Image processing method, optical detection system and electronic equipment

Abstract

The invention discloses an image processing method, an optical detection system and electronic equipment, and relates to the technical field of semiconductor precision detection. According to the method, when each pattern unit is collected, first position information of a to-be-detected wafer in a first direction is obtained, and through comparison with initial position information of the to-be-detected wafer, a first deviation of each detection image generated when the wafer shakes is determined; and each detection image in the initial detection images of the to-be-detected wafer can be corrected and reset through the first deviation, so that the technical problem of detection image distortion caused by wafer jitter is solved through a software algorithm. According to the image processing method provided by the embodiment of the invention, the cost required by hardware equipment improvement is saved, and the limitation of the upper limit of hardware equipment performance improvement on wafer detection image correction is eliminated.

Description

Technical Field

[0001] This application belongs to the technical field of semiconductor precision detection, and particularly relates to an image processing method, an optical detection system, and an electronic device. Background Art

[0002] Currently, in the semiconductor precision detection industry, a scanning camera is commonly used to collect wafer detection images. When performing wafer detection, the wafer is generally set on a moving platform, and the scanning camera is fixed above the moving platform. During the process that the moving platform carries the wafer and moves along the second direction, the scanning camera performs image acquisition operations according to trigger signals.

[0003] When the moving platform moves along the second direction, it will inevitably jitter along the first direction, resulting in distortion of the detection images collected by the scanning camera. In most current technologies, the stability of the moving platform during movement is mainly improved by enhancing the hardware performance of the moving platform. However, the improvement of the hardware device performance cannot avoid the jitter that occurs during the operation of the moving platform. Therefore, the distortion of the wafer detection images cannot be solved in most current technologies. Summary of the Invention

[0004] Embodiments of this application provide an image processing method, an optical detection system, and an electronic device, which can solve the distortion problem of wafer detection images through an image processing algorithm, and eliminate the limitation of the upper limit of the improvement of hardware device performance on the correction of wafer detection images.

[0005] In a first aspect of the embodiments of this application, an image processing method is provided, including: obtaining an initial detection image sequence of a wafer to be detected and initial position information of the wafer to be detected in a first direction; the initial detection image sequence includes multiple detection images; the multiple detection images are sequentially collected during the process that the wafer to be detected moves along a second direction, and the first direction is perpendicular to the second direction; for each detection image, obtaining first position information of the wafer to be detected in the first direction when collecting the detection image, and determining a first deviation, where the first deviation is the deviation between the first position information and the initial position information; adjusting the initial detection image sequence based on the first deviations of the respective detection images to obtain an adjusted detection image sequence.

[0006] In the second aspect of the embodiments of the present application, an optical detection system is provided, including: an encoder for sending a start signal to start the current wafer detection to a moving platform, and during the process of the moving platform moving in the second direction, sending a trigger signal to a scanning camera based on the wafer sampling frequency; a moving platform for placing the wafer to be detected and moving in the second direction when receiving the start signal; a scanning camera for performing image acquisition on the wafer to be detected based on the trigger signal to obtain a detection image; a processor for generating an initial detection image sequence of the wafer to be detected based on the detection image collected by the scanning camera, and adjusting the initial detection image sequence based on the image processing method provided in the first aspect of the embodiments of the present application.

[0007] In the third aspect of the embodiments of the present application, an electronic device is provided, the device including: a processor and a memory storing computer program instructions; when the processor executes the computer program instructions, the image processing method provided in the first aspect of the embodiments of the present application is implemented.

[0008] In the image processing method provided in the embodiments of the present application, when each detection image is collected, first position information of the wafer to be detected in the first direction is obtained, and by comparing with the initial position information of the wafer to be detected, a first deviation occurring when the wafer jitters for each detection image is determined. Through this first deviation, each detection image in the initial detection image sequence of the wafer to be detected can be corrected and reset, thereby solving the technical problem of distorted detection images caused by wafer jitter through a software algorithm. Compared with improving the performance of hardware devices, the image processing method provided in the embodiments of the present application saves the cost required for improving hardware devices and eliminates the limitation of the upper limit of hardware device performance improvement on the correction of wafer detection images. Description of the Drawings

[0009] To more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required to be used in the embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without creative efforts.

[0010] Figure 1 It is a flowchart of an image processing method provided by an embodiment of the present application;

[0011] Figure 2 It is a schematic diagram of adjusting a wafer detection image sequence provided by an embodiment of the present application;

[0012] Figure 3 It is a schematic diagram of pixel filling for a cropped wafer detection image sequence provided by an embodiment of the present application;

[0013] Figure 4It is a schematic structural diagram of an optical detection system provided by an embodiment of the present application;

[0014] Figure 5 It is a schematic flowchart of a method for collecting wafer detection images provided by an embodiment of the present application;

[0015] Figure 6 It is a schematic diagram of the positional relationship of a wafer detection image sequence corresponding to two adjacent wafer detections provided by an embodiment of the present application;

[0016] Figure 7 It is a schematic diagram of the positional relationship of another wafer detection image sequence corresponding to two adjacent wafer detections provided by an embodiment of the present application;

[0017] Figure 8 It is a schematic structural diagram of an electronic device provided by an embodiment of the present application.

[0018] Reference numerals:

[0019] 201, processor; 202, host computer; 203, scanning camera; 204, moving platform; 205, first laser interferometer; 206, second laser interferometer; 207, long mirror; 208, encoder; 209, wafer to be detected. Detailed implementation manners

[0020] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than to limit the present application. For those skilled in the art, the present application can be implemented without some of these specific details. The following description of the embodiments is only intended to provide a better understanding of the present application by showing examples of the present application.

[0021] It should be noted that in this document, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variation thereof is intended to cover a non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the phrase "comprising..." does not exclude the existence of additional identical elements in the process, method, article or device comprising the element.

[0022] It should be noted that the acquisition, storage, use, processing, etc. of data in the technical solution of this application all comply with the relevant provisions of national laws and regulations. In the embodiments of this application, certain industry-existing solutions such as software, components, models, etc. may be mentioned, and they should be regarded as exemplary. The purpose is only to illustrate the feasibility in the implementation of the technical solution of this application, but it does not mean that the applicant has already or necessarily used this solution.

[0023] First, explain the noun terms involved in one or more embodiments of this application.

