Heat exchange device, electronic equipment and server cabinet

Abstract

The invention relates to the technical field of mechanism design, and discloses a heat exchange device, electronic equipment and a server cabinet. The first flow channel is arranged on the device main body and is used for connecting a primary side pipeline; the second flow channel is arranged on the device body and used for being connected with a secondary side pipeline, and the first flow channel is in heat exchange connection with the second flow channel; the heat conduction structure is in heat exchange connection with the first flow channel. The heat exchange device can solve the problems that in the related technology, a space needs to be reserved in a server cabinet to arrange a cold liquid distribution unit, exhaust air of a server can affect the temperature in a machine room, and the temperature of the environment of the machine room needs to be controlled through an air conditioner, the overall energy consumption of a data center is reduced, and the service life of the data center is prolonged. The space in the cabinet is saved, the high-density design of the cabinet is facilitated, and the cost of the cooling liquid can be reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of mechanism design, and particularly to a heat exchange device, an electronic device, and a server cabinet. Background Art

[0002] With the continuous increase in the power demand of servers, the performance requirements for the internal heat exchange devices thereof are becoming increasingly stringent.

[0003] In related technologies, some heat exchange devices include a cold plate and heat dissipation fins provided on the cold plate. The cold plate is used to connect to high-power components inside the server, so as to perform liquid cooling on the high-power components. The heat dissipation fins are heat exchange-connected to the cold plate, so as to cooperate with the air-cooling module inside the server to perform air cooling on the high-power components. However, such a heat exchange device needs to reserve space in the server cabinet to set up a cold liquid distribution unit, resulting in a large occupied space, and the air blown by the air-cooling module will carry part of the heat and be discharged into the computer room through the openings of the server chassis, and an air conditioner is required to control the temperature of the computer room environment. Summary of the Invention

[0004] In view of this, the present invention provides a heat exchange device, an electronic device, and a server cabinet to solve the problems in related technologies that it is necessary to reserve space in the server cabinet to set up a cold liquid distribution unit, and the exhaust air of the electronic device will affect the temperature in the computer room, and an air conditioner is required to control the temperature of the computer room environment.

[0005] In a first aspect, the present invention provides a heat exchange device, including: A device main body; A first flow channel, provided on the device main body and used for connecting a primary side pipeline; A second flow channel, provided on the device main body and used for connecting a secondary side pipeline, and the first flow channel is heat exchange-connected to the second flow channel; A heat conduction structure, heat exchange-connected to the first flow channel.

[0006] In a second aspect, the present invention further provides an electronic device, including: A chassis, in which a first high-power component and a second high-power component can be arranged, and the power consumption of the first high-power component is greater than that of the second high-power component; A cold plate, provided in the chassis and used for heat exchange connection with the first high-power component; The heat exchange device provided in the first aspect of the present invention is provided in the chassis, and the second flow channel of the heat exchange device is connected to the cold plate through a secondary side pipeline; An air-cooling module, provided in the chassis and capable of blowing air to the heat conduction structure of the heat exchange device.

[0007] In a third aspect, the present invention provides a server cabinet, including: A cabinet body; The electronic device provided in the second aspect of the present invention is disposed inside the cabinet.

[0008] Through this application, during the use of the heat exchange device according to the embodiments of the present invention, it can be disposed inside the chassis of the electronic device. The second flow channel can connect the cold plate inside the electronic device through the secondary side pipeline, and the first flow channel can be connected to the cold source through the primary side pipeline. Then, the coolant in the secondary side pipeline can carry the heat released by the second power-consuming component and exchange heat with the low-temperature coolant from the cold source in the first flow channel inside the heat exchange device, thereby realizing liquid cooling and heat dissipation for the first power-consuming component. The first flow channel can be connected to the cold source and take away the heat released by the first power-consuming component and discharge it outside the system.

[0009] The heat conduction structure is in heat exchange connection with the first flow channel, thereby being able to obtain cold quantity from the first flow channel, and then cooperate with the air-cooling module inside the electronic device, so as to provide a low-temperature cooling air flow to the second power-consuming component inside the electronic device to realize air-cooling heat dissipation for the second power-consuming component. After the heat conduction structure is heated itself, the heat on it can be taken away by the primary side pipeline through the first flow channel connected to it and discharged outside the heat exchange device, so that the heat conduction structure is continuously cooled.

[0010] On this basis, since the heat conduction structure can convert the air flow blown out by the air-cooling module into a low-temperature cooling air flow, it can avoid the influence of the exhaust air of the electronic device on the temperature of the computer room, avoid controlling the temperature of the computer room through air conditioners, and thus contribute to reducing the overall energy consumption of the data center.

[0011] Moreover, since the heat exchange device according to the embodiments of the present invention can be disposed inside the chassis of the electronic device, and the device main body is provided with a first flow channel and a second flow channel, it can replace the cold liquid distribution unit to play a heat exchange role. As a result, there is no need to separately reserve space inside the cabinet to set up the cold liquid distribution unit, which helps to save the space inside the cabinet, and can make the secondary side pipeline be completely disposed inside the chassis of the electronic device without extending outside the chassis and connecting to the cold liquid distribution unit, thereby shortening the length of the secondary side pipeline, and then reducing the amount of high-quality coolant in the secondary side pipeline, and greatly saving the cost of the coolant.

[0012] Therefore, the heat exchange device according to the embodiments of the present invention can solve the problems in the related art that it is necessary to reserve space inside the server cabinet to set up the cold liquid distribution unit, and the exhaust air of the server will affect the temperature inside the computer room, and it is necessary to control the temperature of the computer room environment through air conditioners, and it helps to reduce the overall energy consumption of the data center, save the space inside the cabinet, is beneficial to the high-density design of the cabinet, and can reduce the cost of the coolant. Description of the Drawings

[0013] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the related art, the following will briefly introduce the drawings required for use in the description of the specific embodiments or the related art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0014] Figure 1 A cross-sectional view of a heat exchange device according to an embodiment of the present invention at an angle; Figure 2 A cross-sectional view of a heat exchange device according to an embodiment of the present invention. To facilitate the display of its first heat exchange pipeline and second heat exchange pipeline, the heat conducting sheet is hidden; Figure 3 The first heat conducting sheet of a heat exchange device according to an embodiment of the present invention; Figure 4 The second heat conducting sheet of a heat exchange device according to an embodiment of the present invention; Figure 5 A cross-sectional view of a heat exchange device according to an embodiment of the present invention at another angle; Figure 6 A schematic diagram inside a heat exchange device according to an embodiment of the present invention; Figure 7 A schematic diagram of an electronic device according to an embodiment of the present invention; Figure 8 A layout schematic diagram inside an electronic device according to an embodiment of the present invention; Figure 9 A schematic diagram of the air flow direction inside an electronic device according to an embodiment of the present invention; Figure 10 A schematic diagram of an electronic device from a top view angle according to an embodiment of the present invention; Figure 11 A schematic diagram of an electronic device from a top view angle according to an embodiment of the present invention.

[0015] Explanation of reference numerals: 100, heat exchange device; 1, device main body; 101, housing; 102, first heat exchange pipeline; 103, second heat exchange pipeline; 104, heat conducting sheet; 1041, first heat conducting sheet; 10411, first heat conducting pattern; 10412, second heat conducting pattern; 1042, second heat conducting sheet; 10421, third heat conducting pattern; 105, primary side inlet; 106, primary side outlet; 107, secondary side inlet; 108, secondary side outlet; 109, partition board; 2, first flow channel; 3, second flow channel; 4, heat conducting structure; 5. Chassis; 501. Open box; 502. Cover; 503. Chassis inlet; 504. Chassis outlet; 6011. Storage module; 6012. Motherboard; 60121. First notch; 60122. Second notch; 6013. Processor; 602. Power supply module; 8. Air cooling device; 901. First air duct section; 902. Second air duct section; 903. Third air duct section; 904. Fourth air duct section; 905. Fifth air duct section; 10. Primary side pipeline; 1001. Liquid inlet pipeline; 1002. Liquid outlet pipeline; 11. Secondary side pipeline; 1101. Liquid outlet main pipe; 1102. Liquid outlet branch pipe; 1103. Return liquid branch pipe; 1104. Return liquid main pipe; 1105. Filter; 1106. Pump; 12. Cold source; 13. Control module. Detailed implementation manners

[0016] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the protection scope of the present application.

