High-efficiency temperature control system for die-casting new energy automobile structural member

Abstract

The present application relates to the technical field of metal casting, in particular to a high-efficiency temperature control system for die-casting forming of new energy automobile structural parts, comprising: screening all module structure regions based on the degree of segmentation and unification to obtain all to-be-analyzed module structure regions; obtaining the overall complexity of each to-be-analyzed module structure region according to the structural complexity and internal complexity of the to-be-analyzed module structure region; obtaining the temperature cooling coefficient of each to-be-analyzed module structure region according to the overall complexity and the internal temperature distribution of the to-be-analyzed module structure region; and controlling the temperature of each to-be-analyzed module structure region in the mold product based on the cooling coefficient. The present application improves the quality of automobile structural parts in the die-casting process.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of metal casting, in particular to a high-efficiency temperature control system for die-casting forming of a new energy automobile structural part. BACKGROUND

[0002] In the production process of a new energy automobile structural part, a die-casting process is generally used to form the structural part, and then a temperature control system is used to cool the die-cast structural part to ensure normal production. Since the die-casting structural part needs to be filled into a mold cavity in a molten state at high speed and high pressure to solidify it, the temperature of the mold is not uniform during the solidification process of the die-cast structural part due to the non-uniform cooling speed of the metal. Therefore, the temperature of different parts of the mold needs to be accurately controlled, and such a cooling treatment method can effectively reduce the deformation of the automobile structural part. When the die-cast automobile structure is cooled, the temperature of different parts of the mold cannot be controlled due to the different structural complexities of different regions of the automobile structural part, resulting in thermal stress and deformation of the automobile structural part, and thus poor die-casting quality of the automobile structural part. SUMMARY

[0003] The application provides a high-efficiency temperature control system for die-casting forming of a new energy automobile structural part to solve the existing problems.

[0004] The high-efficiency temperature control system for die-casting forming of a new energy automobile structural part adopts the following technical scheme:

[0005] Comprise the following modules:

[0006] An image acquisition module is configured to acquire infrared imaging images of the mold product at several time points during the die-casting process of the automobile structural part.

[0007] A module structure region classification module is configured to acquire several module structure regions in the infrared imaging images, acquire the segmentation uniformity of each module structure region according to the edge pixel point distribution and area change of the module structure region at different time points, and select a to-be-analyzed module structure region from the module structure region based on the segmentation uniformity.

[0008] An overall complexity acquisition module is configured to acquire several temperature clustering clusters in the to-be-analyzed module structure region, acquire the internal complexity of the to-be-analyzed module structure region by analyzing the temperature change in the different temperature clustering clusters and the internal temperature drop of the to-be-analyzed module structure region at adjacent time points, acquire the structural complexity of the to-be-analyzed module structure region according to the internal temperature difference between adjacent to-be-analyzed module structure regions, and acquire the overall complexity of the to-be-analyzed module structure region according to the structural complexity and the internal complexity.

[0009] The temperature control module is configured to obtain a temperature cooling coefficient of a module structure region to be analyzed according to the overall complexity, and perform temperature control on the module structure region to be analyzed based on the cooling coefficient.

[0010] Preferably, the method for obtaining the plurality of module structure regions in the infrared imaging image comprises the following steps:

[0011] For the infrared imaging image of the mold product at any moment, performing edge detection on the infrared imaging image, and taking a region formed by a closed edge as a module structure region.

[0012] Preferably, the method for obtaining the segmentation uniformity of each module structure region according to the edge pixel point distribution and the area change of the module structure region at different moments comprises the following steps:

[0013] obtaining the edge distribution similarity of each module structure region according to the edge pixel point distribution of the module structure region at different moments;

[0014] obtaining the area proximity degree of the vth module structure region according to the area change of the vth module structure region in the infrared imaging image of the mold product at different moments;

[0015] taking a normalized value of a product between the area proximity degree of the vth module structure region and the edge distribution similarity of the vth module structure region as the segmentation uniformity of the vth module structure region.

[0016] Preferably, the method for obtaining the edge distribution similarity of each module structure region according to the edge pixel point distribution of the module structure region at different moments comprises the following steps:

[0017] taking a sequence composed of position coordinates of all edge pixel points of the vth module structure region in the infrared imaging image of the mold product at the ith moment as an edge distribution sequence of the vth module structure region in the infrared imaging image of the mold product at the ith moment, and obtaining a DTW value between the edge distribution sequence of the vth module structure region in the infrared imaging image of the mold product at the ith moment and an edge distribution sequence of the vth module structure region in the infrared imaging image of the mold product at the (i+1)th moment by using a DTW algorithm, and taking the DTW value as an edge distribution similarity factor of the vth module structure region in the infrared imaging image of the mold product at the ith moment;

[0018] The average of the edge distribution similarity factors of the vth module structure area in the infrared imaging images of the mold products at all times is denoted as the edge distribution similarity average of the vth module structure area; the absolute value of the difference between the edge distribution similarity factor of the vth module structure area in the infrared imaging image of the mold product at the ith time and the edge distribution similarity average of the vth module structure area is denoted as the similarity difference value of the vth module structure area in the infrared imaging image of the mold product at the ith time; the inverse proportional normalized value of the similarity difference value of the vth module structure area in the infrared imaging images of the mold products at all times is denoted as the edge similarity value of the vth module structure area.

[0019] The product of the edge distribution similarity average of the vth module structure area and the edge similarity value of the vth module structure area is taken as the edge distribution similarity of the vth module structure area.

