Glue filling device and glue filling method for giant magnetostrictive rod

By using a system consisting of a vacuum tube, a compressed air tube, and a mold, combined with a three-stage dispensing process and parameter adjustment, the problems of low efficiency and poor uniformity in the dispensing process of super magnetostrictive rods were solved, achieving efficient and uniform glue filling and improving the mechanical properties and reliability of the rods.

CN120325482BActive Publication Date: 2025-11-04HUNAN UNIV
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Patent Information

Application Number
CN202510804532.9
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-06-17
Publication Date
2025-11-04
Estimated Expiration
2045-06-17

AI Technical Summary

Technical Problem

Existing technologies suffer from low glue-filling efficiency, poor uniformity, and insufficient precision during the glue-filling process of super magnetostrictive rods. In particular, when multiple slits are in parallel, capillary permeation dynamics become unstable and preferential flow channel effects become severe, resulting in incomplete and uneven glue-filling.

Method used

A glue-drinking device and method are adopted, which utilizes a system consisting of a vacuum tube, an air compressor tube and a mold. Through asymmetric pressure field and temperature control, the glue is made to penetrate the gaps evenly. Combined with a three-stage glue-drinking process and parameter adjustment, the glue is made to completely fill and evenly distribute within the gaps.

Benefits of technology

It improves glue-filling efficiency, ensures the integrity and uniformity of glue-filling, enhances the mechanical properties and reliability of the super magnetostrictive rod, and solves the problems of uneven and inaccurate glue-filling in the existing technology.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present application relates to a glue filling device and glue filling method for magnetostrictive rod, the glue filling device comprises a frame, the frame is provided with a vacuum pipe, a mold and an air pressure pipe; the air pressure pipe comprises a pipe body, one end of the pipe body is communicated with an air compressor; the mold comprises a mold cavity, the bottom of the mold cavity is provided with a first gasket, the top of the mold cavity is provided with a second gasket, the bottom surface of the first gasket is provided with a first recess opening downward, the top surface of the first gasket is provided with a first groove corresponding to the gap, the first groove is communicated with the first recess, the top surface of the second gasket is provided with a second recess opening upward, the bottom surface of the second gasket is provided with a second groove corresponding to the gap, the second groove is communicated with the second recess; the other end of the pipe body is communicated with the first recess; one end of the vacuum pipe is communicated with the second recess, the other end of the vacuum pipe is communicated with a vacuum pump. The glue filling device can improve the glue filling efficiency and completeness.
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Description

TECHNICAL FIELD

[0001] The application relates to a glue filling device and a glue filling method for a giant magnetostrictive rod, and belongs to the technical field of precision processing of magnetostrictive materials. BACKGROUND

[0002] As a core driving element of a water acoustic transducer, a giant magnetostrictive material (Terfenol-D) needs to bear a high-frequency alternating magnetic field of hundreds of Hz to several kHz during operation. According to Maxwell's electromagnetic theory, a closed loop eddy current is formed in the material, and the power loss of the eddy current is P eddy which can be expressed as:

[0003]

[0004] In the formula, f is the working frequency, B max is the magnetic induction intensity amplitude, d is the material characteristic size (if the giant magnetostrictive rod, the material characteristic size is the diameter of the giant magnetostrictive rod), p is the resistivity. Generally, when the diameter of the Terfenol-D rod is greater than 20 mm and the working frequency is greater than 2 kHz, the eddy current loss accounts for more than 35% of the total energy consumption, and the temperature rise rate of the Terfenol-D rod is as high as 8-12 ℃ / min. The temperature rise effect caused by the eddy current loss has significant hazards: on the one hand, the magnetostrictive coefficient of the giant magnetostrictive material decreases nonlinearly with the increase of the temperature, and when the temperature exceeds 80℃, the magnetostrictive coefficient decreases by more than 40%, directly causing the transducer to drop by 5-8 dB in the voltage response; on the other hand, the grain boundary sliding caused by thermal stress can shorten the fatigue life of the giant magnetostrictive material to less than 500 hours, which is far lower than the 10-year service period requirement of the water acoustic equipment.

[0005] In order to block the eddy current path, the current industry generally adopts a wire cutting process to process periodic micron-level slits in the axial direction of the giant magnetostrictive rod, and the slits usually penetrate through both ends and the side surface of the giant magnetostrictive rod. Generally, when the slit width H is greater than or equal to 150 microns and the spacing L between the slits is less than or equal to 5 mm, the effective path of the eddy current is physically cut off; cutting 7 slits can reduce the temperature rise rate to 1.5 ℃ / min under the working condition of 2 kHz, and the magneto-mechanical coupling coefficient is increased to 0.72. However, this "slit suppression eddy" strategy easily brings the following new structural defects:

[0006] (1) Stress concentration effect: the slit tip forms a type II crack stress field, and the bending strength and fracture toughness of the giant magnetostrictive rod after cutting are decreased;

[0007] (2) Fatigue crack propagation under dynamic load: under alternating stress, the secondary cracks initiated at the gap edge propagate rapidly, significantly reducing the structural reliability of the giant magnetostrictive rod.

