Heat dissipation assembly and terminal equipment

Abstract

The invention provides a heat dissipation assembly and terminal equipment, relates to the technical field of electronic equipment, and aims to solve the problem of poor heat dissipation performance of the terminal equipment. The heat dissipation assembly provided by the invention comprises a throttling element, a heat dissipation element and an air source, the throttling element comprises a plurality of through holes, the first end of each through hole penetrates to the first surface of the throttling element, and the second end of each through hole penetrates to the second surface of the throttling element; the heat dissipation piece comprises a heat conduction face and a heat dissipation face which are deviated, the heat conduction face is used for being attached to a to-be-dissipated device in a heat conduction mode, and the heat dissipation face and the second surface are oppositely arranged; the air source is used for generating airflow flowing through the through holes, the airflow flows to the second end from the first end of each through hole, and the diameter of each through hole is smaller than or equal to 1 mm. In the heat dissipation assembly, the heat conduction face of the heat dissipation piece can be attached to the device to be subjected to heat dissipation in a heat conduction mode, the airflow generated by the air source is blown to the heat dissipation face after passing through the through hole of the throttling piece, and therefore heat of the heat dissipation piece is taken away, and cooling of the device to be subjected to heat dissipation is conveniently achieved.

Description

Technical Field

[0001] This application relates to the technical field of electronic devices, and particularly to a heat dissipation component and a terminal device. Background Art

[0002] With the continuous improvement of the performance of terminal devices, the operating power consumption and heat generation of terminal devices have also increased significantly. Therefore, in order to ensure the working performance and safety of terminal devices, heat dissipation of terminal devices is required. In current terminal devices, passive heat dissipation methods are usually adopted. Taking a mobile phone as an example, the chip in the mobile phone is one of the main devices that generate a large amount of heat. Usually, materials such as graphene with a high thermal conductivity are used to conduct the heat of the chip to the outer shell of the mobile phone, and then dissipate it to the outside through the outer shell, so as to achieve heat dissipation of the chip. In practical applications, in order to meet the requirements of good portability, the volume of terminal devices is relatively small, resulting in a small heat dissipation area, which can no longer meet the increasing heat dissipation requirements. Therefore, how to improve the heat dissipation performance of terminal devices has become an urgent technical problem to be solved. Summary of the Invention

[0003] This application provides a heat dissipation component and a terminal device with good heat dissipation performance.

[0004] In a first aspect, this application provides a heat dissipation component, including a throttling member, a heat dissipation member, and a gas source. The throttling member includes a plurality of through holes, and the first end of each through hole penetrates to the first surface of the throttling member, and the second end of each through hole penetrates to the second surface of the throttling member. The heat dissipation member includes a heat conducting surface and a heat dissipating surface that face away from each other. The heat conducting surface is used for thermally contacting with the device to be heat dissipated, and the heat dissipating surface is disposed opposite to the second surface. The gas source is used to generate an air flow flowing through the plurality of through holes. The air flow flows from the first end of each through hole to the second end, and the diameter of each through hole is less than or equal to 1 mm. In the heat dissipation component provided in this application, the heat conducting surface of the heat dissipation member can be thermally contacted with the device to be heat dissipated, so that the heat of the device to be heat dissipated can be conducted to the heat dissipation member through heat transfer. The air flow generated by the gas source blows to the heat dissipating surface after passing through the through holes of the throttling member, thereby taking away the heat of the heat dissipation member, so as to realize the cooling of the device to be heat dissipated. Among them, the diameter of each through hole in the throttling member is less than or equal to 1 mm, so that the air flow has a large flow velocity after flowing through the through hole, thereby generating a jet effect, so as to blow to the heat dissipating surface at a faster speed and quickly take away the heat of the heat dissipation member.

[0005] In an example, the heat dissipating surface has a plurality of heat dissipating teeth extending perpendicular to the heat dissipating surface. By providing the heat dissipating teeth, the heat exchange area between the heat dissipation member and the air flow can be effectively increased, which is beneficial to making the air flow take away the heat of the heat dissipation member more quickly, so as to improve the heat dissipation performance of the heat dissipation component.

[0006] In one example, the included angle between each through hole and the heat dissipation surface is greater than or equal to 80° and less than or equal to 90°, so as to effectively take away the heat of the heat dissipation component.

[0007] In one example, from the first end to the second end of the through hole, the cross-section of the through hole is the same. Through the structural setting of the straight through hole, when the air flow passes through the through hole, it has a lower flow resistance, which is beneficial to ensuring the flow velocity of the air flow.

[0008] In one example, the cross-sectional area of the first end of the through hole is larger than that of the second end. When the air flow passes through the through hole, since the cross-sectional area of the second end is smaller than that of the first end, therefore, the air flow will have a better flow velocity when discharging from the second end, which helps to improve the heat dissipation efficiency of the heat dissipation component.

[0009] In one example, the heat dissipation component further includes a first housing. The first housing covers one side of the first surface of the throttling member, and the first housing has an air inlet, and the air inlet is communicated with the first end of each through hole. By providing the first housing, an effective accommodation space can be provided for the air source. In practical applications, it can prevent external foreign objects from touching the air source, thereby ensuring the safety of the air source.

