Semiconductor wafer impurity cleaning apparatus and cleaning method thereof

Abstract

The application discloses a semiconductor wafer impurity cleaning equipment and a cleaning method thereof, and belongs to the technical field of semiconductor wafer cleaning. The equipment is provided with a rotating motor, a cross-shaped placing frame, an electric push rod II, a moving clamping block, an elastic clamping block and an ultrasonic wave transmitter. The elastic clamping block is attached to the edge of the wafer, and the wafer is clamped and fixed on the top of the cushion block, so that the wafer can be conveniently disassembled or clamped and fixed. The electric push rod III is controlled to drive the moving sliding block to slide until the water guide plate drives the ultrasonic wave transmitter to move to the top of the wafer. Under the rebound action of the compression spring, the ultrasonic wave transmitter is compressed on the surface of the wafer. The rotating motor is started to drive the cross-shaped placing frame to rotate, so that the wafer on the top of the cross-shaped placing frame rotates synchronously with the cross-shaped placing frame. When the wafer rotates, the ultrasonic wave transmitter is started to emit ultrasonic waves to generate fine bubbles in the cleaning liquid. The wafer surface is cleaned by the bubbles breaking, so that the wafer surface is cleaned comprehensively.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor wafer cleaning, in particular to a semiconductor wafer impurity cleaning equipment and a cleaning method thereof. BACKGROUND

[0002] As the core driving force of modern technology, the semiconductor industry plays a crucial role in many fields such as electronic information, communication, artificial intelligence, etc. The surface and internal impurities of semiconductor wafers, which are the basic materials for manufacturing various semiconductor devices, directly determine the performance, reliability and yield of the final product. In the manufacturing process of semiconductor wafers, various impurities are inevitably introduced, which are widely sourced and diverse in type. For example, during the crystal growth stage, the raw materials may carry trace amounts of metal impurities such as iron, copper, nickel, etc. These metal impurities can seriously affect the electrical properties of semiconductors, leading to problems such as device leakage, unstable signal transmission, etc. During the wafer processing process, mechanical operations such as cutting and grinding can generate particulate impurities such as silicon chips and abrasive particles. If these particles remain on the wafer surface, they may cause pattern defects in subsequent photolithography, etching and other processes, reducing the yield of chips. In addition, organic pollutants in the environment, chemical reagent residues and photoresist residues may also adhere to the wafer surface, interfering with normal process technology. Therefore, it is necessary to use a semiconductor wafer impurity cleaning equipment to clean the semiconductor wafer and remove the particulate impurities on the surface of the semiconductor wafer to improve the cleanliness of the semiconductor wafer surface.

[0003] The existing semiconductor wafer impurity cleaning equipment generally uses a suction cup to adsorb and fix the semiconductor wafer during cleaning. The suction cup is adsorbed on the surface of the semiconductor wafer, and the semiconductor wafer is controlled to rotate for cleaning. However, the semiconductor wafer may be detached from the suction cup under the action of centrifugal force, causing the semiconductor wafer to fly out of the cleaning equipment and be damaged. In addition, the cleaning liquid after cleaning contains a large amount of particulate impurities. When the cleaning liquid is filtered and recycled, the filtered particulate impurities may block the filter screen, affecting the recycling of the cleaning liquid. Therefore, improvements are needed.

[0004] Therefore, the present application designs a semiconductor wafer impurity cleaning equipment and a cleaning method thereof to solve the above problems. SUMMARY

[0005] The present application aims to provide a semiconductor wafer impurity cleaning equipment and a cleaning method thereof, to solve the problem that the existing semiconductor wafer impurity cleaning equipment is easy to cause the semiconductor wafer to fly out of the cleaning equipment and be damaged when the wafer is cleaned, and the filtered particle impurities are easy to block the filter screen and affect the recycling of the cleaning liquid.

[0006] To achieve the above object, the present application provides the following technical scheme.

[0007] A semiconductor wafer impurity cleaning equipment, comprising a cleaning box, two sides of the top of the cleaning box are rotatably installed with cover plates through rotating shafts, a circulating water pump is fixedly installed at the bottom of one side of the cleaning box, a water guide pipe is communicatively arranged at the input end of the circulating water pump, a three-way water pipe is communicatively arranged at the output end of the circulating water pump, a plurality of fixed buckles are clamped on the surface of the three-way water pipe, and the fixed buckles are fixedly connected with the surface of the cleaning box or the cover plate, a nozzle is communicated with the end of the three-way water pipe away from the circulating water pump through the cover plate, and the nozzle is fixedly connected to the central position of the inner wall top of the cover plate, a water collecting box is fixedly installed at the bottom of the cleaning box on both sides in a symmetrical manner, a rotating motor is fixedly installed at the bottom of the cleaning box, the output end of the rotating motor extends to the inside of the cleaning box through the bottom of the cleaning box, and the output end of the rotating motor is rotatably connected with the bottom of the cleaning box through a bearing, a cross placement frame is fixedly installed at the output end of the rotating motor, and a pressing and cleaning mechanism is fixedly installed at the top of the inner wall of the cleaning box.

