Axial vertical spiral balun based on glass substrate

Abstract

The invention relates to the technical field of semiconductors, and discloses an axial vertical spiral balun based on a glass substrate, the axial vertical spiral balun comprises a first coil, a second coil and a glass substrate, the first coil comprises a first metal connecting line, a second metal connecting line and a first interconnection through hole group, and the second metal connecting line comprises a second interconnection through hole group; the second coil comprises a third metal connecting wire, a fourth metal connecting wire and a second interconnection through hole group, the first interconnection through hole group and the second interconnection through hole group vertically penetrate through the glass substrate, and the first metal connecting wire and the second metal connecting wire are electrically connected through the first interconnection through hole group; the third metal connecting line and the fourth metal connecting line are electrically connected through the second interconnection through hole group. According to the technical scheme provided by one or more embodiments, the insertion loss of the balun can be reduced, and the performance of the balun is further improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and particularly to an axial vertical spiral balun based on a glass substrate. Background Art

[0002] In the design of modern radio frequency power amplifier modules, baluns (balun, i.e., balun, a balanced-unbalanced converter) are respectively integrated at the input / output ports of the power amplifier. As the core passive device of the differential signal link, the performance of the balun directly restricts the energy efficiency of the power amplifier. Among them, the quality factor of the balun is an important parameter for measuring the performance of the balun.

[0003] In the related art, the traditional radio frequency balun uses a planar spiral winding structure to achieve electromagnetic coupling. However, in the case of high frequencies, the skin effect of the balun will be aggravated, resulting in large skin losses. At the same time, substrate losses and parasitic effects will also be caused, thereby increasing the insertion loss and resulting in a low quality factor of the balun and poor performance of the balun. Summary of the Invention

[0004] This application provides an axial vertical spiral balun based on a glass substrate, which can solve the problem of poor performance of the balun at high frequencies in the related art.

[0005] In a first aspect of this application, an axial vertical spiral balun based on a glass substrate is provided. The axial three-dimensional spiral balun includes a first coil, a second coil, and a glass substrate. The first coil includes a first metal connection line, a second metal connection line, and a first group of interconnected holes. The second coil includes a third metal connection line, a fourth metal connection line, and a second group of interconnected holes. The first group of interconnected holes and the second group of interconnected holes vertically penetrate the glass substrate, where: the first metal connection line and the second metal connection line are electrically connected through the first group of interconnected holes, and the third metal connection line and the fourth metal connection line are electrically connected through the second group of interconnected holes.

[0006] In a possible implementation manner, the first coil further includes a center tap and a third group of interconnected holes, and the third group of interconnected holes vertically penetrate the glass substrate; where, the second metal connection line and the center tap are electrically connected through the third group of interconnected holes; the first group of interconnected holes and the second group of interconnected holes both include a first number of interconnected holes, and the third group of interconnected holes includes a second number of interconnected holes, and the first number is twice the second number.

[0007] In a possible implementation, the first group of interconnected holes includes a first set of interconnected holes and a second set of interconnected holes. The first set of interconnected holes and the second set of interconnected holes are arranged along a first direction. The second group of interconnected holes includes a third set of interconnected holes and a fourth set of interconnected holes. The third set of interconnected holes and the fourth set of interconnected holes are arranged along the first direction. The first set of interconnected holes includes a plurality of first interconnected holes, and the plurality of first interconnected holes are spaced apart along a second direction. The third set of interconnected holes includes a plurality of third interconnected holes, and the plurality of third interconnected holes are spaced apart along the second direction. Each first interconnected hole is disposed between two adjacent third interconnected holes. The first direction is perpendicular to the second direction. The second set of interconnected holes includes a plurality of second interconnected holes, and the plurality of second interconnected holes are spaced apart along the second direction. The fourth set of interconnected holes includes a plurality of fourth interconnected holes, and the plurality of fourth interconnected holes are spaced apart along the second direction. Each second interconnected hole is disposed between two adjacent fourth interconnected holes. Each interconnected hole in the third set of interconnected holes is arranged along the second direction, and the distance between each interconnected hole in the third set of interconnected holes and the first interconnected holes on the same horizontal line in the first direction is equal. The third set of interconnected holes is disposed between the first set of interconnected holes and the second set of interconnected holes.

