Extruder material strip cooling equipment design method and device and computer equipment
Computational modeling and flow-solid-thermal coupling analysis optimize plastic extrusion machine die cooling devices, addressing inefficiencies in existing methods by ensuring precise temperature control and reducing waste.
Patent Information
- Application Number
- CN202510391076.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-31
- Publication Date
- 2025-07-15
AI Technical Summary
In the prior art, the design of plastic extruder strip cooling equipment lacks accuracy, resulting in repeated adjustments during the production process, which consumes time and effort, making it difficult to adapt to different types and temperature changes, and generates a large amount of waste.
By establishing a grid model, combining flow-solid thermal coupling analysis, the boundary conditions of the water and air domain of the strip cooling equipment are obtained, and the temperature field is calculated using the parameterized APP to accurately design the space arrangement of the cooling equipment.
The precise design of the strip cooling equipment is realized to ensure that the plastic particles are fully cooled, avoid heat accumulation, improve production efficiency, and optimize the color and quality of the plastic particles.
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Figure CN120316985A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of chemical production, and particularly relates to a design method, device, and computer equipment for an extruder strip cooling device. Background Art
[0002] In plastic processing, a plastic extruder is an important device that obtains plastic particles by heating, melting, extruding, cooling, and pelletizing plastic raw materials. Among them, the design of the extruder strip cooling device is a key factor, which directly affects the final temperature, color, quality, and processing performance of the plastic particles. Therefore, how to accurately predict and control the cooling temperature field of plastic raw materials is an important research topic. Different types and different filled plastic strips require different strip cooling devices. The initial temperature at the extruder outlet ranges from 350°C to 100°C. When switching production, the strip cooling device needs to be readjusted. At the same time, due to temperature differences between winter and summer and requirements for production capacity improvement, the corresponding strip cooling device also needs to be adjusted synchronously. In the existing production environment, the strip cooling device is often adjusted based on experience and repeated trial and error on site. It is difficult to summarize representative rules for different plastic particles, resulting in a large amount of waste materials and consuming time and effort.
[0003] Therefore, there is an urgent need for a design method, device, and storage medium for an extruder strip cooling device to guide the design of the cooling device in actual production, accurately and quickly predict the cooling effect of the device, ensure that the plastic particles are fully cooled, and avoid heat accumulation. Summary of the Invention
[0004] In view of this, the present invention provides a design method, device, and computer equipment for an extruder strip cooling device to quickly and accurately determine the strip cooling device when the strip cooling device needs to be adjusted.
[0005] In a first aspect, the present invention provides a design method for an extruder strip cooling device, including the following steps: obtaining the production requirements of the extruder for the extruded strip and the strip limiting conditions of the extruded strip; establishing a grid model according to the production requirements of the extruded strip and the space requirements of the strip cooling device, and establishing a water domain boundary condition and an air domain boundary condition in the grid model; performing fluid-solid heat coupling analysis using the grid model, strip limiting conditions, water domain boundary condition, and air domain boundary condition to obtain a first temperature field of the extruded strip in the water domain, a second temperature field in the air domain, and a third temperature field of the extruded strip after passing through the water domain and the air domain; obtaining the target temperature of the extruded strip; and obtaining the spatial arrangement of the water domain and the air domain in the strip cooling device according to the target temperature, the first temperature field, the second temperature field, and the third temperature field.
[0006] The design method of the extruder strip cooling equipment provided by the present invention collects the material parameters during the strip cooling phase change process, establishes the required grid model in combination with the production requirements of the extruded strip and the space requirements of the cooling equipment, and establishes the water domain boundary conditions and air domain boundary conditions in the grid model. Furthermore, fluid-structure-thermal coupling analysis can be carried out on the grid model, strip limiting conditions, water domain boundary conditions and air domain boundary conditions, and then the spatial arrangement of the water domain and air domain in the strip cooling equipment can be obtained to complete the design of the extruder strip cooling equipment, so as to guide the cooling design of actual production, accurately predict the cooling effect of the equipment, ensure that the plastic particles are fully cooled, and avoid heat accumulation.
[0007] In an alternative embodiment, the production requirements of the extruder for the extruded strip include at least one of the following: the number of strips of the extruded strip in the extruder, the arrangement between multiple extruded strips of the extruder, the cross-sectional size of each extruded strip of the extruder, the length of each extruded strip of the extruder, the initial temperature of the extruded strip after extrusion in the extruder, and the pulling speed of the extruded strip during extrusion in the extruder; the strip limiting conditions of the extruded strip include at least one of the following: the density of the extruded strip, the thermal conductivity-temperature curve of the extruded strip, the specific heat capacity-temperature curve of the extruded strip, and the viscosity-temperature curve of the extruded strip.
[0008] By obtaining the thermal conductivity-temperature curve, specific heat capacity-temperature curve, and viscosity-temperature curve of the extruded strip, the present invention can completely express the thermal performance of the extruded strip under different temperature conditions during fluid-structure-thermal coupling analysis. Compared with the traditional simple calculation according to empirical formulas, the temperature field of the extruded strip in the water domain and air domain can be obtained more accurately.
