Wafer inspection equipment and wafer inspection method

Abstract

The present disclosure provides a wafer inspection device and an inspection method for solving the problem of how to improve wafer inspection efficiency. The wafer inspection device includes: a double-sided inspection unit, the double-sided inspection unit includes: a scanning platform, a front optical imaging module and a back optical imaging module, the scanning platform can move linearly along a first direction; the front optical imaging module and the back optical imaging module are respectively arranged on opposite sides of the scanning platform, and are respectively provided with a back bright field light source and a back dark field light source; when the scanning platform moves along the positive direction of the first direction, the front bright field light source and the back bright field light source are synchronously turned on, and the front optical imaging module and the back optical imaging module generate bright field images of the front and back of the wafer respectively; when the scanning platform moves along the negative direction of the first direction, the front and back dark field light sources are synchronously turned on, and the front optical imaging module and the back optical imaging module generate dark field images of the front and back of the wafer respectively.

Description

Technical Field

[0001] The present disclosure relates to a wafer detection device and a wafer detection method, belonging to the field of chip equipment. Background Art

[0002] In the field of wafer inspection technology, traditional inspection equipment typically implements double-sided inspection by flipping the wafer after single-sided inspection. This method requires the configuration of a separate flipping module, resulting in a complex equipment structure, high space utilization, and the risk of the wafer accidentally falling off when flipping. Furthermore, traditional inspection equipment only inspects wafers under a single lighting environment, making it difficult to capture multi-dimensional defect information on the wafer surface under different optical conditions. Alternatively, it requires performing scanning processes in different directions step by step under different lighting environments, which prolongs the inspection cycle, makes it difficult to simultaneously obtain multi-dimensional image data for the front and back sides, and reduces inspection efficiency.

[0003] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute prior art known to ordinary technicians in the field. Summary of the Invention

[0004] In order to solve one of the above technical problems, the present disclosure provides a wafer detection device and a wafer detection method.

[0005] According to one aspect of the present disclosure, a wafer inspection device is provided, which includes: a double-sided inspection unit, and the double-sided inspection unit includes: a scanning stage for placing a wafer and moving in a straight line along a first direction; a front optical imaging module and a back optical imaging module, which are respectively arranged on opposite sides of the scanning stage, the front optical imaging module is provided with a front bright field light source and a front dark field light source, and the back optical imaging module is provided with a back bright field light source and a back dark field light source; wherein, when the scanning stage moves along the positive direction of the first direction, the front bright field light source and the back bright field light source are synchronously turned on, the front optical imaging module generates a bright field image of the front side of the wafer, and the back optical imaging module generates a bright field image of the back side of the wafer; when the scanning stage moves along the negative direction of the first direction, the front dark field light source and the back dark field light source are synchronously turned on, the front optical imaging module generates a dark field image of the front side of the wafer, and the back optical imaging module generates a dark field image of the back side of the wafer.

[0006] According to the technical solution of one aspect of the present disclosure, the wafer inspection equipment can solve the problem of low inspection efficiency in traditional technologies, in which bright field and dark field inspections require step-by-step switching of light sources and two independent scans. This solution automatically switches the bright field and dark field light sources when the scanning stage moves forward / reverse, and synchronously obtains bright field and dark field image data on the front and back of the wafer in a single round-trip scan, thereby solving the problem of low step-by-step inspection efficiency. In wafer surface inspection, the setting of bright field light source and dark field light source is to capture multi-dimensional defect information on the wafer surface through different optical conditions. The bright field light source directly illuminates the wafer surface and is suitable for detecting macro foreign matter, scratches and surface dirt. Its high brightness characteristics can clearly show the reflectivity difference of the wafer surface; while the dark field light source uses oblique or side lighting to utilize the scattering effect of tiny protrusions or depressions on the surface to enhance the imaging contrast of micro defects such as microcracks and shallow residues, which is conducive to discovering wafer defects and improving the accuracy and efficiency of wafer inspection. At the same time, according to the technical solution of one aspect of the present disclosure, the wafer inspection equipment does not need to be configured with an independent flip module, which can reduce the equipment space occupancy rate and avoid the risk of the wafer accidentally falling off when turning over.

[0007] According to the wafer inspection equipment of at least one embodiment of the present disclosure, the front optical imaging module and the back optical imaging module are respectively arranged above and below the scanning stage; the scanning stage blocks a part of the back area of the wafer; the wafer inspection equipment also includes a rotating lifting device, which is arranged below the scanning stage. After the scanning stage moves in the positive direction and the negative direction of the first direction, the rotating lifting device lifts the wafer and rotates it by a first angle to expose a part of the back area of the wafer blocked by the scanning stage; the back optical imaging module generates a bright field image and a dark field image of the back side of the rotated wafer, and generates a complete back side image of the wafer by splicing the images of the back side of the wafer before and after rotation.

[0008] According to the technical solution of this embodiment, the problem of the back of the wafer being blocked by the scanning stage is solved by rotating the lifting device. The scanning stage usually needs to fix the wafer by mechanical clamping or vacuum adsorption to achieve stable movement. Since the clamping parts of the stage will directly contact the surface of the wafer, the edge or local area of the wafer will be blocked by the structure of the stage itself during the first scan, making it impossible for the back inspection group to directly image the area. By rotating the lifting axis to rotate the wafer to a first angle, such as 90° or 180°, and then scanning it a second time, the originally blocked area can be exposed to the detection field of view, and finally the blind area is eliminated by image stitching technology to achieve complete coverage detection of the back of the wafer.

[0009] According to at least one embodiment of the wafer inspection equipment disclosed herein, the rotary lifting device includes a rotary lifting shaft located below the scanning platform, a lifting drive mechanism for lifting the rotary lifting shaft, and a rotary drive mechanism for rotating the rotary lifting shaft to a first angle after being lifted. A suction plate for fixing the wafer is provided on the top of the rotary lifting shaft.

[0010] According to the technical solution of this embodiment, a vacuum chuck, electrostatic chuck, or other suction cup is mounted on the rotary lift shaft to secure the wafer, maintaining stability during lift and rotation. A lift drive mechanism achieves vertical lift, ensuring the wafer is lifted and separated from the scanning stage. The rotary drive mechanism also rotates the lift shaft and wafer.

[0011] According to at least one embodiment of the wafer inspection device disclosed herein, the wafer inspection device also includes a microscopic measurement unit, which includes: a movable stage for carrying a wafer and moving along a horizontal plane; a microscopic measurement lens group configured to magnify the surface circuit of the wafer carried on the movable stage and generate a microscopic image; a lens group height adjustment mechanism for driving the microscopic measurement lens group to move in a vertical direction to achieve focusing; and a data processing module programmed to perform the following operations: establish a wafer surface coordinate map based on the microscopic image generated by the microscopic measurement lens group, and set a target coordinate point of the target circuit to be measured; in a fully automatic mode, control the movable stage to move the wafer to the target coordinate point, and control the lens group height adjustment mechanism to drive the microscopic measurement lens group to move in a vertical direction to achieve focusing; capture all pixel grids of the target circuit in the microscopic image in the measurement direction, and calculate the number of pixel grids N, and calculate the line width W = N×S based on the number of pixel grids N and the pixel grid side length S.

