Special tool and method for efficient machining of hemispherical harmonic oscillator based on generation method

Abstract

The invention provides a special tool and method for efficient machining of a hemispherical harmonic oscillator based on a generation method. The special tool comprises an inner spherical surface, an outer spherical surface and a lip edge machining tool. The inner spherical surface machining tool comprises a first cylindrical section, a first cylinder section and a first annular tool bit located at the free end of the first cylinder section, the section of the first annular tool bit is circular, and the diameter of the circle is larger than the wall thickness of the first cylinder section. The vertical line distance from the circle center to the outer wall surface of the first cylinder section is smaller than that from the circle center to the inner wall surface of the first cylinder section; the outer spherical surface machining tool comprises a second cylindrical section, a second cylindrical section and a second annular tool bit located at the free end of the second cylindrical section, the section of the second annular tool bit is in an L shape, the L-shaped turned edge faces the outer side face of the outer spherical surface machining tool, and the corner of the inner side wall face of the L shape is a 1 / 4 arc; the lip edge machining tool adopts a cylindrical tool bit; a diamond coating is laid on the tool bit. By designing the parameters of the tool bit of the special tool, the machining contact position is fixed, the size precision and the machining efficiency of the inner spherical surface and the outer spherical surface of the harmonic oscillator are improved, and the ultra-precision machining problem of the hemispherical harmonic oscillator is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of hemispherical resonator manufacturing, and relates to a special tool and method for efficient processing of hemispherical resonators based on the generation method, and specifically relates to a special tool and process for ultra-precision forming of hemispherical resonators with high precision and high efficiency. Background Art

[0002] The hemispherical resonant gyro is a vibration gyro based on the Coriolis effect. Compared with mainstream optical gyros, it has outstanding advantages such as small volume, low cost, and high reliability at the same precision, and is one of the research hotspots of inertial devices in recent years. The hemispherical resonator is the core sensitive component of the hemispherical resonant gyro, which is precisely processed from quartz glass, and its surface topography and processing precision directly affect the gyro performance. Summary of the Invention

[0003] The purpose of the present invention is to provide a special tool and method for efficient processing of hemispherical resonators based on the generation method, and solve the ultra-precision processing problem of the hemispherical resonator, which is the core component of the hemispherical resonant gyro.

[0004] The technical solutions adopted by the present invention to achieve the above purpose are as follows:

[0005] As one aspect of the present invention, a special tool for efficient processing of hemispherical resonators based on the generation method is provided, including an inner spherical surface processing tool, an outer spherical surface processing tool, and a lip edge processing tool;

[0006] The inner spherical surface processing tool includes a first cylindrical section, a first cylindrical tube section connected to the first cylindrical section, and a first annular cutter head located at the free end of the first cylindrical tube section. The cross-section of the first annular cutter head is circular, the diameter of the circle is greater than the wall thickness of the first cylindrical tube section, and the perpendicular distance from the center of the circle to the outer wall surface of the first cylindrical tube section is less than the perpendicular distance from the center of the circle to the inner wall surface of the first cylindrical tube section;

[0007] The outer spherical surface processing tool includes a second cylindrical section, a second cylindrical tube section connected to the second cylindrical section, and a second annular cutter head located at the free end of the second cylindrical tube section. The cross-section of the second annular cutter head is L-shaped, the L-shaped flange faces the outer side of the outer spherical surface processing tool, and the inner side wall surface corner of the L-shaped is a 1 / 4 arc;

[0008] The lip edge processing tool uses a cylindrical cutter head;

[0009] The first annular cutter head, the second annular cutter head, and the cylindrical cutter head are coated with diamond coatings.

[0010] Further, the circular radius of the first annular cutter head is R1, and the value range of R1 is 0.5r1 to 0.8r1, where r1 is the inner fillet radius of the hemispherical resonator. The perpendicular distance from the center of the circle of the first annular cutter head to the plane where the inner edge of the first cylindrical section is located is h, and the value range of h is 0.1r2 to 0.15r2, where r2 is the inner spherical radius of the hemispherical resonator;

[0011] The distance from the center of the circle of the first annular cutter head to the axis of the first cylindrical section is d1, and the value range of d1 is 0.4r2 to 0.6r2.