[0010] In one example, the heat dissipation component further includes a second housing. The second housing is connected between the throttling member and the heat dissipation member, and the second housing has an exhaust port, and the exhaust port is communicated with the second end of each through hole. By providing the second housing, it can play a role in fixedly connecting the throttling member and the heat dissipation member, thereby improving the integrity of the heat dissipation component, so that the entire heat dissipation component can be better applied to the terminal device.

[0011] In one example, the heat dissipation surface has a plurality of heat dissipation teeth extending perpendicular to the heat dissipation surface, and the heat dissipation teeth extend toward the exhaust port. When the air flow blows toward the heat dissipation surface in a substantially perpendicular direction, the air flow can be deflected by the heat dissipation teeth, so that the air flow can be discharged from the exhaust port more smoothly.

[0012] In one example, the heat conduction surface is used to be attached to the device to be cooled. Alternatively, the heat dissipation component further includes a heat conduction member, and the heat conduction member is used to be connected between the heat conduction surface and the device to be cooled. Generally speaking, the heat conduction surface can be directly attached to the device to be cooled, or the heat conduction surface can also be attached to the device to be cooled through the heat conduction member.

[0013] In a second aspect, a terminal device includes a device to be cooled and the above-mentioned heat dissipation component, and the heat conduction surface is thermally attached to the device to be cooled. When specifically set, the heat conduction surface and the device to be cooled can be directly attached, or can be attached through other structures such as a heat conduction member. In the terminal device provided in the present application, by configuring the heat dissipation component, the heat dissipation performance of the terminal device can be effectively enhanced. In addition, the position and quantity of the heat dissipation component can be reasonably configured according to actual needs, which has good flexibility and adaptability.

[0014] In one example, the terminal device includes a display screen, a middle frame, and a back plate. The display screen and the back plate are oppositely arranged, and the middle frame is connected between the display screen and the back plate. The heat dissipation component is located on the side of the back plate facing away from the display screen, and the heat conducting surface is attached to the back plate. Generally speaking, the heat dissipation component can be located outside the terminal device to enhance the heat dissipation of the terminal device.

[0015] In one example, the heat dissipation component is located on the side of the back plate facing the display screen. The back plate has an air inlet, and the middle frame has an air outlet. The air inlet is communicated with the first end of each through hole, and the air outlet is communicated with the second end of each through hole. Generally speaking, the heat dissipation component can be located inside the terminal device to enhance the heat dissipation of the terminal device.

[0016] In one example, the terminal device further includes a protrusion and a lens module. The protrusion can be located on the side of the back plate facing away from the display screen. The lens module is located between the middle frame and the back plate, and the lens module extends to the outer surface of the protrusion. The heat dissipation component is located inside the protrusion, and the side wall of the protrusion has an air inlet and an air outlet. The air inlet is communicated with the first end of each through hole, and the air outlet is communicated with the second end of each through hole. In practical applications, the heat dissipation component can be effectively combined with the lens module in the terminal device, so as to realize the reuse of the protrusion structure. Description of the Drawings

[0017] Figure 1 Schematic diagram of the three-dimensional structure of a conventional mobile phone provided by an embodiment of the present application;

[0018] Figure 2 Schematic diagram of the three-dimensional structure of a heat dissipation component provided by an embodiment of the present application;

[0019] Figure 3 is Figure 2 Schematic diagram of the sectional structure in the A-A direction in

[0020] Figure 4 Schematic diagram of the partial sectional structure of a throttle provided by an embodiment of the present application;

[0021] Figure 5 Schematic diagram of the partial sectional structure of another throttle provided by an embodiment of the present application;

[0022] Figure 6 Schematic diagram of the partial sectional structure of another throttle provided by an embodiment of the present application;

[0023] Figure 7 Schematic diagram of the partial sectional structure of another throttle provided by an embodiment of the present application;

[0024] Figure 8Schematic diagram of the partial cross-sectional structure of another throttling member provided by an embodiment of the present application;

[0025] Figure 9 Schematic diagram of the planar structure of a throttling member provided by an embodiment of the present application;

[0026] Figure 10 Schematic diagram of the planar structure of another throttling member provided by an embodiment of the present application;

[0027] Figure 11 Schematic diagram of the planar structure of another throttling member provided by an embodiment of the present application;

[0028] Figure 12 Schematic diagram of the three-dimensional structure of a heat dissipation member provided by an embodiment of the present application;

[0029] Figure 13 Schematic diagram of the three-dimensional structure of another heat dissipation member provided by an embodiment of the present application;

[0030] Figure 14 Schematic diagram of the three-dimensional structure of another heat dissipation member provided by an embodiment of the present application;

[0031] Figure 15 Schematic diagram of the three-dimensional structure of a terminal device provided by an embodiment of the present application;

[0032] Figure 16 Exploded view structure diagram of a terminal device provided by an embodiment of the present application;

[0033] Figure 17 Exploded view structure diagram of another terminal device provided by an embodiment of the present application;

[0034] Figure 18 Schematic diagram of the partial cross-sectional structure of a terminal device provided by an embodiment of the present application;

[0035] Figure 19 Exploded view structure diagram of another terminal device provided by an embodiment of the present application;

[0036] Figure 20 Schematic diagram of the partial cross-sectional structure of a terminal device provided by an embodiment of the present application. Detailed implementation manners

[0037] In order to make the objectives, technical solutions, and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings.

