A heat dissipation device, a heat dissipation method, and an external heat dissipation device.

Abstract

This invention belongs to the field of heat dissipation, specifically relating to a heat dissipation device, a heat dissipation method, and an external heat dissipation device. The heat dissipation device includes a jet exciter and heat dissipation fins. The heat dissipation fins are arranged at a heat source I, and a flow channel is provided on the heat dissipation fins. The jet outlet of the jet exciter faces the inlet of the flow channel, and there is a gap between the jet outlet and the inlet of the flow channel. Room temperature air is drawn in from the jet outlet through the gap, and the air jet ejected from the jet outlet enters the flow channel from the inlet, exchanges heat with the heat dissipation fins, and then flows out from the outlet. The core innovation of this invention is the arrangement of the jet exciter with a gap between it and the inlet of the channel, which allows room temperature air to be drawn in from the outside during the intake phase, rather than from the heated airflow after heat dissipation, directly improving heat exchange efficiency. This arrangement allows the heat dissipation device to be thin, small in size, and low in noise.

Description

Technical Field

[0001] This invention belongs to the field of heat dissipation, specifically relating to a heat dissipation device, a heat dissipation method, and an external heat dissipation device. Background Technology

[0002] With the rapid increase in chip performance, charging power, and battery capacity, mobile devices such as smartphones, tablets, and portable Wi-Fi devices are generating increasingly more heat. Excessive temperature can cause mechanical and electrical failures in electronic components, severely impacting their performance, stability, and lifespan, thus affecting the reliability of the entire system. Heat dissipation in mobile devices has become a key factor restricting stable operation and performance.

[0003] Currently, mobile terminals primarily rely on passive cooling, with some high-performance, high-power models employing active cooling. Passive cooling devices lack sufficient heat dissipation capacity to handle sustained high-load scenarios, and may absorb excessive heat in high-temperature environments, causing the phone to overheat. Some thermally conductive materials may dry out or harden after prolonged use, leading to a decrease in thermal conductivity. Active cooling devices offer excellent heat dissipation, but consume more energy. When in use, they are externally mounted on the mobile terminal, resulting in cumbersome installation, larger size and weight, and poor portability. Air cooling devices are thicker and noisier, making them difficult to integrate into mobile terminals. Liquid cooling devices offer high efficiency, stability, and long lifespan, but their complex piping increases manufacturing costs and process difficulty, and there is a risk of liquid leakage damaging electronic components. Existing active cooling devices mostly rely on wired power or independent batteries, increasing the burden of carrying them. Therefore, there is an urgent need for an ultra-thin, quiet, and wirelessly powered high-efficiency cooling solution. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a heat dissipation device, heat dissipation method and external heat dissipation device that is simple in structure, low in energy consumption and good in heat dissipation effect.

[0005] This invention provides a heat dissipation device, including a jet exciter and heat dissipation fins;

[0006] The heat dissipation fins are arranged at heat source I, and the heat dissipation fins are provided with flow channels;

[0007] The jet outlet of the jet actuator is positioned facing the inlet of the flow channel, and there is a gap between the jet outlet and the inlet of the flow channel;

[0008] The jet exciter draws in ambient temperature air from the jet inlet, and the air jet ejected from the jet inlet enters the flow channel from the channel inlet, exchanges heat with the heat dissipation fins, and then flows out from the channel outlet.

[0009] Furthermore, at least one sidewall of the jet cavity of the jet exciter is located near the heat source I;

[0010] Alternatively, at least one sidewall of the jet cavity of the jet exciter is located at the heat source II;

[0011] Furthermore, microgrooves are provided on the sidewall of the jet cavity that is in contact with heat source I or heat source II.

[0012] Furthermore, the jet exciter is a synthetic dual-jet exciter;

[0013] The two jet inlets of the synthetic dual-jet exciter are arranged side by side along the width of the flow channel.

[0014] Furthermore, each jet port is divided into several sub-jet ports along the width of the flow channel.

[0015] Furthermore, the flow channel is evenly distributed with several sub-flow channels along its width.

[0016] Furthermore, the heat dissipation device also includes a housing, which is hollow inside, and the jet exciter and heat dissipation fins are disposed inside the hollow housing;

[0017] A jet inlet is provided at the interval on the shell, and a jet outlet is provided at the channel outlet.