[0012] Further, the 1 / 4 arc radius of the second annular cutter head is R2, and the value range of R2 is 0.5r3 to 0.8r3, where r3 is the outer fillet radius of the hemispherical resonator;

[0013] The distance from the center of the 1 / 4 arc of the second annular cutter head to the axis of the second cylindrical section is d2, and the value range of d2 is 0.8r4 to 0.95r4, where r4 is the outer spherical radius of the hemispherical resonator.

[0014] Further, the first cylindrical section of the inner spherical surface machining tool is also coated with a diamond coating to reduce the process machining difficulty.

[0015] Further, the first annular cutter head is used in the rough machining stage, and the diamond grain size of the coating is 100 mesh to 300 mesh. The first annular cutter head is used in the finish machining stage, and the diamond grain size of the coating is W3 mesh;

[0016] The second annular cutter head is used in the rough machining stage, and the diamond grain size of the coating is 150 mesh to 280 mesh. The second annular cutter head is used in the finish machining stage, and the diamond grain size of the coating is W3 mesh;

[0017] The diamond grain size of the coating of the cylindrical cutter head is W2.5 mesh in both the rough machining stage and the finish machining stage.

[0018] On the other hand, the present invention also provides an efficient machining method for a hemispherical resonator based on the generation method, including the following steps:

[0019] Install the inner spherical surface machining tool, the outer spherical surface machining tool, and the lip edge machining tool into a five-axis machining center;

[0020] Vertically clamp the hemispherical resonator on the B axis of the five-axis machining center. Taking the position of the highest point of the inner support column of the hemispherical resonator and the machining allowance of the inner support column as a reference, set the center of the inner spherical surface of the hemispherical resonator as the machining zero point;

[0021] The hemispherical resonator rotates by a set angle around the machining zero point, adjusts the central axis of the inner spherical surface machining tool for rough machining to align with the machining zero point, and rough-machines the inner spherical surface of the hemispherical resonator;

[0022] Adjust the alignment of the inner spherical surface machining tool for finish machining to the machining zero point, and perform finish machining on the inner spherical surface of the hemispherical resonator;

[0023] Rotate the hemispherical resonator 90° around the machining zero point so that the axis of the hemispherical resonator is perpendicular to the central axis of the outer spherical surface machining tool. Adjust the central axis of the outer spherical surface machining tool for rough machining to align with the machining zero point, and perform rough machining on the outer spherical surface of the hemispherical resonator;

[0024] Adjust the alignment of the outer spherical surface machining tool for finish machining to the machining zero point, and perform finish machining on the outer spherical surface of the hemispherical resonator;

[0025] Adjust the hemispherical resonator to be vertical, and adjust the lip edge machining tool to perform finish machining on the lip edge.

[0026] Further, after the inner spherical surface machining tool, the outer spherical surface machining tool, and the lip edge machining tool are installed on the five-axis machining center, set the tool length according to the machining requirements.

[0027] Further, for rough machining the inner spherical surface of the hemispherical resonator, the rotational speed of the rough machining inner spherical surface machining tool is 2000 - 3000 r / min, the feed rate is 1 - 2 mm / min, and the rotational speed of the hemispherical resonator is 90 - 100 r / min;

[0028] For finish machining the inner spherical surface of the hemispherical resonator, the rotational speed of the finish machining inner spherical surface machining tool is 9000 - 10000 r / min, 0.2 - 0.5 mm / min, and the rotational speed of the hemispherical resonator is 60 - 70 r / min.

[0029] Further, for rough machining the outer spherical surface of the hemispherical resonator, the rotational speed of the rough machining outer spherical surface machining tool is 2000 - 3000 r / min, the feed rate is 2 - 3 mm / min, and the rotational speed of the hemispherical resonator is 90 - 100 r / min;

[0030] For finish machining the outer spherical surface of the hemispherical resonator, the rotational speed of the finish machining outer spherical surface machining tool is 10000 - 12000 r / min, 0.15 - 0.2 mm / min, and the rotational speed of the hemispherical resonator is 60 - 70 r / min.

