Efficient detection equipment for non-Hermite fluctuation intrinsic mode

Abstract

The invention relates to the technical field of non-Hermite fluctuation eigenmode detection, and discloses a non-Hermite fluctuation eigenmode efficient detection device, which comprises a detection device body, protection doors, a heat dissipation device, a damping device, an anti-electromagnetic interference frame and high thermal conductivity silica gel, and is characterized in that the side wall of the detection device body is provided with two protection doors which are distributed in an axial symmetry manner; the two protective doors are rotatably and cooperatively connected with the side wall of the detection equipment body, an anti-electromagnetic interference frame is arranged in the detection equipment body, a damping device is arranged in the bottom end of the detection equipment body, the damping device is cooperatively connected with the bottom of the detection equipment body through an adaptive screw, and a heat dissipation device is arranged in the detection equipment body. The heat dissipation device is connected with the detection equipment body in a matched mode through adaptive screws, high-heat-conduction silica gel is arranged between the heat dissipation device and the detection equipment body, a damping device is arranged at the bottom end of the heat dissipation device, and the detection equipment greatly improves the detection result and precision and ensures the data authenticity.

Description

Technical Field

[0001] The present invention relates to the technical field of non-Hermitian wave eigenmode detection, and specifically to an efficient detection device for non-Hermitian wave eigenmodes. Background Art

[0002] Non-Hermitian wave eigenmodes are used to describe specific vibration or wave states of non-Hermitian wave systems, and play a key role in fields such as optics and quantum mechanics. Different from Hermitian systems, due to the existence of energy loss, gain, or non-symmetric interactions in non-Hermitian systems, their Hamiltonian operators do not satisfy Hermiticity, which endows non-Hermitian wave eigenmodes with unique properties. The eigenvalues are often complex numbers, where the real part represents the frequency and the imaginary part reflects the gain or loss of the system. In certain cases, non-Hermitian systems will exhibit singular points where the eigenvalues and eigenvectors degenerate simultaneously, and the response characteristics of the system to small perturbations change significantly, showing phenomena such as enhanced sublinear response. By studying non-Hermitian wave eigenmodes, researchers can not only deeply understand the physical mechanisms of non-Hermitian systems, but also help design ultrasensitive optical sensors and optimize qubits, promoting technological innovation in frontier fields such as optics and quantum computing.

[0003] However, due to the low protection performance of traditional non-Hermitian wave detection devices, the detection accuracy is poor, and they are easily affected by the detection environment. Simple shaking, temperature changes, etc. will all affect the detection accuracy. Therefore, we propose an efficient detection device for non-Hermitian wave eigenmodes. Summary of the Invention

[0004] (1) Technical Problems to be Solved

[0005] Aiming at the deficiencies of the prior art, the present invention provides an efficient detection device for non-Hermitian wave eigenmodes, which solves the above problems.

[0006] (2) Technical Solutions

[0007] To achieve the above object, the present invention provides the following technical solution: An efficient detection device for non-Hermitian wave eigenmodes, including a detection device body, a protection door, a heat dissipation device, a shock absorption device, an electromagnetic interference-resistant frame, and high thermal conductivity silicone. There are two protection doors arranged axially symmetrically on the side wall of the detection device body. The two protection doors are rotationally and cooperatively connected to the side wall of the detection device body, and an electromagnetic interference-resistant frame is arranged inside the detection device body. A shock absorption device is arranged inside the bottom end of the detection device body. The shock absorption device is cooperatively connected to the bottom of the detection device body through an adapter screw, and a heat dissipation device is arranged inside the detection device body. The heat dissipation device is cooperatively connected to the detection device body through an adapter screw, and high thermal conductivity silicone is provided between the heat dissipation device and the detection device body. The bottom end of the heat dissipation device is the shock absorption device.

