Temperature control method for board, program product, electronic device and storage medium

Abstract

The present application discloses a temperature control method for a board, a program product, an electronic device, and a storage medium, and relates to the field of big data algorithm technology, including: obtaining the current temperature of the board collected by multiple temperature sensors in a working state to determine the actual temperature of the board, and calculating the difference between the current temperature and the preset temperature; based on the comparison result of the difference with the preset safety threshold, generating the target adjustment impedance of the heating circuit of the board or the target wind speed of the fan, so as to adjust the variable resistance of the heating circuit or the wind speed of the fan so that the actual temperature is within the preset safety range. The present application solves the technical problem that an abnormality of one sensor in the board design causes the entire board to work abnormally, resulting in user business interruption, and increases the board cost and maintenance cost, wasting manpower and material resources. The present application also solves the technical problem that an abnormality of one sensor in the board design causes the entire board to work abnormally, resulting in user business interruption, and increases the board cost and maintenance cost, and wastes ... achieves the technical effect of dynamically adjusting the board

Description

Technical Field

[0001] The present application relates to the field of big data algorithm technology, and in particular to a temperature control method for a board, a program product, an electronic device, and a storage medium. Background Art

[0002] With the development of the times and the advancement of technology, the components on PCB (Printed Circuit Board) circuit boards are getting smaller and smaller. The sensors, heating circuits and fans on the boards will have certain aging and failure problems.

[0003] Conventional board designs have only one sensor, and the board temperature can only be read via the traditional I2C (Inter-Integrated Circuit) signal. When the board ages or is exposed to high or low temperatures, the sensor, heating circuit, and fan may not properly recognize sensor signals due to aging components or excessively high or low ambient temperatures. This can cause the heating circuit to heat abnormally or malfunction, leading to malfunction of the entire board.

[0004] However, in the related art, when a sensor abnormality in the board design causes the entire board to work abnormally, users generally choose to directly replace the abnormal PCB board. This not only causes business interruption for users, but also increases the board cost and maintenance cost, greatly wasting manpower and material resources, and needs to be solved urgently. Summary of the Invention

[0005] The present application provides a temperature control method for a board, a program product, an electronic device, and a storage medium, to at least resolve the problem in the related art that, when an abnormality in one sensor causes abnormal operation of the entire board, users generally choose to directly replace the abnormal PCB board, which not only causes business interruption for users, but also increases board and maintenance costs, greatly wasting manpower and material resources.

[0006] The present application provides a temperature control method for a board, wherein the board is provided with a plurality of temperature sensors, wherein the method comprises the following steps: obtaining the current temperature of the board collected by the plurality of temperature sensors in a working state; determining the actual temperature of the board based on the current temperature collected by the plurality of temperature sensors, and calculating the difference between the actual temperature and a preset temperature; and generating a target adjustment impedance of a heating circuit of the board or a target wind speed of a fan based on a comparison result of the difference with a preset safety threshold, so as to adjust the variable resistance of the heating circuit based on the target adjustment impedance or adjust the wind speed of the fan based on the target wind speed, so that the actual temperature is within a preset safety range.

[0007] The present application also provides a computer program product, which is applied to a board, and the board is correspondingly provided with multiple temperature sensors, wherein the computer program product includes: an acquisition module, used to obtain the current temperature of the board collected by the multiple temperature sensors in a working state; a calculation module, used to determine the actual temperature of the board based on the current temperature collected by the multiple temperature sensors, and calculate the difference between the actual temperature and a preset temperature; a control module, used to generate a target adjustment impedance of the heating circuit of the board or a target wind speed of the fan based on a comparison result of the difference with a preset safety threshold, so as to adjust the variable resistance of the heating circuit based on the target adjustment impedance or adjust the wind speed of the fan based on the target wind speed, so that the actual temperature is within a preset safety range.

[0008] The present application also provides an electronic device, comprising: a memory for storing a computer program; and a processor for implementing the steps of any of the above-mentioned board temperature control methods when executing the computer program.

[0009] The present application also provides a computer-readable storage medium, in which a computer program is stored. When the computer program is executed by a processor, the steps of any of the above-mentioned temperature control methods for the board are implemented.

[0010] Through the present application, a computer can be used to dynamically monitor multiple temperature sensors of a board, so as to determine the actual temperature of the board according to the information collected by the temperature sensors, and then dynamically adjust the impedance of the board's variable resistor and the fan speed in real time according to the actual temperature, thereby changing the heating circuit power and the fan speed, so that the board temperature is always kept within a safe range. Therefore, it can solve the problem in the related art that when one sensor is abnormal and causes the entire PCB board to work abnormally, the user generally chooses to directly replace the abnormal PCB board, which not only causes the user's business to be interrupted, but also increases the board cost and maintenance cost, greatly wasting manpower and material resources. The working status of the PCB board is monitored in real time, and the board impedance, heating circuit power and fan speed are dynamically adjusted according to the board temperature to keep the board temperature within a safe range; and when one sensor fails, the system can automatically adjust to other temperature sensors to continue monitoring the board temperature, ensuring the continuous operation of the system, reducing the risk of PCB board failure, and also greatly reducing the cost and manpower of replacing the PCB board, thereby improving customer satisfaction with the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0012] Figure 1 A flow chart of a temperature control method for a board provided in an embodiment of the present application;

[0013] Figure 2 This is a schematic diagram of automatic board temperature monitoring and control according to one embodiment of the present application;

[0014] Figure 3 This is a flow chart of an algorithm for automatically monitoring board temperature according to one embodiment of the present application;

[0015] Figure 4 A block diagram of a computer program product provided according to an embodiment of the present application;

[0016] Reference numerals:

[0017] Among them, 10-computer program product; 100-acquisition module, 200-calculation module, 300-control module. DETAILED DESCRIPTION

[0018] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0019] It should be noted that, in the description of this application, the terms "comprises," "includes," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. The terms "first," "second," etc., in this application are used to distinguish similar objects, and are not used to describe a particular order or sequence.

