High-precision drilling control method and system for multi-layer PCB

Abstract

The invention discloses a high-precision drilling control method and system for a multi-layer PCB, and relates to the technical field of intelligent control. The method comprises the following steps: scanning and analyzing to obtain layered material characteristics and structural size information of a multi-layer PCB, and carrying out clamping fixation and positioning hole processing on the multi-layer PCB to obtain a PCB positioning hole; a drilling machining three-dimensional coordinate axis is constructed; a PCB drilling strategy space is constructed, the PCB drilling strategy space is adopted to conduct drilling analysis on the layered material characteristics and the structure size information in sequence according to the PCB drilling machining requirement, and layered drilling strategy parameters are obtained; and the layered drilling strategy parameters are mapped to a drilling processing three-dimensional coordinate axis for space route fusion, layered drilling processing parameters are determined, and high-precision drilling and quality detection closed-loop control are executed on the multi-layer PCB. The technical problem that in the prior art, the positioning precision is low in the drilling process of the multi-layer PCB is solved, and the technical effect of improving the drilling machining precision of the multi-layer PCB is achieved.

Description

Technical Field

[0001] The present invention relates to the field of intelligent control technology, and in particular to a high-precision drilling control method and system for multi-layer PCBs. Background Art

[0002] Multilayer printed circuit boards (PCBs) are constructed from alternating conductive and insulating layers, with electrical connections achieved through vias between the layers. This complex structure significantly increases the difficulty of manufacturing multilayer PCBs, with drilling being the most critical step. The accuracy and quality of drilling directly impact the electrical performance and mechanical stability of multilayer PCBs. High-precision drilling ensures accurate via placement and reliable electrical connections between layers. Good drilling quality reduces burrs and hole wall roughness, lowering signal transmission losses and interference, and improving circuit operating frequency and stability. However, traditional drilling methods often struggle to ensure consistent and accurate drilling when faced with such high-precision processing requirements. Problems such as drill offset and out-of-tolerance hole diameters can easily occur, leading to increased PCB scrap rates and manufacturing costs. Summary of the Invention

[0003] The present application provides a high-precision drilling control method and system for multi-layer PCBs, which solves the technical problem of low positioning accuracy during multi-layer PCB drilling in the prior art.

[0004] In a first aspect of the present application, a high-precision drilling control method for a multi-layer PCB is provided, the method comprising: Scanning and analysis are performed to obtain layered material properties and structural dimension information of a multi-layer PCB board. A vacuum adsorption device is used to clamp and fix the multi-layer PCB board and perform positioning hole processing on the board according to a preset board flatness to obtain PCB board positioning holes. A three-dimensional coordinate axis for drilling processing is constructed based on the PCB board positioning holes. A PCB drilling strategy space is constructed and, according to the PCB board drilling processing requirements, drilling analysis is performed sequentially on the layered material properties and structural dimension information using the PCB drilling strategy space to obtain layered drilling strategy parameters. The layered drilling strategy parameters are mapped to the three-dimensional drilling processing coordinate axis for spatial route fusion to determine the layered drilling processing parameters. Based on the layered drilling processing parameters, high-precision drilling and quality inspection closed-loop control are performed on the multi-layer PCB board.

[0005] A second aspect of the present application provides a high-precision drilling control system for a multi-layer PCB, the system comprising: The scanning analysis module: the scanning analysis obtains the layered material characteristics and structural size information of the multi-layer PCB, and a vacuum adsorption device is used to clamp and fix the multi-layer PCB according to the preset board flatness and to process positioning holes, so as to obtain PCB positioning holes; the coordinate axis construction module: according to the PCB positioning holes, a three-dimensional coordinate axis for drilling is constructed; the drilling analysis module: a PCB drilling strategy space is constructed, and the layered material characteristics and structural size information are sequentially analyzed according to the PCB drilling processing requirements by using the PCB drilling strategy space, so as to obtain layered drilling strategy parameters; the control module: the layered drilling strategy parameters are mapped to the three-dimensional coordinate axis for drilling to fuse the space route, the layered drilling processing parameters are determined, and high-precision drilling and quality detection closed-loop control are performed on the multi-layer PCB based on the layered drilling processing parameters.

[0006] One or more technical solutions provided in the present application have at least the following technical effects or advantages: Firstly, the scanning analysis obtains the layered material characteristics and structural size information of the multi-layer PCB, and a vacuum adsorption device is used to clamp and fix the multi-layer PCB according to the preset board flatness and to process positioning holes, so as to obtain PCB positioning holes. Then, according to the PCB positioning holes, a three-dimensional coordinate axis for drilling is constructed. Further, a PCB drilling strategy space is constructed, and the layered material characteristics and structural size information are sequentially analyzed according to the PCB drilling processing requirements by using the PCB drilling strategy space, so as to obtain layered drilling strategy parameters. Then, the layered drilling strategy parameters are mapped to the three-dimensional coordinate axis for drilling to fuse the space route, the layered drilling processing parameters are determined, and high-precision drilling and quality detection closed-loop control are performed on the multi-layer PCB based on the layered drilling processing parameters. The technical problem of low positioning accuracy in the multi-layer PCB drilling process in the prior art is solved, and the technical effect of improving the multi-layer PCB drilling processing precision is achieved. BRIEF DESCRIPTION OF DRAWINGS

[0007] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0008] Figure 1 The high-precision drilling control method flow chart for multi-layer PCB provided by the embodiment of the present application; Figure 2 The high-precision drilling control system structure diagram for multi-layer PCB provided by the embodiment of the present application.

