Electronic device

Abstract

The invention discloses electronic equipment, and belongs to the technical field of electronic equipment. The electronic equipment comprises a vapor chamber and a heating device, the vapor chamber comprises a first cover plate and a second cover plate, the first cover plate and the second cover plate define a cavity, a capillary structure is arranged in the cavity, the heating device is arranged on the side where the first cover plate is located, and the first cover plate comprises a cover plate body and a deformation part; when the temperature of the heating device is lower than a first temperature, a first distance is formed between the first cover plate and the heating device; when the temperature of the heating device is higher than or equal to the first temperature, the deformation piece deforms so that the deformation piece can abut against the heating device.

Description

Technical Field

[0001] This application belongs to the technical field of electronic devices, and particularly relates to an electronic device. Background Art

[0002] With the progress of technology, the chip power of electronic devices has gradually increased, resulting in a growing amount of heat generated by the chips when the electronic devices are operating. When the chips of electronic devices operate at a high temperature, it will cause the power consumption of the electronic devices to increase and reduce the operating stability of the electronic devices.

[0003] In the related art, the heat dissipation effect is improved by filling a heat-conducting layer between the chip on the main board and the heat pipe structure in the electronic device. However, due to the inevitable manufacturing tolerances between the main board, the chip and the heat pipe structure, in order to prevent the assembly interference from pressing the main board and the chip, an assembly gap is usually set between the heat pipe structure and the heat-conducting layer after assembly, which reduces the heat dissipation ability of the heat pipe structure. Summary of the Invention

[0004] The purpose of the embodiments of this application is to provide an electronic device, which solves the problem that the heat dissipation ability of the heat pipe structure is reduced due to the assembly gap between the heat pipe structure and the heat-conducting layer after assembly.

[0005] The embodiments of this application provide an electronic device, which includes a heat pipe and a heat-generating device. The heat pipe includes a first cover plate and a second cover plate. The first cover plate and the second cover plate enclose a cavity, and a capillary structure is arranged in the cavity. The heat-generating device is arranged on the side where the first cover plate is located. The first cover plate includes a cover plate main body and a deformation member. Wherein, when the temperature of the heat-generating device is lower than a first temperature, there is a first distance between the first cover plate and the heat-generating device; when the temperature of the heat-generating device is higher than or equal to the first temperature, the deformation member deforms so that the deformation member abuts against the heat-generating device.

[0006] In the embodiments of this application, the deformation member arranged on the first cover plate can deform, so as to adjust the positional relationship between the first cover plate and the heat-generating device. Therefore, when the heat pipe is assembled into the electronic device, since the temperature of the heat-generating device is relatively low, there is a first distance between the first cover plate and the heat-generating device, ensuring that there is a certain assembly gap between the heat pipe and the heat-generating device of the electronic device during the assembly process, which is convenient for the installation of the heat pipe. After the assembly is completed, when the heat-generating device of the electronic device generates heat until the temperature is higher than the first temperature during use, the deformation member bulges towards the heat-generating device, so that the deformation member in the first cover plate abuts against the heat-generating device, thereby generating extrusion between the heat pipe and the heat-generating device, ensuring that the heat pipe can be closely attached to the heat-generating device, improving the heat conduction effect between the heat pipe and the heat-generating device, and further enhancing the heat dissipation ability of the electronic device, solving the problem that the heat dissipation ability of the heat pipe is reduced due to the assembly gap between the heat pipe and the heat-conducting layer after assembly. Brief Description of the Drawings

[0007] Figure 1 Fig. 1 shows one of the schematic structural diagrams of the electronic device provided in some embodiments of the present application;

[0008] Figure 2 Fig. 2 shows another schematic structural diagram of the electronic device provided in some embodiments of the present application;

[0009] Figure 3 Fig. 3 shows yet another schematic structural diagram of the electronic device provided in some embodiments of the present application;

[0010] Figure 4 Fig. 4 shows still another schematic structural diagram of the electronic device provided in some embodiments of the present application;

[0011] Figure 5 Fig. 5 shows one of the schematic structural diagrams of the vapor chamber provided in some embodiments of the present application;

[0012] Figure 6 Fig. 6 shows another schematic structural diagram of the vapor chamber provided in some embodiments of the present application;

[0013] Figure 7 Fig. 7 shows yet another schematic structural diagram of the vapor chamber provided in some embodiments of the present application;

[0014] Figure 8 Fig. 8 shows still another schematic structural diagram of the vapor chamber provided in some embodiments of the present application;

[0015] Figure 9 Fig. 9 shows another schematic structural diagram of the vapor chamber provided in some embodiments of the present application;

[0016] Figure 10 Fig. 10 shows yet another schematic structural diagram of the vapor chamber provided in some embodiments of the present application;

[0017] Figure 11 Fig. 11 shows still another schematic structural diagram of the vapor chamber provided in some embodiments of the present application.

