Vehicle-mounted semiconductor air conditioning device

Abstract

The invention relates to the technical field of vehicle-mounted air conditioners, and particularly discloses a vehicle-mounted semiconductor air conditioning device which comprises a honeycomb filter screen, the honeycomb filter screen is installed in an exhaust channel in an exhaust end, the top end and the bottom end of the honeycomb filter screen are connected with a water inlet pipe and a water outlet pipe correspondingly, and a water storage cavity is formed in a box body; the water inlet pipe and the water outlet pipe extend into the water storage cavity; the cooled cold air is in contact with the honeycomb filter screen, water is pumped into the honeycomb filter screen through the water inlet pipe by the water suction pump I, so that the honeycomb filter screen is wetted, and when the cold air is in contact with the honeycomb filter screen, the temperature of the cold air is far lower than that of water infiltrating the honeycomb filter screen; in this way, water infiltrating the honeycomb filter screen can be evaporated into cold air, the absolute humidity of the cold air is increased, the comfort of the cold air entering a vehicle can be better, the situation that the skin or respiratory tract of a passenger feels dry due to the fact that the humidity of the cold air is low is effectively avoided, and the comfort of the passenger is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of vehicle air conditioners, and particularly relates to a vehicle semiconductor air conditioning device. Background Art

[0002] A vehicle semiconductor air conditioner is a device that applies semiconductor refrigeration technology to the temperature regulation inside an automobile. Based on the "Peltier effect", when direct current passes through a thermocouple composed of two different conductor materials, heat is absorbed and released at the two ends of the thermocouple respectively, thereby realizing heat transfer. By controlling the direction of the current, the refrigeration or heating function can be achieved.

[0003] The applicant has retrieved some prior arts. For example, a pollution-free semiconductor vehicle air conditioner with the patent publication number CN222346689U. Its solution is that by adding a vehicle air conditioner main body and a refrigeration and heat conduction mechanism, several groups of semiconductor refrigeration chips are connected to an external power supply by wires to perform refrigeration on the side close to the center of the outer casing, and the heat conduction fan in the refrigeration and heat conduction mechanism installed in the installation groove is started. The hot surface of the semiconductor refrigeration chip conducts heat through several groups of heat conduction holes to cool the air entering the inner cavity. The air induction fan in the cold air duct introduces the cold air into the inner side of the cold air duct, which can achieve the effect of refrigeration and no pollution. By adding a vehicle air conditioner main body, the condensed water generated by the semiconductor refrigeration chip flows down through the drainage groove into the water collection holes, and then is introduced into the main water collection pipe through the sub-water collection pipes and falls into the water tank, which is convenient for collecting the condensed water. After the applicant's analysis, the disadvantages of this technical solution are as follows: Since water droplets will condense at the cold end of the semiconductor refrigeration chip during the refrigeration process, these water droplets are the water vapor in the air. The condensed water droplets at the cold end will reduce the moisture in the air, thereby reducing the air humidity. An appropriate reduction in air humidity can improve the comfort of the air blown into the vehicle. However, during the continuous operation of the semiconductor refrigeration chip, the water vapor in the air may be excessively condensed into water droplets, which may lead to too low air humidity, possibly causing a dry feeling on the skin or respiratory tract of passengers and bringing discomfort to the passengers. Summary of the Invention

[0004] The purpose of the present invention is to provide a vehicle semiconductor air conditioning device for the deficiencies of the prior art, so as to solve the technical problem that the humidity of the refrigerated air in the prior art is too low, resulting in dry air entering the vehicle.

[0005] The purpose of the present invention can be achieved by the following technical solutions: A vehicle semiconductor air conditioning device includes an air inlet end, a box body, an air outlet end, several heat dissipation fans, heat dissipation fins and semiconductor refrigeration chips installed in the box body. The device further includes: Honeycomb filter, a honeycomb filter is installed in the exhaust passage inside the exhaust end. The top and bottom of the honeycomb filter are respectively connected with a water inlet pipe and a drain pipe. A water storage cavity is formed inside the box body. The water inlet pipe and the drain pipe both extend into the water storage cavity, and a water pump one is installed at one end of the water inlet pipe located inside the water storage cavity. The water pump one pumps water into the honeycomb filter through the water inlet pipe to make the honeycomb filter wet.