[0020] Preferably, the area proximity degree of the vth module structure area is obtained according to the area change of the vth module structure area in the infrared imaging images of the mold products at different times, and the specific method comprises:

[0021] The set composed of the position coordinates of all pixel points in the vth module structure area in the infrared imaging image of the mold product at the ith time is denoted as the position distribution set of the vth module structure area in the infrared imaging image of the mold product at the ith time; the union set of the position distribution sets of the vth module structure area in the infrared imaging images of the mold products at all times is denoted as the overall position distribution set of the vth module structure area; the intersection set of the position distribution sets of the vth module structure area in the infrared imaging images of the mold products at all times is denoted as the main position distribution set of the vth module structure area; the ratio between the number of all elements in the main position distribution set of the vth module structure area and the number of all elements in the overall position distribution set of the vth module structure area is denoted as the area proximity degree of the vth module structure area.

[0022] Preferably, the internal complexity of the module structure area to be analyzed is obtained by analyzing the internal temperature change of different temperature clustering clusters and the internal temperature drop of the module structure area to be analyzed at adjacent times, and the specific method comprises:

[0023] The internal temperature difference of each module structure area to be analyzed is obtained by analyzing the internal temperature change of different temperature clustering clusters in the module structure area to be analyzed.

[0024] The absolute value of the difference between the average of the temperature values of all pixel points in the zth to-be-analyzed module structure region in the infrared imaging image of the mold product at the ith moment and the average of the temperature values of all pixel points in the zth to-be-analyzed module structure region in the infrared imaging image of the mold product at the i+1th moment is recorded as the temperature drop difference value of the zth to-be-analyzed module structure region in the infrared imaging image of the mold product at the ith moment.

[0025] The average of the temperature drop difference values of the zth to-be-analyzed module structure region in the infrared imaging image of the mold product at all moments is recorded as the temperature drop average of the zth to-be-analyzed module structure region. The absolute value of the difference between the temperature drop difference value of the zth to-be-analyzed module structure region in the infrared imaging image of the mold product at the ith moment and the temperature drop average of the zth to-be-analyzed module structure region is recorded as the internal complexity factor of the zth to-be-analyzed module structure region in the infrared imaging image of the mold product at the ith moment.

[0026] The product of the cumulative sum of the internal complexity factors of the zth to-be-analyzed module structure region in the infrared imaging image of the mold product at all moments and the internal temperature difference of the zth to-be-analyzed module structure region is taken as the internal complexity of the zth to-be-analyzed module structure region.

[0027] Preferably, the method for obtaining the internal temperature difference of each to-be-analyzed module structure region by analyzing the internal temperature changes of different temperature clustering clusters in the to-be-analyzed module structure region comprises the following specific steps:

[0028] The average of the temperature values of all pixel points in the qth temperature clustering cluster in the zth to-be-analyzed module structure region in the infrared imaging image of the mold product at the ith moment is recorded as the temperature average of the qth temperature clustering cluster. The absolute value of the difference between the maximum of the temperature values of all pixel points in the qth temperature clustering cluster and the temperature average of the qth temperature clustering cluster is recorded as the temperature difference value of the qth temperature clustering cluster. The product of the cumulative sum of the temperature difference values of all temperature clustering clusters in the zth to-be-analyzed module structure region in the infrared imaging image of the mold product at the ith moment and the number of all temperature clustering clusters in the zth to-be-analyzed module structure region in the infrared imaging image of the mold product at the ith moment is recorded as the temperature difference factor in the zth to-be-analyzed module structure region in the infrared imaging image of the mold product at the ith moment. The average of the temperature difference factors in the zth to-be-analyzed module structure region in the infrared imaging image of the mold product at all moments is taken as the internal temperature difference of the zth to-be-analyzed module structure region.

[0029] Preferably, the method for obtaining the structural complexity of the to-be-analyzed module structure region according to the internal temperature difference between adjacent to-be-analyzed module structure regions comprises the following specific method:

[0030] all the adjacent module structure regions of the zth module structure region to be analyzed are recorded as the neighboring module structure regions of the zth module structure region to be analyzed;

[0031] the absolute value of the difference between the average temperature of all the pixel points in the zth module structure region to be analyzed and the average temperature of all the pixel points in any one of the neighboring module structure regions of the zth module structure region to be analyzed is recorded as the neighboring temperature difference of the any one of the neighboring module structure regions of the zth module structure region to be analyzed;

[0032] the normalized value of the product between the sum of the neighboring temperature differences of all the neighboring module structure regions of the zth module structure region to be analyzed and the number of all the neighboring module structure regions of the zth module structure region to be analyzed is recorded as the structure complexity of the zth module structure region to be analyzed.

[0033] Preferably, the specific method for obtaining the overall complexity of the module structure region to be analyzed according to the structure complexity and the internal complexity includes:

[0034] the normalized value of the product between the sum of 1 and the structure complexity of the zth module structure region to be analyzed is recorded as a structure complexity factor; and the normalized value of the product between the structure complexity factor and the internal complexity of the zth module structure region to be analyzed is recorded as the overall complexity of the zth module structure region to be analyzed.

[0035] Preferably, the specific method for obtaining the temperature cooling coefficient of the module structure region to be analyzed according to the overall complexity includes:

[0036] the difference between the average temperature of all the pixel points in the zth module structure region to be analyzed and the minimum temperature of all the pixel points in the zth module structure region to be analyzed is recorded as a first difference; the difference between the maximum temperature of all the pixel points in the zth module structure region to be analyzed and the minimum temperature of all the pixel points in the zth module structure region to be analyzed is recorded as a second difference; and the ratio between the first difference and the second difference is recorded as the internal high temperature degree of the zth module structure region to be analyzed.

