PCB surface gold plating device

Abstract

The invention belongs to the technical field of PCB surface treatment, and particularly relates to a PCB surface gold plating device which comprises an electroplating box, a sliding rail is arranged above the electroplating box, a sliding block is slidably connected into the sliding rail, a first hydraulic cylinder is installed at the bottom end of the sliding block, and a mounting frame is arranged at the bottom end of the first hydraulic cylinder; a clamping assembly is arranged at the bottom end of the mounting frame; the clamping assembly is used for clamping and fixing a PCB; according to the PCB surface gold plating device, by arranging the positioning pieces, when the PCB is placed in the electroplating box, the positioning pieces extrude the end portions of the side faces of the PCB, the two ends of the PCB are extruded and limited by the positioning pieces, then during electroplating, due to the fact that the PCB is limited and fixed, the PCB is difficult to shake due to separated-out hydrogen, and the PCB is stabilized in electroplating liquid; and the electroplating quality reduction caused by the influence of separated hydrogen on the PCB is avoided.

Description

Technical Field

[0001] The present invention belongs to the technical field of surface treatment of PCBs, and specifically relates to a gold plating device for the surface of a PCB. Background Art

[0002] The surface treatment processes of PCB boards include: antioxidant treatment, tin spraying, lead-free tin spraying, immersion gold plating, immersion tin plating, immersion silver plating, hard gold plating, full-board gold plating, gold fingers, nickel-palladium-gold OSP, etc. Among them, the electroplating nickel-gold process has been increasingly applied because of its good corrosion resistance, excellent solderability, compatibility with various soldering fluxes, and the ability to perform multiple soldering operations.

[0003] Currently, when electroplating a PCB, it is necessary for workers to clamp and fix the PCB, then place it into a container storing the electroplating solution, and connect the power supply; then metal ions in the electroplating solution adhere to the surface of the PCB. When the electroplating is completed, it is taken out and immediately washed with warm water; then subsequent operations are carried out; however, during actual electroplating operations, the fixture clamps the PCB and immerses it in the electroplating solution. For PCBs with larger sizes and softer textures, since hydrogen gas is evolved during electroplating, causing the electroplating solution to bubble, which in turn causes the electroplating solution to drive the PCB to shake; as the PCB shakes; the copper foil on the surface of the PCB in contact with the fixture clamping is subjected to different forces, which in turn causes looseness between the copper foil and the PCB substrate, and then gaps appear, resulting in metal ions in the electroplating solution entering between the copper foil and the substrate, and then causing the phenomenon of infiltration plating; resulting in a decrease in electroplating quality; the infiltration plating phenomenon refers to the poor bonding between the electroplated layer and the substrate due to certain reasons during the electroplating process, resulting in the electroplated layer penetrating into the interior of the substrate, forming an uneven plating layer.

[0004] Therefore, the present invention provides a gold plating device for the surface of a PCB. Summary of the Invention

[0005] In order to make up for the deficiencies of the prior art and solve at least one of the technical problems proposed in the background art.

[0006] The technical solution adopted by the present invention to solve its technical problems is as follows: A gold plating device for the surface of a PCB according to the present invention includes an electroplating tank. A slide rail is provided above the electroplating tank. A slider is slidably connected inside the slide rail. A first hydraulic cylinder is installed at the bottom end of the slider. An installation frame is provided at the bottom end of the first hydraulic cylinder. A clamping assembly is provided at the bottom end of the installation frame; the clamping assembly is used for clamping and fixing the PCB. A pair of receiving frames are arranged inside the electroplating tank, and a pair of second hydraulic cylinders are arranged on both sides of the electroplating tank; the output ends of the second hydraulic cylinders penetrate into the electroplating tank and are connected to the receiving frames; a pair of receiving columns are arranged between the pair of receiving frames, grooves are formed on the opposite sides of the pair of receiving columns, positioning pieces are inserted into the grooves, and extrusion columns are inserted through the opposite sides of the pair of receiving columns, and the ends of the extrusion columns penetrate into the grooves and are connected to the positioning pieces; the electroplating position of the PCB in the electroplating tank is located between the pair of positioning pieces; an extrusion strip is arranged at one end of one of the pair of receiving frames, and a docking groove adapted to the extrusion strip is formed at the other end of the pair of receiving frames; an inclined surface is arranged at the end of the extrusion strip away from the receiving frame; when the receiving frame drives the extrusion strip to move, the inclined surface of the extrusion strip exerts extrusion on the end of the extrusion column.