[0018] The reference numerals are as follows:

[0019] 10 Electronic device, 100 Vapor chamber, 101 First cover plate, 102 Second cover plate, 103 Cavity, 104 Capillary structure, 105 Cover plate main body, 106 Deformation member, 107 Flexible part, 108 Fitting part, 109 Driving member, 110 First magnet, 111 Second magnet, 112 Elastic structure, 113 Electro-deformation structure, 114 Conductive member, 115 Shape memory alloy structure, 116 Temperature sensing member, 117 Heat conduction medium, 118 Liquid absorption core, 200 Heating device, 300 Heat conduction layer, 400 Circuit board, 500 Middle frame, 600 Rear cover. Detailed implementation manners

[0020] The following will clearly describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application fall within the scope of protection of the present application.

[0021] The terms "first" and "second" in the description and claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise specified, the meaning of "a plurality" is two or more. In addition, "and / or" in the description and claims means at least one of the connected objects, and the character " / " generally means an "or" relationship between the associated objects before and after.

[0022] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0023] In the description of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected, or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0024] The following will be combined with the attached Figures 1 to 11 drawings to provide a detailed description of the electronic device provided in the embodiments of the present application through specific embodiments and their application scenarios.

[0025] In some embodiments of the present application, an electronic device is provided. Figure 1 FIG. 1 shows one of the structural schematic diagrams of the electronic device provided in some embodiments of the present application. Figure 2 FIG. 2 shows another structural schematic diagram of the electronic device provided in some embodiments of the present application. Figure 3FIG. 3 shows a schematic structural diagram of an electronic device provided in some embodiments of the present application, as Figure 1 , Figure 2 and Figure 3 shown. The electronic device 10 includes a vapor chamber 100 and a heating device 200. The vapor chamber 100 includes a first cover plate 101 and a second cover plate 102. The first cover plate 101 and the second cover plate 102 enclose a cavity 103. A capillary structure 104 is disposed in the cavity 103. The heating device 200 is disposed on the side where the first cover plate 101 is located. The first cover plate 101 includes a cover plate main body 105 and a deformation member 106. Wherein, when the temperature of the heating device 200 is lower than the first temperature, there is a first distance between the first cover plate 101 and the heating device 200. When the temperature of the heating device 200 is higher than or equal to the first temperature, the deformation member 106 deforms so that the deformation member 106 abuts against the heating device 200.

[0026] In an embodiment of the present application, the electronic device 10 includes a vapor chamber 100 and a heating device 200. The heating device 200 is a power device inside the electronic device 10. The vapor chamber 100 includes a first cover plate 101 and a second cover plate 102. The first cover plate 101 is the cover plate facing the heating device 200 in the electronic device 10. The first cover plate 101 includes a cover plate main body 105 and a deformation member 106. The deformation member 106 is disposed opposite to the heating device 200 of the electronic device 10, that is, the heating device 200 of the electronic device 10 is located within the coverage area of the area where the deformation member 106 is located. The area where the cover plate main body 105 is located is the other area on the first cover plate 101 except the area where the deformation member 106 is located. The first cover plate 101 and the second cover plate 102 enclose a cavity 103. A capillary structure 104 is disposed in the cavity 103. The capillary structure 104 is used to conduct a heat conduction medium 117, so that the vapor chamber 100 can dissipate heat from the heating device 200 in a uniform heat dissipation manner.

[0027] Exemplarily, the housing is a metal housing. Specifically, for example, the housing material can be a metal material such as copper, iron, or aluminum.

