Infrared miniature LED for tail lamp

Abstract

The invention discloses a vehicle tail lamp based on a micro LED. The micro-LEDs may be arranged in the panel at a density to generate light of the same or similar intensity as existing taillight designs or to meet legal requirements. These micro LED taillights may implement cheaper, more energy efficient, smaller, and / or more customizable taillights. The tail lamp comprises infrared micro LEDs, and the infrared micro LEDs can generate heat and facilitate deicing or defrosting of the tail lamp.

Description

[0001] Background Art and Technical Field

[0002] The present disclosure generally relates to micro-LEDs and their use in automotive applications.

[0003] Due to the brightness required for vehicle taillights, they typically occupy a large volume at the front of the vehicle.

[0004] Taillights can be expensive, especially on larger vehicles or vehicles with computerized taillight controls.

[0005] In cold and / or snowy weather, taillights can ice or frost over, reducing their visibility, which increases the risk for following drivers and can lead to collisions with the vehicle.

[0006] There are de-icing and defrosting systems, but they can be bulky, expensive, and difficult to install if the vehicle does not have them built in. Summary of the Invention

[0007] The present invention relates to a method of operating a vehicle taillight using micro-LEDs and infrared illumination, the method comprising: having a micro-LED panel including a plurality of micro-LEDs, at least one of the plurality of micro-LEDs being capable of emitting infrared illumination; having a substrate to which a micro-LED patch is bonded; and having a connector that allows the electronics of the micro-LED panel to be integrated with the vehicle, wherein the micro-LED panel performs the function of a vehicle taillight, and wherein further, the micro-LED capable of emitting infrared illumination is used to heat the taillight. Brief Description of the Drawings

[0008] FIG. 1: Illustrates the integration of transferred micro-devices and electro-optic thin film devices in a hybrid structure according to an embodiment.

[0009] FIG. 2: Illustrates a micro-LED segment of a taillight having infrared (IR) micro-LEDs according to an embodiment.

[0010] FIG. 3: Illustrates a flat micro-LED panel for a taillight having IR micro-LEDs according to an embodiment.

[0011] FIG. 4: Illustrates three segments of the same taillight or three taillights having a micro-LED panel according to an embodiment.

[0012] FIG. 5: Illustrates a micro-LED segment of a taillight having infrared (IR) micro-LEDs according to an embodiment. Detailed Description

[0013] Embodiments of the present disclosure will be described more fully hereinafter with reference to the accompanying drawings, in which like reference numerals throughout several views represent like elements, and example embodiments are shown in the drawings. However, the embodiments of the claims may be implemented in many different forms and should not be construed as limited to the embodiments set forth herein. The examples set forth herein are non-limiting examples and are merely examples among other possible examples.

[0014] Figure 1A An example of integrating a transfer microdevice 106 and an electro-optic thin film device 112 in a hybrid structure is shown. This is an example of an integrated micro-LED tile that is later picked up and placed in a tile array. It should be apparent to those skilled in the art that there are many ways to create micro-LED tiles and integrate them in a tile array, such as US20160218143A1 - Microdevice integration into systemsubstrate. In multiple hybrid structure embodiments, a receiver substrate 102 and contact pads 104 onto which an array of microdevices 106 is transferred and into which a thin film electro-optic device is integrated. The microdevices 106 can be transferred and bonded to the bonding pads 104 of the receiver substrate 100. In one case, a dielectric layer 108 is formed over the substrate 102 to cover the exposed electrodes and conductive layers. The dielectric layer 108 can be patterned using photolithography and etching. Then a conductive layer 110 is deposited and patterned to form the bottom electrode of the thin film electro-optic device 112. If there is no risk of unwanted coupling between the bottom electrode 110 and other conductive layers in the receiver substrate, the dielectric layer 108 can be eliminated. However, this dielectric layer can also be used as a planarization layer to provide better fabrication of the electro-optic device 112. A dam layer 114 is deposited on the substrate 102 to cover the edges of the electrodes 110 and the microdevices 106. Then a thin film electro-optic device 112 is formed over this structure. An organic LED (OLED) device is an example of a thin film electro-optic device that can be formed using different techniques, including but not limited to shadow masking, photolithography, and printing patterning. Finally, a top electrode 118 of the electro-optic thin film device 112 is deposited and, if needed, patterned. In embodiments where the thickness of the microdevices 106 is significantly high, fractures or other structural problems may occur within the bottom electrode 110. In these embodiments, a planarization layer may or may not be used in combination with the dielectric layer 108 to address this issue. In another embodiment, the microdevices 106 can have device electrodes 116. This electrode can be shared among other microdevices 106 in the system substrate. In this case, the planarization layer (if present) and / or the dam structure 114 cover the electrode 116 to avoid any short circuit between the electro-optic device 112 and the device electrode 116.