[0008] Preferably, a rectangular detection chamber is provided inside the detection device body. An electromagnetic interference-resistant frame is provided inside the rectangular detection chamber. A rectangular opening is provided on the side wall of the rectangular detection chamber corresponding to one end of the protective door. Connecting rods are provided at the four corners of the rectangular opening end, and the connecting rods are rotatably connected to the protective door in a matching manner. A control device is provided on the side wall of the detection device body corresponding to the bottom end of the protective door.

[0009] Preferably, a matching frame is provided at the bottom of the detection device body. A shock-absorbing device is correspondingly placed inside the matching frame. A rectangular opening is provided at the center of the top end of the matching frame, and connection holes I are provided at the four corners of the top end of the matching frame. The bottom end of the matching frame is of a rectangular opening structure, and support columns are provided at the four corners of the top end of the matching frame. A bottom groove is provided at the center of the top end of the support column, and connection holes are provided at the four corners of the bottom groove.

[0010] Preferably, the electromagnetic interference-resistant frame is integrally of a hollow cuboid structure, and the side corresponding to the protective door of the electromagnetic interference-resistant frame is of an open structure. A temperature sensor is provided at the top end inside the electromagnetic interference-resistant frame, and a carrier plate is provided at the bottom end inside the electromagnetic interference-resistant frame. The carrier plate is opposite to the temperature sensor.

[0011] Preferably, the shock-absorbing device is composed of three parts, namely a top plate, a bottom plate, and twelve anti-sway components composed of C-shaped plates and elastic members. The anti-sway components are welded inside the top plate and the bottom plate, and the twelve anti-sway components are distributed in a rectangular surround. A non-slip layer is provided at the bottom end of the bottom plate. Connection holes are provided at the four corners of the top plate and the bottom plate, and the connection holes are connected to the connection holes I through matching screws.

[0012] Preferably, the top end and the bottom end of the C-shaped plate are respectively welded to the top plate and the bottom plate, and both ends of the elastic member are correspondingly welded inside the C-shaped plate.

[0013] Preferably, the heat dissipation device is composed of three parts, namely a heat dissipation plate, a heat dissipation fan, and a protective grille. The top end of the heat dissipation device is the heat dissipation plate. A heat dissipation fan is provided at the center of the bottom end of the heat dissipation plate. A protective grille is provided at the bottom end of the heat dissipation fan. The protective grille and the heat dissipation fan are connected to the heat dissipation plate through matching screws.

[0014] Preferably, a group of fin groups with arc-shaped heat dissipation fins distributed in a circular array are provided at the bottom end of the heat dissipation plate. The outside of the fin group is of a rectangular structure. A matching groove is provided inside the fin group, and the matching groove is correspondingly matched with the outside of the heat dissipation fan. Connection columns are provided at the four corners inside the matching groove, and the connection columns are connected to the heat dissipation fan and the protective grille through matching screws.

[0015] Preferably, a silica gel coating groove is provided at the center of the top end of the heat dissipation plate. The silica gel coating groove is correspondingly matched with the bottom groove, and high thermal conductivity silica gel is correspondingly coated inside the cavity formed by the silica gel coating groove and the bottom groove. Connection holes II are provided at the four corners of the heat dissipation plate, and the connection holes II are connected to the connection holes at the four corners of the bottom groove through matching screws.

[0016] (III) Beneficial Effects

[0017] Compared with the prior art, the present invention provides an efficient detection device for non-Hermitian wave eigenmodes, having the following

[0018] beneficial effects:

[0019] 1. The efficient detection device for non-Hermitian wave eigenmodes greatly improves the detection accuracy. With the help of an anti-electromagnetic interference frame, the device effectively shields the external electromagnetic field, avoiding interference with the non-Hermitian system sample and ensuring that the fluctuation characteristics of the sample are not affected. The temperature sensor is linked with the heat dissipation device to accurately control the internal temperature of the device, preventing the change of the non-Hermitian characteristics of the sample due to temperature changes, which may cause distortion of the detection data. At the same time, the shock absorption device effectively absorbs external vibrations, reducing the interference of vibrations on the detection process. The protective door closes the detection space, reducing the influence of external factors. By combining these measures, the detection accuracy of non-Hermitian wave eigenmodes is greatly improved, providing more accurate data support for scientific researchers and facilitating the in-depth study of the physical mechanism of non-Hermitian systems and technological innovation in frontier fields such as optics and quantum computing.