[0037] the normalized value of the product between the sum of 1 and the overall complexity of the zth module structure region to be analyzed is recorded as a cooling factor; and the product between the internal high temperature degree of the zth module structure region to be analyzed and the cooling factor is recorded as the temperature cooling coefficient of the zth module structure region to be analyzed.

[0038] The beneficial effects of the technical scheme of the present application are: the present application screens all module structure regions based on the degree of segmentation and unification, obtains all to-be-analyzed module structure regions, obtains the overall complexity of each to-be-analyzed module structure region according to the structural complexity and internal complexity of the to-be-analyzed module structure region, obtains the temperature cooling coefficient of each to-be-analyzed module structure region according to the overall complexity and the internal temperature distribution of the to-be-analyzed module structure region, and controls the temperature of each to-be-analyzed module structure region in the mold product based on the cooling coefficient, thereby improving the quality in the die casting process of the automobile structure. BRIEF DESCRIPTION OF DRAWINGS

[0039] In order to more clearly illustrate the technical scheme in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0040] Figure 1 is a structural block diagram of the high-efficiency temperature control system for the die casting forming of the new energy automobile structure part of the present application.

[0041] Figure 2 is a feature relationship flowchart of the high-efficiency temperature control system for the die casting forming of the new energy automobile structure part of the present application. DETAILED DESCRIPTION

[0042] In order to further illustrate the technical means and effects adopted by the present application to achieve the predetermined invention purpose, the specific implementation, structure, features and effects of the high-efficiency temperature control system for the die casting forming of the new energy automobile structure part according to the present application are described in detail as follows by combining the drawings and the preferred embodiments. In the following description, different "one embodiment" or "another embodiment" do not necessarily refer to the same embodiment. In addition, the specific features, structures or characteristics in one or more embodiments can be combined in any suitable form.

[0043] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs.

[0044] The specific scheme of the high-efficiency temperature control system for the die casting forming of the new energy automobile structure part provided by the present application is specifically described below in combination with the drawings.

[0045] Please refer to Figure 1 which shows the structural block diagram of the high-efficiency temperature control system for the die casting forming of the new energy automobile structure part provided by one embodiment of the present application. The system includes the following modules:

[0046] An image acquisition module is configured to acquire infrared imaging images of the mold product at several time points in the die casting process of the automobile structural part.

[0047] It should be noted that, in the die casting process of the automobile structural part, the surface temperature of the mold has a direct impact on the quality of the structural part processed by the mold. The infrared thermal imager can monitor the temperature change of the mold surface in real time without interrupting the production process, and intuitively reflect the current process conditions, so as to realize the rapid adjustment of the mold temperature.

[0048] Specifically, first, the infrared imaging images of the mold product at several time points in the die casting process of the automobile structural part are acquired, and the specific process is as follows:

[0049] In the die casting process of the automobile structural part, every 15 seconds is a time point, and the infrared thermal imaging camera is used to shoot the automobile casting product each time to obtain the infrared imaging images of the mold product at several time points, and a total of 30 minutes of acquisition is performed.

[0050] Thus, the infrared imaging images of the mold product at several time points in the die casting process of the automobile structural part are obtained by the above method.

[0051] The module structure region classification module is configured to acquire several module structure regions in the infrared imaging image; acquire the segmentation uniformity of each module structure region according to the edge pixel point distribution and area change of the module structure region at different time points; and select a to-be-analyzed module structure region from the module structure region based on the segmentation uniformity.

[0052] It should be noted that, since there is a structure change in the mold product, and the local temperature change of the mold product is stable, the mold product can be blocked according to the temperature change in the mold product; the infrared imaging image can acquire the temperature surface distribution of the mold product, so the module with a single structure in the mold product is blocked by the temperature distribution; the single structure can be determined according to the uniformity of the temperature distribution of the current mold product; if the temperature of a certain region is relatively uniform, it indicates that the structure of the current region is relatively uniform, and if there is a temperature difference, it indicates that the current region has a structure blocking condition; at the same time, since the temperature change is relatively uniform under the same temperature control condition, the blocking effect of multiple infrared imaging images can be analyzed to determine each module of the mold product.

[0053] Preferably, in some implementations of the present invention, since the temperature of different module structural areas varies during the cooling process of automotive die-cast structural parts, while the temperature of the same module structural area is relatively uniform; in the infrared imaging image, the grayscale values ​​of pixels in the module structural area with uniform temperature are uniformly distributed; therefore, edges with temperature differences generally belong to the edges of adjacent module structural areas; the specific method for obtaining several module structural areas in the infrared imaging image of the mold product at each moment is as follows:

[0054] For an infrared image of a mold product at any given time, the Canny edge detection algorithm is used to perform edge detection on the infrared image of the mold product at that given time, resulting in an edge detection result image of the infrared image of the mold product at that given time. All closed regions formed by edges in the edge detection result image are taken as the module structure regions in the infrared image of the mold product at that given time.

[0055] The Canny edge detection algorithm is an existing technology, and will not be described in detail here.