[0015] Figure 1B Shows a structure in which, after post-processing to deposit a common electrode and a color conversion layer, the device is shared among several pixels (or sub-pixels). Here, the micro-device 106 is not fully patterned, but the horizontal conditions are engineered such that the contacts 104 define the areas allocated to each pixel. A system substrate 102 with contact pads 104 and a donor substrate with micro-devices 106. After transferring the micro-devices 106 to the system substrate 102, post-processing can be performed, such as depositing a common electrode 120, a color conversion layer 122, a color filter, etc. However, the methods described in this disclosure and other possible methods can be used. After forming the active region, the color conversion layer as described can be added to the pixel (or sub-pixel) active region. This can provide a higher fill factor and higher performance when the active region of the pixel (or sub-pixel) is covered by a reflective layer, and avoid color leakage from side pixels (or sub-pixels). In another embodiment, the micro-devices 106 are grown on a buffer / sacrificial layer.

[0016] Figure 2A Shows a micro-LED segment of a taillight with infrared (IR) micro-LEDs. Figure 2B Is across line A - A' Figure 2A Cross-section of the micro-LED segment. Figure 2C Shows a micro-LED panel for a taillight. Figure 2D Shows for Figure 2C The housing of the micro-LED panel. Element 202 can be a micro-LED segment, which can be composed of one or more tiles containing multiple micro-LEDs. This can be Figure 2CA portion of a micro-LED panel. The micro-LED segments may include micro-LEDs capable of generating IR light. The wavelength of the IR light may be between 750 nm and 1 mm. The IR light is used to generate heat inside or near the taillight. The IR micro-LEDs may be mixed with non-IR micro-LEDs, segmented into IR micro-LED patches, or may be a setting to which all micro-LEDs can be tuned. Element 204 may be a substrate to which the micro-LED patches can be bonded. The substrate may be silicon, glass, sapphire, any other substrate known in the art, any material to which the micro-LED patches can be bonded, or any combination of these materials. The substrate may also house or be bonded to electronics connected to the micro-LEDs. These electronics may be contained within the substrate, tunnel through the substrate to reach the micro-LEDs, or use the substrate as part of the circuit. Element 206 may be a micro-LED patch composed of a plurality of micro-LEDs. Element 208 may be an IR micro-LED patch composed of a plurality of micro-LEDs. Some or all of these micro-LEDs may be capable of emitting IR light. Element 210 may be a protective layer. The protective layer may prevent environmental and / or vibration damage. The protective layer may be made of glass, epoxy, plastic, metal, other protective materials, or any combination of protective materials. The protective layer may be an airtight seal. Element 212 may be a patch panel of the micro-LED panel that can be attached or adhered to a vehicle. Element 214 may be a micro-LED panel, which may be composed of one or more patches containing a plurality of micro-LEDs. A plurality of small micro-LED patches may be integrated together into a larger flat panel. The panel may contain a certain density of micro-LEDs to produce the same light as existing taillights. The panel may use IR micro-LEDs, RGB micro-LEDs, and / or blue micro-LEDs with phosphors to obtain white light. Element 216 may be a substrate to which the micro-LED patches can be bonded. The substrate may be silicon, glass, sapphire, any other substrate known in the art, any material to which the micro-LED patches can be bonded, or any combination of these materials. The substrate may also house or be bonded to electronics connected to the micro-LEDs. These electronics may be contained within the substrate, tunnel through the substrate to reach the micro-LEDs, or use the substrate as part of the circuit. Element 218 may be a micro-LED patch composed of a plurality of micro-LEDs. Element 220 may be Figure 2C A connector that allows the electronics of the micro-LED panel to be connected to the vehicle's electronic system. This may allow the micro-LED panel to be powered and controlled by the vehicle and provide feedback information to the vehicle. Element 220 may house Figure 2CStructure of a micro-LED panel. This structure can conform to the shape of the taillights in existing or upcoming vehicle models, so they can be interchanged with non-micro-LED taillights. Element 222 can be a window that allows light from the micro-LEDs to pass through. The window can include glass, plastic, crystal, transparent or translucent materials, or any combination of these materials. The window can contain lenses or patterns that can diffuse, focus, polarize, block, redirect light from the micro-LEDs, or otherwise interact with light from the micro-LEDs. Element 224 can be Figure 2C a micro-LED panel. Element 226 can be a bracket or base that holds the micro-LED panel in place relative to the vehicle. The bracket or base can also ensure that the electrical connection between the micro-LED panel and the vehicle is not disrupted. Infrared micro-LEDs can be used to enhance the anti-icing performance of the vehicle. Because they generate heat, they can be used to melt ice on the vehicle taillights. This will help improve visibility and safety during ice and snow events.