[0009] In an alternative embodiment, the space requirements of the strip cooling equipment include at least one of the following: the cross-sectional area of the water domain, the length of the water domain, the area of the air domain, and the length of the air domain.
[0010] As a result, at least one of the following can be achieved in the spatial arrangement of the water domain and air domain of the obtained strip cooling equipment: the cross-sectional area of the water domain, the length of the water domain, the area of the air domain, and the length of the air domain.
[0011] In an alternative embodiment, a grid model is established according to the production requirements of the extruded strip and the space requirements of the strip cooling equipment, and water domain boundary conditions and air domain boundary conditions are established in the grid model, including: establishing the grid model by using a preset first method according to the production requirements of the extruded strip and the space requirements of the strip cooling equipment; establishing the water domain boundary conditions and the air domain boundary conditions in the grid model by using a preset second method; wherein, the water domain boundary conditions include at least one of the following: the initial temperature of the water domain, the flow rate of the water domain, the flow velocity of the water in the water domain, the density of the water in the water domain, the thermal conductivity of the water in the water domain, the specific heat capacity of the water in the water domain, the viscosity of the water in the water domain; the air domain boundary conditions include at least one of the following: the initial temperature of the air domain, the flow velocity of the air domain, the air density of the air domain, the thermal conductivity of the air domain, the specific heat capacity of the air domain, the viscosity of the air domain.
[0012] This can make the spatial arrangement of the water domain and the air domain in the determined strip cooling equipment more accurate.
[0013] In an alternative embodiment, performing fluid-structure-thermal coupling analysis by using the grid model, strip limiting conditions, water domain boundary conditions and air domain boundary conditions includes: performing fluid-structure-thermal coupling analysis by using a preset third method according to the grid model, strip limiting conditions, water domain boundary conditions and air domain boundary conditions to obtain a first temperature field, a second temperature field and a third temperature field.
[0014] The present invention uses a modeling and simulation method to perform a complete calculation of the temperature field of the extruder strip in the water domain and the air domain, with higher accuracy and a wider application range. Compared with the traditional method of continuously trial-and-error adjusting the design of the cooling equipment based on original experience, the cost is lower and the advancement is stronger.
[0015] In an alternative embodiment, obtaining the spatial arrangement of the water domain and the air domain in the strip cooling equipment according to the process and results of the fluid-structure-thermal coupling analysis and the target temperature includes: encapsulating the process of the fluid-structure-thermal coupling analysis, the first temperature field, the second temperature field and the third temperature field into a parametric APP; in the parametric APP, taking the target temperature as the output strip temperature of the extruded strip, taking the water domain boundary conditions and the air domain boundary conditions as parametric parameters, and running the parametric APP to obtain the spatial arrangement of the water domain and the air domain in the strip cooling equipment.
[0016] Thus, the present invention uses the parametric APP method to simplify the fluid-structure-thermal coupling process with relatively high professionalism and cumbersome use into an easy-to-understand and easy-to-operate parametric interface, greatly improving production efficiency and reducing workload.
[0017] In a second aspect, the present invention further provides a design device for an extruder strip cooling device. The device includes a first acquisition module, a boundary condition determination module, a fluid-structure interaction analysis module, a second acquisition module, and a design module. The first acquisition module is used to acquire the production requirements of the extruder for the extruded strip and the strip limiting conditions. The boundary condition determination module is used to establish a grid model according to the production requirements of the extruded strip and the space requirements of the strip cooling device, and establish a water domain boundary condition and an air domain boundary condition in the grid model. The fluid-structure interaction analysis module is used to perform fluid-structure thermal coupling analysis using the grid model, the strip limiting conditions, the water domain boundary condition, and the air domain boundary condition. The second acquisition module is used to acquire the target temperature of the extruded strip. The design module is used to obtain the spatial arrangement of the water domain and the air domain in the strip cooling device according to the process and results of the fluid-structure thermal coupling analysis and the target temperature.
[0018] In a third aspect, the present invention provides a computer device, including a memory and a processor, which are communicatively connected to each other. The memory stores computer instructions, and the processor executes the computer instructions to execute the extruder strip cooling device design method according to the first aspect or any corresponding embodiment thereof.
[0019] In a fourth aspect, the present invention provides a computer-readable storage medium, on which computer instructions are stored. The computer instructions are used to cause a computer to execute the extruder strip cooling device design method according to the first aspect or any corresponding embodiment thereof.
[0020] In a fifth aspect, the present invention provides a computer program product, including computer instructions, which are used to cause a computer to execute the extruder strip cooling device design method according to the first aspect or any corresponding embodiment thereof. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the description of the specific embodiments or the prior art. Obviously, the following drawings are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0022] Figure 1 is a flowchart of the extruder strip cooling device design method according to an embodiment of the present invention;
[0023] Figure 2 is a flowchart of another extruder strip cooling device design method according to an embodiment of the present invention;
[0024] Figure 3Schematic layout of the strip cooling equipment according to an embodiment of the present invention in an extrusion production line;
[0025] Figure 4 Schematic diagram of an example of a specific heat capacity - temperature curve according to an embodiment of the present invention;
[0026] Figure 5 Schematic diagram of an example of a thermal conductivity - temperature curve according to an embodiment of the present invention;
[0027] Figure 6 Schematic diagram of the temperature field of the strip in the water area according to an embodiment of the present invention;
[0028] Figure 7 Schematic diagram of the temperature field of the strip in the air area according to an embodiment of the present invention;
[0029] Figure 8 Structural block diagram of an extruder strip cooling equipment design device according to an embodiment of the present invention;
[0030] Figure 9 Schematic diagram of the hardware structure of a computer device according to an embodiment of the present invention. Detailed implementation manners
[0031] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.