[0007] Preferably, the bottom end of the receiving frame is slidably connected to the inner bottom wall of the electroplating tank, and the top end of the receiving frame is located above the top end of the electroplating tank; when the pair of receiving frames are butted against each other, the PCB clamped and fixed by the clamping assembly inside the electroplating tank is isolated from the electroplating tank; that is, when the pair of receiving frames are butted against each other, an isolation area is formed inside the electroplating tank to isolate the PCB; a liquid extraction pipe is arranged through the bottom end of the side surface of the receiving frame, and the end of the liquid extraction pipe away from the receiving frame penetrates to the outside of the electroplating tank; a first conduit is connected to the end of the liquid extraction pipe located outside the electroplating tank, a first pump body fixed to the side surface of the electroplating tank is connected to the end of the first conduit away from the liquid extraction pipe, and the output end of the first pump body penetrates into the electroplating tank; a second conduit is arranged through the side surface of the receiving frame, a third conduit is connected to the end of the second conduit located inside the isolation area, and a spray head connected to the third conduit is arranged on the side surface of the receiving frame and inside the isolation area; a second pump body connected to the second conduit is arranged on the outside of the electroplating tank.

[0008] Preferably, an isolation plate is arranged on the spraying surface of the spray head, and the top end of the isolation plate is rotatably connected to the spraying surface of the spray head.

[0009] Preferably, a pair of support shafts are arranged at both ends of the spray head, the ends of the support shafts away from the spray head penetrate to the outside of the isolation area, gears are arranged at the ends of the support shafts located outside the isolation area, racks are meshed with the side surfaces of the gears, connecting frames are arranged at the top ends of the racks, fixed frames are arranged at the ends of the connecting frames away from the racks, screws are rotatably arranged inside the fixed frames, limit columns are arranged at the bottom ends of the screws, receiving notches are formed on the side surfaces of the receiving frames, and the bottom ends of the limit columns are inserted into the inner walls of the receiving notches; a pair of fixing plates are arranged on both sides of the receiving notch, rotating columns are rotatably arranged on the side surfaces of the fixing plates, meshing rods inclined upward are arranged on the side surfaces of the rotating columns, connecting springs are arranged between the meshing rods and the fixing plates, and the ends of the meshing rods are embedded between the threads on the surfaces of the screws; magnetic blocks are arranged at the bottom ends of the fixed frames. A magnetic plate with the same magnetism is arranged below the magnetic block, and fixing rods are arranged between the magnetic plate and the inner wall of the electroplating tank; when the receiving frame does not move, the angle of the spraying surface of the nozzle is inclined upward based on the PCB.

[0010] Preferably, an isolation cover is arranged on the side surface of the receiving frame, and the isolation cover is used to isolate the gear and the rack and the screw rod from the electroplating solution inside the electroplating tank.

[0011] Preferably, a three-way valve is arranged inside the first conduit.

[0012] Preferably, a pair of adjusting plates are arranged above the receiving column, and each adjusting plate includes a vertical portion and an inclined portion at the top of the vertical portion; the distance between the vertical portions of the pair of adjusting plates is the same as the width of the PCB; a support frame is arranged between the adjusting plate and the top of the electroplating tank.

[0013] Preferably, a rotating belt is slidably arranged on the surface of the adjusting plate.

[0014] Preferably, the clamping assembly includes a clamping plate. An installation groove is formed on the side of the clamping plate away from the PCB, and a pair of third hydraulic cylinders are arranged inside the installation groove. The output ends of the third hydraulic cylinders penetrate through the clamping surface of the clamping plate; clamping blocks are arranged at the output ends of the third hydraulic cylinders, and a plurality of receiving rollers are rotatably arranged on the clamping surface of one of the pair of clamping blocks.