[0020] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0021] An embodiment of the present application provides a temperature control method for a board, and the method is described in detail in conjunction with the execution flow of the temperature control method for the board.

[0022] Specifically, Figure 1 The present invention provides a flow chart of a temperature control method for a board according to an embodiment of the present application.

[0023] like Figure 1 As shown, the board is provided with a plurality of temperature sensors, and the temperature control method of the board includes the following steps:

[0024] In step S101, the current temperature of the board collected by multiple temperature sensors in working state is obtained.

[0025] In some embodiments, a conventional PCB board is provided with only one temperature sensor. As a result, if a problem occurs in one temperature sensor, the entire PCB board may also fail to operate.

[0026] Therefore, the embodiment of the present application can set up multiple temperature sensors on the board, thereby ensuring normal collection of the board temperature through multiple temperature sensors in working state, and helping to handle abnormal board temperature in a timely manner.

[0027] Among them, when the embodiment of the present application uses multiple temperature sensors in a working state to collect the temperature of the board, it can, but is not limited to, use an automatic temperature monitoring algorithm to dynamically collect the current temperature of the board.

[0028] It should also be noted that the board in the embodiment of the present application is provided with multiple temperature sensors not only means that multiple temperature sensors are provided on the entire board, but also means that multiple temperature sensors can be provided at each location (temperature sampling point) on the board where the temperature needs to be monitored. This can avoid the situation where, when a sensor monitoring the temperature at a certain point on the board fails, the board temperature cannot be monitored any further, which may cause the board to work abnormally.

[0029] Furthermore, not all of the multiple temperature sensors provided on the board need to be in working condition. Instead, at least one temperature sensor provided at a location (temperature sampling point) where the temperature of the board needs to be monitored only needs to be in working condition.

[0030] The embodiment of the present application can obtain the current temperature of the board collected by multiple temperature sensors in a working state, so as to facilitate timely control of the temperature of the board when the current temperature of the board becomes abnormal.

[0031] Optionally, in one embodiment of the present application, obtaining the current temperature of the board collected by multiple temperature sensors in a working state includes: obtaining temperature data of multiple temperature sensors in a working state; and performing data conversion on the temperature data to obtain the current temperature.

[0032] During the actual execution process, when obtaining the current temperature of the board collected by multiple temperature sensors in working state, it is sometimes not possible to directly use the data transmitted by the temperature sensor to read the current temperature of the board. The temperature sensor only collects and transmits relevant signal data (temperature data) that can obtain the temperature. Therefore, this application can also perform data conversion on the temperature data to obtain the current temperature data of the board collected by multiple temperature sensors.

[0033] For example, some analog temperature sensors (such as thermistors and thermocouples) can sense temperature changes through sensitive elements and convert the temperature physical quantity into electrical signals (such as voltage, current, resistance, etc.). In this case, embodiments of the present application can convert these electrical signals into corresponding digital data of the current temperature. For example, by using an analog-to-digital converter (such as an ADC), the electrical signal is converted into digital data of the current temperature (for example, 0-5V voltage corresponds to a digital value of 0-1024), and then transmitted to the main control chip of the board (such as an MCU). For some digital temperature sensors, the current temperature digital data can be directly output without additional conversion.

[0034] The embodiment of the present application can perform data conversion on the temperature data collected from multiple temperature sensors, so that signal data such as resistance can be converted into corresponding current temperature digital data, ensuring that the present application can meet various usage scenarios such as analog temperature sensors and digital temperature sensors, and can effectively improve the applicable scenarios of the present application.

[0035] Step S102 , determining the actual temperature of the board according to the current temperatures collected by the multiple temperature sensors, and calculating the difference between the actual temperature and the preset temperature.

[0036] In other embodiments, on a board with only one (one) temperature sensor installed, only the current temperature of the single temperature sensor can be used as the actual temperature of the board. However, on a board with multiple temperature sensors installed, it is necessary to combine the current temperatures collected by multiple temperature sensors based on a certain strategy so as to determine the actual temperature of the board based on the combined result.

[0037] After determining the actual temperature of the board, in order to determine whether the actual temperature of the board is normal, it is necessary to set a preset temperature, so as to determine whether the actual temperature of the board is normal or not based on the difference between the actual temperature and the preset temperature.

[0038] The preset temperature here can be understood as a certain normal temperature reference value or a certain normal temperature reference range of the board set in advance. The preset temperature can be used to determine whether the actual temperature of the board is in a normal state or an abnormal state.

[0039] It should be noted that the normal temperature of the board may be different for different boards and different board application scenarios. For example, for thin and light notebooks and gaming notebooks, the normal operating temperature of the thin and light notebook in a certain working state is generally 0℃ ~ 60℃, and the normal temperature of the board of a gaming notebook may sometimes rise to 65℃ ~ 75℃ for a short time. Therefore, the normal temperature of the board of a gaming notebook is higher than that of a thin and light notebook, generally 0℃ ~ 75℃. The specific preset temperature can be determined by professional and technical personnel in this technical field according to actual conditions. The embodiments of this application are only for illustrative purposes and are not specifically limited.

[0040] The embodiment of the present application can determine the actual temperature of the board based on the current temperature collected by multiple temperature sensors, thereby improving the accuracy of the actual temperature of the board, ensuring that whether the board temperature is normal is determined based on the actual temperature of the board and a certain reference temperature, and facilitating the execution of different temperature controls based on whether the board temperature is normal or not.