[0020] 2. The efficient detection device for non-Hermitian wave eigenmodes significantly enhances the environmental adaptability. The anti-electromagnetic interference frame of the device can work stably in a complex electromagnetic environment, reducing the influence of the external electromagnetic field on the detection. The heat dissipation device can automatically adjust the heat dissipation power according to the internal temperature, ensuring that the device can maintain an appropriate working temperature in different temperature environments. The shock absorption device, through a unique structural design, effectively absorbs external vibrations, enabling the device to work normally on an unstable platform. The protective function of the protective door reduces the influence of environmental factors such as dust and humidity on the device. These designs enable the device to adapt to a variety of complex detection environments, broaden the application scenarios of the device, and meet the detection needs of different fields. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a schematic structural diagram of the present invention;

[0022] Figure 2 is a schematic sectional view of the present invention;

[0023] Figure 3 is a schematic sectional view of the present invention;

[0024] Figure 4 is a schematic diagram of the light bar of the present invention;

[0025] Figure 5 is a schematic diagram of the light bar of the present invention;

[0026] Figure 6 is a schematic diagram of the light bar of the present invention;

[0027] Figure 7 Schematic diagram of the light bar of the present invention.

[0028] In the figure: 1. Detection device body; 2. Protection door; 3. Control device; 4. Heat dissipation device; 5. Shock absorption device; 6. Anti-electromagnetic interference frame; 7. Temperature sensor; 8. Carrying plate; 9. High thermal conductivity silica gel; 10. Connecting rod; 11. Bottom groove; 12. Matching frame; 13. Rectangular opening; 14. First connecting hole; 15. Heat dissipation plate; 16. Heat dissipation fan; 17. Protection grille; 18. Arc-shaped heat dissipation fins; 19. Matching groove; 20. Connecting column; 21. Second connecting hole; 22. Silica gel coating groove; 23. Top plate; 24. Bottom plate; 25. C-shaped plate; 26. Elastic member; 27. Anti-slip layer. Specific embodiments

[0029] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0030] Please refer to Figures 1-7 , a high-efficiency detection device for non-Hermitian wave eigenmodes, including a detection device body 1, a protection door 2, a heat dissipation device 4, a shock absorption device 5, an anti-electromagnetic interference frame 6, and a high thermal conductivity silica gel 9. There are two protection doors 2 arranged axially symmetrically on the side wall of the detection device body 1. The two protection doors 2 are rotationally and cooperatively connected to the side wall of the detection device body 1. And an anti-electromagnetic interference frame 6 is arranged inside the detection device body 1. A shock absorption device 5 is arranged inside the bottom end of the detection device body 1. The shock absorption device 5 is cooperatively connected to the bottom of the detection device body 1 through an adapter screw. And a heat dissipation device 4 is arranged inside the detection device body 1. The heat dissipation device 4 is cooperatively connected to the detection device body 1 through an adapter screw. And a high thermal conductivity silica gel 9 is arranged between the heat dissipation device 4 and the detection device body 1. And the bottom end of the heat dissipation device 4 is the shock absorption device 5.

[0031] Furthermore, a rectangular detection chamber is opened inside the detection device body 1. An anti-electromagnetic interference frame 6 is arranged inside the rectangular detection chamber. And a rectangular opening is opened on the side wall of the rectangular detection chamber corresponding to one end of the protection door 2. Connecting rods 10 are arranged at the four corners of the rectangular opening end. And the connecting rods 10 are rotationally and cooperatively connected to the protection door 2 correspondingly. A control device 3 is arranged on the side wall of the detection device body 1 corresponding to the bottom end of the protection door 2. The protection door 2 plays a protective role for the internal detection space, ensuring the stability of the data inside the rectangular detection chamber during detection. The control device 3 is convenient for effectively controlling the internal components and instruments.