[0015] Preferably, a sealing plate is arranged at the notch of the installation groove.

[0016] The beneficial effects of the present invention are as follows: 1. For a PCB surface gold plating device of the present invention, by arranging positioning pieces, when the PCB is placed inside the electroplating tank, the side ends of the PCB are squeezed by the positioning pieces, and the two ends of the PCB are restricted by the squeezing of the positioning pieces. Then, during electroplating, since the PCB is restricted and fixed, the hydrogen gas evolved is difficult to cause the PCB to shake, so that the PCB is stable in the electroplating solution; it is avoided that the electroplating quality is reduced due to the influence of the evolved hydrogen gas on the PCB.

[0017] 2. For a PCB surface gold plating device of the present invention, by arranging adjusting plates; when the PCB is placed inside the electroplating tank through the clamping assembly, it is necessary for the PCB to be located in the middle position between a pair of receiving columns to ensure subsequent fixation. When the position of the PCB clamped by the clamping assembly is deviated, the PCB will also be deviated when placed inside the electroplating tank. Therefore, adjusting plates are arranged. When the clamping position of the PCB is deviated, the inclined portion of the adjusting plate receives the bottom end of the PCB, and the bottom end of the PCB is pushed horizontally and moves horizontally, and then moves between a pair of vertical portions to achieve position adjustment, which is convenient for subsequent use. Description of the Drawings

[0018] The present invention will be further described below in conjunction with the accompanying drawings.

[0019] Figure 1 is a perspective view of the present invention; Figure 2 is a schematic diagram of the electroplating tank of the present invention; Figure 3 is a schematic diagram of the internal structure of the electroplating tank of the present invention; Figure 4 is a schematic diagram of the connection structure of the receiving frame of the present invention; Figure 5 is a schematic diagram of the connection structure of the nozzle of the present invention; Figure 6 is a schematic diagram of the position of the upper isolation plate of the nozzle of the present invention; Figure 7 is a schematic diagram of the isolation plate of the present invention; Figure 8 is a top perspective view of the internal structure of the electroplating tank of the present invention; Figure 9 is a schematic diagram of the connection structure of the screw of the present invention; Figure 10 is a schematic diagram of the connection structure of the meshing rod of the present invention; Figure 11 is a schematic diagram of the positioning piece of the present invention; Figure 12 is a schematic diagram of the position of the extrusion strip on the receiving frame of the present invention; Figure 13 is a top view of the receiving frame of the present invention; Figure 14 is a schematic diagram of the position of the docking groove on the receiving frame of the present invention; Figure 15 is a perspective view of the connection structure of the adjusting plate of the present invention; Figure 16 is a schematic diagram of the clamping plate of the present invention; Figure 17 is a schematic diagram of the position of the clamping block on the clamping plate of the present invention; Figure 18 is a schematic diagram of the clamping block of the present invention.

[0020] In the figure: 1, electroplating tank; 2, slide rail; 21, first hydraulic cylinder; 22, mounting bracket; 23, clamping plate; 231, mounting groove; 232, third hydraulic cylinder; 233, clamping block; 3, receiving frame; 30, receiving notch; 31, second hydraulic cylinder; 32, extrusion bar; 33, liquid extraction pipe; 34, first conduit; 341, three-way valve; 35, first pump body; 36, second pump body; 37, second conduit; 38, third conduit; 39, spray head; 391, isolation plate; 4, receiving column; 41, positioning piece; 42, extrusion column; 5, limit column; 51, fixed frame; 52, screw; 53, magnet; 54, connecting frame; 55, rack; 56, gear; 6, fixing plate; 61, rotating column; 62, meshing rod; 63, connecting spring; 7, magnetic plate; 71, fixing rod; 8, isolation cover; 9, adjusting plate; 91, support frame; 92, rotating belt. Detailed implementation manners

[0021] In order to make the technical means, creative features, achieved purposes and functions of the present invention easy to understand, the present invention will be further described below in conjunction with specific implementation manners.