[0031] Further, for the lip edge machining tool to perform finish machining on the lip edge, the rotational speed of the lip edge machining tool is 10000 - 12000 r / min, the feed rate is 0.1 - 0.15 mm / min, and the rotational speed of the hemispherical resonator is 40 - 50 r / min.

[0032] Advantages of the present invention compared with the prior art:

[0033] Based on the principle of generating method for machining hemispherical resonators, the present invention provides a high-precision and high-efficiency machining tool and method for hemispherical resonators, aiming to improve the mass production capacity of resonators and provide strong technical support for the engineering application of hemispherical resonant gyroscopes. The present invention has the following advantages:

[0034] (1) According to the structural characteristics of the resonator, the present invention designs a special tool for machining hemispherical resonators based on the generating method. Through the design of the spherical tool head at the machining position of the inner spherical surface of the hemispherical resonator, the fixed machining contact position can be achieved, thereby improving the dimensional accuracy and machining efficiency of the inner spherical surface of the resonator, ensuring the stability of the machining process, and avoiding interference during the cutting process of the tool. Through the design of the L-shaped tool head at the machining position of the outer spherical surface of the hemispherical resonator, the fixed machining contact position can be achieved, thereby improving the dimensional accuracy of the outer spherical surface of the resonator.

[0035] (2) The grain size design scheme of the special tool for machining hemispherical resonators based on the generating method proposed in the present invention can effectively maintain the tool life compared with the prior art, reduce the number of tool changes during the machining process, is conducive to maintaining the stability of the machining state, and has great value for the mass production of hemispherical resonators.

[0036] (3) The machining process parameters of each functional structure of the hemispherical resonator proposed in the present invention can achieve the machining of the resonator under the single-axis feed motion, avoid introducing multi-axis linkage errors, and can improve the machining efficiency while ensuring the machining accuracy of the resonator. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The included drawings are used to provide a further understanding of the embodiments of the present invention, which form a part of the specification, are used to illustrate the embodiments of the present invention, and are used to explain the principle of the present invention together with the text description. Obviously, the drawings in the following description are only some embodiments of the present invention, and those of ordinary skill in the art can obtain other drawings without creative efforts based on these drawings.

[0038] Figure 1 Schematic diagram of the functional structure of the hemispherical resonator provided for the specific embodiment of the present invention;

[0039] Figure 2 Schematic diagram of the structure of the tool for machining the inner spherical surface of the hemispherical resonator provided for the specific embodiment of the present invention, (a) is the front view, (b) is the bottom view;

[0040] Figure 3 Schematic diagram of the cross-section of the tool head of the tool for machining the inner spherical surface of the hemispherical resonator provided for the specific embodiment of the present invention;

[0041] Figure 4 Schematic diagram of the structure of the tool for machining the outer spherical surface of the hemispherical resonator provided for the specific embodiment of the present invention, (a) is the front view, (b) is the bottom view;

[0042] Figure 5 Schematic diagram of the cross-section of the tool tip of the tool for machining the outer spherical surface of the hemispherical resonator provided by the specific embodiment of the present invention;

[0043] Figure 6 Schematic diagram of the structure of the tool for machining the lip edge of the hemispherical resonator provided by the specific embodiment of the present invention, (a) is the front view, (b) is the bottom view;

[0044] Figure 7 Schematic diagram of the tool path for machining the inner spherical surface of the hemispherical resonator and the motion states of the resonator and the tool provided by the specific embodiment of the present invention;

[0045] Figure 8 Schematic diagram of the tool path for machining the outer spherical surface of the hemispherical resonator and the motion states of the resonator and the tool provided by the specific embodiment of the present invention;

[0046] Figure 9 Schematic diagram of the tool path for machining the lip edge of the hemispherical resonator and the motion states of the resonator and the tool provided by the specific embodiment of the present invention. Specific embodiments

[0047] The following details the specific embodiments of the present invention. In the following description, for purposes of explanation rather than limitation, specific details are set forth in order to provide a thorough understanding of the present invention. However, it will be apparent to those skilled in the art that the present invention may be practiced in other embodiments without these specific details.