[0041] Optionally, in one embodiment of the present application, the actual temperature of the board is determined based on the current temperature collected by multiple temperature sensors, including: determining the area where the multiple temperature sensors are located in the board; determining the weight corresponding to each temperature sensor based on the area; and performing weighted average filtering on the current temperature based on the sampling rate and filtering parameters and weights corresponding to the multiple temperature sensors to obtain the actual temperature.

[0042] In other embodiments, considering that the temperature accuracy obtained by temperature sensors set at multiple positions on the board is different, the impact on the overall temperature of the board is also different, and the obtained data may contain noise, etc., the present application can determine the weights corresponding to multiple temperature sensors by the areas where multiple temperature sensors are located in the board, and then use the weighted average filter based on Gaussian weights to process the current temperature digital data collected by the temperature sensor in combination with the sampling rates and filtering parameters corresponding to the multiple temperature sensors to calculate the actual temperature of the board.

[0043] Among them, weighted average filtering based on Gaussian weights is a signal processing method. Its core idea is to assign weights to temperature sampling points at different locations according to Gaussian distribution (normal distribution) when smoothing the signal (such as the current temperature digital data). The closer the point is to the center, the greater the weight, and the farther the point is from the center, the smaller the weight, thereby highlighting key data and suppressing noise.

[0044] Based on this principle, when performing weighted average filtering on temperature data, this application needs to first determine the positions of multiple temperature sensors on the board, and then assign different weights to each temperature sensor according to the position of the temperature sensor and the importance or heat level of different areas of the board, and then calculate the weighted average value based on the weight as the current temperature of the board.

[0045] For example, this application can assign a higher weight (e.g., 50%) to sensors in areas of a PCB that generate a lot of heat or are highly sensitive (e.g., CPU, power module), and a lower weight (e.g., 10%) to less important areas (e.g., capacitors, resistors). For example, a PCB may have three core sensors (each with a weight of 20%) and five common sensors (each with a weight of 5%), for a total weight of 100%.

[0046] For example, the present application can distribute weights according to the distance of the temperature sensor from the heat source of the PCB board: the sensor close to the heat source has a higher weight, and the sensor far away from the heat source has a lower weight (for example, with the heat source as the center, the weight is distributed in proportion to the inverse of the distance).

[0047] Additionally, in some cases, the present application may also divide the PCB board into multiple areas based on functional modules or physical locations, internally process the sensor data within each area, and then comprehensively determine the final temperature. For example, the board can be divided into CPU modules, memory modules, power modules, I / O modules, etc. based on functional modules. The sensor data within each group is averaged or maximized, and the results of each group are then weighted averaged and filtered. For example, in a server board, the CPU module takes the maximum value of the sensors in that area, the power module takes the average value, and the final temperature takes the maximum value of the results of all modules.

[0048] It should be noted that the specific weight distribution of the temperature sensors can be determined by professional and technical personnel in this technical field according to actual conditions and actual needs. The embodiments of this application are only for illustrative purposes and are not specifically limited.

[0049] Furthermore, considering that weighted average filtering requires weighted calculation of multiple groups of sampled data within a time window, the higher the sampling rate, the more data points in the time window, the richer the historical data that the filtering algorithm can use, and the more accurately it can fit the temperature change trend. Therefore, the embodiment of the present application can also dynamically adjust the sampling rate and filtering parameters of the temperature sensor according to the temperature change information of the board, thereby combining the sampling rates and filtering parameters corresponding to multiple temperature sensors and weights to perform weighted average filtering on the temperature data to obtain the actual temperature of the board.

[0050] The embodiment of the present application can determine the weights corresponding to multiple temperature sensors based on the positions of the temperature sensors on the board, and dynamically adjust the sampling rate and filtering parameters of the temperature sensors based on the temperature change information of the board, so as to perform weighted average filtering based on Gaussian weights on the temperature data in combination with the weights, sampling rates and filtering parameters of the temperature sensors, thereby highlighting key data and suppressing noise, thereby ensuring the reliability of the current temperature and further ensuring the accuracy of the actual temperature of the board.

[0051] Optionally, in one embodiment of the present application, before determining the actual temperature of the board based on the current temperature collected by multiple temperature sensors, it also includes: judging whether each temperature sensor is faulty; if any temperature sensor is faulty, discarding the current temperature of the faulty temperature sensor, and counting the actual number of faulty temperature sensors; when the actual number is greater than the preset number, determining that the temperature collection of the board is abnormal, and matching the corresponding warning type and warning action according to the difference between the actual number and the preset number, so as to push the warning type and warning action to the user.

[0052] In some embodiments, the temperature sensor on the board may malfunction due to various reasons, such as physical damage to the hardware, circuit design defects, environmental factors, abnormal signal processing, and human error. If there is only one temperature sensor on the board, if the temperature sensor cannot properly monitor the temperature of the board, the heating circuit may heat abnormally or not work, thereby causing the entire board to malfunction.

[0053] In an embodiment of the present application, a plurality of temperature sensors are installed on the board, so the present application can detect whether there is a faulty temperature sensor among the multiple temperature sensors in working state on the board, and thus record the temperature sensor when a temperature sensor fails, so that when the difference between the actual number of faulty temperature sensors on the board and the preset number reaches a certain value, the corresponding warning type and warning action are matched, and the user is promptly reminded that the temperature sensor of the board is abnormal and takes corresponding response actions.

[0054] The preset number here can be understood as a pre-established threshold value of the number of faulty temperature sensors that may appear on the board, and in the embodiment of the present application, it can be, but is not limited to, set to three.

[0055] For example, the warning types may be, but are not limited to, digital signal reminders and action controls, and the corresponding warning actions may be, but are not limited to, interactive prompts, software-level control actions, and hardware-level control actions.