[0012] According to the technical solution of this embodiment, the width of objects on the wafer surface and the distance between objects can be automatically detected through the microscopic measurement unit. The data processing module controls the linkage of the mobile stage, the microscopic measurement lens group and the lens group height adjustment mechanism, eliminating the need for manual operation and improving detection efficiency.

[0013] According to the wafer inspection equipment of at least one embodiment of the present disclosure, the data processing module is in manual mode, the movable stage manually adjusts the position of the wafer, and the lens group height adjustment mechanism manually adjusts the height of the micro-measurement lens group to achieve focusing.

[0014] According to the technical solution of this embodiment, the microscopic measurement unit is compatible with fully automatic and manual modes, and can cover the needs of different operating scenarios, such as fully automatic mode for mass production and manual fine-tuning during the debugging period.

[0015] According to at least one embodiment of the wafer inspection equipment disclosed herein, the wafer inspection equipment also includes a wafer conveying module and a perimeter patroller, and the wafer conveying module includes: a dual-arm robot including at least two robotic arms, and the two robotic arms are configured to alternately perform wafer picking and placing actions; and a moving mechanism, driving the dual-arm robot to move linearly in a horizontal direction; wherein, the dual-arm robot is used to take out the wafer from the wafer box, convey the wafer to the perimeter patroller to complete edge correction, convey the wafer to the double-sided inspection unit and the microscopic measurement unit in sequence, and after the wafer inspection and measurement are completed, return the wafer to the wafer box.

[0016] According to the technical solution of this embodiment, dual robotic arms are used to alternately pick up and place wafers, thereby reducing waiting time and improving conveying efficiency. At the same time, the conveying path is adjusted based on the edge correction data to solve the positioning error problem caused by wafer position offset.

[0017] According to at least one embodiment of the present disclosure, the wafer inspection equipment further includes a wafer loader, and the wafer loader is provided with the wafer box.

[0018] According to another aspect of the present disclosure, a wafer detection method is provided, which is implemented using the above-mentioned wafer detection equipment. The wafer detection method includes the following steps: placing a wafer on a scanning stage; the scanning stage moves along the positive direction of a first direction, the front bright field light source and the back bright field light source are synchronously turned on, the front optical imaging module generates a bright field image of the front side of the wafer, and the back optical imaging module generates a bright field image of the back side of the wafer; when the scanning stage moves along the negative direction of the first direction, the front dark field light source and the back dark field light source are synchronously turned on, the front optical imaging module generates a dark field image of the front side of the wafer, and the back optical imaging module generates a dark field image of the back side of the wafer; and comparing the bright field images and dark field images of the front and back sides of the wafer with standard wafer image templates.

[0019] Compared with existing technologies, this system offers at least the following benefits: With a single round trip scan of the scanning stage, it simultaneously captures both brightfield and darkfield images on both sides of the wafer, improving inspection efficiency compared to traditional, step-by-step inspections that require four unidirectional scans. This system is particularly suitable for mass production. The dual-sided optical imaging modules operate synchronously, eliminating the need to flip the wafer and reducing the risk of wafer damage. By combining brightfield and darkfield multimodal inspection, it can identify various defects on both sides of the wafer, reducing the rate of missed detections.

[0020] According to at least one embodiment of the wafer inspection method disclosed herein, the following steps are also included: after the scanning stage moves along the positive and negative directions of the first direction, the wafer is lifted and rotated by a first angle to expose a portion of the back side of the wafer that is blocked by the scanning stage; the back optical imaging module generates a bright field image and a dark field image of the back side of the rotated wafer, and generates a complete back side image of the wafer by splicing the images of the back side of the wafer before and after rotation.

[0021] According to the technical solution of this embodiment, the wafer is rotated to expose the area blocked by the scanning stage, and the back side of the wafer is fully covered during inspection to ensure image integrity.

[0022] According to at least one embodiment of the wafer inspection method disclosed herein, the following steps are also included: placing the wafer on a movable stage; the data processing module establishes a wafer surface coordinate map based on the microscopic image generated by the microscopic measurement lens group, and sets the target coordinate point of the target line to be measured; controlling the movable stage to move the wafer to the target coordinate point, and controlling the lens group height adjustment mechanism to drive the microscopic measurement lens group to move in the vertical direction to achieve focusing; capturing all pixel grids of the target line in the microscopic image in the measurement direction, and calculating the number of pixel grids N, and calculating the line width W = N×S based on the number of pixel grids N and the pixel grid side length S.

[0023] This embodiment's technical solution creates a coordinate map using micro-image feature points, and eliminates optical distortion through a pixel grid calibration algorithm (W = N × S), improving measurement accuracy. Autofocus and stage movement are coordinated to shorten measurement time and improve overall efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The accompanying drawings illustrate exemplary embodiments of the present disclosure and together with the description serve to explain the principles of the present disclosure. These drawings are included to provide a further understanding of the present disclosure and are incorporated in and constitute a part of this specification.

[0025] Figure 1 is a perspective view of a wafer inspection apparatus according to one embodiment of the present disclosure.

[0026] Figure 2 is a top view of a wafer inspection device according to one embodiment of the present disclosure.

[0027] Figure 3 is a perspective view of a double-side detection unit according to one embodiment of the present disclosure.

[0028] Figure 4 FIG. 1 is a perspective view of a double-sided inspection unit according to one embodiment of the present disclosure, with a wafer and some components removed.

[0029] Figure 5Schematic diagram of the structure of a double-sided detection unit according to one embodiment of the present disclosure.

[0030] Figure 6 is a perspective view of a microscopic measurement unit according to one embodiment of the present disclosure.

[0031] Figure 7 is a schematic diagram of a wafer coordinate system according to one embodiment of the present disclosure.

[0032] Figure 8 FIG. 4 is a schematic diagram of line width calculation according to one embodiment of the present disclosure.

[0033] Figure 9 is a perspective view of a wafer transfer module according to one embodiment of the present disclosure;

[0034] Figure 10 is a perspective view of a wafer loader according to one embodiment of the present disclosure;

[0035] Figure 11 is an exploded view of a wafer loader according to one embodiment of the present disclosure;

[0036] Figure 12 is a top view of a wafer loader according to one embodiment of the present disclosure;

[0037] Figure 13 yes Figure 12 A sectional perspective view of section A;

[0038] Figure 14 is a perspective view of a baffle module with some components removed according to one embodiment of the present disclosure;

[0039] Figure 15 is a partial perspective view of a baffle module according to one embodiment of the present disclosure;

[0040] Figure 16 is a perspective view of a baffle connected sequentially via a slideway and a second slider according to an embodiment of the present disclosure;

[0041] Figure 17 is an exploded view of a stage module and a wafer cassette according to one embodiment of the present disclosure;

[0042] Figure 18 is a perspective view of the internal structure of a carrier module according to one embodiment of the present disclosure;

[0043] Figure 19 is an exploded view of a cover opening detection module according to one embodiment of the present disclosure;

[0044] Figure 20is a perspective view of the internal structure of the cover opening assembly according to one embodiment of the present disclosure;

[0045] Figure 21 is a perspective view of a detection assembly according to one embodiment of the present disclosure;

[0046] Figure 22 is a perspective view of a track groove according to one embodiment of the present disclosure. DETAILED DESCRIPTION

[0047] The present disclosure will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only intended to explain the relevant content and are not intended to limit the present disclosure. It should also be noted that, for ease of description, only the portions relevant to the present disclosure are shown in the accompanying drawings.