[0032] According to an embodiment of the present invention, an embodiment of a method for designing an extruder strip cooling equipment is provided. It should be noted that the steps shown in the flowchart of the accompanying drawings can be executed in a computer system such as a set of computer - executable instructions, and although the logical order is shown in the flowchart, in some cases, the steps shown or described can be executed in a different order than here.
[0033] In this embodiment, a method for designing an extruder strip cooling equipment is provided, which can be used in a computer device. Figure 1 Flowchart of the method for designing an extruder strip cooling equipment according to an embodiment of the present invention, as Figure 1 shown, the process includes the following steps:
[0034] Step S101: Obtain the production requirements of the extruder for the extruded strip and the strip limiting conditions of the extruded strip.
[0035] Specifically, the production requirements of the extruder for the extruded strip include at least one of the following: the number of strips of the extruded strip in the extruder, the arrangement between multiple extruded strips of the extruder, the cross-sectional size of each extruded strip of the extruder, the length of each extruded strip of the extruder, the initial temperature of the extruded strip after extrusion in the extruder, and the drawing speed of the extruded strip during extrusion in the extruder.
[0036] The strip limiting conditions of the extruded strip include at least one of the following: the density of the extruded strip, the thermal conductivity-temperature curve of the extruded strip, the specific heat capacity-temperature curve of the extruded strip, and the viscosity-temperature curve of the extruded strip. Specifically, the density of the strip can be measured by a densitometer, the specific heat capacity-temperature curve of the strip can be measured by a differential scanning calorimeter, and the thermal conductivity-temperature curve and viscosity-temperature curve of the strip can be measured by a capillary rheometer.
[0037] Step S102: Establish a grid model according to the production requirements of the extruded strip and the space requirements of the strip cooling device, and establish a water domain boundary condition and an air domain boundary condition in the grid model.
[0038] Specifically, the space requirements of the strip cooling device include at least one of the following: the cross-sectional area of the water domain, the length of the water domain, the area of the air domain, and the length of the air domain.
[0039] Step S103: Perform fluid-solid heat coupling analysis using the grid model, strip limiting conditions, water domain boundary conditions, and air domain boundary conditions.
[0040] That is to say, perform fluid-solid heat coupling analysis using the grid model, strip limiting conditions, water domain boundary conditions, and air domain boundary conditions, simulate the water temperature, air temperature, and strip temperature field after the extruded strip passes through the water domain and the air domain, and obtain the first temperature field of the extruded strip in the water domain, the second temperature field in the air domain, and the third temperature field of the extruded strip after passing through the water domain and the air domain.
[0041] Step S104: Obtain the target temperature of the extruded strip.
[0042] Among them, the target temperature of the extruded strip can be determined according to the performance of the extruded strip and production experience. Exemplarily, the performance of the extruded strip can be yellowing resistance performance, modulus, etc. If the target temperature is too high, it will cause heat accumulation and yellowing, and particle adhesion; if the target temperature is too low, it will cause more powder and uneven particle size and fragmentation.
[0043] Step S105: Obtain the spatial arrangement of the water domain and the air domain in the strip cooling device according to the process and results of the fluid-solid heat coupling analysis and the target temperature.
[0044] The design method of the extruder strip cooling equipment provided in this embodiment collects the material parameters during the phase change of strip cooling, establishes the required grid model in combination with the production requirements of the extruded strip and the space requirements of the cooling equipment, and establishes the water domain boundary conditions and the air domain boundary conditions in the grid model. Furthermore, fluid-structure thermal coupling analysis can be carried out on the grid model, the strip limiting conditions, the water domain boundary conditions, and the air domain boundary conditions to further obtain the spatial arrangement of the water domain and the air domain in the strip cooling equipment, complete the design of the extruder strip cooling equipment, and thus can guide the cooling design of actual production, accurately predict the cooling effect of the equipment, ensure that the plastic particles are fully cooled, and avoid heat accumulation.
[0045] In this embodiment, a design method of an extruder strip cooling equipment is provided, which can be used in a computer device. Figure 2 It is a flowchart of another design method of an extruder strip cooling equipment according to an embodiment of the present invention. As Figure 2 shown, the process includes the following steps:
[0046] Step S201: Obtain the production requirements of the extruder for the extruded strip and the strip limiting conditions of the extruded strip.
[0047] Step S202: Establish a grid model according to the production requirements of the extruded strip and the space requirements of the strip cooling equipment, and establish the water domain boundary conditions and the air domain boundary conditions in the grid model.