[0018] The present invention also provides a heat dissipation method using the above-mentioned heat dissipation device, comprising the following steps:

[0019] The jet exciter alternately draws in room temperature air from the jet nozzle and ejects an air jet into the channel inlet. After the air jet enters the flow channel from the channel inlet and exchanges heat with the heat dissipation fins, it finally flows out from the channel outlet.

[0020] The present invention also provides an external heat dissipation device, including a device housing and the aforementioned heat dissipation device, wherein the heat dissipation device is disposed on the device housing.

[0021] Furthermore, a power supply coil is installed on the device casing, which is used to wirelessly power the jet exciter through the device.

[0022] The beneficial effects of this invention are that, by arranging the jet exciter and the heat dissipation fins at intervals and by setting a flow channel on the heat dissipation fins, the jet exciter achieves blowing and sucking separation through the interval arrangement. The air drawn in is at room temperature at the interval, and the jet is directly exchanged with the heat dissipation fins through the flow channel, avoiding hot air circulation, directly enhancing the heat exchange efficiency between the heat dissipation fins and room temperature air, and improving the heat exchange effect between the heat dissipation fins and heat source I.

[0023] The core innovation of this invention lies in the spaced arrangement between the jet actuator and the channel inlet, which allows ambient temperature air to be drawn in during the intake phase, rather than from the heated airflow, directly improving heat exchange efficiency. This arrangement enables the heat dissipation device to be thin, small in size, and low in noise. In contrast, existing heat dissipation devices typically require the air inlet and outlet of the airflow generating device (e.g., a fan) to be arranged opposite each other, resulting in a larger structural size and making it impossible to achieve a small-sized heat dissipation device. Furthermore, conventional jet actuators in the prior art, if they directly draw in hot air, cause the hot air to recirculate, reducing the heat exchange temperature difference and lowering the heat dissipation efficiency. Attached Figure Description

[0024] Figure 1 This is an exploded view of the overall structure of the external heat dissipation device of the present invention;

[0025] Figure 2 This is an exploded view of the jet exciter in this invention (without microgrooves).

[0026] Figure 3 This is an exploded view of the jet exciter in this invention (with micro-grooves).

[0027] Figure 4 This is a schematic diagram of the housing structure in the heat dissipation device of the present invention;

[0028] Figure 5 This is a schematic diagram illustrating the blowing and suction separation effect of the heat dissipation device with a housing in this invention;

[0029] Figure 6 This is a schematic diagram of the internal structure of the outer casing of the external heat dissipation device of the present invention;

[0030] Figure 7 This is a schematic diagram of the jet velocity of the jet exciter measured experimentally according to the present invention;

[0031] Figure 8 This is a schematic diagram of the sound pressure level of the jet exciter measured experimentally according to the present invention;

[0032] Figure 9 This is a schematic diagram of the power consumption of the jet exciter measured experimentally according to the present invention.

[0033] Figure 10 This is a temperature cloud map of the heat source I 4.4W heat dissipation device before it is turned on, as measured in the experiment of this invention.

[0034] Figure 11 The temperature cloud map (without microgrooves) of the heat source I 4.4W heat dissipation device after 650s of operation, as measured in the experiment of this invention.

[0035] Figure 12The temperature cloud map (with micro-grooves) of the heat source I 4.4W heat dissipation device after 650s of operation is obtained from the experiment of this invention.

[0036] In the figure, 1-jet exciter; 11-cavity I; 12-cavity II; 13-piezoelectric vibrator; 14-jet port; 14a-sub-jet port; 15-microgroove; 2-shell; 21-jet inlet; 22-jet outlet; 3-equipment shell; 4-heat dissipation fins; 41-flow channel; 41a-sub-flow channel; 411-channel inlet; 412-channel outlet; 5-spacer; 6-power supply coil. Detailed Implementation

[0037] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0038] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0039] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0040] In this invention, unless otherwise explicitly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection, an electrical connection, a physical connection, or a wireless communication connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two elements or the interaction between two elements, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0041] Furthermore, the technical solutions of the various embodiments of the present invention can be combined with each other, but only if they are feasible for those skilled in the art. If the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by the present invention.

[0042] like Figures 1-6 As shown, the present invention provides a heat dissipation device, including a jet exciter 1 and heat dissipation fins 4;

[0043] Heat dissipation fins 4 are arranged at heat source I. A flow channel 41 is provided on the heat dissipation fins 4. The flow channel 41 is hollow inside and has two through ends, that is, one end of the flow channel 41 is the channel inlet 411 and the other end is the channel outlet 412.