[0032] Furthermore, a matching frame 12 is provided at the bottom of the detection device body 1, and a shock-absorbing device 5 is placed inside the matching frame 12. A rectangular opening 13 is provided at the center of the top end of the matching frame 12, and connecting holes 14 are provided at the four corners of the top end of the matching frame 12. The bottom end of the matching frame 12 is a rectangular opening structure, and supporting columns are provided at the four corners of the top end of the matching frame 12. A bottom groove 11 is provided at the center of the top end of the support column, and connecting holes are provided at the four corners of the bottom groove 11. The matching frame 12 connects the shock-absorbing device 5 to ensure that the shock-absorbing device 5 can be effectively compressed and effectively absorb shaking to prevent shaking from affecting the detection data results of the detection device body 1.

[0033] Furthermore, the anti-electromagnetic interference frame 6 is an overall hollow rectangular structure, and the side of the anti-electromagnetic interference frame 6 corresponding to the protective door 2 is an open structure. A temperature sensor 7 is provided at the top of the anti-electromagnetic interference frame 6, and a loading plate 8 is provided at the bottom of the anti-electromagnetic interference frame 6. The loading plate 8 is opposite to the temperature sensor 7. The anti-electromagnetic interference frame 6 can effectively block the invasion of external electromagnetic fields, avoid spatial coupling between interference sources and internal components of the equipment, and maintain the stability of the electromagnetic environment inside the equipment. The temperature sensor 7 can effectively detect the internal temperature, and the temperature data is fed back to the control device 3, and then the control device 3 controls the heat dissipation device 4 to perform efficient heat dissipation, and quickly derive the internal temperature of the detection device body 1 to prevent the detection data from being distorted due to excessive differences in temperature changes inside the detection device body 1.

[0034] Furthermore, the shock absorbing device 5 is composed of three parts, namely a top plate 23, a bottom plate 24 and twelve anti-sway components composed of C-shaped plates 25 and elastic members 26. The anti-sway components are welded inside the top plate 23 and the bottom plate 24, and the twelve anti-sway components are distributed in a rectangular shape. An anti-slip layer 27 is provided at the bottom end of the bottom plate 24. Connection holes that are connected to the connection holes 14 through adapter screws are provided at the four corners of the top plate 23 and the bottom plate 24. The anti-slip layer 27 effectively increases the friction coefficient, prevents the entire device from sliding, and improves the stability of the overall structure.

[0035] Furthermore, the top and bottom ends of the C-shaped plate 25 are welded to the top plate 23 and the bottom plate 24 respectively, and the two ends of the elastic member 26 are correspondingly welded inside the C-shaped plate 25. The cooperation between the C-shaped plate 25 and the elastic member 26 greatly improves the overall shock absorption effect.

[0036] Further, the heat dissipation device 4 is composed of three parts, namely a heat dissipation plate 15, a heat dissipation fan 16, and a protective grille 17. The top end of the heat dissipation device 4 is the heat dissipation plate 15. A heat dissipation fan 16 is provided at the center of the bottom end of the heat dissipation plate 15. A protective grille 17 is provided at the bottom end of the heat dissipation fan 16. The protective grille 17 and the heat dissipation fan 16 are cooperatively connected to the heat dissipation plate 15 through matching screws. The heat dissipation device 4 adjusts the power of the heat dissipation fan 16 based on the internal temperature data fed back by the control device 3, thereby accelerating the heat dissipation quality of the heat dissipation plate 15 and effectively ensuring the stability of the temperature value in the internal detection space.