[0048] It should be noted here that in order to avoid obscuring the present invention with unnecessary details, only the device structures and / or processing steps closely related to the solution of the present invention are shown in the drawings, while other details less related to the present invention are omitted.

[0049] In response to the ultra-precision machining requirements of the core component, the hemispherical resonator, of the hemispherical resonator gyroscope, the present invention provides a special tool and process for high-precision and high-efficiency machining of the hemispherical resonator based on the generation method, which can greatly improve the machining efficiency while maintaining the machining accuracy, and provide technical support for the engineering application of the hemispherical resonator gyroscope.

[0050] The structure of the hemispherical resonator is as Figure 1 shown, which is a thin-walled shell with a central support column. The central support column is used as the positioning reference. The inner spherical surface, the outer spherical surface and the lip edge are its functional structures. The inner spherical surface and the central support column are connected by a small transition arc. It should be noted that the part of the central support column located inside the hemispherical resonator is the inner support column, and the part located outside the hemispherical resonator is the outer support column. The connection between the inner support column and the inner spherical surface adopts an inner fillet transition, and the connection between the outer support column and the outer spherical surface adopts an outer fillet transition.

[0051] As one aspect of the present invention, a special tool for processing a hemispherical resonator based on the Fancheng method is provided. Figures 2 to 6 As shown, it includes a hemispherical resonator inner sphere processing tool 1, a hemispherical resonator outer sphere processing tool 2 and a hemispherical resonator lip edge processing tool 3.

[0052] The inner spherical surface machining tool 1 of the hemispherical resonator is designed according to the structural characteristics of the hemispherical resonator and the basic principle of the Fancheng method machining. Figure 2 As shown, the base 11 of the hemispherical resonator inner sphere machining tool 1 includes a first cylindrical section, a first cylinder section connected to the first cylindrical section, and a first annular cutter head located at the free end of the first cylinder section (the free end of the cylinder section is the end of the cylinder section away from the cylinder section). The base 11 of the hemispherical resonator inner sphere machining tool 1 is made of brass material, and the first cylinder section and the first annular cutter head are both coated with a coating 12, and the coating arrangement can reduce the difficulty of machining.

[0053] In particular, in order to ensure that the contact position of the hemispherical resonator inner spherical surface machining tool 1 with the resonator is fixed during the machining process, and to increase the contact area, ensure the dimensional accuracy of the resonator, and improve the machining efficiency, the present invention designs the working position (i.e., the tool head) of the hemispherical resonator inner spherical surface machining tool 1 to be spherical, such as Figure 3 As shown, the cross section of the first annular cutter head (the cross section is the longitudinal cross section of the first annular cutter head along the axis direction of the inner spherical surface machining tool) is circular, and the circular diameter is greater than the wall thickness of the first cylindrical segment, so that the circular contour protrudes from the inner and outer wall surfaces of the first cylindrical segment, thereby ensuring that the first annular cutter head directly contacts the inner surface of the hemispherical resonator; and the perpendicular distance from the center of the circle to the outer wall surface of the first cylindrical segment is less than the perpendicular distance from the center of the circle to the inner wall surface of the first cylindrical segment, so that the center of the circle is biased toward the outside of the hemispherical resonator inner spherical surface machining tool 1, which can enhance the cutting ability of the hemispherical resonator. It should be noted that the circular cross section of the first annular cutter head is a partial circular contour, and its area exceeds half of the circle, so that the hemispherical resonator inner spherical surface machining tool 1 only has the cutter head in contact with the inner spherical surface of the hemispherical resonator.