[0022] As Figures 1 to 14 shown, a PCB surface gold plating device according to an embodiment of the present invention includes an electroplating tank 1. A slide rail 2 is arranged above the electroplating tank 1. A slider is slidably connected inside the slide rail 2. A first hydraulic cylinder 21 is installed at the bottom end of the slider. A mounting bracket 22 is arranged at the bottom end of the first hydraulic cylinder 21. A clamping assembly is arranged at the bottom end of the mounting bracket 22; the clamping assembly is used for clamping and fixing the PCB. A pair of receiving frames 3 are arranged inside the electroplating tank 1. A pair of second hydraulic cylinders 31 are arranged on both sides of the electroplating tank 1; the output end of the second hydraulic cylinder 31 penetrates into the electroplating tank 1 and is connected to the receiving frame 3; A pair of receiving columns 4 are arranged between the pair of receiving frames 3. Grooves are opened on the opposite sides of the pair of receiving columns 4. A positioning piece 41 is inserted into the grooves. Extrusion columns 42 are inserted through the opposite sides of the pair of receiving columns 4. The end of the extrusion column 42 penetrates into the groove and is connected to the positioning piece 41; The electroplating position of the PCB in the electroplating tank 1 is between the pair of positioning pieces 41; An extrusion bar 32 is arranged at one end of one of the pair of receiving frames 3, and a docking groove adapted to the extrusion bar 32 is opened at the other end of the pair of receiving frames 3; An inclined surface is arranged at the end of the extrusion bar 32 away from the receiving frame 3; When the receiving frame 3 drives the extrusion bar 32 to move, the inclined surface of the extrusion bar 32 exerts extrusion on the end of the extrusion column 42. When electroplating a PCB, for a PCB with a large size and a relatively soft texture, since hydrogen gas is evolved during electroplating, the electroplating solution will bubble, which will cause the electroplating solution to drive the PCB to shake; as the PCB shakes, the copper foil on the surface of the PCB in contact with the fixture is affected by force, resulting in differences, which will cause the copper foil to become loose from the PCB substrate, and then gaps will appear, allowing metal ions in the electroplating solution to enter between the copper foil and the substrate, resulting in the phenomenon of infiltration plating; this leads to a decline in electroplating quality. To solve the above problems, the embodiments of the present invention are provided with structures such as a receiving frame 3, receiving columns 4, positioning pieces 41, etc.; the specific usage process is as follows: When in use, the top end of the PCB is clamped and fixed by the clamping assembly, and then it is transferred to a specified position above the electroplating tank 1 through the slide rail 2. After that, it is moved downward into the electroplating tank 1 through the first hydraulic cylinder 21 and the mounting frame 22. The electroplating solution in the electroplating tank 1 submerges the PCB. Then, the second hydraulic cylinder 31 is activated, and the second hydraulic cylinder 31 drives the receiving frame 3 to move in the direction of the receiving column 4. When the receiving frame 3 with the extrusion strip 32 installed at the end moves to a certain position, the inclined surface of the extrusion strip 32 exerts extrusion on the end of the extrusion column 42, causing the extrusion column 42 to drive the positioning piece 41 to move towards the side of the PCB. When the positioning piece 41 exerts extrusion on the end of the side of the PCB, it stops. At this time, both ends of the PCB are restricted by the extrusion of the positioning piece 41. Then, during electroplating, since the PCB is restricted and fixed, the evolved hydrogen gas is difficult to cause the PCB to shake, keeping the PCB stable in the electroplating solution; avoiding the decline in electroplating quality caused by the influence of the evolved hydrogen gas on the PCB.

