Substrate heater and substrate heating device

Abstract

The invention discloses a substrate heater and a substrate heating device, the substrate heater comprises an armored module, the armored module is provided with a first vacuum cavity, a heating module is arranged in the first vacuum cavity, and the power connection end of the heating module is arranged outside the first vacuum cavity; the sealing assembly comprises a first bottom cover, a sealing sleeve and a sealing ring, the power connection end of the heating module can penetrate through the outer protruding pipe, the sealing ring and the inner side of the sealing sleeve, and the inner side of the sealing ring abuts against the outer side of the power connection end to form sealing connection. The substrate heating device comprises the substrate heater and a rotating module, the rotating module comprises an outer cover with a containing cavity, a substrate supporting plate and a rotating driving part, the containing cavity is provided with a first opening and a third channel, the substrate supporting plate is fixedly connected with the outer cover, the rotating driving part can drive the outer cover to rotate, the heating module is arranged in the containing cavity, and the heating module is arranged in the containing cavity. The sealing assembly is rotatably connected with the outer cover, and the power connection end of the heating module can penetrate through the third channel and is connected with the sealing assembly in a sealed mode.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer substrate heating, and particularly to a substrate heater and a substrate heating device. Background Art

[0002] A wafer refers to a silicon wafer used for manufacturing silicon semiconductor integrated circuits. During the wafer production process, it is necessary to heat the wafer to cause film expansion. In this process, the wafer needs to be heated. And in the vacuum coating process, heating the wafer substrate is an important step, which directly affects the performance and quality of the film. By heating the surface of the wafer substrate, the physical adsorption on the surface of the wafer substrate can be transformed into chemical adsorption, increasing the interaction between molecules, thereby improving the adhesion between the film and the substrate. And heating the surface of the wafer substrate helps to reduce the difference between the recrystallization temperature of vapor molecules and the substrate temperature, reduce or eliminate the internal stress between the film layers, make the structure of the film more dense, and improve the mechanical strength.

[0003] Currently, the commonly used heating methods are mainly radiation heating, generally using platinum wires and nickel-chromium wires. The heating wires are mainly fixed in the spiral grooves of the ceramic heating plate. The power connection terminals of the heating wires are inside the first vacuum chamber and are connected to the outside through feedthrough electrodes. However, as the heating plate increases, such as when applied to 8-inch products, due to the increase in the area of the ceramic heating plate, affected by strength and weight, the middle area of the heating plate shows a sagging phenomenon. After heating, the sagging situation in the middle area of the heating plate becomes more serious. At the same time, as the area of the heating plate increases, the cost also increases. And in a vacuum environment, the electrical connection ports of the heating wires are prone to damage, resulting in increased losses. Summary of the Invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. For this purpose, the present invention provides a substrate heater and a substrate heating device. Among them, the substrate heater provided in the present application places the heating module in the first vacuum chamber, and the power connection terminals of the heating module extend to the outside of the first vacuum chamber, so that the power connection terminals of the heating module are prevented from being damaged due to being in a vacuum environment. Further, since the power connection terminals of the heating module need to be placed outside the first vacuum chamber, to ensure the vacuum environment of the first vacuum chamber, the present application also adds a sealing component at the connection between the power connection terminals of the heating module and the first channel of the first vacuum chamber to ensure the sealing performance of the first vacuum chamber, ensuring that the main body of the heating module can always be in a vacuum environment. And the substrate heating device applies the substrate heater of the present application. The heating module of the substrate heater of the present application can avoid the deformation of large-size substrates during the heating process through the support of the armored module, ensuring the heating quality of the substrates.

[0005] In a first aspect, a substrate heater according to an embodiment of the present invention includes: The armored module has a first vacuum chamber, the first vacuum chamber has a first channel that can communicate with the outside, a heating module is arranged in the first vacuum chamber, and the power connection end of the heating module passes through the first channel and is arranged outside the first vacuum chamber; The sealing assembly includes a first bottom cover, a sealing sleeve and a sealing ring. The first bottom cover is used to cover the first channel. The first bottom cover is provided with an outward protruding pipe. The sealing sleeve is sleeved on the outside of the outward protruding pipe. The sealing ring is located between the outward protruding pipe and the sealing sleeve. The power connection end of the heating module can pass through the inside of the outward protruding pipe, the sealing ring and the sealing sleeve, and the inner side of the sealing ring abuts against the outer side of the power connection end to form a sealed connection.