[0038] To facilitate the understanding of the heat dissipation component provided by the embodiments of the present application, the following first introduces its application scenarios.

[0039] The heat dissipation component provided by the embodiments of the present application can be applied to various types of terminal devices such as mobile phones, tablet computers, and laptop computers to improve the heat dissipation performance of the terminal devices.

[0040] For example, as Figure 1 shown, in a conventional mobile phone 01 provided by the present application, the mobile phone 01 may include a display screen 011, a middle frame 012, and a back plate 013. The display screen 011 and the back plate 013 are oppositely arranged, and the middle frame 012 is connected between the display screen 011 and the back plate 013. Between the display screen 011 and the back plate 013, components such as a circuit board and a chip 014 can be arranged. In actual application, electronic components such as the chip 014 in the mobile phone 01 will generate a large amount of heat. To ensure the working performance of the chip 014, materials with high thermal conductivity such as graphene are usually used in the current mobile phone 01 to conduct the heat of the chip 014 to the back plate 013 or the display screen 011 of the mobile phone 01, and then dissipate it to the outside through the back plate 013 or the display screen 011, so as to achieve heat dissipation of the chip 014. In actual application, to improve the portability of the mobile phone, the volume of the mobile phone is relatively small, resulting in a relatively limited heat dissipation area of the back plate 013 or the display screen 011. Therefore, the heat dissipation efficiency is relatively low. In addition, with the continuous development of technology and the continuous improvement of user requirements, the performance of the mobile phone 01 has also been significantly improved, and the power and heat generation of components such as the chip 014 have also been significantly increased. Therefore, the current heat dissipation structure can no longer meet the growing heat dissipation requirements.

[0041] Therefore, the embodiments of the present application provide a heat dissipation component, and the heat dissipation component can rely on the air-cooling method to improve the heat dissipation performance of the terminal device. Among them, the heat dissipation component and the terminal device can be detachable, or the heat dissipation component can also be integrated in the terminal device.

[0042] In order to make the purpose, technical solutions, and advantages of the present application clearer, the present application will be further described in detail below with reference to the drawings and specific embodiments.

[0043] As Figure 2 and Figure 3 shown, in an example provided by the present application, the heat dissipation component 10 includes a throttling member 11, a heat dissipation member 12, and a gas source 13. Among them, the gas source 13 is a device for generating air flow. In actual application, the gas source 13 can be a fan. Or, the gas source 13 can also be a device such as a diaphragm that pushes air flow through its own vibration. Please refer to Figure 3 and Figure 4 . The throttling member 11 includes a plurality of through holes 111, and the first end 111a of each through hole 111 penetrates through to the first surface of the throttling member 11 (such as Figure 4 the upper surface in), and the second end 111b of each through hole 111 penetrates through to the second surface of the throttling member 11 (such asFigure 4 the lower surface in Figure 4 the lower surface in Figure 4 the upper surface in The heat-conducting surface 121 is used for thermally contacting with the device 02 to be cooled, and the heat-radiating surface 122 is disposed opposite to the second surface. The air source 13 is used to generate an air flow flowing through the plurality of through holes 111, and the air flow flows from the first end 111a of each through hole 111 to the second end 111b. Exemplarily, the diameter of each through hole 111 may be less than or equal to 1 mm. It should be noted that since the through hole 111 penetrates through the throttling member 11, the first end 111a of the through hole 111 penetrating to the first surface of the throttling member 11 may also be understood as the first end 111a of the through hole 111 extending to the first surface of the throttling member 11, that is, the first end 111a is located on the first surface. Correspondingly, the second end 111b of the through hole 111 penetrating to the second surface of the throttling member 11 may also be understood as the second end 111b of the through hole 111 extending to the second surface of the throttling member 11, that is, the second end 111b is located on the second surface.

[0044] In addition, as Figure 2 and Figure 3 shown, in an example provided by the present application, the heat dissipation assembly 10 further includes a first housing 14. The first housing 14 covers one side of the first surface of the throttling member 11. Wherein, the space enclosed by the first housing 14 and the first surface may form a chamber for installing the air source 13. The first housing 14 has an air inlet 141, and the air inlet 141 is communicated with the first end 111a of each through hole 111. It should be noted that the communication between the air inlet 141 and the first end 111a of each through hole 111 may be understood as that the air flow path between the air inlet 141 and the first end 111a of each through hole 111 is communicated, so that the air flow can effectively circulate between the air inlet 141 and the first end 111a of the through hole 111. External air can enter the chamber through the air inlet 141, and under the driving action of the air source 13, the air in the chamber can enter the through hole 111 from the first end 111a of each through hole 111 and be discharged outward from the second end 111b.