[0008] In a possible implementation, the first group of interconnected holes or the second group of interconnected holes further includes a first quantity of copper cores, and each copper core is disposed in a corresponding interconnected hole. The third group of interconnected holes further includes a second quantity of copper cores, and each copper core is disposed in a corresponding interconnected hole.

[0009] In a possible implementation, the materials of the first metal connection line, the second metal connection line, the third metal connection line, the fourth metal connection line, and the center tap are copper.

[0010] In a possible implementation, the second coil further includes two signal output terminals located at both ends of the second coil. Among them, any one of the signal output terminals is grounded.

[0011] In a possible implementation, the two signal input terminals are on the same horizontal line.

[0012] In a possible implementation, the second coil further includes two signal output terminals, and the two signal output terminals are respectively connected to both ends of the third metal connection line.

[0013] In a second aspect of the present application, a differential amplifier is provided. The differential amplifier includes: a driving amplifier for receiving an input signal and performing preliminary amplification on the input signal, where the input signal is a first single-ended signal; an input balun for converting the preliminarily amplified input signal into a differential signal; a power amplification stage for amplifying the differential signal; and an output balun, which is an axial vertical spiral balun based on a glass substrate according to the first aspect, for converting the differential signal into a second single-ended signal and using the second single-ended signal as an output signal.

[0014] In a third aspect of the present application, a chip is provided, and the chip applies an axial vertical spiral balun based on a glass substrate according to the first aspect.

[0015] The technical solutions provided by one or more embodiments of the present application, through a three-dimensional vertical design of the spiral balun in a glass substrate, reduce the insertion loss of the balun and improve the performance of the balun. Specifically, by using a glass substrate and a glass via process, a three-dimensional spiral coil with an axial vertical distribution is realized, breaking through the limitations of traditional planar winding and significantly reducing the high-frequency skin effect loss. At the same time, due to the low dielectric loss of the glass substrate, it can provide an ideal environment for the electromagnetic field distribution of the balun coil, reduce the insertion loss of the balun, thereby improving the performance of the balun, and can also maintain stable performance under high-frequency high-power working conditions.

[0016] It can be seen that the technical solutions provided by the present application can significantly improve the performance of the balun under high-frequency signals. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0018] Figure 1 It is an overall schematic diagram of an axial vertical spiral balun based on a glass substrate provided by an embodiment of the present application;

[0019] Figure 2 It is a schematic structural diagram of a first coil provided by an embodiment of the present application;

[0020] Figure 3 It is a schematic structural diagram of a second coil provided by an embodiment of the present application;

[0021] Figure 4 It is a schematic diagram of a stacked structure of an axial vertical spiral balun based on a glass substrate provided by an embodiment of the present application;

[0022] Figure 5 Schematic diagram of the distribution of the interconnected holes of each interconnected hole group provided by an embodiment of the present application;

[0023] Figure 6 Schematic diagram of the composition of a differential amplifier provided by an embodiment of the present application.

[0024] Description of reference numerals

[0025] 11 - First coil, 21 - Second coil, 31 - Glass substrate, 41 - Metal interconnect layer, 111 - First metal connection line, 112 - Second metal connection line, 113 - First interconnected hole group, 114 - Center tap, 115 - Third interconnected hole group, 116 - Signal input terminal, 211 - Third metal connection line, 212 - Fourth metal connection line, 213 - Second interconnected hole group, 214 - Signal output terminal, 10 - First interconnected hole group, 20 - Second interconnected hole group, 30 - Third interconnected hole group, 101 - First group of interconnected holes, 102 - Second group of interconnected holes, 201 - Third group of interconnected holes, 202 - Fourth group of interconnected holes. Detailed implementation manners

[0026] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present application.

[0027] In addition, the descriptions involving "first", "second", etc. in the present application are only for descriptive purposes, and cannot be construed as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of the embodiments of the present application, unless otherwise stated, the meaning of "a plurality" is two or more. In addition, the use of "based on" or "according to" means open and inclusive, because a process, step, calculation, or other action "based on" or "according to" one or more of the stated conditions or values may in practice be based on additional conditions or values beyond the stated ones.

[0028] Most traditional baluns adopt a resin substrate laminate process to achieve electromagnetic coupling through a planar spiral winding structure. However, in the actual application of high - frequency scenarios, the insertion loss of the balun is relatively high. The dielectric loss and skin effect of the resin substrate are particularly significant in the GHz frequency band, resulting in a substantial increase in the insertion loss and affecting the power and performance of the balun.