[0008] As a further scheme of the present application, a drain groove is arranged at the central position of the bottom of the cleaning box, a T-shaped sliding bar is fixedly installed at the top of each side of the cleaning box in a symmetrical manner, a moving seat is slidingly installed through the surface of the T-shaped sliding bar, an electric push rod one is fixedly installed at the bottom of the T-shaped sliding bar on each side, and one end of the electric push rod one is fixedly connected with the bottom of one side of the moving seat, a supporting top bar is rotatably installed at the top of the moving seat through a pin shaft, and one end of the supporting top bar away from the moving seat is rotatably connected with the cover plate through a pin shaft.

[0009] As a further scheme of the present application, the water collecting tank top is provided with a water collecting groove, the inner wall of the water collecting groove is fixedly installed with a mounting frame on one side, the mounting frame is communicated with the water collecting groove, the bottom of the mounting frame is fixedly installed with a filter screen, the two sides of the inner wall of the mounting frame are rotatably installed with a reciprocating screw rod through a bearing, the outer side of the water collecting tank is fixedly installed with a moving motor, the output end of the moving motor is rotatably connected with the water collecting tank and the mounting frame through a bearing, the output end of the moving motor is fixedly connected with the reciprocating screw rod, the surface of the reciprocating screw rod inside the mounting frame is threadedly connected with a cleaning seat, the bottom of the cleaning seat is fixedly installed with three cleaning scrapers, and the cleaning scrapers are tightly attached to the filter screen.

[0010] As a further scheme of the present application, the cross placement frame top is fixedly installed with a pad at the central position, four support plates are fixedly installed at equal angles at the bottom of the cross placement frame, a rotating seat one is fixedly installed at the bottom of one side of the support plate, an electric push rod two is rotatably installed in the rotating seat one through a pin shaft, a rotating seat two is rotatably installed on the end of the electric push rod two away from the rotating seat one through a pin shaft, four limiting sliding grooves are provided at equal angles at the top of the cross placement frame, and the limiting sliding grooves penetrate the cross placement frame.

[0011] As a further scheme of the present application, the moving clamping block is slidably installed in the limiting sliding groove, the bottom of the moving clamping block is fixedly connected with the rotating seat two, one side of the top of the moving clamping block is provided with a positioning insertion hole, the top of the moving clamping block is provided with an elastic clamping block, one side of the bottom of the elastic clamping block is provided with a positioning clamping column, the positioning clamping column and the positioning insertion hole are in corresponding positions and have the same shape, the top of the elastic clamping block is provided with a fixing bolt, and the fixing bolt is threadedly connected with the moving clamping block through the elastic clamping block.

[0012] As a further scheme of the present application, the pressing and cleaning mechanism comprises two limiting sliding rods, the two ends of the limiting sliding rods are fixedly connected with the inner wall of the cleaning tank, a moving sliding block is slidably installed on the surface of each limiting sliding rod, an electric push rod three is fixedly connected with the bottom of the limiting sliding rod on one side of the moving sliding block, and the electric push rod three is fixedly connected with the inner wall of the cleaning tank, a concave frame is fixedly installed on the top of the moving sliding block.

[0013] As a further scheme of the present application, an installation column is fixedly installed between the inner top of the concave frame and the top of the moving sliding block, a pressing plate is slidably installed on the surface of the installation column, a pressing spring is sleeved on the surface of the installation column on the top of the pressing plate, a water guide plate is fixedly installed between the two pressing plates, and the water guide plate is provided with an ultrasonic wave emitter.

[0014] A cleaning method of a semiconductor wafer impurity cleaning device, the cleaning method comprising the following steps:

[0015] The control electric push rod one extends and pushes the moving base to slide on the surface of the T-shaped slide bar, the supporting top bar is rotated on the top of the moving base, the cover plate is rotated and opened on both sides of the top of the cleaning box, the appropriate cleaning liquid is poured into the cleaning box, the cleaning liquid flows into the water collecting tank through the drain tank, the appropriate elastic clamping block is selected according to the need, the elastic clamping block is tightly attached to the top of the moving clamping block, the positioning clamping column at the bottom of the elastic clamping block is inserted into the corresponding positioning insertion hole at the top of the moving clamping block, and then the fixing bolt is screwed to be threadedly connected with the moving clamping block through the elastic clamping block, so that the elastic clamping block is fixed on the top of the moving clamping block, four elastic clamping blocks are fixed on the top of the corresponding moving clamping block through the opening, four electric push rods two are controlled to be synchronously extended, the rotating base two is lifted, the moving clamping block is slid in the corresponding limiting sliding groove, the four moving clamping blocks drive the elastic clamping blocks to move away from each other, the wafer is placed on the cushion block, and the edge of the wafer is clamped and fixed on the top of the cushion block;

[0016] The control electric push rod one is retracted to pull the moving base to slide on the surface of the T-shaped slide bar, the moving base pulls the supporting top bar to drive the cover plate to rotate and close on the top of the cleaning box, the nozzle is suspended on the top of the wafer center position, the electric push rod three is controlled to pull the moving sliding block to slide on the surface of the corresponding limiting sliding rod, the moving sliding block drives the water guide plate to move to the top of the wafer, when the ultrasonic wave emitter is attached to the top of the wafer, the water guide plate is lifted to drive the pressing plate to move on the surface of the mounting column, the compression spring is deformed, the pressing plate is pressed on the top of the moving sliding block under the rebound action of the compression spring, so that the ultrasonic wave emitter is pressed on the surface of the wafer, and the circulating water pump is started, the cleaning liquid in the water collecting tank is poured into the circulating water pump through the water guide pipe, is pumped into the three-way water pipe, is pumped into the nozzle from the three-way water pipe, the cleaning liquid is sprayed to the wafer, the ultrasonic wave emitter and the rotating motor are started, the rotating motor drives the cross-shaped placing frame to rotate, the wafer rotates at the bottom of the ultrasonic wave emitter, and the ultrasonic wave emitter emits ultrasonic waves to impact the cleaning liquid on the surface of the wafer, so that bubbles are generated in the cleaning liquid, the impurities on the surface of the wafer are cleaned with the rupture of the bubbles, and the surface of the wafer is cleaned comprehensively;