[0044] The jet nozzle 14 of the jet actuator 1 is positioned facing the channel inlet 411 of the flow channel 41. At this time, the air jet ejected from the jet nozzle 14 of the jet actuator 1 will directly enter the flow channel 41 through the channel inlet 411, and the jet nozzle 14 is spaced 5 away from the channel inlet 411 of the flow channel 41. This spaced 5 connects the jet nozzle 14.

[0045] Since the flow channel 41 increases the flow loss along the flow path, the jet port 14 of the jet actuator 1 will draw in air from the interval 5 where the flow resistance is smaller. However, the jet will not change direction and will enter the flow channel 41 from the channel inlet 411. That is, the jet port 14 of the jet actuator 1 of the present invention draws in room temperature air from the interval 5. At this time, the air drawn in is room temperature air (relative to the air passing through the heat dissipation fins 4, room temperature air is cold air), rather than the hot air flow after heat exchange with the heat source I. This can improve the heat exchange effect on the heat dissipation fins 4. The air jet ejected from the jet port 14 enters the flow channel 41 from the channel inlet 411, exchanges heat with the heat dissipation fins 4, and flows out from the channel outlet 412. This heat exchange on the heat dissipation fins 4 improves the heat exchange effect between the heat exchange fins 4 and the heat source I.

[0046] This invention utilizes the jet exciter 1 and the heat dissipation fins 4 arranged at intervals of 5, and provides a flow channel 41 on the heat dissipation fins 4. The interval arrangement enables the jet exciter 1 to separate blowing and suction, drawing in room temperature air at interval 5, and the jetting directly exchanges heat with the heat dissipation fins 4 through the flow channel 41, avoiding hot air circulation, directly enhancing the heat exchange efficiency between the heat dissipation fins 4 and room temperature air, and improving the heat exchange effect between the heat dissipation fins 4 and the heat source I.

[0047] The core innovation of this invention lies in the arrangement of the jet exciter 1 and the channel inlet 411 with a spacing of 5, which allows ambient temperature air to be drawn in from the outside during the intake phase, rather than from the heated airflow after heat dissipation, directly improving heat exchange efficiency. This arrangement enables the heat dissipation device to be thin, small in size, and low-noise. In contrast, existing heat dissipation devices typically require the air inlet and outlet of the airflow generating device (e.g., a fan) to be arranged opposite each other, resulting in a larger structural size and making it impossible to achieve a small-sized heat dissipation device. Furthermore, compared to conventional jet exciters in the prior art, if the jet exciter directly draws in hot air, it causes the hot air to recirculate, reducing the heat exchange temperature difference and lowering the heat dissipation efficiency.

[0048] In addition, there are also existing jet exciters that can separate suction and flow, but they are only used in the field of pumping, that is, to achieve valveless pumping by periodic blowing and suction. Essentially, they are used to achieve directional delivery of fluids, which is completely different from the heat dissipation field of this application. Moreover, the valveless pumping jet exciter needs to rely on structures such as partition plates and filters to prevent leakage and blockage. Its application scenario is significantly different from the heat dissipation requirements of electronic devices.

[0049] Furthermore, the flow channel 41 of the present invention can be enhanced with protrusions / grooves or other guiding structures that increase the heat exchange area between the jet and the flow channel 41, thereby further improving the heat exchange effect of the heat dissipation fins 4. Of course, the protrusions / grooves can also be used to form vortices, allowing them to function as vortex generators, which can improve the heat exchange effect of the heat dissipation fins 4 by shortening the length of the flow channel 41 (and thus reducing the size of the heat dissipation fins 4, ensuring a compact structure).

[0050] In one embodiment, at least one sidewall of the jet cavity of the jet actuator 1 is disposed near the heat source I;

[0051] In this embodiment, since the jet exciter 1 is relatively close to the heat source I, the heat from the heat source I will diffuse to the jet exciter 1. Therefore, the jet cavity will perform heat exchange on this part during the intake phase, which will enhance the convective heat transfer inside the jet cavity, reduce the temperature of the jet cavity, improve the heat dissipation effect, and at the same time avoid the adverse effects of heat diffusion on the jet exciter.