[0024] A wafer is the basic material for manufacturing semiconductor chips, and various inspections need to be carried out on it during the production process to ensure quality.

[0025] Currently, in the semiconductor precision inspection industry, a scanning camera is commonly used to collect wafer inspection images. When performing wafer inspection, the wafer is generally set on a moving platform, and the scanning camera is fixed above the moving platform. During the process of the moving platform carrying the wafer and moving along the second direction, the scanning camera performs the image acquisition operation according to the trigger signal. However, when the moving platform moves along the second direction, due to factors such as dust particles, air pressure fluctuations, and beam deformation, there will inevitably be jitter in the first direction, resulting in distortion of the inspection images collected by the scanning camera. In most current technologies, the stability of the moving platform during movement is mainly improved by enhancing the hardware performance of the moving platform. The straightness of the currently adopted high-precision moving platform is about ±800nm, which is already at the leading level in the country, but the deviation pixel number is still relatively large under a large magnification objective lens. For example, there is a deviation of about 7 pixels under a 40x objective lens. Therefore, simply improving the stability of the moving platform during movement cannot meet the current high-precision wafer inspection requirements.

[0026] In view of this, this application provides an image processing method, an optical detection system, and an electronic device. In the image processing method provided by the embodiments of this application, when collecting each inspection image, the first position information of the wafer to be inspected in the first direction is obtained, and by comparing it with the initial position information of the wafer to be inspected, the first deviation that occurs to each inspection image during wafer jitter is determined. Through this first deviation, each inspection image in the initial inspection image sequence of the wafer to be inspected can be corrected and reset, thus solving the technical problem of image distortion caused by wafer jitter through software algorithms. Compared with improving the performance of hardware devices, the image processing method provided by the embodiments of this application saves the cost required for hardware device improvement and eliminates the limitation of the upper limit of hardware device performance improvement on wafer inspection image correction.

[0027] In some embodiments, the image processing method provided by the embodiments of the present application can be applied to the inspection station on the production line of a semiconductor manufacturing enterprise. During the inspection of the produced wafers, the initial inspection images collected can be adjusted first by the image processing method provided by the embodiments of the present application, and then the surface defects of the wafers can be analyzed and other inspections can be carried out through the adjusted inspection images, so as to further improve the accuracy of wafer inspection.

[0028] In some embodiments, the image processing method provided by the embodiments of the present application can also be applied to other scenarios that require wafer inspection, such as laboratory and other usage scenarios. Compared with directly using the initially collected wafer inspection images for inspection and analysis, the image processing method provided by the embodiments of the present application can correct the displacement deviation existing in the initial inspection images, providing a more reliable inspection sample for subsequent inspection and analysis.

[0029] It should be noted that the application scenarios described in the above embodiments of the present application are for more clearly explaining the technical solutions of the embodiments of the present application, and do not constitute a limitation on the technical solutions provided by the embodiments of the present application. Those skilled in the art know that with the emergence of new application scenarios, the technical solutions provided by the embodiments of the present application are equally applicable to similar technical problems. The image processing method provided by the embodiments of the present application can be applied to various application scenarios that require image processing of wafer inspection.

[0030] The following introduces the image processing method provided by the embodiments of the present application. In practical applications, the execution subject of the image processing method of the embodiments of the present application can be a processor or an electronic device including a processor. In one example, the processor executing the image processing method of the embodiments of the present application can be an FPGA (Field Programmable Gate Array).

[0031] The following introduces specific embodiments of the image processing method, optical detection system, and electronic device provided by the embodiments of the present application. First, the image processing method is introduced.

[0032] Figure 1 FIG. shows a flowchart of an image processing method provided by an embodiment of the present application. As Figure 1 shown, the method includes steps S101 to S103.

[0033] S101, obtaining an initial inspection image sequence of a wafer to be inspected and initial position information of the wafer to be inspected in a first direction; the initial inspection image sequence includes a plurality of inspection images; the plurality of inspection images are sequentially collected during the movement of the wafer to be inspected in a second direction, and the first direction is perpendicular to the second direction.

[0034] In specific implementation, the wafer to be detected is the wafer waiting to be detected. In one example, the wafer to be detected can be any wafer. In some embodiments, the initial detection image sequence of the wafer to be detected obtained can be the detection image sequence of the wafer collected in advance. This detection image sequence can be stored in a database and retrieved from the database when starting to execute the image processing method of the present application. In some embodiments, the initial detection image sequence of the wafer to be detected obtained can be the detection image sequence collected in real time, that is, the processor can directly obtain the above initial detection image sequence through the device for collecting the detection image sequence of the wafer to be detected. In one example, the device for collecting the detection image sequence of the wafer to be detected can be a scanning camera.

[0035] It should be noted that when collecting the detection image sequence of the wafer to be detected, the wafer moves along with the moving platform, and the device for collecting the detection images is fixed above the moving platform. During the process of the wafer moving along the second direction with the moving platform, the device for collecting the detection images will perform an image acquisition operation according to the trigger signal. Each time the image acquisition operation is performed, a detection image is obtained, and each detection image corresponds to a region on the wafer. When the wafer finishes moving along the second direction with the moving platform, a detection image sequence composed of multiple detection images is obtained. Therefore, the above initial detection image sequence includes multiple detection images; the multiple detection images are sequentially collected during the process of the wafer to be detected moving along the second direction. The above first direction is perpendicular to the second direction, and the plane where the first direction and the second direction are located is parallel to the plane where the wafer to be detected is located; in one example, the first direction is the wafer stepping direction, and the second direction is the wafer scanning direction. In some embodiments, the above first direction and second direction can also be represented by coordinate axes, where the Y-axis represents the first direction, the X-axis represents the second direction, and the plane where the X-axis and the Y-axis are located is parallel to the plane where the wafer to be detected is located.

[0036] In order to provide reference information for whether subsequent detection images are shifted, the above step S101 also obtains the initial position information of the wafer to be detected in the first direction while obtaining the initial detection image sequence. This initial position information is the position information of the wafer to be detected in the first direction when the detection has not started. In one example, the above initial position information can be obtained through a position measuring device, and the specific position measuring device can be selected according to needs. For example, a laser interferometer can be used to measure the above initial position.

