Pre-curing process of IC card chip

Abstract

The invention provides a pre-curing process of an IC card chip. The pre-curing process comprises the following steps that S1, a strip is fed into curing equipment through a feeding device to be preheated; s2, the strip preheated in the step S1 is vacuumized so that the strip can be adsorbed to a gluing table top, and then gluing of various patterns is conducted on the strip; s3, pre-curing the glued strip through an ultraviolet lamp, and checking the quality of the packaged glue and confirming the positioning of the strip through a camera; s4, the strips with qualified glue quality and strip positioning confirmation are sent into a curing oven to be subjected to ultraviolet curing; and S5, the cured strip is automatically received by a receiving device. According to the pre-curing process of the IC card chip, the problem of size inconsistency caused by fluidity of glue can be effectively solved after a double-glue-head filling process, and the stability and quality of a product are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of IC cards, and particularly relates to a pre-curing process for an IC card chip. Background Art

[0002] At present, when the chip of an IC card is encapsulated by a double-gun filling process, since the left gun is farther from the curing furnace than the right gun, when the left and right guns encapsulate simultaneously, due to the fluidity of the glue, and the strip encapsulated by the right gun will enter the curing furnace first, while the strip encapsulated by the left gun enters the curing furnace later, there will be inconsistencies in the diameter size and height of the glue encapsulated by the left and right guns after curing in the curing furnace, which affects the quality of the product. Summary of the Invention

[0003] The purpose of the present invention is to overcome the deficiencies existing in the prior art and provide a pre-curing process for an IC card chip. Pre-curing is to solve the problem that during the double-gun filling process, there is a time difference in the entry of the left and right guns into the curing furnace and the size of the package is defective due to the flow of the glue. A high-intensity ultraviolet curing lamp is directly installed on both sides of the strip after encapsulation for rapid pre-curing to prevent the flow of the glue, achieving the consistency of the sizes after encapsulation by the left and right guns, effectively solving the problem of inconsistent sizes caused by the fluidity of the glue, and improving the stability and quality of the product.

[0004] The technical solution adopted by the present invention is as follows:

[0005] A pre-curing process for an IC card chip, which includes the following steps:

[0006] Step S1. Feed the strip of the IC card chip into the curing device through a feeding device for pre-heating;

[0007] Step S2. Vacuum the strip pre-heated in Step S1 to make it adsorbed on the glue coating table, and then apply glue of various patterns on the strip;

[0008] Step S3. Pre-cure both sides of the strip after glue application with an ultraviolet lamp, and then check the quality of the glue after encapsulation through a camera and confirm the position information of the strip by capturing it through the camera for positioning;

[0009] Step S4. Feed the strip with qualified glue quality and strip positioning confirmation into the curing furnace for ultraviolet curing;

[0010] Step S5. Automatically collect the cured strip by a strip collecting device.

[0011] Preferably, in the pre-curing process for the IC card chip, in Step S1, the pre-heating temperature is 20°C to 175°C, and the time is 2 - 3 seconds.

[0012] Preferably, in the pre-curing process of the IC card chip, in step S2, the degree of vacuum during vacuum pumping is -0.020 to -0.040 MPa.

[0013] Preferably, in the pre-curing process of the IC card chip, in step S3, the power of the ultraviolet lamp during pre-curing is 25% - 100%;

[0014] Preferably, in the pre-curing process of the IC card chip, in step S4, the time of ultraviolet curing is 50S, and the curing temperature is 70°C to 175°C.

[0015] Preferably, in the pre-curing process of the IC card chip, in step S3, the inspection of the glue quality after encapsulation by the camera is specifically as follows: a preset encapsulation gray scale standard value α is set, the gray scale value d of the glue leakage encapsulation part is compared with the encapsulation gray scale standard value α, and based on the comparison result, it is judged whether the glue quality of the strip after glue application meets the requirements.

[0016] Preferably, in the pre-curing process of the IC card chip, judging whether the glue quality of the strip after glue application meets the requirements based on the comparison result includes: based on the comparison rule of the gray scale value d of the glue leakage encapsulation part and the encapsulation gray scale standard value α, according to the encapsulation gray scale standard value α, the normal range of the gray scale value d of the glue leakage encapsulation part is determined, where if d > α, that is, the glue quality of the strip after glue application does not meet the requirements; if d < α, then the glue quality of the strip after glue application meets the requirements.