[0045] By providing the first housing 14, an effective accommodation space can be provided for the air source 13. In actual application, it can prevent external foreign objects from touching the air source 13, thereby ensuring the safety of the air source 13.

[0046] It should be noted that in the example provided in this application, the air inlet 141 is located on one side of the first housing 14. In other examples, the air inlet 141 may be located on any one or more sides of the first housing 14, or the air inlet 141 may also be provided on the surface of the first housing 14 that faces away from the throttle member 11. In actual applications, parameters such as the position, shape, and quantity of the air inlet 141 can be reasonably set according to the actual situation, which will not be elaborated here.

[0047] In addition, in the example provided in this application, the heat dissipation assembly 10 further includes a second housing 15. The second housing 15 is connected between the throttle member 11 and the heat dissipation member 12. The second housing 15 has an exhaust port 151, and the exhaust port 151 is in communication with the second end 111b of each through hole 111. It should be noted that the exhaust port 151 being in communication with the second end 111b of each through hole 111 can be understood as that the air flow path between the exhaust port 151 and the second end 111b of each through hole 111 is in communication, so that air flow can effectively circulate between the exhaust port 151 and the second end 111b of the through hole 111.

[0048] By providing the second housing 15, the function of fixedly connecting the throttle member 11 and the heat dissipation member 12 can be achieved, thereby enhancing the integrity of the heat dissipation assembly 10, so that the entire heat dissipation assembly 10 can be better applied to terminal devices.

[0049] It can be understood that in the example provided in this application, the exhaust port 151 is provided on one side of the second housing 15. In other examples, the exhaust port 151 may be located on any one or more sides of the second housing 15. In actual applications, parameters such as the position, shape, and quantity of the exhaust port 151 can be reasonably set according to the actual situation, which will not be elaborated here.

[0050] Generally speaking, in the examples provided in this application, the heat-conducting surface 121 of the heat sink 12 can be thermally bonded to the device 02 to be cooled, so that the heat of the device 02 to be cooled can be conducted to the heat sink 12 by heat transfer. The airflow generated by the air source 13 blows towards the heat dissipation surface 122 after passing through the through hole 111 of the throttling member 11, thereby taking away the heat of the heat sink 12 to facilitate the cooling of the device 02 to be cooled. Exemplarily, the diameter of each through hole 111 in the throttling member 11 can be less than or equal to 1 mm, so that after the airflow passes through the through hole 111, it has a relatively large flow velocity, thereby generating a jet effect, so as to blow towards the heat dissipation surface 122 at a relatively fast speed and quickly take away the heat of the heat sink 12. Specifically, under the action of the air source 13, an airflow flowing through the through hole 111 will be generated. The larger the diameter of the through hole 111, the smaller the flow velocity of the airflow. On the contrary, the smaller the diameter of the through hole 111, the larger the flow velocity of the airflow. In the examples provided in this application, by limiting the diameter of the through hole 111 within 1 mm, a relatively large airflow velocity can be obtained and the jet effect can be achieved, so that after the airflow is discharged outward from the second end 111b of the through hole 111, it can flow towards the heat dissipation surface 122 of the heat sink 12 at a relatively large speed, thereby quickly taking away the heat of the heat dissipation surface 122. Or, it can be understood that when the diameter of the through hole 111 is greater than 1 mm, it may be difficult for the airflow to reach the heat dissipation surface 122 after being discharged from the second end 111b of the through hole 111, or the flow velocity of the airflow when it reaches the heat dissipation surface 122 is relatively low and cannot effectively take away the heat of the heat dissipation surface 122. In this application, by limiting the diameter of the through hole 111 within 1 mm, the heat dissipation efficiency of the entire heat dissipation assembly 10 can be effectively guaranteed. When specifically setting, the diameter of the through hole 111 can specifically be 1 mm, 0.9 mm, 0.8 mm or 0.1 mm, etc. In actual applications, the diameter of each through hole 111 can be reasonably set according to actual needs.

[0051] It should be noted that the first surface and the second surface of the throttling member 11 described above respectively represent two opposite surfaces of the throttling member 11. In actual applications, the first surface and the second surface can be flat surfaces or curved surfaces, etc. This application does not limit the specific structural shapes of the first surface and the second surface.

[0052] In addition, the heat-conducting surface 121 of the heat sink 12 described above refers to the surface of the heat sink 12 that is used to contact the device 02 to be cooled. The heat dissipation surface 122 refers to the surface that is used to exchange heat with the airflow. In actual applications, the heat-conducting surface 121 and the heat dissipation surface 122 can be flat surfaces or curved surfaces, etc. This application does not limit the specific structural shapes of the heat-conducting surface 121 and the heat dissipation surface 122.