[0037] In some embodiments, the above-mentioned scanning cameras include line-array scanning cameras and area-array scanning cameras. Among them, the line-array scanning camera uses a line-array image sensor, and the photosensitive elements are linearly arranged. Each exposure can only capture one row of information of the image, and relative scanning motion of the object or the camera is required to scan row by row to construct a complete two-dimensional image. In one example, the above-mentioned line-array scanning camera includes a TDI line-array scanning camera, and the TDI line-array scanning camera is the Time Delay and Integration line-array scanning camera. TDI (Time Delay and Integration) is the time delay and integration technology. This kind of camera uses a line-array sensor and improves the sensitivity and image quality of the camera under low-light conditions by performing multiple exposures on the same object at different time points and integrating. The area-array scanning camera uses an area-array image sensor, and the photosensitive elements are distributed in a planar shape, and can capture two-dimensional image information of the scene at one time. Compared with the line-array scanning camera, the size of the detected image collected by the area-array scanning camera in the second direction is larger, and the number of times of sending trigger signals can be reduced.

[0038] S102. For each detected image, obtain the first position information of the wafer to be detected in the first direction when the detected image is collected, and determine the first deviation, where the first deviation is the deviation between the first position information and the initial position information.

[0039] In specific implementation, in order to accurately adjust the deviation of the initial detected image sequence, for each detected image in the initial detected image sequence, first obtain the first position information of the wafer to be detected in the first direction when the detected image is collected, and this first position information can be obtained by a position measuring device arranged in the second direction. Then, by comparing the first position information of the wafer to be detected corresponding to each detected image in the first direction with the above-mentioned initial position information, the first deviation between the two is determined, and this first deviation represents the offset amount of the wafer to be detected corresponding to each detected image in the first direction. In one example, when determining the first deviation between the first position information and the initial position information, the two can be directly subtracted, and the result after subtraction is used as the first deviation.

[0040] Considering that when adjusting the image, the smallest processing unit is one pixel, therefore, the first deviation can be converted into a deviation amount represented by unit pixels in advance, which is convenient for subsequent calculation of adjusting the image. In some embodiments, in the above step S102, determining the first deviation includes:

[0041] Determine the initial deviation value between the above first position information and the above initial position information;

[0042] Obtain the pixel size information of the unit pixel corresponding to the above initial detected image in the above first direction;

[0043] Determine the first deviation based on the above pixel size information and the above initial deviation value; wherein, the first deviation is represented by unit pixels.

[0044] In specific implementation, the initial deviation value can be obtained by taking the difference between the first position information and the initial position information. The measurement unit corresponding to the initial deviation value can be a length unit such as nanometer (nm). In order to accurately convert the initial deviation value into a quantity represented by unit pixels, it is necessary to obtain the pixel size information of the unit pixel corresponding to the initial detection image sequence of the wafer to be detected in the first direction. It should be noted that the pixel size information of the unit pixel corresponding to the initial detection image sequence is determined by the accuracy of the scanning camera. The pixel size of the unit pixel corresponding to the detection images collected by different scanning cameras is different. Generally, the higher the accuracy of the scanning camera, the smaller the pixel size of the corresponding unit pixel. After determining the above initial deviation value and the pixel size information of the unit pixel in the first direction, the first deviation between the first position information and the initial position information can be determined based on these two pieces of information. In one example, the above initial deviation value can be divided by the above pixel size information, and the decimal part can be rounded to obtain the first deviation, that is, the first deviation is represented by how many corresponding unit pixels. For example, the initial deviation value corresponding to a certain detection image is 760 nm, and the pixel size information of the unit pixel in the first direction is 100 nm, then the first deviation corresponding to this detection image is 8 unit pixels.

[0045] It should be noted that a pixel is the basic unit that makes up a detection image and is the smallest unit that cannot be further subdivided. Therefore, any adjustment operation on the detection image ultimately has to be implemented on the processing of individual pixels. After the first deviation is represented in units of pixels, subsequent calculations can be directly based on the number of pixels. For example, when performing a translation operation on an image, if the number of pixels corresponding to the first deviation of a certain detection image is known, the pixels of the detection image can be directly moved by the corresponding number of pixels, without the need for complex coordinate conversion and unit conversion. This greatly simplifies the calculation process, improves the calculation efficiency, and reduces possible errors in the calculation process.

[0046] S103. Adjust the initial detection image sequence based on the first deviation corresponding to each detection image to obtain an adjusted detection image sequence.

[0047] In specific implementation, after determining the first deviation of each detection image, adjust the initial detection image sequence according to the first deviation of each detection image, so that the image distortion caused by jitter in the adjusted initial detection image sequence is reduced, providing a reliable basis for the accurate detection of the wafer to be detected. In one example, when adjusting the initial detection image sequence, each detection image can be restored to the position without deviation according to the first deviation of each detection image.

[0048] In order to accurately adjust the initial detected image sequence, in some embodiments, in the above step S103, the initial detected image sequence is adjusted based on the first deviation of each detected image to obtain an adjusted detected image sequence, including:

[0049] Determine the effective size information of the adjusted detected image sequence in the first direction based on the maximum value and the minimum value among the first deviations corresponding to the multiple detected images;

[0050] For each of the above detected images, translate the detected image based on the first deviation corresponding to the detected image so that the position information of the translated detected image corresponds to the initial position information; crop the translated detected image based on the effective size information to obtain the cropped detected image;

[0051] Obtain an adjusted detected image sequence based on each of the cropped detected images.

[0052] During specific implementation, when determining the effective size information, first traverse the first deviations corresponding to all detected images, and find the maximum value and the minimum value in the first direction. Then, determine the effective size information of the adjusted detected image sequence in the first direction according to the maximum value and the minimum value, and the effective size information is the minimum common size information corresponding to all detected images in the first direction. In one example, the boundary positions at both ends of the detected image in the first direction can be determined by the maximum value and the minimum value, and then the effective size information can be determined by the boundary positions at both ends. In one example, the original size information of the detected image in the first direction can be determined first, and then the maximum value and the minimum value are removed from the original size information to obtain the effective size information in the first direction.