[0009] Explanation of reference signs: scanning analysis module 11, coordinate axis construction module 12, drilling analysis module 13, control module 14. DETAILED DESCRIPTION

[0010] The present application provides a high-precision drilling control method and system for multilayer PCBs, which solves the technical problem of low positioning accuracy in the drilling process of multilayer PCBs in the prior art.

[0011] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0012] It should be noted that the terms "comprising" and "having" are intended to cover non-exclusive inclusion, for example, a process, method, system, product or server comprising a series of steps or units does not have to be limited to only those steps or units clearly listed, but can include other steps or modules that are not clearly listed or inherent to the process, method, product or device.

[0013] Embodiment one, as shown in the present application provides a high-precision drilling control method for multilayer PCBs, wherein the method comprises: Figure 1 Scanning analysis obtains the layered material properties and structure size information of the multilayer PCB board, and a vacuum suction device is used to clamp and fix the multilayer PCB board according to the preset board surface flatness and to process positioning holes, to obtain PCB board positioning holes.

[0014] In the embodiments of the present application, the multilayer PCB to be processed is subjected to structure scanning and material analysis to obtain the layered material properties and structure size information. Specifically, a high-precision non-contact three-dimensional profile scanner or an X-ray tomography device can be used to scan the surface layer and the inner layer of the PCB board layer by layer to obtain the material type, thickness distribution, mechanical property parameters (such as stiffness, elastic modulus) of various layered materials including copper layer, dielectric layer, resin filling layer, etc., and overall board thickness, length-width size, edge deformation, etc. structure size data.

[0015] ​Based on the obtained structural size and material characteristic data, the system accesses a vacuum suction device to automatically clamp and fix the PCB board. During clamping, according to a preset board surface flatness target, the system adjusts the suction negative pressure level and suction partition state of the vacuum suction device, point by point adjusts the vacuum strength of the suction area, so that the overall stress of the PCB board is uniform, the board surface flatness tends to the preset value, and the subsequent drilling deviation caused by uneven suction or material warping is avoided. After suction is completed, the control system detects the actual flatness of the clamped PCB board in real time through a multi-point laser measurement device, and compares it with the preset flatness threshold; if the detection result meets the set requirements, it is confirmed that the clamping and fixing step is completed.

[0016] After clamping is completed, the positioning hole processing flow is entered. The control system automatically plans the number, shape and position of the positioning holes according to the PCB circuit design drawing, process technology specification and assembly alignment requirements, drives the numerical control drilling platform to perform positioning hole pre-processing in the predetermined area of the PCB board. After the positioning hole pre-processing is completed, the actual position coordinates of each hole are detected by a high-resolution camera system or a laser displacement measuring head, the offset amount thereof relative to the designed position is calculated, and the processing path is fine-tuned and corrected, so that high-precision positioning hole processing is finally completed, and the alignment accuracy requirement of the PCB board in subsequent all processes is ensured.

[0017] Further, the PCB board positioning hole is obtained, including: Based on the suction characteristics of the vacuum suction device, vacuum degree analysis is performed on the layered material characteristic and structural size information of the multi-layer PCB board, the target suction vacuum degree is determined, and the multi-layer PCB board is clamped and fixed based on the target suction vacuum degree; according to the circuit design information, manufacturing process constraints and assembly test requirements of the multi-layer PCB board, the number and position of the positioning holes are determined; the fixed multi-layer PCB board is pre-processed and offset detected according to the number and position of the positioning holes, and the positioning hole offset is obtained; based on the positioning hole offset and positioning hole accuracy requirement, the processing offset is corrected, and the PCB board positioning hole is obtained.

[0018] Based on the adsorption characteristics of the vacuum adsorption device, the layered material characteristics and structure size information of the multi-layer PCB are analyzed for vacuum degree. Specifically, according to the mechanical response characteristics of different materials (such as copper layer, FR4, polyimide, etc.) in the PCB during the adsorption process, combined with the thickness distribution, overall size and bending stiffness, a material-structure-adsorption response mapping relationship is established, the required vacuum negative pressure value is estimated, and the target adsorption vacuum degree is determined accordingly. Subsequently, the vacuum adsorption device is controlled to adsorb and clamp the PCB at the target vacuum degree, and the deformation amount of the board surface is monitored in real time during the adsorption process to ensure that the flatness of the board surface after adsorption reaches the preset flatness index (such as within ± 30 μm). After clamping and fixing, the system reads the circuit design file (such as Gerber, ODB++, etc.) and process processing file of the PCB, combined with the manufacturing process constraints (such as clamping edge width, boundary allowance size) of the current batch and the alignment accuracy requirements of the subsequent assembly and test links, and comprehensively analyzes and determines the number and specific position of the positioning holes on the board surface. Generally, at least three positioning holes are provided to realize planar positioning and rotational calibration. According to the determined number and position information of the positioning holes, the drilling execution module is controlled to pre-process the positioning holes of the fixed PCB. After processing, the actual processing hole position coordinates are obtained through the vision detection system or laser interference displacement sensor, and compared with the design coordinates to calculate the offset of each positioning hole. For the case where the offset exceeds the process tolerance range, the system will combine the board surface deformation and machine tool deviation model to correct the processing path; then the related positioning holes are compensated and reprocessed, or new holes are drilled in the allowed area, to finally obtain the PCB positioning holes meeting the accuracy requirements.