[0017] Advantages of the present invention:

[0018] The pre-curing process of the IC card chip of the present invention can effectively solve the problem of inconsistent dimensions caused by the fluidity of the glue after the double-glue head filling process, improving the stability and quality of the product; the glue used for IC card glue application is an ultraviolet-sensitive curing glue, and this glue needs specific wavelength ultraviolet rays to cure the glue. However, considering that the production process cannot cure immediately after glue application, so high-intensity ultraviolet curing is added after glue application to pre-cure the glue instantly at the moment of strip feeding, effectively preventing the flow of the glue. Specific embodiments

[0019] The present invention will be further described below in conjunction with specific embodiments.

[0020] Embodiment 1

[0021] A pre-curing process of an IC card chip, the maximum diameter of the encapsulated strip is 8.50 mm, and the encapsulation height is 580 um, including the following steps:

[0022] Step S1. Feed the strip of the IC card chip into the curing equipment through the feeding device for preheating. The preheating temperature is 20°C and the time is 2 seconds;

[0023] Step S2. Vacuum the strip preheated in Step S1 to make it adsorbed on the glue coating table. The vacuum degree of vacuuming is -0.020 MPa, and then apply glue of various patterns on the strip;

[0024] Step S3. Pre-cure both sides of the strip coated with glue by ultraviolet lamps. The manufacturer of the glue is DELO Industrial Adhesives, and the model is Katiobond 4670. When pre-curing, the power of the ultraviolet lamp is 25%. Then, check the quality of the glue after encapsulation and confirm the positioning of the strip through a camera;

[0025] The specific inspection of the quality of the glue after encapsulation by the camera in Step S3 is as follows: Preset the encapsulation gray scale standard value α to 150, compare the gray scale value d at the glue leakage encapsulation part with the encapsulation gray scale standard value α, and based on the comparison result, judge whether the quality of the glue on the strip after coating meets the requirements; Based on the comparison result, judge whether the quality of the glue on the strip after coating meets the requirements, including: Compare the gray scale value d at the glue leakage encapsulation part with the encapsulation gray scale standard value 150, and according to the encapsulation gray scale standard value α, determine the normal range of the gray scale value d at the glue leakage encapsulation part. If d > 150, that is, the quality of the glue on the strip after coating does not meet the requirements; if d < 150, then the quality of the glue on the strip after coating meets the requirements;

[0026] Step S4. Feed the strip with qualified glue quality and strip positioning confirmation into the curing furnace for ultraviolet curing. The temperature of ultraviolet curing is 70°C and the time is 50S;

[0027] Step S5. Automatically collect the cured strip by the receiving device to obtain the encapsulated strip.

[0028] Example 2

[0029] A pre-curing process for an IC card chip includes the following steps:

[0030] Step S1. Feed the strip of the IC card chip into the curing equipment through the feeding device for preheating. The preheating temperature is 100°C and the time is 2 seconds;

[0031] Step S2. Vacuum the strip preheated in Step S1 to make it adsorbed on the glue coating table. The vacuum degree of vacuuming is -0.020 MPa, and then apply glue of various patterns on the strip;

[0032] Step S3. Pre-cure both sides of the strip after gluing with an ultraviolet lamp. The manufacturer of the glue is DELO Industrial Adhesives, model Katiobond 4670. The power of the ultraviolet lamp during pre-curing is 50%. Then, check the quality of the glue after encapsulation and confirm the positioning of the strip through a camera.

[0033] The specific inspection of the glue quality after encapsulation by the camera in Step S3 is as follows: Preset the encapsulation gray scale standard value α to 150, compare the gray scale value d at the glue non-encapsulation area with the encapsulation gray scale standard value α, and based on the comparison result, judge whether the glue quality of the strip after gluing meets the requirements; Judging whether the glue quality of the strip after gluing meets the requirements based on the comparison result includes: comparing the gray scale value d at the glue non-encapsulation area with the encapsulation gray scale standard value 150, and according to the encapsulation gray scale standard value 150, determine the normal range of the gray scale value d at the glue non-encapsulation area. Among them, if d > 150, that is, the glue quality of the strip after gluing does not meet the requirements; if d < 150, then the glue quality of the strip after gluing meets the requirements.

[0034] Step S4. Feed the strip with qualified glue quality and strip positioning confirmation into a curing furnace for ultraviolet curing. The temperature of ultraviolet curing is 70°C and the time is 50S.

[0035] Step S5. Automatically collect the cured strip by a receiving device to obtain the encapsulated strip.

[0036] Example 3

[0037] A pre-curing process for an IC card chip includes the following steps:

[0038] Step S1. Feed the strip of the IC card chip into a curing device through a feeding device for pre-heating. The pre-heating temperature is 175°C and the time is 2 seconds.