[0053] When setting the through hole 111 in the throttle member 11, the included angle between the extending direction of the through hole 111 and the heat dissipation surface 122 can be greater than or equal to 80° and less than or equal to 90°. Generally speaking, the extending direction of the through hole 111 and the heat dissipation surface 122 are in a substantially perpendicular positional relationship, so that after the air flow is discharged from the through hole 111, it can blow towards the heat dissipation surface 122 in a substantially perpendicular direction, effectively improving the heat dissipation performance of the heat dissipation assembly 10. When specifically setting, the included angle between the extending direction of the through hole 111 and the heat dissipation surface 122 can specifically be 80°, 85°, 89° or 90°, etc. In other embodiments, the included angle between the extending direction of the through hole 111 and the heat dissipation surface 122 can also be other angles, which will not be elaborated here.

[0054] In addition, when setting the through hole 111 in the throttle member 11, parameters such as the size, shape and positional arrangement of the through hole 111 can be diverse.

[0055] For example, as Figure 4 shown, in an example provided by the present application, the through hole 111 can be a straight through hole 111. That is, from the first end 111a to the second end 111b of the through hole 111, the cross-section of the through hole 111 remains unchanged.

[0056] Or, as Figure 5 shown, in another example provided by the present application, the through hole 111 can be a stepped hole. That is, from the first end 111a to the second end 111b of the through hole 111, the through hole 111 is divided into two sections with different cross-sections. The cross-section near the first end 111a is larger, and the cross-section near the second end 111b is smaller.

[0057] Or, as Figure 6 shown, in another example provided by the present application, the through hole 111 can be a chamfered stepped hole. That is, from the first end 111a to the second end 111b of the through hole 111, the through hole 111 is divided into two sections with different cross-sections. The cross-section near the first end 111a is larger, and the cross-section near the second end 111b is smaller. And, a gradual transition is achieved through a chamfer between the two sections.

[0058] Or, as Figure 7 shown, in another example provided by the present application, the through hole 111 can be a tapered hole. That is, from the first end 111a to the second end 111b of the through hole 111, the cross-section of the through hole 111 linearly decreases.

[0059] Or, as Figure 8 shown, in another example provided by the present application, from the first end 111a to the second end 111b of the through hole 111, the cross-section of the through hole 111 linearly decreases in the form of a gradual change line.

[0060] Generally speaking, in Figures 5 to 8In the example shown, the cross-sectional area of the first end 111a of the through hole 111 is larger than that of the second end 111b. Therefore, when air flows into the through hole 111 from the first end 111a and discharges from the second end 111b, the flow velocity of the air will be significantly increased, thereby improving the heat dissipation performance of the heat dissipation component 10.

[0061] It can be understood that in practical applications, from the first end 111a to the second end 111b of the through hole 111, the cross-sectional change of the through hole 111 can also be other situations, which will not be elaborated here. Additionally, in specific settings, in a direction perpendicular to the extending direction of the through hole 111, the cross-sectional shape of the through hole 111 can be circular, elliptical, polygonal, or other irregular shapes. In practical applications, the cross-sectional shape of the through hole 111 can be reasonably set according to actual needs, which will not be elaborated here.

[0062] In addition, in specific settings, the position layout of the through holes 111 can also be diverse.

[0063] For example, as Figure 9 shown, in an example provided by the present application, multiple through holes 111 can be arranged at equal intervals, and the diameter of each through hole 111 is basically the same.

[0064] Or, as Figure 10 shown, in another example provided by the present application, multiple through holes 111 can be arranged in a crisscross manner, and the diameter of each through hole 111 is basically the same.

[0065] Or, as Figure 11 shown, in another example provided by the present application, multiple through holes 111 can be arranged in a hybrid manner. Among them, among the multiple through holes 111, there are two through holes 111 with different diameters.

[0066] It can be understood that in the Figures 9 to 11 example shown, it is only an exemplary illustration of the arrangement manner of the through holes 111. In other examples, parameters such as the diameter, quantity, and position arrangement of the through holes 111 can be reasonably selected and adjusted according to actual needs, and the present application places no restrictions thereon.

[0067] In addition, when setting the heat dissipation member 12, the structural shape of the heat dissipation member 12 can also be diverse.

[0068] For example, as Figure 3 and Figure 12As shown, in an example provided by the present application, the heat dissipation surface 122 of the heat dissipation member 12 has a plurality of heat dissipation teeth 123 extending perpendicular to the heat dissipation surface 122. By providing the heat dissipation teeth 123, the heat dissipation area of the heat dissipation member 12 can be effectively increased. When the air flow blows towards the heat dissipation surface 122, the heat in the heat dissipation teeth 123 will also be carried away, effectively improving the heat dissipation performance of the heat dissipation assembly 10. It should be noted that the heat dissipation teeth 123 extending perpendicular to the heat dissipation surface 122 means that the included angle between the extending direction of the heat dissipation teeth 123 and the heat dissipation surface 122 is about 90°, so as to reduce or avoid the heat dissipation teeth 123 blocking the air flow blowing towards the heat dissipation surface 122, thereby ensuring the heat dissipation efficiency of the heat dissipation member 12. Additionally, in other examples, the included angle between the extending direction of the heat dissipation teeth 123 and the heat dissipation surface 122 can also be other angles, which will not be elaborated here.