[0054] Further, the circular radius R1 value and the spherical center height value h (h is the perpendicular distance from the circular spherical center of the first annular cutter head to the plane where the inner wall edge of the first cylindrical section is located) of the first annular cutter head are optimized. The R1 value is obtained according to the inner fillet radius of the harmonic oscillator, and the value range is 0.5r1 to 0.8r1, where r1 is the inner fillet radius of the hemispherical harmonic oscillator. The spherical center height value h is obtained according to the position of the inner fillet of the harmonic oscillator, and the value range of h is 0.1r2 to 0.15r2, where r2 is the inner spherical radius of the hemispherical harmonic oscillator. In addition, the distance d1 from the circular spherical center of the first annular cutter head to the axis of the first cylindrical section ranges from 0.4r2 to 0.6r2. Thus, it can ensure that the contact position of the inner spherical surface machining tool 1 of the hemispherical harmonic oscillator is fixed, and thus ensure the dimensional accuracy and machining efficiency of the harmonic oscillator. In the rough machining stage, the coating particle size of the inner spherical surface machining tool 1 of the hemispherical harmonic oscillator is selected as diamond particles with a mesh size of 100 to 300 meshes to achieve rapid material removal. In the finish machining stage, the coating particle size of the inner spherical surface machining tool 1 of the hemispherical harmonic oscillator is selected as diamond particles with a mesh size of W3 to improve the surface roughness and dimensional accuracy and meet the design requirements.

[0055] The outer spherical surface machining tool 2 of the hemispherical harmonic oscillator is designed according to the structural characteristics of the hemispherical harmonic oscillator and the basic principle of generating method as Figure 4 shown. Among them, the substrate 21 of the outer spherical surface machining tool 2 of the hemispherical harmonic oscillator includes a second cylindrical section, a second cylindrical section connected to the second cylindrical section, and a second annular cutter head located at the free end of the second cylindrical section (that is, the end of the cylindrical section far from the cylindrical section). The substrate 21 of the outer spherical surface machining tool 2 of the hemispherical harmonic oscillator is made of brass material, and a coating 22 is deposited on the second annular cutter head.

[0056] Particularly, to ensure that the contact position of the outer spherical surface machining tool 2 of the hemispherical harmonic oscillator with the harmonic oscillator is fixed during the machining process and ensure the dimensional accuracy of the harmonic oscillator, the working position of the outer spherical surface machining tool 2 of the hemispherical harmonic oscillator is designed as a hemispherical shape, as Figure 5 shown. The cross-section of the second annular cutter head (this cross-section is the longitudinal cross-section of the annular cutter head along the axis direction of the inner spherical surface machining tool) is L-shaped, the L-shaped flanging faces the outer side of the outer spherical surface machining tool, and the inner wall surface corner of the L-shape is a 1 / 4 arc. Among them, the curvature radius R2 of the 1 / 4 arc is obtained according to the outer fillet radius of the harmonic oscillator, and the value range of R2 is 0.5r3 to 0.8r3, where r3 is the outer fillet radius of the hemispherical harmonic oscillator; the distance d2 from the center of the 1 / 4 arc of the outer spherical surface machining tool to the axis of the second cylindrical section is obtained according to the outer spherical radius of the harmonic oscillator, and the value range of d2 is 0.8r4 to 0.95r4, where r4 is the outer spherical radius of the hemispherical harmonic oscillator. In the rough machining stage, the coating particle size of the outer spherical surface machining tool 2 of the hemispherical harmonic oscillator is selected as diamond particles with a mesh size of 150 to 280 meshes to achieve rapid material removal. In the finish machining stage, the coating particle size of the outer spherical surface machining tool of the hemispherical harmonic oscillator is selected as diamond particles with a mesh size of W3 to improve the surface roughness and dimensional accuracy and meet the design requirements.