[0017] It should be noted that the orientation or positional relationship indicated by terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present application. The terms "mounted", "connected", "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. The terms "parallel", "perpendicular", "equal" include the described situations and situations similar to the described situations, and the range of the similar situations is within an acceptable deviation range, where the acceptable deviation range is determined by those of ordinary skill in the art considering the measurements being discussed and the errors associated with the measurements of specific quantities (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallel and approximate parallel, where the acceptable deviation range of approximate parallel can be, for example, within 5° deviation; "perpendicular" includes absolute perpendicular and approximate perpendicular, where the acceptable deviation range of approximate perpendicular can also be, for example, within 5° deviation. "Equal" includes absolute equality and approximate equality, where the acceptable deviation range of approximate equality can be, for example, that the difference between the two equal ones is less than or equal to 5% of either one. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0018] Next, in conjunction with Figures 1 to 11 , embodiments of the present invention will be described.

[0019] According to an embodiment of the present invention, on the one hand, a heat exchange device 100 is provided, which includes a device main body 1, a first flow channel 2, a second flow channel 3, and a heat conduction structure 4.

[0020] Among them, the first flow channel 2 is arranged on the device main body 1 and is used to connect the primary side pipeline 10. The second flow channel 3 is arranged on the device main body 1 and is used to connect the secondary side pipeline 11. The first flow channel 2 is in heat exchange connection with the second flow channel 3. The heat conduction structure 4 is in heat exchange connection with the first flow channel 2.

[0021] During the use of the heat exchange device 100 according to the embodiment of the present invention, it can be arranged in the chassis 5 of an electronic device, such as Figure 7As shown, the second flow channel 3 can connect the cold plate in the electronic device through the secondary pipeline 11. The first flow channel 2 can be connected to the cold source 12 through the primary pipeline 10. Furthermore, the coolant in the secondary pipeline 11 can carry the heat released by the second power-consuming component and exchange heat with the low-temperature coolant from the cold source 12 in the first flow channel 2 within the heat exchange device 100, thereby realizing liquid cooling and heat dissipation for the first power-consuming component. The first flow channel 2 can be connected to the cold source 12 to take away the heat released by the first power-consuming component and discharge it outside the system.

[0022] The heat conduction structure 4 is in heat exchange connection with the first flow channel 2, thereby being able to obtain cold quantity from the first flow channel 2. Furthermore, it can cooperate with the air-cooling module in the electronic device to provide a low-temperature cooling air flow to the second power-consuming component in the electronic device, so as to realize air-cooling and heat dissipation for the second power-consuming component. After the heat conduction structure 4 is heated itself, the heat on it can be taken away by the primary pipeline 10 through the first flow channel 2 connected to it and discharged outside the heat exchange device 100, thereby continuously cooling the heat conduction structure 4.

[0023] On this basis, since the heat conduction structure 4 can convert the air flow blown out by the air-cooling module into a low-temperature cooling air flow, it can avoid the influence of the exhaust air of the electronic device on the temperature of the computer room, avoid controlling the temperature of the computer room through air conditioners, and thus contribute to reducing the overall energy consumption of the data center.

[0024] Moreover, since the heat exchange device 100 of the invention embodiment can be arranged in the chassis 5 of the electronic device, and the first flow channel 2 and the second flow channel 3 are provided in the device main body 1, it can replace the cold liquid distribution unit to play a heat exchange role. As a result, there is no need to separately reserve space in the cabinet to set up the cold liquid distribution unit, which helps to save the space in the cabinet, and can make the secondary pipeline 11 be completely placed in the chassis 5 of the electronic device without extending outside the chassis 5 and connecting to the cold liquid distribution unit. Thus, the length of the secondary pipeline 11 is shortened, and further the amount of high-quality coolant in the secondary pipeline 11 is reduced, greatly saving the cost of the coolant.

[0025] Therefore, the heat exchange device 100 of the invention embodiment can solve the problems in the related technology that it is necessary to reserve space in the server cabinet to set up the cold liquid distribution unit, and the exhaust air of the electronic device will affect the temperature in the computer room, and it is necessary to control the temperature of the computer room environment through air conditioners, and it helps to reduce the overall energy consumption of the data center, save the space in the cabinet, is beneficial to the high-density design of the cabinet, and can reduce the cost of the coolant.

[0026] In the description of the present invention, it should be noted that the terms "first", "second", and "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. The meaning of "a plurality" refers to two or more, unless otherwise specifically defined.

[0027] In one embodiment, the heat exchange device 100 is disposed within the chassis 5 of the electronic device. By being arranged in this way, it helps to save space within the cabinet and enables the secondary side pipeline 11 to be completely placed within the chassis 5 of the electronic device, without the need to extend outside the chassis 5 and connect to the cold liquid distribution unit. As a result, the length of the secondary side pipeline 11 is shortened, thereby reducing the amount of high-quality coolant within the secondary side pipeline 11 and greatly saving the cost of the coolant.

[0028] In one embodiment, the coolant within the secondary side pipeline 11 flows through components such as cold plates and manifolds inside the electronic device, directly or indirectly contacting power-consuming components such as the processor 6013. Therefore, extremely high requirements are imposed on the insulation, purity, and compatibility of the coolant within the secondary side pipeline 11.

[0029] Therefore, high-quality coolants such as PG25 are usually used within the secondary side pipeline 11.

[0030] In one embodiment, the coolant within the secondary side pipeline 11 mainly includes a base liquid and an anti-freeze additive liquid. The base liquid is mainly ultrapure water to ensure an extremely low conductivity, usually less than or equal to 5 μS / cm, to avoid the risk of short circuits. The anti-freeze additive is preferably but not limited to ethylene glycol (EG) or propylene glycol (PG), etc., with a concentration of approximately 30% - 50% to enhance low-temperature anti-freezing performance.

[0031] The coolant within the primary side pipeline 10 is connected between the external cold source 12 and the heat exchange device 100 and does not directly contact the electronic device. Therefore, more emphasis is placed on environmental adaptability and cost. Thus, a lower-quality coolant can be used within the secondary side pipeline 11.

[0032] Exemplarily, in an alternative embodiment, the coolant within the secondary side pipeline 11 mainly includes a traditional mixture and industrial water. The traditional mixture includes water and ethylene glycol to balance anti-freezing and low cost. The industrial water is treated tap water and softened water, but a preservative needs to be added.

[0033] As an alternative implementation, in an embodiment not shown in one of the figures, the heat exchange device 100 is disposed outside the chassis 5 of the electronic device. At this time, the secondary side pipeline 11 passes through the chassis 5 and is connected to the heat exchange device 100, but this will increase the length of the secondary side pipeline 11 to a certain extent. In addition, when the heat exchange device 100 is disposed outside the chassis 5 of the electronic device, a through hole needs to be opened at the position corresponding to the chassis 5 and the heat exchange device 100 so that the air flow can flow through the heat conduction structure 4 of the heat exchange device 100 and be converted into a low-temperature cooling air flow to dissipate heat from the second power-consuming component, but this will cause a certain loss of the low-temperature cooling air flow to a certain extent.