[0048] Existing wafer inspection equipment only inspects wafers under a single lighting environment, making it difficult to capture multi-dimensional defect information on the wafer surface under different optical conditions; or it is necessary to perform scanning processes in different directions step by step under different lighting environments, resulting in a longer inspection cycle and difficulty in synchronously obtaining multi-dimensional image data of the front and back sides, resulting in low inspection efficiency.

[0049] In order to solve the above technical problems, this embodiment provides a wafer inspection device.

[0050] Figure 1 is a perspective view of a wafer inspection device according to one embodiment of the present disclosure, Figure 2 is a top view of a wafer inspection device according to one embodiment of the present disclosure, Figure 3 is a perspective view of a double-sided detection unit according to one embodiment of the present disclosure, Figure 4 is a three-dimensional diagram of a double-sided inspection unit according to one embodiment of the present disclosure after removing the wafer and some components. Figure 5 Schematic diagram of the structure of a double-sided detection unit according to one embodiment of the present disclosure.

[0051] like Figures 1 to 5 As shown, the wafer inspection device provided in this embodiment includes: a double-sided inspection unit 100 , and the double-sided inspection unit 100 includes: a scanning stage 110 , a front optical imaging module 120 , a back optical imaging module 130 and a stage base 140 .

[0052] like Figure 4 and Figure 5As shown, the scanning stage 110 is used to place a wafer and move linearly along a first direction. The first direction is the Y-axis, for example. The stage base 140 is provided with a slide rail 141 extending along the Y-axis. The scanning stage 110 is connected to the slide rail 141 via a first slider 142. A motor-driven ball screw module 143 is mounted on the stage base 140 and connected to the scanning stage 110. This ball screw module 143 drives the scanning stage 110 to move along the Y-axis.

[0053] like Figure 5 As shown, the front optical imaging module 120 and the back optical imaging module 130 are respectively arranged on opposite sides of the scanning stage 110. The front optical imaging module 120 is provided with a front bright field light source 121 and a front dark field light source 122, and the back optical imaging module 130 is provided with a back bright field light source 131 and a back dark field light source 132. Exemplarily, the front optical imaging module 120 and the back optical imaging module 130 are respectively arranged above and below the scanning stage 110, and each is provided with a lens for taking pictures and generating images.

[0054] Among them, when the scanning stage 110 moves along the positive direction of the first direction, the front bright field light source 121 and the back bright field light source 131 are turned on synchronously, the front optical imaging module 120 generates a bright field image of the front side of the wafer, and the back optical imaging module 130 generates a bright field image of the back side of the wafer; when the scanning stage 110 moves along the negative direction of the first direction, the front dark field light source 122 and the back dark field light source 132 are turned on synchronously, the front optical imaging module 120 generates a dark field image of the front side of the wafer, and the back optical imaging module 130 generates a dark field image of the back side of the wafer.

[0055] like Figure 3 and Figure 4 As shown, to facilitate wafer placement, a through hole 111 is provided in the middle of the scanning stage 110, and a plurality of support plates 112 are arranged in a ring inside the through hole 111. The support plates 112 are spaced apart, and the spacing is greater than the size of a single support plate 112. The wafer is placed on the support plates 112. The support plates 112 of the scanning stage 110 block part of the back surface of the wafer.

[0056] like Figures 3 to 5As shown, in order to solve the problem of the back side of the wafer being blocked, the wafer inspection equipment also includes a rotating lifting device 150. The rotating lifting device 150 is arranged below the scanning stage 110. After the scanning stage 110 moves in the positive and negative directions of the first direction, the rotating lifting device 150 lifts the wafer and rotates the wafer by a first angle, so that the part of the back side of the wafer blocked by the scanning stage 110 is exposed; the back optical imaging module 130 generates a bright field image and a dark field image of the back side of the rotated wafer, and generates a complete back side image of the wafer by splicing the images before and after the rotation of the back side of the wafer. The problem of the back side of the wafer being blocked by the scanning stage 110 is solved by the rotating lifting device 150. The scanning stage 110 usually needs to fix the wafer by mechanical clamping or vacuum adsorption to achieve stable movement. Since the clamping parts of the stage will directly contact the surface of the wafer, the edge or local area of the wafer will be blocked by the stage's own structure during the first scan, so that the area cannot be directly imaged by the back side inspection group. By rotating the lifting shaft 151 to rotate the wafer to a first angle, such as 90° or 180°, and then scanning it again, the originally blocked area can be exposed to the detection field of view. Finally, the blind area is eliminated through image stitching technology to achieve complete coverage detection of the back side of the wafer.

[0057] The rotating lifting device 150 can use an existing module with rotating and lifting functions, and the actions of lifting and rotating the wafer can be performed sequentially or simultaneously. Figure 4 and Figure 5As shown, the rotary lifting device 150 can also realize the rotation and lifting functions through the following implementation. Specifically, the rotary lifting device 150 includes a rotary lifting shaft 151 located below the scanning stage, a lifting drive mechanism 152 for lifting the rotary lifting shaft 151, and a rotary driving mechanism 153 for rotating the rotary lifting shaft 151 to a first angle after the rotary lifting shaft 151 is lifted. Exemplarily, the rotary driving mechanism 153 is mounted on the lifting component of the lifting drive mechanism 152, and the rotary lifting shaft 151 is mounted on the rotating component of the rotary driving mechanism 153. A suction plate 154 for fixing the wafer is provided on the top of the rotary lifting shaft 151. The suction plate 154 can be a vacuum suction cup, an electrostatic suction cup, etc. During operation, the rotating lifting shaft 151 fixes the wafer by installing the adsorption plate 154, keeping the wafer stable during the lifting and rotation process. The wafer is separated from the support plate 112 after lifting and is placed back on the support plate 112 after rotation. At this time, the area on the back of the wafer that was originally blocked by the support plate 112 is exposed between the support plates 112 and can be captured by the lens of the back optical imaging module 130. The lifting drive mechanism 152 can use a linear module, such as a ball screw combined with a servo motor or a ball screw module 143 of a linear motor, and cooperate with the guide mechanism 155 to realize the vertical lifting action to ensure that the wafer is separated from the scanning stage 110 after being lifted. The rotating drive mechanism 153 can be driven by an independent servo motor through a reducer to rotate the rotating table around the Z axis. The rotation angle is controlled by real-time feedback of the encoder to realize the rotation of the rotating lifting shaft 151 and the wafer.

[0058] Compared with the prior art, the wafer inspection equipment of this embodiment performs synchronous inspection on the front and back of the wafer through the double-sided inspection unit 100. In the wafer surface inspection, the setting of the bright field light source and the dark field light source is to capture the multi-dimensional defect information of the wafer surface through different optical conditions. The bright field light source directly illuminates the wafer surface and is suitable for detecting macro foreign matter, scratches and surface dirt. Its high brightness characteristics can clearly present the difference in reflectivity of the wafer surface. The dark field light source uses the scattering effect of tiny protrusions or depressions on the surface on light through oblique or side lighting to enhance the imaging contrast of micro defects such as microcracks and shallow residues. In traditional technology, bright field and dark field inspections require step-by-step switching of light sources and two independent scans, resulting in low detection efficiency. This solution solves the problem of low step-by-step inspection efficiency by automatically switching the bright / dark field light source when the scanning stage 110 moves forward / reverse, and synchronously acquiring bright field and dark field image data of the front and back of the wafer in a single round-trip scan. At the same time, according to the technical solution of one aspect of the present disclosure, the wafer inspection equipment does not need to be configured with an independent flip module, which can reduce the equipment space occupancy rate and avoid the risk of the wafer accidentally falling off when turning over.