[0028] In an embodiment of the present application, the deformation member 106 can deform with temperature changes, thereby changing the positional relationship between the first cover plate 101 and the heating device 200. Specifically, the deformation member is disposed in the area opposite to the heating device 200 on the first cover plate 101. When the temperature of the heating device 200 is lower than the first temperature, the deformation member 106 does not deform, and there is a first distance between the first cover plate 101 and the heating device 200, that is, the first cover plate 101 and the heating device 200 are spaced apart at this time. When the temperature of the heating device 200 is higher than or equal to the first temperature, the deformation member 106 deforms. At this time, the deformation member 106 protrudes toward the heating device 200 so that the deformation member 106 abuts against the heating device 200.

[0029] It should be noted that the deformation of the deformation member 106 can be a reversible deformation or an irreversible deformation.

[0030] As Figure 2 shown, when the temperature of the heat generating device 200 is lower than the first temperature, the deformation member 106 is flush with the cover plate main body 105. At this time, the distance between the deformation member 106 and the heat generating device 200 is L1, and L1>0, that is, the first distance between the first cover plate 101 and the heat generating device 200 is L1. As Figure 3 shown, when the temperature of the heat generating device 200 is higher than or equal to the first temperature, the deformation member 106 deforms, and the elastic member bulges toward the heat generating device 200 and abuts against the heat generating device 200.

[0031] In some embodiments, the deformation of the deformation member 106 is a reversible deformation. Specifically, for example, when the temperature of the heat generating device 200 rises from the first temperature to a temperature higher than the first temperature, the deformation member 106 changes from being flush with the cover plate main body 105 to bulging toward the heat generating device 200; when the temperature of the heat generating device 200 drops from a temperature higher than the first temperature to a temperature lower than the first temperature, the deformation member 106 changes from bulging toward the heat generating device 200 to being flush with the cover plate main body 105.

[0032] In the embodiment of the present application, the deformation member 106 provided on the first cover plate 101 can deform, so as to adjust the positional relationship between the first cover plate 101 and the heat generating device 200. Therefore, when the heat sink 100 is assembled into the electronic device 10, since the temperature of the heat generating device 200 is relatively low, there is a first distance between the first cover plate 101 and the heat generating device 200, ensuring that there is a certain assembly gap between the heat sink 100 and the heat generating device 200 of the electronic device 10 during the assembly process, which is convenient for the installation of the heat sink 100. After the assembly is completed, when the heat generating device 200 generates heat until the temperature is higher than the first temperature during the use of the electronic device 10, the deformation member 106 bulges toward the heat generating device 200, so that the deformation member 106 in the first cover plate 101 abuts against the heat generating device 200, thereby generating extrusion between the heat sink 100 and the heat generating device 200, ensuring that the heat sink 100 can be closely attached to the heat generating device 200, improving the heat conduction effect between the heat sink 100 and the heat generating device 200, and further enhancing the heat dissipation capacity of the electronic device 10, solving the problem that the heat dissipation capacity of the heat sink 100 is reduced due to the assembly gap between the heat sink 100 and the heat conduction layer 300 after assembly.

[0033] As Figure 2 and Figure 3As shown, in some embodiments of the present application, the deformation member 106 includes: a flexible portion connected to the cover plate main body 105; a fitting portion connected to the flexible portion 107, and the flexible portion 107 is circumferentially distributed along the fitting portion 108. Wherein, when the temperature of the heat generating device 200 is higher than the first temperature, the flexible portion 107 deforms so that the fitting portion 108 abuts against the heat generating device 200.

[0034] In the embodiments of the present application, the deformation member 106 includes a fitting portion 108 and a flexible portion 107, and the flexible portion 107 encloses the outside of the fitting portion 108. The flexible portion 107 is disposed around the first cover plate 101. The outer portion enclosed by the flexible portion 107 is the cover plate main body 105, and the inner portion enclosed by the flexible portion 107 is the fitting portion 108. The fitting portion 108 is used for fitting contact with the heat generating device 200. When the flexible portion 107 deforms, and since the flexible portion 107 is disposed around the outside of the fitting portion 108 and the flexible portion 107 can generate a certain deformation, therefore, when the fitting portion 108 moves in the direction towards or away from the heat generating device 200, the flexible portion 107 can deform.

[0035] Exemplarily, the flexible portion 107 can be at least one of a metal thin shell, a metal foil, etc., and the flexible portion 107 has a certain deformation ability. The fitting portion 108 and the cover plate main body 105 are of the same material.