[0034] In one embodiment, as Figure 1 and Figure 2As shown, the device body 1 includes a housing 101, a first heat exchange pipeline 102, a second heat exchange pipeline 103, and a heat conducting fin 104.

[0035] Among them, the first heat exchange pipeline 102 is arranged inside the housing 101, and a first flow channel 2 is arranged inside the first heat exchange pipeline 102. The second heat exchange pipeline 103 is arranged inside the housing 101, and a second flow channel 3 is arranged inside the second heat exchange pipeline 103. A plurality of heat conducting fins 104 are arranged at intervals along the extending direction of the first heat exchange pipeline 102 and the second heat exchange pipeline 103, and can fill the gaps between the first heat exchange pipeline 102, the second heat exchange pipeline 103, and the housing 101.

[0036] By setting it like this, the heat conducting fin 104 not only provides a stable physical support for the first heat exchange pipeline 102 and the second heat exchange pipeline 103, ensuring their precise spatial positioning inside the housing 101; more importantly, it efficiently integrates the first heat exchange pipeline 102 and the second heat exchange pipeline 103 into a compact and highly integrated heat transfer unit. This unit is tightly accommodated inside the housing 101, and its essence is an effective extension and significant expansion of the original heat transfer surface. This structural optimization ultimately realizes the improvement of double heat exchange efficiency: on the one hand, it significantly enhances the heat transfer efficiency between the first heat exchange loop and the heat conducting structure 4; on the other hand, it also optimizes the heat interaction efficiency between the first heat exchange pipeline 102 and the second heat exchange pipeline 103.

[0037] In one embodiment, the heat conducting fin 104 is sleeved outside the first heat exchange pipeline 102 and the second heat exchange pipeline 103. As an alternative embodiment, in an embodiment not shown in a drawing, the heat conducting fin 104 is integrally formed outside the first heat exchange pipeline 102 and the second heat exchange pipeline 103.

[0038] In one embodiment, the extending directions of the first heat exchange pipeline 102 and the second heat exchange pipeline 103 are parallel to each other, which can extend the heat exchange time of the coolant in the first flow channel 2 and the second flow channel 3.

[0039] In one embodiment, the heat exchange fin is a heat conducting metal fin, such as copper, aluminum, stainless steel, titanium, silver, nickel, etc.

[0040] As an alternative embodiment, the heat conducting fin 104 can also be made of non-metallic heat conducting materials such as graphite, carbon nanotubes, porous ceramic fibers, or aluminum nitride.

[0041] In one embodiment, as Figure 3 shown, the heat conducting fin 104 is provided with a first heat conducting pattern 10411. One end of the first heat conducting pattern 10411 is connected to or close to the first flow channel 2, and the other end extends towards the direction close to the heat conducting structure 4.

[0042] The first heat conduction pattern 10411 extends from the first flow channel 2 towards the direction close to the heat conduction structure 4, and can guide the heat on the heat conduction structure 4 to be conducted towards the first flow channel 2 efficiently and directionally, significantly reducing the thermal resistance, promoting heat conduction, and improving the heat transfer efficiency between the first flow channel 2 and the heat conduction structure 4.

[0043] In one embodiment, the first heat conduction sheet 1041 is a corrugated metal sheet, and the first heat conduction pattern 10411 is a pattern prominently formed on the heat conduction sheet 104. The raised pattern can penetrate the interfacial air layer, thereby increasing the effective contact area and reducing the thermal resistance.

[0044] As an alternative implementation, in an embodiment not shown in one of the drawings, the plane where the heat sink is located can also be selected to be set at an angle with the air flow direction.

[0045] In one embodiment, the first heat conduction pattern 10411 is preferably but not limited to being formed on the heat conduction sheet 104 by means such as laser etching, electroplating, or chemical vapor deposition.

[0046] In one embodiment, a first heat exchange surface is provided between the housing 101 and the heat conduction structure 4. There are multiple pairs of the first heat conduction patterns 10411, and the multiple pairs of the first heat conduction patterns 10411 are arranged at intervals along the distance direction between the first heat exchange surface and the first flow channel 2. Along the direction close to the first flow channel 2, each pair of the first heat conduction patterns 10411 extends towards the direction of approaching each other.

[0047] Through the above structural design, each pair of adjacent first heat conduction patterns 10411 encloses a triangular region. This specific triangular arrangement significantly enhances the heat convergence effect on the first heat exchange surface. Its core function is to efficiently direct and concentrate the heat that was originally distributed over a large area and dispersedly on this heat exchange surface to the adjacent area of the first flow channel 2. This concentrated heat transfer greatly promotes the full and efficient heat exchange process between the flowing medium (such as coolant) in the first flow channel 2 and the entire heat conduction structure 4.

[0048] As an alternative implementation, in an embodiment not shown in one of the drawings, the first heat conduction pattern 10411 can also be selected to be radially distributed with the first flow channel 2 as the center.

[0049] In one embodiment, as Figure 2 shown, a partition plate 109 is provided in the housing 101. The partition plate 109 divides the housing 101 into a first chamber and a second chamber. The heat conduction sheet 104 includes a first heat conduction sheet 1041 and a second heat conduction sheet 1042. The first flow channel 2 and the first heat conduction sheet 1041 are arranged in the first chamber, and the second flow channel 3 and the second heat conduction sheet 1042 are arranged in the second chamber.

[0050] Through the above structural configuration, the partition plate 109 precisely divides the first chamber and the second chamber that are independent of each other inside the housing 101. This physical isolation design can effectively block the heat transfer from the second flow channel 3 area to the area where the heat conduction structure 4 is located, thereby avoiding the adverse impact on its temperature and ensuring that the heat conduction structure 4 maintains an ideal thermal state under the design conditions.

[0051] On the basis of this thermal isolation guarantee, the heat conduction fin 104 can fully exert its heat conduction enhancement function. It not only significantly improves the heat transfer ability of the heat conduction structure 4 itself, but more importantly, as an efficient heat transfer bridge, it optimizes the heat transfer between the heat conduction structure 4 and the first flow channel 2, as well as the heat interaction between the first flow channel 2 and the second flow channel 3.

[0052] In addition, the partition plate 109 can also ensure that a leakage on one side can only affect the chamber of this side, thereby reducing the maintenance cost and enabling different chambers to withstand different pressures, avoiding overpressure bursting of the pipe.

[0053] In one embodiment, the second heat conduction pattern 10412 is provided on the first heat conduction fin 1041, and the second heat conduction pattern 10412 extends from the partition plate 109 towards the direction close to the first flow channel 2.

[0054] As Figure 4 shown, the second heat conduction fin 1042 is a corrugated metal sheet, and the third heat conduction pattern 10421 is provided on the second heat conduction fin 1042. One end of the third heat conduction pattern 10421 is connected to or close to the second heat exchange pipeline, and the other end extends towards the direction close to the partition plate 109.

[0055] Through the above structural design, the second heat conduction pattern 10412 and the third heat conduction pattern 10421 cooperate to construct an efficient heat directional conduction path. Its core function is to accurately capture and guide the heat carried by the coolant in the second flow channel 3, and transfer it to the first flow channel 2 area with low loss and high efficiency.

[0056] This cross-flow channel heat transfer realized by the heat conduction pattern directly strengthens the ability of the first flow channel 2 as the core heat dissipation channel. The coolant flowing through the first flow channel 2 can continuously absorb and take away the heat introduced from the second flow channel 3.

[0057] The circulating coolant in the secondary pipeline 11 is continuously and efficiently cooled and cooled down through this path, so as to ensure that it has sufficient heat carrying capacity and provide continuous and sufficient heat dissipation guarantee for the high-heat generating components inside the electronic device, especially the first power-consuming component.

[0058] In one embodiment, the second heat conduction pattern 10412 is a pattern prominently formed on the heat conduction fin 104, and the raised pattern can penetrate the interface air layer, thereby increasing the effective contact area and reducing the thermal resistance.