[0017] The cleaning liquid after cleaning contains a large amount of particle impurities, the cleaning liquid mixed with the particle impurities flows from the water tank to the mounting frame, is filtered through the filter screen, the impurities in the cleaning liquid are filtered on the top of the filter screen, the filtered cleaning liquid flows into the water collecting tank for recycling, the particle impurities accumulated on the top of the filter screen are prone to block the mesh holes after a period of accumulation, the cleaning seat is moved back and forth on the inner wall of the mounting frame by starting the moving motor to drive the reciprocating screw rod to rotate, the cleaning scraper is moved back and forth on the top of the filter screen to clean, and the particle impurities accumulated on the top of the filter screen are moved to avoid the particle impurities from being deposited on the top of the filter screen to block the filter screen and affect the filtering effect of the filter screen.

[0018] After the wafer cleaning is completed, the rotating motor and the circulating water pump are stopped, the first electric push rod is elongated to rotate and open the cover plate on the top of the cleaning tank, the moving slider is pushed away from the top of the wafer by the third electric push rod, the elastic clamping block is driven away from the edge of the wafer by the second electric push rod, and the wafer is taken off from the bottom of the pad block for replacement, so that the batch of wafers are sequentially cleaned.

[0019] Compared with the prior art, the present application has the following advantages:

[0020] 1、The elastic clamping block is correspondingly attached to the top of the moving clamping block, the positioning clamping column at the bottom of the elastic clamping block is inserted into the corresponding positioning insertion hole, the fixing bolt is tightened to connect the elastic clamping block and the moving clamping block, the elastic clamping block is fixed on the top of the moving clamping block, the openings of the four elastic clamping blocks are directed to the pad block, the wafer is placed on the top of the pad block, the second electric push rod is controlled to be synchronously extended and retracted, the moving clamping block is slid in the limiting sliding groove, the elastic clamping block is driven to approach the wafer, until the elastic clamping block is attached to the edge of the wafer, the wafer is clamped and fixed on the top of the pad block, the wafer is conveniently disassembled or clamped and fixed, the moving slider is driven to slide by the third electric push rod, until the water guide plate drives the ultrasonic wave transmitter to move to the top of the wafer, the ultrasonic wave transmitter is pressed on the surface of the wafer under the rebounding action of the compression spring, the cross placement frame is rotated by starting the rotating motor, the wafer is rotated on the top of the cross placement frame, the ultrasonic wave transmitter is started to emit ultrasonic waves to generate fine bubbles in the cleaning liquid, the wafer surface is cleaned by the bubbles breaking, so that the wafer surface is comprehensively cleaned.

[0021] 2, The present application is through the setting cleaning box, water collecting tank, filter screen, reciprocating screw rod, moving motor, circulating water pump and spray head, the cleaning liquid of wafer after cleaning falls in the cleaning box, the particle impurities during cleaning flow into the mounting frame inside from the water tank, the cleaning liquid mixed with particle impurities is filtered through the filter screen, the filtered particle impurities are accumulated in the inner wall of the filter screen, the moving motor is started to control the reciprocating screw rod to rotate, the cleaning seat is reciprocated on the surface of the reciprocating screw rod, the cleaning scraper is reciprocated on the inner wall of the filter screen, the particle impurities accumulated in the filter screen are scraped and cleaned, and the clean cleaning liquid flows into the water collecting tank, the circulating water pump is started to make the clean cleaning liquid in the water collecting tank flow into the circulating water pump from the water guide pipe, the pressurized input three-way pipe is input from the three-way pipe, and the spray head is sprayed to the wafer surface, so that the wafer cleaning liquid is recycled. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0023] Figure 1 The expansion structure diagram of the present application is shown in the figure;

[0024] Figure 2 The expansion structure diagram of the cleaning box and the cover plate of the present application is shown in the figure;

[0025] Figure 3 The structure diagram of the circulating water pump and the three-way pipe of the present application is shown in the figure;

[0026] Figure 4 The cross-sectional structure diagram of the water collecting tank, the filter screen and the cleaning scraper of the present application is shown in the figure;

[0027] Figure 5 The cross-sectional structure diagram of the rotating motor and the cross-shaped placing frame of the present application is shown in the figure;

[0028] Figure 6 The cross-sectional structure diagram of the cross-shaped placing frame and the cushion block of the present application is shown in the figure;

[0029] Figure 7 The structure diagram of the moving clamping block, the elastic clamping block and the fixing bolt of the present application is shown in the figure;

[0030] Figure 8 The cross-sectional structure diagram of the moving sliding block and the water guide plate of the present application is shown in the figure.