[0069] When specifically setting, the shape of the heat dissipation teeth 123 can be various.

[0070] For example, as Figure 12 shown, in an example provided by the present application, each heat dissipation tooth 123 is a flat plate-like structure, and moreover, a plurality of heat dissipation teeth 123 can be arranged at intervals in a parallel manner, such that a channel for the smooth flow of the air flow can be formed between two adjacent heat dissipation teeth 123.

[0071] Or, as Figure 13 shown, in another example provided by the present application, each heat dissipation tooth 123 is a tree-like structure, and moreover, a plurality of heat dissipation teeth 123 can be arranged at intervals in a parallel manner, such that a channel for the smooth flow of the air flow can be formed between two adjacent heat dissipation teeth 123.

[0072] Or, as Figure 14 shown, in another example provided by the present application, the heat dissipation member 12 includes two different types of heat dissipation teeth 123. One type of heat dissipation tooth 123 is a flat plate-like structure, and the other type of heat dissipation tooth 123 is hemispherical. A plurality of heat dissipation teeth 123 with plate-like structures can be arranged at intervals in a parallel manner, and moreover, a channel for the smooth flow of the air flow can be formed between two adjacent heat dissipation teeth 123. Additionally, a plurality of hemispherical heat dissipation teeth are arranged in rows, and the plate-like heat dissipation teeth 123 and the hemispherical heat dissipation teeth are arranged alternately in sequence.

[0073] Generally speaking, in the examples provided by the present application, by providing the heat dissipation teeth 123, the heat exchange area between the air flow and the heat dissipation member 12 can be effectively increased, such that more heat can be carried away during the flow of the air flow, so as to improve the heat dissipation performance of the heat dissipation assembly 10.

[0074] During actual application, parameters such as the shape, quantity, and position arrangement of the heat dissipation teeth 123 can be reasonably set according to actual requirements, which will not be elaborated here.

[0075] In addition, when setting the heat dissipation teeth 123, the relative positions of the heat dissipation teeth 123 and the exhaust port 151 can be reasonably set to enhance the disturbance of the air flow by the heat dissipation teeth 123, so that the air flow can be discharged from the exhaust port 151 more smoothly.

[0076] For example, please refer to Figure 3 and Figure 12 . The exhaust port 151 can be located in the extending direction of the heat dissipation teeth 123. After the air flow blows towards the heat dissipation surface 122 in a substantially vertical direction, the air flow can be deflected by the heat dissipation teeth 123, so that the air flow is discharged from the exhaust port 151 more smoothly. It can be understood that in the example provided in Figure 3 , the exhaust port 151 is only on the right side surface of the second housing 15. In other examples, the exhaust port 151 can also be provided on the left side surface or other side surfaces of the second housing 15 to improve the discharge efficiency of the air flow. When specifically setting, the positions of the exhaust port 151 and the heat dissipation teeth 123 can be reasonably set locally according to the actual situation.

[0077] In specific applications, the heat dissipation component 10 can be directly applied in the terminal device, and the heat dissipation component 10 and the terminal device are independent of each other. Or, some components in the heat dissipation component 10 can be reused with some components in the terminal device.

[0078] For example, as Figure 15 and Figure 16 shown, in an example provided in the present application, the heat dissipation component 10 can be used as an integral structure and applied in the terminal device to enhance the heat dissipation performance of the terminal device.

[0079] Specifically, in the example provided in Figure 16 , the terminal device 20 is specifically a mobile phone, which includes a display screen 21, a middle frame 22, a back plate 23, and a chip 24. The display screen 21 and the back plate 23 are oppositely arranged, the middle frame 22 is connected between the display screen 21 and the back plate 23, and the chip 24 is installed in the space between the display screen 1 and the back plate 23. It can be understood that in actual applications, the mobile phone also includes components such as a circuit board, and other components or components in the mobile phone will not be elaborated here.

[0080] In actual applications, the mobile phone can also include a heat conducting member 25 and a heat conducting member 26. Among them, the heat conducting member 25 can be attached between the chip 24 and the display screen 21, so that the heat of the chip 24 can be transferred to the display screen 21 through the heat conducting member 25 for dissipation. In addition, the heat conducting member 26 can be attached between the chip 24 and the back plate 23, so that the heat of the chip 24 can be transferred to the back plate 23 through the heat conducting member 26 for dissipation.

[0081] The heat dissipation component 10 can be directly attached to the surface of the backplane 23, and the heat dissipation element 12 in the heat dissipation component 10 can be in contact with the surface of the backplane 23. At this time, the backplane 23 can be regarded as Figure 2 the device 02 to be cooled shown in Figure 2 , so that the heat of the backplane 23 can be effectively transferred to the heat dissipation element 12. Generally speaking, by setting the heat dissipation component 10, the cooling efficiency of the backplane 23 can be effectively improved, so that the heat of the chip 24 can be more effectively transferred to the backplane 23 for dissipation, which is beneficial to improving the heat dissipation performance of the entire terminal device.