[0053] Refer to Figure 2 , where each small square represents a pixel point, the number in the square represents the position information of the pixel point, X represents the second direction, and Y represents the first direction. Figure 2 There are a total of three detected image sequences. The leftmost image is the initial detected image sequence, the middle image is the translated detected image sequence, and the rightmost image is the cropped detected image sequence. Each column in each detected image sequence corresponds to a detected image. In Figure 2In the leftmost detected image sequence, assume that the detected images corresponding to the initial position information of the wafer to be detected in the first direction are from 0 to 9, the detected images with the largest deviation in the first direction are from 1 to 10, and the detected images with the smallest deviation in the first direction are from -1 to 8. It should be noted that, for the convenience of calculation, in the embodiments of the present application, negative deviation < zero deviation < positive deviation. When the deviation direction is the same as the first direction, it is a positive deviation, and when the deviation direction is opposite to the first direction, it is a negative deviation. Therefore, in Figure 2 In the leftmost detected image sequence, the largest first deviation in the first direction is +1, and the smallest first deviation is -2. The unit of the deviation is pixels.

[0054] In some embodiments, the maximum deviation along the third direction among the first deviations corresponding to each of the above-mentioned detected images may be determined first, and then the smallest first deviation in the first direction may be determined based on the maximum deviation, where the third direction is opposite to the first direction.

[0055] After determining the effective size information of the adjusted detected image sequence in the first direction, for each detected image, the detected image may be first translated according to the first deviation corresponding to the detected image, so that the position information of the translated detected image corresponds to the initial position information of the wafer to be detected in the first direction, that is, the position of each detected image is corrected by translation, so that each pixel point in each detected image returns to the position before jitter occurs. Then, using the effective size information calculated previously, the translated image is cropped to remove the redundant part, and the cropped detected image is obtained. Finally, all the cropped detected images are combined into a new sequence, which is the adjusted detected image sequence.

[0056] It should be noted that the detected image is translated in the first direction according to the first deviation, so that the position information of the translated detected image corresponds to the initial position information, which realizes the calibration of the position of the detected image, ensures that the image is in the expected correct position, provides an image basis with accurate position for subsequent processing and analysis, and reduces the analysis error caused by the first deviation. In addition, for wafer detection, it is necessary to compare the pixel points in the same row along the second direction. Therefore, when a certain row in the detected image sequence lacks some pixel points, all the pixel points in that row will be unavailable. On this basis, using the effective size information to crop the translated image to remove the redundant part can make the image only retain the effective content area. This can reduce the amount of image data, improve the efficiency of subsequent processing, and avoid the interference of the redundant part on the analysis result, thereby improving the image quality and the accuracy of the analysis.

[0057] Refer to Figure 2 , which is a schematic diagram of adjusting the initial detected image sequence in the embodiments of the present application, where Figure 2The leftmost image is the initial detection image sequence, the middle image is the translated detection image sequence, and the right image is the cropped detection image sequence. Compared with the initial detection image sequence, the cropped detection image sequence not only realizes the calibration of the position of the detection image, but also removes the redundant parts in the detection image.

[0058] In order to make the adjusted detection image sequence have the same size as the initial detection image sequence, in some embodiments, based on each of the above-mentioned cropped detection images, an adjusted detection image sequence is obtained, including:

[0059] For each of the above-mentioned cropped detection images, based on the initial size of the above-mentioned detection image in the above-mentioned first direction, determine the target position points where the cropped above-mentioned detection image needs to be filled with pixel points, and fill the above-mentioned target position points with preset pixel points to obtain the filled above-mentioned detection image;

[0060] Based on each of the filled above-mentioned detection images, an adjusted detection image sequence is obtained.

[0061] In specific implementation, considering that after cropping the detection image, the obtained detection image sequence is significantly smaller in size compared with the initial detection image sequence, and when the detection image sequence is used for different display devices or image processing, generally a fixed size of the detection image is required. By filling pixel points, the cropped detection image sequence can be adjusted to the size of the initial detection image sequence, so that it can be correctly displayed on the screen or meet the requirements of subsequent processing for the image size.

[0062] When filling pixel points for the cropped detection image, the initial size of the detection image in the first direction can be obtained first, and this initial size is the size of the detection image in the first direction before being cropped. Then, based on this initial size, determine the target position points where the cropped detection image needs to be filled with pixel points. In one example, the difference between the initial size and the size of the cropped detection image in the first direction can be determined first, and the number of pixel points that the detection image needs to be filled with can be determined based on this difference. Among them, the size of the cropped detection image in the first direction can be directly determined according to the above-mentioned effective size information, and the number of pixel points that the detection image needs to be filled with can be determined by the ratio of the above-mentioned difference to the pixel size information of a unit pixel in the first direction. In some embodiments, when the first deviation corresponding to the detection image is already represented by a unit pixel, the number of pixel points that the detection image needs to be filled with can be directly determined by the difference between the initial size and the size of the cropped detection image in the first direction. For example, the initial size of a certain detection image in the first direction is 2048 pixels, and the size of the cropped detection image in the first direction is 2040 pixels. At this time, the number of pixel points that the detection image needs to be filled with is 8.

[0063] After determining the number of pixel points to be filled in the detected image, the target position points of the pixel points to be filled can be randomly determined at both ends of the cropped detected image in the first direction. For example, in the above example, 4 target position points of the pixel points to be filled can be determined at both ends of the cropped detected image in the first direction. In some embodiments, in order to ensure that the position of the uncropped area in the filled detected image is consistent with the initial position of the wafer to be detected in the first direction, the target position points of the pixel points to be filled can be determined according to the relative position between each cropped detected image and the initial detected image without deviation, and the number of pixel points to be filled in the detected image.

[0064] After determining the target position points of the pixel points to be filled in the cropped detected image, preset pixel points are filled for these target position points to obtain the above-mentioned detected image after filling. The preset pixel points can be set as needed. For example, the color of the preset pixel points can be set to white or black. After obtaining the detected images after filling corresponding to each detected image, these detected images after filling are combined together to obtain an adjusted sequence of detected images. Refer to Figure 3 , where the left image is a sequence of detected images composed of cropped detected images, and the right image is a sequence of detected images composed of detected images after filling. Figure 3 The size of the right image in Figure 2 is made to be consistent with the size of the leftmost image in

[0065] In some embodiments, after obtaining the corrected detected image based on each detected image after filling, the image processing method of the embodiment of the present application further includes:

[0066] For each detected image after filling, when the target position point is an edge position point of the detected image after filling in the first direction, a first edge mark is added to the preset pixel point of the target position point; when there are original endpoint pixel points with a second edge mark at non-edge positions in the detected image after filling, the second edge mark of the original endpoint pixel points is deleted; the detected image before cropping includes a second edge mark.