[0006] A substrate heater according to an embodiment of the present invention has at least the following beneficial effects: The heating module of the substrate heater of the present application is supported by the armored module, which can prevent large-sized substrates from deforming during the heating process and ensure the heating quality of the substrates. At the same time, the heating module is in the first vacuum chamber, which can prevent the heating module from directly contacting and heating the substrate, prevent the substrate from being damaged due to overheating too quickly, and help reduce losses. In addition, in the substrate heater provided in the present application, the heating module is placed in the first vacuum chamber, and the power connection end of the heating module extends to the outside of the first vacuum chamber, so that the power connection end of the heating module is prevented from being damaged due to being in a vacuum environment. Further, since the power connection end of the heating module needs to be externally placed outside the first vacuum chamber, to ensure the vacuum environment of the first vacuum chamber, the present application also adds a sealing assembly at the connection between the power connection end of the heating module and the first channel of the first vacuum chamber to ensure the sealing of the first vacuum chamber and ensure that the main body of the heating module can always be in a vacuum environment.

[0007] A substrate heater according to an embodiment of the present invention, the power connection end is connected with a power connection electrode, the power connection electrode can pass through the inside of the outward protruding pipe, the sealing ring and the sealing sleeve, and the inner side of the sealing ring abuts against the outer side of the power connection electrode to form a sealed connection.

[0008] A substrate heater according to an embodiment of the present invention, the armored module includes a lower base and an upper cover connected to the lower base. The inner wall of the lower base and the inner wall of the upper cover jointly enclose the first vacuum chamber, and the first channel is located on the upper cover.

[0009] A substrate heater according to an embodiment of the present invention further includes a temperature monitoring module located in the first vacuum chamber. The temperature monitoring module includes a first detector and a second detector. The power connection ends of the first detector and the second detector are arranged outside the first vacuum chamber after passing through the first channel. The power connection ends of the first detector and the second detector can pass through the inside of the outer convex tube, the sealing ring, and the sealing sleeve, and the inner side of the sealing ring abuts against the outer side of the power connection end to form a sealed connection.

[0010] A substrate heater according to an embodiment of the present invention, wherein power connection electrodes are connected to the power connection ends of the first detector and the second detector. The power connection electrodes can pass through the inside of the outer convex tube, the sealing ring, and the sealing sleeve, and the inner side of the sealing ring abuts against the outer side of the power connection electrode to form a sealed connection.

[0011] A substrate heater according to an embodiment of the present invention, wherein the first bottom cover is provided with at least three outer convex tubes, and the power connection ends of the heating module, the first detector, and the second detector are respectively arranged corresponding to the three outer convex tubes.

[0012] A substrate heater according to an embodiment of the present invention, wherein the sealing assembly further includes a first connecting pipe capable of communicating with the first channel. The first bottom cover covers one end of the first connecting pipe. The first bottom cover is provided with two outer convex tubes. The first connecting pipe is provided with a second channel, and the second channel is provided with the sealing assembly. The power connection ends of the heating module and the first detector are arranged corresponding to the two outer convex tubes of the first bottom cover, and the power connection end of the second detector can pass through the second channel and extend to the outside of the sealing assembly.

[0013] In a second aspect, a substrate heating device according to an embodiment of the present invention includes the above-mentioned substrate heater; A rotation module, including an outer cover with a receiving cavity, a substrate carrier plate, and a rotation driving member. The receiving cavity has a first opening and a third channel. The substrate carrier plate is arranged at the first opening and is fixedly connected to the outer cover. The rotation driving member can drive the outer cover to rotate. The heating module is arranged in the receiving cavity. The sealing assembly is arranged outside the third channel and is rotatably connected to the outer cover. The power connection end of the heating module can pass through the third channel and be hermetically connected to the sealing assembly.

[0014] A substrate heating device according to an embodiment of the present invention has at least the following beneficial effects: The substrate heating device applies the substrate heater of the present application. Among them, the heating module of the substrate heater of the present application is supported by the sheathed module, which can avoid the deformation of large-size substrates during the heating process and ensure the heating quality of the substrates. At the same time, the heating module is located in the first vacuum chamber, which can avoid direct contact heating between the heating module and the substrate, prevent the substrate from being damaged due to excessive heating speed, and help reduce losses. In addition, the substrate heater provided by the present application places the heating module in the first vacuum chamber, and the power connection end of the heating module extends to the outside of the first vacuum chamber, so that the power connection end of the heating module is prevented from being damaged due to being in a vacuum environment. Further, since the power connection end of the heating module needs to be externally disposed outside the first vacuum chamber, in order to ensure the vacuum environment of the first vacuum chamber, the present application also adds a sealing component at the connection between the power connection end of the heating module and the first channel of the first vacuum chamber to ensure the sealing of the first vacuum chamber and ensure that the main body of the heating module can always be in a vacuum environment.