[0029] Among them, the above skin effect is the phenomenon that high-frequency current mainly flows on the surface of the conductor. As the frequency increases, the distribution of current density on the surface of the conductor becomes more concentrated, resulting in a decrease in the effective cross-sectional area of conduction, an aggravation of the skin effect, a significant increase in the AC resistance. And due to the planar winding process restricting the geometric parameters of the winding, the insertion loss is further aggravated, thereby increasing the resistance loss, reducing the quality factor of the balun and degrading the performance. At the same time, parasitic capacitance and parasitic inductance will be generated between the coil and the substrate in the high-frequency case, which will weaken the inductance of the balun, causing substrate loss and further reducing the quality factor of the balun.

[0030] For a high-efficiency and low-loss radio frequency system, since the insertion loss of the balun is particularly prominent in the high-frequency case, it significantly degrades the performance of the balun in the high-frequency case and limits the application of the balun in high-performance radio frequency systems. In view of this, one or more embodiments of the present application provide an axially vertical spiral balun based on a glass substrate, which can solve the above problems and improve the performance of the balun in high-frequency applications.

[0031] Please refer to Figure 1 , one embodiment of the present application provides an axially vertical spiral balun based on a glass substrate. The axially three-dimensional spiral balun includes a first coil 11, a second coil 21 and a glass substrate. The first coil includes a first metal connection line, a second metal connection line and a first group of interconnected holes. The second coil includes a third metal connection line, a fourth metal connection line and a second group of interconnected holes. The first group of interconnected holes and the second group of interconnected holes vertically penetrate the glass substrate, wherein:

[0032] The first metal connection line and the second metal connection line are electrically connected through the first group of interconnected holes, and the third metal connection line and the fourth metal connection line are electrically connected through the second group of interconnected holes.

[0033] Specifically, the balun structure generally includes a first coil 11 and a second coil 21, which are respectively a primary coil and a secondary coil. Coupling is carried out through the first coil 11 and the second coil 21, and signal conversion and transmission are realized based on the principle of electromagnetic induction. Among them, when an alternating current passes through the first coil 11, an alternating magnetic field will be generated, and the second coil 21 will induce an electromotive force according to the alternating magnetic field, and magnetic field coupling occurs between the first coil 11 and the second coil 21. In a differential amplifier circuit, the balun can be used for the conversion of output signals to convert differential signals into single-ended signals for output. In a high-frequency circuit, by optimizing the layout of the first coil 11 and the second coil 21, parasitic effects and losses can be reduced, and the stability and performance of the balun can be improved.

[0034] Among them, please refer to Figure 2, the above-mentioned first coil 11 includes a first metal connection line 111 located above the surface of the glass substrate, a second metal connection line 112 located below the surface of the glass substrate, and a first group of through-hole connections 113 vertically penetrating the glass substrate. The first metal connection line 111 and the second metal connection line 112 are connected through the first group of through-hole connections 113 to form the first coil 11. Optionally, the above-mentioned first coil 11 further includes a center tap 114 and a third group of through-hole connections 115. The above-mentioned center tap is electrically connected to a fourth metal connection line through the third group of through-hole connections. The above-mentioned center tap 114 is located above the surface of the glass substrate, and the third group of through-hole connections 115 vertically penetrate the glass substrate.

[0035] In one embodiment, the first coil 11 further includes two signal input terminals 116. The two signal input terminals 116 are respectively connected to both ends of the first metal connection line 111, and the two signal input terminals 116 are located on the same horizontal line of the first coil 11.

[0036] Please refer to Figure 3 , the above-mentioned second coil 21 includes a third metal connection line 211 located above the surface of the glass substrate, a fourth metal connection line 212 located below the surface of the glass substrate, and a second group of through-hole connections 213 vertically penetrating the glass substrate. The third metal connection line 211 and the fourth metal connection line 212 are connected through the second group of through-hole connections 213 to form the second coil 21.

[0037] In one embodiment, the second coil 21 further includes two signal output terminals 214. The two signal output terminals 214 are respectively located at both ends of the second coil 21. Among them, one signal output terminal 214 is used to output a signal, and the other signal output terminal 214 is used for grounding.

[0038] Exemplarily, in the application of the output balun of a differential amplifier circuit, the above-mentioned signal input terminal 116 receives a differential amplified signal and outputs a single-ended signal through one of the signal output terminals 214.