[0048] In an alternative embodiment, establishing a grid model according to the production requirements of the extruded strip and the space requirements of the strip cooling equipment, and establishing the water domain boundary conditions and the air domain boundary conditions in the grid model includes the following steps:
[0049] Step S2021: Establish a grid model according to the production requirements of the extruded strip and the space requirements of the strip cooling equipment by using a preset first method.
[0050] Specifically, the first method can be the method in Hypermesh software.
[0051] Step S2022: Use a preset second method to establish the water domain boundary conditions and the air domain boundary conditions in the grid model.
[0052] Specifically, the second method can be the method in Simlab software.
[0053] Specifically, the water domain boundary conditions include at least one of the following: the initial temperature of the water domain, the water flow rate, the flow velocity, the water density, the thermal conductivity, the specific heat capacity, and the viscosity.
[0054] The air domain boundary conditions include at least one of the following: the initial temperature of the air domain, the air flow velocity, the air density, the thermal conductivity, the specific heat capacity, and the viscosity.
[0055] The above water domain boundary conditions and air domain boundary conditions can make the spatial arrangement of the water domain and the air domain in the determined strip cooling device more accurate.
[0056] Step S203: Perform fluid-structure-thermal coupling analysis using the mesh model, strip limiting conditions, water domain boundary conditions, and air domain boundary conditions.
[0057] In an optional implementation manner, performing fluid-structure-thermal coupling analysis using the mesh model, strip limiting conditions, water domain boundary conditions, and air domain boundary conditions includes: inputting the mesh model, strip limiting conditions, water domain boundary conditions, and air domain boundary conditions into a preset third method for fluid-structure-thermal coupling analysis to obtain the first temperature field, the second temperature field, and the third temperature field.
[0058] Exemplarily, the third method can be the method in Simlab software.
[0059] Step S204: Obtain the target temperature of the extruded strip.
[0060] Step S205: Obtain the spatial arrangement of the water domain and the air domain in the strip cooling device according to the process and results of the fluid-structure-thermal coupling analysis and the target temperature.
[0061] In an optional implementation manner, obtaining the spatial arrangement of the water domain and the air domain in the strip cooling device according to the process and results of the fluid-structure-thermal coupling analysis and the target temperature includes: encapsulating the process of the fluid-structure-thermal coupling analysis, the first temperature field, the second temperature field, and the third temperature field into a parametric APP; in the parametric APP, taking the target temperature as the output strip temperature of the extruded strip, taking the water domain boundary conditions and the air domain boundary conditions as parametric parameters, and running the parametric APP to obtain the spatial arrangement of the water domain and the air domain in the strip cooling device.
[0062] Among them, the first temperature field examines the temperature field when the extruded strip exits the water domain, which determines the water domain design parameters. Even when encapsulated into an APP, it will be called to adjust the water domain. At the same time, when entering the air domain, the strip temperature field in the first temperature field will be used as the initial condition for calculation; the second temperature difference determines the air domain design parameters; the third temperature field is the temperature field of the final strip after passing through the cooling device, and the third temperature field is used to calculate the final uniform target temperature.
[0063] The design method of the extruder strip cooling equipment provided in this embodiment collects the material parameters during the strip cooling phase change process, establishes the required grid model in combination with the production requirements of the extruded strip and the space requirements of the cooling equipment, and establishes the water domain boundary conditions and the air domain boundary conditions in the grid model. Furthermore, fluid-solid heat coupling analysis can be carried out on the grid model, the strip limiting conditions, the water domain boundary conditions and the air domain boundary conditions, and then the spatial arrangements of the water domain and the air domain in the strip cooling equipment can be obtained to complete the design of the extruder strip cooling equipment, so as to guide the cooling design of actual production, accurately predict the cooling effect of the equipment, ensure that the plastic particles are fully cooled, and avoid heat accumulation.
[0064] To illustrate the design method of the extruder strip cooling equipment in the embodiments of the present invention more clearly, a specific example is given. Figure 3 is a schematic layout diagram of the strip cooling equipment in the extrusion production line according to the embodiments of the present invention, as Figure 3 shown, the extrusion production line includes an extruder head 1, a water tank 2 in the cooling equipment, a water blowing air knife 3 in the cooling equipment, and a pelletizer 4.
[0065] Specifically, the design of the extruder strip cooling equipment includes the following steps:
[0066] Step SA1: Obtain the production requirements of the extruded strip of the extruder and the strip limiting conditions.
[0067] For example, taking the extrusion of a polycarbonate material as an example, the production requirements of the extruder for the extruded strip are: the number of strips is 3, arranged in parallel at the middle water level line position of the water tank, the strip diameter is 3 mm, and the strip is cylindrical. It should be noted that the length of the extruded strip is usually intercepted for analysis during the modeling process and will not be fully modeled, so it is not a key parameter and can be ignored.
[0068] The strip limiting conditions of the extruded strip are: the plastic strip of the extruder is a nylon fiber-reinforced material, the density is 1.7116E-09 t / mm, the initial temperature at the position of the extruder head is 240 °C, and the pulling speed of the strip during extrusion in the extruder is 40 m / min; the specific heat capacity-temperature curve obtained by differential scanning calorimetry is as Figure 4 shown, and the thermal conductivity-temperature curve obtained by capillary rheometer is as Figure 5 shown.