[0023] The bottom end of the receiving frame 3 is slidably connected to the inner bottom wall of the electroplating tank 1, and the top end of the receiving frame 3 is located above the top end of the electroplating tank 1; when a pair of receiving frames 3 are butted against each other, the PCB clamped and fixed by the clamping assembly inside the electroplating tank 1 is isolated from the electroplating tank 1; that is, when a pair of receiving frames 3 are butted against each other, an isolation area is formed inside the electroplating tank 1 to isolate the PCB; a liquid extraction pipe 33 is provided through the bottom end of the side of the receiving frame 3, and one end of the liquid extraction pipe 33 away from the receiving frame 3 penetrates to the outside of the electroplating tank 1; a first conduit 34 is connected in communication with the end of the liquid extraction pipe 33 located outside the electroplating tank 1, and a first pump body 35 fixed to the side of the electroplating tank 1 is connected in communication with the end of the first conduit 34 away from the liquid extraction pipe 33, and the output end of the first pump body 35 penetrates into the inside of the electroplating tank 1; a second conduit 37 is provided through the side of the receiving frame 3, a third conduit 38 is connected in communication with one end of the second conduit 37 located inside the isolation area, and a spray head 39 communicated with the third conduit 38 is provided on the side of the receiving frame 3 and located inside the isolation area; a second pump body 36 communicated with the second conduit 37 is provided outside the electroplating tank 1; when the electroplating is completed, the pair of receiving frames 3 are controlled to move further until the pair of receiving frames 3 are butted against each other. During this process, the liquid extraction pipe 33 is driven synchronously, and the pressing strip 32 on one receiving frame 3 will be inserted into the docking groove opened at the end of the other receiving frame 3, without interfering with the movement of the receiving frame 3. When the pair of receiving frames 3 are butted against each other, an isolation area is formed inside the electroplating tank 1 to isolate the PCB; then the first pump body 35 is started, and the first pump body 35 pumps the electroplating solution inside the isolation area formed by the pair of receiving frames 3 into the outside of the isolation area through the first conduit 34 and the liquid extraction pipe 33. When the electroplating solution inside the isolation area is exhausted, the second pump body 36 is started, and the second pump body 36 injects the external clean water into the spray head 39 through the second conduit 37 and the third conduit 38, and then sprays it onto the surface of the PCB through the spray head 39 to spray and clean the PCB. After that, after the cleaning is completed, the PCB is controlled to leave the electroplating tank 1, and then the clean water inside the isolation area is pumped out. Since a three-way valve 341 is provided inside the first conduit 34; the clean water can be discharged to the outside of the electroplating tank 1 in cooperation with the three-way valve 341; the entire PCB cleaning process is carried out inside the electroplating tank 1, without the need for the PCB to carry the electroplating solution on its surface to be transferred, avoiding the electroplating solution carried on the PCB from falling during the transfer, causing pollution, and at the same time avoiding the long distance between the cleaning station and the electroplating station, resulting in some electroplating solution staying on the PCB for a long time and being difficult to clean.

[0024] It should be noted that the conduits used in the present invention are prepared from flexible pipes and can be stretched and deformed.

[0025] The spraying surface of the spray head 39 is provided with a partition plate 391. The top end of the partition plate 391 is rotatably connected to the spraying surface of the spray head 39. When the spray head 39 sprays clean water, the partition plate 391 is pushed to deflect. When the spray head 39 does not spray clean water, the partition plate 391 seals the spraying surface of the spray head 39 to prevent the electroplating solution from entering the spray head 39 during electroplating and contaminating the spray head 39. It should be noted that the hydrogen gas precipitated during electroplating breaks on the liquid surface of the electroplating solution, causing the electroplating solution to splash, and may splash into the spray head 39.