[0056] For example, when the difference between the actual number of temperature sensors and the preset number reaches 2, that is, when a temperature sensor failure occurs on a board, the matching warning type is digital signal reminder + action control, and the matching warning action is an interactive prompt. This application can, but is not limited to, transmit the fault sensor to the main control system through a digital signal, notify the display interface and the user for interactive prompts, such as pop-up red alarm signals, text prompts, etc. to remind the user of temperature sensor failure (such as "temperature sensor communication failure").

[0057] If the difference between the actual number of temperature sensors and the preset number reaches 1, meaning two temperature sensors fail on a single board, the matching alert type is action control, and the matching alert action is a software-level control action. This embodiment of the present application can, but is not limited to, temporarily forcibly shut down functional modules that rely on temperature sensors. For example, a temperature sensor failure could disable charging / discharging functions to prevent battery overheating, and this control action could be pushed to the user through the interface.

[0058] When the difference between the actual number of temperature sensors and the preset number reaches 0, that is, when three temperature sensors fail on a board, the matching alert type is action control, and the matching alert action is a hardware-level control action. The hardware circuit (such as the power management chip PMIC) automatically cuts off the power supply of part of the load, or reduces the chip operating frequency (such as controlling the GPU to automatically reduce the frequency to a safe frequency) to reduce heat, and pushes the control action to the user through the interface.

[0059] In addition, whenever a temperature sensor on the board fails, the embodiment of the present application can discard the current temperature collected by the failed temperature sensor and automatically adjust to another temperature sensor to replace the failed temperature sensor to continue working. The other temperature sensor is used to collect the temperature of the board to ensure that the temperature of the board can be monitored normally, thereby ensuring that the board can work normally.

[0060] The embodiment of the present application can discard the current temperature of the faulty temperature sensor when it is determined that the temperature sensor is faulty, thereby ensuring that the actual temperature of the board obtained by the system is valid and accurate. Furthermore, the embodiment of the present application can switch to other normal temperature sensors to continue working when the number of faulty temperature sensors counted exceeds a certain number, thereby ensuring that the board and related systems can continue to operate normally, reducing the risk of board failure, and thus greatly reducing the cost and manpower issues of replacing the board.

[0061] Generating abnormal alerts and pushing them to users will help users understand the situation in a timely manner to repair or replace the board, thereby ensuring that the board is in normal condition when the user uses it and improving customer satisfaction with the product.

[0062] Optionally, in one embodiment of the present application, determining whether each temperature sensor is faulty includes: collecting temperature change information of each temperature sensor within a target time and / or a work log of the board; and detecting whether each temperature sensor is faulty based on the temperature change information and / or the work log.

[0063] Based on the relevant descriptions of other embodiments, it can be understood that the present application can determine whether each temperature sensor in working state on the board is faulty, so that when the temperature sensor fails, it can switch to the normal temperature sensor in time to continue monitoring the temperature of the board, and when a certain number of faulty temperature sensors appear on the board, remind the user to repair the card or replace the board in time to avoid sudden abnormality of the board due to abnormality of the temperature sensor and delay the user's normal work.

[0064] In some embodiments, when determining whether a temperature sensor is faulty, the temperature change information of each temperature sensor within the target time or the work log of the board or the temperature change information of each temperature sensor within the target time and the work log of the board can be collected, and each temperature sensor can be monitored to determine whether it is faulty based on these temperature change information and work logs.

[0065] Temperature change information refers to the temperature changes of the board within the target time period, as collected by the temperature sensor. The target time period is defined as the time period (time range) during which the temperature sensor collects temperature change information. For example, collecting temperature change information within one minute or three minutes.

[0066] For example, the present application can collect the temperature change information of a board card collected by a temperature sensor within one minute. Under normal circumstances, the temperature change of the board card will have a certain change trend, such as gradually increasing or gradually decreasing. If the temperature of the board card collected by the temperature sensor within one minute is sometimes particularly high and sometimes particularly low, then it can be judged that the temperature sensor is faulty.

[0067] Alternatively, if the work log of the board records that a component of the board worked at a very high intensity during a certain period of time, but the temperature collected by the temperature sensor of the component was suppressed and maintained at a certain temperature, then it can also be determined that the temperature sensor is faulty.

[0068] It should be noted that there are many methods for determining temperature sensor failure. In actual application, professional and technical personnel in this technical field can select a judgment method based on actual conditions. The embodiments of this application are only for illustrative purposes and are not specifically limited.

[0069] The embodiment of the present application can determine whether the temperature sensor is faulty based on the temperature change information of the board card collected by the temperature sensor within the target time and / or the work log of the board card. Therefore, corresponding technical support can be provided for the system to use a certain algorithm to set a timing to determine whether the temperature sensor is faulty, which helps to detect whether the temperature sensor is faulty in a timely manner, and ensure that the board card will not have problems such as abnormal working status of the board card due to device aging, excessively high ambient temperature or excessively low temperature, thereby ensuring that there will be no service interruption on the user side.

[0070] Optionally, in one embodiment of the present application, each temperature sensor is detected to be faulty based on temperature change information and / or work log, including: performing mean filtering on the temperature change information, and determining the temperature change sequence of each temperature sensor within the target time in combination with the timestamp corresponding to the temperature change information and the processed temperature change information; preprocessing the work log, and correcting abnormal data in the preprocessed work log, determining the working events of the board within the target time based on the corrected work log and timestamp, and detecting the working conditions of other working components in the working event except each temperature sensor; based on the working conditions of other working components, judging whether the temperature change sequence complies with the temperature change rules corresponding to the working event; if the temperature change sequence complies with the temperature change rules corresponding to the working event, it is determined that the temperature sensor corresponding to the working event is not faulty; otherwise, it is determined that the temperature sensor corresponding to the working event is faulty.