[0069] Step SA2: Establish a grid model according to the production requirements of the extruded strip and the space requirements of the strip cooling equipment, and establish water domain boundary conditions and air domain boundary conditions in the grid model.
[0070] For example, the space requirements for the strip cooling equipment are as follows: the width of the water tank water area is 30 cm, the height is 20 cm, the length is 4 m, and the length of the air area is 3 m. Among them, the air bath area is often an area value with more complete heat dissipation selected according to the actual situation. For example, it can be 0.5 m * 0.5 m.
[0071] The grid model established according to the production requirements of the extruded strip and the space requirements of the strip cooling equipment is as follows: the grid size of the strip is 0.5 mm, the grid type is tetrahedral grid, the water area grid is 0.5 mm in size, the tetrahedral grid is drawn, 5 layers of boundary layer grids are drawn on the contact surface between the strip and the water area, the air area grid size is 0.5 mm, the grid type is tetrahedral grid, and 5 layers of boundary layer grids are drawn on the contact surface between the strip and the air area.
[0072] The water area boundary conditions established in the grid model are as follows: the initial temperature of the water area is 12 °C, the water area flow rate is 5.8 m 3 / h, the thermal conductivity is 0.598 mlW / (mm*K), the specific heat capacity is 4.183E+09 mlJ / (t*K), and the viscosity is 1E-09 N*s / mm 2 。
[0073] The air area boundary conditions established in the grid model are as follows: the initial temperature of the air area is 23 °C, the air flow rate is 1000 mm / s, the thermal conductivity is 0.02521 mlW / (mm*K), the specific heat capacity is 1.005E+09 mlJ / (t*K), and the viscosity is 1.781E-11 N*s / mm 2 。
[0074] Step SA3: Perform fluid-structure-thermal coupling analysis using the grid model, strip limiting conditions, water area boundary conditions, and air area boundary conditions to obtain the first temperature field of the extruded strip in the water area, the second temperature field in the air area, and the third temperature field of the extruded strip after passing through the water area and the air area.
[0075] For example, the temperature field of the plastic strip in the water area is as Figure 6 shown. The surface temperature of the strip drops to close to the water temperature of 23 °C, the center temperature of the strip is 155.3 °C, and the average temperature is 110.5 °C.
[0076] In one embodiment, the temperature field of the plastic strip in the air area is as Figure 7 shown. The surface temperature of the strip drops to close to the room temperature of the air area of 30 °C, the center temperature of the strip is 90.2 °C, and the average temperature is 65.2 °C.
[0077] Step SA4: Obtain the target temperature of the extruded strip.
[0078] Step SA5: Obtain the spatial arrangement of the water area and the air area in the strip cooling equipment according to the process and results of the fluid-structure-thermal coupling analysis and the target temperature.
[0079] In one embodiment, the parameterized parameters of the water area boundary conditions include, but are not limited to, the initial temperature of the water area being 8 - 20 °C, the water flow rate being 1 - 10 m 3 / h, the water flow velocity being 10 - 1000 mm / s, and the length of the water area being 2 - 6 m. Among them, the parameterized parameters of the water area boundary conditions can be understood as inputting these conditions in the form of independent variables, and they can be adjusted within the specified range to reach the optimal value required for the final target temperature.
[0080] In one embodiment, the parameterized parameters of the air area boundary conditions include, but are not limited to, the initial temperature of the air area being 2 - 35 °C, the air flow velocity being 1000 - 5000 mm / s, and the length of the air area being 2 - 6 m.
[0081] In one embodiment, preset the target temperature and the design boundary of the cooling equipment, and intelligently complete the design of the cooling equipment. Preset the target temperature of the plastic strip to be 60 °C, the plastic strip is polycarbonate, the initial temperature is 300 °C, the pulling speed is 40 m / min, the strip diameter is 3.5 mm, and in the design boundary conditions of the cooling equipment, the initial temperature of the water area is 8 - 20 °C, the water flow rate is 1 - 10 m 3 / h, the water flow velocity is 10 - 1000 mm / s, the length of the water area is 2 - 6 m, the initial temperature of the air area is 2 - 35 °C, the air flow velocity is 1000 - 5000 mm / s, and the length of the air area is 2 - 6 m. The output strip temperature result by the APP is 58 °C, which meets the preset target of less than or equal to 60 °C. At this time, the cooling equipment is designed with the initial temperature of the water area being 15 °C, the water flow rate being 6.1 m 3 / h, the water flow velocity being 600 mm / s, the length of the water area being 4 m, the initial temperature of the air area being 25 °C, the air flow velocity being 1000 mm / s, and the length of the air area being 4 m. That is to say, taking the given target temperature as the final target temperature, which is a target value, the preset initial temperature, pulling speed, and diameter of the strip are fixed values, equivalent to unchanging initial conditions, and the initial temperature of the water area, water flow rate, etc. are all the above-mentioned parameterized independent variables. The encapsulated parameterized APP will, according to these variables and the target value, combined with the original fluid-structure-thermal coupling analysis process, can be understood as expressing the fluid-structure-thermal coupling analysis process in the form of a certain system of equations, and then adjusting the independent variables to obtain the target temperature.