[0056] It should be noted that after edge segmentation of the infrared imaging image of the mold product, if the current edge is the true edge of the module structure region, it means that the closed region after segmentation represents the module structure region of the mold product, and the temperature change inside the module structure region is relatively uniform. Moreover, after multiple infrared imaging images are segmented, the similarity of the edges of the module structure region will be relatively uniform, and the area of ​​the module structure region will also be relatively similar. Therefore, by combining the similarity of the edge distribution and the similarity of the area of ​​the module structure region, the degree of segmentation uniformity of each module structure region can be obtained.

[0057] Preferably, in some implementations of the present invention, the specific method for obtaining the edge distribution similarity of each module structure region based on the distribution of edge pixels of each module structure region in the infrared imaging image of the mold product at different times is as follows:

[0058] For any given moment, an infrared image of the mold product is constructed using the lower left corner pixel of the infrared image of the mold product at that moment as the origin, with the horizontal rightward direction as the positive direction of the horizontal axis and the vertical upward direction as the positive direction of the vertical axis.

[0059] The sequence of position coordinates of all edge pixel points of the vth module structure region in the infrared imaging image of the mold product at the ith moment is denoted as the edge distribution sequence of the vth module structure region in the infrared imaging image of the mold product at the ith moment; the DTW value between the edge distribution sequence of the vth module structure region in the infrared imaging image of the mold product at the ith moment and the edge distribution sequence of the vth module structure region in the infrared imaging image of the mold product at the ith+1 moment is obtained by using the DTW algorithm, and is denoted as the edge distribution similarity factor of the vth module structure region in the infrared imaging image of the mold product at the ith moment.

[0060] Among them, for any one module structure region, starting from the edge pixel point directly above the center of the module structure region, rotating clockwise for one turn to obtain the edge distribution sequence; using the existing technology optical flow method to track the target, obtaining the same module structure region in the infrared imaging image of the mold product at the adjacent moment.

[0061] The average value of the edge distribution similarity factors of the vth module structure region in the infrared imaging image of the mold product at all moments is denoted as the edge distribution similarity average value of the vth module structure region; the absolute value of the difference between the edge distribution similarity factor of the vth module structure region in the infrared imaging image of the mold product at the ith moment and the edge distribution similarity average value of the vth module structure region is denoted as the similarity difference value of the vth module structure region in the infrared imaging image of the mold product at the ith moment; the inverse proportional normalized value of the similarity difference value of the vth module structure region in the infrared imaging image of the mold product at all moments is denoted as the edge similarity value of the vth module structure region.

[0062] The product of the edge distribution similarity average value of the vth module structure region and the edge similarity value of the vth module structure region is taken as the edge distribution similarity of the vth module structure region.

[0063] The specific formula is:

[0064]

[0065] In the formula, r v represents the edge distribution similarity of the vth module structure region; dtw(l v represents the average value of the edge distribution similarity factors of the vth module structure region in the infrared imaging image of the mold product at all moments; n represents the number of infrared imaging images of the mold product at all moments; dtw(l i,v , l i+1,v) represents the DTW value between the edge distribution sequence of the vth module structure region in the infrared imaging image of the mold product at the ith moment and the edge distribution sequence of the vth module structure region in the infrared imaging image of the mold product at the i+1th moment; || represents taking the absolute value; exp() represents the exponential function with the natural constant as the base number, and the embodiment adopts the exp(-x) model to present the inverse proportional relationship and normalization processing, x is the input of the model, and the implementer can select the inverse proportional function and the normalization function according to the actual situation.

[0066] Wherein, the DTW value between two sequences is a prior art, and the embodiment will not be described in detail here.

[0067] Preferably, in some implementations of the embodiment of the application, according to the area change of each module structure region in the infrared imaging image of the mold product at different moments and the edge distribution similarity, the specific method for obtaining the segmentation uniformity of each module structure region is:

[0068] The set composed of the position coordinates of all pixel points in the vth module structure region in the infrared imaging image of the mold product at the ith moment is denoted as the position distribution set of the vth module structure region in the infrared imaging image of the mold product at the ith moment; the union set of the position distribution sets of the vth module structure region in the infrared imaging images of the mold product at all moments is denoted as the overall position distribution set of the vth module structure region; the intersection set of the position distribution sets of the vth module structure region in the infrared imaging images of the mold product at all moments is denoted as the main position distribution set of the vth module structure region; the ratio between the number of all elements in the main position distribution set of the vth module structure region and the number of all elements in the overall position distribution set of the vth module structure region is denoted as the area proximity degree of the vth module structure region;

[0069] The normalized value of the product between the area proximity degree of the vth module structure region and the edge distribution similarity of the vth module structure region is taken as the segmentation uniformity of the vth module structure region;

[0070] The specific formula is:

[0071]

[0072] In the formula, w v represents the segmentation uniformity of the vth module structure region; r v represents the edge distribution similarity of the vth module structure region; N0 v represents the number of all elements in the main position distribution sequence of the vth module structure region; N1 vrepresents the number of all elements in the overall position distribution sequence of the vth module structure region; norm() is a linear normalization function.

[0073] Preferably, in some implementations of the embodiments of the present application, all module structure regions are screened based on the uniformity of segmentation, and the specific method for obtaining all module structure regions to be analyzed is as follows:

[0074] A threshold parameter K is preset, and the present embodiment takes K=0.7 as an example for description, and the present embodiment is not limited in particular, wherein K is determined according to the specific implementation;

[0075] If the uniformity of segmentation of the vth module structure region is less than or equal to the threshold parameter K, the vth module structure region is recorded as a module structure region to be analyzed.

[0076] Thus, the module structure region to be analyzed is obtained by the above method.