[0017] Figure 3A Shows a flat micro-LED panel for a taillight with IR micro-LEDs. Figure 3B Shows the components of a system that automatically activates the IR micro-LEDs in the presence of ice on the taillight. Element 310 can be a micro-LED panel that can be composed of one or more tiles containing multiple micro-LEDs. Multiple small micro-LED tiles can be integrated together into a larger flat panel. The micro-LED panel can contain micro-LEDs capable of generating IR light. The wavelength of the IR light can be between 750 nm and 1 mm. The IR light is used to generate heat inside or near the taillight. The IR micro-LEDs can be mixed with non-IR micro-LEDs, segmented into IR micro-LED tiles, or can be a setting where all micro-LEDs can be tuned. Element 312 can be a substrate to which the micro-LED tiles can be bonded. The substrate can be silicon, glass, sapphire, any other substrate known in the art, any material to which the micro-LED tiles can be bonded, or any combination of these materials. The substrate can also house or be bonded to electronics connected to the micro-LEDs. These electronics can be contained within the substrate, tunnel through the substrate to reach the micro-LEDs, or use the substrate as part of a circuit. Element 314 can be a micro-LED tile composed of multiple micro-LEDs. Element 316 can be a Figure 3A connector that allows the electronics of the micro-LED panel to be connected to the vehicle's electronic system. This can allow the micro-LED panel to be powered and controlled by the vehicle and provide feedback information to the vehicle. Element 318 can be a memory unit that stores data. The data stored in the memory unit can include data from sensors and any memory required to run the ice module. Element 320 can be Figure 3AA micro-LED panel. Component 324 can be an ice module that activates IR micro-LEDs in the presence of ice. Component 326 can be a processor that operates the ice module. Component 328 can be a bus controller that handles communication between the processor, memory, sensors, and the micro-LED panel. Component 330 can be an ice detector. The ice detector can be used to identify the presence of icing conditions. Direct and indirect methods can be used to perform ice detection. The direct method can include identifying the presence of atmospheric icing conditions, such as the presence of supercooled water droplets. The indirect method can include detecting ice accumulation on the surface or changes in vehicle performance behavior to infer the presence of icing conditions. Infrared micro-LEDs can be used to enhance vehicle anti-icing performance. Since they generate heat, they can be used to melt ice on vehicle taillights. This will help improve visibility and safety during snow and ice events.

[0018] Figure 4A Shows three segments or three taillights of the same taillight with a micro-LED panel. Figure 4B Shows the components of a system that automatically activates IR micro-LEDs in the presence of ice on the taillight. Component 401 can be three separate segments of a taillight. Each segment can be used for a different purpose. For example, one segment can be used for the brake light, another segment for the turn signal light, and another segment for the night light. Component 402 can be the first segment of the taillight, which can be the brake light. Component 404 can be the second segment of the taillight, which can be the turn signal light. Component 406 can be the third segment of the taillight, which can be the night light. Component 408 can be a micro-LED panel, which can be composed of one or more tiled blocks containing multiple micro-LEDs. Multiple small micro-LED tiled blocks can be integrated together into a larger flat panel. The micro-LED panel can contain micro-LEDs capable of generating IR light. The wavelength of the IR light can be between 750 nm and 1 mm. The IR light is used to generate heat inside or near the taillight. The IR micro-LEDs can be mixed with non-IR micro-LEDs, segmented into IR micro-LED tiled blocks, or can be a setting to which all micro-LEDs can be tuned. Component 410 can be a bracket or base that holds the micro-LED panel in place relative to the vehicle. The bracket or base can also ensure that the electrical connection between the micro-LED panel and the vehicle is not damaged. Component 432 can be a system for detecting the presence of ice on one or more taillight segments and turning on the IR micro-LEDs of the iced segments. Component 434 can be Figure 3AThe micro-LED panel. Element 436 can be a memory cell that stores data. The data stored in the memory cell can include data from sensors and any memory required to operate the ice module and the segment module. Element 437 can be a processor that operates the ice module and the segment module. Element 438 can be a bus controller that handles communication between the processor, the memory, the sensors, and the micro-LED panel. Element 440 can be a segment module that determines which segments of the taillight are frozen and need to be activated by the ice module. Element 442 can be an ice detector. The ice detector can be used to identify the presence of icing conditions. Direct and indirect methods can be used to perform ice detection. The direct method can include identifying the presence of atmospheric icing conditions, such as the presence of supercooled water droplets. The indirect method can include detecting ice accumulation on a surface or changes in vehicle performance behavior to infer the presence of icing conditions. Segmenting the taillight in this way reduces the number of IR micro-LEDs that need to be activated to de-ice or defrost the taillight.