[0019] Further, determining the target adsorption vacuum degree comprises: analyzing the layered material characteristics and structure size information of the multi-layer PCB based on the adsorption characteristics of the vacuum adsorption device to determine an initial adsorption vacuum degree; starting the vacuum adsorption device to adsorb and clamp the multi-layer PCB according to the initial adsorption vacuum degree, and detecting and obtaining an initial board surface flatness; taking the difference between the initial board surface flatness and the preset board surface flatness as a board surface deviation flatness; dynamically compensating the initial adsorption vacuum degree based on the board surface deviation flatness to determine the target adsorption vacuum degree.

[0020] Based on the adsorption characteristics of the vacuum adsorption device, combined with the layered material characteristics and structural size information of the multi-layer PCB board, a vacuum degree analysis is performed. The layered material characteristics include the material type, thickness parameter, rigidity modulus, and thermal expansion coefficient of each functional layer, and the structural size information includes the length, width, and number of layers of the overall board. Based on this information, the control system calculates the initial adsorption vacuum degree that can provide effective fixation without causing material deformation through table lookup or physical modeling methods such as finite element simulation or plate deformation estimation model.

[0021] The control system starts the vacuum adsorption device to adsorb and fix the multi-layer PCB board according to the initial adsorption vacuum degree, and simultaneously uses a plate profile measurement device (such as a laser displacement sensor, a white light interferometer, etc.) to obtain the initial plate flatness value after adsorption. The flatness is usually represented by the standard deviation or maximum height difference of different measurement points on the plate surface.

[0022] The system compares the obtained initial plate flatness value with the preset plate flatness value set by the process (such as less than ±25μm), calculates the difference between the two, and defines it as the plate deviation flatness. If the deviation exceeds the tolerance range, it indicates that the current adsorption vacuum degree is insufficient to meet the requirements of flat fixation, or the adsorption force distribution is uneven. In response to this deviation, the system calls a dynamic compensation algorithm to adjust the initial adsorption vacuum degree, including increasing the vacuum negative pressure value, increasing the adsorption surface pressure ring pressure, or fine-tuning the adsorption cavity arrangement structure, etc. The compensated vacuum degree is defined as the target adsorption vacuum degree. The target adsorption vacuum degree ensures that the flatness of the multi-layer PCB board in the clamped state meets the reference requirements of subsequent drilling processing, thereby effectively reducing the drilling errors caused by plate warping or uneven stress.

[0023] According to the PCB board positioning hole, a three-dimensional coordinate axis for drilling processing is constructed.

[0024] After the clamping and fixing of the multi-layer PCB board and the processing of the positioning holes, the system constructs a three-dimensional coordinate axis for drilling based on the information of the PCB board positioning holes. Specifically, the actual spatial coordinates of the processed positioning holes are recognized and read by a high-precision visual recognition system or a contact probe device, including their position distribution in the X-axis and Y-axis planes and the normal angle with the surface of the PCB board, to evaluate their actual clamping deviation and tilt state; the system compares the set of recognized coordinates with the reference points in the original design to generate a set of position offset data and attitude offset data. The system takes at least two non-collinear positioning holes as reference points to establish a two-dimensional coordinate system based on the board surface body, and constructs a three-dimensional coordinate axis for drilling with the board surface normal as the Z-axis direction. The three-dimensional coordinate axis for drilling takes the reference coordinate system of the processing equipment as the external parameter, and maps the actual clamping position of the PCB board in the equipment to a unified drilling coordinate system through a coordinate transformation matrix (such as a homogeneous transformation matrix or a rigid body transformation matrix), realizing accurate spatial positioning of each drilling path.

[0025] A PCB drilling strategy space is constructed, and the layered material characteristics and structure size information are sequentially analyzed using the PCB drilling strategy space according to the drilling processing requirements of the PCB board, to obtain layered drilling strategy parameters.

[0026] After obtaining the layered material characteristics and structure size information of the multi-layer PCB board, a PCB drilling strategy space is constructed based on existing drilling experience data, process databases, and typical working condition samples, which includes material dimensions, structure dimensions, process dimensions, and equipment dimensions. The material dimensions include dielectric layer types, copper foil thickness, filler hardness, etc., the structure dimensions include interlayer alignment accuracy, board thickness, tolerance range, etc., the process dimensions include drill bit diameter, rotation speed, feed speed, tool withdrawal mode, cooling strategy, etc., and the equipment dimensions involve the rigidity, vibration frequency response characteristics, and processing stability of the current drilling platform.