[0059] In one embodiment, the second heat conduction lines 10412 are preferably but not limited to being formed on the heat conduction sheet 104 by means such as laser etching, electroplating, or chemical vapor deposition.

[0060] In one embodiment, there are multiple pairs of the second heat conduction lines 10412. The multiple pairs of the second heat conduction lines 10412 are arranged at intervals along the direction of the distance between the partition plate 109 and the first flow channel 2. Along the direction approaching the first flow channel 2, each pair of the second heat conduction lines 10412 extends in a direction approaching each other.

[0061] Through the above structural design, each pair of adjacent second heat conduction lines 10412 encloses a triangular region. This specific triangular arrangement significantly enhances the heat convergence effect on the partition plate 109. Its core function is to efficiently direct and concentrate the heat originally distributed over a large area and dispersedly on the partition plate 109 to the adjacent region of the first flow channel 2. This concentrated heat transfer greatly promotes the full and efficient heat exchange process between the flowing medium (such as coolant) in the first flow channel 2 and the entire second channel.

[0062] As an alternative embodiment, in an embodiment not shown in a drawing, each heat conduction sheet 104 can be penetrated by the first heat exchange pipeline 102 and the second heat exchange pipeline 103, and is provided with first heat conduction lines 10411, second heat conduction lines 10412, and third heat conduction lines 10421.

[0063] In one embodiment, the second flow channel 3 and the heat conduction structure 4 are respectively arranged on opposite sides of the first flow channel 2. Multiple pairs of first heat conduction lines 10411 and multiple pairs of second heat conduction lines 10412 can form triangular regions. The cold in the first flow channel 2 can be transported towards the heat conduction structure 4 and the second flow channel 3 respectively through the triangular heat conduction lines, so that the heat conduction between the first flow channel 2 and the heat conduction structure 4 and the second flow channel 3 is smoother.

[0064] As an alternative embodiment, in an embodiment not shown in a drawing, the second heat conduction lines 10412 can also be selected to be radially distributed with the first flow channel 2 as the center.

[0065] In one embodiment, there are multiple pairs of the third heat conduction lines 10421. The multiple pairs of the third heat conduction lines 10421 are arranged at intervals along the direction of the distance between the second heat exchange pipeline 103 and the partition plate 109. Along the direction approaching the partition plate 109, each pair of the third heat conduction lines 10421 extends in a direction approaching each other.

[0066] Through the above geometric configuration design, each pair of adjacent third heat conduction lines 10421 encloses a set of triangular regions. This unique triangular structure acts as an efficient heat collector at the thermodynamics level: its core function is to actively capture the heat dissipated by the coolant flowing in the second flow channel 3 to the surrounding environment or adjacent structures, and direct and conduct the originally potentially lost thermal energy to key positions in the first flow channel 2.

[0067] This "heat collection - concentrated transfer" mechanism realized by the heat conduction lines significantly enhances the thermal coupling effect between the first flow channel 2 and the second flow channel 3. The direct result is to establish an efficient and controllable heat transfer channel between the two, greatly promoting the full and efficient heat exchange process between the cooling medium (usually with a lower temperature or a larger heat capacity) in the first flow channel 2 and the cooling medium in the second flow channel 3.

[0068] As an alternative implementation, in an embodiment not shown in one of the figures, the third heat conduction lines 10421 can also be selected to be radially distributed centered on the middle of the partition plate 109.

[0069] In one embodiment, the second flow channel 3 and the heat conduction structure 4 are respectively arranged on both sides of the first flow channel 2.

[0070] Through the above structural configuration, the heat exchange device 100 of the embodiment of the present invention achieves the dual objectives of key thermal interference isolation and thermal conduction optimization: First of all, this design physically blocks the heat transfer path from the second flow channel 3 region to the heat conduction structure 4 region. This active thermal isolation strategy effectively avoids the adverse disturbance of the heat in the second flow channel 3 on the temperature field of the heat conduction structure 4, ensuring that the heat conduction structure 4 can stably maintain its designed operating temperature and provide effective heat dissipation for the second power-consuming component.

[0071] On this basis, this structural design significantly improves the thermal connection performance between the first flow channel 2, the heat conduction structure 4 and the second flow channel 3.

[0072] In one embodiment, from top to bottom, the heat conduction structure 4, the first flow channel 2 and the second flow channel 3 are arranged in sequence. By setting like this, the core function of the heat conduction structure 4 at the top layer is to form a close cooperation with the original air-cooling module inside the electronic device. Through efficient heat conduction and convective heat dissipation, this layer is specifically responsible for solving the heat dissipation requirements of the second power-consuming components (such as the power supply module 602, etc.) in the device.

[0073] The second flow channel 3 at the bottom, together with the cold plate at the first power-consuming component and the secondary side pipeline 11, constitutes a closed secondary side cooling loop. This loop is in direct contact with the first power-consuming component and is responsible for removing the heat generated by the first power-consuming component through the coolant circulation.

[0074] The middle first flow channel 2 can play the role of heat convergence and dissipation. First of all, the first flow channel 2 can continuously absorb the heat carried by the bottom secondary side system through the efficient heat conduction of the first heat conduction fin 1041 and the second heat conduction fin 1042.

[0075] And as the core circulation channel of the primary side cooling medium, the first flow channel 2 finally transfers the converged heat to the external heat dissipation terminal (such as a cooling tower or a computer room-level cooling system) to achieve the final dissipation of heat.

[0076] The core advantages of this hierarchical structure are as follows: Function decoupling is achieved: the heat dissipation domains of air cooling and liquid cooling are clearly separated to avoid mutual interference.

[0077] Secondly, heat flow optimization is achieved, and an efficient and one-way heat transfer path from the first power-consuming component, the secondary side coolant, the first heat conduction fin 1041, the second heat conduction fin 1042, the first flow channel 2, and finally to the external environment is constructed.

[0078] Finally, this hierarchical structure also helps to improve the integration degree within the electronic device, makes full use of the vertical space, and realizes the coordination of air cooling and liquid cooling in a compact structure.

[0079] In one embodiment, the heat conduction structure 4 includes heat dissipation fins connected to the device main body 1.

[0080] The heat dissipation fins can increase the heat exchange area between the air flow blown out by the air cooling module and the heat conduction structure 4, which helps to improve the heat dissipation effect of the heat exchange device 100 on the second power-consuming component.

[0081] In one embodiment, when the heat exchange device 100 is arranged in the chassis 5, the first flow channel 2 and the second flow channel 3 can be selected to extend along the width direction of the chassis 5. The heat dissipation fins include a plurality of heat dissipation sheets arranged at intervals along the extension direction of the first flow channel 2 and the second flow channel 3. By setting like this, when the air cooling module in the chassis 5 drives the cooling air flow, the air flow can flow smoothly along the extension direction of the flow channel and the heat dissipation sheets. The parallel gap channels formed between the heat dissipation sheets force the air flow to fully sweep and penetrate the surface of each heat dissipation sheet, greatly increasing the heat exchange contact area and time between the air flow and the heat dissipation sheets.

[0082] The arrangement of the heat dissipation sheets with intervals parallel to the main air flow direction significantly reduces the resistance generated by air flow turning and eddy currents, and thus effectively reduces the overall air resistance when the air flow passes through the heat dissipation fin area. The reduced air resistance allows the air cooling module to provide a larger effective air volume at the same power consumption, or maintain the same heat dissipation capacity at a lower rotational speed. This not only optimizes the heat exchange efficiency between the cooling medium and air in the flow channel, but also reduces the system cooling power consumption, which helps to improve the overall energy efficiency of the machine.

