Mini-led backboard structure realized through temporary bonding and de-bonding technology and technology

Abstract

The invention relates to the field of LED backplane processing, and discloses a mini-LED backplane structure and process realized through a temporary bonding and de-bonding process, and the process comprises the following steps: S1, firstly, manufacturing a required glass substrate; s2, manufacturing a layer of metal film on the surface of the glass substrate through PVD (Physical Vapor Deposition), electroplating, evaporation and other coating processes, and then manufacturing a metal wiring layer; s3, preparing a high-reflectivity image layer; s4, filling a bump material such as solder paste in a via hole of the high-reflectivity layer through a silk-screen printing process and the like, and processing an LED on the bump; and S5, finally, an FPCA bonding process is carried out, visual alignment fitting is carried out, and the FPCA is bent and attached to the surface of the glass substrate. According to the backboard, the glass substrate is adopted as the glass substrate, the heat dissipation effect of the backboard can be achieved, the strength of the backboard can be improved, the defects of a traditional PCB backboard are overcome, and the light efficiency utilization rate of the backboard is improved through the high-reflection white ink layer printed through the silk screen.

Description

Technical Field

[0001] The present invention relates to the field of LED backplane processing, and specifically to a mini-LED backplane structure and process realized through temporary bonding and debonding processes. Background Art

[0002] Mini-LED has advantages over large-size TFT-LCDs in terms of display effect and cost, and is an LED device with a chip size between 50 and 200 μm. A unit composed of a MiniLED pixel array and a driving circuit with a pixel center pitch of 0.3 to 1.5 mm.

[0003] However, traditional mini-LEDs use PCBs as backplanes, and the light efficiency utilization of the backplanes is not high, and their hardness, heat resistance, and heat dissipation are poor, which cannot meet the development trend of new mini-LED substrates. Moreover, with the increase in mini-LED partitions and the decrease in LED pitch, their heat dissipation and warping have become constraints for mini-LEDs. Therefore, it is necessary to design a mini-LED backplane structure and process realized through temporary bonding and debonding processes. Summary of the Invention

[0004] The purpose of the present invention is to provide a mini-LED backplane structure and process realized through temporary bonding and debonding processes to solve the problems in the prior art.

[0005] The purpose of the present invention can be achieved through the following technical solutions:

[0006] A mini-LED backplane structure and process realized through temporary bonding and debonding processes, the mini-LED backplane structure includes a glass substrate, an FPCA is fixedly arranged on one side of the glass substrate, a metal wiring layer is fixedly arranged on one side of the glass substrate, and a highly reflective white ink for improving backlight utilization is fixedly arranged on the metal wiring layer;

[0007] A bump is fixedly arranged on the metal wiring layer, an LED for emitting light is fixedly arranged on the bump, and multiple LEDs are arranged in an array on the highly reflective white ink.

[0008] Further, the metal wiring layer is located on the front side of the glass substrate, the FPCA is wrapped around the side of the glass substrate, and a driving IC and components are fixedly arranged on the outside of the FPCA, and the driving IC and components are located on the back side of the glass substrate.

[0009] Further, the highly reflective white ink is located on one side of the FPCA.

[0010] A mini-LED backplane structure and process realized through temporary bonding and debonding processes, the process includes the following steps:

[0011] S1. First, fabricate the required glass substrate;

[0012] S2. Through coating processes such as PVD, electroplating, and evaporation, deposit a metal thin film on the surface of the glass substrate, and then fabricate a metal wiring layer;

[0013] S3. Then, prepare a high-reflection coating layer;

[0014] S4. Then, through processes such as screen printing, fill bump materials such as solder paste at the vias of the high-reflection coating layer, and mount the LED on the bump;

[0015] S5. Finally, perform the FPCA bonding process, conduct visual alignment and bonding, and bend and attach the FPCA to the surface of the glass substrate.

[0016] Furthermore, the metal thin film is a single-layer or multi-layer structure with a thickness of 100 nm to 1 μm.

[0017] Furthermore, the material of the metal thin film is one of Al, Cu, Ti, and Ag.

[0018] Furthermore, the preparation method of the metal wiring layer is coating, exposure, development, etching, and stripping.

[0019] Furthermore, the metal wiring layer fabricates a patterned metal layer on the surface of the glass substrate through processes such as printing.

