Manufacturing method of two-step type step-shaped golden finger plate

Abstract

The invention relates to a manufacturing method of a second-order stepped golden finger plate. The method comprises a preposition step of providing a first stack structure and a second stack structure; a first groove forming step in which a first groove is formed in the first stack structure, and the first stack structure defines a sacrifice portion located on one side of the first groove and a press-fit portion located on the other side of the first groove; a lamination step: laminating a lamination layer between the first stack structure and the second stack structure; a second groove forming step: forming a second groove communicated with the first groove; a windowing step: removing the sacrificial part so as to enable the press-fit part, the press-fit layer and the second stack structure to jointly form a step-shaped structure; and a beveling step: beveling the second stack structure to form a second-order stepped golden finger plate. According to the manufacturing method of the second-order stepped golden finger plate, the problem that an existing manufacturing method of the golden finger plate cannot meet the plate thickness requirement can be solved.

Description

Technical Field

[0001] The present invention relates to a manufacturing method of a gold finger board, in particular to a manufacturing method of a second-order stepped gold finger board. Background Art

[0002] With the development of technology, the requirement for the overall board thickness of the gold finger board increases to improve the signal transmission effect, but it is not necessary to increase the thickness of the plug-in end of the gold finger board. The existing manufacturing methods of gold finger boards cannot meet the foregoing board thickness requirements, so it is necessary to improve the existing manufacturing methods of gold finger boards. Summary of the Invention

[0003] The present invention discloses a manufacturing method of a second-order stepped gold finger board, mainly used to solve the problem that the existing manufacturing methods of gold finger boards cannot meet the board thickness requirements.

[0004] One embodiment of the present invention discloses a manufacturing method of a second-order stepped gold finger board, which includes: a pre-step of providing a first stack structure and a second stack structure; wherein, the first stack structure has a first top surface and a first bottom surface, and the second stack structure has a second top surface and a second bottom surface; a first groove forming step of forming a first groove on the first bottom surface of the first stack structure, and the first stack structure defines a sacrificial part on one side of the first groove and a lamination part on the other side of the first groove; a first gold plating step of plating a first gold finger layer on the second top surface of the second stack structure; a lamination step of laminating a lamination layer between the first stack structure and the second stack structure; a second groove forming step of forming a second groove communicating with the first groove on the first top surface of the first stack structure; a windowing step of removing the sacrificial part of the first stack structure and the lamination layer located at the sacrificial part, so that the lamination part of the first stack structure, the lamination layer and the second stack structure jointly form a stepped structure; a beveling step of performing a beveling operation on the second stack structure to remove a part of the second stack structure and form two beveled surfaces respectively connected to the second top surface and the second bottom surface, thereby forming a second-order stepped gold finger board.

[0005] Preferably, after the first groove forming step, the manufacturing method of the second-order stepped gold finger board further includes a first ink printing step of forming a first ink layer on the bottom surface of the sacrificial part of the first stack structure.

[0006] Preferably, after the first gold plating step, the manufacturing method of the second-order stepped gold finger board further includes a second ink printing step of forming a second ink layer covering the first gold finger layer.

[0007] Preferably, in the windowing step, the sacrificial part of the first stack structure, the first ink layer, the second ink layer, and the part of the lamination layer located between the sacrificial part and the second stack structure are removed.

[0008] Preferably, the lamination layer is a polypropylene glue layer.

[0009] Preferably, after the windowing step, the first gold finger layer is exposed from the first stack structure.

[0010] Preferably, the first thickness of the first stack structure is between 0.05 mm and 5.2 mm.

[0011] Preferably, the second thickness of the second stack structure is between 0.8 mm and 3.2 mm.

[0012] Preferably, the sum of the first thickness of the first stack structure and the second thickness of the second stack structure is less than 6 mm.

[0013] Preferably, after the lamination step, the manufacturing method of the two-stage stepped gold finger board further includes a second gold plating step of plating a second gold finger layer on the second bottom surface of the second stack structure.

[0014] In summary, one of the beneficial effects of the present invention is that the manufacturing method of the two-stage stepped gold finger board provided by the present invention can pass through the "first groove forming step of forming a first groove on the first bottom surface of the first stack structure, and the first stack structure defines a sacrificial part on one side of the first groove and a lamination part on the other side of the first groove", "second groove forming step of forming a second groove communicating with the first groove on the first top surface of the first stack structure", and "windowing step of removing the sacrificial part of the first stack structure and the lamination layer located at the sacrificial part, so that the lamination part of the first stack structure, the lamination layer, and the second stack structure jointly form a stepped structure" technical solution to improve the problem that the existing manufacturing method of the gold finger board cannot meet the board thickness requirement.