[0036] In the embodiments of the present application, the fitting portion 108 embedded in the first cover plate 101 and the flexible portion 107 capable of driving the first region to protrude from the second region are provided in the deformation member 106. When the flexible portion 107 deforms, it can drive the fitting portion 108 to protrude towards the heat generating device 200, so that the deformation member 106 can deform according to the numerical relationship between the temperature of the heat generating device 200 and the first temperature, that is, to ensure that there is a first distance between the first cover plate 101 and the heat generating device 200 during the assembly process, and when the heat generating device 200 generates heat after the assembly is completed, the heat generating device 200 can be in close contact with the heat sink 100, thereby improving the heat dissipation performance of the electronic device 10.

[0037] Such as Figure 2 and Figure 3 As shown, in some embodiments of the present application, the heat sink 100 further includes: a driving member 109 located in the cavity 103, one side of the driving member 109 abuts against the fitting portion 108, and the other side of the driving member 109 abuts against the second cover plate 102. Wherein, when the temperature of the heat generating device 200 is higher than the first temperature, the driving member 109 drives the fitting portion 108 to move towards the heat generating device 200 and drives the flexible portion 107 to deform.

[0038] In the embodiment of the present application, the vapor chamber 100 further includes a driving member 109, the driving member 109 is connected to the deformation member 106, and the driving member 109 is used to drive the deformation member 106 to deform when the temperature of the heating device 200 changes. Specifically, the driving member 109 is disposed inside the cavity 103, and both sides of the driving member 109 are respectively abutted against the fitting portion 108 and the second cover plate 102, that is, the driving member 109 is located between the fitting portion 108 and the second cover plate 102. When the temperature of the heating device 200 is higher than the first temperature, the driving member 109 can deform, and since the flexible portion 107 surrounding the periphery of the fitting portion 108 can deform, the fitting portion 108 can drive the fitting portion 108 to move in the direction of the heating device 200.

[0039] Specifically, the driving member 109 can be deformed by the influence of temperature, and the deformation of the driving member 109 is a controllable deformation. Among them, when the temperature of the heating device 200 is higher than the first temperature, the driving member 109 deforms to drive the fitting portion 108 to protrude toward the heating device 200.

[0040] In the embodiment of the present application, a driving member 109 capable of deforming according to the temperature change of the heating device 200 is further disposed in the cavity 103 of the vapor chamber 100. When the temperature of the heating device 200 is less than the first temperature value, the driving member 109 can maintain the current deformed state, so that the fitting portion 108 maintains a flush state with the cover plate main body 105, and when the temperature of the heating device 200 is greater than the first temperature, the driving member 109 can drive the fitting portion 108 to move toward the heating device 200.

[0041] Figure 4 FIG. 4 shows a schematic structural diagram of the electronic device 10 provided in some embodiments of the present application. Figure 5 FIG. 1 shows a schematic structural diagram of the vapor chamber 100 provided in some embodiments of the present application. Figure 6 FIG. 2 shows a schematic structural diagram of the vapor chamber 100 provided in some embodiments of the present application. Figure 7 FIG. 3 shows a schematic structural diagram of the vapor chamber 100 provided in some embodiments of the present application. Figure 8 FIG. 4 shows a schematic structural diagram of the vapor chamber 100 provided in some embodiments of the present application. Figure 9 FIG. 5 shows a schematic structural diagram of the vapor chamber 100 provided in some embodiments of the present application. As Figures 4 to 9 shown, in some embodiments of the present application, the fitting portion 108 includes a first magnet 110, the driving member 109 includes an elastic structure 112, and the vapor chamber 100 further includes:

[0042] The second magnet 111 is embedded in the second cover plate 102. The second magnet 111 is disposed opposite to the first magnet 110. The magnetic poles of the opposite ends of the first magnet 110 and the second magnet 111 are opposite. The elastic structure 112 is located between the first magnet 110 and the second magnet 111. When the temperature of the heating device 200 is lower than the first temperature, the first magnet 110 and the second magnet 111 have a first magnetic attraction force to compress the elastic structure 112. When the temperature of the heating device 200 is higher than or equal to the first temperature, the first magnet 110 and the second magnet 111 have a second magnetic attraction force to drive the fitting portion 108 to move toward the heating device 200 and drive the flexible portion 107 to deform. The second magnetic attraction force is less than the first magnetic attraction force.