[0077] The overall complexity obtaining module is configured to obtain a plurality of temperature clustering clusters in the module structure region to be analyzed; by analyzing the temperature change within different temperature clustering clusters and the temperature drop within the module structure region to be analyzed at adjacent time points, the internal complexity of the module structure region to be analyzed is obtained; according to the internal temperature difference between adjacent module structure regions to be analyzed, the structural complexity of the module structure region to be analyzed is obtained; and according to the structural complexity and the internal complexity, the overall complexity of the module structure region to be analyzed is obtained.

[0078] It should be noted that the above edge block can only distinguish the module structure regions with larger gray difference, and if the temperature difference is small, the temperature of the module structure region cannot be distinguished; meanwhile, there are some module structure regions that cannot be identified. Therefore, the present embodiment can determine the temperature complexity within the module structure region to be analyzed according to the temperature distribution and the uniformity of temperature change within the module structure region to be analyzed, and can determine the regional structural complexity of the module structure region to be analyzed according to the temperature difference between the module structure region to be analyzed and the adjacent module, and the module area, so as to obtain the overall complexity of the module structure region to be analyzed.

[0079] It should be noted that the temperature values of all pixel points in the module structure region to be analyzed are clustered by the DBSCAN clustering algorithm, and the structural complexity of the current module is determined according to the size of the block within the current module after clustering and the temperature difference within the block, wherein the more the blocks, the more the internal temperature is uneven, and the complexity of the module is larger.

[0080] Preferably, in some implementations of the embodiments of the present application, the specific method for clustering the temperature values of all the pixel points in each module structure region to be analyzed to obtain a plurality of temperature clustering clusters in each module structure region is as follows:

[0081] The temperature values of all the pixel points in the zth module structure region to be analyzed in the infrared imaging image of the mold product at the ith moment are clustered by using the DBSCAN clustering algorithm to obtain a plurality of temperature clustering clusters in the zth module structure region in the infrared imaging image of the mold product at the ith moment.

[0082] Preferably, in some implementations of the embodiments of the present application, the specific method for obtaining the internal temperature difference of each module structure region to be analyzed by analyzing the internal temperature change of different temperature clustering clusters in each module structure region to be analyzed is as follows:

[0083] The mean value of the temperature values of all the pixel points in the qth temperature clustering cluster in the zth module structure region to be analyzed in the infrared imaging image of the mold product at the ith moment is denoted as the temperature mean value of the qth temperature clustering cluster; the absolute value of the difference between the maximum value of the temperature values of all the pixel points in the qth temperature clustering cluster and the temperature mean value of the qth temperature clustering cluster is denoted as the temperature difference value of the qth temperature clustering cluster; the product of the cumulative sum of the temperature difference values of all the temperature clustering clusters in the zth module structure region to be analyzed in the infrared imaging image of the mold product at the ith moment and the number of all the temperature clustering clusters in the zth module structure region to be analyzed in the infrared imaging image of the mold product at the ith moment is denoted as the temperature difference factor in the zth module structure region to be analyzed in the infrared imaging image of the mold product at the ith moment; and the mean value of the temperature difference factors in the zth module structure region to be analyzed in the infrared imaging images of the mold product at all moments is taken as the internal temperature difference of the zth module structure region to be analyzed.

[0084] The specific formula is as follows:

[0085]

[0086] In the formula, d v represents the internal temperature difference of the zth module structure region to be analyzed; n represents the number of infrared imaging images of the mold product at all moments; M i,v represents the number of all the temperature clustering clusters in the zth module structure region to be analyzed in the infrared imaging image of the mold product at the ith moment; represents the mean value of the temperature values of all the pixel points in the qth temperature clustering cluster in the zth module structure region to be analyzed in the infrared imaging image of the mold product at the ith moment; Tmax i,v,qrepresents the maximum value of the temperature values of all pixel points in the qth temperature clustering cluster in the zth to-be-analyzed module structure region in the infrared imaging image of the mold product at the ith moment; || represents taking an absolute value.

[0087] Preferably, in some implementations of the embodiments of the present application, the more uniform the internal temperature drop of the to-be-analyzed module structure region is, the more complex the internal structure of the to-be-analyzed module structure region is, because the to-be-analyzed module structure region does not have a heat aggregation condition; according to the internal temperature drop and the internal temperature difference of each to-be-analyzed module structure region in the infrared imaging image of the mold product at adjacent moments, a specific method for obtaining the internal complexity of each to-be-analyzed module structure region is as follows:

[0088] The absolute value of the difference between the mean value of the temperature values of all pixel points in the zth to-be-analyzed module structure region in the infrared imaging image of the mold product at the ith moment and the mean value of the temperature values of all pixel points in the zth to-be-analyzed module structure region in the infrared imaging image of the mold product at the ith+1 moment is denoted as the temperature drop difference value of the zth to-be-analyzed module structure region in the infrared imaging image of the mold product at the ith moment.

[0089] The mean value of the temperature drop difference values of the zth to-be-analyzed module structure region in the infrared imaging image of the mold product at all moments is denoted as the temperature drop mean value of the zth to-be-analyzed module structure region; the absolute value of the difference between the temperature drop difference value of the zth to-be-analyzed module structure region in the infrared imaging image of the mold product at the ith moment and the temperature drop mean value of the zth to-be-analyzed module structure region is denoted as the internal complexity factor of the zth to-be-analyzed module structure region in the infrared imaging image of the mold product at the ith moment.