[0008] To enhance the mechanical properties of the giant magnetostrictive rod with a gap, the prior art often uses a vacuum impregnation process to fill epoxy resin-based composite materials into the gap. The theoretical basis of this process is the Lucas-Washburn equation:

[0009]

[0010] In the formula, h(t) is the penetration depth, γ is the surface tension, η is the viscosity of the glue solution, δ is the gap width, θ is the contact angle, and t is the time. However, when dealing with complex giant magnetostrictive rods with a gap depth-width ratio greater than 10:1 and multiple parallel gaps, the traditional vacuum impregnation process and manual glue filling process face the following key challenges:

[0011] (1) Capillary penetration dynamics instability: the flow of high-viscosity glue solution (η>500 mPa·s) in the gap is subject to the dynamic balance of capillary force and gas back pressure. This capillary penetration dynamics instability phenomenon is more pronounced in the glue filling of the micro-gap of the giant magnetostrictive rod. Due to the small gap spacing and the deep gap, the gas discharge paths of adjacent gaps interfere with each other, forming a local high-pressure gas resistance area, which easily leads to penetration stagnation during the glue filling process of the giant magnetostrictive rod.

[0012] (2) Preferential flow channel effect: in the giant magnetostrictive rod with multiple parallel gaps, the glue solution has a viscous finger phenomenon. The gap width deviation will cause distortion of the pressure gradient field, causing some gaps to be connected early to form "preferential flow channels", resulting in non-uniform filling of each gap, and further leading to stress distribution imbalance.

[0013] (3) Low efficiency and uniformity of manual glue filling: manual glue filling has high manual involvement and low automation, which not only leads to low glue filling efficiency (just for the glue filling process, it takes about half an hour), but also has the problems of inaccurate glue filling position and low overall uniformity. Manual operation can easily cause more air bubbles in the glue, leading to uneven and not compact glue filling of the giant magnetostrictive rod after glue filling.

[0014] Therefore, during the glue filling process of the giant magnetostrictive rod after cutting the gap, how to ensure the integrity, uniformity and accuracy of the glue filling to ensure the good mechanical properties of the giant magnetostrictive rod has become a difficult problem to be solved. SUMMARY

[0015] In view of the deficiencies of the prior art, one of the purposes of the present application is to provide a glue filling device for a giant magnetostrictive rod, so as to improve the glue filling efficiency of the gap of the giant magnetostrictive rod; and another purpose of the present application is to provide a glue filling method for a giant magnetostrictive rod.

[0016] In order to solve the above technical problems, the technical solutions of the present application are as follows:

[0017] The glue filling device for the giant magnetostrictive rod, the giant magnetostrictive rod is provided with a plurality of gaps, the glue filling device comprises a frame body, the frame body is provided with a vacuum pipe, a mold and an air pressure pipe; the air pressure pipe comprises a pipe body and a piston arranged in the pipe body, one end of the pipe body is communicated with an air compressor; the mold comprises a mold cavity, a sleeve matched with the side wall of the mold cavity and a heating element for heating the mold cavity, the sleeve is made of elastic material; the bottom of the mold cavity is provided with a first gasket, the top of the mold cavity is provided with a second gasket, the sleeve, the first gasket and the second gasket surround a cavity for accommodating the giant magnetostrictive rod to be filled with glue, the bottom surface of the first gasket is provided with a downwardly opening first recess, the top surface of the first gasket is provided with a first groove corresponding to the gap of the giant magnetostrictive rod to be filled with glue, the first groove is communicated with the first recess, the top surface of the second gasket is provided with an upwardly opening second recess, the bottom surface of the second gasket is provided with a second groove corresponding to the gap of the giant magnetostrictive rod to be filled with glue, the second groove is communicated with the second recess; the bottom of the mold is provided with a first hole, one end of the first hole is communicated with the first recess, the other end of the first hole is detachably connected with the other end of the pipe body; the top of the mold is provided with a second hole, one end of the second hole is communicated with the second recess; one end of the vacuum pipe is detachably connected with the other end of the second hole, the other end of the vacuum pipe is communicated with a vacuum pump.

