High-efficiency heat dissipation circuit board

Abstract

The invention discloses an efficient heat dissipation circuit board which comprises a substrate, a circuit board body and a plurality of heat dissipation units, a plurality of temperature sensors are installed at the circuit board body, and each heat dissipation unit comprises a heat conduction plate fixedly connected with the substrate through a supporting column, upper heat dissipation fins, lower heat dissipation fins and a thermoelectric refrigeration unit installed on the heat conduction plate. The cold surface of the thermoelectric refrigeration unit faces the circuit board body, and the hot surface abuts against the heat-conducting plate. According to the circuit board provided by the invention, the temperature of each area of the circuit board body can be monitored, so that the temperature of the circuit body can be comprehensively monitored. Moreover, the local efficient and rapid heat dissipation of the circuit board body can be realized, thereby guaranteeing the long-term stable operation of the circuit board.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit boards, and more specifically, to an efficient heat dissipation circuit board. Background Art

[0002] Circuit boards play a crucial role in electronic devices. They provide support and connection for electronic components to ensure the normal operation of the circuit. Circuit boards are widely used in electronic products in various industries such as communication devices, computers, household appliances, and industrial equipment, and are an indispensable part of modern electronic devices.

[0003] The heat generation of different regions of the circuit board is often different, which is jointly determined by factors such as the working power of different components and the layout density of the components. Existing circuit boards often cannot monitor the local temperature of the circuit board, making it difficult for staff to accurately understand the heat distribution on the circuit board, and thus unable to take effective heat dissipation measures, resulting in low heat dissipation efficiency. And existing circuit boards cannot achieve efficient and rapid heat dissipation of local areas, easily leading to local overheating problems of the circuit board. Local overheating not only causes a decline in the performance of the circuit board and an acceleration of component aging, but may also cause serious faults such as short circuits and burns, posing a serious threat to the normal operation of the equipment. Summary of the Invention

[0004] The present invention aims to overcome the defects of the prior art and provides an efficient heat dissipation circuit board.

[0005] To achieve the above object, the present invention provides the following technical solution: A circuit board includes a substrate, a circuit board body, and a plurality of heat dissipation units. A plurality of temperature sensors are installed on the circuit board body. The heat dissipation unit includes a heat conduction plate fixedly connected to the substrate through a support column, an upper heat dissipation fin, a lower heat dissipation fin, and a thermoelectric refrigeration unit installed on the heat conduction plate. The cold surface of the thermoelectric refrigeration unit faces the circuit board body, and the hot surface abuts against the heat conduction plate.

[0006] Further, the circuit board body is installed on the substrate, and the heat dissipation unit is installed on the substrate.

[0007] Further, the upper heat dissipation fin is fixed to the upper surface of the heat conduction plate, and the lower heat dissipation fin is fixed to the lower surface of the heat conduction plate.

[0008] Further, the directions of the upper heat dissipation fin and the lower heat dissipation fin are perpendicular.

[0009] Further, the first pipe portion is parallel to the upper heat dissipation fin; the lower heat dissipation fin is parallel to the second pipe portion.

[0010] Thus, when blowing and dissipating heat from the side, the direction of the upper heat dissipation fin is more matched with the direction of the heat dissipation air flow.

[0011] Further, there is at least one temperature sensor below each heat dissipation unit.

[0012] Further, multiple temperature sensors are distributed in a rectangular array.

[0013] Thus, it is more convenient to monitor the temperatures of various regions of the circuit board body.

[0014] Further, the thermoelectric refrigeration unit is a semiconductor thermoelectric refrigeration unit.

[0015] Further, the circuit board body and the substrate are fixedly connected by bolts.

[0016] Further, there is a heat conduction pad or heat conduction glue between the hot surface and the heat conduction plate.

[0017] Further, it further includes an air flow generating unit and an air outlet hood connected to the air flow generating unit through a first pipe portion. There are three heat dissipation units, and the air outlet hood and the three heat dissipation units are distributed in a row.

[0018] Further, the three heat dissipation units are distributed in a row at equal intervals.

[0019] Further, one end of the air outlet hood faces the circuit board body.

[0020] Further, the air outlet hood is fixedly connected to the substrate through a support rod.