[0082] In one embodiment, the preset target temperature is 60 °C, and the cooling equipment is designed with the initial temperature of the water area being 15 °C and the water flow rate being 610 m 3 / h, the water flow rate is 600 mm / s, the water area length is 4 m, the initial air domain temperature is 30 °C, the air flow rate is 1000 mm / s, the air domain length is 3 m. At this time, the temperature of the strip output by the APP is 66 °C, which does not meet the requirement of being less than or equal to the preset target temperature of 60 °C. The APP intelligently adjusts the parametric parameters, reduces the cooling water temperature to 10 °C. At this time, the temperature of the strip output by the APP is 59 °C, which meets the requirement of being less than or equal to the preset target temperature of 60 °C. It is confirmed that the cooling equipment is designed with the initial water area temperature of 10 °C and the water flow rate of 610 m 3 / h, the water flow rate is 600 mm / s, the water area length is 4 m, the initial air domain temperature is 30 °C, the air flow rate is 1000 mm / s, the air domain length is 3 m.
[0083] The design method of the extruder strip cooling equipment of the present invention has the following beneficial effects: Through fluid-solid thermal coupling analysis, the cooling temperature field of the strip under corresponding process conditions is calculated. Compared with the prior art, this method can more accurately simulate the behavior of the plastic strip in the actual production environment, including the heat transfer process of the plastic strip in the water area and the air domain, and the phase change effect of the plastic raw material during the cooling process, thereby improving the prediction accuracy. The technical solution can quickly and accurately calculate the final temperature of the plastic strip through the parametric APP, which can directly guide the cooling design of actual production, ensure that the plastic particles are fully cooled without heat accumulation, and thus optimize the subsequent color, quality and processing performance of the plastic strip.
[0084] In this embodiment, a device for designing an extruder strip cooling equipment is also provided. This device is used to implement the above embodiments and preferred implementation manners, and those that have been described will not be repeated. As used below, the term "module" can be a combination of software and / or hardware that can achieve a predetermined function. Although the devices described in the following embodiments are preferably implemented in software, implementation in hardware, or a combination of software and hardware is also possible and contemplated.
[0085] This embodiment provides a device for designing an extruder strip cooling equipment, as Figure 8 shown, including:
[0086] The first acquisition module 801 is used to acquire the production requirements of the extruded strip of the extruder and the strip limiting conditions.
[0087] The boundary condition determination module 802 is used to establish a grid model according to the production requirements of the extruded strip and the space requirements of the strip cooling equipment, and establish water area boundary conditions and air domain boundary conditions in the grid model.
[0088] The fluid-solid coupling analysis module 803 is used to perform fluid-solid thermal coupling analysis by using the grid model, strip limiting conditions, water area boundary conditions and air domain boundary conditions.
[0089] The second acquisition module 804 is configured to acquire the target temperature of the extruded strip.
[0090] The design module 805 is configured to obtain the spatial arrangement of the water area and the air area in the strip cooling device according to the process and results of the fluid-solid heat coupling analysis and the target temperature.
[0091] In some alternative embodiments, the production requirements of the extruder for the extruded strip include at least one of the following: the number of strips of the extruded strip in the extruder, the arrangement between multiple extruded strips of the extruder, the cross-sectional dimension of each extruded strip of the extruder, the length of each extruded strip of the extruder, the initial temperature of the extruded strip after extrusion in the extruder, the pulling speed of the extruded strip when extruded in the extruder; the strip limiting conditions of the extruded strip include at least one of the following: the density of the extruded strip, the thermal conductivity-temperature curve of the extruded strip, the specific heat capacity-temperature curve of the extruded strip, the viscosity-temperature curve of the extruded strip.
[0092] In some alternative embodiments, the spatial requirements of the strip cooling device include at least one of the following: the cross-sectional area of the water area, the length of the water area, the area of the air area, the length of the air area.
[0093] In some alternative embodiments, the boundary condition determination module 802 is specifically configured to: establish a grid model by using a preset first method according to the production requirements of the extruded strip and the spatial requirements of the strip cooling device; establish water area boundary conditions and air area boundary conditions in the grid model by using a preset second method; wherein, the water area boundary conditions include at least one of the following: the initial temperature of the water area, the flow rate of the water area, the flow velocity of the water in the water area, the density of the water in the water area, the thermal conductivity of the water in the water area, the specific heat capacity of the water in the water area, the viscosity of the water in the water area; the air area boundary conditions include at least one of the following: the initial temperature of the air area, the flow velocity of the air area, the air density of the air area, the thermal conductivity of the air area, the specific heat capacity of the air area, the viscosity of the air area.
[0094] In some alternative embodiments, the fluid-solid coupling analysis module 803 is specifically configured to: perform fluid-solid heat coupling analysis by using a preset third method according to the grid model, the strip limiting conditions, the water area boundary conditions and the air area boundary conditions, to obtain the first temperature field, the second temperature field and the third temperature field.
