedly connected to the inner top end of the outer body (12); a servo motor (32), wherein a side wall of the servo motor (32) is fixedly connected to an outer side wall of the outer body (12); A screw rod (33), one end of the screw rod (33) is movably connected to the servo motor (32), and the other end of the screw rod (33) is movably sleeved with the end of the movable housing (31), the screw rod (33) located inside the movable housing (31) is movably sleeved with the movable block (41), and the outer wall of the movable block (41) is adapted to the inner wall of the movable housing (31).

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