[0006] As a preference of the above technical solution, several elastic members are arranged at one side edge position of the honeycomb filter, and a space for the honeycomb filter to move is formed inside the exhaust passage.

[0007] As a preference of the above technical solution, several of the heat dissipation fans, heat dissipation fins and semiconductor refrigeration chips are divided into two groups. The heat dissipation fans, heat dissipation fins and semiconductor refrigeration chips in each group are arranged in sequence from outside to inside. The two groups of heat dissipation fans, heat dissipation fins and semiconductor refrigeration chips are symmetrically arranged, and the two groups of heat dissipation fans, heat dissipation fins and semiconductor refrigeration chips are in a V shape.

[0008] As a preference of the above technical solution, a partition plate is arranged inside the box body. The partition plate is located between the two groups of heat dissipation fans, heat dissipation fins and semiconductor refrigeration chips. Several movable guide plates are installed on one side of the partition plate close to the semiconductor refrigeration chip. A protective plate is installed on the outside of the semiconductor refrigeration chip. Several fixed guide plates are arranged on one side of the protective plate close to the partition plate. Several movable guide plates and several fixed guide plates are arranged at equal intervals and staggeredly. The movable guide plates are inclined from the air inlet end direction towards the air exhaust end direction. A through hole is formed inside the box body, and the through hole is communicated with the water storage cavity. The through hole is located below the protective plate.

[0009] As a preference of the above technical solution, two fixing rods are symmetrically arranged at the bottom of one side of the honeycomb filter close to the box body. Several groups of limiting blocks are arranged on the fixing rods. One group of limiting blocks corresponds to one movable guide plate. Each group of limiting blocks has two pieces, and the two limiting blocks are located on both sides of the movable guide plate.

[0010] As a preference of the above technical solution, two fixing pipes are symmetrically arranged at the bottom of one side of the honeycomb filter close to the box body. Several right-angle scraping plates are arranged on the periphery of the fixing pipes. The right-angle scraping plates are abutted against the bottommost edge of the bottom of the protective plate.

[0011] As a preference of the above technical solution, two fixing plugs are symmetrically arranged on one side of the air inlet end close to the box body. The fixing plugs are sleeved inside the fixing pipes. Several spray heads are arranged on the surface of the fixing pipes. The spray heads face the bottom of the protective plate on the same side as the fixing pipes.

[0012] As a preference of the above technical solution, a circulating water pipe is embedded and installed inside the heat dissipation fins. Both ends of the circulating water pipe extend into the water storage cavity, and a water pump two is installed at one end.

[0013] The beneficial effects of the present invention are as follows: 1. In the present invention, by making the cooled cold air contact with the honeycomb filter, since the water pump 1 pumps water into the honeycomb filter through the water inlet pipe, the honeycomb filter is wetted. When the cold air contacts the honeycomb filter, since the temperature of the cold air is much lower than the temperature of the water infiltrated on the honeycomb filter, the water infiltrated on the honeycomb filter will evaporate into the cold air, thereby increasing the absolute humidity of the cold air. In this way, the comfort of the cold air entering the vehicle can be improved, effectively avoiding the dryness of the passengers' skin or respiratory tract caused by the low air humidity of the cold air, and improving the comfort of the passengers. 2. In the present invention, since the honeycomb filter intercepts the cold air, the cold air has an action of hitting the honeycomb filter, so that the honeycomb filter cooperates with the elastic member to shake, so that the cold air can fully contact the honeycomb filter, thereby ensuring that the air humidity of the cold air increases and the comfort of the cold air entering the vehicle is better. 3. In the present invention, after the air enters the box body, through a plurality of alternately arranged movable guide plates and fixed guide plates, the flow path of the air in the box body is increased, and the contact time between the air and the semiconductor refrigeration sheet is increased, so that the air can better exchange heat with the semiconductor refrigeration sheet, thereby ensuring the temperature of the cold air and improving the refrigeration effect of the vehicle-mounted air conditioner; at the same time, the flow rate of the air can be slowed down, thereby further increasing the contact time between the air and the semiconductor refrigeration sheet, so that the air can better exchange heat with the semiconductor refrigeration sheet, thereby ensuring the temperature of the cold air and further improving the refrigeration effect of the vehicle-mounted air conditioner. 4. In the present invention, when the air passes through the movable guide plate, through the guidance of the movable guide plate, the air contacts the protection plate in an inclined state, so that the water droplets attached to the surface of the protection plate can be blown obliquely downward, so that the water droplets can quickly drain from the surface of the protection plate and enter the water storage cavity through the through holes. In this way, it can effectively prevent a large amount of water droplets from adhering to the surface of the protection plate and freezing, and avoid the surface of the protection plate from icing and reducing the refrigeration effect of the semiconductor refrigeration sheet. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is a schematic diagram of the overall external structure of the present invention; Figure 2 is a schematic diagram of a partial internal structure of the present invention; Figure 3 is a schematic diagram of the internal structure of the box body; Figure 4 is a schematic diagram of the structure of the circulating water pipe; Figure 5 is a schematic diagram of the structure of the honeycomb filter; Figure 6 is Figure 3 the enlarged schematic diagram of part A in Figure 7 is Figure 3 The enlarged structure diagram at position B in