[0018] Thus, the sleeve can be sleeved on the magnetostrictive rod to be glued, and then loaded into the mold cavity, so that the magnetostrictive rod is wrapped by the sleeve, the first gasket and the second gasket (wherein the sleeve is tightly matched with the side surface of the magnetostrictive rod, the first gasket is tightly matched with the bottom end of the magnetostrictive rod, and the second gasket is tightly matched with the top end of the magnetostrictive rod), which can not only meet the sealing requirement to prevent glue overflow during the glue filling process, but also meet the glue filling requirement; the glue is filled in the pipe body from the piston to the other end of the pipe body; then the air pressure pipe, the mold and the vacuum pipe are connected in sequence, and then the air compressor and the vacuum pump are started, so that an asymmetric pressure field is formed on the upper and lower sides of the mold, the glue is driven to flow from the pipe body to the first hole, the first recess, the first groove and then into the corresponding gap of the magnetostrictive rod, and gradually fills each gap, and the excess glue flows into the second groove from the top end of the magnetostrictive rod, and then flows into the vacuum pipe through the second recess and the second hole, and when it is judged that glue appears in the vacuum pipe, the glue filling can be stopped, and the heating element can be heated to maintain the appropriate temperature condition in the mold cavity during the glue filling process, so that the glue viscosity is stable and the flowability is good, and the good glue filling effect is ensured; then, after the magnetostrictive rod is dried and solidified together with the mold, the mold is demolded, and the magnetostrictive rod after glue filling is obtained. It can be seen that the glue filling device can improve the glue filling efficiency and ensure the good glue filling effect, and can effectively solve the problems of low glue filling efficiency and poor glue filling uniformity caused by manual glue filling in the prior art.

[0019] The bottom surface of the first gasket is provided with a downwardly open first recess, and the top surface of the first gasket is provided with a first groove corresponding to the gap of the magnetostrictive rod to be glued, and the first groove is communicated with the first recess, so that the glue can be uniformly infiltrated into each gap of the magnetostrictive rod during the glue filling process, and the glue in each gap flows in parallel during the glue filling process, which is helpful to improve the completeness and uniformity of the glue filling.

[0020] Optionally, the magnetostrictive rod is a Tb-Dy-Fe alloy rod.

[0021] Optionally, the magnetostrictive rod is provided with a plurality of parallel gaps. Further, the gaps include first gaps and second gaps which are parallel to each other and are alternately distributed, and the through positions of the first gaps and the second gaps with the side surface of the magnetostrictive rod are located on both sides of a plane perpendicular to the center axis of the magnetostrictive rod.

[0022] Further, the mold includes a first mold assembly and a second mold assembly which is detachably connected with the first mold assembly, and the mold cavity is surrounded by the combination of the first mold assembly and the second mold assembly, and a glue pad is arranged at the gap between the first mold assembly and the second mold assembly. Thus, the loading and demolding of the magnetostrictive rod can be facilitated, and the sealing performance of the mold cavity can be ensured.

[0023] Optionally, the rubber pad is a silica gel pad.

[0024] Further, the bottom of the first mold assembly is provided with a base protruding towards the second mold assembly, and the first hole is arranged on the base; the top of the second mold assembly is provided with a top base protruding towards the first mold assembly, and the second hole is arranged on the top base. In this way, the loading of the giant magnetostrictive rod can be facilitated, and the connection of the air pressure pipe and the vacuum pipe with the mold can also be facilitated.

[0025] Further, the end face of the first mold assembly towards the second mold assembly is provided with a plurality of positioning pins, and the second mold assembly is provided with positioning holes matched with the positioning pins. In this way, the positioning between the first mold assembly and the second mold assembly can be quickly realized, and the assembly of the mold can be facilitated.

[0026] Further, the sidewall of the first mold assembly and / or the second mold assembly is provided with a threaded hole, the threaded hole is in communication with the mold cavity, a bolt is arranged in the threaded hole, a sealing rubber pad is sleeved on the bolt, and the sealing rubber pad is located on the section where the bolt is outside the mold. In this way, the demolding can be facilitated, and the sealing property of the mold cavity can be ensured.

[0027] Optionally, the first mold assembly is mainly composed of polytetrafluoroethylene; and the second mold assembly is mainly composed of polytetrafluoroethylene. The polytetrafluoroethylene material will not be adhered to the common epoxy resin glue, and the disassembly can be facilitated.

[0028] Further, the connection between the first hole and the pipe body is provided with a first sealing ring, and the connection between the second hole and the vacuum pipe is provided with a second sealing ring. In this way, the connection between the first hole and the pipe body and the connection between the second hole and the vacuum pipe can be facilitated, and the sealing property can be ensured, so that the establishment of the asymmetric pressure field can be ensured.

[0029] Further, the pipe body is made of transparent material, and / or the vacuum pipe is made of transparent material. In this way, the glue condition in the pipe body and / or the vacuum pipe can be observed by naked eyes, and then the glue filling end point can be determined.