[0052] In another embodiment, at least one sidewall of the jet cavity of the jet actuator 1 is disposed at the heat source II;

[0053] In this embodiment, the cavity of the jet exciter 1 can exchange heat with heat source II, that is, one side wall of the cavity is the wall of heat source II, while the heat dissipation fins 4 can exchange heat with another heat source I. This allows for simultaneous heat exchange at multiple locations on the device. For mobile devices, such as mobile phones, the heat dissipation fins 4 can be placed at the CPU on the back panel of the phone to dissipate heat from the CPU, and the cavity of the jet exciter 1 can be placed near the motherboard or camera on the back panel of the phone to dissipate heat from the motherboard or camera. In this embodiment, the heat source temperature of the cavity of the jet exciter 1 is lower than the heat source temperature at the heat dissipation fins 4. At this time, the cavity of the jet exciter 1 draws in room temperature air, ensuring a good heat exchange effect. After the room temperature air exchanges heat with the cavity, it is blown into the flow channel 41 to exchange heat with the heat dissipation fins 4. Since the temperature of the air after heat exchange is still lower than the temperature of the heat dissipation fins 4, the heat exchange effect on the heat dissipation fins 4 is still guaranteed.

[0054] In one embodiment, reference Figure 3 Microgrooves 15 are provided on the sidewall of the jet cavity where it contacts heat source I or heat source II. In this embodiment, heat from heat source I or heat source II diffuses to the jet exciter 1. The microgrooves 15 structure is provided inside the jet cavity. During the intake phase, the jet flows over the microgrooves 15 structure inside the jet cavity, enhancing convective heat transfer within the jet cavity, further reducing the jet cavity temperature, improving heat dissipation, and preventing adverse effects of heat diffusion on the jet exciter 1. After the jet enhances convective heat transfer inside the jet cavity, the temperature rises slightly, but remains below the temperature of the flow channel 41. The adverse effect on the heat transfer effect of the flow channel 41 is negligible, and it still enhances the heat transfer effect on the heat dissipation fins 4. Simultaneously, the jet cavity temperature decreases, allowing some heat from heat source I to be conducted to heat source II, resulting in a redistribution of heat flow between the two heat sources, a reduction in the high-temperature area, and a slight enhancement of the heat transfer effect. (Refer to...) Figure 11 and Figure 12 .

[0055] In one embodiment, the jet exciter 1 is a synthetic dual-jet exciter, which can improve the blowing and suction efficiency. In this case, the jet cavity of the synthetic dual-jet exciter includes cavity I 11 and cavity II 12, and the synthetic dual-jet exciter also includes a piezoelectric vibrator 13. Cavities I 11 and II 12 can simultaneously dissipate heat from heat source I or heat source II, or only one of them can dissipate heat from heat source I or heat source II. Both cavity I 11 and cavity II 12 are provided with jet ports 14. Cavities I 11 and II 12 are separated by the piezoelectric vibrator 13. The piezoelectric vibrator 13, when energized, vibrates periodically, causing the air inside cavities I 11 and II 12 to be compressed / expanded, thereby causing the jet ports 14 on cavities I 11 and II 12 to alternately draw in and out.

[0056] The two jet ports 14 of the synthetic dual-jet exciter are arranged side by side along the width direction of the flow channel 41. The two jet ports 14 correspond to different positions in the width direction of the flow channel 41, thereby ensuring the overall heat exchange effect of the flow channel 41. In this embodiment, the thickness of the heat dissipation device can be made very thin, resulting in a compact structure.

[0057] In one embodiment, each jet port 14 is divided into several sub-jet ports 14a along the width direction of the flow channel 41. This arrangement allows the jet flow effects at different positions along the width direction of the flow channel 41 to be independent of each other.

[0058] In a preferred embodiment, the jet port 14 or the sub-jet port 14a is a horizontally arranged slit, which can prevent self-containment and increase the area covered by the jet.

[0059] In one embodiment, the flow channel 41 is uniformly arranged with several sub-flow channels 41a along its width. This arrangement avoids the problem of a chaotic flow field within the flow channel 41 caused by some areas having jets while others do not, thus preventing excessive jet flow resistance. Furthermore, by dividing and arranging several sub-flow channels 41a, the airflow in the width direction within the flow channel 41 can be smooth and will not interfere with each other.

[0060] Preferably, in an embodiment where each jet port 14 is divided into several sub-jet ports 14a, each jet port 14 corresponds to one or more adjacent sub-flow channels 41a, so that the airflow in each sub-flow channel 41a is smooth and the flow effect is guaranteed.

[0061] In one embodiment, the width of the flow channel 41 is greater than or equal to the width of all jet ports 14, thereby ensuring that airflow can occur at all positions in the width direction of the flow channel 41, thus ensuring the heat exchange effect.