[0015] In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, these descriptions and drawings are only used to illustrate the present invention and do not impose any limitation on the protection scope of the present invention. Description of the Drawings

[0016] Figure 1 It is a flowchart of the manufacturing method of the two-stage stepped gold finger board according to an embodiment of the present invention.

[0017] Figure 2Schematic diagram of the preliminary steps of the manufacturing method of the two - stage stepped gold finger board according to the embodiments of the present invention.

[0018] Figure 3 Schematic diagram of the first groove - forming step of the manufacturing method of the two - stage stepped gold finger board according to the embodiments of the present invention.

[0019] Figure 4 Schematic diagram of the first ink - printing step of the manufacturing method of the two - stage stepped gold finger board according to the embodiments of the present invention.

[0020] Figure 5 Schematic diagram of the first gold - plating step of the manufacturing method of the two - stage stepped gold finger board according to the embodiments of the present invention.

[0021] Figure 6 Schematic diagram of the second ink - printing step of the manufacturing method of the two - stage stepped gold finger board according to the embodiments of the present invention.

[0022] Figure 7 Schematic diagram of the lamination step of the manufacturing method of the two - stage stepped gold finger board according to the embodiments of the present invention.

[0023] Figure 8 Schematic diagram of the second gold - plating step of the manufacturing method of the two - stage stepped gold finger board according to the embodiments of the present invention.

[0024] Figure 9 Schematic diagram of the second groove - forming step of the manufacturing method of the two - stage stepped gold finger board according to the embodiments of the present invention.

[0025] Figure 10 Schematic diagram of the window - opening step of the manufacturing method of the two - stage stepped gold finger board according to the embodiments of the present invention.

[0026] Figure 11 Schematic diagram of the bevel - cutting step of the manufacturing method of the two - stage stepped gold finger board according to the embodiments of the present invention. Detailed implementation manners

[0027] The following are specific embodiments to illustrate the implementation manners of the present invention regarding the "manufacturing method of the two - stage stepped gold finger board". Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. Additionally, the drawings of the present invention are only simple schematic illustrations and are not drawn according to actual dimensions, hereby declared in advance. The following implementation manners will further elaborate on the relevant technical content of the present invention, but the disclosed content is not intended to limit the protection scope of the present invention.

[0028] It should be understood that although terms such as "first", "second", "third", etc. may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are mainly used to distinguish one component from another or one signal from another. Additionally, the term "or" used herein may, depending on the actual situation, include any combination of one or more of the associated listed items.

[0029] Manufacturing method of a two - stage stepped gold finger board

[0030] Please refer to Figure 1 as shown in Figure 1 FIG. is a flowchart of the manufacturing method of the two - stage stepped gold finger board according to an embodiment of the present invention. An embodiment of the present invention provides a manufacturing method of a two - stage stepped gold finger board. The manufacturing method of the two - stage stepped gold finger board includes a pre - processing step S110, a first groove forming step S120, a first gold plating step S130, a lamination step S140, a second groove forming step S150, a window opening step S160, and a chamfering step S170. Of course, the manufacturing method of the two - stage stepped gold finger board may include other steps according to requirements, and the present invention does not limit this here.

[0031] Please refer to Figure 2 as shown in Figure 2 FIG. is a schematic diagram of the pre - processing step of the manufacturing method of the two - stage stepped gold finger board according to an embodiment of the present invention. In the pre - processing step S110, a first stack structure 1 and a second stack structure 2 are provided. The first stack structure 1 has a first top surface 1a and a first bottom surface 1b, and the second stack structure 2 has a second top surface 2a and a second bottom surface 2b. The first stack structure 1 includes a plurality of first insulating layers 11 and a plurality of first circuit layers 12 formed on the plurality of first insulating layers 11, and the second stack structure 2 includes a plurality of second insulating layers 21 and a plurality of second circuit layers 22 formed on the plurality of second insulating layers 21.

[0032] Preferably, the first thickness T1 of the first stack structure 1 is between 0.05 mm and 5.2 mm, the second thickness T2 of the second stack structure 2 is between 0.8 mm and 3.2 mm, and the sum of the first thickness T1 of the first stack structure 1 and the second thickness T2 of the second stack structure 2 is less than 6 mm.