[0031] In the drawings, the component list represented by each mark is as follows:

[0032] 1, cleaning box; 101, cover plate; 102, lower water tank; 103, T-shaped slide bar; 104, moving seat; 105, electric push rod one; 106, support top bar; 2, circulating water pump; 201, water guide pipe; 202, three-way water pipe; 203, fixed buckle; 204, spray head; 3, water collecting tank; 301, water collecting tank; 302, mounting frame; 303, filter screen; 304, reciprocating screw rod; 305, moving motor; 306, cleaning seat; 307, cleaning scraper; 4, rotating motor; 5, cross placement frame; 501, cushion block; 502, support plate; 503, rotating seat one; 504, electric push rod two; 505, rotating seat two; 506, limiting sliding groove; 507, moving clamping block; 508, positioning jack; 509, elastic clamping block; 510, positioning clamping column; 511, fixing bolt; 6, pressing cleaning mechanism; 601, limiting sliding rod; 602, moving sliding block; 603, electric push rod three; 604, concave frame; 605, mounting column; 606, pressing plate; 607, pressing spring; 608, water guide plate; 609, ultrasonic wave emitter. DETAILED DESCRIPTION

[0033] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0034] Please refer to Figures 1-8 The present application provides a technical solution:

[0035] The utility model provides a semiconductor wafer impurity cleaning equipment, including the cleaning box 1, the both sides of the top of cleaning box 1 are rotatably installed with cover plate 101 through the pivot respectively, the bottom of one side of cleaning box 1 is fixedly installed with circulating water pump 2, the input end of circulating water pump 2 is connected with water guide pipe 201, the output end of circulating water pump 2 is connected with three -way water pipe 202, a plurality of fixed buckles 203 are clamped on the surface of three -way water pipe 202, and the fixed buckle 203 is fixedly connected with the surface of cleaning box 1 or cover plate 101, the end of three -way water pipe 202 away from circulating water pump 2 is connected with shower head 204 through cover plate 101, and the shower head 204 is fixedly connected at the central position of the inner wall top of cover plate 101. The both sides of the bottom of cleaning box 1 are fixedly installed with the water collecting tank 3 that is connected to cleaning box 1 symmetrically, and the water guide pipe 201 is connected to the water collecting tank 3, and the bottom of cleaning box 1 is fixedly installed with rotating motor 4, the output end of rotating motor 4 extends to the inside of cleaning box 1 through the bottom of cleaning box 1, and the output end of rotating motor 4 is rotatably connected with the bottom of cleaning box 1 through bearing, and the output end of rotating motor 4 is fixedly installed with cross placement frame 5, and the top of the inner wall of cleaning box 1 is fixedly installed with the pressing cleaning mechanism 6 that washes the wafer of cross placement frame 5;

[0036] When working, the cover plate 101 is opened from the top of the cleaning box 1, the wafer is fixed on the top of the cross placement frame 5, then the pressing cleaning mechanism 6 is controlled to move to the top of the wafer, an appropriate amount of cleaning liquid is poured into the cleaning box 1, the cover plate 101 is closed, the cleaning liquid in the cleaning box 1 flows into the water collecting tank 3, the circulating water pump 2 is started to guide the cleaning liquid in the water collecting tank 3 into the circulating water pump 2 through the water guide pipe 201 for pressurization, the cleaning liquid pressurized by the circulating water pump 2 is sent to the shower head 204 from the three-way water pipe 202 and sprayed from the shower head 204 to the surface of the wafer; meanwhile, the rotating motor 4 is started to control the cross placement frame 5 to rotate, so that the cleaning liquid sprayed from the shower head 204 falls on the surface of the wafer when the cross placement frame 5 drives the wafer to rotate at the bottom of the pressing cleaning mechanism 6, and the centrifugal force generated when the cross placement frame 5 drives the wafer to rotate causes the cleaning liquid to flow on the surface of the wafer for cleaning, and the wafer rotates at the bottom of the pressing cleaning mechanism 6, so that the pressing cleaning mechanism 6 cleans the surface of the wafer, and the cleaning liquid mixed with particulate impurities after cleaning falls in the cleaning box 1 and flows to the water collecting tank 3 for treatment and recycling.

[0037] As a further scheme of the present application, the lower water groove 102 is arranged at the central position of the bottom of the cleaning tank 1, the T-shaped sliding bar 103 is symmetrically and fixedly arranged at the top of the cleaning tank 1, the moving seat 104 is slidingly arranged on the surface of the T-shaped sliding bar 103, the electric push rod I 105 is fixedly arranged at the bottom of the T-shaped sliding bar 103, the bottom of one side of the moving seat 104 is fixedly connected with the telescopic end of the electric push rod I 105, the supporting top bar 106 is rotatably arranged at the top of the moving seat 104 through the pin shaft, and one end of the supporting top bar 106 away from the moving seat 104 is rotatably connected with the cover plate 101 through the pin shaft.

[0038] In operation, the electric push rod I 105 on both sides of the cleaning tank 1 is controlled to be synchronously telescopic, the moving seat 104 is driven to slide on the surface of the corresponding T-shaped sliding bar 103, the supporting top bar 106 is rotated at the top of the moving seat 104, and the cover plate 101 is controlled to be rotated at the top of the cleaning tank 1, so that the opening or closing of the cover plate 101 at the top of the cleaning tank 1 is facilitated.