[0071] During the actual execution process, when combining the temperature dynamic change information and the work log to detect whether each temperature sensor is faulty, the present application can, but is not limited to, first perform mean filtering on the temperature change information, thereby suppressing the noise in the temperature change information data, improving the reliability and accuracy of the data, and combining the timestamp corresponding to the temperature change information and the processed temperature change information to determine the temperature change sequence of each temperature sensor within the target time.

[0072] Then, the embodiment of the present application can pre-process the work log, for example, perform data cleaning on the work log, remove invalid record information in the work log, and then correct the abnormal data in the pre-processed work log, for example, correct the abnormal record information in the work log in combination with the previous and next records, so as to determine the working events of the board within the target time according to the corrected work log and timestamp, and detect the working conditions of other working components in the work event except each temperature sensor.

[0073] Based on the working conditions of other working components, the embodiment of the present application can determine whether other working components have abnormalities, and thus determine whether the temperature change sequence complies with the temperature change rules corresponding to the working event when it is determined that other working components have no abnormalities. If the temperature change sequence complies with the temperature change rules corresponding to the working event, it is determined that the temperature sensor corresponding to the working event is not faulty; otherwise, it is determined that the temperature sensor corresponding to the working event is faulty.

[0074] Taking the CPU board as an example, this application can, but is not limited to, first collect the temperature data (temperature change information) of the CPU temperature sensor within a certain period of time as: [25℃, 28℃, 32℃, 30℃, 33℃], and the corresponding timestamps are [10:00:00, 10:00:01, 10:00:02, 10:00:03, 10:00:04].

[0075] Then, the embodiment of the present application can perform mean filtering on these temperature data. For example, the window size is 3, and the first filtering is performed: (25 + 28 + 32) / 3 = 28.3°C; then the second filtering is performed: (28 + 32 +30) / 3 = 30°C; and finally the third filtering is performed: (32 + 30 + 33) / 3 = 31.7°C.

[0076] Next, combining the timestamp of the temperature change information with the processed data, we can get the temperature change sequence of the CPU temperature sensor: [(10:00:01, 28.3°C), (10:00:02, 30°C), (10:00:03, 31.7°C)].

[0077] At the same time, the work log is pre-processed. For example, the original work log contains information such as "10:00:00 Board startup", "10:00:01", "10:00:02 Start running a large computing task", "10:00:03 Board temperature drops to -10°C", and "10:00:05 Task completed".

[0078] First, remove the record "10:00:00" in the original work log that lacks key information. At the same time, it is detected that "10:00:03 the board temperature dropped sharply to -10°C", which is obviously abnormal and belongs to abnormal data. This abnormal data can be removed. The corrected work log shows that the board was started at 10:00:00, the large computing task started at 10:00:02, and the task ended at 10:00:05.

[0079] At this point, the work event and the operating conditions of the relevant components were determined. Based on the corrected work log and timestamp, the work event was determined to be "Starting a large computing task at 10:00:02." At this time, in addition to the temperature sensor, components such as the CPU and power module began operating at high loads. Logs and other monitoring data revealed that CPU utilization rose from 20% to 90%, and the power module output power increased, indicating that these components were under high load.

[0080] Finally, determine whether the temperature sensor is faulty. Normally, the CPU temperature should rise when a large computing task begins. In the known temperature change sequence, from 10:00:02 to 10:00:03, the CPU temperature rose from 30°C to 31.7°C, meeting the temperature rise rule for large computing tasks. Therefore, the CPU temperature sensor corresponding to this work event is not faulty. If, during the same work event, the temperature drops instead of rises or remains unchanged, this does not meet the temperature change rule, and the CPU temperature sensor is considered faulty.

[0081] The embodiment of the present application can improve the reliability of temperature change information data through mean filtering, construct a temperature change sequence in combination with timestamps, and pre-process logs to correct abnormal data to accurately locate working events and component working conditions. Based on the matching analysis of working conditions and temperature rules, data interference is efficiently eliminated, sensor faults can be accurately located, and the accuracy and reliability of fault detection can be improved.

[0082] In step S103, based on the comparison result between the difference and the preset safety threshold, a target adjustment impedance of the heating circuit of the board or a target wind speed of the fan is generated, so as to adjust the variable resistance of the heating circuit based on the target adjustment impedance or adjust the wind speed of the fan based on the target wind speed, so that the actual temperature is within the preset safety range.

[0083] As a possible implementation method, after obtaining the actual temperature of the board, the embodiment of the present application can generate different temperature control actions according to the comparison result of the difference between the actual temperature of the board and a certain temperature and the preset safety threshold, so as to maintain the temperature of the board within the preset safety range.

[0084] The preset safety threshold can be understood as a preset reference safety threshold for the difference between the actual temperature of a board and a certain temperature. If the difference is above or below the safety threshold, it can be considered that the board's temperature is abnormal, which may cause the board to malfunction. For example, the safety threshold can be set to any value between 0 and 5. If the difference between the actual temperature of the board and the certain temperature is less than 0 or greater than 5, it can be considered that the board's temperature is abnormal.

[0085] The preset safety interval here can be understood as a pre-set safe temperature range for the board, which can be the same as the normal temperature value (normal temperature range) of the board in the preset temperature example in the previous embodiment, or it can be different. For example, the normal operating temperature of a thin and light notebook is generally 0℃ ~ 60℃, and the temperature safety interval can also be set to 0℃ ~ 60℃, or it can be set to -5℃ ~ 65℃ (plus a certain safety threshold). The specific safety threshold and preset safety interval can be determined by professional and technical personnel in this technical field according to actual conditions, and the embodiments of this application do not impose specific restrictions.