[0043] In the embodiment of the present application, both the first magnet 110 and the second magnet 111 are ferromagnetic ferromagnets, and when the temperature of the heating device 200 is higher than the first temperature, the first magnet 110 and the second magnet 111 can achieve temporary or permanent demagnetization. The first magnet 110 is used as the fitting portion 108 provided on the first cover plate 101, the second magnet 111 is provided on the second cover plate 102, and the first magnet 110 and the second magnet 111 are disposed opposite to each other. The elastic structure 112 is located between the first magnet 110 and the second magnet 111.

[0044] Specifically, the magnetic poles of the opposite ends of the first magnet 110 and the second magnet 111 are opposite.

[0045] When the temperature of the heating device 200 is lower than the first temperature, the first magnet 110 and the second magnet 111 are magnetic, and there is a first magnetic attraction force between the first magnet 110 and the second magnet 111, that is, the first magnet 110 and the second magnet 111 are attracted to each other under the action of the magnetic field, thereby squeezing the elastic structure 112 to make the elastic structure 112 in a compressed state. At this time, the fitting portion 108 remains flush with the first cover plate 101, that is, there is a first distance between the first cover plate 101 and the heating device 200.

[0046] When the temperature of the heating device 200 is higher than or equal to the first temperature, there is a second magnetic attraction force between the first magnet 110 and the second magnet 111, and the second magnetic attraction force is less than the first magnetic attraction force. For example, both the first magnet 110 and the second magnet 111 lose their magnetism. At this time, the attraction force between the first magnet 110 and the second magnet 111 decreases, the pressure exerted by the first magnet 110 and the second magnet 111 on the elastic structure 112 decreases, and the compression amount of the elastic structure 112 decreases. At this time, the elastic structure 112 drives the fitting portion 108 to move toward the heating device 200, so that the fitting portion 108 abuts against the heating device 200.

[0047] Exemplarily, the elastic structure 112 can be at least one of a spring, a rigid foam, and silica gel, that is, the elastic structure 112 is a structure with elasticity and can recover from a compressed state to an uncompressed state, or can change from a compressed state to an extended state.

[0048] It should be noted that when the first magnet 110 and the second magnet 111 are demagnetized, the compression amount of the elastic structure 112 decreases, that is, the length of the elastic structure 112 is greater than the thickness of the housing, that is, the amplitude of the elastic structure 112 is greater than the distance between the first cover plate 101 and the second cover plate 102. Therefore, the first region enclosed by the fitting portion 108 protrudes from the second region under the elastic action of the elastic structure 112.

[0049] As Figure 6 shown, the second magnet 111 is embedded in the second cover plate 102. As Figure 7 and Figure 8 shown, the fitting portion 108 is embedded in the first cover plate 101, and the first magnet 110 serves as the fitting portion 108 in the elastic member.

[0050] Exemplarily, the value range of the first temperature is 50°C to 60°C.

[0051] Specifically, when the working temperature of the first magnet 110 and the second magnet 111 is relatively low, that is, when the working temperature of the first magnet 110 and the second magnet 111 is below the Curie point, the first magnet 110 and the second magnet 111 have opposite magnetic polarities, that is, it is ensured that the first magnet 110 and the second magnet 111 can attract each other to compress the elastic structure 112 when the working temperature is relatively low. When the working temperature of the first magnet 110 and the second magnet 111 is relatively high, that is, when the working temperature of the first magnet 110 and the second magnet 111 is above the Curie point, the first magnet 110 and the second magnet 111 lose their magnetism, that is, it is ensured that the first magnet 110 and the second magnet 111 can no longer attract each other when the working temperature is relatively high, thereby reducing the compression amount of the elastic structure 112.

[0052] In the embodiments of the present application, the fitting portion 108 is provided as the first magnet 110, the second magnet 111 is provided on the second cover plate 102, and the elastic structure 112 is provided between the first magnet 110 and the second magnet 111, and the magnetism of the first magnet 110 and the second magnet 111 can change in response to the temperature change of the heating device 200. Therefore, when there is magnetism between the first magnet 110 and the second magnet 111, the elastic structure 112 is compressed, so that the fitting portion 108 is flush with the first cover plate 101, and there is a first distance between the fitting portion 108 and the heating device 200. When there is no magnetism between the first magnet 110 and the second magnet 111, the compression amount of the elastic structure 112 decreases, and the elastic structure 112 drives the fitting portion 108 to protrude from the cover plate body 105 and makes the fitting portion 108 contact the heating device 200, improving the controllability of the deformation of the deformable member 106.