[0037] Further, a set of fin groups formed by arc-shaped heat dissipation fins 18 arranged in a circular array is provided at the bottom end of the heat dissipation plate 15. The outer part of the fin group is in a rectangular structure. A mating groove 19 is formed inside the fin group. The mating groove 19 corresponds to the outside of the heat dissipation fan 16 for cooperation. Connection columns 20 are provided at the four corners inside the mating groove 19. The connection columns 20 are cooperatively connected to the heat dissipation fan 16 and the protective grille 17 through matching screws. The special structure of the arc-shaped heat dissipation fins 18 can greatly improve the air circulation rate and significantly improve the heat dissipation quality.

[0038] Further, a silica gel application groove 22 is provided at the center of the top end of the heat dissipation plate 15. The silica gel application groove 22 corresponds to the bottom groove 11 for cooperation. High thermal conductivity silica gel 9 is correspondingly applied inside the cavity formed by the silica gel application groove 22 and the bottom groove 11. Connection holes two 21 are provided at the four corners of the heat dissipation plate 15. The connection holes two 21 are cooperatively connected to the connection holes at the four corners of the bottom groove 11 through matching screws. The high thermal conductivity silica gel 9 can efficiently conduct the internal temperature of the detection device body 1 to the heat dissipation plate 15 quickly, improving the heat dissipation quality.

[0039] Structural description:

[0040] Detection device body 1: The detection device body 1 is the main framework of the entire device. A rectangular detection chamber is provided inside, which is used to place key components such as an anti-electromagnetic interference frame, providing a physical bearing space for the detection work.

[0041] Protective door 2: The protective door 2 is symmetrically distributed on the side wall of the detection device body 1 and is rotationally cooperated with it through a connecting rod 10. When closed, it closes the rectangular detection chamber to protect the internal detection space.

[0042] Control device 3: The control device 3 is installed at the bottom end of the side wall of the detection device body 1 corresponding to the protective door 2, and can effectively control components and instruments such as the heat dissipation device and data acquisition inside the device.

[0043] Heat dissipation device 4: The heat dissipation device 4 is composed of a heat dissipation plate 15, a heat dissipation fan 16, and a protective grille 17. It adjusts heat dissipation by the temperature data fed back by the control device 3 to maintain the stability of the internal temperature of the device.

[0044] Vibration damping device 5: The vibration damping device 5 is composed of an anti-sway component consisting of a top plate 23, a bottom plate 24, a C-shaped plate 25 and an elastic member 26, and is installed at the bottom of the detection device body 1 to absorb external vibrations;

[0045] Electromagnetic interference resistant frame 6: The electromagnetic interference resistant frame 6 is a hollow rectangular parallelepiped structure and is placed in the rectangular detection chamber of the detection device body 1, which can shield external electromagnetic fields and maintain the stability of the internal electromagnetic environment;

[0046] Temperature sensor 7: The temperature sensor 7 is installed at the top end inside the electromagnetic interference resistant frame 6 to monitor the temperature inside the frame in real time and feed the data back to the control device 3 for heat dissipation regulation;

[0047] Carrier plate 8: The carrier plate 8 is located at the bottom end inside the electromagnetic interference resistant frame 6 and is opposite to the temperature sensor 7, and is used to place the non-Hermitian system sample to be detected;

[0048] High thermal conductivity silicone 9: The high thermal conductivity silicone 9 is applied in the cavity formed by the silicone application groove 22 and the bottom groove 11 to efficiently conduct the heat inside the detection device body 1 to the heat dissipation plate 15;

[0049] Connecting rod 10: The connecting rod 10 is located at the four corners of the rectangular opening end and is rotationally matched with the protective door 2 to realize the rotational opening and closing of the protective door 2 relative to the detection device body 1;

[0050] Bottom groove 11: The bottom groove 11 is located at the center of the top of the support column of the mating frame 12, and connection holes are provided at the four corners, and are connected to components such as the heat dissipation plate 15 through mating screws;