[0067] In specific implementation, considering that when collecting wafer images through a scanning camera, the obtained detection images will be marked with second edge marks at the pixel points at the edge positions, so that when the subsequent processor receives the detection images, it can effectively identify the detection images. When the detection images in the initial detection image sequence are translated, cropped, and pixel-filled by the image processing method of the embodiments of the present application, it is very likely that the previous end points will be replaced, which will further cause errors in the edge marks in the detection images. To avoid this phenomenon, in the embodiments of the present application, for each filled detection image, it is necessary to detect whether there is a target position point that is the edge position point of the filled detection image in the first direction. If it exists, a first edge mark needs to be added to the target position point. At the same time, it is detected whether there are original end point pixels with second edge marks at non-edge positions in the filled detection image. If it exists, since the original end point pixels are no longer used as new end points, the second edge marks of the original end point pixels need to be deleted.

[0068] In the image processing method provided by the embodiments of the present application, when collecting each detection image, the first position information of the wafer to be detected in the first direction is obtained, and by comparing with the initial position information of the wafer to be detected, the first deviation that occurs when each detection image jitters during wafer detection is determined. Through this first deviation, each detection image in the initial detection image sequence of the wafer to be detected can be corrected and reset, thereby solving the technical problem of the distortion of the detection images caused by wafer jitter through software algorithms. Compared with improving the performance of hardware devices, the image processing method provided by the embodiments of the present application saves the cost required for improving the hardware devices and eliminates the limitation of the upper limit of the performance of the hardware devices on the correction of the wafer detection images.

[0069] Based on the same inventive concept, corresponding to the above image processing method, the present application also proposes an image acquisition method. The image acquisition method is applied to an optical detection system. The optical detection system includes an encoder and a processor. Refer to Figure 5 , the wafer detection image acquisition method includes steps S201 to S204.

[0070] Step S201, send a start signal to start this wafer detection to the motion platform through the encoder, so that the motion platform moves along the second direction; the motion platform is used to place the wafer to be detected.

[0071] In specific implementation, the moving platform is used to place the wafer to be detected and carry the wafer to be detected for movement, so that the scanning camera can collect detection images of different areas of the wafer to be detected. Since the detection accuracy requirements of the wafer to be detected are relatively high, generally, multiple wafer detections are required to complete the collection of detection images for all areas of the wafer to be detected. Since the process of each wafer detection is similar, in the embodiments of the present application, the process of single wafer detection is mainly introduced.

[0072] In the image acquisition method of the present application, an encoder sends a start signal for starting the current wafer detection to the moving platform. After receiving the start signal, the moving platform starts to move along the second direction. In some embodiments, in order to ensure the accuracy of the position adjustment of the wafer detection image, before the encoder sends a start signal to the moving platform, it is necessary to initialize the moving position of the moving platform, that is, to move the moving platform to a specified initial position.

[0073] Step S202: During the process of the moving platform moving along the second direction, the encoder sends a trigger signal to the scanning camera based on the wafer sampling frequency, so that when the scanning camera receives the trigger signal, it performs image acquisition on the wafer to be detected to obtain a detection image.

[0074] In specific implementation, in order to accurately control the scanning camera to perform detection image acquisition on the wafer to be detected, during the process of the moving platform moving along a specific second direction, the encoder transmits a trigger signal to the scanning camera according to the wafer sampling frequency. Each time the scanning camera receives the trigger signal, it performs image acquisition on the wafer to be detected to obtain a detection image. It should be noted that the wafer sampling frequency can be set in advance and sent to the encoder. When setting the wafer sampling frequency, the size of the corresponding detection image collected by the scanning camera once in the second direction can be referred to. For example, when the size of a certain detection image in the second direction is 1 pixel unit, the corresponding wafer sampling frequency can be set such that for every 1 pixel unit the moving platform moves along the second direction, the scanning camera performs one detection image acquisition. This can ensure that during the process of the moving platform moving along the second direction, the problem of a certain area of the wafer to be detected being missed in the collection is avoided. After setting the wafer sampling frequency, the encoder can send a trigger signal according to this wafer sampling frequency. For example, when the wafer sampling frequency is set such that for every 1 pixel unit the moving platform moves along the second direction, the scanning camera performs one detection image acquisition, the encoder will send a trigger signal each time it detects that the moving platform moves 1 pixel unit along the second direction.

[0075] In some embodiments, in order to collect the detection image of the wafer to be detected at the initial position, when the encoder sends a start signal to the motion platform to start the current wafer detection, a trigger signal will also be sent to the scanning camera at the same time, so that the scanning camera can collect the detection image of the wafer to be detected at the current position.

[0076] Step S203: Based on the detection images collected by the scanning camera, the processor generates an initial detection image sequence of the wafer to be detected.

[0077] Specifically, after the scanning camera collects the detection images, it will send these detection images to the processor, and then the processor combines these detection images together to generate an initial detection image sequence of the wafer to be detected. In the embodiments of the present application, the specific type of the processor can be selected according to needs. For example, in one example, the processor of the present application can be an FPGA.

[0078] Step S204: The processor adjusts the initial detection image sequence based on the image processing method as in the embodiments of the present application.

[0079] Specifically, after obtaining the initial detection image sequence of the wafer to be detected, the processor can adjust the initial detection image sequence according to the corresponding image processing method in any of the foregoing embodiments, so as to reduce the image distortion caused by wafer jitter. In one example, after the processor adjusts the initial detection image sequence to obtain an adjusted detection image sequence, it can send the adjusted detection image sequence to the host computer, so that the host computer can perform further processing according to the adjusted detection image sequence.

[0080] In some embodiments, the above optical detection system may be a wafer detection image acquisition system. Refer to Figure 4 , this optical detection system includes an encoder 208 and a processor 201. It should be noted that, in addition to the encoder and the processor, the above optical detection system may further include other components, such as a scanning camera, a motion platform, a displacement measurement device, etc.