[0039] It should be noted that, please refer to Figure 4 , the above-mentioned first metal connection line 111, second metal connection line 112, and third metal connection line 211 are respectively located in different planes, and the second metal connection line 211 and the fourth metal connection line 212 are located in the same plane. Specifically, a stacked structure located on the surface of the glass substrate 31 is adopted. Among them, the layer where the first metal connection line 111 is located is the bottom layer close to the upper surface of the glass substrate. Optionally, a metal interconnection layer 41 is provided on the glass substrate. The above-mentioned metal interconnection layer 41 connects the first metal connection line 111 and the through-hole connections, while ensuring sufficient connection with the glass substrate 31 and maintaining the stability of the stacked structure.

[0040] In this embodiment, using a glass substrate can reduce the insertion loss of the balun. Since the glass substrate has low dielectric loss, excellent thermal stability, and high insulation strength, it can effectively reduce the loss of electromagnetic energy during high-frequency transmission, thereby optimizing the high-frequency electromagnetic field distribution. The glass substrate has less absorption and attenuation of electromagnetic waves, significantly reducing substrate loss and parasitic effects, thus effectively reducing the insertion loss of the balun and improving the performance of the balun under high-frequency transmission.

[0041] In this embodiment, the stacked structure of the above-mentioned metal connection lines of each layer and the group of through-vias penetrating the glass substrate together form a three-dimensional spiral balun with an axial perpendicularity, breaking through geometric limitations through three-dimensional magnetic circuit design. When a high-frequency signal is transmitted, the current is mainly concentrated on the surface of the conductor, resulting in skin effect loss. By adopting a vertical spiral structure to optimize the winding design and increase the surface area of the conductor, the current distribution can be made more uniform, thereby reducing skin loss and improving the performance of the balun at high frequencies. At the same time, the vertical spiral structure makes the electromagnetic field more evenly distributed in three-dimensional space, improving the electromagnetic coupling efficiency and further improving the performance of the balun.

[0042] In an alternative embodiment, distributed capacitance compensation can be achieved by adjusting the thickness of the glass substrate, improving the broadband impedance matching ability, and thus improving the performance of the balun. Specifically, the vertical-structure balun is composed of a first coil and a second coil that are tightly coupled. The distributed capacitance between the metal connection lines of each layer and the parasitic capacitance of the metal connection lines to the substrate are affected by the thickness of the glass substrate. Preferably, the thickness of the glass substrate can be set to 200 nm. Coordinating and optimizing the substrate thickness with other parameters of the balun can offset the frequency effects of the distributed capacitance and parasitic capacitance, improve the broadband impedance matching ability, and thus improve the performance of the balun.

[0043] In one embodiment, the first group of through-vias of the first coil includes a first number of through-vias, and the third group of through-vias of the first coil includes a second number of through-vias. The second group of through-vias of the second coil includes a first number of through-vias, which is the same as the number of the first group of through-vias. The number of through-vias in the first group of through-vias and the second group of through-vias is twice that of the third group of through-vias. The number of through-vias of each coil reflects the number of turns of each coil. It should be noted that the application does not limit the number of turns of the balun coil, and the number of turns can be adjusted according to different application scenarios.

[0044] In this embodiment, each of the through-vias penetrating the glass substrate is a glass via. Specifically, a glass via process can be used to perforate the glass substrate to form a conical glass via. Optionally, glass perforation techniques such as sandblasting, photosensitive glass, plasma etching, and laser-induced etching can be used to fabricate the glass via. Further, metal filling, electroplating filling, etc. can be used to fill the glass via.

[0045] Please refer to Figure 5 Figure 5 , in one embodiment, the first interconnected hole group 10 includes a first group of interconnected holes 101 and a second group of interconnected holes 102. The first group of interconnected holes 101 and the second group of interconnected holes 102 are arranged along a first direction. The second interconnected hole group 20 includes a third group of interconnected holes 201 and a fourth group of interconnected holes 202. The third group of interconnected holes 201 and the fourth group of interconnected holes 202 are arranged along the first direction.

[0046] Among them, the first group of interconnected holes 101 includes a plurality of first interconnected holes. The plurality of first interconnected holes are arranged at intervals along a second direction. The third group of interconnected holes 201 includes a plurality of third interconnected holes. The plurality of third interconnected holes are arranged at intervals along the second direction. Each first interconnected hole is disposed between two adjacent third interconnected holes. The first direction is perpendicular to the second direction.