[0026] A pair of support shafts are provided at both ends of the spray head 39. The end of the support shaft away from the spray head 39 penetrates to the outside of the isolation area. A gear 56 is provided at the end of the support shaft located outside the isolation area. A rack 55 is meshed with the side surface of the gear 56. A connecting frame 54 is provided at the top end of the rack 55. A fixed frame 51 is provided at the end of the connecting frame 54 away from the rack 55. A screw 52 is rotatably provided inside the fixed frame 51. A limit post 5 is provided at the bottom end of the screw 52. A receiving notch 30 is formed on the side surface of the receiving frame 3. The bottom end of the limit post 5 is inserted into the inner wall of the receiving notch 30 to ensure the linear movement of the screw 52. A pair of fixing plates 6 are provided on both sides of the receiving notch 30. A rotating column 61 is rotatably provided on the side surface of the fixing plate 6. An inclined upward meshing rod 62 is provided on the side surface of the rotating column 61. A connecting spring 63 is provided between the meshing rod 62 and the fixing plate 6. The end of the meshing rod 62 is embedded between the threads on the surface of the screw 52. A magnet 53 is provided at the bottom end of the fixed frame 51. A magnetic plate 7 with the same magnetic properties is arranged below the magnetic block 53, and a fixing rod 71 is arranged between the magnetic plate 7 and the inner wall of the electroplating box 1; when the receiving frame 3 does not move, the angle of the spraying surface of the nozzle 39 is tilted upward based on the PCB; when a pair of receiving frames 3 move and dock, the magnetic block 53 loses the magnetic force between the magnetic plate 7, and then the screw 52 moves downward under the action of its own gravity, and needs to be meshed with the meshing rod 62 during movement, so the screw 52 rotates synchronously when moving downward, and the speed of the screw 52 moving downward is reduced. When the screw 52 moves downward, the rack 55 is driven to move downward synchronously through the fixed frame 51 and the connecting frame 54, and meshes with the gear 56 for transmission. The gear 56 drives the inclined nozzle 39 to rotate gradually through the support shaft, and the spraying surface of the nozzle 39 gradually tilts downward, so that during the cleaning process of the PCB, The spraying position of clean water gradually moves from top to bottom to ensure the cleaning effect; then, when the receiving frame 3 is reset, the nozzle 39 restores the initial angle again through the magnetic force between the magnetic block 53 and the magnetic plate 7; it should be pointed out that when the screw 52 is reset, the meshing rod 62 is squeezed and deflected by the thread of the screw 52, so the meshing rod 62 squeezes the connecting spring 63, and when the screw 52 is reset upward, the connecting spring 63 is difficult to provide the blocking force required for the meshing transmission of the screw 52 and the meshing rod 62, that is, the end of the meshing rod 62 cannot be stabilized in the thread of the screw 52; when the screw 52 is upward, no meshing transmission is required, so the movement speed is faster, and when the screw 52 moves downward, the connecting spring 63 is difficult to be stretched so that the end of the meshing rod 62 is disengaged from the thread of the screw 52, so the downward movement of the screw 52 is delayed, ensuring that the angle of the nozzle 39 gradually changes.

[0027] An isolation cover 8 is provided on the side of the receiving frame 3, and the isolation cover 8 is used to isolate the gear 56, the rack 55 and the screw 52 from the electroplating liquid inside the electroplating box 1, to avoid the electroplating liquid from contacting the gear 56, the rack 55 and the screw 52, thereby preventing the metal in the electroplating liquid from being deposited at the meshing position, thereby ensuring smooth meshing.

[0028] like Figures 15 to 18 As shown, a pair of adjustment plates 9 are arranged above the receiving column 4, and the adjustment plate 9 includes a vertical portion and an inclined portion at the top of the vertical portion; the spacing between the vertical portions of the pair of adjustment plates 9 is the same as the PCB width; a support frame 91 is arranged between the adjustment plate 9 and the top of the electroplating box 1; when the PCB is placed inside the electroplating box 1 through the clamping assembly, the PCB needs to be located in the middle position of the pair of receiving columns 4 to ensure that it is fixed later. When the position of the PCB clamped by the clamping assembly deviates, the PCB will also deviate when placed inside the electroplating box 1, so the adjustment plate 9 is arranged. When the clamping position of the PCB deviates, the inclined portion of the adjustment plate 9 supports the bottom end of the PCB, and the bottom end of the PCB is subjected to horizontal thrust and moves horizontally, and then moves between the pair of vertical portions to achieve position adjustment for easy use later.