[0021] Further, it further includes two air guiding units and two driving units. The air guiding unit includes two end plates, an air inlet chamber, an air outlet chamber, and a top plate. The ends of the air inlet chambers of the two air guiding units facing each other are open. The air inlet chamber farther away from the air flow generating unit is connected with a flexible pipe portion; the air flow generating unit is also connected with a second pipe portion. One end of the flexible pipe portion is inserted into the second pipe portion. A limiting seat with a U-shaped limiting channel is fixed at the substrate, and the flexible pipe portion passes through the U-shaped limiting channel; the cooperation of the two driving units and the two air guiding units can realize the independent translational driving of the two air guiding units.

[0022] Since the flexible pipe portion has flexibility and can be made of, for example, rubber material, while having flexibility, its shape will not collapse. Thus, along with the movement of the air guiding unit connected thereto and under the limitation of the limiting seat, the end of the flexible pipe portion inserted into the second pipe portion can insert more or less.

[0023] Further, the air inlet chamber is connected to one of the end plates, and the air outlet chamber is connected to the other end plate.

[0024] Further, the top plate connects the two end plates.

[0025] Further, the end plate connected to the air inlet chamber has an air inlet through hole communicating with the air inlet chamber.

[0026] Further, the end plate connected to the air outlet chamber has an air outlet through hole communicating with the air outlet chamber.

[0027] Further, the first pipe portion is fixedly connected to the substrate through a plurality of first support blocks.

[0028] Further, the second pipe portion is fixedly connected to the substrate through a plurality of second support blocks.

[0029] Further, the three heat dissipation units are respectively a first heat dissipation unit, a second heat dissipation unit and a third heat dissipation unit; both the first pipe portion and the second pipe portion are rigid pipe portions, a first valve is installed at the first pipe portion, and a second valve is installed at the second pipe portion; the circuit board can be in a first heat dissipation state and a second heat dissipation state. In the first heat dissipation state, the air flow generating unit and the first valve are opened, the second valve is closed, one of the air guiding units is located between the first heat dissipation unit and the second heat dissipation unit, and the other air guiding unit is located between the second heat dissipation unit and the third heat dissipation unit; in the second heat dissipation state, the air flow generating unit and the second valve are opened, the first valve is closed, and the two air guiding units are located at the position of the same heat dissipation unit.

[0030] Further, the driving unit includes a first mounting seat, a second mounting seat, two motors mounted on the first mounting seat, two bearings mounted at the second mounting seat, and two lead screws connected between the motors and the bearings; the air inlet chamber is connected with a first sliding seat, the air outlet chamber is connected with a second sliding seat, the first sliding seat has a first threaded hole cooperating with one of the lead screws and a first through hole portion penetrated by the other lead screw, and the second sliding seat has a second threaded hole cooperating with one of the lead screws and a second through hole portion penetrated by the other lead screw.

[0031] Further, the first through hole portion is not in contact with the lead screw passing through it; the second through hole portion is not in contact with the lead screw passing through it.

[0032] Thus, the two driving units altogether have four motors, four bearings and four lead screws, wherein two motors, two bearings and two lead screws are used to drive one air guiding unit, and the other two motors, the other two bearings and the other two lead screws are used to drive the other air guiding unit.

[0033] Further, limiting bumps are connected to both end plates of the air guiding unit, strip-shaped blocks are fixedly connected to both ends of the heat conducting plate, and the strip-shaped blocks have strip-shaped limiting grooves cooperating with the limiting bumps.

[0034] Thus, on the one hand, the translation of the air guiding unit is limited, and on the other hand, when the air guiding unit contacts the strip-shaped blocks, it can also serve the purpose of helping with heat dissipation.

[0035] Furthermore, one side of the top plate close to the air outlet hood is higher than the side far from the air outlet hood, and the included angle between the top plate and the substrate is between 5° and 15°.

[0036] Thus, in the first heat dissipation state, the side of the top plate facing the heat dissipation air flow is higher, so as to gather the heat dissipation air flow, and make the heat dissipation air flow better blow towards the heat dissipation unit farther away.

[0037] Furthermore, the substrate is provided with a rectangular through hole and a rectangular groove portion surrounding the rectangular through hole, and the circuit board body is installed at the groove portion.

[0038] Thus, the installation between the circuit board body and the substrate is realized.

[0039] Furthermore, the air flow generating unit includes an air flow generating chamber and a fan unit installed in the air flow generating chamber.

[0040] Furthermore, the air flow generating chamber is provided with a plurality of ventilation holes.

[0041] Furthermore, the upper heat dissipation fins have strip-shaped notches.

[0042] Thus, the strip-shaped notches can make the heat dissipation air flow better blow towards the heat dissipation unit farther away.