[0019] Figure 5A Shows a micro-LED segment of a taillight with infrared (IR) micro-LEDs. Figure 5B Is a cross-section along line A-A' Figure 5A Of the micro-LED segment. Figure 5C Shows a patterned taillight with embedded IR micro-LEDs. Element 502 can be a micro-LED segment, which can be composed of one or more splicing blocks containing multiple micro-LEDs. This can be Figure 2CA portion of a micro-LED panel. The micro-LED segments may include micro-LEDs capable of generating IR light. The wavelength of the IR light may be between 750 nm and 1 mm. The IR light is used to generate heat inside or near the taillight. The IR micro-LEDs may be mixed with non-IR micro-LEDs, segmented into IR micro-LED patches, or may be a setting to which all micro-LEDs can be tuned. Element 504 may be a substrate to which the micro-LED patches can be bonded. The substrate may be silicon, glass, sapphire, any other substrate known in the art, any material to which the micro-LED patches can be bonded, or any combination of these materials. The substrate may also house or be bonded to electronics connected to the micro-LEDs. These electronics may be contained within the substrate, tunnel through the substrate to reach the micro-LEDs, or use the substrate as part of a circuit. Element 506 may be an IR micro-LED patch composed of multiple micro-LEDs. Some or all of these micro-LEDs may be capable of emitting IR light. Element 508 may be a protective layer. The protective layer may prevent environmental and / or vibration damage. The protective layer may be made of glass, epoxy, plastic, metal, other protective materials, or any combination of protective materials. The protective layer may be hermetically sealed. Element 510 may be a patch panel of the micro-LED panel that can be attached or adhered to a vehicle. Element 512 may be a patterned taillight with embedded IR micro-LEDs. The IR-capable micro-LEDs may be arranged to de-ice or defrost only the taillight portion that displays the patterned taillight. Alternatively, the IR-capable micro-LEDs may be arranged such that they de-ice or defrost only the taillight portion that conveys essential information from the taillight, such as brake lights and turn signals. The taillight may prioritize these modes based on the de-icing or defrosting speed. For example, once the essential information portion of the taillight is de-iced or defrosted, the patterned portion may be de-iced or defrosted, and then the entire taillight may be de-iced or defrosted. De-icing or defrosting the taillight in this way reduces the number of IR micro-LEDs that need to be activated to de-ice or defrost the taillight. It also ensures that in cases where the system cannot de-ice or defrost the entire taillight, the heat from the IR micro-LEDs is concentrated on the most important parts.

[0020] The functions performed in the processes and methods may be implemented in a different order. Additionally, the steps and operations outlined are provided only as examples, and some of these steps and operations may be optional, combined into fewer steps and operations, or expanded into additional steps and operations without departing from the essence of the disclosed embodiments.

Claims

1. A method of operating a vehicle taillight using a micro-LED and infrared illumination, the method comprising: A micro-LED panel including a plurality of micro-LEDs, at least one of the plurality of micro-LEDs capable of emitting infrared illumination; A substrate to which a micro-LED patch is bonded; And A connector that allows the electronics of the micro-LED panel to be integrated with the vehicle, wherein the micro-LED panel performs the function of the vehicle taillight, and wherein further, the micro-LED capable of emitting infrared illumination is used to heat the taillight.

2. The method according to claim 1, wherein there is a micro-LED segment including a micro-LED capable of generating IR light.

3. The method according to claim 2, wherein the wavelength of the IR light is between 750 nm and 1 mm.

4. The method according to claim 2, wherein the IR light is used to generate heat within or near the taillight.

5. The method according to claim 2, wherein the IR micro-LEDs are mixed with non-IR micro-LEDs, segmented into IR micro-LED patches, or are a setting to which all micro-LEDs can be tuned.

6. The method according to claim 2, wherein there are micro-LED patches including a plurality of micro-LEDs.

7. The method according to claim 2, wherein there are IR micro-LED patches including a plurality of micro-LEDs, a portion or all of these micro-LEDs capable of emitting IR light.

8. The method according to claim 1, wherein the substrate is one of silicon, glass, sapphire, or any material to which a micro-LED patch is bonded, or any combination of these materials.

9. The method according to claim 1, wherein the connector allows the electronics of the panel to be connected to the vehicle's electronic system, wherein further, the electronics are contained within the substrate, tunnel through the substrate to reach the micro-LEDs, or use the substrate as part of a circuit.

10. The method according to claim 1, wherein there is a protective layer that prevents environmental and / or vibration damage, and wherein further, the protective layer is made of glass, epoxy resin, plastic, metal, or any combination of protective materials, and wherein further, the protective layer is hermetically sealed.

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