[0030] Further, the heating element is a PEEK temperature compensation ring; and the gasket is made of polytetrafluoroethylene.

[0031] Optionally, the vacuum pipe, the mold and the air pressure pipe are sequentially arranged from top to bottom. In this way, part of the glue can be prevented from falling directly due to the influence of gravity, so that the glue filling process can be controlled, and the glue filling effect such as filling rate can be improved.

[0032] Based on the same inventive concept, the present application also provides a glue filling method for a giant magnetostrictive rod, which is performed by using the glue filling device as described above, and includes the following steps:

[0033] S1, loading the giant magnetostrictive rod to be filled with glue into the mold cavity;

[0034] Load the adhesive into the air compressor pipe;

[0035] S2. Connect the air compressor pipe, mold, and vacuum pipe in sequence;

[0036] S3. Activate the heating element to bring the mold cavity temperature to the target temperature;

[0037] S4. Start the air compressor and vacuum pump, pour the adhesive, and stop the air compressor and vacuum pump when adhesive appears in the vacuum tube.

[0038] S5. Transfer the mold to the drying oven, heat and cure it, then demold it to complete the gluing operation of the super magnetostrictive rod.

[0039] Optionally, in S2, during glue dispensing, the vacuum level in the vacuum tube is controlled to be -95 to 65 kPa, and the pressure in the air compressor tube is controlled to be 0.1 to 0.5 MPa.

[0040] Optionally, in S2, during glue dispensing, the vacuum level in the vacuum tube is controlled to be -90 to 70 kPa, and the pressure in the air compressor tube is controlled to be 0.2 to 0.4 MPa.

[0041] Optionally, the target temperature is 30-50°C, further 35-45°C, and even further 38-42°C.

[0042] Further, in S2, during the glue-filling process, the first stage of glue-filling is performed, wherein the vacuum degree in the vacuum tube is controlled to be constant at V0, the pressure in the air compressor tube is controlled to be constant at P0, the glue-filling time is 25-35s, V0 = -85--75kPa, P0 = 0.2-0.4MPa; then the second stage of glue-filling is performed, wherein the vacuum degree [i.e., V(t)] is controlled to linearly and gradually change from V0 to -95--85kPa during the second stage of glue-filling, preferably -92--88kPa, more preferably -91--89kPa, according to... The pressure is dynamically adjusted, where P(t) is the pressure at time t during the second stage of glue filling, V(t) is the vacuum degree at time t during the second stage of glue filling, α is the permeability coefficient of the glue, and the filling time is 250-290s. Then, a third stage of glue filling is performed, where the vacuum degree is controlled to be constant at -75 to -65 kPa, the pressure is constant at 0.28 to 0.3 MPa, and the filling time is 15-25s. The first stage of glue filling is the initial glue filling stage, the second stage is the main glue filling stage, and the third stage is the final leveling stage, which helps to eliminate residual stress. During the second stage of glue filling, gradient glue filling is performed by establishing a mathematical model between P(t) and V(t), which helps to suppress the preferential flow channel effect. The applicant's research found that using the above three-stage glue filling method helps to further improve the gap filling rate and uniformity.

[0043] The parameters such as pressure, vacuum degree, temperature and the like can be monitored in real time by setting relevant sensors, and since the pressure sensor, temperature sensor and the like and their using methods are all very mature prior art, the real-time monitoring of the above parameters is very easy to realize, and the present application will not be described in detail.

[0044] Optionally, the glue solution is a two-component epoxy resin glue.

[0045] Optionally, the glue solution is composed of epoxy resin and curing agent at a mass ratio of 100:30-100, preferably, the mass ratio of epoxy resin and curing agent is 100:70-90, such as 100:75, 100:80, 100:85 and the like.

[0046] Optionally, the epoxy resin is E51, and the curing agent is 650 polyamide curing agent.

[0047] Optionally, α is 0.1-0.2, further 0.12-0.18, and more further 0.14-0.16.

[0048] Optionally, the glue solution is loaded on the downstream side of the piston in the air pressure pipe. Thus, subsequent glue filling can be facilitated, and the glue solution can be prevented from pre-curing.

[0049] Optionally, in S4, when continuous glue solution appears in the vacuum pipe, the air compressor and the vacuum pump are stopped.