[0043] Furthermore, some components on the circuit board body are abutted against the thermoelectric refrigeration unit through heat conduction pads.

[0044] Thus, for some components with large heat generation, such as power components, they can be abutted against the thermoelectric refrigeration unit, so that the thermoelectric refrigeration unit can quickly refrigerate when needed to dissipate heat from the components with large heat generation.

[0045] Beneficial effects:

[0046] 1. The circuit board of the present application can monitor the temperatures of various regions of the circuit board body, so as to comprehensively monitor the temperature of the circuit board body.

[0047] 2. The circuit board of the present application can achieve efficient and rapid heat dissipation of a part of the circuit board body, so as to ensure the long-term stable operation of the circuit board. Description of the drawings

[0048] Figure 1 It is a schematic diagram of the first perspective in the first heat dissipation state;

[0049] Figure 2 It is an enlarged view of area A;

[0050] Figure 3 It is an enlarged view of area B;

[0051] Figure 4 Schematic diagram of the second perspective of the first heat dissipation state;

[0052] Figure 5 Enlarged view of area C;

[0053] Figure 6 Enlarged view of area D;

[0054] Figure 7 Schematic diagram of the first perspective of the second heat dissipation state;

[0055] Figure 8 Enlarged view of area E;

[0056] Figure 9 Schematic diagram of the second perspective of the second heat dissipation state;

[0057] Figure 10 Enlarged view of area F.

[0058] Description of reference numerals: Substrate 1; Rectangular through-hole 1.1; Circuit board body 2; Support column 3.1; Heat conduction plate 3.2; Strip-shaped limiting groove 3.2.1; Upper heat dissipation fin 3.3; Strip-shaped notch 3.3.1; Lower heat dissipation fin 3.4; Thermoelectric refrigeration unit 4; Airflow generating unit 5; First pipe portion 5.1; First valve 5.1.1; First support block 5.1.2; Air outlet hood 5.2; Support rod 5.2.1; Second pipe portion 5.3; Second support block 5.3.2; End plate 6.1; Limiting protrusion 6.1.1; Air inlet chamber 6.2; Air outlet chamber 6.3; Top plate 6.4; Flexible pipe portion 6.5; Limiting seat 6.6; First sliding seat 6.7; Second sliding seat 6.8; First mounting seat 7.1; Second mounting seat 7.2; Motor 7.3; Bearing 7.4; Lead screw 7.5. Detailed implementation manners

[0059] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions from beginning to end. The embodiments described below with reference to the drawings are exemplary and are intended to explain the present invention, and should not be construed as a limitation to the present invention.

[0060] The present invention provides an efficient heat dissipation circuit board as shown in the figure, which includes a substrate 1, a circuit board body 2 installed at the substrate 1, and a plurality of heat dissipation units installed at the substrate 1. A plurality of temperature sensors are installed at the circuit board body 2. The heat dissipation unit includes a heat conduction plate 3.2 fixedly connected to the substrate 1 through a support column 3.1, an upper heat dissipation fin 3.3 fixed on the upper surface of the heat conduction plate 3.2, a lower heat dissipation fin 3.4 fixed on the lower surface of the heat conduction plate 3.2, and a thermoelectric refrigeration unit 4 installed on the heat conduction plate 3.2. The cold surface of the thermoelectric refrigeration unit 4 faces the circuit board body 2, and the hot surface abuts against the heat conduction plate 3.2. The circuit board further includes an air flow generating unit 5 and an air outlet hood 5.2 connected to the air flow generating unit 5 through a first pipe portion 5.1. There are three heat dissipation units, and the air outlet hood 5.2 and the three heat dissipation units are arranged in a row. The circuit board further includes two air guiding units and two driving units. The air guiding unit includes two end plates 6.1, an air inlet chamber 6.2 connected to one of the end plates 6.1, an air outlet chamber 6.3 connected to the other end plate 6.1, and a top plate 6.4 connecting the two end plates 6.1. The ends of the air inlet chambers 6.2 of the two air guiding units facing each other are open. The air inlet chamber 6.2 farther away from the air flow generating unit 5 is connected with a flexible pipe portion 6.5. The air flow generating unit 5 is further connected with a second pipe portion 5.3. One end of the flexible pipe portion 6.5 is inserted into the second pipe portion 5.3. A limit seat 6.6 with a U-shaped limit channel is fixed at the substrate 1, and the flexible pipe portion 6.5 passes through the U-shaped limit channel. The cooperation of the two driving units and the two air guiding units can realize the independent translational driving of the two air guiding units.