[0039] Step S2. Evacuate the strip pre-heated in Step S1 to make it adsorbed on the gluing tabletop. The vacuum degree of evacuation is -0.020 MPa, and then apply glue of various patterns on the strip.

[0040] Step S3. Pre-cure both sides of the strip after gluing with an ultraviolet lamp. The manufacturer of the glue is DELO Industrial Adhesives, model Katiobond 4670. The power of the ultraviolet lamp during pre-curing is 100%. Then, check the quality of the glue after encapsulation and confirm the positioning of the strip through a camera.

[0041] In step S3, the inspection of the glue quality after the camera is encapsulated is specifically as follows: The preset encapsulation gray scale standard value α is 150. The gray scale value d at the glue non-encapsulation position is compared with the encapsulation gray scale standard value α. Based on the comparison result, it is judged whether the glue quality of the strip after glue application meets the requirements. Based on the comparison result, judging whether the glue quality of the strip after glue application meets the requirements includes: comparing the gray scale value d at the glue non-encapsulation position with the encapsulation gray scale standard value 150, and determining the normal range of the gray scale value d at the glue non-encapsulation position according to the encapsulation gray scale standard value 150. If d > 150, that is, the glue quality of the strip after glue application does not meet the requirements; if d < 150, the glue quality of the strip after glue application meets the requirements.

[0042] Step S4. Feed the strip with qualified glue quality and strip positioning into a curing furnace for ultraviolet curing. The temperature and time of ultraviolet curing are 70°C and 50S.

[0043] Step S5. Automatically collect the cured strip by a receiving device to obtain the encapsulated strip.

[0044] The encapsulated diameter and encapsulated height of the strip in Example 1 are tested. The encapsulated diameter is measured by an image measuring instrument, and the encapsulated height is measured by a height sensor. The test results are shown in Table 1.

[0045] Table 1

[0046]

[0047] From the test results in Table 1, it can be concluded that increasing the pre-curing can significantly reduce the problem of excessive diameter deviation caused by the difference in the travel distance of the glue encapsulation on the left and right sides from the curing furnace, and improve the stability of the product.

[0048] Finally, it should be noted that the above specific embodiments are only used to illustrate the technical solutions of the present invention and are not restrictive. Although the present invention has been described in detail with reference to the examples, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present invention, and they should all be covered by the scope of the claims of the present invention.

Claims

1. A pre-curing process for an IC card chip, characterized in that, Including the following steps: Step S1. Feed the strip of the IC card chip into the curing equipment through the feeding device for preheating; Step S2. Vacuum the strip preheated in Step S1 to make it adsorbed on the gluing tabletop, and then apply glue of various patterns on the strip; Step S3. Pre-cure both sides of the glued strip with an ultraviolet lamp, and then check the quality of the glue after encapsulation and confirm the positioning of the strip through a camera; Step S4. Feed the strip with qualified glue quality and strip positioning into the curing furnace for ultraviolet curing; Step S5. Automatically collect the cured strip by the strip collecting device.

2. The pre-curing process of the IC card chip according to claim 1, wherein In Step S1, the preheating temperature is 20°C to 175°C, and the time is 2 - 3 seconds.

3. The pre-curing process of the IC card chip according to claim 1, wherein In Step S2, the vacuum degree of vacuuming is -0.020 to -0.040 MPa.

4. The pre-curing process of the IC card chip according to claim 1, characterized in that, In Step S3, the power of the ultraviolet lamp during pre-curing is 25% - 100%.

5. The pre-curing process of the IC card chip according to claim 1, characterized in that, In Step S4, the time of ultraviolet curing is 50S, and the curing temperature is 70°C to 175°C.

6. The pre-curing process of the IC card chip according to claim 1, wherein In Step S3, the specific inspection of the glue quality after encapsulation by the camera is as follows: preset the encapsulation gray scale standard value α, compare the gray scale value d at the glue leakage encapsulation part with the encapsulation gray scale standard value α, and based on the comparison result, judge whether the glue quality of the glued strip meets the requirements.

7. The pre-curing process of the IC card chip according to claim 6, characterized in that Based on the comparison result, judging whether the glue quality of the glued strip meets the requirements includes: based on the comparison rule of the gray scale value d at the glue leakage encapsulation part with the encapsulation gray scale standard value α, determine the normal range of the gray scale value d at the glue leakage encapsulation part according to the encapsulation gray scale standard value α, where if d > α, that is, the glue quality of the glued strip does not meet the requirements; if d < α, then the glue quality of the glued strip meets the requirements.

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