[0050] The glue filling device of the present application adopts the cooperation of the air compressor and the vacuum pump, the mold is located between the air pressure pipe and the vacuum pipe, the super magnetostrictive rod material with the gap is located in the mold, the bottom of the mold cavity is provided with the first gasket with the slot corresponding to the gap of the super magnetostrictive rod material, and meanwhile, the process parameters such as the pressure P of the air pressure pipe, the vacuum degree V of the vacuum pipe and the temperature T in the mold cavity are controlled, so as to control the pressure gradient and the vacuum pumping speed, and the problems of low glue filling integrity, uniformity and accuracy caused by the capillary penetration dynamics instability and the preferential flow channel effect are better solved.

[0051] Compared with the prior art, the present application has the following beneficial effects:

[0052] (1) The glue filling device of the present application can improve the glue filling efficiency, and solve the problems of low glue filling integrity, uniformity and accuracy caused by the capillary penetration dynamics instability and the preferential flow channel effect in the prior art.

[0053] (2) The glue filling device of the present application has compact structure and good reliability, and can efficiently, reliably and quickly realize the parallel glue filling of multiple gaps in the super magnetostrictive rod material. BRIEF DESCRIPTION OF DRAWINGS

[0054] Figure 1 It is a structural diagram of a glue filling device for a super magnetostrictive rod material.

[0055] Figure 2 It is an exploded view of a mold of a glue filling device for a giant magnetostrictive rod of the present application.

[0056] Figure 3 It is a perspective view of a first mold assembly of the present application.

[0057] Figure 4 It is a perspective view of a second mold assembly of the present application.

[0058] Figure 5 It is a schematic view of a giant magnetostrictive rod and a first gasket of the present application in a fitted state.

[0059] Figure 6 It is a schematic view of a mold, an air pressure pipe and a vacuum pipe of the present application in a connected state.

[0060] Figure 7 It is a schematic view of a cross-sectional structure of an air pressure pipe of the present application.

[0061] Figure 8 It is a schematic view of a cross-sectional structure of a giant magnetostrictive rod to be filled with glue of the present application.

[0062] Figure 9 It is a bottom view of a first gasket of the present application.

[0063] Figure 10 It is a top view of a second gasket of the present application. Figure 9

[0064] It is a cross-sectional view along line A-A in the above figure. Figure 11

[0065] It is a cross-sectional view along line B-B in the above figure. Figure 12 Figure 11 It is a result view of a local gap of a giant magnetostrictive rod filled with glue in Example 1 of the present application under a metalloscope.

[0066] Figure 13 It is a result view of a local gap of a giant magnetostrictive rod filled with glue in Example 2 of the present application under a metalloscope.

[0067] Figure 14 It is a result view of a local gap of a giant magnetostrictive rod filled with glue in Example 3 of the present application under a metalloscope.

[0068] Figure 15 It is a result view of a local gap of a giant magnetostrictive rod filled with glue in Example 4 of the present application under a metalloscope.

[0069] Figure 16 It is a result view of a local gap of a giant magnetostrictive rod filled with glue in Example 4 of the present application under a metalloscope.​

[0070] Figure 17 The partial gap of the magnetostrictive rod after glue filling in the embodiment 5 of the present application under the result figure of the metallographic microscope.

[0071] Figure 18 The partial gap of the magnetostrictive rod after glue filling in the embodiment 6 of the present application under the result figure of the metallographic microscope.

[0072] In the figure, 1, vacuum tube; 2, mold, 20, positioning hole, 21, first hole, 22, first fixed hole, 23, cavity, 24, base, 25, second sealing ring, 26, heating element, 27, first gasket, 271, first concave cavity, 272, first groove, 28, piston, 29, second hole; 3, tube body, 31, first sealing ring, 32, second gasket, 321, second concave cavity, 322, second groove, 33, top base, 34, support, 35, second fixed hole, 36, second nut, 37, first nut; 4, air compressor; 5, first support; 6, threaded rod; 7, second support; 8, control box; 9, vacuum pump; 10, first mold assembly; 11, rubber pad; 12, magnetostrictive rod, 1201, first gap, 1202, second gap; 13, second mold assembly; 14, positioning pin; 15, sleeve; 16, sealing rubber pad; 17, bolt; 18, threaded hole. DETAILED DESCRIPTION

[0073] The present application will be described in detail below with reference to the embodiments. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict. For the convenience of description, if the words "up", "down", "left", "right" appear in the following, they only mean the same direction as the up, down, left and right of the drawing itself, and do not limit the structure.