[0039] As a further scheme of the present application, the water collecting tank 3 is provided with a water collecting groove 301, the mounting frame 302 is fixedly arranged on the inner wall of the water collecting groove 301, the mounting frame 302 is in position correspondence and communication with the lower water groove 102, the filter screen 303 is fixedly arranged on the inner bottom of the mounting frame 302, the reciprocating screw rod 304 is rotatably arranged between the inner walls of the mounting frame 302 through the bearing, the moving motor 305 is fixedly arranged on the outer side of the water collecting tank 3, the output end of the moving motor 305 is rotatably connected with the water collecting tank 3 and the mounting frame 302 through the bearing, the output end of the moving motor 305 is fixedly connected with the reciprocating screw rod 304, the cleaning seat 306 is threadedly connected with the surface of the reciprocating screw rod 304 in the mounting frame 302, and the three cleaning scrapers 307 are fixedly arranged on the bottom of the cleaning seat 306 and tightly abut against the filter screen 303.

[0040] In operation, the cleaning liquid mixed with the particle impurities in the cleaning tank 1 flows into the mounting frame 302 from the lower water groove 102, is filtered through the filter screen 303, and the particle impurities are accumulated on the top of the filter screen 303, the clean cleaning liquid falls into the water collecting groove 301 for recycling, the moving motor 305 is started to control the reciprocating screw rod 304 to rotate, the cleaning seat 306 is reciprocally moved on the surface of the reciprocating screw rod 304, the cleaning scrapers 307 are controlled to move back and forth in the filter screen 303, the particle impurities are pushed to move to the both sides in the filter screen 303 and are accumulated, the filter screen 303 is prevented from being blocked by the particle impurities to affect the filtering use of the cleaning liquid, and since the particle impurities in the cleaning liquid are small and are accumulated on the surface of the reciprocating screw rod 304, the reciprocating movement of the cleaning seat 306 on the surface of the reciprocating screw rod 304 is not affected.

[0041] As a further scheme of the present application, the cushion block 501 is fixedly installed at the central position of the top of the cross placement frame 5, four support plates 502 are fixedly installed at the bottom of the cross placement frame 5 at equal angles, the rotary seat one 503 is fixedly installed at the bottom of one side of the support plate 502, the electric push rod two 504 is rotatably installed in the rotary seat one 503 through a pin shaft, the rotary seat two 505 is rotatably installed at the end of the electric push rod two 504 away from the rotary seat one 503 through a pin shaft; four limiting sliding grooves 506 are arranged at the top of the cross placement frame 5 at equal angles, the limiting sliding groove 506 penetrates through the cross placement frame 5 and is provided with an installation groove in the inner wall, the movable clamping block 507 is limitingly and slidingly installed in the limiting sliding groove 506 through the installation groove, and the movable clamping block 507 is fixedly connected with the rotary seat two 505 at the bottom; one side of the top of the movable clamping block 507 is provided with the positioning insertion hole 508, the elastic clamping block 509 is arranged at the top of the movable clamping block 507, one side of the bottom of the elastic clamping block 509 is provided with the positioning clamping column 510, the positioning clamping column 510 is corresponding to the position of the positioning insertion hole 508 and is the same in shape; the fixed bolt 511 is arranged at the top of the elastic clamping block 509 and is screwed with the movable clamping block 507 through the elastic clamping block 509.

[0042] During work, the elastic clamping block 509 is correspondingly attached to the top of the movable clamping block 507, the positioning clamping column 510 is clamped into the corresponding positioning insertion hole 508, the fixed bolt 511 is tightened to connect and fix the elastic clamping block 509 and the movable clamping block 507, and it is ensured that the elastic clamping block 509 will not deviate when being fixed on the top of the movable clamping block 507. After the wafer is placed on the top of the cushion block 501, the four electric push rods two 504 are controlled to be synchronously extended and retracted, the corresponding movable clamping block 507 is pulled to be close to the cushion block 501, the elastic clamping block 509 is attached to the edge of the wafer, the center of the wafer is moved to the central position of the top of the cushion block 501, the elastic clamping block 509 clamps and fixes the wafer, and it is ensured that the wafer will not fly out from the top of the cross placement frame 5 when the cross placement frame 5 is rotated by the rotary motor 4.

[0043] As a further scheme of the present application, the pressing cleaning mechanism 6 comprises limiting slide rods 601, the number of the limiting slide rods 601 is two, and the limiting slide rods 601 are fixedly connected with the inner wall of the cleaning tank 1 at both ends, the limiting slide rods 601 are respectively penetrated by slidingly installed moving sliding blocks 602 on the surface, the moving sliding blocks 602 are fixedly connected with electric push rods three 603 at one side of the bottom of the limiting slide rods 601, and the electric push rods three 603 are fixedly connected with the inner wall of the cleaning tank 1, the moving sliding blocks 602 are fixedly installed with concave frames 604 at the top, the concave frames 604 are fixedly installed with installation columns 605 between the inner top and the top of the moving sliding block 602, the installation columns 605 are penetrated by slidingly installed pressing plates 606 on the surface, and the installation columns 605 are sleeved with pressing springs 607 on the surface at the top of the pressing plates 606, the two pressing plates 606 are fixedly installed with water guide plates 608, and the water guide plates 608 penetrate the opposite side wall of the concave frame 604, and the water guide plates 608 are provided with ultrasonic wave emitters 609 at the bottom.