[0057] The lip edge machining tool 3 for the hemispherical resonator is designed according to the structural characteristics of the hemispherical resonator and the basic principle of generating method as shown in Figure 6 the following figure. The lip edge machining tool uses a cylindrical cutter head. Among them, the base body 31 of the outer spherical surface machining tool 3 for the hemispherical resonator is made of brass material, and the cylindrical cutter head is coated with a coating 32. The lip edge of the hemispherical resonator undertakes the driving and detection functions and has relatively high requirements for surface roughness. Therefore, the coating of the cylindrical cutter head selects a W2.5 mesh tool to meet the application requirements.

[0058] The special tool provided by the present invention can realize the precision and rapid forming of the hemispherical resonator based on the generating method. The special tool and the resonator perform a generating grinding motion, and the envelope surface formed during the generating motion of the tool and the resonator is the inner and outer spherical surfaces of the resonator. When machining based on the generating method, the special tool and the resonator are in line contact, which can greatly improve the machining efficiency while ensuring high precision, and can complete the forming machining of the inner and outer spherical surfaces and the lip edge under one clamping, and is suitable for mass production of hemispherical resonators.

[0059] As another aspect of the present invention, an efficient machining method for a hemispherical resonator based on the generating method is also provided. The machining steps include:

[0060] (1) Confirm that there is no sand dropping, protrusion and other abnormal phenomena on the tool;

[0061] (2) Clamp the inner spherical surface machining tool and the outer spherical surface machining tool of the hemispherical resonator to the tool holder respectively, and the tool mounting height is 35 mm;

[0062] (3) Install the inner spherical surface machining tool and the outer spherical surface machining tool of the hemispherical resonator on the main shaft in sequence, and use a tool setter to measure the tool length;

[0063] (4) Vertically clamp the hemispherical resonator on the B axis of the five-axis machining center, use an on-line probe to detect the highest point of the inner support column of the resonator, and then calculate the center positions of the inner and outer spherical surfaces of the resonator according to the remaining machining allowance, and establish a machining coordinate system (construct the X axis in the horizontal direction and the Y axis vertically upward) with this position as the machining zero point;

[0064] (5) Rough-machine the inner spherical surface of the hemispherical resonator. Swing the hemispherical resonator to the designed angle (this designed angle is determined based on experience or simulation tests). At the same time, convert the coordinate system in step (4) according to the designed angle along with the resonator, establish the zero point for inner spherical surface machining, call the rough machining tool for the inner spherical surface of the hemispherical resonator, align the central axis of the rough machining tool for the inner spherical surface of the hemispherical resonator with the zero point for inner spherical surface machining, select a spindle speed of 2000 - 3000 r / min, a turntable speed of 90 - 100 r / min, let the hemispherical resonator rotate with the turntable, and a tool feed rate of 1 - 2 mm / min. The tool path for downward feed and the motion states of the resonator and the tool are as Figure 7 shown, and complete the rough machining of the inner spherical surface;

[0065] (6) Call the finish machining tool for the inner spherical surface of the hemispherical resonator, select a spindle speed of 9000 - 10000 r / min, a turntable speed of 60 - 70 r / min, and a tool feed rate of 0.2 - 0.5 mm / min. The tool path for downward feed and the motion states of the resonator and the tool are as Figure 7 shown, and complete the finish grinding of the inner spherical surface;

[0066] (7) Then, rough-machine the outer spherical surface of the hemispherical resonator. Swing the hemispherical resonator by 90°, convert the coordinate system in step (4) by 90°, establish the zero point for outer spherical surface machining, call the rough machining tool for the outer spherical surface of the hemispherical resonator, select a spindle speed of 2000 - 3000 r / min, a turntable speed of 90 - 100 r / min, and a tool feed rate of 2 - 3 mm / min. The tool path for downward feed and the motion states of the resonator and the tool are as Figure 8 shown, and complete the roughing of the outer spherical surface;

[0067] (8) Call the finish machining tool for the outer spherical surface of the hemispherical resonator, select a spindle speed of 10000 - 12000 r / min, a tool feed rate of 0.15 - 0.2 mm / min, and a turntable speed of 60 - 70 r / min. The tool path for downward feed and the motion states of the resonator and the tool are as Figure 8 shown, and complete the finish machining of the outer spherical surface;

[0068] (9) Perform the finish machining of the lip edge of the hemispherical resonator. Make the hemispherical resonator vertical, call the finish machining tool for the lip edge of the hemispherical resonator, select a spindle speed of 10000 - 12000 r / min, a turntable speed of 40 - 50 r / min, and a tool feed rate of 0.1 - 0.15 mm / min. The machining tool path is as Figure 9 shown, and complete the machining of the lip edge.