[0033] Please refer to Figure 3 as shown in Figure 3Schematic diagram of the first groove forming step of the manufacturing method of the two - stage stepped gold finger board according to the embodiment of the present invention. In the first groove forming step S120, a first groove 13 is formed on the first bottom surface 1b of the first stack structure 1, and the first stack structure 1 defines a sacrificial portion 14 (such as Figure 3 the part of the first stack structure 1 located on the right side of the first groove 13 as described in Figure 3 ), and a lamination portion 15 (such as Figure 3 the part of the first stack structure 1 located on the left side of the first groove 13 as described in

[0034] ). In other words, the sacrificial portion 14 and the lamination portion 15 of the first stack structure 1 are respectively formed on the right side and the left side of the first groove 13 as described in Figure 3 .

[0034] In the first groove forming step S120, the first groove 13 can be formed by, for example, a laser method, but the present invention is not limited thereto. In addition, the depth of the first groove 13 can be, for example, between 0.034 mm and 3.47 mm, or the depth of the first groove 13 can be slightly greater than two - thirds of the first thickness T1 of the first stack structure 1, but the present invention is not limited thereto. In addition, the first groove 13 does not penetrate through to the first top surface 1a of the first stack structure 1.

[0035] Please refer to Figure 4 as shown, Figure 4 Schematic diagram of the first ink printing step of the manufacturing method of the two - stage stepped gold finger board according to the embodiment of the present invention. After the first groove forming step S120 in one of the embodiments, the manufacturing method of the two - stage stepped gold finger board can further include a first ink printing step S121, and a first ink layer 3 is formed on the bottom surface of the sacrificial portion 14 of the first stack structure 1.

[0036] Please refer to Figure 5 as shown, Figure 5 Schematic diagram of the first gold plating step of the manufacturing method of the two - stage stepped gold finger board according to the embodiment of the present invention. In the first gold plating step S130, a first gold finger layer 4 is plated on the second top surface 2a of the second stack structure 2. The position of the first gold finger layer 4 on the second stack structure 2 can correspond to the sacrificial portion 14 of the first stack structure 1.

[0037] Please refer to Figure 6 as shown, Figure 6It is a schematic diagram of the second ink printing step in the manufacturing method of the two-stage stepped gold finger board according to an embodiment of the present invention. After the first gold plating step S130 in one of the embodiments, the manufacturing method of the two-stage stepped gold finger board may further include a second ink printing step S131 to form a second ink layer 5 covering the first gold finger layer 4. However, it is worth mentioning that the two-stage stepped gold finger board is not limited to necessarily including the first ink printing step S121 or the second ink printing step S131.

[0038] Please refer to Figure 7 as shown in Figure 7 It is a schematic diagram of the lamination step in the manufacturing method of the two-stage stepped gold finger board according to an embodiment of the present invention. In the lamination step S140, a lamination layer 6 is laminated between the first stack structure 1 and the second stack structure 2. In one of the embodiments, the lamination layer 6 may be a polypropylene glue layer.

[0039] Please refer to Figure 8 as shown in Figure 8 It is a schematic diagram of the second gold plating step in the manufacturing method of the two-stage stepped gold finger board according to an embodiment of the present invention. In addition, after the lamination step S140, the manufacturing method of the two-stage stepped gold finger board may further include a second gold plating step S141 to deposit a second gold finger layer 7 on the second bottom surface 2b of the second stack structure 2.

[0040] Please refer to Figure 9 as shown in Figure 9 It is a schematic diagram of the second groove forming step in the manufacturing method of the two-stage stepped gold finger board according to an embodiment of the present invention. In the second groove forming step S150, a second groove 16 communicating with the first groove 13 is formed on the first top surface 1a of the first stack structure 1. Through the first groove 13 formed in the first groove forming step S120, the second groove forming step S150 can be more easily performed.

[0041] Specifically, since the first groove 13 is formed on the first bottom surface 1b of the first stack structure 1, the second groove 16 can be formed more accurately, and the depth of the second groove 16 can be smaller. In addition, in the second groove forming step S150, the second groove may be formed by, for example, mechanical drilling, but the present invention is not limited thereto.

[0042] Please refer to Figure 10 as shown in Figure 10Schematic diagram of the windowing step of the manufacturing method of the second-order stepped gold finger board according to the embodiment of the present invention. In the windowing step S160, the sacrificial part 14 of the first stack structure 1 and the lamination layer 6 located on the sacrificial part 14 are removed, so that the lamination part 15 of the first stack structure 1, the lamination layer 6 and the second stack structure 2 together form a stepped structure S. Through the design of the stepped structure S, the overall thickness (such as the sum of the first thickness T1 and the second thickness T2) can be increased without the need to thicken the second thickness T2 of the second stack structure 2, so that the final product can have better signal transmission.