[0074] Embodiment 1

[0075] Reference Figures 1-12The glue filling device for the giant magnetostrictive rod of the embodiment comprises a frame body, a plurality of slits are arranged on the giant magnetostrictive rod 12, and the frame body is provided with a vacuum pipe 1 (capable of bearing a limit vacuum degree of -100 kPa and achieving a suction speed of 30 L / min under a vacuum degree of -100 kPa), a mold 2 and an air pressure pipe which are sequentially distributed from top to bottom. The frame body comprises a first support 5, a second support 7 and a support seat 34 for bearing the mold, two threaded rods 6 (made of 304 stainless steel) extending in the vertical direction are fixed on the support seat 34, the top end of the threaded rod 6 extends above the mold, the bottom end of the threaded rod 6 extends below the mold, the first support 5 is movably installed on the section of the threaded rod 6 extending above the mold (the first support is in the form of a plate, and a through hole matched with the threaded rod 6 is arranged on the first support), the vacuum pipe is fixed on the first support 5, after the vacuum pipe and the mold are connected in place, the first nut 37 is screwed into the top end of the threaded rod 6, so that the first nut 37 abuts against the first support 5, thereby realizing the stable connection of the vacuum pipe and the mold, the second support 7 is movably installed on the section of the threaded rod 6 extending below the mold (the second support is in the form of a plate, and a through hole matched with the threaded rod 6 is arranged on the second support), the air pressure pipe is fixed on the second support 7, after the air pressure pipe and the mold are connected in place, the second nut 36 is screwed into the bottom end of the threaded rod 6, so that the second nut 36 abuts against the second support 7, thereby realizing the stable connection of the air pressure pipe and the mold. In this way, the connection and disconnection between the vacuum pipe, the air pressure pipe and the mold can be conveniently realized. The bottom of the support seat 34 is provided with a control box 8 to facilitate the storage of control elements such as PID temperature controllers and intelligent control units, which helps to improve the intelligent control degree.

[0076] Referring to Figure 7 , the air pressure pipe comprises a pipe body 3 (capable of bearing a pressure range of 0-1.2 MPa) and a piston 28 arranged in the pipe body 3, and one end of the pipe body 3 is communicated with an air compressor 4.

[0077] Referring to Figures 2-4 , Figure 6The mold 2 comprises a mold cavity, a sleeve 15 matched with the side wall of the mold cavity and a heating element 26 for heating the mold cavity, the sleeve 15 is made of silica gel; the bottom of the mold cavity is provided with a first gasket 27, the top of the mold cavity is provided with a second gasket 32, the sleeve 15, the first gasket 27 and the second gasket 32 form a cavity 23 for accommodating the super magnetostrictive rod to be filled with glue, the bottom surface of the first gasket 27 is provided with a first recessed cavity 271 opening downward, the top surface of the first gasket 27 is provided with a first groove 272 corresponding to the gap of the super magnetostrictive rod to be filled with glue, the first groove 272 is communicated with the first recessed cavity 271, the top surface of the second gasket 32 is provided with a second recessed cavity 321 opening upward, the bottom surface of the second gasket 32 is provided with a second groove 322 corresponding to the gap of the super magnetostrictive rod to be filled with glue, the second groove 322 is communicated with the second recessed cavity 321; the bottom of the mold 2 is provided with a first hole 21, one end of the first hole 21 is communicated with the first recessed cavity 271, the other end of the first hole 21 is detachably connected with the other end of the pipe body 3; the top of the mold 2 is provided with a second hole 29, one end of the second hole 29 is communicated with the second recessed cavity 321.

[0078] One end of the vacuum tube 1 is detachably connected with the other end of the second hole 29, the other end of the vacuum tube 1 is communicated with a vacuum pump 9.

[0079] Referring to Figure 3 and Figure 4 The mold 2 comprises a first mold assembly 10 and a second mold assembly 13 detachably connected with the first mold assembly 10, the mold cavity is surrounded by the combination of the first mold assembly 10 and the second mold assembly 13, and a glue pad 11 is arranged at the gap between the first mold assembly 10 and the second mold assembly 13. The glue pad 11 is made of silica gel.

[0080] The bottom of the first mold assembly 10 is provided with a base 24 protruding towards the second mold assembly 13, and the first hole 21 is arranged on the base 24; the top of the second mold assembly 13 is provided with a top base 33 protruding towards the first mold assembly 10, and the second hole 29 is arranged on the top base 33.

[0081] The end surface of the first mold assembly 10 facing the second mold assembly 13 is provided with a plurality of positioning pins 14, and the second mold assembly 13 is provided with positioning holes 20 matched with the positioning pins 14.

[0082] The side wall of the second mold assembly 13 is provided with a threaded hole 18 which is communicated with the mold cavity, and a bolt 17 is installed in the threaded hole 18, and a sealing gasket 16 made of silica gel is sleeved on the bolt 17, and the sealing gasket is located between the nut of the bolt and the outer side wall of the mold, so as to seal the mold cavity from the outside. The region where the first mold assembly 10 and the second mold assembly 13 are connected is provided with a plurality of first fixing holes 22, and the second mold assembly 13 is provided with a second fixing hole 35 matched with the first fixing hole 22, and the fixing holes are provided with threads, and the first fixing hole and the second fixing hole are provided with fixing bolts (not shown in the figure) to realize the fixation between the first mold assembly 10 and the second mold assembly 13.