[0015] In a substrate heating device according to an embodiment of the present invention, a heat insulation plate is provided in the accommodation cavity, the heat insulation plate covers the upper part of the heating module, and at least two of the heat insulation plates are stacked in the vertical direction.

[0016] In a substrate heating device according to an embodiment of the present invention, a notch is provided at one end of the outer cover close to the first opening, and the substrate support plate cooperates with the notch to form a feeding port for taking and placing substrates, and the diameter of the feeding port is larger than the diameter of the substrate.

[0017] The additional aspects and advantages of the present invention will be partly given in the following description, partly will become obvious from the following description, or be understood through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and / or additional aspects and advantages of the present invention will become obvious and easy to understand from the description of the embodiments in conjunction with the following drawings, wherein: Figure 1 is a structural cross-sectional view of a substrate heating device according to an embodiment of the present invention; Figure 2 is a structural diagram of a substrate heating device according to an embodiment of the present invention; Figure 3 is a structural diagram of a substrate heater according to an embodiment of the present invention; Figure 4 is an enlarged view of the sealing component according to an embodiment of the present invention.

[0019] Description of the reference numerals: Second vacuum chamber 1; Armored module 100; Heating module 110; Lower base 120; Upper cover 130; Sealing assembly 200; First bottom cover 210; Outer convex tube 211; Sealing sleeve 220; Sealing ring 230; First connecting pipe 240; First detector 300; Second detector 400; Power connection electrode 500; Rotating module 600; Outer cover 610; Heat insulation plate 611; Notch 612; Substrate carrier 620; Rotation drive 630; Second connecting pipe 640; First transmission gear 650; Second transmission gear 660; Third connecting pipe 670; Magnetic coupling mechanism 700; Inner magnetic coupling assembly 710; Outer magnetic coupling assembly 720; Substrate 800; Sealing flange 900. Detailed implementation manners

[0020] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0021] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by terms such as up, down, front, back, left, right, etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.

[0022] In the description of the invention, the meaning of several is one or more, the meaning of multiple is more than two, greater than, less than, exceeding, etc. are understood as not including the present number, and above, below, within, etc. are understood as including the present number. If there is a description of first and second, it is only for the purpose of distinguishing technical features and should not be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence relationship of the indicated technical features.

[0023] In the description of the present invention, unless otherwise clearly defined, words such as setting, installing, connecting, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in the present invention in combination with the specific content of the technical solution.

[0024] Referring to Figures 1 to 2 , the embodiments of the present invention provide a substrate heating device. Specifically, the substrate heating device includesFigures 3 to 4 The substrate heating device shown. Among them, the substrate heating device provided in this application is applied to a substrate heating equipment (not shown in the figure). The substrate heating equipment (not shown in the figure) is provided with a second vacuum chamber 1, as Figure 1 the second vacuum chamber 1 simulated by the dotted line in the figure. The substrate heating device is arranged inside the second vacuum chamber 1. The second vacuum chamber 1 has an outlet through which the power connection terminal of the heating module can pass. The sealing component 200 is located outside the second vacuum chamber 1.

[0025] As Figure 1 shown, the substrate heating device includes a sheathed module 100, a heating module 110, a sealing component 200 and a temperature monitoring module. Specifically, the sheathed module 100 includes a lower base 120 and an upper cover 130 connected to the lower base 120. The inner walls of the lower base 120 and the upper cover 130 enclose and form a first vacuum chamber together. And a first channel is located on the upper cover 130. The first channel can communicate the first vacuum chamber with the external atmosphere. And the heating module 110 is arranged inside the first vacuum chamber. However, since the power connection terminal of the heating module 110 in this application needs to be external to the outside of the first vacuum chamber, and the first vacuum chamber needs to maintain a vacuum environment. Therefore, the power connection terminal of the heating module 110 can pass through the first channel to the outside of the first vacuum chamber. At the same time, to ensure the vacuum environment of the first vacuum chamber, a sealing component 200 is additionally provided at the connection between the power connection terminal of the heating module 110 and the first channel of the first vacuum chamber to ensure the sealing performance of the first vacuum chamber and ensure that the main body of the heating module 110 can always be in a vacuum environment.