[0059] Figure 6 : is a stereogram of a microscopic measurement unit according to one embodiment of the present disclosure. Figure 1 and Figure 6 As shown, the wafer inspection equipment provided in this embodiment further includes a microscopic measurement unit 200 based on the previous embodiment. The microscopic measurement unit 200 includes: a movable stage 210, a microscopic measurement lens group 220, a lens group height adjustment mechanism 230, a marble platform 240 and a data processing module (not shown in the figure).

[0060] Specifically, an XY axis 241 is mounted on the marble platform 240. This axis 241 drives the movable stage 210 to move along the X-axis and Y-axis, which are perpendicular to each other. The movable stage 210 is used to carry wafers and is mounted on the XY axis 241. It is driven by the XY axis 241 to move horizontally.

[0061] The micro-measuring lens assembly 220 is configured to magnify the surface circuits of the wafer carried by the moving stage 210 and generate a microscopic image. The micro-measuring lens assembly 220 can use an existing imaging device that has the function of magnifying the wafer surface and generating a microscopic image.

[0062] The lens height adjustment mechanism 230 is used to drive the microscopic measurement lens assembly 220 to move vertically to achieve focus. This mechanism can be a conventional motor-driven lifting module that requires a certain level of movement accuracy. The microscopic measurement lens assembly 220 is mounted on the lifting component of the lifting module.

[0063] Figure 7 is a schematic diagram of a wafer coordinate system according to one embodiment of the present disclosure, Figure 8 FIG. 4 is a schematic diagram of line width calculation according to one embodiment of the present disclosure.

[0064] like Figure 7 and Figure 8 As shown, the data processing module is programmed to perform the following operations: Based on several feature points in the microscopic image generated by the microscopic measurement lens assembly 220, a wafer surface coordinate map is created and the target coordinate point of the target line to be measured is set. In fully automatic mode, the movable stage 210 is controlled to move the wafer to the target coordinate point, and the lens assembly height adjustment mechanism 230 is controlled to drive the microscopic measurement lens assembly 220 in a vertical direction to achieve focus. All pixel grids of the target line in the microscopic image in the measurement direction are captured, and the number of pixel grids N is calculated. Based on the number of pixel grids N and the pixel grid side length S, the line width W = N × S is calculated.

[0065] Furthermore, the micro-measurement unit 200 also includes a manual mode. In manual mode, the mobile stage 210 manually adjusts the wafer position, and the lens height adjustment mechanism 230 manually adjusts the height of the micro-measurement lens assembly 220 to achieve focus. The data processing module captures all pixel grids of the target line in the microscopic image in the measurement direction and calculates the number of pixel grids N. Based on the number of pixel grids N and the pixel grid side length S, the line width W = N × S is calculated.

[0066] The wafer inspection equipment provided in this embodiment not only performs double-sided inspection of the wafer via the double-sided inspection unit 100, but also automatically detects the width of traces on the wafer surface via the microscopic measurement unit 200. In automatic mode, the data processing module controls the linkage of the mobile stage 210, the microscopic measurement lens assembly 220, and the lens assembly height adjustment mechanism 230, eliminating the need for manual operation and improving inspection efficiency. Furthermore, the microscopic measurement unit 200 is compatible with both fully automatic and manual modes, meeting the needs of different operational scenarios, such as fully automatic mode for mass production and manual fine-tuning during the commissioning period.

[0067] Figure 9 is a perspective view of a wafer transfer module according to one embodiment of the present disclosure.

[0068] like Figure 1 and Figure 9 As shown, this embodiment provides a wafer inspection device. Based on the previous embodiment, the wafer inspection device of this embodiment further includes a wafer transport module 300, a patrol device 400 and a wafer loader 500. The wafer transport module 300 includes: a dual-arm manipulator 310 and a moving mechanism 320. The dual-arm manipulator 310 includes at least two manipulators 311. At least two manipulators 311 are configured to alternately perform wafer pick-up and placement actions. The moving mechanism 320 drives the dual-arm manipulator 310 to move linearly in the horizontal direction. The wafer loader 500 is provided with a wafer box 550 (such as Figure 10 ). The dual-arm robot 310 is used to remove wafers from the wafer cassette 550, transport the wafers to the edge detector 400 for edge correction, sequentially transport the wafers to the double-sided inspection unit 100 and the micro-measurement unit 200, and return the wafers to the wafer cassette 550 after wafer inspection and measurement are completed.

[0069] The wafer handling module 300 uses dual robotic arms 311 to alternately pick and place wafers, reducing waiting time and improving handling efficiency. Simultaneously, the handling path is adjusted based on edge correction data to address positioning errors caused by wafer position shifts.

[0070] The wafer inspection equipment provided in this embodiment not only performs double-sided inspection on the wafer through the double-sided inspection unit 100 and automatically detects the width of the line on the wafer surface through the microscopic measurement unit 200, but also automatically transports the wafer between the wafer box 550, the edge patrol device 400, the double-sided inspection unit 100 and the microscopic measurement unit 200 through the wafer transfer module 300, thereby improving the transfer efficiency and improving the accuracy of the wafer movement through the edge patrol device 400.

[0071] Existing wafer loaders lack effective protection mechanisms for wafer cassettes. Operator misoperation can damage the wafers inside the cassette, potentially causing breakage. Furthermore, existing automated wafer loading equipment requires a horizontal movement mechanism on the lid assembly to open, resulting in high manufacturing costs.

[0072] Therefore, in order to solve the above technical problems, this embodiment provides a wafer loader 500. Figure 10 is a perspective view of a wafer loader according to one embodiment of the present disclosure.

[0073] Figure 11 FIG. 1 is an exploded view of a wafer loader according to an embodiment of the present disclosure. Figure 11 As shown, the wafer loader 500 includes a machine frame 510, a carrier module 520, a baffle module 530 and a cover opening detection module 540. The machine frame 510 serves as a mounting carrier for the carrier module 520, the baffle module 530 and the cover opening detection module 540.

[0074] Figure 12 is a top view of a wafer loader according to one embodiment of the present disclosure, Figure 13 yes Figure 12 A sectional perspective view of section AA.

[0075] like Figure 12 and Figure 13 As shown, the carrier module 520 is set on the machine frame 510 and is used to fix the wafer box 550. The fixing method can be the same as that of the existing wafer automatic loading equipment. The carrier module 520 is provided with a linear drive mechanism 521. The linear drive mechanism 521 is used to drive the wafer box 550 to move between the opening station and the inspection station. Figure 12 As shown in the figure, the area of the wafer cassette 550 at the solid line edge is the lid opening station, and the area of the wafer cassette 550 at the dotted line edge is the inspection station. The inspection station and the lid opening station are arranged linearly along the opening direction of the lid 551 of the wafer cassette 550. That is, the lid opening station is closer to the lid opening inspection module 540, so that when the lid 551 of the wafer cassette 550 is fixed and the wafer cassette 550 moves from the lid opening station to the inspection station, the wafer cassette 550 can automatically separate from the lid 551.