[0051] Mating frame 12: The mating frame 12 is located at the bottom of the detection device body 1, and the vibration damping device 5 is placed inside, and a rectangular opening 13 and a first connection hole 14 are opened at the top to connect and fix the vibration damping device 5;

[0052] Rectangular opening 13: The rectangular opening 13 is opened at the center of the top end of the mating frame 12 to facilitate the compression of the vibration damping device 5 inside it to effectively absorb vibrations;

[0053] First connection hole 14: The first connection hole 14 is located at the four corners of the top end of the mating frame 12 and is connected to the top plate 23 and the bottom plate 24 of the vibration damping device 5 through mating screws;

[0054] Heat dissipation plate 15: The heat dissipation plate 15 is the top component of the heat dissipation device 4, and arc-shaped heat dissipation fins 18 are provided at the bottom, and the heat is conducted through the high thermal conductivity silicone 9 and dissipated by means of the heat dissipation fan 16;

[0055] Heat dissipation fan 16: The heat dissipation fan 16 is installed at the center of the bottom end of the heat dissipation plate 15 and is regulated by the control device 3 to accelerate the heat dissipation of the heat dissipation plate 15 and maintain the temperature control of the device;

[0056] Protective grille 17: The protective grille 17 is located at the bottom of the cooling fan 16 and is connected to the heat dissipation plate 15 by mating screws to protect the cooling fan 16 and guide the air flow;

[0057] Arc-shaped heat dissipation fins 18: The arc-shaped heat dissipation fins 18 are distributed in a circular array at the bottom of the heat dissipation plate 15. The special arc-shaped structure increases the heat dissipation area and improves the air flow rate;

[0058] Fitting groove 19: The fitting groove 19 is located inside the arc-shaped heat dissipation fins 18 and mates with the outside of the cooling fan 16. Connecting posts 20 are provided at the four corners for connecting components such as the cooling fan 16;

[0059] Connecting post 20: The connecting post 20 is located at the four corners inside the fitting groove 19 and mates with the cooling fan 16 and the protective grille 17 through mating screws to achieve the connection and fixation of components;

[0060] Second connecting hole 21: The second connecting hole 21 is located at the four corners of the heat dissipation plate 15 and is connected and mated with the connecting holes at the four corners of the bottom groove 11 through mating screws;

[0061] Silicone application groove 22: The silicone application groove 22 is located at the center of the top end of the heat dissipation plate 15 and mates with the bottom groove 11 to provide a space for applying high thermal conductivity silicone 9 to conduct heat;

[0062] Top plate 23: The top plate 23 is a part of the shock absorption device 5 and is welded to the bottom plate 24 to form an anti-shake assembly composed of a C-shaped plate 25 and an elastic member 26 to achieve the shock absorption function;

[0063] Bottom plate 24: The bottom plate 24 belongs to the shock absorption device 5 and is provided with an anti-slip layer 27 at the bottom. It jointly fixes the anti-shake assembly with the top plate 23 to maintain the stability of the device;

[0064] C-shaped plate 25: The top and bottom of the C-shaped plate 25 are welded between the top plate 23 and the bottom plate 24, and the elastic member 26 is welded inside to enhance the shock absorption effect of the shock absorption device 5;

[0065] Elastic member 26: The two ends of the elastic member 26 are welded inside the C-shaped plate 25, and the shaking energy is absorbed through elastic deformation to improve the shock absorption performance of the shock absorption device 5;

[0066] Anti-slip layer 27: The anti-slip layer 27 is located at the bottom end of the bottom plate 24, which increases the friction coefficient between the device and the placement plane, prevents the device from sliding, and enhances the stability.