[0015] In the figure: 1. Air inlet end; 2. Box body; 21. Heat exhaust window; 22. Water storage cavity; 23. Through hole; 3. Exhaust end; 4. Heat dissipation fan; 5. Heat sink; 6. Thermoelectric cooler; 7. Protection plate; 8. Honeycomb filter; 81. Elastic member; 82. Water inlet pipe; 83. Drain pipe; 84. First water pump; 9. Fixed pipe; 91. Right-angle scraper; 92. Fixed plug; 93. Nozzle; 10. Fixed rod; 101. Limit block; 11. Spacer; 12. Movable guide plate; 13. Fixed guide plate; 14. Circulating water pipe; 15. Second water pump; 16. Air inlet channel; 17. Exhaust channel. Specific embodiments

[0016] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0017] As Figures 1 - 5 shown, the in-vehicle thermoelectric air conditioner device includes an air inlet end 1, a box body 2, an exhaust end 3, a plurality of heat dissipation fans 4, heat sinks 5 and thermoelectric coolers 6 installed in the box body 2. The device further includes: A honeycomb filter 8 is installed in the exhaust channel 17 in the exhaust end 3. The top and bottom ends of the honeycomb filter 8 are respectively connected to a water inlet pipe 82 and a drain pipe 83. A water storage cavity 22 is provided in the box body 2. The water inlet pipe 82 and the drain pipe 83 both extend into the water storage cavity 22, and a first water pump 84 is installed at one end of the water inlet pipe 82 located in the water storage cavity 22. The first water pump 84 pumps water into the honeycomb filter 8 through the water inlet pipe 82 to moisten the honeycomb filter 8.

[0018] In actual application of this embodiment, the air outside the vehicle enters through the air inlet channel 16 of the air inlet end 1, and the air passes through the heat exchange of a plurality of semiconductor refrigeration sheets 6. After heat transfer, the heat in the air is absorbed by the semiconductor refrigeration sheets 6, and the air temperature is reduced. In this process, the water vapor in the air condenses into water droplets attached to the semiconductor refrigeration sheets 6, resulting in a decrease in the humidity in the air. The air continues to flow toward the exhaust channel 17 of the exhaust end 3, and the air will contact the honeycomb filter 8. Since the water pump 84 draws water into the honeycomb filter 8 through the water inlet pipe 82, the honeycomb filter 8 is moistened. When the cold air contacts the honeycomb filter 8, since the temperature of the cold air is much lower than the temperature of the water soaked on the honeycomb filter 8, the water soaked on the honeycomb filter 8 will evaporate into the cold air, thereby increasing the absolute humidity of the cold air. In this way, the comfort of the cold air entering the vehicle can be better, and the low air humidity of the cold air can be effectively avoided to cause the dryness of the passenger's skin or respiratory tract, thereby improving the comfort of the passenger. The water droplets attached to the semiconductor cooling sheet 6 can enter the water storage chamber 22, and then be supplied to the honeycomb filter 8, so that the water droplets and the water vapor in the air are circulated to ensure that the air humidity of the cold air is not too low; When the cold air contacts the honeycomb filter 8, the honeycomb filter 8 can filter the cold air and filter out dust in the cold air, thereby ensuring the air quality of the cold air entering the vehicle.