[0020] Furthermore, in step S3, a mixed high-reflection coating layer is printed on the surface through processes such as screen printing.

[0021] Furthermore, the material of the high-reflection coating layer in step S3 is TiO2, and the thickness is 0.5 μm to 10 μm.

[0022] Advantages of the present invention:

[0023] 1. The mini-LED backplane structure and process realized by the present invention through the temporary bonding and debonding processes use a glass substrate as the glass substrate for the backplane, which can solve the heat dissipation effect of the backplane, improve the strength of the backplane, overcome the disadvantages of traditional PCB backplanes, and at the same time, a high-reflection coating layer is processed on the backplane, eliminating the need for additional processing of reflective film materials on the backplane and simplifying the structure of the backplane;

[0024] 2. The mini-LED backplane structure and process realized by the present invention through the temporary bonding and debonding processes are processed by screen printing to form a reflective layer, and a high-reflection white ink layer is processed on the backplane, improving the light efficiency utilization rate of the backplane and enhancing the light effect. Description of the Drawings

[0025] The present invention will be further described below with reference to the accompanying drawings.

[0026] Figure 1 It is a schematic structural diagram of the backplane structure of the present invention;

[0027] Figure 2 It is a schematic process diagram of the backplane of the present invention;

[0028] Figure 3 It is a schematic process diagram of the backplane of the present invention;

[0029] Figure 4 It is a schematic process flow diagram of the present invention.

[0030] The description of the reference numerals in the drawings is as follows:

[0031] 1: Glass substrate; 2: Metal wiring layer; 3: High-reflective white ink; 4: Bump; 5: LED; 6: FPCA; 7: Driver IC and components. Specific embodiments

[0032] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0033] The mini-LED backplane structure and process implemented through the temporary bonding and debonding process are as Figure 1 shown. The mini-LED backplane structure includes a glass substrate 1. On one side of the glass substrate 1, an FPCA 6 is fixedly provided. The FPCA component is a flexible printed circuit board component, which is a highly integrated and bendable circuit structure in the field of electronic manufacturing. On one side of the glass substrate 1, a metal wiring layer 2 is fixedly provided. The metal wiring layer 2 is located on the front surface of the glass substrate 1, and a high-reflective white ink 3 is fixedly provided on the metal wiring layer 2. Since the glass substrate is a transparent material, the light efficiency utilization rate of the mini-LED on the traditional glass substrate is low, and the high-reflective white ink 3 is added to improve the light efficiency utilization rate.

[0034] The FPCA 6 wraps around the side of the glass substrate 1 and has a U-shaped structure. It is attached to the outside of the glass substrate 1 by using the characteristics of the flexible printed circuit board. On the outside of the FPCA 6, a driver IC and components 7 are fixedly provided. The driver IC and components 7 are located on the back surface of the glass substrate 1 and have elements such as transistors, resistors, capacitors, and inductors required in the circuit and wiring interconnected together. They are fabricated on a semiconductor wafer or dielectric substrate and then encapsulated in a package to form a micro-structure with the required circuit functions.

[0035] The highly reflective white ink 3 is located on one side of the FPCA 6. A bump 4 is fixedly provided on the metal wiring layer 2, and an LED 5 is fixedly provided on the bump 4. A plurality of LEDs 5 are arranged in an array on the highly reflective white ink 3 to emit light and generate a light source on the glass substrate.

[0036] MiniLED is an LED device with a chip size between 50 and 200 μm, consisting of a MiniLED pixel array and a driving circuit, and the pixel center pitch is 0.3 - 1.5 mm. Due to its advantages of power saving, long life, high brightness, and high contrast, MiniLED makes MiniLED displays feasible. Because glass has strong hardness, heat resistance, and heat dissipation, it replaces the traditional PCB backplane. With the increase of mini-LED partitions and the decrease of LED pitch, its heat dissipation and warping have become bottlenecks restricting the development of mini-LED technology. The problems of traditional LEDs are improved through the glass substrate.

[0037] As Figures 2 - 4 shown, the process includes the following steps:

[0038] S1. First, produce the required glass substrate 1.

[0039] S2. Through coating processes such as PVD, electroplating, and evaporation, deposit a single or multi-layer metal film of Al, Cu, Ti, Ag, etc. with a thickness of 100 nm - 1 μm on the surface of the glass substrate 1, and then fabricate the metal wiring layer 2 through coating, exposure, development, etching, and stripping, or fabricate the patterned metal wiring layer 2 on the surface through printing and other processes.