[0067] Working principle: Install the efficient detection device for non-Hermitian wave eigenmodes correctly according to the schematic diagram. When the device is turned on, the non-Hermitian system sample to be detected is placed on the carrier plate 8, inside the internal space of the electromagnetic interference-resistant frame 6. The electromagnetic interference-resistant frame 6 adopts a hollow cuboid structure, effectively shielding the external electromagnetic field, preventing it from interfering with the non-Hermitian wave characteristics of the sample, maintaining the stability of the electromagnetic environment inside the device, and laying a foundation for accurate detection. The temperature sensor 7 monitors the temperature inside the electromagnetic interference-resistant frame 6 in real time and feeds the data back to the control device 3. At the same time, the heat generated during the operation of the device is conducted from the detection device body 1 to the heat dissipation plate 15 of the heat dissipation device 4 through the high thermal conductivity silicone 9. The high thermal conductivity silicone 9 is applied in the cavity formed by the silicone application groove 22 and the bottom groove 11. With excellent thermal conductivity, efficient heat transfer is achieved. The bottom of the heat dissipation plate 15 is provided with arc-shaped heat dissipation fins 18, which not only increase the heat dissipation area but also accelerate the air flow with a special arc-shaped structure. The control device 3 adjusts the power of the heat dissipation fan 16 according to the data fed back by the temperature sensor 7. The heat dissipation fan 16 operates to generate an air flow, which is blown out through the protective grille 17. Cooperating with the arc-shaped heat dissipation fins 18, it quickly takes away the heat of the heat dissipation plate 15, maintaining the stability of the internal temperature of the device and preventing the detection data from being distorted due to temperature changes. In terms of shock absorption, the shock absorption device 5 plays a key role. When the device is shaken by the outside world, the anti-shake assembly composed of the C-shaped plate 25 and the elastic member 26 between the top plate 23 and the bottom plate 24 of the shock absorption device 5 starts to work. The C-shaped plate 25 provides structural support, and the elastic member 26 absorbs the shaking energy through elastic deformation, greatly weakening the impact of the external vibration on the detection device body 1. The cooperation frame 12 plays a role in connecting and fixing the shock absorption device 5, ensuring its stable operation when absorbing shaking and avoiding shaking from interfering with the detection data. The protective door 2 is rotatably installed on the side wall of the detection device body 1. When closed, it closes the rectangular detection chamber, protecting the internal detection space, reducing the interference of external factors on the detection process, and ensuring the stability of the data inside the rectangular detection chamber during detection. The operator can effectively control the internal components and instruments such as heat dissipation and data acquisition of the device through the control device 3, realizing the efficient detection of non-Hermitian wave eigenmodes.

[0068] Although the embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and variations can be made in these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An efficient detection device for non-Hermitian wave eigenmodes, comprising a detection device body (1), a protective door (2), a heat dissipation device (4), a shock absorption device (5), an electromagnetic interference resistant frame (6), and high thermal conductivity silica gel (9), characterized in that: On the side wall of the detection device body (1), there are two protective doors (2) arranged in an axisymmetric distribution. The two protective doors (2) are rotationally connected to the side wall of the detection device body (1). And inside the detection device body (1), there is an electromagnetic interference-resistant frame (6). At the bottom end inside the detection device body (1), there is a shock-absorbing device (5). The shock-absorbing device (5) is connected to the bottom of the detection device body (1) through an adapter screw. And inside the detection device body (1), there is a heat dissipation device (4). The heat dissipation device (4) is connected to the detection device body (1) through an adapter screw. And there is a high thermal conductivity silica gel (9) between the heat dissipation device (4) and the detection device body (1). And the bottom end of the heat dissipation device (4) is the shock-absorbing device (5).

2. The high-efficiency detection device for a non-Hermitian wave eigenmode according to claim 1, wherein: Inside the detection device body (1), there is a rectangular detection chamber. Inside this rectangular detection chamber, there is an electromagnetic interference-resistant frame (6). And on one side wall of the rectangular detection chamber corresponding to the protective door (2), there is a rectangular opening. At the four corners of this rectangular opening end, there are connecting rods (10). And the connecting rods (10) are rotationally connected to the protective door (2) correspondingly. On the side wall of the detection device body (1) corresponding to the bottom end of the protective door (2), there is a control device (3).