[0082] Among them, the specific materials of the heat conducting member 25 and the heat conducting member 26 can include materials with good heat conductivity such as graphite and heat pipes. The present application does not limit the specific materials and structural types of the heat conducting member 25 and the heat conducting member 26.

[0083] In addition, in the example provided in the present application, the air flow channel in the heat dissipation component 10 and the terminal device 20 are independent of each other. That is to say, the heat dissipation component 10 will not damage the airtightness of the terminal device, thus avoiding adverse effects on the dustproof and waterproof performance of the terminal device 20.

[0084] When specifically setting, the heat dissipation component 10 can be fixedly connected to the backplane 23 by means of bonding or magnetic attraction. Among them, the connection method and connection structure between the heat dissipation component 10 and the backplane 23 can be selected according to actual needs, and the present application does not limit this.

[0085] In the above example, an exemplary description is made with the heat dissipation component 10 and the terminal device 20 as independent structures. However, in other examples, the heat dissipation component 10 and the terminal device 20 can also be integrally arranged.

[0086] For example, as Figure 17 shown, in another example provided in the present application, an air inlet 231 can be provided in the backplane 23, an air outlet 221 can be provided in the middle frame 22, and the throttle member 11 and the heat dissipation element 12 in the heat dissipation component 10 can both be arranged inside the mobile phone.

[0087] Specifically, please refer to Figure 17 and Figure 18 , the mobile phone includes a display screen 21, a middle frame 22, a backplane 23 and a chip 24. The display screen 21 is arranged opposite to the backplane 23, the middle frame 22 is connected between the display screen 21 and the backplane 23, and the chip 24 is installed in the space between the display screen 21 and the backplane 23. The heat conducting member 25 can be attached between the chip 24 and the display screen 21, so that the heat of the chip 24 can be transferred to the display screen 21 through the heat conducting member 25 for dissipation. In addition, the heat conducting member 26 can be attached between the chip 24 and the heat dissipation element 12, so that the heat of the chip 24 can be transferred to the heat dissipation element 12 in the heat dissipation component 10 through the heat conducting member 26 for dissipation.

[0088] Alternatively, it can be understood that, with reference to Figure 3 and Figure 17 , it can be considered that the first housing 14 in Figure 3 is integrally provided with the back plate 23 in Figure 17 , and the second housing 15 in the figure is integrally provided with the middle frame 22 in Figure 17 .

[0089] It should be noted that in practical applications, the air duct between the air inlet 141 and the air outlet 151 is isolated from other spaces inside the mobile phone to prevent impurities such as external water vapor or dust from entering the mobile phone through the air inlet 141 or the air outlet 151, thereby reducing the airtightness of the mobile phone.

[0090] Alternatively, as Figure 19 shown, in another example provided in the present application, the heat dissipation component 10 can also be integrated with the lens component in the mobile phone.

[0091] Specifically, the terminal device further includes a protrusion 232, and the protrusion 232 is located on the side of the back plate 23 away from the display screen 21. The terminal device includes a lens module ( Figure 19 not shown in the figure), the lens module is located between the middle frame 22 and the back plate 23, and the lens module extends to the outer surface of the protrusion 232, so as to collect external images. The heat dissipation component 10 is located inside the protrusion 232, and the side wall of the protrusion 232 has an air inlet 2321 and an air outlet 2322. External air can enter the inside of the back plate 23 from the air inlet 2321 and be discharged from the air outlet 2322, thereby realizing the cooling of the mobile phone. Alternatively, it can be understood that, with reference to Figure 3 and Figure 19 , it can be considered that the first housing 14 and the second housing 15 in Figure 3 are replaced by the protrusion 232 in Figure 19 , the air inlet 141 can be considered as the air inlet 2321, and the air outlet 151 can be considered as the air outlet 2322. When specifically setting, the protrusion 232 can be a structural member independent of the back plate 23, or the protrusion 232 and the back plate 23 can also be an integral structural form, and the present application does not limit this.

[0092] Please refer to Figure 19 and Figure 20 . In Figure 20 , a schematic cross-sectional structure diagram of the protrusion 232 part in the terminal device is shown. In the example provided in the present application, the protrusion 232 is a hollow convex-shaped structure, and both the throttle member 11 and the heat dissipation member 12 in the heat dissipation component 10 are fixed inside the protrusion 232. In practical applications, the heat conducting member 26 can be attached between the chip 24 and the back plate 23, and the heat conducting surface in the heat dissipation component 10 (such asFigure 20 The lower surface (in [description]) can be attached to the upper surface of the backplane 23, that is, the heat generated by the chip 24 can be transferred to the heat dissipation component 10 through the heat conducting member 26 and the backplane 23. Or, in some examples, a window can be opened at the position of the backplane 23 corresponding to the protrusion 232 to prevent the backplane 23 from transferring heat, thereby shortening the heat transfer path. That is, the heat conducting member 26 can be attached between the chip 24 and the heat conducting surface of the heat dissipation component 10, and the heat generated by the chip 24 can be directly transferred to the heat dissipation component 10 through the heat conducting member 26.