[0086] Based on the comparison results of the board, the embodiments of the present application can, but are not limited to, generate the target adjustment impedance of the heating circuit of the board or the target wind speed of the fan, so as to adjust the variable resistance of the heating circuit according to the generated target adjustment impedance of the heating circuit, or adjust the wind speed of the fan according to the target wind speed of the fan, thereby controlling the temperature of the board so that the actual temperature of the board is maintained within a safe range.

[0087] The target adjustment impedance here refers to the impedance adjustment value calculated based on the actual temperature of the board card to adjust the actual temperature of the board card to a normal temperature. The target wind speed here refers to the wind speed value calculated based on the actual temperature of the board card to adjust the actual temperature of the board card to a normal temperature.

[0088] It should be noted that the target adjustment impedance of the specific heating circuit or the target wind speed needs to be calculated based on the actual temperature of the board. The embodiments of this application are only for illustrative purposes and are not specifically limited.

[0089] In an embodiment of the present application, the target adjustment impedance of the heating circuit of the board or the target wind speed of the fan can be generated by comparing the difference between the actual temperature of the board and a certain temperature with a certain safety threshold, so as to adjust the actual temperature of the board by adjusting the variable resistance of the heating circuit or the wind speed of the fan, so that the actual temperature of the board is within a certain safety temperature range.

[0090] Optionally, in one embodiment of the present application, based on the comparison result of the difference and the preset safety threshold, the target adjustment impedance of the heating circuit of the board or the target wind speed of the fan is generated, including: when the comparison result is that the difference is less than the preset safety threshold, the target adjustment impedance of the heating circuit is generated based on the actual temperature of the board; when the comparison result is that the difference is greater than the preset safety threshold, the target wind speed of the fan is generated based on the actual temperature of the board.

[0091] During the actual implementation process, the present application can generate the target adjustment impedance of the heating circuit or the target wind speed of the fan based on the comparison result of the difference between the actual temperature of the board and a certain temperature and a certain safety threshold. Specifically, when the comparison result is that the difference is greater than the certain safety threshold, the present application can generate the target wind speed of the fan based on the actual temperature of the board; when the comparison result is that the difference is less than the certain safety threshold, the present application can generate the target adjustment impedance of the heating circuit based on the actual temperature of the board.

[0092] Among them, when the comparison result is that the difference is less than a certain safety threshold, that is, the difference between the actual temperature of the board and a certain temperature is less than the safety threshold, it means that the actual temperature of the board is less than the certain temperature, and the board temperature is too low. The system will receive an instruction. At this time, the embodiment of the present application can adjust the resistance of the variable resistor and start the heating circuit to heat. When the board temperature returns to normal, the heating circuit is turned off.

[0093] When the comparison result shows that the difference is greater than a certain safety threshold, that is, the difference between the actual temperature of the board and the certain temperature is greater than the safety threshold, it means that the actual temperature of the board is greater than the certain temperature, and the board temperature is too high. The system will receive an instruction. At this time, the embodiment of the present application can generate a certain target wind speed for the fan, and increase the fan speed by adjusting the fan speed, which helps to dissipate heat from the board. When the board temperature returns to normal, the fan returns to normal speed.

[0094] The embodiment of the present application can dynamically adjust the board impedance, heating circuit power and fan speed according to the board temperature to ensure continuous operation of the system and reduce the occurrence of faults.

[0095] The temperature control method of the board in this application is explained in detail below using a specific embodiment.

[0096] Figure 2 This is a schematic diagram of automatic monitoring and control of board temperature according to an embodiment of the present application. Figure 2 As shown:

[0097] 1. The board control system uses a temperature monitoring algorithm to dynamically collect information from multiple temperature sensors on the PCB board through multiple sensing channels to monitor the board temperature and analyze the temperature value information within the system; Figure 3 This is a flow chart of an automatic temperature monitoring algorithm for a board card according to an embodiment of the present application. Figure 3 As shown, the board temperature automatic monitoring algorithm can be expressed as follows but is not limited to:

[0098] (1) Initialization

[0099] Initialize the I2C communication link of the PCB board, configure the registers of multiple temperature sensors, and set parameters such as sampling rate and filtering;

[0100] (2) Dynamic collection of temperature data

[0101] Read raw data from multiple temperature sensors through the I2C interface and convert the raw data from multiple temperature sensors into actual temperature values. The sampling rate and filter parameters can be dynamically adjusted according to temperature changes to ensure the accuracy of the collected temperature data.

[0102] (3) Gaussian weight processing of temperature data

[0103] The temperature data is filtered using a weighted average filtering algorithm based on Gaussian weights to remove unnecessary noise.

[0104] (4) Real-time monitoring of temperature mesh network (temperature monitoring system built based on wireless mesh network technology)

[0105] Set the board temperature threshold to room temperature. When the board temperature exceeds or falls below the set threshold, a real-time abnormal temperature record is generated through the mesh network.

[0106] (5) Temperature data recording and reporting

[0107] The temperature data is recorded in a log file and uploaded to the server. The server analyzes the temperature data in real time and reports any abnormal temperature in a timely manner, triggering fan speed regulation or heating circuits to ensure that the board temperature is controllable.

[0108] (6) Real-time temperature monitoring of the main cycle

[0109] In the real-time temperature monitoring main loop, steps 1-5 are continuously executed to achieve real-time monitoring of the board temperature and trigger strategies such as fan speed regulation or heating circuit to ensure that board problems are controllable and the normal operation of the system is guaranteed.

[0110] Second, when the actual temperature of the board card exceeds the temperature threshold (equivalent to the difference between the actual temperature of the board card and a certain temperature being greater than a certain safety threshold in the previous embodiment), the board card temperature is too high, and the system will receive a command to adjust the fan speed to increase the fan speed. When the board card temperature returns to normal, the fan speed returns to normal.