[0076] Figure 14 This is a three-dimensional diagram of a baffle module after removing some components according to an embodiment of the present disclosure. Figure 12 and Figure 14 As shown, the baffle module 530 includes a left baffle assembly 531, a right baffle assembly 532, and a lift baffle assembly 533, which are arranged around the stage module 520. They protect the wafer cassette 550 from accidental contact and misoperation. The left baffle assembly 531 and the right baffle assembly 532 are mounted on the stage frame 510. The lift baffle assembly 533 is movable between the left baffle assembly 531 and the right baffle assembly 532 and is equipped with a baffle drive mechanism 534. The baffle drive mechanism 534 is mounted on the left baffle assembly 531 or the right baffle assembly 532 and is used to drive the lift baffle assembly 533 to move upward and downward, thereby opening or closing the baffle module 530 to allow or prevent the operator from operating.

[0077] Figure 19 FIG. 1 is an exploded view of a cover opening detection module according to an embodiment of the present disclosure. Figure 13 and Figure 19 As shown, the cover opening detection module 540 includes a lifting mechanism 541, a cover opening assembly 542, and a detection assembly 543. The lifting mechanism 541 is set on the machine frame 510 and connected to the cover opening assembly 542. The cover opening assembly 542 is used to fix and unlock the lid 551 of the wafer box 550 located at the cover opening station. Its fixing and unlocking methods can be the same as those of existing wafer automatic loading equipment. The detection assembly 543 is set on the cover opening assembly 542 and is used to detect the wafers inside the wafer box 550 located at the detection station. Its detection method can be the same as that of existing wafer automatic loading equipment.

[0078] Figure 15 It is a partial three-dimensional view of a baffle module according to one embodiment of the present disclosure. Figure 16 1 is a perspective view of a baffle connected in sequence through a slideway and a slider according to an embodiment of the present disclosure. Figure 15 and Figure 16As shown, the left baffle assembly 531 and the right baffle assembly 532 are disposed on the machine frame 510, and the lifting baffle assembly 533 is disposed between the left baffle assembly 531 and the right baffle assembly 532 so as to be movable and retractable. This can be achieved in the following manner: the left baffle assembly 531 and the right baffle assembly 532 are fixedly disposed on two opposite sides of the machine frame 510, such as by screws. The left baffle assembly 531 and the right baffle assembly 532 each have a slide groove 531A, and the slide grooves 531A are positioned opposite each other. The lifting baffle assembly 533 includes at least three baffles 533A slidably disposed within a slide slot 531A. The baffles 533A are arranged sequentially from top to bottom and stacked horizontally. A vertically extending slideway 533B and a second slider 533C slidably engaged with the slideway 533B are disposed between adjacent baffles 533A. A baffle drive mechanism 534 is connected to the top baffle. When the top baffle of two adjacent baffles moves upward, the second slider 533C drives the bottom baffle upward. When the baffle drive mechanism 534 drives the top baffle downward, the bottom baffle can descend under its own weight. The baffle is slidably guided by the slide groove 531A, and cooperates with the adjacent baffle through the slide 533B and the second slider 533C. The double limit and guidance realize the stable lifting and lowering of the baffle, and the upper baffle is used to drive the movement of the lower baffle, which simplifies the driving structure and makes the lifting and lowering operation of the baffle more efficient; it is also important that the baffles can be stacked directly, which can effectively reduce the storage space required after lowering and reduce space occupancy; the baffle can be quickly lifted before the equipment works through the lifting movement to prevent people from entering the working area and affecting the operation of the machine and the safety of people, effectively reducing the risk of fragments caused by misoperation of the staff.

[0079] like Figure 15As shown, in some embodiments, the baffle driving mechanism 534 is arranged on the left baffle assembly 531 or the right baffle assembly 532, and is used to drive the lifting and lowering movement of the lifting baffle assembly 533. This can be achieved in the following way: a mounting plate 531B is fixedly provided on the inner side of the left baffle assembly 531 or the right baffle assembly 532, and the mounting plate 531B serves as an installation carrier of the baffle driving mechanism 534. The baffle driving mechanism 534 includes a baffle driving cylinder 534A, a connecting block 534B, a first synchronous belt 534C, a first pulley 534D, a rotating shaft 534E, a second synchronous belt 534F, and a second pulley 534G; the driving cylinder 534A is arranged on the mounting plate 531B and is provided with a piston rod, the piston rod, the connecting block 534B and the first synchronous belt 534C are fixedly connected in sequence, such as by bolts, the first synchronous belt 534C is connected to the two first pulleys 534D, the first pulley 534D is rotatably arranged on the mounting plate 531B through the axle, and the axle of one of the first pulleys 534D is transmission connected to the rotating shaft 534E, and the connecting line of the two first pulleys 534D is parallel to the piston rod. The rotating shaft 534E is rotatably disposed between the left baffle assembly 531 and the right baffle assembly 532. For example, its ends are rotatably mounted on bearings provided in the left baffle assembly 531 and the right baffle assembly 532, respectively. Two synchronous belt mechanisms are provided at each end of the rotating shaft 534E. Specifically, two second pulleys 534G are provided at each end of the rotating shaft 534E. The left baffle assembly 531 and the right baffle assembly 532 are each provided with a second pulley 534G above the rotating shaft 534E. Two second synchronous belts 534F are connected between the rotating shaft 534E and the second pulley 534G on the left baffle assembly 531, and between the rotating shaft 534E and the second pulley 534G on the right baffle assembly 532, respectively. The second synchronous belt 534F is connected to the uppermost baffle. Of course, the rotating shaft 534E may alternatively be provided with only a single synchronous belt mechanism to drive the baffle to rise and fall. The beneficial effect of this driving mechanism is that, through the transmission method of synchronous belt and pulley, the baffle driving cylinder 534A can stably drive the baffle, the transmission process is smooth, and the lifting position of the baffle can be accurately controlled; at the same time, by being installed on the mounting plate 531B of the left baffle assembly 531 or the right baffle assembly 532, the internal space of the baffle module 530 is fully utilized, the overall structural layout of the baffle module 530 is optimized, and the space occupied by the baffle module 530 is reduced.

[0080] Furthermore, if Figure 15As shown, in one embodiment of the aforementioned transmission connection between the axle and the rotating shaft 534E, the baffle drive mechanism 534 further includes a third synchronous belt 534H, a tensioning pulley 534I, and two third pulleys 534J. One third pulley 534J is fixedly connected to the axle of the first pulley 534D, and the other third pulley 534J is fixedly mounted on the rotating shaft 534E. The third synchronous belt 534H is connected between the two third pulleys 534J. The tensioning pulley 534I is rotatably mounted on the mounting plate 531B and is used to tension the third synchronous belt 534H. The third synchronous belt 534H and the third pulleys 534J optimize the transmission unit of the baffle drive mechanism 534, ensuring smoother power transmission, preventing slippage during transmission, and improving transmission accuracy and stability.

[0081] It is understandable that the transmission connection between the wheel axle and the rotating shaft 534E can also be achieved through an existing gear transmission mechanism or a chain transmission mechanism.

[0082] like Figure 15 As shown, to enhance the stability of the movement of the first synchronous belt 534C, the baffle drive mechanism 534 further includes a first guide rail 534K. The first guide rail 534K is bolted to the mounting plate 531B and is parallel to the piston rod of the baffle drive cylinder 534A. A slide is fixedly mounted on the connecting block 534B, which is slidably connected to the first guide rail 534K. The combination of the first guide rail 534K and the slide provides precise guidance for the movement of the connecting block 534B, enabling the connecting block 534B to move stably along a straight line under the drive of the piston rod, thereby ensuring the accuracy of the movement of the baffle drive mechanism 534.