[0083] Referring to Figure 6 , the first hole 21 and the connecting part of the pipe body 3 are provided with a first sealing ring 31 which is embedded in the bottom surface of the base 24, and the other end of the first hole 21 is detachably and tightly connected with the other end of the pipe body 3 through the first sealing ring 31; the connecting part of the second hole 29 and the vacuum tube 1 is provided with a second sealing ring 25 which is embedded in the top surface of the top base 33, and the one end of the vacuum tube 1 is detachably and tightly connected with the other end of the second hole 29 through the second sealing ring 25. The sealing ring is made of silica gel.

[0084] The pipe body 3 is made of transparent material, and the vacuum tube 1 is made of transparent material. The heating element 26 is a PEEK temperature compensation ring with a built-in Pt100 temperature sensor to facilitate temperature monitoring and control; the material of the gasket is polytetrafluoroethylene.

[0085] The glue filling method for the giant magnetostrictive rod is carried out by using the glue filling device described above, and includes the following steps:

[0086] S1, loading the giant magnetostrictive rod to be filled with glue into the mold cavity;

[0087] Loading the glue solution 30 into the air pressure pipe;

[0088] Referring to Figure 5 and Figure 8The super-magnetostrictive rod 12 is a Terfenol-D rod with a size of Φ35*55mm; seven parallel slits are formed on the super-magnetostrictive rod, the width of the slits is 150μm, the depth (i.e. the axial dimension) of the slits is 55mm, one side end of the slits penetrates the side surface of the super-magnetostrictive rod, the distance d between the other side end of the slits and the side surface of the super-magnetostrictive rod is 5mm, the slits penetrate the top end surface and the bottom end surface of the super-magnetostrictive rod, and the seven slits are uniformly distributed in the super-magnetostrictive rod; the slits include four first slits 1201 and three second slits 1202, the first slits 1201 and the second slits 1202 are alternately distributed, the penetration positions of the first slits 1201 and the second slits 1202 on the side surface of the super-magnetostrictive rod are located on both sides of a plane that passes through the center axis of the super-magnetostrictive rod and is perpendicular to the slits, so that the solid part of the super-magnetostrictive rod in the cross section perpendicular to the axial direction of the super-magnetostrictive rod is in a snake shape;

[0089] The preparation method of the glue solution 30 is as follows: under the clean room environment at 25℃, the E51 epoxy resin and the curing agent (650 low molecular weight polyamide) are mixed in a mass ratio of 100:80, and are stirred and mixed for 3min at a mechanical stirring speed of 1200rpm.

[0090] S2, the air pressure pipe, the mold 2 and the vacuum pipe 1 are sequentially communicated;

[0091] S3, the heating element 26 is started to make the temperature of the mold cavity reach and maintain the target temperature (40±0.5℃) within 5min;

[0092] S4, the air compressor 4 and the vacuum pump 9 are started, and the glue is poured, when the continuous glue solution appears in the vacuum pipe, the air compressor 4 and the vacuum pump 9 are stopped;

[0093] S5, the mold is transferred to the circulating hot air drying box, after heating and curing, the mold is demolded, and the glue pouring operation of the super-magnetostrictive rod is completed;

[0094] Among them, heating and curing is carried out in three stages, first heating and curing at 60℃ for 2h, then heating and curing at 80℃ for 1.5h, and then heating and curing at 120℃ for 0.5h.

[0095] In S2, when pouring the glue, first, the first stage of glue pouring is carried out, wherein the vacuum degree in the vacuum pipe 1 is controlled to be constant at-80kPa, the pressure in the air pressure pipe is controlled to be constant at 0.2MPa, and the glue pouring time is 30s; then, the second stage of glue pouring is carried out, wherein the vacuum degree [V(t)] is linearly changed from-80kPa to-90kPa during the second stage of glue pouring, and the glue pouring time is 30s. The pressure is dynamically adjusted, P(t) is the pressure at time t in the second glue filling process, V(t) is the vacuum degree at time t in the second glue filling process, and the glue filling time is 270 s (0≤t≤270 s); then, the third glue filling process is performed, wherein the vacuum degree is controlled to be constant at-70 kPa, the pressure is controlled to be constant at 0.29 MPa, and the glue filling time is 20 s.

[0096] The result of the local gap of the magnetostrictive rod after glue filling under the metallographic microscope is shown in FIG. 4. Figure 13 The image is subjected to threshold segmentation using MATLAB image analysis software after observation under the metallographic microscope, and the glue filling rate and interface porosity are analyzed and calculated, and the related calculation formula is as follows:

[0097] ;

[0098] .