[0029] A rotating belt 92 is slidably arranged on the surface of the adjusting plate 9; when the bottom end of the PCB is pressed against the inclined portion of the adjusting plate 9, the rotating belt 92 will replace the surface of the adjusting plate 9 and rotate on the surface of the adjusting plate 9 as the PCB moves, avoiding mutual sliding between the PCB and the inclined portion to generate frictional force and causing damage to the PCB.

[0030] The clamping assembly includes a clamping plate 23. An installation groove 231 is formed on the side of the clamping plate 23 away from the PCB. A pair of third hydraulic cylinders 232 are arranged inside the installation groove 231. The output end of the third hydraulic cylinder 232 penetrates through the clamping surface of the clamping plate 23; a clamping block 233 is arranged at the output end of the third hydraulic cylinder 232. A plurality of receiving rollers are rotatably arranged on the clamping surface of one of the pair of clamping blocks 233; when clamping the PCB, the clamping block 233 at the output end of the third hydraulic cylinder 232 clamps and fixes the PCB; the clamping block 233 with receiving rollers does not clamp the PCB; when adjusting the position of the PCB, control the clamping block 233 with receiving rollers to clamp the PCB, and control the clamping block 233 without receiving rollers to release the clamping of the PCB. Therefore, when the PCB moves, it can be buffered by the receiving rollers, and the rotation of the receiving rollers avoids friction and damage between the PCB and the clamping block 233.

[0031] A sealing plate is arranged at the notch of the installation groove 231; isolating the third hydraulic cylinder 232 from the electroplating tank 1; protecting the third hydraulic cylinder 232 in the installation groove 231.

[0032] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A PCB surface gold plating device, characterized in that: It includes an electroplating tank (1), a slide rail (2) is arranged above the electroplating tank (1), a slider is slidably connected inside the slide rail (2), a first hydraulic cylinder (21) is installed at the bottom end of the slider, an installation frame (22) is arranged at the bottom end of the first hydraulic cylinder (21), and a clamping assembly is arranged at the bottom end of the installation frame (22); the clamping assembly is used for clamping and fixing the PCB. A pair of receiving frames (3) are arranged inside the electroplating tank (1), and a pair of second hydraulic cylinders (31) are arranged on both sides of the electroplating tank (1); the output end of the second hydraulic cylinder (31) penetrates into the electroplating tank (1) and is connected to the receiving frame (3); a pair of receiving columns (4) are arranged between the pair of receiving frames (3), grooves are formed on the opposite sides of the pair of receiving columns (4), positioning pieces (41) are inserted into the grooves, extrusion columns (42) are inserted through the opposite sides of the pair of receiving columns (4), the end of the extrusion column (42) penetrates into the groove and is connected to the positioning piece (41); the electroplating position of the PCB in the electroplating tank (1) is located between the pair of positioning pieces (41); an extrusion strip (32) is arranged at one end of one of the pair of receiving frames (3), and a docking groove adapted to the extrusion strip (32) is formed at the end of the other of the pair of receiving frames (3); an inclined surface is arranged at the end of the extrusion strip (32) away from the receiving frame (3); when the receiving frame (3) drives the extrusion strip (32) to move, the inclined surface of the extrusion strip (32) exerts extrusion on the end of the extrusion column (42).

2. The PCB surface gold plating device according to claim 1, characterized in that: The bottom end of the receiving frame (3) is slidably connected to the inner bottom wall of the electroplating tank (1), and the top end of the receiving frame (3) is located above the top end of the electroplating tank (1); when the pair of receiving frames (3) are docked with each other, the PCB clamped and fixed by the clamping assembly inside the electroplating tank (1) is isolated from the electroplating tank (1); that is, when the pair of receiving frames (3) are docked, an isolation area is formed inside the electroplating tank (1) to isolate the PCB; a liquid extraction pipe (33) is arranged through the bottom end of the side surface of the receiving frame (3), and the end of the liquid extraction pipe (33) away from the receiving frame (3) penetrates to the outside of the electroplating tank (1); a first conduit (34) is connected in communication with the end of the liquid extraction pipe (33) located outside the electroplating tank (1), and a first pump body (35) fixed to the side surface of the electroplating tank (1) is connected in communication with the end of the first conduit (34) away from the liquid extraction pipe (33), and the output end of the first pump body (35) penetrates into the electroplating tank (1); a second conduit (37) is arranged through the side surface of the receiving frame (3), a third conduit (38) is connected in communication with the end of the second conduit (37) located inside the isolation area, and a spray head (39) connected in communication with the third conduit (38) is arranged on the side surface of the receiving frame (3) and inside the isolation area; a second pump body (36) connected in communication with the second conduit (37) is arranged outside the electroplating tank (1).