[0062] In one embodiment, the interval 5 is set on the side of the heat dissipation fins 4 away from the heat source I. This arrangement ensures that the air drawn in from the interval 5 is at room temperature, thereby ensuring the heat exchange effect.

[0063] In one embodiment, the heat dissipation device further includes a housing 2, which is hollow inside, and the jet exciter 1 and the heat dissipation fins 4 are disposed in the hollow of the housing 2. Preferably, the housing 2 is provided with a through groove at the heat dissipation fins 4, so that the heat dissipation fins 4 can directly act on the heat source I.

[0064] A jet inlet 21 is provided on the housing 2 at intervals 5, and a jet outlet 22 is provided at the channel outlet 412. In this embodiment, by providing the housing 2, the integrity of the heat dissipation device can be ensured.

[0065] The present invention also provides a heat dissipation method using the above-mentioned heat dissipation device, comprising the following steps:

[0066] The jet exciter 1's jet port 14 alternately draws in room temperature air from the interval 5 and ejects an air jet into the channel inlet 411. After the air jet enters the flow channel 41 from the channel inlet 411 and exchanges heat with the heat dissipation fins 4, it finally flows out from the channel outlet 412.

[0067] The present invention also provides an external heat dissipation device, including a device housing 3 and the aforementioned heat dissipation device, wherein the heat dissipation device is disposed on the device housing 3. The device housing 3 is used to be disposed on a device requiring heat dissipation, for example, the device housing 3 is a mobile phone heat dissipation protective case, and the device is a mobile phone. Of course, the device requiring heat dissipation can be other electronic devices with heat dissipation needs, such as routers, tablets, power banks, etc.

[0068] The external heat dissipation device provided in this embodiment does not require any structural modifications to the device itself, and can prevent the device from being damaged or having its performance reduced by localized high temperatures.

[0069] In one embodiment, a power supply coil 6 is provided on the device housing 3. The power supply coil 6 is used to wirelessly power the jet exciter 1 through the device. In this embodiment, the device needs to be equipped with a transmitting coil, and the power supply coil 6 is used as a receiving coil. In addition, the device housing 3 is also provided with corresponding circuits, control chips, power management modules, and energy storage elements, etc., to realize wireless power supply to the jet exciter 1 through the device. The specific connection and setting relationship is prior art and will not be described in detail here. In this embodiment, the external heat dissipation device does not require an external battery, which facilitates the arrangement and installation of the external heat dissipation device.

[0070] This external heat dissipation device does not operate when the device is in a low-power operation state. When the device is in a high-power operation state, the heat dissipation device operates and adjusts the drive voltage and frequency according to the real-time power consumption of the device, achieving an optimal balance between power consumption, noise, and heat dissipation effect, and has great application potential.

[0071] Taking a case where four sub-jet ports 14a are set up as an example, refer to Figure 7 The jet velocity measured in the experiment increased approximately linearly with the operating frequency when the piezoelectric oscillator 13 was in the range of 100-500Hz.

[0072] refer to Figure 8The sound pressure level measured in the experiment of this invention is such that, when the piezoelectric vibrator 13 is in the 100-350Hz operating frequency range, the operating noise of the heat dissipation device is basically consistent with the ambient noise, making it suitable for long-term silent operation when the equipment is in a high power consumption state. Within the 350-500Hz operating frequency range, the operating noise of the heat dissipation device gradually increases, making it suitable for operation when the equipment is in an extremely high power consumption state.

[0073] refer to Figure 9 The power consumption measured in the experiment of this invention is approximately linearly increased with the operating frequency when the piezoelectric oscillator 13 is in the range of 100-500Hz.

[0074] refer to Figure 10 The temperature cloud map of the heat source I 4.4W heat dissipation device before it is turned on, as measured in the experiment of this invention.

[0075] refer to Figure 11 The temperature cloud map of the 4.4W heat dissipation device I, measured in the experiment of this invention, after running for 650 seconds shows that the heat dissipation device operates with an average power consumption of 189mW and a working noise of 45dB. After running for 200 seconds, the temperature of heat source I decreased by approximately 6°C. The cooling effect is significant.