[0099] It can be known from the observation under the metallographic microscope and the processing and analysis of the image that the glue filling rate of the 7 gaps of the magnetostrictive rod after glue filling in Example 1 is 99.3%, the interface porosity is 0.5%, and the glue filling integrity is high.

[0100] Example 2

[0101] Example 1 is repeated, and the only difference is that the third glue filling process is omitted in S4.

[0102] The glue filling rate of the 7 gaps is 98.2%, the interface porosity is 1.8%, the glue filling integrity is relatively high, and the result of the local gap of the magnetostrictive rod after glue filling in Example 2 under the metallographic microscope is shown in FIG. 5. Figure 14

[0103] Example 3

[0104] Example 1 is repeated, and the only difference is that in S4, the pressure and the vacuum degree are not dynamically adjusted in the second glue filling process, the vacuum degree is set to be constant at-80 kPa, and the pressure is stable at 0.2 MPa.

[0105] The glue filling rate of the 7 gaps is 92.5%, the interface porosity is 8.8%, and the result of the local gap of the magnetostrictive rod after glue filling in Example 3 under the metallographic microscope is shown in FIG. 6. Figure 15

[0106] Example 4

[0107] Example 1 is repeated, and the only difference is that the first glue filling process is omitted in S4.

[0108] ​​The filling rate of the 7 gaps is 98.7% and the interface porosity is 1.4% by metallographic microscope detection, and the glue filling integrity is high. The result of the local gap of the magnetostrictive rod after glue filling of Example 4 under the metallographic microscope is shown in FIG. 5. Figure 16

[0109] Example 5

[0110] Example 1 is repeated, with the difference being that the vacuum degree [V(t)] is linearly changed from -80 kPa to -85 kPa in the second section of the glue filling process.

[0111] The filling rate of the 7 gaps is 96.4% and the interface porosity is 6.2% by metallographic microscope detection, and the glue filling integrity is reduced. The result of the local gap of the magnetostrictive rod after glue filling of Example 5 under the metallographic microscope is shown in FIG. 6. Figure 17

[0112] Example 6

[0113] Example 1 is repeated, with the difference being that the vacuum degree [V(t)] is linearly changed from -80 kPa to -95 kPa in the second section of the glue filling process.

[0114] The filling rate of the 7 gaps is 91.5% and the interface porosity is 10.1% by metallographic microscope detection, and the glue filling integrity is also reduced. The result of the local gap of the magnetostrictive rod after glue filling of Example 6 under the metallographic microscope is shown in FIG. 7. Figure 18

[0115] It can be seen from the comparison that the linear change range of the vacuum degree in the second section of the glue filling process helps to further improve the glue filling integrity.

[0116] The above-mentioned content illustrated by the examples should be understood as the examples being used only for more clearly illustrating the present application, and not for limiting the scope of the present application. After reading the present application, various equivalent modifications of the present application by those skilled in the art all fall within the scope defined by the claims attached to the present application.​​​

Claims

1. A method for potting a giant magnetostrictive rod, characterized by, The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling.

2. The method of claim 1, wherein, The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. 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The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. 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The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device and a glue filling method, and relates to the technical field of glue filling. The application discloses a glue filling device 3. The method of claim 2, wherein, The bottom of the first mold assembly is provided with a base protruding towards the second mold assembly, and the first hole is arranged on the base. The top of the second mold assembly is provided with a top base protruding towards the first mold assembly, and the second hole is arranged on the top base.

4. The method of claim 2, wherein, The end face of the first mold assembly towards the second mold assembly is provided with a plurality of positioning pins, and the second mold assembly is provided with positioning holes matched with the positioning pins.

5. The method according to any of claims 2 to 4, characterized in that, The sidewall of the first mold assembly and / or the second mold assembly is provided with a threaded hole, the threaded hole is communicated with the mold cavity, a bolt is arranged in the threaded hole, a sealing rubber gasket is sleeved on the bolt, and the sealing rubber gasket is located on the section where the bolt is outside the mold.

6. The method of claim 1-4, wherein, The connection between the first hole and the pipe body is provided with a first sealing ring, and the connection between the second hole and the vacuum pipe is provided with a second sealing ring.

7. The method of claim 1-4, wherein, The pipe body is made of transparent material, and / or the vacuum pipe is made of transparent material; the heating element is a PEEK temperature compensation ring; and the material of the gasket is polytetrafluoroethylene.

8. The method of claim 1-4, wherein, The vacuum pipe, the mold and the air pipe are sequentially arranged from top to bottom.

Citation Information

Patent Citations

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