[0069] The processing process parameters of each functional structure of the hemispherical resonator proposed in this embodiment (specifically including the tool rotation speed, feed speed, and hemispherical resonator rotation speed) can achieve the processing of the resonator under uniaxial feed motion, avoid introducing multi-axis linkage errors, and improve the processing efficiency while ensuring the processing accuracy of the resonator.

[0070] Features described and / or illustrated for one embodiment as above can be used in the same or similar manner in one or more other embodiments, and / or combined with features in other embodiments or used to replace features in other embodiments.

[0071] It should be emphasized that the term "comprising / including" when used herein refers to the presence of features, whole things, steps or components, but does not exclude the presence or addition of one or more other features, whole things, steps, components or combinations thereof.

[0072] Many features and advantages of these embodiments are clear from this detailed description, and thus the appended claims are intended to cover all such features and advantages of these embodiments that fall within their true spirit and scope. In addition, since many modifications and changes are readily envisioned by those skilled in the art, the embodiments of the present invention are not to be limited to the exact structures and operations illustrated and described, but may cover all suitable modifications and equivalents that fall within their scope.

[0073] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, the present invention may have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

[0074] The parts not detailed in the present invention are well-known technologies to those skilled in the art.

Claims

1. A special tool for efficient machining of hemispherical resonators based on the generation method, characterized in that, It includes an inner spherical surface machining tool, an outer spherical surface machining tool, and a lip edge machining tool; The inner spherical surface machining tool includes a first cylindrical section, a first cylindrical tube section connected to the first cylindrical section, and a first annular cutter head located at the free end of the first cylindrical tube section. The cross-section of the first annular cutter head is circular, the diameter of the circle is greater than the wall thickness of the first cylindrical tube section, and the perpendicular distance from the center of the circle to the outer wall surface of the first cylindrical tube section is less than the perpendicular distance from the center of the circle to the inner wall surface of the first cylindrical tube section; The outer spherical surface machining tool includes a second cylindrical section, a second cylindrical tube section connected to the second cylindrical section, and a second annular cutter head located at the free end of the second cylindrical tube section. The cross-section of the second annular cutter head is L-shaped, the L-shaped flange faces the outer side surface of the outer spherical surface machining tool, and the inner side wall surface corner of the L-shaped is a 1 / 4 circular arc; The lip edge machining tool uses a cylindrical cutter head; The first annular cutter head, the second annular cutter head, and the cylindrical cutter head are coated with diamond coatings.

2. The special tool according to claim 1, characterized in that, The circular radius of the first annular cutter head is R1, and the value range of R1 is 0.5r1 to 0.8r1, where r1 is the inner fillet radius of the hemispherical resonator. The perpendicular distance from the center of the circle of the first annular cutter head to the plane where the inner edge of the first cylindrical tube section is located is h, and the value range of h is 0.1r2 to 0.15r2, where r2 is the inner spherical surface radius of the hemispherical resonator; The distance from the center of the circle of the first annular cutter head to the axis of the first cylindrical tube section is d1, and the value range of d1 is 0.4r2 to 0.6r2.

3. The special tool according to claim 1, wherein The 1 / 4 circular arc radius of the second annular cutter head is R2, and the value range of R2 is 0.5r3 to 0.8r3, where r3 is the outer fillet radius of the hemispherical resonator; The distance from the center of the 1 / 4 circular arc of the second annular cutter head to the axis of the second cylindrical tube section is d2, and the value range of d2 is 0.8r4 to 0.95r4, where r4 is the outer spherical surface radius of the hemispherical resonator.

