Electronic component aging test equipment

Abstract

The invention relates to the technical field of electronic component testing, in particular to electronic component aging testing equipment which comprises a supporting seat and a testing workbench, a centrifugal rotating mechanism is arranged on the supporting seat, and the testing workbench is connected to the centrifugal rotating mechanism; a plurality of testing stations are arranged on the testing workbench, a plurality of connecting terminals are arranged on each testing station, and the heights of the lower ends of the connecting terminals located on the same side are sequentially decreased; the lower ends of the connecting terminals of the plurality of test stations which are located at the same side and the lower ends of which are located at the same height are electrically connected with a test electric column; the centrifugal rotating mechanism drives the test workbench to rotate centrifugally, and can simulate a gravitational acceleration environment in aviation flight; the same test station is provided with a plurality of connecting terminals with decreasing heights, and the connecting terminals can be connected with a plurality of test electric columns in a penetrating manner, so that multi-pin synchronous test is realized; according to the invention, centrifugal rotation dynamic test, multi-pin synchronous test and heat dissipation optimization are combined, so that the efficiency and accuracy of the aging test of the electronic component are remarkably improved.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic component testing, and particularly to an electronic component aging test equipment. Background Art

[0002] An electronic component is a basic unit that constitutes an electronic circuit. It is usually independently packaged and has two or more leads or metal contacts, and needs to be interconnected through soldering (such as printed circuit boards) and other methods to achieve specific functions (such as amplification, oscillation, etc.). With the development of electronic technology, the requirements for the stability and reliability of electronic components are getting higher and higher, especially for products used in the aerospace industry. Through high-temperature electrical aging tests on electronic component products, defects and potential hazards in the internal electrodes of the components can be exposed in advance, ensuring that the products leaving the factory can withstand the test of time, which is of great significance for improving the stability and reliability of the products. In order to simulate the process of gradual aging of internal components of electronic products due to various factors (such as the influence of temperature changes and electrical stress, etc.) during long-term operation in the actual use environment, and the impact on the performance and life of the products, the aging test device applies a certain electrical stress to the electronic products to accelerate the aging process of the products and evaluate the performance of the products in a short time.

[0003] The publicly disclosed Chinese patent with the publication number CN106405274B discloses an electronic component aging test device, including: a carrier plate and side guide plates. When using this electronic component aging test device, there is no need to solder the electronic components on the PCB board for aging tests. Just place the electronic components in the installation slots, electrically connect the two end electrodes of the electronic components through the side conductive pins and the middle conductive plate respectively, and then connect to an external power supply to perform current aging tests. This publicly disclosed patent realizes non-welding aging tests through the carrier plate, side guide plates, conductive pins and the middle conductive plate. The side conductive pins and the middle conductive plate are respectively connected to the two end electrodes of the electronic components, supporting batch testing; the upper guide plate is equipped with upper conductive pins, which can be connected to the middle electrode, supporting voltage testing.

[0004] However, the technical solution provided by this publicly disclosed invention still has the following limitations:

[0005] 1. For the electronic components of products used in the aerospace industry, the dynamic gravitational acceleration environment during air flight cannot be simulated, resulting in a deviation between the test conditions and the actual working conditions, affecting the authenticity of the aging test;

[0006] 2. Each test can only be for a single item. In the actual test process, the test duration for a single item is about four hours. For multi-pin components, repeated operations are required, which is time-consuming and inefficient. Summary of the Invention

[0007] In view of the above-mentioned disadvantages of the prior art, the purpose of the present invention is to provide an electronic component aging test equipment. By installing a centrifugal rotation mechanism on the support base and driving the centrifugal rotation mechanism to drive the test workbench to rotate centrifugally through a driving motor, it can simulate the dynamic gravitational acceleration environment during air flight. And during the simulation process, the gravitational acceleration conditions can be adjusted as needed by adjusting the output speed of the driving motor, improving the authenticity of the aging test. By respectively arranging a plurality of connection terminals with decreasing heights on both sides of the same test station, the test electric columns respectively inserted on the plurality of connection terminals can independently control different test items, realizing synchronous testing of multiple pins, and significantly improving the efficiency. The design of decreasing the height of the connection terminals can avoid interference between multiple test electric columns and optimize the layout of the test structure. And one test electric column is simultaneously inserted into the lower ends of the connection terminals of multiple test stations on the same side and with the same lower height, enabling synchronous measurement of the electronic components of multiple test stations and improving the consistency of batch electronic component testing. It is used to solve the problems in the prior art that the authenticity of the aging test cannot be simulated due to the dynamic gravitational acceleration environment during air flight, and the single test can only target a single project, which is time-consuming and inefficient.

