Heat exchange device assembly

Abstract

The invention provides a heat exchange device assembly which is at least provided with a condenser structure and comprises a cover plate with a plurality of first columns and a bottom plate with a plurality of second columns. Wherein the cover plate covers and defines a sealed chamber corresponding to the bottom plate, and the end faces of the plurality of first cylinders correspond to the end faces of the plurality of second cylinders respectively. Therefore, by means of the design, the condenser can be suitable for special environments (such as extremely low temperature), and the situation that the structure of the condenser is damaged due to steam volume change expansion is avoided.

Description

Technical Field

[0001] The present invention relates to a heat exchange device, and more particularly to a heat exchange device assembly applicable to a special environment. Background Art

[0002] The miniaturization and high integration of electronic devices (such as base stations) have led to a significant increase in the internal chip heat flux density. Therefore, a heat exchange device using phase change (such as two-phase flow) has been widely favored due to its fast heat dissipation and high efficiency.

[0003] A conventional heat exchange device assembly usually includes a condenser structure 9, as Figure 1 shown, which defines a sealed chamber 92 by covering between a cover plate 911 and a bottom plate 912, and the working fluid circulates therein to achieve the effect of heat exchange; for example, it can be covered jointly by the cover plate 911 and the bottom plate 912; and, a plurality of support columns 93 are also provided to provide the structural strength support required for the cover plate 911 and the bottom plate 912.

[0004] When the condenser structure 9 is disposed in a heat exchange device assembly (not shown), it can be connected to an evaporator in contact with a heat source (such as an electronic device) through an inlet pipe for conducting steam and a return pipe for conducting the working fluid after condensation. Thus, the inner surface of the cover plate 911 or the bottom plate 912 will respectively correspond to a return side or a condensation side of the working fluid. The plurality of support columns 93 are usually combined on the inner surface of one of the cover plate 911 or the bottom plate 912, and the end surfaces thereof extend and engage (contact) with the other inner surface to form a gap, and vice versa. Alternatively, the plurality of support columns 93 can also be separately disposed between the two sides, and gaps are respectively formed between the inner surfaces of the cover plate 911 or the bottom plate 912.

[0005] At this time, regardless of whether the above-mentioned gap is formed near the return side or the condensation side, since the working fluid will pass through and enter the gap between the end surface of the plurality of support columns 93 and the inner surface during the circulation in the sealed chamber 92. In a special environment (such as extremely low temperature), if solidification (such as water freezing) occurs due to the extremely low temperature, the working fluid will accumulate in the gap and undergo a volume change, not only weakening the structural strength of the plurality of support columns 93, but also causing the cover plate 911 or the bottom plate 912 to bulge, and even leading to system failure. For example, when the steam of the working fluid passes through the condensation side at extremely low temperature, it may solidify in the gap on the condensation side due to the low temperature; or, the working fluid accumulated on the return side may also solidify in the gap on the return side due to the extremely low temperature.

[0006] Therefore, when an electronic device needs to be used in a special environment (such as extremely low temperature), although the known heat exchange device assembly has good heat conduction, it is limited by the characteristics of the working fluid therein (such as water) and the condenser structure 9, and is prone to ice formation and bulging. Therefore, how to solve the above-mentioned known problems and deficiencies is the direction that the inventors of this case and related manufacturers in this industry are eager to research and improve. Summary of the Invention

[0007] Therefore, in order to effectively solve the above problems, an object of the present invention is to provide a heat exchange device assembly applicable to special environments.

[0008] To achieve the above object, the present invention provides a heat exchange device assembly, which at least has a condenser structure, and the condenser structure includes: a cover plate and a bottom plate.

[0009] The cover plate has a plurality of first cylinders disposed on the inner surface of the cover plate, and the bottom plate has a plurality of second cylinders disposed on the inner surface of the bottom plate; wherein the cover plate covers the bottom plate to define a sealed chamber, and the end faces of the plurality of first cylinders respectively correspond to the end faces of the plurality of second cylinders.