[0090] The product of the cumulative sum of the internal complexity factors of the zth to-be-analyzed module structure region in the infrared imaging image of the mold product at all moments and the internal temperature difference of the zth to-be-analyzed module structure region is taken as the internal complexity of the zth to-be-analyzed module structure region.

[0091] The specific formula is as follows:

[0092]

[0093] In the formula, G v represents the internal complexity of the zth to-be-analyzed module structure region; d v represents the internal temperature difference of the zth to-be-analyzed module structure region; n represents the number of infrared imaging images of the mold product at all moments; TX i,v represents the temperature drop difference value of the zth to-be-analyzed module structure region in the infrared imaging image of the mold product at the ith moment. represents the mean value of temperature drop of the zth module structure region to be analyzed; || represents taking absolute value.

[0094] It should be noted that if the module structure region to be analyzed is a fine part of the automobile structure, or the module structure region to be analyzed has a complex structure and has recesses and protrusions and the like, the temperature difference detection between the adjacent module structure region and the module structure region to be analyzed will be larger; if the module structure region to be analyzed has more module structure regions connected thereto and is larger in shape compared to other module structure regions, it indicates that the module structure region to be analyzed is a skeleton part of the automobile structure, and because it has multiple connection positions of module structure regions, its structure is more complex.

[0095] Preferably, in some implementations of the embodiments of the present application, the specific method for obtaining the structural complexity of each module structure region to be analyzed according to the internal temperature difference between each module structure region to be analyzed and the surrounding module structure region is as follows:

[0096] All adjacent module structure regions of the zth module structure region to be analyzed are obtained and are denoted as adjacent module structure regions of the zth module structure region to be analyzed;

[0097] For any one of the adjacent module structure regions of the zth module structure region to be analyzed, the absolute value of the difference between the mean value of the temperature of all pixel points in the any one of the adjacent module structure regions and the mean value of the temperature of all pixel points in the zth module structure region to be analyzed is denoted as the adjacent temperature difference of the any one of the adjacent module structure regions;

[0098] The normalized value of the product between the sum of the adjacent temperature differences of all adjacent module structure regions of the zth module structure region to be analyzed and the number of all adjacent module structure regions of the zth module structure region to be analyzed is denoted as the structural complexity of the zth module structure region to be analyzed;

[0099] The specific formula is as follows:

[0100]

[0101] In the formula, E z represents the structural complexity of the zth module structure region to be analyzed; L z represents the number of all adjacent module structure regions of the zth module structure region to be analyzed; T z,l represents the mean value of the temperature of all pixel points in the lth adjacent module structure region of the zth module structure region to be analyzed; T z represents the mean value of the temperature of all pixel points in the zth module structure region to be analyzed; norm() is a linear normalization function.

[0102] Preferably, in some implementations of the embodiments of the present application, according to the structural complexity and internal complexity of each module structure region to be analyzed, the specific formula for obtaining the overall complexity of each module structure region to be analyzed is:

[0103] Let the sum of 1 and the structural complexity of the zth module structure region to be analyzed be a structural complexity factor; let the normalized value of the product between the structural complexity factor and the internal complexity of the zth module structure region to be analyzed be the overall complexity of the zth module structure region to be analyzed.

[0104] The specific formula is:

[0105] F v = G v × (1 + E z )

[0106] In the formula, F v represents the overall complexity of the zth module structure region to be analyzed; G v represents the internal complexity of the zth module structure region to be analyzed; and E z represents the structural complexity of the zth module structure region to be analyzed.

[0107] Thus far, the overall complexity of each module structure region to be analyzed is obtained through the above method.

[0108] The temperature control module is configured to obtain a temperature cooling coefficient of the module structure region to be analyzed according to the overall complexity, and perform temperature control on the module structure region to be analyzed based on the cooling coefficient.

[0109] It should be noted that the more complex the overall complexity of the module structure region to be analyzed, the higher the possibility of heat accumulation, and thus a higher cooling coefficient is required. Since the higher the internal temperature of the module structure region to be analyzed, the faster the cooling required, the higher the cooling coefficient of the module structure region to be analyzed, the internal high-temperature degree of the module structure region to be analyzed also needs to be considered, and thus the temperature cooling coefficient of the module structure region to be analyzed is determined comprehensively.

[0110] Preferably, in some implementations of the embodiments of the present application, according to the overall complexity and the internal temperature distribution of each module structure region to be analyzed, the specific method for obtaining the temperature cooling coefficient of each module structure region to be analyzed is:

[0111] The difference between the mean value of the temperature of all pixel points in the zth to-be-analyzed module structure area and the minimum value of the temperature of all pixel points in the zth to-be-analyzed module structure area is recorded as a first difference value; the difference between the maximum value of the temperature of all pixel points in the zth to-be-analyzed module structure area and the minimum value of the temperature of all pixel points in the zth to-be-analyzed module structure area is recorded as a second difference value; the ratio between the first difference value and the second difference value is recorded as the internal high-temperature degree of the zth to-be-analyzed module structure area.

[0112] The sum of 1 and the overall complexity degree of the zth to-be-analyzed module structure area is recorded as a cooling factor; the product of the internal high-temperature degree of the zth to-be-analyzed module structure area and the cooling factor is taken as the temperature cooling coefficient of the zth to-be-analyzed module structure area.