4. The special tool according to claim 1, characterized in that, The first cylindrical tube section of the inner spherical surface machining tool is also coated with a diamond coating.

5. The special tool according to claim 1, characterized in that, The first annular cutter head is used in the rough machining stage, and the diamond grain size of the coating is 100 mesh to 300 mesh. The first annular cutter head is used in the finish machining stage, and the diamond grain size of the coating is W3 mesh; The second annular cutter head is used in the rough machining stage, and the diamond grain size of the coating is 150 mesh to 280 mesh. The second annular cutter head is used in the finish machining stage, and the diamond grain size of the coating is W3 mesh; For the cylindrical cutter head in the rough machining stage and the finish machining stage, the diamond grain size of the coating is W2.5 mesh.

6. An efficient processing method for a hemispherical resonator based on the generation method, characterized in that, It includes the following steps: Install the inner spherical surface machining tool, the outer spherical surface machining tool, and the lip edge machining tool into a five-axis machining center; Vertically clamp the hemispherical resonator on the B axis of the five-axis machining center. Taking the position of the highest point of the inner support column of the hemispherical resonator and the machining allowance of the inner support column as references, set the center of the inner spherical surface of the hemispherical resonator as the machining zero point; The hemispherical resonator rotates by a set angle around the machining zero point, adjust the center axis of the inner spherical surface machining tool for rough machining to align with the machining zero point, and perform rough machining on the inner spherical surface of the hemispherical resonator; Adjust the inner spherical surface machining tool for finish machining to align with the machining zero point, and perform finish machining on the inner spherical surface of the hemispherical resonator; The hemispherical resonator is rotated 90° around the machining zero point so that the axis of the hemispherical resonator is perpendicular to the axis of the cutting tool center for machining the outer spherical surface. Adjust the axis of the cutting tool center for rough machining the outer spherical surface to align with the machining zero point, and perform rough machining on the outer spherical surface of the hemispherical resonator; Adjust the cutting tool for finish machining the outer spherical surface to align with the machining zero point, and perform finish machining on the outer spherical surface of the hemispherical resonator; Adjust the hemispherical resonator to be vertical, and adjust the cutting tool for machining the lip edge to perform finish machining on the lip edge.

7. The method according to claim 6, wherein After the cutting tool for machining the inner spherical surface, the cutting tool for machining the outer spherical surface, and the cutting tool for machining the lip edge are installed on the five-axis machining center, set the tool length according to the machining requirements.

8. The method according to claim 6, wherein For rough machining the inner spherical surface of the hemispherical resonator, the rotational speed of the cutting tool for rough machining the inner spherical surface is 2000 - 3000 r / min, the feed rate is 1 - 2 mm / min, and the rotational speed of the hemispherical resonator is 90 - 100 r / min; For finish machining the inner spherical surface of the hemispherical resonator, the rotational speed of the cutting tool for finish machining the inner spherical surface is 9000 - 10000 r / min, 0.2 - 0.5 mm / min, and the rotational speed of the hemispherical resonator is 60 - 70 r / min.

9. The method according to claim 6, wherein For rough machining the outer spherical surface of the hemispherical resonator, the rotational speed of the cutting tool for rough machining the outer spherical surface is 2000 - 3000 r / min, the feed rate is 2 - 3 mm / min, and the rotational speed of the hemispherical resonator is 90 - 100 r / min; For finish machining the outer spherical surface of the hemispherical resonator, the rotational speed of the cutting tool for finish machining the outer spherical surface is 10000 - 12000 r / min, 0.15 - 0.2 mm / min, and the rotational speed of the hemispherical resonator is 60 - 70 r / min.

10. The method according to claim 6, wherein For the cutting tool for machining the lip edge to perform finish machining on the lip edge, the rotational speed of the cutting tool for machining the lip edge is 10000 - 12000 r / min, the feed rate is 0.1 - 0.15 mm / min, and the rotational speed of the hemispherical resonator is 40 - 50 r / min.

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