[0026] Specifically, as Figure 4 shown, the sealing component 200 includes a first bottom cover 210, a sealing sleeve 220 and a sealing ring 230. Among them, the first bottom cover 210 covers the first channel. And the first bottom cover 210 is provided with an outwardly protruding tube 211. The sealing sleeve 220 is sleeved on the outside of the outwardly protruding tube 211. The sealing ring 230 is located between the outwardly protruding tube 211 and the sealing sleeve 220. The power connection terminal of the heating module 110 can pass through the inside of the outwardly protruding tube 211, the sealing ring 230 and the sealing sleeve 220. The inner side of the sealing ring 230 abuts against the outer side of the power connection terminal to form a sealed connection.

[0027] As a further improvement of the solution, as shown in the figure, the power connection terminal is connected with a power connection electrode 500. The power connection electrode 500 can pass through the inside of the outwardly protruding tube 211, the sealing ring 230 and the sealing sleeve 220. The inner side of the sealing ring 230 abuts against the outer side of the power connection electrode 500 to form a sealed connection. Specifically, the power connection electrode 500 is a feedthrough electrode.

[0028] Advantageously, by using the feedthrough electrode as the power connection electrode 500 between the heating module 110 and an external power source or communication device, the power connection electrode 500 of the heating module 110 has a feedthrough function. Moreover, the feedthrough electrode can transmit electrical signals in a vacuum or sealed environment while maintaining the system's sealing performance, so that the first vacuum chamber can maintain a vacuum environment, ensuring the heat transfer efficiency of the heating module 110 and ensuring that the substrate 800 is uniformly heated.

[0029] According to some embodiments of the present application, the temperature monitoring module includes a first detector 300 and a second detector 400. The power connection ends of the first detector 300 and the second detector 400 are arranged outside the first vacuum chamber after passing through the first channel. The power connection ends of the first detector 300 and the second detector 400 can pass through the inner sides of the outer convex tube 211, the sealing ring 230, and the sealing sleeve 220, and the inner side of the sealing ring 230 abuts against the outer side of the power connection end to form a sealed connection.

[0030] Specifically, the first detector 300 is used to monitor whether the temperature of the heating module 110 meets the heating requirements and whether the heating module 110 is operating normally, while the second detector 400 is used to monitor whether the temperature rise of the lower base 120 in the sheathed module 100 is normal.

[0031] That is, it can be understood that the lower base 120 in the sheathed module 100 has a heating surface, the heated surface of the substrate 800 is attached to the heating surface, and the heat generated by the heating module 110 can be transferred to the heating surface to heat the surface of the substrate 800. The detection end of the second detector 400 can be connected to the heating surface of the lower base 120. In addition, the detection end of the first detector 300 is connected to the heating module 110.

[0032] Furthermore, the power connection ends of the first detector 300 and the second detector 400 also need to be externally arranged outside the first vacuum chamber, and the power connection ends of the first detector 300 and the second detector 400 are also provided with feedthrough electrodes to ensure the vacuum environment of the first vacuum chamber.

[0033] According to some embodiments of the present application, as shown in the figure, the heating module 110 of the present application is a disc-shaped heating wire, and the heating wire is distributed in a spiral shape and fixedly connected to the lower base 120. By supporting the heating wire by the lower base 120, it is possible to prevent the heating wire from sagging during the process of heating the surface of the substrate 800, which may cause the substrate 800 to deform, effectively protecting the substrate 800.

[0034] According to some embodiments of the present application, the first bottom cover 210 is provided with three outer convex tubes 211, and the power connection ends of the first detector 300, the second detector 400, and the heating module 110 are respectively arranged corresponding to the three outer convex tubes 211.

[0035] Alternatively, as shown in the figure, the first bottom cover 210 is provided with two outwardly protruding tubes 211. Among them, the first bottom cover 210 is hermetically connected to the upper cover 130 of the armored module 100 through a first connecting tube 240. The first connecting tube 240 is provided with a second channel, and the second channel is also connected to a sealing assembly 200. The power connection end of the second detector 400 can sequentially pass through the second channel and the sealing assembly 200, and the power connection end of the second detector 400 is also hermetically connected to the sealing assembly 200. That is, it can be understood that the first detector 300, the second detector 400, and the heating module 110 respectively have independent wire threading channels to avoid electromagnetic interference.

[0036] As shown in the figure, the substrate heating device provided by the present application further includes a rotation module 600.