[0019] Furthermore, a plurality of elastic members 81 are disposed at one edge of the honeycomb filter 8 , and a space for the honeycomb filter 8 to move is provided in the exhaust passage 17 .

[0020] In one case of this embodiment, the elastic member 81 may be a spring, or other elastically expandable and contractible member.

[0021] In actual application of this embodiment, since the honeycomb filter 8 intercepts the cold air, the cold air has a movement of hitting the honeycomb filter 8, so that the honeycomb filter 8 and the elastic member 81 are shaken, so that the cold air can fully contact with the honeycomb filter 8, thereby ensuring that the air humidity of the cold air is increased, so that the cold air entering the car is more comfortable; When the honeycomb filter 8 is shaken, the water infiltrated in the honeycomb filter 8 can be distributed more evenly, thereby further allowing the air to fully contact the honeycomb filter 8.

[0022] like Figures 1 - 3 As shown, a number of cooling fans 4, heat sinks 5 and semiconductor cooling fins 6 are divided into two groups. The cooling fans 4, heat sinks 5 and semiconductor cooling fins 6 in each group are arranged sequentially from the outside to the inside. The two groups of cooling fans 4, heat sinks 5 and semiconductor cooling fins 6 are symmetrically arranged, and the two groups of cooling fans 4, heat sinks 5 and semiconductor cooling fins 6 are in an eight-shape.

[0023] Furthermore, a spacer 11 is provided inside the box body 2. The spacer 11 is located between two sets of heat dissipation fans 4, heat sinks 5 and semiconductor refrigeration chips 6. A number of movable guide plates 12 are installed on the side of the spacer 11 close to the semiconductor refrigeration chip 6. A protective plate 7 is installed outside the semiconductor refrigeration chip 6. A number of fixed guide plates 13 are provided on the side of the protective plate 7 close to the spacer 11. The number of movable guide plates 12 and the number of fixed guide plates 13 are arranged at equal intervals and staggered. The movable guide plate 12 is inclined from the air inlet end 1 towards the air outlet end 3. A through hole 23 is opened in the box body 2. The through hole 23 communicates with the water storage cavity 22. The through hole 23 is located below the protective plate 7.

[0024] In actual application of this embodiment, the protective plate 7 protects the semiconductor refrigeration chip 6 while ensuring the refrigeration effect of the semiconductor refrigeration chip 6, effectively avoiding damage to the semiconductor refrigeration chip 6 caused by long-term attachment of water droplets on the surface of the semiconductor refrigeration chip 6; after the air enters the box body 2, through a number of alternately arranged movable guide plates 12 and fixed guide plates 13, the flow path of the air in the box body 2 is increased, and the contact time between the air and the semiconductor refrigeration chip 6 is increased, so that the air can exchange heat with the semiconductor refrigeration chip 6 better, thereby ensuring the temperature of the cold air and improving the refrigeration effect of the vehicle-mounted air conditioner; Through a number of alternately arranged movable guide plates 12 and fixed guide plates 13, the flow rate of the air can be slowed down, thereby further increasing the contact time between the air and the semiconductor refrigeration chip 6, so that the air can exchange heat with the semiconductor refrigeration chip 6 better, thereby ensuring the temperature of the cold air and further improving the refrigeration effect of the vehicle-mounted air conditioner; When the air passes through the movable guide plate 12, through the guidance of the movable guide plate 12, the air contacts the protective plate 7 in an inclined state, so that the water droplets attached to the surface of the protective plate 7 can be blown obliquely downward, so that the water droplets can quickly drain from the surface of the protective plate 7 and enter the water storage cavity 22 through the through hole 23. This can effectively prevent a large amount of water droplets from adhering to the surface of the protective plate 7 and freezing, and prevent the surface of the protective plate 7 from icing and reducing the refrigeration effect of the semiconductor refrigeration chip 6; Quickly draining the water droplets from the surface of the protective plate 7 can ensure the water storage capacity in the water storage cavity 22, so that the honeycomb filter 8 always remains in a moist state, thereby increasing the absolute humidity of the cold air, making the comfort of the cold air entering the vehicle better, further effectively preventing the dryness of the skin or respiratory tract of passengers caused by the low air humidity of the cold air, and further improving the comfort of passengers.