[0053] Figure 10 FIG. 6 shows a schematic structural diagram of the heat sink 100 provided in some embodiments of the present application. As Figure 10 shown, in some embodiments of the present application, the driving member 109 includes: an electro-deformable structure 113; the heat sink 100 further includes: a conductive member provided on the second cover plate 102, and the conductive member 114 is connected to the electro-deformable structure 113; wherein, when the temperature of the heating device 200 is higher than the first temperature, a voltage is applied to the electro-deformable structure 113 through the conductive member 114, so that the electro-deformable structure 113 drives the fitting portion 108 to move towards the heating device 200 and drives the flexible portion 107 to deform.

[0054] In the embodiments of the present application, the driving member 109 provided in the cavity 103 includes an electro-deformable structure 113, and a conductive member 114 is further provided in the heat sink 100. The electro-deformable structure 113 is provided in the cavity 103 and is located at a position corresponding to the fitting portion 108. The conductive member 114 is electrically connected to the electro-deformable structure 113 and is used to provide a voltage to the electro-deformable structure 113.

[0055] Specifically, when the temperature of the heating device 200 is lower than the first temperature, the controller of the electronic device 10 does not energize the electro-deformable structure 113 through the conductive member 114. At this time, the electro-deformable structure 113 is in a compressed state, and the fitting portion 108 is flush with the cover plate body 105, that is, there is a first distance between the first cover plate 101 and the heating device 200.

[0056] When the temperature of the heat-generating device 200 is higher than or equal to the first temperature, the controller of the electronic device 10 energizes the electro-deformable structure 113 through the conductive member 114. The electro-deformable structure 113 changes from a compressed state to a stretched state. At this time, the fitting portion 108 bulges toward the heat-generating device 200, that is, the fitting portion 108 can bulge toward the heat-generating device 200, so that the fitting portion 108 abuts against the heat-generating device 200.

[0057] Exemplarily, the conductive member 114 may be a bonding point.

[0058] In the embodiment of the present application, by providing the electro-deformable structure 113 in the cavity 103 and providing the conductive member 114 for applying a voltage to the electro-deformable structure 113 in the heat sink 100, and the electro-deformable structure 113 can deform according to the applied voltage parameters. Therefore, based on the numerical relationship between the temperature of the heat-generating member and the first temperature, it is controlled whether to apply a voltage to the electro-deformable structure 113 through the conductive member 114. When no voltage is applied to the electro-deformable structure 113, the electro-deformable structure 113 is in a compressed state. When a voltage is applied to the electro-deformable structure 113, the electro-deformable structure is in a stretched state, further improving the controllability of the deformation of the deformable member 106.

[0059] Figure 11 FIG. 7 shows a schematic structural diagram of the heat sink 100 provided in some embodiments of the present application. As Figure 11 shown, in some embodiments of the present application, the driving member 109 includes: a shape memory alloy structure; the heat sink 100 further includes: a temperature sensing member 116 disposed on the cover body 105, and the temperature sensing member 116 is connected to the shape memory alloy structure; wherein, when the temperature of the heat-generating device 200 is higher than the first temperature, the shape memory alloy structure deforms to drive the fitting portion 108 to move toward the heat-generating device 200 and drive the flexible portion 107 to deform.

[0060] In the embodiment of the present application, the driving member 109 provided in the cavity 103 includes a shape memory alloy structure 115, and a temperature sensing member 116 is further provided in the heat sink 100. The shape memory alloy structure 115 is provided in the cavity 103, and the shape memory alloy structure 115 is located at a position corresponding to the fitting portion 108. The temperature sensing member 116 is provided on the cover body 105 of the first cover 101, and the setting position of the temperature sensing member 116 corresponds to the setting position of the shape memory alloy structure 115. Since the first cover 101 faces the heat-generating device 200 of the electronic device 10 and the temperature sensing member 116 is connected to the shape memory alloy structure 115, the temperature sensing member 116 can conduct the temperature of the heat-generating device 200 to the shape memory alloy structure 115, so that the shape memory alloy structure 115 can deform in response to the change in temperature.

[0061] Specifically, when the temperature of the heating device 200 is lower than the first temperature, that is, the temperature at the shape memory alloy structure 115 is relatively low, the shape memory alloy structure 115 is in a compressed state. At this time, the fitting portion 108 remains flush with the cover plate main body 105, that is, there is a first distance between the fitting portion 108 and the heating device 200.