[0010] Wherein, the end faces of the plurality of first cylinders and the end faces of the plurality of second cylinders are in a concave-convex corresponding relationship with each other.

[0011] Wherein, the end faces of the plurality of first cylinders and the end faces of the plurality of second cylinders are in a concave-convex corresponding relationship in an arc shape, a rectangular shape or a wedge shape.

[0012] Wherein, the sealed chamber has a condensation side corresponding to the inner surface of the cover plate and a reflux side corresponding to the inner surface of the bottom plate.

[0013] Wherein, the end faces of the plurality of first cylinders form concave surfaces, and the end faces of the plurality of second cylinders form convex surfaces corresponding to the concave surfaces.

[0014] Wherein, the end faces of the plurality of first cylinders and the end faces of the plurality of second cylinders are respectively corresponding and joined to each other.

[0015] Wherein, the condenser structure is communicated with an evaporator through an inlet pipe and a reflux pipe.

[0016] Thereby, the present invention provides a condenser structure applicable to a special environment (such as extremely low temperature), which will not cause damage to the condenser structure due to the expansion of the steam volume. Brief Description of the Drawings

[0017] Figure 1 It is a sectional view and a partially enlarged schematic view of a known condenser structure;

[0018] Figure 2 It is a three-dimensional schematic view of the heat exchange device assembly of the present invention;

[0019] Figure 3 is a partially exploded view of the heat exchange device assembly of the present invention;

[0020] Figure 4 is a partially exploded view of the heat exchange device assembly of the present invention;

[0021] Figure 5 is a partially sectional view of the heat exchange device assembly of the present invention;

[0022] Figure 6 is a partially sectional view of the heat exchange device assembly of the present invention;

[0023] Figure 7 is a partially sectional view of the heat exchange device assembly of the present invention;

[0024] Figure 8 is a partially sectional view of the heat exchange device assembly of the present invention.

[0025] Description of reference numerals: condenser structure 1; cover plate 11; first cylinder 111; bottom plate 12; second cylinder 121; sealed chamber 13; condensation side 131; reflux side 132; evaporator 2; inlet pipe 21; reflux pipe 22; flow accumulation tank 4; condenser structure 9; cover plate 911; bottom plate 912; sealed chamber 92; support column 93. Detailed implementation manners

[0026] The above objects of the present invention and its structural and functional characteristics will now be described with reference to the preferred embodiments shown in the accompanying drawings.

[0027] Please refer to the present invention Figure 2 is a three-dimensional view of the heat exchange device assembly of the present invention; Figure 3 and Figure 4 is a partially exploded view of the heat exchange device assembly of the present invention; and, Figures 5 to 8 is a partially sectional view of the heat exchange device assembly of the present invention.

[0028] First, as shown in the present invention Figures 2 to 6 The present invention provides a heat exchange device assembly having at least a condenser structure 1, and the condenser structure 1 includes a cover plate 11 and a bottom plate 12. In some embodiments, both the cover plate 11 and the bottom plate 12 are made of a metal material with good heat conduction properties. Specifically, the cover plate 11 and the bottom plate 12 can be covered with each other to define a sealed chamber 13. During use, the sealed chamber 13 is filled with a working fluid (not shown) to achieve the purpose of heat exchange by circulating the working fluid therein.

[0029] Please also refer to Figure 2As shown, in some embodiments, the heat exchange device assembly of the present invention may further be provided with an evaporator 2 corresponding to the condenser structure 1. The evaporator 2 (e.g., a water-cooled head) can absorb heat energy from an electronic device and conduct the heat energy to the working fluid so that the working fluid undergoes a phase change (i.e., evaporates into steam).