[0093] It can be understood that in the above examples, an exemplary description is given with one heat dissipation component 10 equipped in the terminal device 20 as an example. In actual applications, two or more heat dissipation components 10 can be equipped in the terminal device 20. The specific number of heat dissipation components 10 equipped in the terminal device 20 is not limited in this application.

[0094] In addition, in the above examples, an exemplary description is given with the heat dissipation component 10 applied to a mobile phone as an example. In actual applications, the heat dissipation component 10 can also be applied to devices such as tablet computers, laptop computers, routers, and base stations. Generally speaking, the heat dissipation component 10 provided in this application can be equipped in any terminal device that needs to enhance the heat dissipation performance.

[0095] In each embodiment of this application, if there is no special description and logical conflict, the terms and / or descriptions between different embodiments are consistent and can be referenced to each other. The technical features in different embodiments can be combined to form new embodiments according to their internal logical relationships.

[0096] In this application, "a plurality" means two or more. "And / or" describes the association relationship of associated objects, indicating that three relationships can exist. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone, where A and B can be singular or plural.

[0097] It can be understood that in the embodiments of this application, the various numerical numbers involved are only for the convenience of description and do not limit the scope of the embodiments of this application. The magnitude of the sequence numbers of the above processes does not mean the sequence of execution. The execution sequence of each process should be determined according to its function and internal logic.

Claims

1. A heat dissipation component, characterized in that, Including throttling parts, heat sinks and air sources; The throttle member includes a plurality of through holes, a first end of each of the through holes penetrates to a first surface of the throttle member, and a second end of each of the through holes penetrates to a second surface of the throttle member; The heat sink comprises a heat conducting surface and a heat dissipating surface which are separated from each other, the heat conducting surface is used for heat-conductingly fitting with the device to be cooled, and the heat dissipating surface is arranged opposite to the second surface; The air source is used to generate an air flow flowing through the plurality of through holes, the air flow flows from the first end to the second end of each through hole, and the diameter of each through hole is less than or equal to 1 mm.

2. The heat dissipation component according to claim 1, wherein The heat dissipation surface has a plurality of heat dissipation teeth extending perpendicularly to the heat dissipation surface.

3. The heat dissipation component according to claim 1 or 2, characterized in that, The included angle between each of the through holes and the heat dissipation surface is greater than or equal to 80° and less than or equal to 90°.

4. The heat dissipation component according to any one of claims 1 to 3, characterized in that, The cross-section of the through hole is the same from the first end to the second end of the through hole.

5. The heat dissipation component according to any one of claims 1 to 3, characterized in that A cross-sectional area of ​​the first end of the through hole is greater than a cross-sectional area of ​​the second end.

6. The heat dissipation component according to any one of claims 1 to 5, characterized in that, The heat dissipation assembly also includes a first housing; The first housing covers one side of the first surface of the throttle element, and the first housing has an air inlet, which is communicated with the first end of each of the through holes.

7. The heat dissipation component according to claim 6, characterized in that The gas source is located in a space enclosed by the first shell and the first surface of the throttling element.

8. The heat dissipation component according to any one of claims 1 to 7, characterized in that, The heat dissipation assembly also includes a second housing; The second shell is connected between the throttling element and the heat sink, and has an exhaust port, which is communicated with the second end of each through hole.

9. The heat dissipation component according to claim 8, wherein The heat dissipation surface has a plurality of heat dissipation teeth extending perpendicularly to the heat dissipation surface, and the heat dissipation teeth extend toward the exhaust port.

10. The heat dissipation component according to any one of claims 1 to 9, characterized in that, The heat-conducting surface is used to fit with the device to be cooled; or, the heat dissipation assembly further includes a heat-conducting member, and the heat-conducting member is used to be connected between the heat-conducting surface and the device to be cooled.

11. A terminal device, characterized in that, It comprises a device to be cooled and a heat dissipation assembly as claimed in any one of claims 1 to 10, wherein the heat conductive surface is thermally bonded to the device to be cooled.

12. The terminal device according to claim 11, wherein The terminal device comprises a display screen, a middle frame and a back plate, the display screen and the back plate are arranged opposite to each other, and the middle frame is connected between the display screen and the back plate; The heat dissipation component is located at a side of the back plate away from the display screen, and the heat conducting surface is in contact with the back plate.

13. The terminal device according to claim 12, characterized in that, The terminal device also includes a protrusion and a lens module; The protrusion is located on a side of the back plate away from the display screen; The lens module is located between the middle frame and the back plate, and the lens module extends to the outer surface of the protrusion; The heat dissipation assembly is located in the protrusion, and the side wall of the protrusion has an air inlet and an air outlet, the air inlet is communicated with the first end of each of the through holes, and the air outlet is communicated with the second end of each of the through holes.

14. The terminal device according to claim 11, wherein The heat dissipation component is located on a side of the back plate facing the display screen; The back plate has an air inlet, and the middle frame has an air outlet. The air inlet is communicated with the first end of each of the through holes, and the air outlet is communicated with the second end of each of the through holes.

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