[0047] The second group of interconnected holes 102 includes a plurality of second interconnected holes. The plurality of second interconnected holes are arranged at intervals along the second direction. The fourth group of interconnected holes 202 includes a plurality of fourth interconnected holes. The plurality of fourth interconnected holes are arranged at intervals along the second direction. Each second interconnected hole is disposed between two adjacent fourth interconnected holes.

[0048] Each interconnected hole of the third interconnected hole group 30 is arranged along the second direction, and the distance between each interconnected hole of the third interconnected hole group 30 and the first interconnected hole on the same horizontal line in the first direction is equal. The third interconnected hole group 30 is disposed between the first group of interconnected holes 101 and the second group of interconnected holes 201.

[0049] It should be noted that the above-mentioned first direction and second direction are perpendicular to the direction of each interconnected hole, and the above-mentioned first direction is perpendicular to the above-mentioned second direction. In addition, the number and diameter of the interconnected holes in each of the above-mentioned interconnected hole groups are adjustable, and the present application does not limit this too much.

[0050] In this embodiment, the first group of interconnected holes 101 and the third group of interconnected holes 201 are located on one side of the first coil and the second coil. The second group of interconnected holes 102 and the fourth group of interconnected holes 202 are located on the other side of the first coil and the second coil. And for any one side, the interconnected holes of the first coil and the interconnected holes of the second coil are arranged at intervals to form a first coil and a second coil with high coupling. Since the tightness of the first coil and the second coil will affect the coupling coefficient, and thus affect the performance of the balun. By highly coupling the first coil and the second coil, while ensuring that the performance of the balun is not affected, the three-dimensional space distribution of the balun can be optimized, and thus the performance of the balun can be improved.

[0051] In this embodiment, the first group of interconnected holes 10 or the second group of interconnected holes 20 further includes a first number of copper cores, and each copper core is disposed in a corresponding interconnected hole; the third group of interconnected holes 30 further includes a second number of copper cores, and each copper core is disposed in a corresponding interconnected hole.

[0052] The above copper cores are used for electrical connection with metal connecting wires connected to respective interconnected holes. The above copper cores can be formed by filling each interconnected hole with metallic copper. Preferably, glass perforation can be performed by laser induction and chemical solution etching to form each interconnected hole, and electroplating copper is used for each interconnected hole to prepare the copper cores of each interconnected hole.

[0053] In this embodiment, the materials of the first metal connecting wire, the second metal connecting wire, the third metal connecting wire, the fourth metal connecting wire, and the center tap are also copper.

[0054] In an alternative embodiment, at high-frequency signals, the skin effect loss can be reduced by adjusting the aspect ratio and sidewall roughness of the copper cores. Specifically, since high-frequency current is mainly concentrated on the surface of the conductor, when the conductor roughness is too large, it will cause the current path to extend and electromagnetic wave scattering, resulting in additional losses. And when the diameter of the copper core increases, the surface area of the conductor increases and the skin effect loss decreases. When the depth of the copper core increases, the current path extends and the skin effect loss will increase. Therefore, by reasonably adjusting the aspect ratio and sidewall roughness of the copper cores, the performance of the balun can be improved to a certain extent. It should be noted that the above aspect ratio is the ratio of the depth of the copper core to the maximum diameter of the copper core. Preferably, an aspect ratio of 3.64:1 is adopted.

[0055] The technical solution provided by one or more embodiments of the present application, through three-dimensional vertical design of the spiral balun in the glass substrate, reduces the insertion loss of the balun and improves the performance of the balun. Specifically, the glass substrate and glass via process are adopted to realize a three-dimensional spiral coil with axial vertical distribution, breaking through the limitation of traditional planar winding, and significantly reducing the high-frequency skin effect loss. At the same time, because the glass substrate has a low dielectric loss, it can provide an ideal environment for the electromagnetic field distribution of the balun coil, reduce the insertion loss of the balun, and thus improve the performance of the balun, and can also maintain stable performance under high-frequency high-power working conditions.

[0056] In addition, by constructing a three-dimensional vertical spiral coil, higher-density electromagnetic coupling can be achieved. By optimizing the aspect ratio and sidewall roughness of the copper cores in the interconnected holes, the loss of high-frequency signals on the conductor surface can be effectively reduced, further improving the performance of the balun.