[0027] The system extracts a strategy subset that matches the current layered material characteristics and structure size information from the PCB drilling strategy space according to the drilling processing requirements of the PCB board, and sequentially executes drilling strategy analysis. Specifically, the drilling difficulty of each layer of material is scored, the adaptation analysis of drilling depth and hole diameter accuracy is performed, and the processing risk of specific structure positions is evaluated. Through analysis, a drilling process combination scheme covering each layered structure is generated and output as layered drilling strategy parameters, specifically including the drill bit specification, feed speed, drilling angle, cooling medium flow rate, and tool withdrawal mode used for each layer.

[0028] Further, the construction of the PCB drilling strategy space includes: The drilling strategy space dimensions are defined, including material dimension, structure dimension, process dimension, and equipment dimension; historical drilling data mining is performed based on the drilling strategy space dimensions to obtain a PCB historical drilling data set; a PCB drilling effect fitness function is constructed according to a PCB drilling process target; and the PCB historical drilling data set is optimized and expanded by using the PCB drilling effect fitness function to construct a PCB drilling strategy space.

[0029] Firstly, according to the processing requirements and diversified characteristics of multi-layer PCB, the multi-dimensional structure of drilling strategy space is defined, and the drilling strategy space dimensions include at least material dimension, structure dimension, process dimension, and equipment dimension. The material dimension involves different medium layers, metal layers, and physical parameters such as hardness and thermal conductivity; the structure dimension covers geometric structure information such as the number of layers, thickness, via distribution, and interlayer stacking mode; the process dimension includes adjustable processing parameters such as drill bit specification, rotation speed, feed rate, tool retract mode, cooling mode, and processing allowance setting; and the equipment dimension reflects the performance indicators of the drilling equipment used, such as platform rigidity, servo response speed, stability, and error compensation capability. Under this multi-dimensional structure, the system performs data mining based on the collected and stored historical drilling samples to establish a PCB historical drilling data set, and the sample content includes drilling process parameters and processing effect records of various PCBs under different conditions, such as drilling accuracy, hole burr, hole wall perpendicularity, and drill breakage rate. Then, a PCB drilling effect fitness function is constructed, which takes the minimization of processing error, minimization of tool wear, and maximization of process stability as the evaluation core to comprehensively score the process performance of drilling strategies under different dimensional combinations. Finally, the system filters and optimizes the strategy combinations in the historical data set by using the PCB drilling effect fitness function, and through clustering analysis and evolutionary algorithm, the high fitness strategies are crossed, mutated, and expanded to dynamically generate an optimized multi-dimensional drilling strategy sample set, thereby constructing a PCB drilling strategy space with wide coverage and strong adaptability.

[0030] Further, the PCB drilling effect fitness function is used to optimize and expand the PCB historical drilling data set to construct a PCB drilling strategy space, including: The PCB drilling effect fitness function is used to evaluate the effect of the PCB historical drilling data set to obtain a PCB drilling effect fitness set; the PCB historical drilling data set is optimized according to the PCB drilling effect fitness set to obtain a parent PCB drilling data set; the parent PCB drilling data set is crossed, mutated, and selected and expanded to construct the PCB drilling strategy space.

[0031] Firstly, the PCB drilling effect fitness function is used to evaluate the processing effect of each set of drilling parameter combination in the historical PCB drilling data set. According to the drilling accuracy, hole mouth burr size, hole wall perpendicularity, heat affected zone range, tool life and other evaluation indexes, the PCB drilling effect fitness set is formed by comprehensive calculation, which reflects the process adaptability level of each strategy combination. Then, the system optimizes the original data set according to the PCB drilling effect fitness set, and selects the strategy combination with fitness value higher than the preset optimization threshold as the parent PCB drilling data set, which is used to build the optimized strategy library. Then, based on the evolutionary optimization idea, the parent PCB drilling data set is subjected to crossover operation and mutation operation: the crossover operation generates potential new strategy samples by randomly combining different parameter dimensions of two or more strategies; the mutation operation generates new strategy combinations by fine-tuning or perturbing single strategy parameters, so as to enhance the parameter diversity and space coverage ability. Finally, the system re-evaluates and selects the offspring strategy set obtained after crossover and mutation, and combines with the excellent strategies in the original parent generation, to complete the selective expansion of the PCB drilling strategy space, and build the optimized drilling strategy space covering diversified process conditions and having high adaptability.

[0032] Further, the layered drilling strategy parameters are obtained, including: The layered material characteristics and structure size information are sequentially matched with the PCB drilling strategy space to obtain a matched layered drilling strategy set; the matched layered drilling strategy set is compared and optimized according to the PCB board drilling processing requirements to obtain a preliminary layered drilling strategy; the preliminary layered drilling strategy is subjected to processing simulation and deviation adjustment optimization to obtain the layered drilling strategy parameters.