[0037] Specifically, the rotation module 600 includes an outer cover 610 having a receiving cavity, a substrate support plate 620, a rotation assembly, and a rotation driving member 630. In addition, the armored module 100 and the heating module 110 of the heater are both installed in the receiving cavity of the outer cover 610, and the substrate support plate 620 is disposed at the opening of the receiving cavity for supporting the substrate 800 to be heated.

[0038] As shown in the figure, the rotating assembly includes a second connecting pipe 640, a first flange sleeved outside the second connecting pipe 640, and a magnetic coupling mechanism 700. Among them, the magnetic coupling mechanism 700 includes an inner magnetic coupling component 710 sleeved outside the second connecting pipe 640 and an outer magnetic coupling component 720 sleeved outside the inner magnetic coupling component 710. Among them, the inner magnetic coupling component 710 is connected to one end of the second connecting pipe 640, and the other end of the second connecting pipe 640 is connected to the outer cover 610. One end of the inner magnetic coupling component 710 is connected to the first connecting pipe 240 of the sealing component 200. The power connection ends of the heating module 110, the first detector 300, and the second detector 400 sequentially pass through the first channel and the second connecting pipe 640 and then extend to the outside of the first vacuum chamber. Through the cooperation of the dual detectors, the independent channel design of the dual detectors, and the magnetic coupling mechanism 700, both the monitoring accuracy is ensured, and the electromagnetic coupling interference between the sensor cable and the heating cable is avoided. In addition, the rotary drive 630 is drivingly connected to the outer magnetic coupling component 720. Specifically, as shown in the figure, a first transmission gear 650 is installed on the outer magnetic coupling component 720, and the output end of the rotary drive 630 is connected to a second transmission gear 660. The first transmission gear 650 is meshingly connected to the second transmission gear 660. The outer cover 610 is driven to rotate through gear transmission, so as to drive the substrate 800 on the substrate carrier 620 to rotate accordingly. However, the heating module 110 in this application is rotatably connected to the outer cover 610. When the outer cover 610 rotates, the heating module 110 remains stationary to improve the temperature uniformity, ensure the rotation heating of the substrate 800, and the gear transmission is stable, which can ensure the uniform heating of the substrate 800.

[0039] Further, a third connecting pipe 670 is hermetically connected to the outside of the armored module 100. Among them, the second connecting pipe 640 is sleeved outside the third connecting pipe 670. One end of the third connecting pipe 670 away from the heating module 110 is hermetically connected to the first connecting pipe 240. The power connection ends of the heating module 110, the first detector 300, and the second detector 400 sequentially pass through the first channel and the third connecting pipe 670 and then to the outside of the first vacuum chamber and are hermetically connected to the sealing component 200.

[0040] Among them, as shown in the figure, the second connecting pipe 640 and the third connecting pipe 670 can also pass through the second vacuum chamber 1. To further ensure that the second vacuum chamber 1 can maintain a vacuum environment, a sealing flange 900 is provided at the outlet of the second vacuum chamber 1. The second connecting pipe 640 is hermetically connected to the sealing flange 900 to ensure that, at the same time, the second connecting pipe 640 and the sealing flange 900 can rotate relative to each other.

[0041] That is, it can be understood that through the combined cooperation of the sealing flange 900 and the sealing assembly 200 in this application, the heating module 110 can always be maintained in a vacuum environment, while the power connection of the heating module is in the atmospheric environment. The sealing flange 900 and the sealing assembly 200 play a role in vacuum sealing.

[0042] As a further improvement of the solution, a heat insulation plate 611 is arranged in the accommodation cavity. The heat insulation plate 611 covers the upper part of the heating module 110, and at least two heat insulation plates 611 are stacked in the vertical direction.

[0043] Beneficially, the stacked heat insulation plate 611 design can optimize the thermal field distribution, reduce energy loss, and protect external components at the same time.

[0044] As a further improvement of the solution, a notch 612 is arranged at one end of the outer cover 610 close to the first opening. The substrate carrier plate 620 cooperates with the notch 612 to form a feeding port for taking and placing the substrate 800. The diameter of the feeding port is larger than the diameter of the substrate 800 to facilitate the user to take out or put in the substrate 800.

[0045] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0046] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and purposes of the present invention. The scope of the present invention is defined by the claims and their equivalents.