[0057] The present application also provides an application scenario of the above-mentioned axial vertical spiral balun based on a glass substrate. In the differential amplification circuit of a radio frequency power amplifier, the above-mentioned axial vertical spiral balun based on a glass substrate can be used as an output balun. Since the insertion loss of the above-mentioned balun is small and its performance is also high at high frequencies, the efficiency and linear power performance of the power amplifier can be improved.

[0058] For the axial vertical spiral balun based on a glass substrate provided by the present application, at a frequency of 3.6 GHz, the quality factor reaches above 70. The quality factor, as an important parameter for measuring the performance of the balun, reflects the ratio of the stored energy to the dissipated energy of the balun. The higher the quality factor, the smaller the energy loss of the balun at the current frequency and the higher the performance. Compared with the planar spiral balun with a traditional laminate structure, the quality factor is increased by more than 75%. At the same time, the three-dimensional vertical spiral structure can greatly improve the chip integration, and using a glass substrate can reduce the substrate loss. The insertion loss of the balun can be reduced to below 0.25 dB and still maintain high performance under high-frequency signals, thereby effectively improving the power added power and the maximum linear output power of the power amplification module, and being applicable to high-frequency high-power application scenarios.

[0059] Please refer to Figure 6 , the present application also provides a differential amplifier, and the differential amplifier includes:

[0060] A driving amplifier 10, configured to receive an input signal and perform preliminary amplification on the input signal, where the input signal is a first single-ended signal;

[0061] An input balun 20, configured to convert the preliminarily amplified input signal into a differential signal;

[0062] A power amplification stage 30, configured to amplify the differential signal;

[0063] An output balun 40, applying the above-mentioned axial vertical spiral balun based on a glass substrate, configured to convert the differential signal into a second single-ended signal and use the second single-ended signal as an output signal.

[0064] Wherein,

[0065] In one embodiment, the driving amplifier 10 is specifically configured to receive an input signal and perform preliminary amplification on the input signal to ensure that the power amplification stage can receive a signal with sufficient intensity. Optionally, a low-noise amplifier can be used to minimize the noise introduction of the signal.

[0066] In one embodiment, the input balun 20 is specifically configured to receive an input signal from a driving amplifier, convert the input signal into a differential signal, achieve impedance matching between the input end and the power amplification stage, reduce reflection loss, and transmit the differential signal to the power amplification stage.

[0067] In one embodiment, the power amplification stage 30 is specifically configured to receive the differential signal from the input balun, perform a large-scale power amplification on the signal, and output the amplified signal to the output balun.

[0068] In one embodiment, the output balun 40 is specifically configured to receive the signal from the power amplification stage, convert the differential signal into a single-ended signal for subsequent single-ended output or load matching. The further functional description of the above output balun is the same as that of the corresponding embodiment above and will not be elaborated here.

[0069] This application also provides an integrated chip that applies the above-mentioned axial vertical spiral balun based on a glass substrate. The axial vertical spiral balun based on a glass substrate has significant advantages in an integrated chip. For example, in the fields of radio frequency chips and high-density system integration, the above balun can greatly improve the chip integration and electrical interconnection performance.

[0070] The above-described chip can be implemented by a product with certain functions. A typical implementation device is a computer. Specifically, the computer can be, for example, a personal computer, a laptop computer, a cellular phone, a camera phone, a smart phone, a personal digital assistant, a media player, a navigation device, an email device, a game console, a tablet computer, a wearable device, or a combination of any of these devices.

[0071] It should also be noted that the term "comprising", "including" or any other variant thereof is intended to cover a non-exclusive inclusion, such that a process, method, commodity or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, commodity or device. Without further limitation, an element defined by the statement "comprising one..." does not exclude the existence of additional identical elements in the process, method, commodity or device comprising the element.

[0072] Each embodiment in this specification is described in a progressive manner. The same or similar parts between the embodiments can be referred to each other. Each embodiment focuses on the differences from other embodiments. For the relevant parts, refer to the partial descriptions of other embodiments.

[0073] The above are only embodiments of the present application and are not intended to limit the present application. For those skilled in the art, various changes and modifications can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included within the scope of the claims of the present application.

[0074] Although the embodiments of the present application have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present application, and such modifications and variations fall within the scope defined by the appended claims.