[0033] The system sequentially performs strategy matching on the layered material properties and structural size information of the multi-layer PCB based on the constructed PCB drilling strategy space. Specifically, first, the material attributes (such as glass fiber, copper-clad plate, resin substrate, etc.) and corresponding geometric characteristic parameters (such as layer thickness, hole diameter design, tolerance range, etc.) of each layer of the PCB are identified as matching input conditions; then, the strategy samples that meet the conditions of material dimension, structure dimension, and process dimension are searched for in the PCB drilling strategy space, and the strategy combinations that match the layered information are filtered out to form a matched layered drilling strategy set. Next, the system performs comprehensive comparison and optimization analysis on the matched layered drilling strategy set according to the specific drilling processing requirements of the PCB, including hole density, drilling path optimization, thermal influence control, equipment parameter limitation, etc., and selects the optimal strategy combination according to the fitness sorting principle as the preliminary layered drilling strategy. Based on the drilling equipment model and material processing response model, the system performs simulation of the preliminary layered drilling strategy, evaluates key indicators such as hole position deviation, thermal deformation, and drilling stability under simulated processing conditions, and fine-tunes and optimizes the strategy parameters based on the simulation results to output the final layered drilling strategy parameters that can be used to guide drilling execution.

[0034] The layered drilling strategy parameters are mapped to the drilling processing three-dimensional coordinate axis for space route fusion to determine the layered drilling processing parameters, and high-precision drilling and quality detection closed-loop control are performed on the multi-layer PCB based on the layered drilling processing parameters.

[0035] After obtaining the layered drilling strategy parameters, the system maps the layered drilling strategy parameters as input variables to the drilling processing three-dimensional coordinate axis constructed according to the PCB positioning hole. Specifically, according to the interlayer drilling sequence, hole distribution, drill size, and feed speed, etc. contained in the layered drilling strategy parameters, the system performs coordinate transformation matching with the PCB space structure information to construct a drilling parameter space conversion matrix; based on the drilling parameter space conversion matrix, the system projects each layer of drilling strategy parameters into the actual processing coordinate system to realize space route fusion between the physical drilling path and the strategy logical path, determine the specific layered drilling processing parameters, and form a multi-layer drilling task list with spatial directionality and dynamic path control capability.

[0036] The control system performs high-precision drilling operation according to the layered drilling processing parameters, and simultaneously accesses a real-time optical detection system and a mechanical feedback module to continuously collect quality indexes such as hole position deviation, interlayer burr and hole wall ablation during drilling, and obtain corresponding PCB quality parameters. The system real-time evaluates processing deviation according to the PCB quality parameters, and generates corresponding drilling processing correction amount for dynamically regulating subsequent drilling operation parameters, including feed rate adjustment, drill bit temperature control strategy update and path compensation correction, thereby constructing a closed-loop control mechanism of processing-detection-feedback, and ensuring high consistency and high precision of drilling effect of the multi-layer PCB under different material and structure conditions.

[0037] Further, the layered drilling processing parameters are determined, including: The layered drilling strategy parameters are spatially aligned with the drilling processing three-dimensional coordinate axis to obtain a drilling parameter space conversion matrix, and the layered drilling strategy parameters are mapped to the drilling processing three-dimensional coordinate axis based on the drilling parameter space conversion matrix to perform spatial route fusion, and the layered drilling processing parameters are determined.

[0038] Specifically, the hole position distribution, interlayer position relationship, drilling sequence and process requirements contained in the layered drilling strategy parameters are extracted, and combined with the drilling processing three-dimensional coordinate axis constructed by the PCB positioning hole, a drilling parameter space conversion matrix is constructed through coordinate fitting and path matching to describe the mapping relationship between the strategy logic coordinates and the actual processing coordinates. The system performs coordinate transformation on the layered drilling strategy parameters based on the drilling parameter space conversion matrix, maps each drilling action, path node and parameter attribute in the logic strategy to the actual three-dimensional processing coordinate system, and completes the mapping process from strategy to space route. The system performs spatial route fusion on this basis to exclude path conflicts, optimize drilling path continuity and efficiency, thereby determining the layered drilling processing parameters suitable for the target multi-layer PCB, and outputting to the execution mechanism for specific processing control.

[0039] Further, the layered drilling processing parameters are determined, including: Based on the layered drilling processing parameters, high-precision drilling is performed on the multi-layer PCB, and an optical detection system is used to collect and obtain PCB quality parameters; the layered drilling processing parameters are regulated and analyzed according to the PCB quality parameters to determine the layered drilling processing correction amount, and the drilling closed-loop control is performed through the layered drilling processing correction amount.