[0081] Considering that since the wafer to be detected generally needs to be detected multiple times to ensure that the detection images of all regions of the wafer are collected, the regions of two adjacent wafer detections need to be adjacent to avoid missing regions that have not been detected. However, since the wafer image processing method in the embodiments of the present application will crop the positions of the edges of the detection images, some pixel information of the edge regions will be lost. In order to retrieve this lost pixel information, in some embodiments, the above wafer detection image acquisition method further includes:

[0082] The above-mentioned processor determines the offset distance of the wafer to be detected in the first direction during this wafer detection based on the above-mentioned adjusted detection image sequence and the above-mentioned initial detection image sequence;

[0083] The above-mentioned processor obtains the target size of the above-mentioned initial detection image sequence in the first direction;

[0084] The above-mentioned processor determines the step distance of the wafer to be detected in the first direction during the next wafer detection based on the above-mentioned offset distance and the above-mentioned target size.

[0085] Specifically, in the embodiments of the present application, when performing wafer detection, the wafer to be detected is detected row by row. Each time wafer detection is performed, the moving platform moves in the first direction to move to the target row that needs to be detected currently. Then, when starting this wafer detection, the moving platform moves in the second direction. After this wafer acquisition is completed, the moving platform needs to move in the first direction for the next wafer detection. And the distance that the wafer to be detected needs to move in the first direction during the next wafer detection is the step distance of the moving platform in the first direction. Refer to Figure 6 , if the cropping of the detection image in the embodiments of the present application is not considered when determining the step distance of the moving platform in the first direction, there will be a blank area where pixel values are not collected between the wafer detection image sequences obtained from two adjacent wafer detections. To eliminate this blank area and determine its corresponding pixel values, in the embodiments of the present application, when determining the step distance of the moving platform in the first direction, the processor will determine the offset distance of the wafer to be detected in the first direction during this wafer detection based on the adjusted detection image sequence and the initial detection image sequence, and obtain the target size of the initial detection image sequence in the first direction. Then, the processor will determine the step distance of the moving platform in the first direction during the next wafer detection of the above-mentioned wafer to be detected based on the above-mentioned offset distance and the above-mentioned target size. Thus, when determining the step distance of the moving platform at the start of each next wafer detection, it is ensured that there is a sufficient overlapping area between adjacent wafer detection image sequences to complement the cropped pixel information.

[0086] In some embodiments, when determining the step distance of the wafer to be detected in the first direction during the next wafer detection according to the offset distance and the target size, the step distance of the wafer to be detected in the first direction can be directly determined by subtracting the target size from the offset distance, that is, the step distance of the wafer to be detected in the first direction is made greater than or equal to the difference obtained by subtracting the target size from the offset distance. However, this method may ignore the offset of the detection image caused by jitter during the next wafer detection. Therefore, in some embodiments, when determining the step distance of the wafer to be detected in the first direction during the next wafer detection based on the above offset distance and the above target size, it includes:

[0087] The above processor determines the step distance of the wafer to be detected in the first direction during the next wafer detection based on the target difference between the above target size and twice the above offset distance; wherein, the above step distance is greater than or equal to the above target difference.

[0088] In specific implementation, considering that during the next wafer detection, it is still inevitable to have a deviation of the detection image caused by jitter. When determining the step distance of the wafer to be detected in the first direction, the processor can determine the step distance of the wafer to be detected in the first direction during the next wafer detection according to the target difference between the target size in the first direction of the initial detection image sequence and twice the above offset distance. Refer to Figure 7 , where the target size is 10 pixels and the offset distance is 1 pixel. At this time, the target difference between the target size and twice the offset distance is 8 pixels. Therefore, the step distance of the wafer to be detected in the first direction is 8 pixels. From Figure 7 it can be seen that at this time, the overlapping area within the dashed box 001 can retrieve the missing pixel values.

[0089] The wafer detection image acquisition method of the above embodiment is used to implement the corresponding image processing method in any of the foregoing embodiments, and has the beneficial effects of the corresponding image processing method embodiment, which will not be elaborated here.

[0090] Based on the above wafer detection image acquisition method. Correspondingly, the present application also provides an optical detection system. Refer to Figure 4 , the optical detection system includes:

[0091] An encoder 208, configured to send a start signal for starting the current wafer detection to a motion platform 204, and send a trigger signal to a scanning camera 203 based on the wafer sampling frequency during the process of the motion platform 204 moving in the second direction;

[0092] A motion platform 204, configured to place a wafer 209 to be detected and move in the second direction when receiving the start signal;

[0093] A scanning camera 203 for acquiring an image of a wafer to be detected 209 based on a trigger signal to obtain a detection image;

[0094] A processor 201 for generating an initial detection image sequence of the wafer to be detected 209 based on the detection image acquired by the scanning camera 203 and adjusting the initial detection image sequence based on the image processing method according to the embodiments of the present application.

[0095] In some embodiments, the scanning camera may be a line array scanning camera or a area array scanning camera. In one example, the scanning camera may be a TDI line array scanning camera. The processor may be an FPGA or a device including an FPGA. The above optical detection system further includes a first displacement measuring device mainly for measuring displacement information of the moving platform in the first direction. Specifically, the first displacement measuring device may be selected according to needs. For example, a laser interferometer, an optoelectronic encoder, a grating displacement sensor, etc. In one example, refer to Figure 4 , when the first displacement measuring device uses a laser interferometer, the real-time acquisition of the displacement of the moving platform in the first direction can be realized by the cooperation of a first laser interferometer 205 arranged along the first direction and a long mirror 207 arranged on the moving platform, and the AB phase signals of the acquired displacement information are synchronously sent to the processor. Among them, the A phase and the B phase are two electrical signals with a specific phase relationship (usually a 90-degree phase difference). Sending the displacement information through the AB phase signals can improve the anti-interference ability of the signals and at the same time meet the requirements of high-precision measurement.

[0096] In some embodiments, when starting the acquisition of the wafer detection image this time, the encoder will send a start signal to the moving platform. After receiving the start signal, the moving platform moves along the second direction carrying the wafer to be detected. During the movement of the moving platform along the second direction, the encoder will send a trigger signal to the scanning camera according to the wafer sampling frequency. Each time the scanning camera receives the trigger signal, it acquires an image of the wafer to be detected to obtain a detection image, and sends the acquired detection image to the processor, and the processor combines multiple detection images together to obtain an initial detection image sequence. In addition, during the movement of the moving platform along the second direction, the first displacement measuring device measures the displacement of the moving platform in the first direction to determine the first position information in the first direction corresponding to each detection image. After obtaining the initial detection image sequence of the wafer to be detected, the processor can adjust the initial detection image sequence according to the corresponding image processing method in any of the foregoing embodiments to reduce image distortion caused by wafer jitter. Refer to Figure 4 , where the first direction in the embodiments of the present application is Figure 4 the direction pointed by the arrow X in Figure 4The direction pointed by the arrow Y in

[0097] In some embodiments, the processor 201 is further configured to:

[0098] Based on the adjusted detection image sequence and the initial detection image sequence, determine the offset distance of the wafer to be detected in the first direction during this wafer detection;

[0099] Obtain the target size of the initial detection image sequence in the first direction;

[0100] Based on the offset distance and the target size, determine the step distance of the motion platform in the first direction during the next wafer detection of the wafer to be detected.