[0044] When the wafer is clamped and fixed on the top of the cross placement frame 5, the electric push rod three 603 is controlled to extend and pull the moving sliding block 602 to slide on the surface of the corresponding limiting slide rod 601, the water guide plate 608 is driven to move to the top of the wafer, the ultrasonic wave emitter 609 is tightly attached to the wafer, the wafer lifts the ultrasonic wave emitter 609, the pressing plates 606 at both ends of the water guide plate 608 are moved on the surface of the corresponding installation column 605, the pressing spring 607 is deformed, the pressing plate 606 is pressed to the moving sliding block 602 under the rebounding action of the pressing spring 607, the ultrasonic wave emitter 609 is tightly attached to the surface of the wafer, and the cleaning liquid sprayed from the nozzle 204 falls on the top of the water guide plate 608, so that the cleaning liquid falls on the surface of the wafer from both sides of the water guide plate 608, the ultrasonic wave emitter 609 is started to emit ultrasonic waves to the cleaning liquid on the surface of the wafer, small bubbles are generated in the cleaning liquid, and the particle impurities on the surface of the wafer are cleaned with the bubbles.

[0045] A cleaning method of a semiconductor wafer impurity cleaning device, the cleaning method comprises the following steps:

[0046] Control electric push rod one 105 extension push mobile seat 104 in T type slide bar 103 surface sliding, make mobile seat 104 pull support top bar 106 drive cover plate 101 in cleaning tank 1 top rotation closing, make shower head 204 hang in wafer center position top, control electric push rod three 603 pull mobile sliding block 602 in corresponding limit sliding rod 601 surface sliding, make mobile sliding block 602 drive water guide plate 608 move to wafer top, when ultrasonic transmitter 609 stick wafer top, support water guide plate 608 drive compression plate 606 on installation column 605 surface move, extrude compression spring 607 deformation, under the spring back of compression spring 607 will compression plate 606 compress in mobile sliding block 602 top, so that ultrasonic transmitter 609 compress in wafer surface, start circulating water pump 2 simultaneously, through water guide pipe 201 pour cleaning liquid in sump 301 inside into circulating water pump 2 and pump into three way pipe 202, from three way pipe 202 pressurized pump into shower head 204, make cleaning liquid spray to wafer, start ultrasonic transmitter 609 and rotating motor 4, rotating motor 4 drive cross placement frame 5 rotation, make wafer rotate in ultrasonic transmitter 609 bottom, while ultrasonic transmitter 609 send ultrasonic wave impact wafer surface cleaning liquid, make cleaning liquid produce bubble, along with the breakage of bubble clean wafer surface impurity, so as to clean wafer surface completely;

[0047] Control electric push rod one 105 contraction pull mobile seat 104 in T type slide bar 103 surface sliding, make mobile seat 104 pull support top bar 106 drive cover plate 101 in cleaning tank 1 top rotation closing, make shower head 204 hang in wafer center position top, control electric push rod three 603 pull mobile sliding block 602 in corresponding limit sliding rod 601 surface sliding, make mobile sliding block 602 drive water guide plate 608 move to wafer top, when ultrasonic transmitter 609 stick wafer top, support water guide plate 608 drive compression plate 606 on installation column 605 surface move, extrude compression spring 607 deformation, under the spring back of compression spring 607 will compression plate 606 compress in mobile sliding block 602 top, so that ultrasonic transmitter 609 compress in wafer surface, start circulating water pump 2 simultaneously, through water guide pipe 201 pour cleaning liquid in sump 301 inside into circulating water pump 2 and pump into three way pipe 202, from three way pipe 202 pressurized pump into shower head 204, make cleaning liquid spray to wafer, start ultrasonic transmitter 609 and rotating motor 4, rotating motor 4 drive cross placement frame 5 rotation, make wafer rotate in ultrasonic transmitter 609 bottom, while ultrasonic transmitter 609 send ultrasonic wave impact wafer surface cleaning liquid, make cleaning liquid produce bubble, along with the breakage of bubble clean wafer surface impurity, so as to clean wafer surface completely;

[0048] The cleaning liquid after cleaning contains a large amount of particle impurities, the cleaning liquid mixed with particle impurities flows from the sink 102 to the mounting frame 302, is filtered through the filter screen 303, the impurities in the cleaning liquid are filtered on the top of the filter screen 303, the filtered cleaning liquid flows into the water collecting tank 301 for recycling, the particle impurities accumulated on the top of the filter screen 303 are easy to block the screen hole after a certain time of accumulation, the cleaning seat 306 reciprocally moves in the inner wall of the mounting frame 302 by starting the moving motor 305 to drive the reciprocating screw rod 304 to rotate, simultaneously drives the cleaning scraper 307 to reciprocally move on the top of the filter screen 303 to clean, pushes the particle impurities accumulated on the top of the filter screen 303 to move, avoids the particle impurities to be stationary on the top of the filter screen 303 to block the filter screen 303, and affects the filtering effect of the filter screen 303;

[0049] After the wafer cleaning is completed, the rotating motor 4 and the circulating water pump 2 are stopped, the control electric push rod one 105 is elongated to make the cover plate 101 rotate to open on the top of the cleaning tank 1, simultaneously the electric push rod three 603 pushes the moving slider 602 to make the water guide plate 608 away from the top of the wafer, and then the four electric push rod twos 504 are elongated to push the moving clamping block 507 to drive the elastic clamping block 509 away from the edge of the wafer, the wafer is taken off from the bottom of the pad block 501 for replacement, so that the batch wafers are sequentially cleaned.