[0083] like Figure 12 As shown, in some embodiments, the left baffle assembly 531, the right baffle assembly 532, the lifting baffle assembly 533, and the platform frame 510 form a square space around the carrier module 520. The square space provides good protection and positioning for the carrier module 520, effectively preventing external factors from interfering with the carrier module 520.

[0084] Figure 17 is an exploded view of a stage module and a wafer cassette according to one embodiment of the present disclosure. Figure 18 : is a three-dimensional diagram of the internal structure of the carrier module according to one embodiment of the present disclosure. Figure 17 and Figure 18As shown, in some embodiments of the stage module 520, the stage module 520 includes: a module base plate 522, a guide rail assembly 523, a stage assembly 524, and a fixing mechanism 525; the module base plate 522 is fixedly disposed on the machine frame 510, the guide rail assembly 523 is fixedly disposed on the module base plate 522, the stage assembly 524 is slidably disposed on the guide rail assembly 523, and is used to place the wafer box 550; the linear drive mechanism 521 includes a ball screw assembly, which is fixedly disposed on the module base plate 522 and connected to the stage assembly 524, and is used to drive the stage assembly 524 to move along the guide rail assembly 523 between the cover opening station and the inspection station; the fixing mechanism 525 is disposed on the stage assembly 524, and can be a snap assembly, and is used to fix the wafer box 550 on the stage assembly 524. The snap assembly can use an existing electric or pneumatic snap mechanism, which will not be described in detail here. The module base plate 522 provides a stable support base for the entire stage module 520. The combination of the guide rail assembly 523 and the ball screw assembly enables the stage assembly 524 to move precisely and smoothly between the lid opening and inspection stations, improving the positioning accuracy and movement efficiency of the wafer cassette 550. The provision of a snap assembly ensures that the wafer cassette 550 is fixed to the stage assembly 524, preventing the wafer cassette 550 from shaking or falling during movement, and ensuring smooth transfer and inspection.

[0085] It is understandable that the fixing mechanism 525 may also be a clamp or a vacuum suction cup.

[0086] like Figure 19 As shown, in some embodiments of the above-mentioned lifting mechanism 541, the lifting mechanism 541 is a ball screw module and is installed on the module back plate 544, its moving end is connected to the cover opening component 542, and the module back plate 544 is fixed on the machine frame 510.

[0087] Figure 20 This is a three-dimensional diagram of the internal structure of the cover opening assembly according to an embodiment of the present disclosure. Figure 20As shown, in some embodiments of the above-mentioned lid opening assembly 542, the lid opening assembly 542 includes a fixing assembly 542A for fixing the lid 551, an unlocking assembly for unlocking the lid 551, and a bonding plate 542B for mounting the fixing assembly 542A and the unlocking assembly. The fixing assembly 542A can be a vacuum suction cup or a clamp. The unlocking assembly includes at least two key pins 542C rotatably arranged on the bonding plate 542B, a connecting rod assembly connected to the two key pins 542C, and an unlocking cylinder 542D connected to the connecting rod assembly; the connecting rod assembly includes a first rotating rod 542E, a second rotating rod 542F and an intermediate rod 542G, the two ends of the first rotating rod 542E are respectively hinged to the piston rod of the unlocking cylinder 542D and one end of the intermediate rod 542G, and the middle part of the first rotating rod 542E is connected to an unlocking pin, one end of the second rotating rod 542F is connected to the unlocking pin, and the other end is fixedly connected to one end of the intermediate rod 542G; wherein, the first rotating rod 542E and the second rotating rod 542F are parallel to each other, and the intermediate rod 542G and the piston rod of the unlocking cylinder 542D are parallel to each other and arranged along a parallelogram, and the two key pins 542C are arranged at the middle position of the opposite sides of the parallelogram. During operation, the wafer box 550 moves to the lid opening station, the fixing assembly 542A stably fixes the lid 551, and the key pin 542C is inserted into the keyhole of the lid 551. The unlocking cylinder 542D drives the connecting rod assembly, which drives the key pin 542C to rotate, thereby unlocking the lid 551. Compared with the unlocking mechanism of the traditional worm gear drive, the lid opening assembly 542 of the present application simplifies the overall structure through the parallelogram structure of the connecting rod assembly, and makes the rotation of the key pin 542C more stable and precise, thereby improving the success rate and reliability of lid opening.

[0088] Figure 21 is a perspective view of a detection assembly according to one embodiment of the present disclosure. Figure 22 : is a perspective view of a track groove according to an embodiment of the present disclosure. Figure 21 and Figure 22As shown, in some embodiments of the above-mentioned detection component 543, the detection component 543 includes a detection frame 543A, a telescopic cylinder 543B and a detection sensor 543C; the detection frame 543A is rotatably arranged on the cover opening component 542, such as being connected to the bonding plate 542B of the cover opening component 542 through a rotating shaft, and an arc-shaped track groove 543D is provided at the bottom of the detection frame 543A, the telescopic cylinder 543B is fixedly arranged on the cover opening component 542, and its piston rod is provided with a roller 543E, and the roller 543E is arranged inside the track groove 543D; the detection sensor 543C is arranged at the top of the detection frame 543A; wherein, when the piston rod of the telescopic cylinder 543B moves, the roller 543E pushes the groove wall of the track groove 543D to rotate the detection frame 543A, so that the detection sensor 543C moves from the outside to the inside of the wafer box 550 or from the inside to the outside of the wafer box 550. The telescopic cylinder 543B drives the roller 543E to move in the track groove 543D, thereby realizing the rotation of the detection frame 543A, and then driving the detection sensor 543C to extend into the wafer box 550. At the same time, the lifting mechanism 541 drives the detection sensor 543C to rise and fall, which can facilitate the inspection of the inside and outside of the wafer box 550. After the inspection, the telescopic cylinder 543B drives the roller 543E to move in the opposite direction, causing the detection frame 543A to rotate in the opposite direction and resetting the detection sensor 543C.

[0089] The present embodiment provides a control method for a wafer loader, which is used to control any of the wafer loader mentioned above and includes the following steps: after the wafer box 550 is placed on the carrier module 520, the baffle driving mechanism 534 drives the lifting baffle assembly 533 to rise; the carrier module 520 fixes the wafer box 550 at the inspection station; the linear driving mechanism 521 drives the wafer box 550 from the inspection station to the lid opening station; the lid opening assembly 542 fixes and unlocks the lid 551 of the wafer box 550 located at the lid opening station; the linear driving mechanism 521 drives the wafer box 550 to retreat from the lid opening station to the inspection station, so that the wafer box 550 and the lid 551 are separated, and the lifting and lowering movement of the lid opening assembly 542 and the detection assembly 543 is not interfered with by the wafer box 550; the lifting mechanism 541 controls the lifting and lowering movement of the detection assembly 543, and the detection assembly 543 detects the wafer located inside the wafer box 550.