[0040] The system inputs the layered drilling processing parameters to the drilling control unit, controls the position of the drilling head relying on the established three-dimensional processing coordinate axis, and performs accurate processing on the target drilling positions of the multi-layer PCB one by one according to the set process parameters such as hole position, drilling depth, drilling speed, and interlayer switching. During the drilling process, the system simultaneously calls the integrated high-resolution optical detection system to perform online image acquisition and defect identification on the completed drilling area, and obtains the PCB quality parameters including hole position deviation, hole diameter error, hole wall burr, and layering offset. The system inputs the collected PCB quality parameters into the analysis module, compares and analyzes them with the preset quality standards, identifies the potential error sources, and combines the actual processing path, material response characteristics, and equipment execution feedback to evaluate the adaptability of the current layered drilling processing parameters. Based on the evaluation result, the system further generates a processing error compensation amount to form a layered drilling processing correction amount, including coordinate offset correction, drilling speed or feed rate adjustment, drilling sequence optimization, etc. The system dynamically updates the processing parameters and feeds them back to the drilling control unit to complete a parameter adaptive correction, and then realizes real-time closed-loop control of the drilling process, ensuring that the drilling precision and product consistency are continuously stable within the target tolerance range.

[0041] Further, determining the layered drilling processing correction amount comprises: performing defect identification on the PCB quality parameters to obtain PCB defect features, generating cause analysis based on the PCB defect features to obtain defect generation causes, and performing associated regulation and correction on the layered drilling processing parameters according to the defect generation causes to determine the layered drilling processing correction amount.

[0042] After completing the quality parameter acquisition, the system first performs image processing and intelligent identification analysis on the PCB quality parameters, identifies drilling defect features including hole diameter out-of-tolerance, hole position offset, layering alignment error, burr residue, and hole wall ablation, and forms a structured PCB defect feature set. Subsequently, the system performs cause analysis on each type of defect feature based on the preset drilling process knowledge base and defect association model, identifies the possible generation causes corresponding to the defect, including but not limited to drill bit wear, feed rate mismatch, interlayer material response asynchronization, insufficient cooling, or adsorption positioning error, etc. The system establishes a mapping relationship between the defects and the drilling strategy parameters based on the above defect generation causes and the actual drilling conditions, performs target-oriented associated regulation and control on the original layered drilling processing parameters, and finally outputs executable parameter correction instructions to form the layered drilling processing correction amount. The layered drilling processing correction amount includes drilling depth fine-tuning, drilling speed feed curve optimization, coordinate compensation, cooling parameter adjustment, etc., which is fed back to the drilling control system to realize adaptive updating of the processing path and parameters, thereby effectively eliminating the processing errors caused by defects and ensuring the consistency and precision stability of the PCB drilling quality.

[0043] To sum up, the embodiments of the present application have at least the following technical effects: First, the scanning analysis obtains the layered material characteristics and structure size information of the multi-layer PCB, and a vacuum suction device is used to clamp and fix the multi-layer PCB according to the preset board flatness and to process positioning holes, so as to obtain PCB positioning holes. Then, a three-dimensional coordinate axis for drilling is constructed according to the PCB positioning holes. Further, a PCB drilling strategy space is constructed, and the layered material characteristics and structure size information are sequentially analyzed by the PCB drilling strategy space according to the drilling requirements of the PCB, so as to obtain layered drilling strategy parameters. Then, the layered drilling strategy parameters are mapped to the three-dimensional coordinate axis for drilling to fuse the space route, determine the layered drilling processing parameters, and perform high-precision drilling and quality detection closed-loop control on the multi-layer PCB based on the layered drilling processing parameters. The technical problem of low positioning accuracy in the drilling process of the multi-layer PCB in the prior art is solved, and the technical effect of improving the drilling precision of the multi-layer PCB is achieved.

[0044] Embodiment two, based on the same inventive concept as the high-precision drilling control method for multi-layer PCB in the foregoing embodiments, as shown in Figure 2 The present application provides a high-precision drilling control system for multi-layer PCB, wherein the system comprises: A scanning analysis module 11: scanning analysis obtains the layered material characteristics and structure size information of the multi-layer PCB, and a vacuum suction device is used to clamp and fix the multi-layer PCB according to the preset board flatness and to process positioning holes, so as to obtain PCB positioning holes. A coordinate axis construction module 12: constructs a three-dimensional coordinate axis for drilling according to the PCB positioning holes. A drilling analysis module 13: constructs a PCB drilling strategy space, and sequentially analyzes the layered material characteristics and structure size information by the PCB drilling strategy space according to the drilling requirements of the PCB, so as to obtain layered drilling strategy parameters. A control module 14: maps the layered drilling strategy parameters to the three-dimensional coordinate axis for drilling to fuse the space route, determines the layered drilling processing parameters, and performs high-precision drilling and quality detection closed-loop control on the multi-layer PCB based on the layered drilling processing parameters.

[0045] Further, the scanning analysis module 11 is used to perform the following method: The vacuum degree of the layered material characteristics and the structure size information of the multi-layer PCB board is analyzed based on the adsorption characteristics of the vacuum adsorption device, an initial adsorption vacuum degree is determined, the vacuum adsorption device is started to adsorb and clamp the multi-layer PCB board according to the initial adsorption vacuum degree, and an initial board surface flatness is detected and acquired; a difference between the initial board surface flatness and the preset board surface flatness is taken as a board surface deviation flatness; the initial adsorption vacuum degree is dynamically compensated based on the board surface deviation flatness, and the target adsorption vacuum degree is determined.