Claims

1. A semiconductor wafer impurity cleaning device, comprising a cleaning tank (1), characterized in that: The top of the cleaning tank (1) is rotatably mounted on both sides via a pivot. A circulating water pump (2) is fixedly mounted on the bottom of one side of the cleaning tank (1). The input end of the circulating water pump (2) is connected to a water guide pipe (201), and the output end of the circulating water pump (2) is connected to a three-way water pipe (202). The surface of the three-way water pipe (202) is secured with multiple fixing buckles (203), and the fixing buckles (203) are fixedly connected to the surface of the cleaning tank (1) or the cover plate (101). The end of the three-way water pipe (202) away from the circulating water pump (2) passes through the cover plate (101) and is connected to a... The nozzle (204) is fixedly connected to the center of the top of the inner wall of the cover plate (101). Water collection tanks (3) are symmetrically fixed on both sides of the bottom of the cleaning tank (1). A rotating motor (4) is fixedly installed at the bottom of the cleaning tank (1). The output end of the rotating motor (4) extends through the bottom of the cleaning tank (1) into the interior of the cleaning tank (1). The output end of the rotating motor (4) is rotatably connected to the bottom of the cleaning tank (1) through a bearing. A cross placement bracket (5) is fixedly installed at the top of the rotating motor (4). A pressing cleaning mechanism (6) is fixedly installed at the top of the inner wall of the cleaning tank (1). A pad (501) is fixedly installed at the center of the top of the cross placement frame (5). Four support plates (502) are fixedly installed at equal angles at the bottom of the cross placement frame (5). A rotating seat (503) is fixedly installed at the bottom of one side of the support plate (502). An electric push rod (504) is rotatably installed inside the rotating seat (503) via a pin. A rotating seat (505) is rotatably installed at the end of the electric push rod (504) away from the rotating seat (503) via a pin. Four limiting grooves (506) are provided at equal angles on the top of the cross placement frame (5), and the limiting grooves (506) penetrate the cross placement frame (5). The limiting slide groove (506) has a movable card block (507) slidably installed inside, and the bottom of the movable card block (507) is fixedly connected to the rotating seat (505). The top side of the movable card block (507) is provided with a positioning insertion hole (508). The top of the movable card block (507) is provided with an elastic card block (509). The bottom side of the elastic card block (509) is provided with a positioning pin (510). The positioning pin (510) and the positioning insertion hole (508) are in the same position and have the same shape. The top of the elastic card block (509) is provided with a fixing bolt (511), and the fixing bolt (511) passes through the elastic card block (509) and is threadedly connected to the movable card block (507). The clamping and cleaning mechanism (6) includes two limiting slide rods (601), and both ends of the limiting slide rods (601) are fixedly connected to the inner wall of the cleaning tank (1). The surface of the limiting slide rods (601) is respectively slidably mounted with movable sliders (602). One side of the movable slider (602) is fixedly connected to the bottom of the limiting slide rod (601) with an electric push rod three (603), and the electric push rod three (603) is fixedly connected to the inner wall of the cleaning tank (1). The top of the movable slider (602) is fixedly mounted with a concave frame (604). An installation column (605) is fixedly installed between the top of the concave frame (604) and the top of the movable slider (602). A pressure plate (606) is slidably installed through the surface of the installation column (605), and a pressure spring (607) is sleeved on the surface of the installation column (605) at the top of the pressure plate (606). A water guide plate (608) is fixedly installed between the two pressure plates (606), and an ultrasonic transmitter (609) is provided at the bottom of the water guide plate (608).

2. The semiconductor wafer impurity cleaning equipment according to claim 1, characterized in that: The bottom of the cleaning tank (1) is provided with a water tank (102) at the center of both sides. T-shaped slide bars (103) are symmetrically fixedly installed on the top of both sides of the cleaning tank (1). A movable seat (104) is slidably installed through the surface of the T-shaped slide bar (103). Electric push rods (105) are fixedly installed on the bottom of the T-shaped slide bars (103) on both sides of the cleaning tank (1). One end of the electric push rod (105) is fixedly connected to the bottom of one side of the movable seat (104). A support top bar (106) is rotatably installed on the top of the movable seat (104) through a pin. The end of the support top bar (106) away from the movable seat (104) is rotatably connected to the cover plate (101) through a pin.

3. The semiconductor wafer impurity cleaning equipment according to claim 2, characterized in that: The water collection tank (3) is provided with a water collection trough (301) at the top. A mounting bracket (302) is fixedly installed on one side of the inner wall of the water collection trough (301). The mounting bracket (302) is connected to the lower water tank (102). A filter screen (303) is fixedly installed at the bottom of the mounting bracket (302). A reciprocating screw (304) is rotatably installed between the two sides of the inner wall of the mounting bracket (302) through a bearing. A moving motor (305) is fixedly installed on the outside of the water collection tank (3). The output end of the motor (305) passes through the water collection tank (3) and the mounting bracket (302) and is rotatably connected to the water collection tank (3) and the mounting bracket (302) through the bearing. The output end of the moving motor (305) is fixedly connected to the reciprocating screw (304). The surface of the reciprocating screw (304) located inside the mounting bracket (302) is threadedly connected to the cleaning seat (306). Three cleaning scrapers (307) are fixedly installed at the bottom of the cleaning seat (306), and the cleaning scrapers (307) are close to the filter screen (303).