[0062] When the temperature of the heating device 200 is higher than or equal to the first temperature, that is, the temperature at the shape memory alloy structure 115 is relatively high, the shape memory alloy structure 115 changes from a compressed state to a stretched state. At this time, the fitting portion 108 bulges toward the heating device 200, so that the fitting portion 108 is in contact with the heating device 200.

[0063] In the embodiment of the present application, by arranging the shape memory alloy structure 115 in the cavity 103, and arranging the temperature sensing element 116 on the cover plate main body 105 of the first cover plate, and the shape memory alloy structure 115 can deform according to the temperature change conducted by the temperature sensing element 116. When the temperature of the heating device 200 is lower than the first temperature, that is, the temperature at the shape memory alloy structure 115 is relatively low, the shape memory alloy structure 115 is in a compressed state. When the temperature of the heating device 200 is higher than or equal to the first temperature, the shape memory alloy structure 115 drives the fitting portion 108 to bulge toward the heating device 200, so that the fitting portion 108 is in contact with the heating device 200, further improving the controllability of the deformation of the deformable member 106.

[0064] As Figure 1 and Figure 4 shown, in some embodiments of the present application, a heat conduction layer 300 is provided on the heating device 200, and the heat conduction layer 300 is disposed opposite to the fitting portion 108.

[0065] In the embodiment of the present application, when the temperature of the heating device 200 is lower than the first temperature, the deformable member 106 is flush with the cover plate main body 105. At this time, there is a first distance between the first cover plate 101 and the heat conduction layer 300 in the heating device 200, so that there is an assembly gap between the first cover plate 101 and the heat conduction layer 300. When the temperature of the heating device 200 is higher than or equal to the first temperature, the deformable member 106 bulges toward the heating device 200, causing extrusion between the heat sink 100 and the heat conduction layer 300, ensuring that the heat sink 100 can be closely attached to the heat conduction layer 300 and the heating device 200, improving the heat conduction effect between the heat sink 100, the heat conduction layer 300 and the heating device 200, and further enhancing the heat dissipation capacity of the electronic device 10.

[0066] Exemplarily, the heat conduction layer 300 can be at least one of a heat conduction gel, a heat conduction resin, and a metal foil, and the heat generated by the heating device 200 can be transferred to the heat sink 100 through the heat conduction layer 300.

[0067] As Figure 4 shown, in some embodiments of the present application, the cavity 103 is filled with a heat-conducting medium 117, and the heat pipe 100 further includes:

[0068] A wick 118 is disposed in the cavity 103, and the capillary structure 104 is located within the wick 118.

[0069] In the embodiments of the present application, the heat pipe 100 further includes a wick 118 disposed in the cavity 103. The cavity 103 is filled with a heat-conducting medium 117. Since the capillary structure 104 is provided in the wick 118, the wick 118 can effectively conduct the heat-conducting medium 117, thereby improving the heat dissipation efficiency of the heat pipe 100.

[0070] Specifically, the wick 118 is disposed on the bottom wall of the cavity 103. The bottom wall of the cavity 103 is the opposite wall surface of the first cover plate 101 facing the heat-generating device 200 of the electronic device 10, shortening the distance between the wick 118 and the heat-generating device 200 of the electronic device 10, and further improving the heat dissipation performance of the heat pipe 100.

[0071] As Figure 1 and Figure 4 shown, in some embodiments of the present application, the electronic device 10 further includes: a circuit board 400, the heat-generating device 200 is disposed on the circuit board 400, and the first cover plate 101 of the heat pipe 100 faces the circuit board 400.

[0072] In the embodiments of the present application, the circuit board 400 is used to dispose the heat-generating device 200. The heat-generating device 200 is usually a power device within the electronic device 10. The first cover plate 101 of the heat pipe 100 faces the heat-generating device 200, and the heat-generating device 200 is correspondingly disposed with the deformation member 106 on the first cover plate 101, ensuring that when the temperature of the heat-generating device 200 changes, the deformation member 106 deforms accordingly to change the gap between the first cover plate 101 and the heat-generating device 200, further improving the controllability of the distance between the heat-generating device 200 and the first cover plate 101.

[0073] As Figure 1 shown, in some embodiments of the present application, the electronic device 10 further includes: a middle frame 500, the circuit board 400 is disposed on the middle frame 500; a rear cover 600, which is connected to the middle frame 500, and the heat pipe 100 is located between the rear cover 600 and the circuit board 400.