[0076] Taking four sub-jet ports 14a as an example, the bottom wall of the jet cavity of the jet exciter 1 is located near the heat source I, and a micro-groove 15 is provided in the jet cavity;

[0077] refer to Figure 11 and Figure 12 The temperature of cavity II 12 of the synthetic dual-jet exciter is lower than that without microgrooves, while the temperature of heat dissipation fins 4 is basically the same as that without microgrooves, meaning that the heat dissipation effect of heat dissipation fins 4 remains consistent. This is mainly because of the microgrooves 15; during the intake phase, the jet flows over the microgrooves 15 structure inside the jet cavity, enhancing convective heat transfer within the jet cavity. After the jet enhances convective heat transfer inside the jet cavity, the temperature rises slightly, but it is still lower than the temperature of the flow channel 41. The adverse effect on the heat transfer effect of the flow channel 41 is negligible, and it still enhances the heat transfer effect of heat dissipation fins 4. At the same time, the jet cavity temperature decreases, and some of the heat from heat source I can be conducted to heat source II, causing a redistribution of the heat flow distribution between the two heat sources, reducing the area of ​​the high-temperature region, and slightly enhancing the heat transfer effect.

[0078] The above description is merely an embodiment and does not constitute any limitation on the present invention. Any person skilled in the art can make many possible variations, modifications, or alterations to the technical solutions of the present invention without departing from the scope of the present invention. Therefore, any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present invention, without departing from the scope of the present invention, should fall within the protection scope of the present invention.

Claims

1. A heat dissipating device, characterized by, The heat dissipation device comprises a jet flow exciter (1) and a heat dissipation fin (4); The heat dissipation fin (4) is arranged at the heat source I, and a flow passage (41) is arranged on the heat dissipation fin (4), the flow passage (41) is hollow inside and penetrates through both ends; The jet flow port (14) of the jet flow exciter (1) is arranged towards the passage inlet (411) of the flow passage (41), and the jet flow port (14) is spaced apart from the passage inlet (411) of the flow passage (41) by a spacing (5), the spacing (5) is arranged on the side of the heat dissipation fin (4) away from the heat source I; Because the flow passage (41) increases the flow loss of the airflow, the jet flow port (14) of the jet flow exciter (1) inhales the air at room temperature from the spacing (5) with smaller flow resistance, the jet flow port (14) of the jet flow exciter (1) alternately inhales the air at room temperature from the spacing (5) and ejects the air jet flow towards the passage inlet (411), the ejected jet flow enters the flow passage (41) from the passage inlet (411), and the jet flow exchanges heat with the heat dissipation fin (4) and then flows out from the passage outlet (412); The jet flow exciter (1) is a synthetic double jet flow exciter; The two jet flow ports (14) of the synthetic double jet flow exciter are arranged side by side along the width direction of the flow passage (41).

2. The heat dissipating device of claim 1, wherein At least one side wall of the jet flow cavity of the jet flow exciter (1) is arranged near the heat source I. Alternatively, at least one side wall of the jet flow cavity of the jet flow exciter (1) is arranged at the heat source II.

3. The heat dissipating device of claim 2, wherein the heat dissipating device is a heat sink. The abutting side wall of the jet flow cavity and the heat source I or the heat source II is provided with a micro groove (15).

4. The heat dissipating device of claim 1, wherein the heat dissipating device is a heat sink. Each jet flow port (14) is divided into a plurality of sub jet flow ports (14a) along the width direction of the flow passage (41).

5. The heat dissipating device according to any one of claims 1 to 4, wherein The flow passage (41) is uniformly arranged with a plurality of sub flow passages (41a) along the width direction.

6. The heat dissipating device according to any one of claims 1 to 4, wherein The heat dissipation device further comprises a shell (2), the shell (2) is hollow inside, and the jet flow exciter (1) and the heat dissipation fin (4) are arranged in the hollow of the shell (2); The shell (2) is provided with a jet flow inlet (21) at the spacing (5) and a jet flow outlet (22) at the passage outlet (412).

7. A heat dissipation method characterized by, The heat dissipation device according to any one of claims 1-6 is used, and the use comprises the following steps: The jet flow port (14) of the jet flow exciter (1) alternately inhales the air at room temperature from the spacing (5) and ejects the air jet flow towards the passage inlet (411), the air jet flow enters the flow passage (41) from the passage inlet (411), exchanges heat with the heat dissipation fin (4), and finally flows out from the passage outlet (412).

8. An external heat dissipating device, characterized by, The heat dissipation device according to any one of claims 1-6 is arranged on the equipment shell (3).

9. The heat dissipating device according to claim 8, wherein The equipment shell (3) is provided with a power supply coil (6) for wirelessly supplying power to the jet flow exciter (1) through the equipment.

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