[0083] As a transformable embodiment, in an embodiment not shown in the drawings, the heat conduction structure 4 may alternatively be a baffle or a heat pipe array provided on the device body 1, etc.

[0084] According to an embodiment of the present invention, on the other hand, an electronic device is further provided, including a chassis 5, a cold plate, a heat exchange device 100 and an air cooling module.

[0085] Wherein, as Figure 7 and Figure 8 shown, a first power consumption component and a second power consumption component can be arranged in the chassis 5, and the power consumption of the first power consumption component is greater than that of the second power consumption component. The cold plate is arranged in the chassis 5 and is used for heat exchange connection with the first power consumption component. The heat exchange device 100 is the heat exchange device 100 provided in the first aspect of the present invention. The heat exchange device 100 is arranged in the chassis 5, and the second flow channel 3 of the heat exchange device 100 is connected to the cold plate through a secondary side pipeline 11. The air cooling module is arranged in the chassis 5 and can blow air to the heat conduction structure 4 of the heat exchange device 100.

[0086] The electronic device of the second aspect of the present invention includes or uses the heat exchange device 100 of the first aspect of the present invention, so it has its beneficial effects. During the use of the electronic device of the second aspect of the present invention, the second flow channel 3 can connect the cold plate in the electronic device through the secondary side pipeline 11, and the first flow channel 2 can be connected to the cold source 12 through the primary side pipeline 10. Furthermore, the coolant in the secondary side pipeline 11 can carry the heat released by the second power consumption component and exchange heat with the low-temperature coolant from the cold source 12 in the first flow channel 2 in the heat exchange device 100, so as to realize liquid cooling and heat dissipation of the first power consumption component. The first flow channel 2 can be connected to the cold source 12 and take away the heat released by the first power consumption component and discharge it outside the system.

[0087] The heat conduction structure 4 is in heat exchange connection with the first flow channel 2, so that it can obtain cold quantity from the first flow channel 2, and then cooperate with the air cooling module in the electronic device to provide a low-temperature cooling air flow to the second power consumption component in the electronic device, so as to realize air cooling and heat dissipation of the second power consumption component. After the heat conduction structure 4 is heated itself, the heat on it can be taken away by the primary side pipeline 10 through the first flow channel 2 connected to it and discharged outside the heat exchange device 100, so that the heat conduction structure 4 is continuously cooled.

[0088] On this basis, since the heat conduction structure 4 can convert the air flow blown out by the air cooling module into a low-temperature cooling air flow, it can avoid the influence of the exhaust air of the electronic device on the temperature of the computer room, avoid controlling the temperature of the computer room through air conditioners, and thus help to reduce the overall energy consumption of the data center.

[0089] Moreover, since the heat exchange device 100 of the electronic device in the invention embodiment is integrated in the chassis 5, and the first flow channel 2 and the second flow channel 3 are provided in the device main body 1, it can replace the cold liquid distribution unit to play a heat exchange role. As a result, there is no need to separately reserve space in the cabinet to set up the cold liquid distribution unit, which helps to save the space in the cabinet, and can make the secondary side pipeline 11 be completely placed in the chassis 5 of the electronic device without extending outside the chassis 5 and connecting to the cold liquid distribution unit. Thus, the length of the secondary side pipeline 11 is shortened, and further, the amount of high-quality coolant in the secondary side pipeline 11 is reduced, greatly saving the cost of the coolant.

[0090] Therefore, the heat exchange device 100 of the invention embodiment can solve the problems in the related art that it is necessary to reserve space in the server cabinet to set up the cold liquid distribution unit, and the exhaust air of the server will affect the temperature in the computer room, and it is necessary to control the temperature of the computer room environment through air conditioners, and helps to reduce the overall energy consumption of the data center, save the space in the cabinet, is beneficial to the high-density design of the cabinet, and can reduce the cost of the coolant.

[0091] Among them, the first power-consuming components preferably but not limited to include a central processing unit 6013, a graphics processing unit 6013, a storage module 6011, etc. The first power-consuming components generate heat under load, and the heat is conducted to the cold plate through direct contact.

[0092] In one embodiment, the cold source 12 is preferably but not limited to an external cooling tower. The air-cooling module is preferably but not limited to an axial flow fan or a centrifugal fan, etc.

[0093] In one embodiment, the storage module 6011 is an HDD module. The HDD module generally refers to a standardized storage unit composed of multiple mechanical hard disks, which integrates power supply, data interface and heat dissipation system through a hardware backplane, and is typically applied to servers, NAS or distributed storage devices.

[0094] The second power-consuming components preferably but not limited to include a voltage regulation module, a bus network card, a power supply module 602, etc.

[0095] In one embodiment, the electronic device is a computing node.

[0096] As a transformable implementation manner, the electronic device can also be optionally a switching node, a storage node, a cabinet server, etc.

[0097] In one embodiment, the chassis 5 includes an open box body 501, a cover body 502 and a first sealing ring.

[0098] The open box body 501 is an integral structure. The cover body 502 is covered on the opening of the open box body 501. The first sealing ring is clamped between the open box body 501 and the cover body 502.

[0099] Through the above structural configuration, the open box body 501, the cover body 502 and the first sealing ring together form the fully enclosed chassis 5. This sealing structure enables the air-cooling module to be efficiently coupled with the heat conduction structure 4 of the heat exchange device 100, forming a closed-loop low-temperature cooling air flow circulation system inside the chassis 5.

[0100] By setting it like this, the closed-loop air flow precisely flows through the second power-consuming components (such as the power supply module 602, memory, etc.), realizing efficient air-cooling heat dissipation, and completely blocking the heat inside the electronic device from diffusing to the computer room environment, eliminating the local hot spots in the computer room caused by the exhaust air of the traditional system.

[0101] Moreover, since the computer room does not need to compensate for the heat exhausted by the equipment, the electronic device in the embodiment of the present invention allows the traditional computer room air-conditioning system to be completely cancelled, directly reducing the cooling-related power consumption by 30 - 50%.

[0102] On this basis, eliminating the air-conditioning equipment and the huge air ducts simplifies the number of equipment in the computer room, effectively improving the space utilization rate of the data center.

[0103] In one embodiment, the first power-consuming components include a storage module 6011 and a main board 6012.

[0104] Among them, the storage module 6011 is arranged inside the chassis 5. The main board 6012 is arranged inside the chassis 5. The storage module 6011, the air-cooling module, the heat exchange device 100 and the main board 6012 are arranged in sequence along the air outlet direction of the air-cooling module.

[0105] In one embodiment, as Figure 9 shown, the electronic device is provided with a first support structure and a second support structure. The first support structure is supported between the storage module 6011 and the bottom wall of the chassis 5. The second support structure is supported between the main board 6012 and the bottom wall of the chassis 5. The electronic device is provided with a circulation air duct, and the circulation air duct includes a first air duct section 901, a second air duct section 902, a third air duct section 903, a fourth air duct section 904 and a fifth air duct section 905.

[0106] Among them, the first air duct section 901 is arranged between the top wall of the chassis 5 and the main board 6012. The second air duct section 902 is arranged between the main board 6012 and the rear window of the chassis 5 and is connected to the first air duct section 901. The third air duct section 903 is arranged between the bottom wall of the chassis 5 and the main board 6012 and the storage module 6011 and is connected to the second air duct section 902. The fourth air duct section 904 is arranged between the storage module 6011 and the front window of the chassis 5 and is connected to the third air duct section 903. The fifth air duct section 905 is arranged between the storage module 6011 and the top wall of the chassis 5 and is connected to the first air duct section 901.

[0107] Through the above support structure design, the first support structure and the second support structure respectively provide a stable mechanical bearing for the storage module 6011 and the main board 6012, and at the same time form a key height gap between their bottoms and the bottom wall of the chassis 5, thereby forming an efficient circulating air duct inside the chassis 5.