4. A cleaning method for a semiconductor wafer impurity cleaning device, wherein the semiconductor wafer impurity cleaning device according to claim 3 is characterized in that, The cleaning method includes the following steps: The electric push rod (105) extends and pushes the movable seat (104) to slide on the surface of the T-shaped slide bar (103), causing the support top bar (106) to rotate on the top of the movable seat (104), lifting the cover plate (101) to rotate and open on both sides of the top of the cleaning tank (1), pouring an appropriate amount of cleaning liquid into the cleaning tank (1), so that the cleaning liquid flows into the water collection tank (301) through the drain tank (102), and select a suitable elastic block (509) as needed, and attach the elastic block (509) to the top of the movable block (507), so that the positioning pin (510) at the bottom of the elastic block (509) is inserted into the corresponding positioning hole (508) at the top of the movable block (507), and then tighten the fixing bolt (511) through the elastic block (509) and threadedly connect it to the movable block (507), thereby making The elastic block (509) is fixed on the top of the movable block (507). Repeat the steps to fix the openings of the four elastic blocks (509) relative to the top of the corresponding movable block (507). Then control the four electric push rods (504) to extend synchronously, lift the rotating seat (505), and push the movable block (507) to slide inside the corresponding limiting groove (506). This causes the four movable blocks (507) to move the elastic blocks (509) away from each other. The wafer is placed on the top of the pad (501), and the edge of the wafer rests on the opening of the elastic block (509). Control the four electric push rods (504) to retract synchronously, pull the movable block (507) to slide inside the limiting groove (506), and make the elastic block (509) stick to the edge of the wafer. This clamps and fixes the wafer on the top of the pad (501). Control the electric push rod one (105) to retract and pull the moving seat (104) to slide on the surface of the T-shaped slide bar (103), so that the moving seat (104) pulls the support top bar (106) and drives the cover plate (101) to rotate and close on the top of the cleaning tank (1), so that the nozzle (204) is suspended on the top of the wafer center position. Control the electric push rod three (603) to pull the moving slider (602) to slide on the surface of the corresponding limit slide bar (601), so that the moving slider (602) drives the water guide plate (608) to move to the top of the wafer. When the ultrasonic transmitter (609) is in contact with the top of the wafer, it lifts the water guide plate (608) and drives the pressure plate (606) to move up on the surface of the mounting post (605), squeezing the pressure spring (607) to deform. Under the rebound action of the pressure spring (607), the pressure plate (606) is pressed. At the top of the movable slider (602), the ultrasonic transmitter (609) is pressed against the wafer surface. At the same time, the circulating water pump (2) is started, and the cleaning fluid inside the water collection tank (301) is poured into the circulating water pump (2) through the water guide pipe (201) for pressurization and pumping into the three-way water pipe (202). The three-way water pipe (202) is pressurized and pumped into the nozzle (204) so ​​that the cleaning fluid is sprayed onto the wafer. The ultrasonic transmitter (609) and the rotating motor (4) are started. The rotating motor (4) drives the cross placement frame (5) to rotate, so that the wafer rotates at the bottom of the ultrasonic transmitter (609). At the same time, the ultrasonic transmitter (609) emits ultrasonic waves to impact the cleaning fluid on the wafer surface, causing bubbles to be generated in the cleaning fluid. As the bubbles burst, the impurities on the wafer surface are cleaned, thereby thoroughly cleaning the wafer surface. The cleaning solution contains a large number of particulate impurities. The cleaning solution mixed with particulate impurities flows from the drain tank (102) to the mounting frame (302). After being filtered by the filter screen (303), the impurities in the cleaning solution are filtered onto the top of the filter screen (303). The filtered cleaning solution flows into the collection tank (301) for recycling. The particulate impurities accumulated on the top of the filter screen (303) are prone to clogging the mesh after a certain period of time. By starting the moving motor (305) to drive the reciprocating screw (304) to rotate, the cleaning seat (306) moves back and forth on the inner wall of the mounting frame (302). At the same time, the cleaning scraper (307) moves back and forth on the top of the filter screen (303) to clean, pushing the particulate impurities accumulated on the top of the filter screen (303) to move, so as to avoid the particulate impurities remaining on the top of the filter screen (303) and clogging the filter screen (303), thus affecting the filtration effect of the filter screen (303). After the wafer cleaning is completed, stop rotating the motor (4) and circulating water pump (2), control the electric push rod one (105) to extend so that the cover plate (101) rotates and opens at the top of the cleaning tank (1), and at the same time control the electric push rod three (603) to push the moving slider (602) so that the water guide plate (608) moves away from the top of the wafer, and then control the four electric push rod two (504) to extend and push the moving block (507) to drive the elastic block (509) away from the edge of the wafer, and remove the wafer from the bottom of the pad (501) for replacement, so as to clean a batch of wafers in sequence.

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