[0030] Between the evaporator 2 and the condenser structure 1, they can be connected respectively through at least one inlet pipe 21 for conveying steam and at least one return pipe 22 for conveying the working fluid after condensation (e.g., a loop thermosyphon or a loop heat pipe). In this way, the steam can be transported to the condenser structure 1 for condensation, and then sent back to the evaporator 2 via the return pipe 22 to continue the heat exchange cycle. At this time, the sealed chamber 13 can have a condensation side 131 and a return side 132 corresponding to the circulation of the working fluid. The condensation side 131 is arranged upward in cooperation with the rising steam and can be configured to be adjacent to the inlet pipe 21; the return side 132 is opposite to it, and the condensed working fluid flows back by gravity.

[0031] For example, please refer back to Figure 6 As shown, by the setting of the above heat exchange device assembly, the condensation side 131 of the sealed chamber 13 corresponds to the inner surface of the cover plate 11, and the return side 132 corresponds to the inner surface of the bottom plate 12. However, the reverse is not limited to this. In this embodiment, the outer surface of the cover plate 11 is arranged upward and contacts the low-temperature external environment for heat exchange to discharge heat energy. Of course, other configurations for forming the condensation side 131 and the return side 132 corresponding to the cover plate 11 and the bottom plate 12 do not affect the implementation of the present invention.

[0032] And, as again shown in Figure 2 In this embodiment, the heat exchange device assembly may further include a heat dissipation fin group (not shown) provided on the outer surface of the bottom plate 12, and a storage groove 4 protruding corresponding to the return side 132 of the inner surface of the bottom plate 12. The storage groove 4 communicates with the bottom plate 12 and the return pipe 22 to connect and guide the condensed and returned working fluid back to the evaporator 2 to continue the heat exchange cycle. Thereby, the working fluid (e.g., water) undergoes a two-phase flow heat exchange cycle; that is, after absorbing heat energy from the electronic device and vaporizing, it then dissipates heat and condenses through the heat exchange cycle to discharge the heat energy to the external environment.

[0033] In other embodiments, the heat exchange device assembly of the present invention may also be configured to only have the condenser structure 1, allowing the working fluid to perform a closed heat exchange cycle only within the sealed chamber 13 therein (not shown; e.g., a heat pipe or a 3D heat pipe or a two-phase flow device, etc.), without having the above-mentioned other structures (such as the evaporator 2, etc.). For example, the electronic device may be configured to directly contact the outer surface corresponding to the return side 132, and cause the working fluid to directly absorb heat on the return side 132 to generate a phase change (i.e., evaporation).

[0034] In particular, in the heat exchange device assembly of the present invention, the condenser structure 1 has a plurality of first cylinders 111 combined on the inner surface of the cover plate 11, and the bottom plate 12 also has a plurality of second cylinders 121 combined on the inner surface of the bottom plate 12. Among them, the plurality of first cylinders 111 and second cylinders 121 can be formed by forging, casting, welding, etc. (the present invention is not limited thereto), so that they are respectively integrated with the cover plate 11 and the bottom plate 12. Therefore, there are no gaps between the plurality of first cylinders 111 and second cylinders 121 and the cover plate 11 and the bottom plate 12 respectively. More specifically, no gaps will be formed at the joints where the cover plate 11 and the bottom plate 12 are respectively combined with the plurality of first cylinders 111 and second cylinders 121.

[0035] Therefore, since the present invention is formed by the plurality of first cylinders 111 and second cylinders 121 extending away from the inner surfaces of the cover plate 11 and the bottom plate 12. So, for example, even in a special environment (such as extremely low temperature), when the working fluid solidifies on the inner surface of the cover plate 11 or the bottom plate 12, regardless of the corresponding relationship between the condensation side 131 or the return side 132 and the inner surface of the cover plate 11 or the bottom plate 12, because no gaps will be formed near the inner surface of the cover plate 11 or the bottom plate 12, the solidified working fluid will not accumulate in the gaps, resulting in a weakening of the strength of the plurality of first cylinders 111 and second cylinders 121, or even bulging of the cover plate 11 or the bottom plate 12, leading to system failure and other problems.