[0108] During the operation of the electronic device, the air cooling module can drive the air flow to flow through the heat conduction structure 4 of the heat exchange device 100, and reduce the air flow temperature to the target low temperature through forced convection heat exchange.

[0109] The low-temperature cooling air flow circulates and dissipates heat from the power-consuming components inside the chassis 5 according to a preset path. The low-temperature cooling air flow can cool the processor 6013 and the power supply module 602 when flowing through the first air duct section 901 and the second air duct section 902, and cool the storage module 6011 when flowing through the third air duct section 903 to the fifth air duct section 905. The heated air flow flows through the heat conduction structure 4 again, and transfers the heat to the primary-side cooling medium through the first flow channel 2, and the air flow temperature is reduced to the initial low temperature again.

[0110] The cooled air flow returns to the first air duct section 901 to start a new round of circulation.

[0111] In one embodiment, the width of the key height gap formed between the bottoms of the main board 6012 and the storage module 6011 and the bottom wall of the chassis 5 can be selected to be 5-15 mm.

[0112] Among them, the first support structure and the second support structure are preferably but not limited to support columns or support protrusions, etc.

[0113] As a variable implementation manner, the bottom wall of the chassis 5 is also selected to be formed with reinforcing ribs protruding upward, and the reinforcing ribs extend along the length direction of the chassis 5, so that the low-temperature cooling air flow can be guided while supporting the storage module 6011 and the main board 6012.

[0114] In one embodiment, as Figure 11 shown, the device body 1 is provided with a primary-side inlet 105 and a primary-side outlet 106, the first flow channel 2 connects the primary-side inlet 105 and the primary-side outlet 106, the chassis 5 is provided with a chassis inlet 503 and a chassis outlet 504, and the primary-side pipeline 10 includes a liquid inlet pipeline 1001, a second sealing ring, a liquid outlet pipeline 1002 and a third sealing ring.

[0115] The liquid inlet pipeline 1001 passes through the chassis inlet 503 and is used to connect the cold source 12 and the primary-side inlet 105.

[0116] The second sealing ring is clamped between the chassis inlet 503 and the liquid inlet pipeline 1001. The liquid outlet pipeline 1002 passes through the chassis outlet 504 and is used to connect the cold source 12 and the primary side outlet 106. The third sealing ring is clamped between the chassis outlet 504 and the liquid outlet pipeline 1002.

[0117] Through the above pipeline connection scheme, the low-temperature coolant of the external cold source 12 is injected into the first flow channel 2 of the heat exchange device 100 via the liquid inlet pipeline 1001, and the high-temperature coolant that has completed heat exchange returns to the cold source 12 through the liquid outlet pipeline 1002 for regeneration. This circulation system ensures the sealing performance of the chassis 5 through a double dynamic sealing design.

[0118] The second sealing ring can precisely fill the assembly gap between the liquid inlet pipeline 1001 and the chassis inlet 503.

[0119] The third sealing ring can precisely fill the assembly gap between the liquid outlet pipeline 1002 and the chassis outlet 504.

[0120] In one embodiment, the first sealing ring, the second sealing ring, and the third sealing ring are made of fluororubber material, which can ensure elastic sealing under thermal shock.

[0121] In one embodiment, as Figure 8 shown, the first notch 60121 and the second notch 60122 are respectively provided on opposite sides of the main board 6012. The second power consumption component includes a power supply module 602. The power supply module 602 is arranged inside the chassis 5. The power supply modules 602 are arranged in pairs and are respectively arranged in the first notch 60121 and the second notch 60122. The chassis inlet 503 and the chassis outlet 504 are arranged between a power supply module 602 and the main board 6012.

[0122] By setting it like this, the physical distance between the power supply module 602 and the central processing unit 6013 is significantly shortened, which helps to shorten the wiring from the power supply module 602 to the central processing unit 6013. At the same time, the power supply unit adopts a mirror-symmetrical distribution design. This solution simultaneously improves the circuit performance and electromagnetic compatibility.

[0123] In one embodiment, the inner walls of the first notch 60121 and the second notch 60122 are nickel-plated, which can play an anti-oxidation role. The gaps between the power supply module 602, the first notch 60121, and the second notch 60122 are filled with thermal conductive silicone grease.

[0124] As a transformable implementation manner, in an embodiment not shown in one drawing, the chassis inlet 503 and the chassis outlet 504 are respectively arranged in the first notch 60121 and the second notch 60122 and are located between the main board 6012 and the power supply module 602.

[0125] In one embodiment, the power supply module 602 is disposed at the rear end of the chassis 5, and the chassis inlet 503 and the chassis outlet 504 are disposed on the rear window of the chassis 5.

[0126] In one embodiment, there are multiple cold plates. As Figure 10 shown, on the device body 1 of the heat exchange device 100, there are a secondary side inlet 107 and a secondary side outlet 108. The second flow channel 3 connects the secondary side inlet 107 and the secondary side outlet 108. The secondary side pipeline 11 includes a liquid outlet main pipe 1101, a liquid distributor, liquid outlet branch pipes 1102, liquid return branch pipes 1103, a liquid collector, and a liquid return main pipe 1104.

[0127] Among them, the liquid outlet main pipe 1101 is connected to the secondary side outlet 108. The input end of the liquid distributor is connected to the liquid outlet main pipe 1101. The liquid outlet branch pipes 1102 are connected between the output end of the liquid distributor and the input end of the cold plate. The liquid return branch pipes 1103 are connected to the output end of the cold plate. The input end of the liquid collector is connected to the liquid return branch pipes 1103. The liquid return main pipe 1104 is connected between the output end of the liquid collector and the secondary side inlet 107.

[0128] By setting like this, a cold plate is arranged above the first power consumption component. The cold plate is in direct contact with the first power consumption component. When the electronic device is running, the first power consumption component generates heat under load. The heat is transferred to the cold plate through direct contact. The cold plate obtains the coolant through the liquid outlet branch pipes 1102. After the coolant exchanges heat with the first power consumption component in the cold plate, it sequentially returns to the second flow path of the heat exchange device 100 through the liquid return branch pipes 1103, the liquid collector, and the liquid return main pipe 1104. The coolant exchanges heat with the first flow path in the heat exchange device 100 and is then converted into low-temperature coolant, and then returns to the input end of the cold plate through the liquid outlet main pipe 1101, the liquid distributor, and the liquid outlet branch pipes 1102.

[0129] In one embodiment, a high thermal conductivity cold plate is integrated above the first power consumption component, and its bottom surface is microscopically and closely contacted with the component surface through nano-level flatness treatment (roughness Ra ≤ 0.1 μm).

[0130] In one embodiment, the primary side inlet 105 and the secondary side inlet 107 are disposed on the same side of the device body 1, and the secondary side inlet 107 and the secondary side outlet 108 are disposed on the other side of the device body 1.

[0131] As a changeable implementation manner, in an embodiment not shown in one drawing, the primary side inlet 105 and the secondary side outlet 108 are disposed on the same side of the device body 1, and the secondary side inlet 107 and the primary side outlet 106 are disposed on the same side of the device body 1.

[0132] In one embodiment, the secondary side pipeline 11 further includes a filter 1105 and a pump 1106.

[0133] The filter 1105 is installed on the pipeline between the output end of the liquid collector and the inlet 107 of the secondary side. Its main function is to filter the coolant that is about to flow into the liquid collector. This design can effectively intercept impurities in the coolant, thus avoiding the risk of blockage in the downstream secondary pipeline 11.

[0134] The pump 1106 located downstream of the system has its input end connected to the secondary side outlet 108 and its output end connected to the liquid distributor. As the power source of the system cycle, the pump 1106 is responsible for driving the continuous flow of the coolant in the secondary pipeline 11 to ensure the stable operation of the cooling cycle.