[0101] In some embodiments, during the next wafer detection of the wafer to be detected, the step distance of the motion platform in the first direction is greater than or equal to the difference between the target size and the above offset distance.

[0102] In some embodiments, during the next wafer detection of the wafer to be detected, the step distance of the motion platform in the first direction is greater than or equal to the difference between the target size and twice the above offset distance.

[0103] In some embodiments, the above optical detection system further includes a second displacement measurement device;

[0104] The second displacement measurement device is used to measure the displacement information of the motion platform in the second direction; the second direction is perpendicular to the first direction. It should be noted that in the optical detection system of the embodiments of the present application, in addition to measuring the displacement information of the motion platform in the first direction through the first displacement measurement device, the displacement information of the motion platform in the second direction can also be measured through the second displacement measurement device. The orthogonality of the motion platform can be calibrated by the combined use of the position information of the motion platform in the first direction and the displacement information in the second direction.

[0105] In some embodiments, refer to Figure 4 , the above second displacement measurement device includes a second laser interferometer 206 and a long mirror 207 arranged along the second direction.

[0106] In some embodiments, refer to Figure 4 , the optical detection system of the embodiments of the present application may further include a host computer 202. After the processor adjusts the initial detection image sequence to obtain the adjusted detection image sequence, the adjusted detection image sequence can be sent to the host computer so that the host computer can perform the next step of processing according to the adjusted detection image sequence.

[0107] The optical detection system of the above embodiments is used to implement the corresponding image acquisition method in any of the foregoing embodiments, and has the beneficial effects of the corresponding image acquisition method embodiments, which will not be elaborated here.

[0108] Figure 8 FIG. shows a schematic hardware structure diagram of an electronic device provided by an embodiment of the present application.

[0109] In some embodiments, the electronic device may include a processor 801 and a memory 802 storing computer program instructions.

[0110] Specifically, the above-mentioned processor 801 may include a central processing unit (CPU), or an application specific integrated circuit (ASIC), or one or more integrated circuits configured to implement the embodiments of the present application.

[0111] The memory 802 may include a mass storage for data or instructions. By way of example and not limitation, the memory 802 may include a hard disk drive (HDD), a floppy disk drive, a flash memory, an optical disc, a magneto-optical disc, a magnetic tape, or a universal serial bus (USB) drive, or a combination of two or more of these. In a suitable case, the memory 802 may include a removable or non-removable (or fixed) medium. In a suitable case, the memory 802 may be internal or external to the integrated gateway disaster recovery device. In a particular embodiment, the memory 802 is a non-volatile solid state memory.

[0112] In a particular embodiment, the memory 802 includes a read-only memory (ROM). In a suitable case, the ROM may be a mask-programmed ROM, a programmable ROM (PROM), an erasable PROM (EPROM), an electrically erasable PROM (EEPROM), an electrically rewritable ROM (EAROM), or a flash memory, or a combination of two or more of these.

[0113] The memory may include a read-only memory (ROM), a random access memory (RAM), a magnetic disk storage media device, an optical storage media device, a flash memory device, an electrical, optical, or other physical / tangible memory storage device. Thus, in general, the memory includes one or more tangible (non-transitory) computer-readable storage media (e.g., memory devices) encoded with software including computer-executable instructions, and when the software is executed (e.g., by one or more processors), it is operable to perform the operations described in reference to the method according to one aspect of the present disclosure.

[0114] The processor 801 reads and executes the computer program instructions stored in the memory 802 to implement any one of the multi-disciplinary model co-simulation methods in the above embodiments.

[0115] In one example, the electronic device may further include a communication interface 803 and a bus 810. Among them, as Figure 8 shown, the processor 801, the memory 802, and the communication interface 803 are connected through the bus 810 to complete communication with each other.

[0116] The communication interface 803 is mainly used to implement communication between each module, device, unit, and / or device in the embodiments of the present application.

[0117] The bus 810 includes hardware, software, or both, and couples the components of the online data flow metering device to each other. By way of example and not limitation, the bus may include an Accelerated Graphics Port (AGP) or other graphics bus, an Enhanced Industry Standard Architecture (EISA) bus, a Front Side Bus (FSB), a HyperTransport (HT) interconnect, an Industry Standard Architecture (ISA) bus, an InfiniBand interconnect, a Low Pin Count (LPC) bus, a memory bus, a MicroChannel Architecture (MCA) bus, a Peripheral Component Interconnect (PCI) bus, a PCI-Express (PCI-X) bus, a Serial Advanced Technology Attachment (SATA) bus, a Video Electronics Standards Association Local (VLB) bus, or other suitable buses or a combination of two or more of these. In a suitable case, the bus 810 may include one or more buses. Although the embodiments of the present application describe and illustrate specific buses, the present application contemplates any suitable bus or interconnect.

[0118] The electronic device in the above embodiments is used to implement the corresponding image processing method in any one of the foregoing embodiments, and has the beneficial effects of the corresponding method embodiments, which will not be elaborated here.

[0119] In addition, in combination with the image processing method in the above embodiments, the embodiments of the present application can be implemented by providing a computer storage medium. Computer program instructions are stored on the computer storage medium; when the computer program instructions are executed by a processor, any one of the image processing methods in the above embodiments is implemented.

[0120] In addition, in combination with the image processing method in the above embodiments, the embodiments of the present application can be implemented by providing a computer program product. When the instructions in the computer program product are executed by the processor of the electronic device, the electronic device is caused to execute the image processing method provided in any aspect of the embodiments of the present application as described above.

[0121] It should be clear that the present application is not limited to the specific configurations and processes described above and shown in the figures. For the sake of brevity, the detailed descriptions of known methods are omitted here. In the above embodiments, several specific steps are described and shown as examples. However, the method process of the present application is not limited to the specific steps described and shown, and those skilled in the art can make various changes, modifications, and additions, or change the order between steps after understanding the spirit of the present application.