[0040] S3. Then, print a TiO2 mixed highly reflective coating layer on the surface through screen printing and other processes, with a thickness of 0.5 μm - 10 μm.

[0041] S4. Then, fill bump materials such as solder paste at the vias of the highly reflective coating layer through screen printing and other processes, and process the LED 5 on the bump 4.

[0042] S5. Finally, perform the FPCA bonding process, perform visual alignment and bonding, and bend and attach the FPCA to the surface of the glass substrate 1.

[0043] Process effect:

[0044] Mainly, an additional highly reflective coating material is processed on the metal wiring layer 2 on the glass substrate 1, and the highly reflective coating material is fabricated on the surface of the glass substrate through screen printing and other processes to improve the backlight efficiency;

[0045] It can improve the utilization efficiency of the backlight on the surface of the glass substrate, and at the same time simplify the backlight structure, eliminating the need for additional assembly of reflective film materials and simplifying the production and processing operations of the mini-LED backplane.

[0046] The foregoing has shown and described the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments, and what is described in the above embodiments and the specification is only to illustrate the principle of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements fall within the scope of the present invention claimed.

Claims

1. A mini-LED backplane structure and process achieved through a temporary bonding and debonding process, characterized in that, The mini-LED backplane structure includes a glass substrate (1). On one side of the glass substrate (1), an FPCA (6) is fixedly arranged. On one side of the glass substrate (1), a metal wiring layer (2) is fixedly arranged. On the metal wiring layer (2), a highly reflective white ink (3) for improving the backlight utilization rate is fixedly arranged; On the metal wiring layer (2), a bump (4) is fixedly arranged. On the bump (4), an LED (5) for emitting light is fixedly arranged. Multiple LEDs (5) are arranged in an array on the highly reflective white ink (3).

2. The mini-LED backplane structure and process achieved through the temporary bonding and debonding process according to claim 1, characterized in that, The metal wiring layer (2) is located on the front side of the glass substrate (1). The FPCA (6) is wrapped around the side of the glass substrate (1). On the outside of the FPCA (6), a driving IC and components (7) are fixedly arranged. The driving IC and components (7) are located on the back side of the glass substrate (1).

3. The mini-LED backplane structure and process achieved by the temporary bonding and debonding process according to claim 1, characterized in that, The highly reflective white ink (3) is located on one side of the FPCA (6).

4. The mini-LED backplane structure and process achieved by the temporary bonding and debonding process according to claim 2, characterized in that, The process includes the following steps: S1. First, produce the required glass substrate (1); S2. Through coating processes such as PVD, electroplating, and evaporation, deposit a metal thin film on the surface of the glass substrate (1), and then produce the metal wiring layer (2); S3. Then prepare a high-reflection layer; S4. Then, through processes such as screen printing, fill bump materials such as solder paste at the vias of the high-reflection layer, and process the LED (5) on the bump (4); S5. Finally, perform the FPCA bonding process, conduct visual alignment and bonding, and bend and attach the FPCA to the surface of the glass substrate (1).

5. The mini-LED backplane structure and process achieved by the temporary bonding and debonding process according to claim 4, characterized in that, The metal thin film is a single-layer or multi-layer structure with a thickness of 100 nm to 1 μm.

6. The mini-LED backplane structure and process achieved by the temporary bonding and debonding process according to claim 5, characterized in that, The material of the metal thin film is one of Al, Cu, Ti, and Ag.

7. The mini-LED backplane structure and process achieved through the temporary bonding and debonding process according to claim 4, characterized in that, The preparation method of the metal wiring layer (2) is coating, exposure, development, etching, and stripping.

8. The mini-LED backplane structure and process achieved by the temporary bonding and debonding process according to claim 4, characterized in that, The metal wiring layer (2) produces a patterned metal layer on the surface of the glass substrate (1) through processes such as printing.

9. The mini-LED backplane structure and process achieved by the temporary bonding and debonding process according to claim 4, characterized in that, In S3, a mixed high-reflection layer is printed on the surface through processes such as screen printing.

10. The mini-LED backplane structure and process achieved through the temporary bonding and debonding process according to claim 9, characterized in that, In S3, the material of the high-reflection layer is TiO2, and the thickness is 0.5 μm to 10 μm.

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