[0095] In some alternative embodiments, the design module 805 is specifically configured to: package the process of the fluid-solid heat coupling analysis, the first temperature field, the second temperature field and the third temperature field into a parametric APP; in the parametric APP, use the target temperature as the output strip temperature of the extruded strip, use the water area boundary conditions and the air area boundary conditions as parametric parameters, and run the parametric APP to obtain the spatial arrangement of the water area and the air area in the strip cooling device.
[0096] The further function descriptions of the above-mentioned various modules and units are the same as those in the corresponding above embodiments, and will not be elaborated here.
[0097] The extruder strip cooling equipment design device in this embodiment is presented in the form of functional units. Here, the unit refers to an ASIC (Application Specific Integrated Circuit) circuit, a processor and a memory that execute one or more software or fixed programs, and / or other devices that can provide the above functions.
[0098] An embodiment of the present invention further provides a computer device having the Figure 8 extruder strip cooling equipment design device shown above.
[0099] Please refer to Figure 9 , Figure 9 which is a schematic structural diagram of a computer device provided by an optional embodiment of the present invention. As Figure 9 shown, the computer device includes: one or more processors 10, a memory 20, and an interface for connecting each component, including a high-speed interface and a low-speed interface. Each component communicates with each other using different buses and can be installed on a common motherboard or installed in other ways as needed. The processor can process instructions executed within the computer device, including instructions stored in the memory or on the memory to display graphical information of the GUI on an external input / output device (such as a display device coupled to the interface). In some optional embodiments, if necessary, multiple processors and / or multiple buses can be used together with multiple memories and multiple memories. Similarly, multiple computer devices can be connected, and each device provides some necessary operations (for example, as a server array, a set of blade servers, or a multi-processor system). Figure 9 In
[0100] FIG. 19, one processor 10 is taken as an example.
[0101] Among them, the memory 20 stores instructions executable by at least one processor 10, so that at least one processor 10 executes the method shown in the above embodiment.
[0102] The memory 20 may include a program storage area and a data storage area. Among them, the program storage area can store an operating system and application programs required for at least one function; the data storage area can store data created according to the use of the computer device, etc. In addition, the memory 20 may include high-speed random access memory and may also include non-transitory memory, such as at least one magnetic disk storage device, a flash memory device, or other non-transitory solid-state storage devices. In some alternative embodiments, the memory 20 may optionally include a memory remotely provided with respect to the processor 10, and these remote memories can be connected to the computer device through a network. Examples of the above-mentioned network include but are not limited to the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.
[0103] The memory 20 may include volatile memory, such as random access memory; the memory may also include non-volatile memory, such as flash memory, a hard disk, or a solid-state drive; the memory 20 may further include a combination of the above types of memory.
[0104] The computer device further includes an input device 30 and an output device 40. The processor 10, the memory 20, the input device 30, and the output device 40 can be connected through a bus or other means. Figure 9 Taking connection through a bus as an example.
[0105] The input device 30 can receive input digital or character information and generate key signal inputs related to the user settings and function controls of the computer device, such as a touch screen, a keypad, a mouse, a trackpad, a touchpad, a pointing stick, one or more mouse buttons, a trackball, a joystick, etc. The output device 40 may include a display device, an auxiliary lighting device (such as an LED), and a tactile feedback device (such as a vibration motor), etc. The above-mentioned display device includes but is not limited to a liquid crystal display, a light-emitting diode, a display, and a plasma display. In some alternative embodiments, the display device may be a touch screen.
[0106] Embodiments of the present invention also provide a computer-readable storage medium. The methods according to the embodiments of the present invention can be implemented in hardware, firmware, or be implemented as computer code that can be recorded on a storage medium, or be implemented as computer code that is originally stored in a remote storage medium or a non-transitory machine-readable storage medium and downloaded through a network and will be stored in a local storage medium, so that the methods described herein can be stored as such software processing on a storage medium using a general-purpose computer, a dedicated processor, or programmable or dedicated hardware. Among them, the storage medium can be a magnetic disk, an optical disk, a read-only memory, a random access memory, a flash memory, a hard disk, or a solid-state drive, etc.; further, the storage medium can also include a combination of the above-mentioned types of memories. It can be understood that a computer, a processor, a microprocessor controller, or programmable hardware includes a storage component that can store or receive software or computer code. When the software or computer code is accessed and executed by the computer, the processor, or the hardware, the methods shown in the above embodiments are implemented.
[0107] A part of the present invention can be applied as a computer program product, for example, computer program instructions. When executed by a computer, through the operation of the computer, the methods and / or technical solutions according to the present invention can be invoked or provided. Those skilled in the art should be able to understand that the forms in which computer program instructions exist in a computer-readable medium include, but are not limited to, source files, executable files, installation package files, etc. Correspondingly, the ways in which computer program instructions are executed by a computer include, but are not limited to: the computer directly executes the instructions, or the computer compiles the instructions and then executes the corresponding compiled program, or the computer reads and executes the instructions, or the computer reads and installs the instructions and then executes the corresponding installed program. Herein, the computer-readable medium can be any available computer-readable storage medium or communication medium accessible by the computer.