[0111] When the actual temperature of the board is lower than the temperature threshold (equivalent to the difference between the actual temperature of the board and a certain temperature being less than a certain safety threshold in the previous embodiment), the board temperature is too low, and the system will receive an instruction to adjust the resistance of the variable resistor and start the heating circuit. When the board temperature returns to normal, the heating circuit will be turned off.

[0112] Through the description of the above implementation methods, those skilled in the art can clearly understand that the method according to the above embodiment can be implemented by means of software plus the necessary general hardware platform, and of course it can also be implemented by hardware, but in many cases the former is a better implementation method.

[0113] An embodiment of the present application also provides a computer program product.

[0114] Figure 4 A block diagram of a computer program product provided according to an embodiment of the present application.

[0115] like Figure 4As shown, the computer program product 10 is applied to a board, and the board is correspondingly provided with a plurality of temperature sensors. The computer program product 10 includes: an acquisition module 100 , a calculation module 200 and a control module 300 .

[0116] The acquisition module 100 is used to acquire the current temperature of the board collected by multiple temperature sensors in working state;

[0117] The calculation module 200 is used to determine the actual temperature of the board according to the current temperature collected by multiple temperature sensors, and calculate the difference between the actual temperature and the preset temperature;

[0118] The control module 300 is used to generate a target adjustment impedance of the heating circuit of the board or a target wind speed of the fan based on the comparison result of the difference and the preset safety threshold, so as to adjust the variable resistance of the heating circuit based on the target adjustment impedance or adjust the wind speed of the fan based on the target wind speed, so that the actual temperature is within the preset safety range.

[0119] Optionally, in one embodiment of the present application, the acquisition module 100 includes: an acquisition unit and a calculation unit.

[0120] The acquisition unit is used to acquire temperature data of multiple temperature sensors in working state.

[0121] The calculation unit is used to perform data conversion on the temperature data to obtain the current temperature.

[0122] Optionally, in one embodiment of the present application, it further includes: a judgment module, a statistics module and a generation module.

[0123] The judgment module is used to judge whether each temperature sensor is faulty before determining the actual temperature of the board according to the current temperatures collected by the multiple temperature sensors.

[0124] The statistics module is used for discarding the current temperature of the failed temperature sensor when any temperature sensor fails, and counting the actual number of failed temperature sensors.

[0125] The matching module is used to determine that the temperature collection of the board is abnormal when the actual number is greater than the preset number, and match the corresponding warning type and warning action according to the difference between the actual number and the preset number, so as to push the warning type and warning action to the user.

[0126] Optionally, in one embodiment of the present application, the judgment module includes: a collection unit and a detection unit.

[0127] The acquisition unit is used to collect the temperature change information of each temperature sensor within the target time and / or the work log of the board.

[0128] The detection unit is used to detect whether each temperature sensor is faulty based on the temperature dynamic change information and / or the work log.

[0129] Optionally, in one embodiment of the present application, the detection unit includes: a processing subunit, a detection subunit and a judgment subunit.

[0130] The processing subunit is used to perform mean filtering on the temperature change information, and determine the temperature change sequence of each temperature sensor within the target time by combining the timestamp corresponding to the temperature change information and the processed temperature change information.

[0131] The detection subunit is used to preprocess the work log and correct the abnormal data in the preprocessed work log, determine the work events of the board within the target time based on the corrected work log and timestamp, and detect the working conditions of other working components except each temperature sensor in the work event.

[0132] The judgment subunit is used to judge whether the temperature change sequence conforms to the temperature change rules corresponding to the working event based on the working conditions of other working components. If the temperature change sequence conforms to the temperature change rules corresponding to the working event, it is judged that the temperature sensor corresponding to the working event is not faulty; otherwise, it is judged that the temperature sensor corresponding to the working event is faulty.

[0133] Optionally, in one embodiment of the present application, the control module 300 includes: a first generation unit and a second generation unit.

[0134] The first generating unit is configured to generate a target adjustment impedance of the heating circuit when the comparison result shows that the difference is less than a preset safety threshold.

[0135] The second generating unit is configured to generate a target wind speed for the fan when the comparison result shows that the difference is greater than a preset safety threshold.

[0136] For the description of the features in the embodiment corresponding to the computer program product 10, reference can be made to the relevant description of the embodiment corresponding to the temperature control method of the board, which will not be repeated here.

[0137] An embodiment of the present application further provides an electronic device, comprising a memory and a processor, wherein the memory stores a computer program, and the processor is configured to run the computer program to execute the steps of any of the above-mentioned embodiments of the temperature control method for a board.

[0138] An embodiment of the present application further provides a computer-readable storage medium, in which a computer program is stored, wherein the computer program is configured to execute the steps of any of the above-mentioned embodiments of the temperature control method for a board when running.

[0139] In an exemplary embodiment, the computer-readable storage medium may include, but is not limited to, various media that can store computer programs, such as a USB flash drive, a read-only memory (ROM), a random access memory (RAM), a mobile hard disk, a magnetic disk, or an optical disk.

[0140] An embodiment of the present application further provides a computer program product, which includes a computer program. When the computer program is executed by a processor, the steps of any of the above-mentioned embodiments of the temperature control method for a board are implemented.

[0141] An embodiment of the present application also provides another computer program product, including a non-volatile computer-readable storage medium, which stores a computer program. When the computer program is executed by a processor, it implements the steps in any of the above-mentioned embodiments of the temperature control method for the board.