[0061] The three heat dissipation units are the first heat dissipation unit, the second heat dissipation unit and the third heat dissipation unit respectively; both the first pipe portion 5.1 and the second pipe portion 5.3 are rigid pipe portions, a first valve 5.1.1 is installed at the first pipe portion 5.1, and a second valve is installed at the second pipe portion 5.3; the circuit board can be in a first heat dissipation state and a second heat dissipation state. In the first heat dissipation state, the air flow generating unit 5 and the first valve 5.1.1 are opened, the second valve is closed, one of the air guiding units is located between the first heat dissipation unit and the second heat dissipation unit, and the other air guiding unit is located between the second heat dissipation unit and the third heat dissipation unit; in the second heat dissipation state, the air flow generating unit 5 and the second valve are opened, the first valve 5.1.1 is closed, and the two air guiding units are located at the position of the same heat dissipation unit. The driving unit includes a first mounting seat 7.1, a second mounting seat 7.2, two motors 7.3 mounted on the first mounting seat 7.1, two bearings 7.4 mounted at the second mounting seat 7.2, and two lead screws 7.5 connected between the motors 7.3 and the bearings 7.4; the air inlet chamber 6.2 is connected with a first sliding seat 6.7, the air outlet chamber 6.3 is connected with a second sliding seat 6.8, the first sliding seat 6.7 has a first threaded hole that cooperates with one of the lead screws 7.5 and a first through hole portion that is penetrated by the other lead screw 7.5, and the second sliding seat 6.8 has a second threaded hole that cooperates with one of the lead screws 7.5 and a second through hole portion that is penetrated by the other lead screw 7.5.

[0062] Limit bumps 6.1.1 are connected to both ends of the two end plates 6.1 of the air guiding unit. Bar-shaped blocks are fixedly connected to both ends of the heat conducting plate 3.2, and the bar-shaped blocks have bar-shaped limiting grooves 3.2.1 that cooperate with the limit bumps 6.1.1. One side of the top plate 6.4 close to the air outlet cover 5.2 is higher than the side far from the air outlet cover 5.2, and the included angle between the top plate 6.4 and the substrate 1 is between 5 and 15 degrees. The substrate 1 has a rectangular through hole 1.1 and a rectangular frame-shaped groove portion surrounding the rectangular through hole, and the circuit board body 2 is installed at the groove portion. The air flow generating unit 5 includes an air flow generating chamber and a fan unit installed in the air flow generating chamber; the upper heat dissipation fins 3.3 have bar-shaped notches 3.3.1. Some components on the circuit board body 2 are abutted against the thermoelectric refrigeration unit 4 through heat conducting pads.

[0063] Working principle: For the circuit board of the present application, since there are multiple temperature sensors on the circuit board body, the temperature of each part of the circuit board body can be monitored, so that the overall temperature of the circuit board body can be comprehensively monitored. When there is no local high temperature, natural heat conduction can be achieved by using the heat conduction of the heat conducting plate, and air cooling by the air flow generating unit can be used in case of need. And when the local temperature shows a high temperature anomaly, the thermoelectric refrigeration unit can be used to quickly cool and dissipate heat from the local part of the circuit board body. And the heat is transferred to the heat conducting plate through the hot surface of the refrigeration unit and blown away by the cooling air flow of the air flow generating unit.

[0064] And the air flow generating unit has two air-cooled heat dissipation modes, as Figure 1 shown, the two air guiding units are respectively located between two gaps of the three heat dissipation units, and the air outlet hood can realize air outlet. Since there are strip-shaped notches on the upper heat dissipation fins and one side of the top plate facing the heat dissipation air flow is higher, the heat dissipation air flow can better slightly sweep the upper heat dissipation fins. And although the heat dissipation air flow will move upward when moving far away, under the guiding action of the top plate, more heat dissipation air flow will pass under the top plate, so as to better slightly sweep the upper heat dissipation fins. In this state, the heat dissipation air flow can realize purging heat dissipation of the upper heat dissipation fins of the three heat dissipation units.

[0065] In addition, in the second heat dissipation state, if the temperature of the circuit board body corresponding to a certain heat dissipation unit rises abnormally, the two air guiding units can be located above this heat dissipation unit, so that the air flow generated by the air flow generating unit passes through the second pipe part, the flexible pipe part, the two air inlet chambers, the two top plates and the two air outlet chambers, so that the heat dissipation air flow can purge the upper heat dissipation fins of this heat dissipation unit, thereby realizing rapid heat dissipation of this heat dissipation unit. Thus, rapid heat dissipation of the local temperature rise of the circuit board body can be realized through this heat dissipation method.