[0025] Such as Figure 3 、 Figure 5 、 Figure 6 and Figure 7As shown in the figure, two fixing rods 10 are symmetrically arranged at the bottom of the side of the honeycomb filter screen 8 close to the box body 2. A number of groups of limiting blocks 101 are arranged on the fixing rods 10. One group of limiting blocks 101 corresponds to one movable guide plate 12. Each group of limiting blocks 101 has two blocks, and the two limiting blocks 101 are located on both sides of the movable guide plate 12.

[0026] In actual application of this embodiment, since the honeycomb filter screen 8 is in a shaking state, the honeycomb filter screen 8 drives the two fixing rods 10 to reciprocate, so that a number of groups of limiting blocks 101 drive a number of movable guide plates 12 to rotate reciprocally. In this way, the contact range between the air and the surface of the protection plate 7 can be enlarged. On the one hand, the cooling speed of the air can be increased. On the other hand, the contact area between the air and the surface of the protection plate 7 can be increased, so that more water droplets can be blown downward by the air during the flowing process of the air, further accelerating the discharge rate of the water droplets attached to the surface of the protection plate 7, further effectively preventing a large amount of water droplets from adhering to the surface of the protection plate 7 and freezing, and further preventing the surface of the protection plate 7 from icing and reducing the refrigeration effect of the semiconductor refrigeration sheet 6.

[0027] Furthermore, two fixing pipes 9 are symmetrically arranged at the bottom of the side of the honeycomb filter screen 8 close to the box body 2. A number of right-angle scraping plates 91 are arranged on the periphery of the fixing pipes 9, and the right-angle scraping plates 91 are abutted against the bottommost edge of the bottom of the protection plate 7.

[0028] Furthermore, two fixing plugs 92 are symmetrically arranged on the side of the air inlet end 1 close to the box body 2. The fixing plugs 92 are sleeved in the fixing pipes 9, and a number of spray heads 93 are arranged on the surface of the fixing pipes 9. The spray heads 93 face the bottom of the protection plate 7 on the same side as the fixing pipes 9.

[0029] In actual application of this embodiment, since the honeycomb filter screen 8 is in a shaking state, the honeycomb filter screen 8 drives the two fixing pipes 9 to reciprocate. During the reciprocating movement of the fixing pipes 9, a number of right-angle scraping plates 91 can reciprocally scrape the bottom of the protection plate 7, so that the downward-flowing water droplets can quickly separate from the protection plate 7 and enter the water storage cavity 22 through the through holes 23, further accelerating the discharge rate of the water droplets attached to the surface of the protection plate 7, further effectively preventing a large amount of water droplets from adhering to the surface of the protection plate 7 and freezing, and further preventing the surface of the protection plate 7 from icing and reducing the refrigeration effect of the semiconductor refrigeration sheet 6; During the reciprocating movement of the fixing pipes 9, since the position of the fixing plugs 92 remains unchanged, the fixing plugs 92 intermittently press air into the fixing pipes 9, so that the gas is ejected from the spray heads 93 and sprayed onto the bottom of the protection plate 7, thereby assisting the right-angle scraping plates 91 to make the water droplets at the bottom of the protection plate 7 fall off, and further accelerating the discharge rate of the water droplets attached to the surface of the protection plate 7.

[0030] As Figure 4As shown, a circulating water pipe 14 is embedded and installed in the heat sink 5. Both ends of the circulating water pipe 14 extend into the water storage cavity 22, and a second water pump 15 is installed at one end.

[0031] In actual application of this embodiment, the second water pump 15 pumps the water in the water storage cavity 22 to make the water flow along the circulating water pipe 14. In this way, it can cooperate with the heat dissipation of the heat sink 5 to improve the heat dissipation efficiency of the hot end of the semiconductor refrigeration sheet 6. The dissipated heat is discharged towards the hot air exhaust window 21 through the cooling fan 4, thereby reducing the heat of the hot end of the semiconductor refrigeration sheet 6, and further improving the refrigeration effect of the cold end of the semiconductor refrigeration sheet 6.

[0032] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed.