[0046] Further, the scanning analysis module 11 is configured to perform the following method: The vacuum degree of the layered material characteristics and the structure size information of the multi-layer PCB board is analyzed based on the adsorption characteristics of the vacuum adsorption device, an initial adsorption vacuum degree is determined, the vacuum adsorption device is started to adsorb and clamp the multi-layer PCB board according to the initial adsorption vacuum degree, and an initial board surface flatness is detected and acquired; a difference between the initial board surface flatness and the preset board surface flatness is taken as a board surface deviation flatness; the initial adsorption vacuum degree is dynamically compensated based on the board surface deviation flatness, and the target adsorption vacuum degree is determined.

[0047] Further, the drilling analysis module 13 is configured to perform the following method: A drilling strategy space dimension is defined, the drilling strategy space dimension includes a material dimension, a structure dimension, a process dimension and a device dimension; historical drilling data of a PCB is obtained by mining based on the drilling strategy space dimension; a PCB drilling effect fitness function is constructed according to a PCB drilling process target; the PCB drilling effect fitness function is used to optimize and expand the historical drilling data of the PCB, and a PCB drilling strategy space is constructed.

[0048] Further, the drilling analysis module 13 is configured to perform the following method: The historical drilling data of the PCB is evaluated by using the PCB drilling effect fitness function, and a PCB drilling effect fitness set is obtained; the historical drilling data of the PCB is optimized according to the PCB drilling effect fitness set, and a parent PCB drilling data set is obtained; the parent PCB drilling data set is cross-varied and selected and expanded, and the PCB drilling strategy space is constructed.

[0049] Further, the drilling analysis module 13 is configured to perform the following method: The layered drilling strategy parameters are matched with the drilling processing three-dimensional coordinate axes in space to obtain a drilling parameter space conversion matrix; and the layered drilling strategy parameters are mapped to the drilling processing three-dimensional coordinate axes based on the drilling parameter space conversion matrix to perform space route fusion, so as to determine the layered drilling processing parameters.

[0050] Further, the control module 14 is configured to perform the following method: The layered drilling strategy parameters are matched with the drilling processing three-dimensional coordinate axes in space to obtain a drilling parameter space conversion matrix; and the layered drilling strategy parameters are mapped to the drilling processing three-dimensional coordinate axes based on the drilling parameter space conversion matrix to perform space route fusion, so as to determine the layered drilling processing parameters.

[0051] Further, the control module 14 is configured to perform the following method: Based on the layered drilling processing parameters, high-precision drilling is performed on the multi-layer PCB, and an optical detection system is used to collect PCB quality parameters; the layered drilling processing parameters are analyzed and regulated based on the PCB quality parameters to determine a layered drilling processing correction amount, and the drilling is controlled in a closed loop through the layered drilling processing correction amount.

[0052] Further, the control module 14 is configured to perform the following method: The PCB quality parameters are subjected to defect identification to obtain PCB defect features; the PCB defect features are subjected to cause analysis to obtain defect causes, and the layered drilling processing parameters are associated, regulated and corrected according to the defect causes to determine the layered drilling processing correction amount.

[0053] It should be noted that the above-mentioned sequence of the embodiments of the present application is only for description, and does not represent the advantages and disadvantages of the embodiments. The above describes a specific embodiment of the present application. The processes depicted in the drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multi-task processing and parallel processing are possible or can be advantageous.

[0054] The above only describes the preferred embodiments of the present application and does not limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

[0055] The specification and drawings are, of course, subject to various interpretations and should not be viewed in any limiting sense. It will be understood that various modifications and changes can be made to the application disclosed without departing from the scope of the application. It is therefore intended that the application be limited only by the scope of the appended claims, including any amendments thereof, and their equivalents.

Claims

1. A high precision drilling control method for multilayer PCB, characterized by, The method comprises: The scanning analysis obtains the layered material characteristics and structure size information of the multi-layer PCB board, and the vacuum adsorption device is used to clamp and fix the multi-layer PCB board according to the preset board flatness, and the positioning hole processing is performed, so as to obtain the PCB positioning hole; According to the PCB positioning hole, a three-dimensional coordinate axis for drilling processing is constructed; A PCB drilling strategy space is constructed, and the layered material characteristics and structure size information are sequentially analyzed by using the PCB drilling strategy space according to the drilling processing requirements of the PCB board, so as to obtain layered drilling strategy parameters; The layered drilling strategy parameters are mapped to the three-dimensional coordinate axis for drilling processing to perform space route fusion, and the layered drilling processing parameters are determined, and high-precision drilling and quality detection closed-loop control are performed on the multi-layer PCB board based on the layered drilling processing parameters.

2. The high precision drilling control method for multi-layer PCB of claim 1, wherein, The obtained PCB positioning hole comprises: Based on the adsorption characteristics of the vacuum adsorption device, the vacuum degree analysis is performed on the layered material characteristics and structure size information of the multi-layer PCB board, the target adsorption vacuum degree is determined, and the multi-layer PCB board is clamped and fixed based on the target adsorption vacuum degree; According to the circuit design information, manufacturing process constraints and assembly test requirements of the multi-layer PCB board, the number and position of the positioning hole are determined; According to the number and position of the positioning hole, the pre-processing and offset detection of the positioning hole are performed on the fixed multi-layer PCB board, and the offset of the positioning hole is obtained; Based on the offset of the positioning hole and the accuracy requirement of the positioning hole, the processing offset is corrected, and the PCB positioning hole is obtained.