3. The PCB surface gold plating device according to claim 2, wherein: An isolation plate (391) is arranged on the spraying surface of the spray head (39), and the top end of the isolation plate (391) is rotatably connected to the spraying surface of the spray head (39).

4. A PCB surface gold plating device according to claim 2, characterized in that: A pair of support shafts are provided at both ends of the spray head (39). One end of the support shaft away from the spray head (39) penetrates to the outside of the isolation area. A gear (56) is provided at the end of the support shaft located outside the isolation area. A rack (55) is meshed and connected to the side of the gear (56). A connecting frame (54) is provided at the top of the rack (55). A fixed frame (51) is provided at the end of the connecting frame (54) away from the rack (55). A screw rod (52) is rotatably arranged inside the fixed frame (51). A limit post (5) is provided at the bottom end of the screw rod (52). A receiving notch (30) is formed on the side of the receiving frame (3). The bottom end of the limit post (5) is inserted into the inner wall of the receiving notch (30). A pair of fixing plates (6) are provided on both sides of the receiving notch (30). A rotating column (61) is rotatably arranged on the side of the fixing plate (6). An inclined upward meshing rod (62) is provided on the side of the rotating column (61). A connecting spring (63) is provided between the meshing rod (62) and the fixing plate (6). The end of the meshing rod (62) is embedded between the threads on the surface of the screw rod (52). A magnetic block (53) is provided at the bottom end of the fixed frame (51). A magnetic plate (7) with the same magnetism is provided below the magnetic block (53). A fixing rod (71) is provided between the magnetic plate (7) and the inner wall of the electroplating tank (1). When the receiving frame (3) does not move, the angle of the spraying surface of the spray head (39) is inclined upward based on the PCB.

5. A PCB surface gold plating device according to claim 4, characterized in that: An isolation cover (8) is provided on the side of the receiving frame (3). The isolation cover (8) is used to isolate the gear (56) and the rack (55), and the screw rod (52) and the electroplating solution inside the electroplating tank (1).

6. The PCB surface gold plating device according to claim 2, wherein: A three-way valve (341) is provided inside the first conduit (34).

7. A PCB surface gold plating device according to claim 1, characterized in that: A pair of adjusting plates (9) are provided above the receiving column (4). The adjusting plates (9) include a vertical portion and an inclined portion at the top of the vertical portion. The distance between the vertical portions of the pair of adjusting plates (9) is the same as the width of the PCB. A support frame (91) is provided between the adjusting plates (9) and the top of the electroplating tank (1).

8. A PCB surface gold plating device according to claim 7, characterized in that: A rotating belt (92) is slidably arranged on the surface of the adjusting plate (9).

9. A PCB surface gold plating device according to claim 8, characterized in that: The clamping assembly includes a clamping plate (23). An installation groove (231) is formed on the side of the clamping plate (23) away from the PCB. A pair of third hydraulic cylinders (232) are arranged inside the installation groove (231). The output ends of the third hydraulic cylinders (232) penetrate the clamping surface of the clamping plate (23). A clamping block (233) is provided at the output end of the third hydraulic cylinder (232). A plurality of receiving rollers are rotatably arranged on the clamping surface of one of the pair of clamping blocks (233).

10. A PCB surface gold plating device according to claim 9, characterized in that: A sealing plate is provided at the notch of the installation groove (231).

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