[0036] It should be noted that since the cover plate 11 corresponds to the bottom plate 12 and the two are covered to define the sealed chamber 13, the end faces of the plurality of first cylinders 111 in the sealed chamber 13 defined by the cover plate 11 and the bottom plate 12 are respectively corresponding to the end faces of the plurality of second cylinders 121. For example, both end faces can be flat, and further, the two end faces can also be in a mutually concave-convex or other geometric forms corresponding or matching each other. As Figure 6 and Figure 8 shown, the concave-convex corresponding engagement can be that the end faces of the plurality of first cylinders 111 and the plurality of second cylinders 121 are in an arc-shaped, rectangular or wedge-shaped mutual concave-convex corresponding engagement.

[0037] Please refer back to Figures 2 to 6 As shown, in the setting of the heat exchange device assembly in this embodiment (due to the corresponding setting relationship between the condenser structure 1 and the evaporator 2, the inlet pipe 21, the return pipe 22, and the accumulator tank 4), the condensation side 131 corresponds to the inner surface of the cover plate 11 arranged upward, and the return side 132 corresponds to the inner surface of the bottom plate 12. Therefore, a concave surface for concave-convex fitting can be formed on the end surfaces of the plurality of first cylinders 111, and convex surfaces corresponding to the concave surfaces are formed on the end surfaces of the plurality of second cylinders 121.

[0038] At this time, the working fluid condensed on the condensation side 131 will then drip downward under the action of gravity, or flow back to the return side 132 along the plurality of first cylinders 111 and second cylinders 121. Therefore, due to the above-mentioned arrangement relationship where the plurality of first cylinders 111 are concave surfaces, the plurality of second cylinders 121 are convex surfaces, and they correspond to the condensation side 131 and the return side 132, although the working fluid flowing back under the action of gravity still passes through the joint where the end surfaces of the two correspond to each other, the working fluid still flows back to the return side 132 under the action of gravity. Therefore, the heat exchange device assembly of the present invention can further prevent the possibility of the working fluid aggregating and solidifying at any position during the circulation process due to extremely low temperature in a special environment.

[0039] In addition to the above-described embodiments, in other embodiments, the end surfaces of the plurality of first cylinders 111 and the second cylinders 121 can also stably correspond to and engage with each other (contact) under normal conditions, and it is not limited to the above.

[0040] The above has described the present invention in detail, and what is described above is only a preferred embodiment of the present invention, and it should not be used to limit the scope of implementation of the present invention. That is, all equivalent changes and modifications made according to the present invention should still fall within the patent coverage scope of the present invention.

Claims

1. A heat exchange device assembly, having at least a condenser structure, characterized in that, The structure of this condenser includes: A cover plate having a plurality of first cylinders disposed on the inner surface of the cover plate; A bottom plate having a plurality of second cylinders disposed on the inner surface of the bottom plate; wherein: The cover plate is closed corresponding to the bottom plate to define a sealed chamber, and the end faces of the plurality of first cylinders respectively correspond to the end faces of the plurality of second cylinders.

2. The heat exchange device assembly according to claim 1, wherein: The end faces of the plurality of first cylinders respectively correspond to the end faces of the plurality of second cylinders in a concave-convex manner.

3. The heat exchange device assembly according to claim 2, wherein: The end faces of the plurality of first cylinders and the plurality of second cylinders correspond to each other in a concave-convex manner in an arc shape, a rectangular shape or a wedge shape.

4. The heat exchange device assembly according to claim 2, wherein: The sealed chamber has a condensation side corresponding to the inner surface of the cover plate and a reflux side corresponding to the inner surface of the bottom plate.

5. The heat exchange device assembly according to claim 4, wherein: The end faces of the plurality of first cylinders form concave surfaces, and the end faces of the plurality of second cylinders form convex surfaces corresponding to the concave surfaces.

6. The heat exchange device assembly according to claim 1, characterized in that: The end faces of the plurality of first cylinders and the plurality of second cylinders are respectively correspondingly joined to each other.

7. The heat exchange device assembly according to claim 1, characterized in that: The condenser structure is communicated with an evaporator through an inlet pipe and a reflux pipe.

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