3. The high-efficiency detection device for a non-Hermitian wave eigenmode according to claim 2, characterized in that: At the bottom of the detection device body (1), there is a fitting frame (12). Inside the fitting frame (12), the shock-absorbing device (5) is placed correspondingly. In the center of the top end of the fitting frame (12), there is a rectangular opening (13). And at the four corners of the top end of the fitting frame (12), there are connection holes one (14). The bottom end of the fitting frame (12) is a rectangular opening structure. And at the four corners of the top end of the fitting frame (12), there are support columns. At the center of the top end of this support column, there is a bottom groove (11). At the four corners of the bottom groove (11), there are connection holes.

4. The high-efficiency detection device for a non-Hermitian wave eigenmode according to claim 2, characterized in that: The electromagnetic interference-resistant frame (6) is in an overall hollow cuboid structure. And on one side of the electromagnetic interference-resistant frame (6) corresponding to the protective door (2), it is an open structure. At the top end inside the electromagnetic interference-resistant frame (6), there is a temperature sensor (7). And at the bottom end inside the electromagnetic interference-resistant frame (6), there is a carrier plate (8). The carrier plate (8) is opposite to the temperature sensor (7).

5. The high-efficiency detection device for a non-Hermitian wave eigenmode according to claim 3, wherein: The shock-absorbing device (5) is composed of three parts, namely a top plate (23), a bottom plate (24), and twelve anti-shake components composed of a C-shaped plate (25) and an elastic member (26). The anti-shake components are welded inside the top plate (23) and the bottom plate (24). And the twelve anti-shake components are distributed in a rectangular surround. And at the bottom end of the bottom plate (24), there is an anti-slip layer (27). At the four corners of the top plate (23) and the bottom plate (24), there are connection holes that are connected to the connection holes one (14) through an adapter screw.

6. The high-efficiency detection device for a non-Hermitian wave eigenmode according to claim 5, characterized in that: The top end and the bottom end of the C-shaped plate (25) are welded to the top plate (23) and the bottom plate (24) respectively. And the two ends of the elastic member (26) are welded inside the C-shaped plate (25) correspondingly.

7. The high-efficiency detection device for a non-Hermitian wave eigenmode according to claim 1, wherein: The heat dissipation device (4) is composed of three parts, namely a heat dissipation plate (15), a heat dissipation fan (16) and a protective grille (17). The top end of the heat dissipation device (4) is the heat dissipation plate (15), the center of the bottom end of the heat dissipation plate (15) is provided with the heat dissipation fan (16), the bottom end of the heat dissipation fan (16) is provided with the protective grille (17), and the protective grille (17) and the heat dissipation fan (16) are cooperatively connected to the heat dissipation plate (15) through mating screws.

8. The high-efficiency detection device for a non-Hermitian wave eigenmode according to claim 7, wherein: A fin group with a group of arc-shaped heat dissipation fins (18) arranged in a circular array is provided at the bottom end of the heat dissipation plate (15), and the outside of the fin group is in a rectangular structure. A mating groove (19) is formed inside the fin group, the mating groove (19) corresponds to the outside of the heat dissipation fan (16) for mating, and connection posts (20) are provided at the four corners inside the mating groove (19). The connection posts (20) are cooperatively connected to the heat dissipation fan (16) and the protective grille (17) through mating screws.

9. The high-efficiency detection device for a non-Hermitian wave eigenmode according to claim 8, characterized in that: A silicone coating groove (22) is provided at the center of the top end of the heat dissipation plate (15), the silicone coating groove (22) corresponds to the bottom groove (11) for mating, and high thermal conductivity silicone (9) is correspondingly coated inside the cavity formed by the silicone coating groove (22) and the bottom groove (11). Connection holes two (21) are formed at the four corners of the heat dissipation plate (15), and the connection holes two (21) are cooperatively connected to the connection holes at the four corners of the bottom groove (11) through mating screws.

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