[0090] For example, the wafer loader of the present application is used for wafer loading. The wafer loader utilizes a forward-motion Base + ladder diagram language control system. This forward-motion Base + ladder diagram language control system is a programming method for industrial automation that combines the efficiency of the Base language with the intuitiveness of the ladder diagram language. The advantages of this Base + ladder diagram combination are as follows: flexibility and intuitiveness: Base handles complex logic, while ladder diagram handles simple logic, improving development efficiency and system performance; modular design: supports modular programming, facilitating function reuse and maintenance; and good real-time performance: suitable for real-time control, capable of quickly responding to input signals and executing operations. The operational flow is as follows: start, initialization, waiting for a person or overhead crane to place a wafer cassette 550, recipe selection, loading process, robotic arm placement of wafers, unloading process, waiting for a person or overhead crane to remove the wafer cassette 550, and end. Specifically, initialization: system startup, self-test, and initialization settings. Waiting for a person or overhead crane to place a wafer cassette 550: the system waits for the wafer cassette 550 to be placed in the designated location. Recipe selection: Select the corresponding processing recipe based on the wafer box 550 model or type.

[0091] Exemplarily, the loading process is as follows: baffle rises: the baffle rises to prevent personnel from entering the working area and affecting the operation of the machine and the safety of personnel; wafer box fixation: the fixing mechanism 525 uses a snap assembly, a clamp or a vacuum suction cup to fix the wafer box to prevent the wafer box 550 from moving during subsequent operations, and to confirm that the wafer box 550 is firmly fixed; wafer box 550 advances: the wafer box 550 advances from the initial position to the cover opening station to ensure that the wafer box 550 accurately reaches the working area of the cover opening component 542; the cover opening component 542 Vacuum suction: The vacuum suction cup of the cover opening assembly 542 is started, sucking the cover 551 of the wafer box 550, confirming that the suction cup firmly fixes the cover 551, and the key pin 542C is inserted into the keyhole of the cover 551; Unlocking the cover 551: The key pin 542C rotates to unlock the buckle of the cover 551, confirming that it is completely unlocked, and the cover 551 can be opened; Wafer box 550 retracts: The wafer box 550 retracts from the cover opening position, and the door of the wafer box 550 is pulled open by the action of the vacuum suction cup, completing the cover opening operation.

[0092] Exemplarily, the unloading process is as follows: wafer box 550 returns, Map process, wafer box 550 advances, locks lid 551, wafer box 550 returns, wafer box 550 is released and baffle descends. Specifically, wafer box 550 returns: wafer box 550 returns from the unloading position to the inspection station to ensure that the lifting and lowering action of the lid opening component 542 is not affected; Map process: execute the Map operation process; wafer box 550 advances: wafer box 550 advances to the lid opening position to ensure that the wafer box 550 accurately reaches the working area of the lid opening component 542, lid 551 enters wafer box 550, and key pin 542C is inserted into the keyhole; lock lid 551: key pin 542C rotates , lock the wafer box 550 buckle, confirm that the cover 551 is locked in place on the wafer box 550, and the vacuum suction cup releases the adsorption of the cover 551; the wafer box 550 returns: the wafer box 550 returns to the initial position and enters the personnel (or overhead crane) operation area; the wafer box 550 is released: the fixing mechanism 525 cancels the fixation of the wafer box 550; the baffle descends: the baffle drive mechanism 534 drives the baffle 533A to descend, ensuring that the wafer box 550 can be safely taken and placed in the handover area.

[0093] The above-mentioned Map process is as follows: the cover opening component 542 descends to the starting position: the cover opening component 542 descends from the current position to the starting position of the Mapping scan to ensure that the cover opening component 542 does not interfere with the operation of the detection component 543; the detection component 543 extends: the telescopic cylinder 543B drives the detection frame 543A to rotate, so that the detection sensor 543C extends and enters the interior of the wafer box 550 to confirm that the detection mechanism has reached the scanning starting position; the cover opening component 542 descends to the end position: the cover opening component 542 continues to descend from the starting position to the Mapping scan starting position ing scan ends at the position, during the descent, the detection sensor 543C scans the inside of the wafer box 550; latching data calculation results: after the scan is completed, the system latches the detection data, analyzes the latched data, analyzes whether the product is stacked or tilted (whether there is tilt or misalignment), and generates an internal status report of the wafer box 550 based on the calculation results; detection component 543 retracts: the detection sensor 543C retracts from the inside of the wafer box 550 and returns to the initial position to confirm that the detection mechanism is fully retracted to avoid interference with subsequent operations.

[0094] In summary, the wafer loader of the present application improves the protection of the wafer through the baffle module 530. After the wafer box 550 is placed on the carrier module 520, the baffle drive mechanism 534 drives the lifting baffle assembly 533 to rise, so that the left baffle assembly 531, the right baffle assembly 532, and the lifting baffle assembly 533 are arranged around the carrier module 520 to form a protective structure to protect the wafer box 550 and prevent misoperation from causing fragments. The wafer loader of the present application reduces the production cost through the coordinated action of the carrier module 520 and the cover opening detection module 540. After the cover opening assembly 542 fixes and unlocks the lid 551 of the wafer box 550 located at the cover opening station, the linear drive mechanism 521 drives the wafer box 550 to retreat from the cover opening station to the detection station, so that the wafer box 550 and the lid 551 are separated, and the lifting and lowering movement of the cover opening assembly 542 and the detection assembly 543 is not interfered with by the wafer box 550. Compared with the existing wafer automatic loading equipment, the wafer loader of the present application does not need to be configured with a horizontal moving mechanism on the cover opening component 542 to open the cover 551, but uses the horizontal driving mechanism of the carrier module 520 to drive the wafer box 550 to move, and then open the cover 551. That is, the horizontal driving mechanism has the function of driving the wafer box 550 to move between the inspection station and the cover opening station, and opening the cover 551 of the wafer box 550. The wafer box 550 can synchronously complete the cover opening action when returning to the inspection station. In this way, the wafer loader of the present application can eliminate the use of the horizontal driving mechanism, thereby reducing the production cost.

[0095] This embodiment discloses a detection method for wafer detection equipment, including the following steps: placing a wafer on a scanning stage 110; the scanning stage 110 moves along the positive direction of a first direction, the front bright field light source 121 and the back bright field light source 131 are synchronously turned on, the front optical imaging module 120 generates a bright field image of the front side of the wafer, and the back optical imaging module 130 generates a bright field image of the back side of the wafer; when the scanning stage 110 moves along the negative direction of the first direction, the front dark field light source 122 and the back dark field light source 132 are synchronously turned on, the front optical imaging module 120 generates a dark field image of the front side of the wafer, and the back optical imaging module 130 generates a dark field image of the back side of the wafer; the bright field images and dark field images of the front and back sides of the wafer are compared with a standard wafer image template to determine whether there are defects on the wafer surface or whether there are foreign objects or dirt on the surface.

[0096] The inspection method of this embodiment uses a single round trip scan of the scanning stage 110 to simultaneously capture both brightfield and darkfield images on both sides. Compared to conventional step-by-step inspection methods that require four unidirectional scans, this method improves inspection efficiency and is particularly suitable for mass production scenarios. The dual-sided optical imaging modules operate synchronously, eliminating the need to flip the wafer and reducing the risk of wafer damage. By combining brightfield and darkfield multimodal inspection, various defects on both sides of the wafer can be identified, reducing the rate of missed detections.