[0135] In one embodiment, the electronic device further includes a temperature detection module, a pressure detection module, a flow sensor, and a control module 13.

[0136] Among them, temperature detection modules are respectively provided on the first power-consuming component and the second power-consuming component. The pressure detection module is connected to the main liquid outlet pipe 1101 or the main liquid return pipe 1104. The flow sensor is connected to the main liquid outlet pipe 1101 or the main liquid return pipe 1104. The control module 13 is communicatively connected to the temperature detection module, the pressure detection module, the flow sensor, the pump 1106, and the air-cooled module, and can control the power of the pump 1106 and the air-cooled module according to the detection results of the temperature detection module, the pressure detection module, and the flow sensor.

[0137] By setting like this, the control module 13 can achieve dynamic energy efficiency optimization and safety protection based on the detection data of the temperature detection module, the pressure detection module, and the flow sensor.

[0138] Exemplarily, in an optional embodiment, when the temperature of the first power-consuming component exceeds the set threshold, the control module 13 immediately increases the power of the pump 1106 to increase the coolant flow rate; when the temperature drops back to the safe zone, the power of the pump 1106 automatically decreases to achieve energy consumption savings.

[0139] When the temperature of the second power-consuming component exceeds the standard, the control module 13 increases the fan speed of the air-cooled module to enhance the heat dissipation effect on the second power-consuming component; after the temperature returns to below the preset temperature, the speed is adjusted back to the silent mode to reduce the system operation noise.

[0140] On this basis, the coolant in the secondary pipeline 11 is usually mainly water, and phase change boiling will occur under low-pressure and high-temperature working conditions, generating steam bubbles to block the microchannels.

[0141] The control module 13 can maintain the absolute pressure of the pipeline within the safe range in real time and ensure that the maximum junction temperature of the integrated circuit is less than 85°C to prevent vaporization.

[0142] When the temperature of the cold plate approaches the boiling point, the control module 13 triggers the pump 1106 to enter the boosting mode, thereby rapidly increasing the output pressure.

[0143] When the pressure detection module detects that the liquid in the secondary side pipeline 11 is over-pressured, the control module 13 links the electromagnetic pressure relief valve to quickly open for protection.

[0144] In one embodiment, the control module 13 can analyze the data through artificial intelligence to achieve dynamic adjustment.

[0145] Specifically, in an optional embodiment, the core mechanism of the control module 13 is to integrate the physical model with the real-time data, combining the basic physical equations describing the fluid dynamics and thermodynamic behavior (such as the Navier-Stokes equations) with the real-time operation data collected by sensors to build a high-fidelity system digital twin in the virtual space.

[0146] Based on this digital twin environment, the control module 13 uses its integrated machine learning model to make real-time predictions on the temperature field distribution of the integrated circuit and its future change trends. Based on the above prediction results, the module can automatically and dynamically adjust key execution components (such as valve opening and pump 1106 speed) to optimize the cooling effect in real time and ensure that the integrated circuit works in a safe and efficient temperature range. At the same time, the AI-driven system can continuously analyze the deviation between the operating data and the prediction model, effectively identify potential abnormal conditions such as micro-leakage or pipeline blockage, and provide support for early warning and preventive maintenance.

[0147] In one embodiment, sudden load response, natural cooling switching and anti-condensation protection can also be achieved through artificial intelligence.

[0148] Specifically, when a surge in the computing power of the processor 6013 is detected, the control module 13 can control the pump 1106 to increase the flow of the cold plate within 200ms. When the outdoor temperature is less than 15°C, the control module 13 can reduce the speed of the pump 1106. When the coolant temperature is close to the dew point, the control module 13 can control the automatic heating valve to operate.

[0149] The control module 13 may include a programmable logic control component (such as a PLC or a CPU), a memory, and electronic components connected to the programmable logic control component, etc., which are well known to those skilled in the art and will not be described in detail here.

[0150] According to an embodiment of the present invention, in a third aspect, a server cabinet is provided, comprising a cabinet body and electronic equipment, wherein the electronic equipment is the electronic equipment provided in the second aspect of the present invention, and is arranged in the cabinet body.

[0151] The server cabinet of the third aspect of the present invention includes or uses the electronic device of the second aspect of the present invention, and thus has its beneficial effects, that is, it can solve the problems in the related art that it is necessary to reserve space in the server cabinet to set up a cold liquid distribution unit, and the exhaust air of the electronic device will affect the temperature in the computer room, and it is necessary to control the temperature of the computer room environment through air conditioners, and it helps to reduce the overall energy consumption of the data center, save the space in the cabinet, is conducive to the high-density design of the cabinet, and can reduce the cost of the coolant.

[0152] In one embodiment, the server cabinet is preferably but not limited to a standard server cabinet, a network equipment cabinet, a storage server cabinet, etc.

[0153] In one embodiment, the cabinet can be an artificial intelligence cabinet. An artificial intelligence cabinet is a special cabinet for artificial intelligence computing, which is usually configured with multiple high-performance central processing units or graphics processing units to support the development and training of large-scale deep learning models. In order to improve the computing power density, it is required that more nodes can be concentrated in the same cabinet to achieve efficient utilization of resources.

[0154] In summary, the heat exchange device 100 of the first aspect, the electronic device of the second aspect, and the server cabinet of the third aspect of the present invention have the following beneficial effects: The heat exchange device 100 of the embodiment of the present invention is built inside the electronic device, concentrating the air-liquid interaction and liquid-liquid interaction in one heat exchange device 100, replacing the cold liquid exchange unit inside the cabinet in the traditional computer room, realizing efficient heat dissipation of the electronic device, and greatly improving the utilization rate of the cabinet space.

[0155] On this basis, the upper heat conduction structure 4 of the heat exchange device 100 uses the air-cooling module to assist in heat dissipation, and forms a circulating air duct design in the chassis 5, realizing heat interaction between the heat of the second power-consuming components inside the electronic device and the first flow channel 2 in the middle layer of the heat exchange device 100, and finally directly discharging it to the outside of the computer room through the primary side cooling system pipeline, realizing zero heat emission inside the computer room, further weakening the role of the air conditioner in the data center, and greatly reducing the PUE.

[0156] Also, because the heat exchange device 100 of the embodiment of the present invention is built inside the electronic device, the second flow channel 3 at the bottom layer can form a secondary side cooling system with the cold plate of the first power-consuming component inside the electronic device, the circulation pump 1106, the high-quality coolant deionized water of the secondary side pipeline, the pipeline, the filtration system, etc. The secondary side cooling system is integrated inside the electronic device, and the circulation loop is greatly shortened, further saving the amount of high-quality coolant deionized water and reducing the cost of the data center.

[0157] Although embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations fall within the scope of the present invention as claimed.

Claims

1. A heat exchange device, characterized in that, Comprising: Device main body (1); First flow channel (2), provided on the device main body (1) for connecting the primary side pipeline (10); Second flow channel (3), provided on the device main body (1) for connecting the secondary side pipeline (11), and the first flow channel (2) is heat exchange connected to the second flow channel (3); Heat conduction structure (4), heat exchange connected to the first flow channel (2).

2. The heat exchange device according to claim 1, characterized in that, The device main body (1) includes: Shell (101); First heat exchange pipeline (102), passing through the shell (101), and the first flow channel (2) is provided in the first heat exchange pipeline (102); Second heat exchange pipeline (103), passing through the shell (101), and the second flow channel (3) is provided in the second heat exchange pipeline (103); Multiple heat conduction fins (104), arranged at intervals along the extending direction of the first heat exchange pipeline (102) and the second heat exchange pipeline (103), and capable of filling the gap between the first heat exchange pipeline (102), the second heat exchange pipeline (103) and the shell (101).