Claims

1. A substrate heater, characterized in that, Including: An armored module (100) having a first vacuum chamber with a first channel communicating with the outside. A heating module (110) is disposed in the first vacuum chamber, and the power connection end of the heating module (110) passes through the first channel and is disposed outside the first vacuum chamber. A sealing assembly (200) including a first bottom cover (210), a sealing sleeve (220), and a sealing ring (230). The first bottom cover (210) is used to cover the first channel. The first bottom cover (210) is provided with an outwardly protruding tube (211). The sealing sleeve (220) is sleeved outside the outwardly protruding tube (211). The sealing ring (230) is located between the outwardly protruding tube (211) and the sealing sleeve (220). The power connection end of the heating module (110) can pass through the inside of the outwardly protruding tube (211), the sealing ring (230), and the sealing sleeve (220). The inner side of the sealing ring (230) abuts against the outer side of the power connection end to form a sealed connection.

2. The substrate heater according to claim 1, wherein The power connection end of the heating module (110) is connected to a power connection electrode (500). The power connection electrode (500) can pass through the inside of the outwardly protruding tube (211), the sealing ring (230), and the sealing sleeve (220). The inner side of the sealing ring (230) abuts against the outer side of the power connection electrode (500) to form a sealed connection.

3. A substrate heater according to claim 1, characterized in that, The armored module (100) includes a lower base (120) and an upper cover (130) connected to the lower base (120). The inner wall of the lower base (120) and the inner wall of the upper cover (130) jointly enclose to form the first vacuum chamber. The first channel is located on the upper cover (130).

4. A substrate heater according to claim 1, characterized in that, It further includes a temperature monitoring module located in the first vacuum chamber. The temperature monitoring module includes a first detector (300) and a second detector (400). The power connection ends of the first detector (300) and the second detector (400) pass through the first channel and are disposed outside the first vacuum chamber. The power connection ends of the first detector (300) and the second detector (400) can pass through the inside of the outwardly protruding tube (211), the sealing ring (230), and the sealing sleeve (220). The inner side of the sealing ring (230) abuts against the outer side of the power connection end to form a sealed connection.

5. A substrate heater according to claim 4, wherein The power connection ends of the first detector (300) and the second detector (400) are both connected to a power connection electrode (500). The power connection electrode (500) can pass through the inside of the outwardly protruding tube (211), the sealing ring (230), and the sealing sleeve (220). The inner side of the sealing ring (230) abuts against the outer side of the power connection electrode (500) to form a sealed connection.

6. The substrate heater according to claim 5, wherein, The first bottom cover (210) is provided with at least three outwardly protruding tubes (211). The power connection ends of the heating module (110), the first detector (300), and the second detector (400) are respectively arranged corresponding to the three outwardly protruding tubes (211).

7. A substrate heater according to claim 5, wherein, The sealing assembly (200) further includes a first connecting pipe (240) capable of communicating with the first channel. One end of the first connecting pipe (240) is covered by the first bottom cover (210). The first bottom cover (210) is provided with two outwardly protruding pipes (211). The first connecting pipe (240) is provided with a second channel, and the sealing assembly (200) is arranged in the second channel. The power connection ends of the heating module (110) and the first detector (300) are arranged corresponding to the two outwardly protruding pipes (211) of the first bottom cover (210). The power connection end of the second detector (400) can pass through the second channel and extend to the outside of the sealing assembly (200).

8. A substrate heating device, comprising the substrate heater according to any one of claims 1 to 7, characterized in that: A rotation module (600), including an outer cover (610) having a receiving cavity, a substrate support plate (620) and a rotation driving member (630). The receiving cavity has a first opening and a third channel. The substrate support plate (620) is arranged at the first opening and fixedly connected to the outer cover (610). The rotation driving member (630) can drive the outer cover (610) to rotate. The heating module (110) is arranged in the receiving cavity. The sealing assembly (200) is arranged outside the third channel and is rotatably connected to the outer cover (610). The power connection end of the heating module (110) can pass through the third channel and be hermetically connected to the sealing assembly (200).

9. A substrate heating device according to claim 8, characterized in that, A heat insulation plate (611) is arranged in the receiving cavity. The heat insulation plate (611) covers the upper part of the heating module (110). At least two heat insulation plates (611) are stacked in the vertical direction.

10. A substrate (800) heating device according to claim 8, characterized in that, One end of the outer cover (610) close to the first opening is provided with a notch (612). The substrate support plate (620) cooperates with the notch (612) to form a feeding port for placing and taking the substrate (800). The diameter of the feeding port is larger than the diameter of the substrate (800).

Images