[0097] Furthermore, to avoid missed inspections due to obstructions on the back side of the wafer, the inspection method further includes the following steps: after the scanning stage 110 moves in the positive and negative directions of the first direction, the wafer is lifted and rotated by a first angle to expose a portion of the back side of the wafer obscured by the scanning stage 110; the back side optical imaging module 130 generates a bright field image and a dark field image of the back side of the rotated wafer, and generates a complete back side image of the wafer by stitching the images before and after the rotation of the back side of the wafer. By rotating the wafer to expose the area obscured by the scanning stage 110, the back side of the wafer is fully covered by the inspection, ensuring image integrity.

[0098] In addition, in order to detect the width of the line on the wafer surface, the detection method also includes the following steps: placing the wafer on the movable stage 210; the data processing module establishes a wafer surface coordinate map based on several feature points of the microscopic image generated by the microscopic measurement lens group 220, and sets the target coordinate point of the target line to be measured; controlling the movable stage 210 to move the wafer to the target coordinate point, and controlling the lens group height adjustment mechanism 230 to drive the microscopic measurement lens group 220 to move in the vertical direction to achieve focusing; capturing all pixel grids of the target line in the microscopic image in the measurement direction, and calculating the number of pixel grids N, and calculating the line width W=N×S based on the number of pixel grids N and the pixel grid side length S. The detection method disclosed in the present invention establishes a coordinate map through the microscopic image feature points and eliminates the influence of optical distortion through the pixel grid calibration algorithm (W=N×S), which can improve measurement accuracy. The coordinated control of autofocus and stage movement can shorten measurement time and improve overall efficiency.

[0099] Those skilled in the art will appreciate that the above embodiments are merely intended to clearly illustrate the present disclosure and are not intended to limit the scope of the present disclosure. Other changes or modifications may be made based on the above disclosure, and such changes or modifications are still within the scope of the present disclosure.

Claims

1. A wafer inspection device, characterized in that: include: A double-sided detection unit, comprising: a scanning stage, used for placing a wafer and moving linearly along a first direction; and The front optical imaging module and the back optical imaging module are respectively arranged on opposite sides of the scanning stage, the front optical imaging module is provided with a front bright field light source and a front dark field light source, and the back optical imaging module is provided with a back bright field light source and a back dark field light source; Wherein, when the scanning stage moves along the positive direction of the first direction, the front bright field light source and the back bright field light source are synchronously turned on, the front optical imaging module generates a bright field image of the front side of the wafer, and the back optical imaging module generates a bright field image of the back side of the wafer; when the scanning stage moves along the negative direction of the first direction, the front dark field light source and the back dark field light source are synchronously turned on, the front optical imaging module generates a dark field image of the front side of the wafer, and the back optical imaging module generates a dark field image of the back side of the wafer; The front optical imaging module and the back optical imaging module are respectively arranged above and below the scanning stage; the scanning stage blocks a portion of the back side of the wafer; The wafer inspection equipment further includes a rotary lifting device, which is disposed below the scanning stage. After the scanning stage moves in a positive direction and a negative direction of the first direction, the rotary lifting device lifts the wafer and rotates it by a first angle to expose a portion of the back surface of the wafer that is blocked by the scanning stage. The back optical imaging module generates a bright field image and a dark field image of the back side of the rotated wafer, and generates a complete back side image of the wafer by splicing the images before and after the back side of the wafer is rotated.

2. The wafer inspection device according to claim 1, characterized in that: The rotary lifting device includes a rotary lifting shaft located below the scanning platform, a lifting drive mechanism for lifting the rotary lifting shaft, and a rotary drive mechanism for rotating the rotary lifting shaft to a first angle after being lifted. A suction plate for fixing the wafer is provided on the top of the rotary lifting shaft.

3. The wafer inspection device according to claim 1, wherein: The wafer inspection device further includes a microscopic measurement unit, which includes: A movable stage, used to carry the wafer and move along a horizontal plane; a microscopic measurement lens assembly configured to magnify the surface circuits of the wafer carried on the movable stage and generate a microscopic image; A lens group height adjustment mechanism, used to drive the micro-measuring lens group to move in a vertical direction to achieve focusing; and The data processing module is programmed to perform the following operations: Establish a wafer surface coordinate map based on the microscopic image generated by the microscopic measurement lens group, and set the target coordinate points of the target line to be measured; In the fully automatic mode, the movable stage is controlled to move the wafer to the target coordinate point, and the lens group height adjustment mechanism is controlled to drive the micro-measuring lens group to move in the vertical direction to achieve focusing; Capture all pixel grids of the target line in the measurement direction in the microscopic image and calculate the number of pixel grids N. Based on the number of pixel grids N and the pixel grid side length S, calculate the line width W = N × S.

4. The wafer inspection equipment according to claim 3, characterized in that: The movable stage adjusts the position of the wafer manually, and the lens group height adjustment mechanism adjusts the height of the micro-measuring lens group manually to achieve focusing.

5. The wafer inspection equipment according to claim 3, characterized in that: The wafer inspection equipment further includes a wafer transport module and an edge patrol device, wherein the wafer transport module includes: A dual-arm robot, comprising at least two robotic arms, the two robotic arms being configured to alternately perform wafer pick-up and placement actions; and A moving mechanism drives the dual-arm manipulator to move linearly in a horizontal direction; Among them, the dual-arm robot is used to take out the wafer from the wafer box, transport the wafer to the edge patrol device to complete edge correction, transport the wafer to the double-sided inspection unit and the micro-measurement unit in turn, and after the wafer inspection and measurement are completed, return the wafer to the wafer box.

6. The wafer inspection device according to claim 5, characterized in that: The wafer inspection equipment further includes a wafer loader, and the wafer loader is provided with the wafer box.

7. A wafer inspection method, implemented using the wafer inspection device according to any one of claims 1 to 6, characterized in that: The wafer detection method comprises the following steps: Place the wafer on the scanning stage; The scanning stage moves along the positive direction of the first direction, the front bright field light source and the back bright field light source are turned on synchronously, the front optical imaging module generates a bright field image of the front side of the wafer, and the back optical imaging module generates a bright field image of the back side of the wafer; When the scanning stage moves along the negative direction of the first direction, the front dark field light source and the back dark field light source are synchronously turned on, the front optical imaging module generates a dark field image of the front side of the wafer, and the back optical imaging module generates a dark field image of the back side of the wafer; Compare the brightfield and darkfield images of the front and back sides of the wafer with a standard wafer image template; The wafer detection method further comprises the following steps: After the scanning stage moves along the positive and negative directions of the first direction, the wafer is lifted and rotated by a first angle to expose a portion of the back side of the wafer that is blocked by the scanning stage; the back optical imaging module generates a bright field image and a dark field image of the back side of the rotated wafer, and generates a complete back side image of the wafer by splicing the images before and after the rotation of the back side of the wafer.

8. The wafer detection method according to claim 7, characterized in that: The following steps are also included: Place the wafer on the moving stage; The data processing module establishes a wafer surface coordinate map based on the microscopic image generated by the microscopic measurement lens group, and sets the target coordinate points of the target circuit to be measured; Controlling the movable stage to move the wafer to the target coordinate point, and controlling the lens group height adjustment mechanism to drive the micro-measuring lens group to move in the vertical direction to achieve focusing; Capture all pixel grids of the target line in the measurement direction in the microscopic image and calculate the number of pixel grids N. Based on the number of pixel grids N and the pixel grid side length S, calculate the line width W = N × S.

Images