[0043] In addition, after the windowing step S160, the first gold finger layer 4 is exposed from the first stack structure 1 (that is, not covered by the first stack structure 1). Specifically, in the windowing step S160, the sacrificial part 14 of the first stack structure 1 and the lamination layer 6 located on the sacrificial part 14 can be removed along the second groove 16.

[0044] In addition, in one embodiment, the second-order stepped gold finger board 100 includes the first ink printing step S121 and the second ink printing step S131, and in the windowing step S160, the sacrificial part 14 of the first stack structure 1, the first ink layer 3, the second ink layer 5, and the part of the lamination layer 6 located between the sacrificial part 14 and the second stack structure 2 can be removed.

[0045] More specifically, in the windowing step S160, the sacrificial part 14 of the first stack structure 1 and the part of the lamination layer 6 located between the sacrificial part 14 and the second stack structure 2 can be removed first, and then the first ink layer 3 and the second ink layer 5 are removed by a chemical solution. Through the first ink layer 3 and the second ink layer 5, the sacrificial part 14 of the first stack structure 1 can be removed more easily, thus bringing convenience in the manufacturing process.

[0046] Please refer to Figure 11 as shown Figure 11Schematic diagram of the beveling step in the manufacturing method of the two - stage stepped gold finger board according to the embodiment of the present invention. In the beveling step S170, a beveling operation is performed on the second stack structure 2 to remove a part of the second stack structure 2 and form two beveled surfaces 2c respectively connected to the second top surface 2a and the second bottom surface 2b, thereby forming a two - stage stepped gold finger board 100. More specifically, in the beveling step S170, it may be to remove the angular parts at the intersection of the second top surface 2a and the side edge and the angular parts at the intersection of the second bottom surface 2b and the side edge in the second stack structure 2 to form the two beveled surfaces 2c.

[0047] Two - stage stepped gold finger board

[0048] Please refer to Figure 11 as shown in Figure 11 which is also a schematic diagram of the two - stage stepped gold finger board according to the embodiment of the present invention. The embodiment of the present invention also provides a two - stage stepped gold finger board 100. The two - stage stepped gold finger board 100 can be obtained by performing the aforementioned manufacturing method of the two - stage stepped gold finger board, but the present invention is not limited thereto. In addition, the two - stage stepped gold finger board 100 can be, for example, a two - stage five - press stepped gold finger board.

[0049] The two - stage stepped gold finger board 100 includes a first stack structure 1, a second stack structure 2, a lamination layer 6, and a first gold finger layer 4. Of course, the two - stage stepped gold finger board 100 can include other components according to requirements, and the present invention does not limit this here.

[0050] The first stack structure 1 has a first top surface 1a and a first bottom surface 1b. The second stack structure 2 has a second top surface 2a and a second bottom surface 2b, and the second stack structure 2 has two beveled surfaces 2c respectively connected to the second top surface 2a and the second bottom surface 2b. More specifically, one of the beveled surfaces 2c is connected to the second top surface 2a and the side edge of the second stack structure 2, and the other beveled surface 2c is connected to the second bottom surface 2b and the side edge of the second stack structure 2. Accordingly, an insertion and extraction end 23 adjacent to the first gold finger layer 4 is formed on the second stack structure 2.

[0051] The lamination layer 6 is disposed between the first stack structure 1 and the second stack structure 2. The lamination layer 6 can be, for example, a polypropylene glue lamination, so that there can be a better bonding force between the first stack structure 1 and the second stack structure 2, but the present invention is not limited thereto.

[0052] The first finger layer 4 is disposed on the second top surface 2a of the second stack structure 2. Specifically, the first finger layer 4 is formed at a position on the second top surface 2a of the second stack structure 2 where the first stack structure 1 is not provided, and the first finger layer 4 is disposed adjacent to one of the inclined surfaces 2c.

[0053] In this embodiment, the first thickness T1 of the first stack structure 1 is between 0.05 mm and 5.2 mm, the second thickness T2 of the second stack structure 2 is between 0.8 mm and 3.2 mm, and the sum of the first thickness T1 of the first stack structure 1 and the second thickness T2 of the second stack structure is less than 6 mm, but the present invention is not limited thereto. In addition, the ratio between the first thickness T1 of the first stack structure 1 and the second thickness T2 of the second stack structure 2 may be between 0.016 and 6.5, but the present invention is not limited thereto.