3. The heat exchange device according to claim 2, characterized in that, The heat conduction fin (104) is provided with a first heat conduction pattern (10411), one end of the first heat conduction pattern (10411) is connected to or close to the first flow channel (2), and the other end extends towards the direction close to the heat conduction structure (4).

4. The heat exchange device according to claim 3, wherein A first heat exchange surface is provided between the shell (101) and the heat conduction structure (4), there are multiple pairs of the first heat conduction patterns (10411), and multiple pairs of the first heat conduction patterns (10411) are arranged at intervals along the distance direction between the first heat exchange surface and the first flow channel (2), and along the direction close to the first flow channel (2), each pair of the first heat conduction patterns (10411) extends towards the direction of approaching each other.

5. The heat exchange device according to claim 2, wherein, A partition plate (109) is provided in the shell (101), the partition plate (109) divides a first chamber and a second chamber in the shell (101), the heat conduction fin (104) includes a first heat conduction fin (1041) and a second heat conduction fin (1042), the first flow channel (2) and the first heat conduction fin (1041) are provided in the first chamber, and the second flow channel (3) and the second heat conduction fin (1042) are provided in the second chamber.

6. The heat exchange device according to claim 5, characterized in that The first heat conduction fin (1041) is provided with a second heat conduction pattern (10412), and the second heat conduction pattern (10412) extends from the partition plate (109) towards the direction close to the first flow channel (2); The second heat conduction fin (1042) is provided with a third heat conduction pattern (10421), one end of the third heat conduction pattern (10421) is connected to or close to the second heat exchange pipeline, and the other end extends towards the direction close to the partition plate (109).

7. The heat exchange device according to claim 6, characterized in that, There are multiple pairs of the second heat conduction patterns (10412), and multiple pairs of the second heat conduction patterns (10412) are arranged at intervals along the distance direction between the partition plate (109) and the first flow channel (2), and along the direction close to the first flow channel (2), each pair of the second heat conduction patterns (10412) extends towards the direction of approaching each other.

8. The heat exchange device according to claim 6, characterized in that, The third heat conduction lines (10421) are multiple pairs, and the multiple pairs of the third heat conduction lines (10421) are arranged at intervals along the direction of the distance between the second heat exchange pipeline (103) and the partition plate (109). Along the direction approaching the partition plate (109), each pair of the third heat conduction lines (10421) extends in the direction of approaching each other.

9. The heat exchange device according to any one of claims 1 to 8, characterized in that, The second flow channel (3) and the heat conduction structure (4) are respectively arranged on both sides of the first flow channel (2).

10. The heat exchange device according to any one of claims 1 to 8, characterized in that, The heat conduction structure (4) includes heat dissipation fins connected to the device main body (1).

11. An electronic device, characterized in that, Comprising: A chassis (5) in which a first power consumption component and a second power consumption component can be arranged, and the power consumption of the first power consumption component is greater than that of the second power consumption component; A cold plate arranged in the chassis (5) for heat exchange connection with the first power consumption component; The heat exchange device (100) according to any one of claims 1 to 10 is arranged in the chassis (5), and the second flow channel (3) of the heat exchange device (100) is connected to the cold plate through a secondary side pipeline (11); An air cooling module arranged in the chassis (5) and capable of blowing air to the heat conduction structure (4) of the heat exchange device (100).

12. The electronic device according to claim 11, wherein The chassis (5) includes: An open box body (501), and the open box body (501) is an integral structure; A cover body (502) covering the opening of the open box body (501); A first sealing ring clamped between the open box body (501) and the cover body (502).

13. The electronic device according to claim 11, wherein The first power consumption component further includes: A storage module (6011) arranged in the chassis (5); A main board (6012) arranged in the chassis (5), and the storage module (6011), the air cooling module, the heat exchange device (100) and the main board (6012) are arranged in sequence along the air outlet direction of the air cooling module.

14. The electronic device according to claim 13, characterized in that, A first support structure and a second support structure are arranged in the electronic device. The first support structure supports between the storage module (6011) and the bottom wall of the chassis (5), and the second support structure supports between the main board (6012) and the bottom wall of the chassis (5). A circulation air duct is arranged in the electronic device, and the circulation air duct includes: A first air duct section (901) arranged between the top wall of the chassis (5) and the main board (6012); A second air duct section (902) between the main board (6012) and the rear window of the chassis (5) and connected to the first air duct section (901); A third air duct section (903) arranged between the bottom wall of the chassis (5) and the main board (6012) and the storage module (6011) and connected to the second air duct section (902); A fourth air duct section (904) arranged between the storage module (6011) and the front window of the chassis (5) and connected to the third air duct section (903); A fifth air duct section (905) arranged between the storage module (6011) and the top wall of the chassis (5) and connected to the first air duct section (901).

15. The electronic device according to claim 13, wherein The device body (1) is provided with a primary side inlet (105) and a primary side outlet (106). The first flow channel (2) connects the primary side inlet (105) and the primary side outlet (106). The chassis (5) is provided with a chassis inlet (503) and a chassis outlet (504). The primary side pipeline (10) includes: A liquid inlet pipeline (1001) that passes through the chassis inlet (503) and is used to connect the cold source (12) and the primary side inlet (105); A second sealing ring that is clamped between the chassis inlet (503) and the liquid inlet pipeline (1001); A liquid outlet pipeline (1002) that passes through the chassis outlet (504) and is used to connect the cold source (12) and the primary side outlet (106); A third sealing ring that is clamped between the chassis outlet (504) and the liquid outlet pipeline (1002).

16. The electronic device according to claim 15, characterized in that, On opposite sides of the main board (6012), there are respectively a first notch (60121) and a second notch (60122). The second power-consuming component includes: A power supply module (602) that is arranged inside the chassis (5). The power supply modules (602) are arranged in pairs and are respectively arranged inside the first notch (60121) and the second notch (60122). The chassis inlet (503) and the chassis outlet (504) are arranged between one of the power supply modules (602) and the main board (6012).

17. The electronic device according to claim 11, wherein There are multiple cold plates. The device body (1) of the heat exchange device (100) is provided with a secondary side inlet (107) and a secondary side outlet (108). The second flow channel (3) connects the secondary side inlet (107) and the secondary side outlet (108). The secondary side pipeline (11) includes: A liquid outlet main pipe (1101) that connects the secondary side outlet (108); A liquid distributor, whose input end is connected to the liquid outlet main pipe (1101); Liquid outlet branch pipes (1102) that are connected between the output end of the liquid distributor and the input end of the cold plate; Liquid return branch pipes (1103) that are connected to the output end of the cold plate; A liquid collector, whose input end is connected to the liquid return branch pipe (1103); A liquid return main pipe (1104) that is connected between the output end of the liquid collector and the secondary side inlet (107).

18. The electronic device according to claim 17, wherein The secondary side pipeline (11) further includes: A filter (1105) that is arranged between the output end of the liquid collector and the secondary side inlet (107); and / or, A pump (1106), whose input end is connected to the secondary side outlet (108), and whose output end is connected to the liquid distributor.

19. The electronic device according to claim 18, characterized in that, It further includes: A temperature detection module that is respectively arranged on the first power-consuming component and the second power-consuming component; A pressure detection module that is connected to the liquid outlet main pipe (1101) or the liquid return main pipe (1104); A flow sensor that is connected to the liquid outlet main pipe (1101) or the liquid return main pipe (1104); A control module (13), communicatively connected to the temperature detection module, the pressure detection module, the flow sensor, the pump (1106) and the air-cooling module, and capable of controlling the power of the pump (1106) and the air-cooling module according to the detection results of the temperature detection module, the pressure detection module and the flow sensor.

20. A server cabinet, characterized in that, Comprising: A cabinet; The electronic device according to any one of claims 11 to 19, disposed within the cabinet.

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