[0113] Preferably, in some implementations of the embodiments of the present application, when the temperature control technology is used to control the temperature of each to-be-analyzed module structure area in the mold product during the die casting process of the automobile structure, the temperature cooling coefficient can be used to cool it down; wherein the temperature cooling coefficient affects the flow rate of the cooling liquid, the temperature change rate and the temperature distribution of the cooling area, and then the specific method of controlling the temperature of each to-be-analyzed module structure area in the mold product based on the cooling coefficient is:

[0114] The temperature cooling coefficients of all to-be-analyzed module structure areas are input into the temperature control system, and the temperature control system can automatically set the temperature cooling coefficients of each to-be-analyzed module structure area, thereby optimizing the temperature balance of the mold, reducing thermal stress and deformation, and improving the die casting quality of the automobile structure.

[0115] Please refer to Figure 2 which shows a feature relationship flowchart of an efficient temperature control system for new energy automobile structure die casting;

[0116] Thus, the present embodiment is completed.

[0117] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement, improvement, etc. made within the principles of the present application shall be included in the protection scope of the present application.

Claims

1. A high-efficiency temperature control system for die-casting new energy automobile structural parts, characterized in that, The system comprises the following modules: An image acquisition module, configured to acquire infrared imaging images of the mold product at several time points in the die casting process of the automobile structural member; A module structure region classification module, configured to acquire several module structure regions in the infrared imaging images; acquire a segmentation uniformity of each module structure region according to edge pixel point distribution and area change of the module structure region at different time points; and select a module structure region to be analyzed from the module structure regions based on the segmentation uniformity; An overall complexity acquisition module, configured to acquire several temperature clustering clusters in the module structure region to be analyzed; acquire an internal complexity of the module structure region to be analyzed by analyzing temperature change inside different temperature clustering clusters and internal temperature drop of the module structure region to be analyzed at adjacent time points; acquire a structural complexity of the module structure region to be analyzed according to internal temperature difference between adjacent module structure regions to be analyzed; and acquire an overall complexity of the module structure region to be analyzed according to the structural complexity and the internal complexity; A temperature control module, configured to acquire a temperature cooling coefficient of the module structure region to be analyzed according to the overall complexity; and perform temperature control on the module structure region to be analyzed based on the cooling coefficient. The method for acquiring the several module structure regions in the infrared imaging images comprises the following steps:

2. The high-efficiency temperature control system for die-casting new energy automobile structural parts according to claim 1, characterized in that, For the infrared imaging image of the mold product at any time point, edge detection is performed on the infrared imaging image, and a region formed by a closed edge is regarded as a module structure region. The method for acquiring the segmentation uniformity of each module structure region according to the edge pixel point distribution and the area change of the module structure region at different time points comprises the following steps:

3. The high-efficiency temperature control system for die-casting new energy automobile structural parts according to claim 1, characterized in that, According to the edge pixel point distribution of the module structure region at different time points, edge distribution similarity of each module structure region is acquired. According to the area change of the vth module structure region in the infrared imaging image of the mold product at different time points, area proximity of the vth module structure region is acquired. A normalized value of a product of the area proximity of the vth module structure region and the edge distribution similarity of the vth module structure region is regarded as the segmentation uniformity of the vth module structure region. The method for acquiring the edge distribution similarity of each module structure region according to the edge pixel point distribution of the module structure region at different time points comprises the following steps:

4. The high-efficiency temperature control system for die-casting new energy automobile structural parts according to claim 3, characterized in that, A sequence composed of position coordinates of all edge pixel points of the vth module structure region in the infrared imaging image of the mold product at the ith time point is regarded as an edge distribution sequence of the vth module structure region in the infrared imaging image of the mold product at the ith time point; a DTW value between the edge distribution sequence of the vth module structure region in the infrared imaging image of the mold product at the ith time point and an edge distribution sequence of the vth module structure region in the infrared imaging image of the mold product at the (i+1)th time point is acquired by using a DTW algorithm, and is regarded as an edge distribution similarity factor of the vth module structure region in the infrared imaging image of the mold product at the ith time point. ​ The mean value of the edge distribution similarity factor of the vth module structure area in the infrared imaging image of the mold product at all times is denoted as the edge distribution similarity mean value of the vth module structure area; the absolute value of the difference between the edge distribution similarity factor of the vth module structure area in the infrared imaging image of the mold product at the ith time and the edge distribution similarity mean value of the vth module structure area is denoted as the similarity difference value of the vth module structure area in the infrared imaging image of the mold product at the ith time; the inverse proportional normalized value of the similarity difference value of the vth module structure area in the infrared imaging image of the mold product at all times is denoted as the edge similarity value of the vth module structure area. The product of the edge distribution similarity mean value of the vth module structure area and the edge similarity value of the vth module structure area is taken as the edge distribution similarity of the vth module structure area.

5. The high-efficiency temperature control system for die-casting new energy automobile structural parts according to claim 3, characterized in that, The specific method for obtaining the area proximity degree of the vth module structure area according to the area change of the vth module structure area in the infrared imaging image of the mold product at different times comprises the following steps: The set composed of the position coordinates of all pixel points in the vth module structure area in the infrared imaging image of the mold product at the ith time is denoted as the position distribution set of the vth module structure area in the infrared imaging image of the mold product at the ith time; the union set of the position distribution sets of the vth module structure area in the infrared imaging images of the mold product at all times is denoted as the overall position distribution set of the vth module structure area; the intersection set of the position distribution sets of the vth module structure area in the infrared imaging images of the mold product at all times is denoted as the main position distribution set of the vth module structure area; the ratio between the number of all elements in the main position distribution set of the vth module structure area and the number of all elements in the overall position distribution set of the vth module structure area is denoted as the area proximity degree of the vth module structure area.