[0074] In the embodiments of the present application, the electronic device 10 further includes a middle frame 500 and a rear cover 600. Among them, the middle frame 500 is used to mount the rear cover 600 and the circuit board 400. The heat pipe 100 is located between the rear cover 600 and the circuit board 400, enabling the heat pipe 100 to dissipate heat from the circuit board 400.

[0075] Exemplarily, a battery is disposed between the rear cover 600 and the circuit board 400.

[0076] In the embodiments of the present application, the electronic device 10 may be a portable electronic device such as a mobile phone or a tablet computer.

[0077] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0078] Although the embodiments of the present application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that, It includes a heat pipe and a heating device. The heat pipe includes a first cover plate and a second cover plate. The first cover plate and the second cover plate enclose to form a cavity. A capillary structure is arranged in the cavity. The heating device is arranged on the side where the first cover plate is located. The first cover plate includes a cover plate main body and a deformation member; Wherein, when the temperature of the heating device is lower than a first temperature, there is a first distance between the first cover plate and the heating device; When the temperature of the heating device is higher than or equal to the first temperature, the deformation member deforms so that the deformation member abuts against the heating device.

2. The electronic device according to claim 1, wherein The deformation member includes: A flexible part connected to the cover plate main body; A fitting part connected to the flexible part. The flexible parts are distributed circumferentially along the fitting part. Wherein, when the temperature of the heating device is higher than the first temperature, the flexible parts deform so that the fitting part abuts against the heating device.

3. The electronic device according to claim 2, wherein The heat pipe further includes: A driving member located in the cavity. One side of the driving member abuts against the fitting part, and the other side of the driving member abuts against the second cover plate. Wherein, when the temperature of the heating device is higher than the first temperature, the driving member drives the fitting part to move towards the heating device and drives the flexible parts to deform.

4. The electronic device according to claim 3, characterized in that, The fitting part includes a first magnet, the driving member includes an elastic structure, and the heat pipe further includes: A second magnet embedded in the second cover plate. The second magnet is arranged opposite to the first magnet. The magnetic poles of the opposite ends of the first magnet and the second magnet are opposite. The elastic structure is located between the first magnet and the second magnet; Wherein, when the temperature of the heating device is lower than the first temperature, the first magnet and the second magnet have a first magnetic attraction force to compress the elastic structure; When the temperature of the heating device is higher than or equal to the first temperature, the first magnet and the second magnet have a second magnetic attraction force to make the elastic structure drive the fitting part to move towards the heating device and drive the flexible parts to deform. The second magnetic attraction force is less than the first magnetic attraction force.

5. The electronic device according to claim 3, wherein The driving member includes: an electro-deformation structure; the heat pipe further includes: A conductive member arranged on the second cover plate. The conductive member is connected to the electro-deformation structure; Wherein, when the temperature of the heating device is higher than the first temperature, a voltage is applied to the electro-deformation structure through the conductive member to make the electro-deformation structure drive the fitting part to move towards the heating device and drive the flexible parts to deform.

6. The electronic device according to claim 3, wherein The driving member includes: a shape memory alloy structure; the heat pipe further includes: A temperature sensing member arranged on the cover plate main body. The temperature sensing member is connected to the shape memory alloy structure; Wherein, when the temperature of the heating device is higher than the first temperature, the shape memory alloy structure deforms to drive the fitting part to move towards the heating device and drive the flexible parts to deform.

7. The electronic device according to any one of claims 2 to 6, characterized in that, A heat conducting layer is arranged on the heating device. The heat conducting layer is arranged opposite to the fitting part.

8. The electronic device according to any one of claims 1 to 6, characterized in that, The cavity is filled with a heat conducting medium. The heat pipe further includes: The liquid absorption core is disposed in the cavity, and the capillary structure is located in the liquid absorption core.

9. The electronic device according to any one of claims 1 to 6, characterized in that, The electronic device further includes: A circuit board, the heating device is disposed on the circuit board, and the first cover plate of the heat sink is arranged facing the circuit board.

10. The electronic device according to claim 9, characterized in that, The electronic device further includes: A middle frame, the circuit board is disposed in the middle frame; A rear cover, connected to the middle frame, and the heat sink is located between the rear cover and the circuit board.

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