[0066] Although the present invention has been illustrated and described with respect to the preferred embodiments, those skilled in the art should understand that various changes and modifications can be made to the present invention as long as they do not exceed the scope defined by the claims of the present invention.

Claims

1. An efficient heat dissipation circuit board, characterized in that, It includes a substrate, a circuit board body, and multiple heat dissipation units. Multiple temperature sensors are installed on the circuit board body. The heat dissipation unit includes a heat conduction plate fixedly connected to the substrate through a support column, an upper heat dissipation fin, a lower heat dissipation fin, and a thermoelectric refrigeration unit installed on the heat conduction plate. The cold surface of the thermoelectric refrigeration unit faces the circuit board body, and the hot surface abuts against the heat conduction plate.

2. The high-efficiency heat dissipation circuit board according to claim 1, wherein It further includes an air flow generating unit and an air outlet hood connected to the air flow generating unit through a first pipe portion. There are three heat dissipation units, and the air outlet hood and the three heat dissipation units are arranged in a row.

3. The highly efficient heat dissipation circuit board according to claim 2, wherein It further includes two air guiding units and two driving units. The air guiding unit includes two end plates, an air inlet chamber, an air outlet chamber, and a top plate. The ends of the air inlet chambers of the two air guiding units facing each other are open. The air inlet chamber farther away from the air flow generating unit is connected with a flexible pipe portion. The air flow generating unit is also connected with a second pipe portion. One end of the flexible pipe portion is inserted into the second pipe portion. A limiting seat with a U-shaped limiting channel is fixed at the substrate, and the flexible pipe portion passes through the U-shaped limiting channel. The cooperation of the two driving units and the two air guiding units can realize the independent translational driving of the two air guiding units.

4. The high-efficiency heat dissipation circuit board according to claim 3, wherein The three heat dissipation units are respectively a first heat dissipation unit, a second heat dissipation unit, and a third heat dissipation unit. Both the first pipe portion and the second pipe portion are rigid pipe portions. A first valve is installed at the first pipe portion, and a second valve is installed at the second pipe portion. The circuit board can be in a first heat dissipation state and a second heat dissipation state. In the first heat dissipation state, the air flow generating unit and the first valve are opened, and the second valve is closed. One of the air guiding units is located between the first heat dissipation unit and the second heat dissipation unit, and the other air guiding unit is located between the second heat dissipation unit and the third heat dissipation unit. In the second heat dissipation state, the air flow generating unit and the second valve are opened, and the first valve is closed. The two air guiding units are located at the position of the same heat dissipation unit.

5. The high-efficiency heat dissipation circuit board according to claim 4, wherein The driving unit includes a first mounting seat, a second mounting seat, two motors installed on the first mounting seat, two bearings installed at the second mounting seat, and two lead screws connected between the motors and the bearings. The air inlet chamber is connected with a first sliding seat, and the air outlet chamber is connected with a second sliding seat. The first sliding seat has a first threaded hole that cooperates with one of the lead screws and a first through-hole portion that is penetrated by the other lead screw. The second sliding seat has a second threaded hole that cooperates with one of the lead screws and a second through-hole portion that is penetrated by the other lead screw.

6. The highly efficient heat dissipation circuit board according to claim 5, characterized in that, Limiting bumps are connected to both ends of the two end plates of the air guiding unit. Bar-shaped blocks are fixedly connected to both ends of the heat conduction plate, and the bar-shaped blocks have bar-shaped limiting grooves that cooperate with the limiting bumps.

7. The high-efficiency heat dissipation circuit board according to claim 4, wherein The side of the top plate close to the air outlet hood is higher than the side far from the air outlet hood, and the included angle between the top plate and the substrate is between 5° and 15°.

8. The highly efficient heat dissipation circuit board according to claim 5, wherein The substrate has a rectangular through-hole and a rectangular frame-shaped groove portion surrounding the rectangular through-hole. The circuit board body is installed at the groove portion.

9. The highly efficient heat dissipation circuit board according to claim 5, characterized in that The air flow generating unit includes an air flow generating chamber and a fan unit installed in the air flow generating chamber. The upper heat dissipation fin has a strip-shaped notch.

10. The highly efficient heat dissipation circuit board according to claim 5, wherein Some components on the circuit board body abut against the thermoelectric refrigeration unit through a heat conduction pad.

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