6. The high-efficiency temperature control system for die-casting new energy automobile structural parts according to claim 1, characterized in that, The specific method for obtaining the internal complexity of the analyzed module structure area by analyzing the internal temperature change of different temperature clustering clusters and the internal temperature drop of the analyzed module structure area at adjacent times comprises the following steps: The internal temperature difference of each analyzed module structure area is obtained by analyzing the internal temperature change of different temperature clustering clusters in the analyzed module structure area. The absolute value of the difference between the mean value of the temperature values of all pixel points in the zth analyzed module structure area in the infrared imaging image of the mold product at the ith time and the mean value of the temperature values of all pixel points in the zth analyzed module structure area in the infrared imaging image of the mold product at the ith+1 time is denoted as the temperature drop difference value of the zth analyzed module structure area in the infrared imaging image of the mold product at the ith time. The mean value of the temperature drop difference of the zth to-be-analyzed module structure region in the infrared imaging image of the mold product at all time points is denoted as the temperature drop mean value of the zth to-be-analyzed module structure region; the absolute value of the difference between the temperature drop difference of the zth to-be-analyzed module structure region in the infrared imaging image of the mold product at the ith time point and the temperature drop mean value of the zth to-be-analyzed module structure region is denoted as the internal complexity factor of the zth to-be-analyzed module structure region in the infrared imaging image of the mold product at the ith time point; The product of the cumulative sum of the internal complexity factors of the zth to-be-analyzed module structure region in the infrared imaging image of the mold product at all time points and the internal temperature difference of the zth to-be-analyzed module structure region is taken as the internal complexity of the zth to-be-analyzed module structure region.

7. The high-efficiency temperature control system for die-casting new energy automobile structural parts according to claim 6, characterized in that, The specific method for obtaining the internal temperature difference of each to-be-analyzed module structure region by analyzing the internal temperature change of different temperature clustering clusters in the to-be-analyzed module structure region comprises the following steps: The mean value of the temperature values of all pixel points in the qth temperature clustering cluster in the zth to-be-analyzed module structure region in the infrared imaging image of the mold product at the ith time point is denoted as the temperature mean value of the qth temperature clustering cluster; the absolute value of the difference between the maximum value of the temperature values of all pixel points in the qth temperature clustering cluster and the temperature mean value of the qth temperature clustering cluster is denoted as the temperature difference value of the qth temperature clustering cluster; the product of the cumulative sum of the temperature difference values of all temperature clustering clusters in the zth to-be-analyzed module structure region in the infrared imaging image of the mold product at the ith time point and the number of all temperature clustering clusters in the zth to-be-analyzed module structure region in the infrared imaging image of the mold product at the ith time point is denoted as the temperature difference factor of the zth to-be-analyzed module structure region in the infrared imaging image of the mold product at the ith time point; the mean value of the temperature difference factors of the zth to-be-analyzed module structure region in the infrared imaging image of the mold product at all time points is taken as the internal temperature difference of the zth to-be-analyzed module structure region.

8. The high-efficiency temperature control system for die-casting new energy automobile structural parts according to claim 1, characterized in that, The specific method for obtaining the structural complexity of the to-be-analyzed module structure region according to the internal temperature difference between adjacent to-be-analyzed module structure regions comprises the following steps: All adjacent module structure regions of the zth to-be-analyzed module structure region are obtained and are all denoted as adjacent module structure regions of the zth to-be-analyzed module structure region; For any one adjacent module structure region of the zth to-be-analyzed module structure region, the absolute value of the difference between the mean value of the temperatures of all pixel points in the any one adjacent module structure region and the mean value of the temperatures of all pixel points in the zth to-be-analyzed module structure region is denoted as the adjacent temperature difference value of the any one adjacent module structure region; The normalized value of the product of the cumulative sum of the adjacent temperature difference values of all adjacent module structure regions of the zth to-be-analyzed module structure region and the number of all adjacent module structure regions of the zth to-be-analyzed module structure region is denoted as the structural complexity of the zth to-be-analyzed module structure region.

9. The high-efficiency temperature control system for die-casting new energy automobile structural parts according to claim 1, characterized in that, The method for obtaining the overall complexity of the module structure region to be analyzed according to the structural complexity and the internal complexity includes the following specific steps: The sum of 1 and the structural complexity of the zth module structure region to be analyzed is denoted as a structural complexity factor; and the normalized value of the product between the structural complexity factor and the internal complexity of the zth module structure region to be analyzed is denoted as the overall complexity of the zth module structure region to be analyzed.

10. The high-efficiency temperature control system for die-casting new energy automobile structural parts according to claim 1, characterized in that, The method for obtaining the temperature cooling coefficient of the module structure region to be analyzed according to the overall complexity includes the following specific steps: The difference between the average temperature of all pixel points in the zth module structure region to be analyzed and the minimum temperature of all pixel points in the zth module structure region to be analyzed is denoted as a first difference; the difference between the maximum temperature of all pixel points in the zth module structure region to be analyzed and the minimum temperature of all pixel points in the zth module structure region to be analyzed is denoted as a second difference; and the ratio between the first difference and the second difference is denoted as the internal high-temperature degree of the zth module structure region to be analyzed; The sum of 1 and the overall complexity of the zth module structure region to be analyzed is denoted as a cooling factor; and the product between the internal high-temperature degree of the zth module structure region to be analyzed and the cooling factor is taken as the temperature cooling coefficient of the zth module structure region to be analyzed.

Images