[0108] Although the embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations all fall within the scope defined by the appended claims.
Claims
1. A design method for an extruder strip cooling device, characterized in that Including: Obtaining the production requirements of the extruder for the extruded strip and the strip limiting conditions of the extruded strip; Establishing a grid model according to the production requirements of the extruded strip and the space requirements of the strip cooling equipment, and establishing a water domain boundary condition and an air domain boundary condition in the grid model; Performing a fluid-structure-thermal coupling analysis using the grid model, the strip limiting conditions, the water domain boundary condition, and the air domain boundary condition; Obtaining the target temperature of the extruded strip; Obtaining the spatial arrangements of the water domain and the air domain in the strip cooling equipment according to the process and results of the fluid-structure-thermal coupling analysis and the target temperature.
2. The method according to claim 1, wherein: The production requirements of the extruder for the extruded strip include at least one of the following: the number of strips of the extruded strip in the extruder, the arrangement between multiple extruded strips of the extruder, the cross-sectional dimension of each extruded strip of the extruder, the length of each extruded strip of the extruder, the initial temperature of the extruded strip after extrusion in the extruder, and the pulling speed of the extruded strip during extrusion in the extruder; The strip limiting conditions of the extruded strip include at least one of the following: the density of the extruded strip, the thermal conductivity-temperature curve of the extruded strip, the specific heat capacity-temperature curve of the extruded strip, and the viscosity-temperature curve of the extruded strip; 3. The method according to claim 1, wherein The space requirements of the strip cooling equipment include at least one of the following: the cross-sectional area of the water domain, the length of the water domain, the area of the air domain, and the length of the air domain; 4. The method according to claim 1, wherein The establishing a grid model according to the production requirements of the extruded strip and the space requirements of the strip cooling equipment, and establishing a water domain boundary condition and an air domain boundary condition in the grid model includes: Establishing the grid model according to the production requirements of the extruded strip and the space requirements of the strip cooling equipment by using a preset first method; Establishing the water domain boundary condition and the air domain boundary condition in the grid model by using a preset second method; Wherein, the water domain boundary condition includes at least one of the following: the initial temperature of the water domain, the flow rate of the water domain, the water flow velocity in the water domain, the water density in the water domain, the thermal conductivity of the water in the water domain, the specific heat capacity of the water in the water domain, and the viscosity of the water in the water domain; The air domain boundary condition includes at least one of the following: the initial temperature of the air domain, the air flow velocity in the air domain, the air density in the air domain, the thermal conductivity of the air in the air domain, the specific heat capacity of the air in the air domain, and the viscosity of the air in the air domain; 5. The method according to claim 1, wherein The performing a fluid-structure-thermal coupling analysis using the grid model, the strip limiting conditions, the water domain boundary condition, and the air domain boundary condition includes: Performing a fluid-structure-thermal coupling analysis according to the grid model, the strip limiting conditions, the water domain boundary condition, and the air domain boundary condition by using a preset third method to obtain a first temperature field, a second temperature field, and a third temperature field.
6. The method according to claim 5, characterized in that The obtaining the spatial arrangements of the water domain and the air domain in the strip cooling equipment according to the process and results of the fluid-structure-thermal coupling analysis and the target temperature includes: Package the process of the fluid-structure-thermal coupling analysis, the first temperature field, the second temperature field, and the third temperature field into a parametric APP; In the parametric APP, use the target temperature as the output strip temperature of the extruded strip, and use the water domain boundary condition and the air domain boundary condition as parametric parameters. Run the parametric APP to obtain the spatial arrangement of the water domain and the air domain in the strip cooling device.
7. An extrusion machine strip cooling equipment design device, characterized in that, The device includes: A first acquisition module, configured to acquire the production requirements of the extruder for the extruded strip and the strip limiting conditions; A boundary condition determination module, configured to establish a grid model according to the production requirements of the extruded strip and the spatial requirements of the strip cooling device, and establish a water domain boundary condition and an air domain boundary condition in the grid model; A fluid-structure coupling analysis module, configured to perform fluid-structure-thermal coupling analysis by using the grid model, the strip limiting conditions, the water domain boundary condition, and the air domain boundary condition; A second acquisition module, configured to acquire the target temperature of the extruded strip; A design module, configured to obtain the spatial arrangement of the water domain and the air domain in the strip cooling device according to the process and results of the fluid-structure-thermal coupling analysis and the target temperature.
8. A computer device, characterized in that, It includes: A memory and a processor, which are communicatively connected to each other. The memory stores computer instructions, and the processor executes the computer instructions to execute the design method of the extruder strip cooling device according to any one of claims 1 to 6.
9. A computer-readable storage medium, characterized in that, Computer instructions are stored on the computer-readable storage medium, and the computer instructions are used to cause a computer to execute the design method of the extruder strip cooling device according to any one of claims 1 to 6.
10. A computer program product, characterized in that, It includes computer instructions, and the computer instructions are used to cause a computer to execute the design method of the extruder strip cooling device according to any one of claims 1 to 6.