3. The high precision drilling control method for multi-layer PCB of claim 2, wherein, The determination of the target adsorption vacuum degree comprises: Based on the adsorption characteristics of the vacuum adsorption device, the vacuum degree analysis is performed on the layered material characteristics and structure size information of the multi-layer PCB board, and the initial adsorption vacuum degree is determined; The vacuum adsorption device is started to adsorb and clamp the multi-layer PCB board according to the initial adsorption vacuum degree, and the initial board flatness is detected and obtained; The difference between the initial board flatness and the preset board flatness is taken as the board deviation flatness; Based on the board deviation flatness, the initial adsorption vacuum degree is dynamically compensated to determine the target adsorption vacuum degree.

4. The high precision drilling control method for multi-layer PCB of claim 1, wherein, The construction of the PCB drilling strategy space comprises: Defining the drilling strategy space dimension, the drilling strategy space dimension comprises material dimension, structure dimension, process dimension and equipment dimension; Based on the drilling strategy space dimension, historical drilling data mining is performed to obtain a PCB historical drilling data set; According to the PCB drilling process target, a PCB drilling effect fitness function is constructed; The PCB historical drilling data set is preferentially expanded by using the PCB drilling effect fitness function, and a PCB drilling strategy space is constructed.

5. The high-precision drilling control method for a multi-layer PCB according to claim 4, characterized in that: The PCB historical drilling data set is preferentially expanded by using the PCB drilling effect fitness function, and a PCB drilling strategy space is constructed, which comprises: The PCB historical drilling data set is evaluated by using the PCB drilling effect fitness function, and a PCB drilling effect fitness set is obtained; The PCB historical drilling data set is optimized according to the PCB drilling effect adaptability set, and a parent PCB drilling data set is obtained; The parent PCB drilling data set is cross-varied and selected to expand, and the PCB drilling strategy space is constructed.

6. The high precision drilling control method for multi-layer PCB of claim 1, wherein, The layered drilling strategy parameters are obtained, including: The layered material characteristics and structure size information are sequentially matched with the PCB drilling strategy space, and a matched layered drilling strategy set is obtained; The matched layered drilling strategy set is compared and optimized according to the PCB board drilling processing requirements, and a preliminary layered drilling strategy is obtained; The preliminary layered drilling strategy is simulated and optimized by deviation adjustment, and the layered drilling strategy parameters are obtained.

7. The high precision drilling control method for multi-layer PCB of claim 1, wherein, The layered drilling strategy parameters are obtained, including: The layered drilling strategy parameters are aligned with the drilling processing three-dimensional coordinate axis in space to obtain a drilling parameter space conversion matrix; Based on the drilling parameter space conversion matrix, the layered drilling strategy parameters are mapped to the drilling processing three-dimensional coordinate axis for space route fusion to determine the layered drilling processing parameters.

8. The high precision drilling control method for multi-layer PCB of claim 1, wherein, Based on the layered drilling processing parameters, high-precision drilling and quality detection closed-loop control are performed on the multi-layer PCB board, including: Based on the layered drilling processing parameters, high-precision drilling is performed on the multi-layer PCB board, and an optical detection system is used to collect PCB board quality parameters; According to the PCB board quality parameters, the layered drilling processing parameters are adjusted and analyzed to determine the layered drilling processing correction amount, and the drilling closed-loop control is performed through the layered drilling processing correction amount.

9. The high precision drilling control method for multi-layer PCB of claim 8, wherein, The layered drilling processing correction amount is determined, including: The PCB board quality parameters are identified to obtain PCB board defect characteristics; Based on the PCB board defect characteristics, the defect generation reason is obtained, and the layered drilling processing parameters are associated and adjusted according to the defect generation reason to determine the layered drilling processing correction amount.

10. A high precision drilling control system for multilayer PCBs, characterized by, The system for implementing the high-precision drilling control method for the multi-layer PCB according to any one of claims 1-9, the system comprising: A scanning analysis module: scanning and analyzing the layered material characteristics and structure size information of the multi-layer PCB board, and using a vacuum adsorption device to clamp and fix the multi-layer PCB board according to the preset board flatness and to process positioning holes to obtain PCB board positioning holes; A coordinate axis construction module: constructing a drilling processing three-dimensional coordinate axis according to the PCB board positioning holes; A drilling analysis module: constructing a PCB drilling strategy space, and sequentially performing drilling analysis on the layered material characteristics and structure size information according to the PCB drilling processing requirements using the PCB drilling strategy space to obtain layered drilling strategy parameters; A control module: mapping the layered drilling strategy parameters to the drilling processing three-dimensional coordinate axis for space route fusion to determine layered drilling processing parameters, and performing high-precision drilling and quality detection closed-loop control on the multi-layer PCB board based on the layered drilling processing parameters.

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