[0122] The functional blocks shown in the above-described structural block diagrams can be implemented as hardware, software, firmware, or a combination thereof. When implemented in hardware, it can be, for example, an electronic circuit, an application-specific integrated circuit (ASIC), appropriate firmware, a plug-in, a functional card, and so on. When implemented in software, the elements of the present application are programs or code segments used to perform the required tasks. The program or code segment can be stored in a machine-readable medium or transmitted via a data signal carried in a carrier wave over a transmission medium or a communication link. "Machine-readable medium" can include any medium capable of storing or transmitting information. Examples of machine-readable media include electronic circuits, semiconductor memory devices, ROM, flash memory, erasable ROM (EROM), floppy disks, CD-ROMs, optical discs, hard disks, fiber optic media, radio frequency (RF) links, and so on. The code segment can be downloaded via a computer network such as the Internet, an intranet, and so on.

[0123] It should also be noted that the exemplary embodiments mentioned in the present application describe some methods or systems based on a series of steps or devices. However, the present application is not limited to the order of the above steps, that is, the steps can be executed in the order mentioned in the embodiments, can be different from the order in the embodiments, or several steps can be executed simultaneously.

[0124] Aspects of the present disclosure have been described above with reference to the flowcharts and / or block diagrams of methods, apparatuses (systems), and computer program products according to embodiments of the present disclosure. It should be understood that each block in the flowcharts and / or block diagrams, and the combinations of blocks in the flowcharts and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing devices to produce a machine such that the instructions executed by the processor of the computer or other programmable data processing devices enable the implementation of the functions / actions specified in one or more blocks of the flowcharts and / or block diagrams. Such a processor can be, but is not limited to, a general-purpose processor, a special-purpose processor, a special application processor, or a field-programmable logic circuit. It is also understood that each block in the block diagrams and / or flowcharts, and the combinations of blocks in the block diagrams and / or flowcharts, can also be implemented by dedicated hardware performing the specified functions or actions, or by a combination of dedicated hardware and computer instructions.

[0125] As described above, this is only the specific implementation manner of the present application. Those skilled in the art can clearly understand that for the convenience and brevity of description, the specific working processes of the systems, modules, and units described above can refer to the corresponding processes in the foregoing method embodiments, and will not be elaborated herein. It should be understood that the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present application can easily think of various equivalent modifications or substitutions, and these modifications or substitutions should all be covered within the protection scope of the present application.

Claims

1. An image processing method, characterized in that, Including: Obtain an initial detection image sequence of a wafer to be detected and initial position information of the wafer to be detected in a first direction; The initial detection image sequence includes a plurality of detection images; the plurality of detection images are sequentially acquired during the movement of the wafer to be detected in a second direction, and the first direction is perpendicular to the second direction; For each detection image, obtain first position information of the wafer to be detected in the first direction when the detection image is acquired, and determine a first deviation, where the first deviation is the deviation between the first position information and the initial position information; Adjust the initial detection image sequence based on the first deviations corresponding to the respective detection images to obtain an adjusted detection image sequence.

2. The method according to claim 1, wherein Adjusting the initial detection image sequence based on the first deviations corresponding to the respective detection images to obtain an adjusted detection image sequence includes: Determine effective size information of the adjusted detection image sequence in the first direction based on the maximum value and the minimum value of the first deviations corresponding to the plurality of detection images; For each of the detection images, translate the detection image based on the first deviation corresponding to the detection image so that the position information of the translated detection image corresponds to the initial position information; crop the translated detection image based on the effective size information to obtain a cropped detection image; Obtain an adjusted detection image sequence based on the respective cropped detection images.

3. The method according to claim 2, characterized in that, Obtaining an adjusted detection image sequence based on the respective cropped detection images includes: For each cropped detection image, determine target position points where pixel points need to be filled in the cropped detection image based on the initial size of the detection image in the first direction, fill the target position points with preset pixel points to obtain a filled detection image; Obtain an adjusted detection image sequence based on the respective filled detection images.

4. The method according to claim 3, wherein After adjusting the initial detection image sequence based on the first deviations corresponding to the respective detection images to obtain an adjusted detection image sequence, the method further includes: For each filled detection image, when the target position point is an edge position point of the filled detection image in the first direction, add a first edge mark to the preset pixel point of the target position point; when there are original end point pixel points with a second edge mark at non-edge positions in the filled detection image, delete the second edge mark of the original end point pixel points; the detection image before cropping includes the second edge mark.

5. The method according to claim 1, wherein Determining the first deviation includes: Determine an initial deviation value between the first position information and the initial position information; Obtain pixel size information of a unit pixel corresponding to the initial detection image sequence in the first direction; Determine the first deviation based on the pixel size information and the initial deviation value; where the first deviation is represented by a unit pixel.

6. An optical detection system, characterized in that, Including: An encoder, configured to send a start signal for starting the current wafer inspection to a motion platform, and during the process of the motion platform moving in the second direction, send a trigger signal to a scanning camera based on a wafer sampling frequency; The motion platform is configured to place a wafer to be inspected, and move in the second direction when receiving the start signal; A scanning camera, configured to perform image acquisition on the wafer to be inspected based on the trigger signal to obtain a detection image; A processor, configured to generate an initial detection image sequence of the wafer to be inspected based on the detection image acquired by the scanning camera, and adjust the initial detection image sequence based on the wafer inspection image processing method according to any one of claims 1-5.

7. The system according to claim 6, wherein The processor is further configured to: Determine an offset distance of the wafer to be inspected in the first direction based on the adjusted detection image sequence and the initial detection image sequence; Obtain a target size of the initial detection image sequence in the first direction; Determine a step distance of the motion platform in the first direction during the next wafer inspection based on the offset distance and the target size.

8. The system according to claim 7, wherein The step distance is greater than or equal to a difference between the target size and twice the offset distance.

9. The system according to claim 6, wherein The system further includes a second displacement measuring device; the second displacement measuring device is configured to measure displacement information of the motion platform in the second direction; the second direction is perpendicular to the first direction.

10. An electronic device, characterized in that, The device includes: a processor and a memory storing computer program instructions; when the processor executes the computer program instructions, the image processing method according to any one of claims 1-5 is implemented.

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