Claims

1. Vehicle-mounted semiconductor air-conditioning device, comprising an air inlet end (1), a box body (2), an air outlet end (3), a plurality of heat dissipation fans (4), heat sinks (5) and semiconductor refrigeration sheets (6) installed in the box body (2), characterized in that, The device further includes: A honeycomb filter screen (8), which is installed in the exhaust air passage (17) inside the exhaust air end (3). The top and bottom of the honeycomb filter screen (8) are respectively connected with a water inlet pipe (82) and a drain pipe (83). A water storage cavity (22) is formed in the box body (2). The water inlet pipe (82) and the drain pipe (83) both extend into the water storage cavity (22), and a first water pump (84) is installed at one end of the water inlet pipe (82) located inside the water storage cavity (22). The first water pump (84) pumps water into the honeycomb filter screen (8) through the water inlet pipe (82) to moisten the honeycomb filter screen (8).

2. The in-vehicle semiconductor air-conditioning device according to claim 1, wherein, A number of elastic members (81) are arranged at one side edge position of the honeycomb filter screen (8), and a space for the honeycomb filter screen (8) to move is formed in the exhaust air passage (17).

3. The in-vehicle semiconductor air conditioning device according to claim 2, characterized in that, The several heat dissipation fans (4), heat dissipation fins (5) and semiconductor refrigeration chips (6) are divided into two groups. The heat dissipation fans (4), heat dissipation fins (5) and semiconductor refrigeration chips (6) in each group are arranged in sequence from outside to inside. The two groups of heat dissipation fans (4), heat dissipation fins (5) and semiconductor refrigeration chips (6) are symmetrically arranged, and the two groups of heat dissipation fans (4), heat dissipation fins (5) and semiconductor refrigeration chips (6) are in a V-shape.

4. The on-vehicle semiconductor air-conditioning device according to claim 3, wherein A partition plate (11) is arranged inside the box body (2). The partition plate (11) is located between the two groups of heat dissipation fans (4), heat dissipation fins (5) and semiconductor refrigeration chips (6). A number of movable guide plates (12) are installed on one side of the partition plate (11) close to the semiconductor refrigeration chip (6). A protection plate (7) is installed outside the semiconductor refrigeration chip (6). A number of fixed guide plates (13) are arranged on one side of the protection plate (7) close to the partition plate (11). The several movable guide plates (12) and the several fixed guide plates (13) are arranged at equal intervals and staggered. The movable guide plates (12) are inclined from the direction of the air inlet end (1) towards the direction of the air exhaust end (3). A through hole (23) is formed in the box body (2), and the through hole (23) is communicated with the water storage cavity (22). The through hole (23) is located below the protection plate (7).

5. The in-vehicle semiconductor air-conditioning device according to claim 4, wherein, Two fixing rods (10) are symmetrically arranged at the bottom of the side of the honeycomb filter screen (8) close to the box body (2). A number of groups of limit blocks (101) are arranged on the fixing rods (10). One group of limit blocks (101) corresponds to one movable guide plate (12). Each group of limit blocks (101) has two pieces, and the two limit blocks (101) are located on both sides of the movable guide plate (12).

6. The in-vehicle semiconductor air-conditioning device according to claim 4, characterized in that, Two fixing pipes (9) are symmetrically arranged at the bottom of the side of the honeycomb filter screen (8) close to the box body (2). A number of right-angle scraping plates (91) are arranged on the periphery of the fixing pipes (9), and the right-angle scraping plates (91) are abutted against the lowermost edge of the bottom of the protection plate (7).

7. The in-vehicle semiconductor air conditioning device according to claim 6, characterized in that, Two fixing plugs (92) are symmetrically arranged on one side of the air inlet end (1) close to the box body (2). The fixing plugs (92) are sleeved in the fixing pipes (9). A number of spray heads (93) are arranged on the surface of the fixing pipes (9), and the spray heads (93) face the bottom of the protection plate (7) on the same side as the fixing pipes (9).

8. The in-vehicle semiconductor air-conditioning device according to claim 3, wherein A circulating water pipe (14) is embedded and installed in the heat sink (5). Both ends of the circulating water pipe (14) extend into the water storage cavity (22), and a second water pump (15) is installed at one end thereof.

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