[0054] The size of the first stack structure 1 in the lateral direction W may be smaller than the size of the second stack structure 2 in the lateral direction W. The lateral direction W is defined as the direction parallel to the connection line between the two ends of the second stack structure 2 (such as one end formed with the inclined surface 2c and the other end not formed with the inclined surface 2c). Accordingly, the first top surface 1a and the side edge of the first stack structure 1, the side edge of the bonding layer 6, and the second top surface 2a of the second stack structure 2 together form a stepped structure S.

[0055] In addition, the two-stage stepped finger board 100 may further include a second finger layer 7, and the second finger layer 7 is located on the second bottom surface 2b of the second stack structure 2 and corresponds to the first finger layer 4 in position.

[0056] Beneficial effects of the embodiment

[0057] In summary, one of the beneficial effects of the present invention is that the manufacturing method of the two-stage stepped finger board provided by the present invention can, through the "first groove forming step, forming a first groove on the first bottom surface of the first stack structure, and the first stack structure defines a sacrificial portion on one side of the first groove and a bonding portion on the other side of the first groove", "second groove forming step, forming a second groove communicating with the first groove on the first top surface of the first stack structure", and "window opening step, removing the sacrificial portion of the first stack structure and the bonding layer located at the sacrificial portion, so that the bonding portion of the first stack structure, the bonding layer, and the second stack structure together form a stepped structure" technical solutions to improve the problem that the existing manufacturing method of the finger board cannot meet the board thickness requirements.

[0058] The above are only the preferred and feasible embodiments of the present invention, and thus do not limit the patent scope of the present invention. Therefore, all equivalent technical changes made by using the content of the specification and drawings of the present invention are included in the protection scope of the present invention.

Claims

1. A manufacturing method of a second-order stepped gold finger board, characterized in that, The manufacturing method of the second-order stepped gold finger board includes: A pre-step of providing a first stack structure and a second stack structure; wherein, the first stack structure has a first top surface and a first bottom surface, and the second stack structure has a second top surface and a second bottom surface; A first groove forming step of forming a first groove on the first bottom surface of the first stack structure, and the first stack structure defines a sacrificial part on one side of the first groove and a pressing part on the other side of the first groove; A first gold plating step of plating a first gold finger layer on the second top surface of the second stack structure; A pressing step of pressing a pressing layer between the first stack structure and the second stack structure; A second groove forming step of forming a second groove communicating with the first groove on the first top surface of the first stack structure; A window opening step of removing the sacrificial part of the first stack structure and the pressing layer located at the sacrificial part, so that the pressing part of the first stack structure, the pressing layer and the second stack structure jointly form a stepped structure; A bevel cutting step of performing a bevel cutting operation on the second stack structure to remove a part of the second stack structure and form two bevel surfaces respectively connected to the second top surface and the second bottom surface, thereby forming a second-order stepped gold finger board.

2. The manufacturing method of the second-order stepped gold finger board according to claim 1, characterized in that After the first groove forming step, the manufacturing method of the second-order stepped gold finger board further includes a first ink printing step of forming a first ink layer on the bottom surface of the sacrificial part of the first stack structure.

3. The manufacturing method of the second-order stepped gold finger board according to claim 2, wherein After the first gold plating step, the manufacturing method of the second-order stepped gold finger board further includes a second ink printing step of forming a second ink layer covering the first gold finger layer.

4. The manufacturing method of the second-order stepped gold finger board according to claim 3, characterized in that, In the window opening step, the sacrificial part of the first stack structure, the first ink layer, the second ink layer, and the part of the pressing layer located between the sacrificial part and the second stack structure are removed.

5. The manufacturing method of the second-order stepped gold finger board according to claim 1, characterized in that, The pressing layer is a polypropylene glue layer.

6. The manufacturing method of the second-order stepped gold finger board according to claim 1, characterized in that, After the window opening step, the first gold finger layer is exposed from the first stack structure.

7. The manufacturing method of the second-order stepped gold finger board according to claim 1, characterized in that, The first thickness of the first stack structure is between 0.05 mm and 5.2 mm.

8. The manufacturing method of the second-order stepped gold finger board according to claim 1, characterized in that, The second thickness of the second stack structure is between 0.8 mm and 3.2 mm.

9. The manufacturing method of the second-order stepped gold finger board according to claim 1, characterized in that, The sum of the first thickness of the first stack structure and the second thickness of the second stack structure is less than 6 mm.

10. The manufacturing method of the second-order stepped gold finger board according to claim 1, wherein, After the pressing step, the manufacturing method of the second-order stepped gold finger board further includes a second gold plating step of plating a second gold finger layer on the second bottom surface of the second stack structure.

Images