[0142] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the above description has generally described the components and steps of each example according to their functions. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0143] The above is a detailed introduction to the temperature control method, program product, electronic device and storage medium of a board provided by the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core ideas of the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A temperature control method for a board, characterized in that: The board is provided with a plurality of temperature sensors, wherein the method comprises the following steps: Acquire the current temperature of the board collected by the multiple temperature sensors in working state; Determine the actual temperature of the board according to the current temperatures collected by the multiple temperature sensors, and calculate the difference between the actual temperature and the preset temperature; Based on a comparison result of the difference and a preset safety threshold, a target adjustable impedance of the heating circuit of the board or a target wind speed of the fan is generated, and the variable resistor of the heating circuit is adjusted based on the target adjustable impedance or the wind speed of the fan is adjusted based on the target wind speed, so that the actual temperature is within a preset safety range; Before determining the actual temperature of the board based on the current temperatures collected by the multiple temperature sensors, the method further includes: determining whether each temperature sensor is faulty; if any temperature sensor is faulty, discarding the current temperature of the faulty temperature sensor, and counting the actual number of the faulty temperature sensors; if the actual number is greater than a preset number, determining that the temperature collection of the board is abnormal, and matching a corresponding warning type and warning action based on the difference between the actual number and the preset number, so as to push the warning type and warning action to the user; Before determining the actual temperature of the board according to the current temperatures collected by the multiple temperature sensors, the method further includes: collecting temperature change information of each temperature sensor within a target time and / or a work log of the board; and detecting whether each temperature sensor is faulty based on the temperature change information and / or the work log; Among them, the detecting whether each temperature sensor is faulty based on the temperature change information and / or the work log includes: performing mean filtering on the temperature change information, and determining the temperature change sequence of each temperature sensor within the target time in combination with the timestamp corresponding to the temperature change information and the processed temperature change information; performing data cleaning on the work log, and correcting abnormal data in the work log after data cleaning, determining the working event of the board within the target time according to the corrected work log and the timestamp, and detecting the working conditions of other working components except each temperature sensor in the working event; based on the working conditions of the other working components, determining the temperature change rules corresponding to the other working components to judge whether the temperature change sequence complies with the temperature change rules corresponding to the working event; if the temperature change sequence complies with the temperature change rules corresponding to the working event, it is determined that the temperature sensor corresponding to the working event is not faulty; otherwise, it is determined that the temperature sensor corresponding to the working event is faulty.

2. The method according to claim 1, characterized in that The obtaining of the current temperature of the board collected by the plurality of temperature sensors in a working state includes: Acquiring temperature data of the plurality of temperature sensors in a working state; The temperature data is converted to obtain the current temperature.

3. The method according to claim 1, characterized in that The generating, based on a comparison result of the difference and a preset safety threshold, a target adjustment impedance of the heating circuit of the board or a target wind speed of the fan, comprises: If the comparison result shows that the difference is less than the preset safety threshold, generating a target adjustment impedance of the heating circuit based on the actual temperature of the board; If the comparison result shows that the difference is greater than the preset safety threshold, a target wind speed of the fan is generated based on the actual temperature of the board.

4. A computer program product, characterized in that Applied to a board, the board correspondingly provided with a plurality of temperature sensors, wherein the computer program product comprises: an acquisition module, configured to acquire the current temperature of the board collected by the multiple temperature sensors in a working state; a calculation module, configured to determine the actual temperature of the board according to the current temperatures collected by the multiple temperature sensors, and calculate the difference between the actual temperature and a preset temperature; a control module, configured to generate a target adjustable impedance of the heating circuit of the board or a target wind speed of the fan based on a comparison result of the difference and a preset safety threshold, and adjust the variable resistance of the heating circuit based on the target adjustable impedance or adjust the wind speed of the fan based on the target wind speed so that the actual temperature is within a preset safety range; The computer program product further includes: a judgment module for judging whether each temperature sensor is faulty before determining the actual temperature of the board based on the current temperatures collected by the multiple temperature sensors; a counting module for discarding the current temperature of the faulty temperature sensor and counting the actual number of the faulty temperature sensors if any temperature sensor is faulty; a matching module for determining that the temperature collection of the board is abnormal if the actual number is greater than a preset number, and matching a corresponding warning type and warning action based on the difference between the actual number and the preset number, so as to push the warning type and warning action to the user; The judgment module includes: a collection unit for collecting temperature change information of each temperature sensor within a target time and / or a work log of the board; a detection unit for detecting whether each temperature sensor is faulty based on the temperature change information and / or the work log; Among them, the detection unit includes: a processing subunit, which is used to perform mean filtering on the temperature change information, and determine the temperature change sequence of each temperature sensor within the target time in combination with the timestamp corresponding to the temperature change information and the processed temperature change information; a detection subunit, which is used to perform data cleaning on the work log, and correct the abnormal data in the work log after data cleaning, determine the working event of the board within the target time according to the corrected work log and the timestamp, and detect the working conditions of other working components except each temperature sensor in the working event; a judgment subunit, which is used to determine the temperature change rules corresponding to the other working components based on the working conditions of the other working components, so as to judge whether the temperature change sequence conforms to the temperature change rules corresponding to the working event. If the temperature change sequence conforms to the temperature change rules corresponding to the working event, it is judged that the temperature sensor corresponding to the working event does not have a fault; otherwise, it is judged that the temperature sensor corresponding to the working event has a fault.

5. The computer program product according to claim 4, wherein The acquisition module includes: an acquiring unit, configured to acquire temperature data of the plurality of temperature sensors in a working state; A processing unit is used to perform data conversion on the temperature data to obtain the current temperature.

6. An electronic device, characterized in that: include: A memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the temperature control method for the board according to any one of claims 1 to 3.

7. A computer-readable storage medium having a computer program stored thereon, characterized in that: The program is executed by a processor to implement the temperature control method of the board according to any one of claims 1 to 3.

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