Claims

1. An axial vertical spiral balun based on a glass substrate, characterized in that, The axial three-dimensional spiral balun includes a first coil, a second coil and a glass substrate. The first coil includes a first metal connecting line, a second metal connecting line and a first group of through-connection holes. The second coil includes a third metal connecting line, a fourth metal connecting line and a second group of through-connection holes. The first group of through-connection holes and the second group of through-connection holes vertically penetrate the glass substrate, where: The first metal connecting line and the second metal connecting line are electrically connected through the first group of through-connection holes, and the third metal connecting line and the fourth metal connecting line are electrically connected through the second group of through-connection holes.

2. The axial vertical spiral balun based on a glass substrate according to claim 1, wherein The first coil further includes a center tap and a third group of through-connection holes, and the third group of through-connection holes vertically penetrate the glass substrate; where: The second metal connecting line and the center tap are electrically connected through the third group of through-connection holes; Both the first group of through-connection holes and the second group of through-connection holes include a first number of through-connection holes, and the third group of through-connection holes includes a second number of through-connection holes. The first number is twice the second number.

3. The axial vertical spiral balun based on a glass substrate according to claim 2, wherein, The first group of through-connection holes includes a first sub-group of through-connection holes and a second sub-group of through-connection holes. The first sub-group of through-connection holes and the second sub-group of through-connection holes are arranged along a first direction. The second group of through-connection holes includes a third sub-group of through-connection holes and a fourth sub-group of through-connection holes. The third sub-group of through-connection holes and the fourth sub-group of through-connection holes are arranged along the first direction; The first sub-group of through-connection holes includes a plurality of first through-connection holes, and the plurality of first through-connection holes are spaced along a second direction. The third sub-group of through-connection holes includes a plurality of third through-connection holes, and the plurality of third through-connection holes are spaced along the second direction. Each first through-connection hole is disposed between two adjacent third through-connection holes. The first direction is perpendicular to the second direction; The second sub-group of through-connection holes includes a plurality of second through-connection holes, and the plurality of second through-connection holes are spaced along the second direction. The fourth sub-group of through-connection holes includes a plurality of fourth through-connection holes, and the plurality of fourth through-connection holes are spaced along the second direction. Each second through-connection hole is disposed between two adjacent fourth through-connection holes; Each through-connection hole of the third group of through-connection holes is arranged along the second direction, and the distance between each through-connection hole of the third group of through-connection holes and the first through-connection holes on the same horizontal line in the first direction is equal. The third group of through-connection holes is disposed between the first sub-group of through-connection holes and the second sub-group of through-connection holes.

4. The axial vertical spiral balun based on a glass substrate according to claim 2, wherein The first group of through-connection holes or the second group of through-connection holes further includes a first number of copper cores, and each copper core is disposed in a corresponding through-connection hole; the third group of through-connection holes further includes a second number of copper cores, and each copper core is disposed in a corresponding through-connection hole.

5. The axial vertical spiral balun based on a glass substrate according to claim 1, characterized in that, The materials of the first metal connecting line, the second metal connecting line, the third metal connecting line, and the fourth metal connecting line are copper.

6. The axial vertical spiral balun based on a glass substrate according to claim 1, wherein The first coil further includes two signal input terminals, and the two signal input terminals are respectively connected to both ends of the first metal connecting line.

7. The axial vertical spiral balun based on a glass substrate according to claim 6, wherein The two signal input terminals are on the same horizontal line.

8. The axial vertical spiral balun based on a glass substrate according to claim 1, characterized in that, The second coil further includes two signal output terminals, and the two signal output terminals are located at two ends of the second coil; wherein, any one of the signal output terminals is grounded.

9. A differential amplifier, characterized in that, The differential amplifier includes: A driving amplifier, configured to receive an input signal and perform preliminary amplification on the input signal, where the input signal is a first single-ended signal; An input balun, configured to convert the preliminarily amplified input signal into a differential signal; A power amplification stage, configured to amplify the differential signal; An output balun, which is an axial vertical spiral balun based on a glass substrate according to any one of claims 1 to 8 above, and is configured to convert the differential signal into a second single-ended signal and use the second single-ended signal as an output signal.

10. An integrated chip, characterized in that, An axial vertical spiral balun based on a glass substrate according to any one of claims 1 to 8 above.

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