[0008] To achieve the above object and other related objects, the present invention provides an electronic component aging test equipment, including two support bases and a test workbench arranged between the two support bases;

[0009] Centrifugal rotation mechanisms are provided on both of the two support bases, and both ends of the test workbench are connected to the centrifugal rotation mechanisms. The test workbench is driven by the centrifugal rotation mechanisms to rotate centrifugally to simulate the gravitational acceleration environment during air flight;

[0010] A plurality of test stations are provided on the test workbench. A plurality of connection terminals are provided on a single test station, and the lower ends of the plurality of connection terminals on the same side decrease in height in sequence;

[0011] One test electric column is electrically connected to the lower ends of the connection terminals of multiple test stations on the same side and with the same lower height, and a single test electric column controls one test item correspondingly.

[0012] In an embodiment of the present invention, both of the two centrifugal rotation mechanisms include a rotating shaft and an eccentric wheel sleeved on the rotating shaft. The rotating shaft is installed on the support base through a rotating connecting piece, and the test workbench is movably connected to the eccentric wheel through a pin shaft.

[0013] In an embodiment of the present invention, a driving motor is installed on one of the support bases, and the output end of the driving motor is connected to the rotating shaft of the centrifugal rotation mechanism at the corresponding position;

[0014] A slip ring is provided on the other support base, and the test electric column is rotationally connected to the test equipment through the slip ring.

[0015] In an embodiment of the present invention, a wiring hole is provided at one end of the test workbench close to the slip ring, and the wire connected to the test electric column is led out through the wiring hole.

[0016] In an embodiment of the present invention, a rectangular pad is provided on the test workbench, and the pad penetrates through multiple test stations at the same time, and the encapsulation body of the electronic component is placed on the pad.

[0017] In an embodiment of the present invention, a U-shaped pressing plate is fitted on the upper end of the ceramic pad, and the pressing plate presses on the upper ends of multiple electronic component encapsulation bodies at the same time; the pad and the pressing plate are detachably connected by bolts.

[0018] In an embodiment of the present invention, both the pad and the pressing plate are made of ceramic materials with thermal conductivity and insulation properties.

[0019] In an embodiment of the present invention, a through hole is provided in the upper end area of the test workbench corresponding to the connection terminal, and the lead of the electronic component passes through the through hole and is inserted into the connection terminal.

[0020] In an embodiment of the present invention, a convex portion is provided on one side of the lower end of the connection terminal, and the directions of the convex portions provided at the lower ends of two adjacent connection terminals are opposite; the test electric column is inserted through the convex portion.

[0021] In an embodiment of the present invention, several convex platforms are provided in the test workbench, and the convex platforms support the lower ends of the connection terminals.

[0022] As described above, the electronic component aging test equipment of the present invention has the following beneficial effects:

[0023] 1. By installing a centrifugal rotation mechanism on the support base in the present invention, the centrifugal rotation mechanism can drive the test workbench to rotate centrifugally through the driving of the driving motor, simulating the dynamic gravitational acceleration environment during aviation flight, and during the simulation process, the gravitational acceleration conditions can be adjusted as needed by adjusting the output speed of the driving motor, improving the authenticity of the aging test; both ends of the test workbench are movably connected to the eccentric wheels through pin shafts to ensure stable rotation. At the same time, the slip ring of the slip ring rotates with the rotating shaft, and the test signal is transmitted to the test electric column through the wire, enabling continuous testing of electronic components in a dynamic environment.

[0024] 2. The present invention respectively sets multiple connection terminals with decreasing heights on both sides of the same test station. The test electric columns respectively inserted on the multiple connection terminals can independently control different test items, realizing synchronous testing of multiple pins, and significantly improving the efficiency. The design of decreasing heights of the connection terminals can avoid interference between multiple test electric columns and optimize the layout of the test structure. Moreover, one test electric column is simultaneously inserted into the lower ends of the connection terminals of multiple test stations on the same side and with the same lower height, enabling synchronous measurement of electronic components of multiple test stations and improving the consistency of batch electronic component testing.

[0025] 3. The present invention is provided with a linear ceramic backing plate and a U-shaped ceramic pressing plate on the test workbench. The linear ceramic backing plate and the U-shaped ceramic pressing plate can cooperate to fix the electronic component, improving the reliability of the placement of the electronic component relative to the test workbench during the dynamic testing process. And the heat-conducting and insulating characteristics of the ceramic material can quickly conduct the heat of the electronic component packaging body, avoiding temperature concentration and improving the accuracy of test data.

[0026] 4. The present invention is provided with convex parts with opposite directions at the lower ends of the connection terminals. The test electric columns are inserted on the convex parts, which can prevent the test electric columns from shifting during the dynamic testing process. At the same time, the convex platform arranged inside the test workbench can support the connection terminals, enhancing the installation stability of the connection terminals and the test electric columns during the dynamic testing process.

[0027] 5. The present invention drives the test workbench to rotate centrifugally through a centrifugal rotation mechanism, which can accurately simulate the gravitational acceleration environment during aviation flight. Multiple connection terminals with decreasing heights are set at the same test station, which can insert multiple test electric columns to realize synchronous testing of multiple pins of a single electronic component. The design of the heat-conducting and insulating ceramic material backing plate and pressing plate can not only fix the electronic component but also evenly conduct heat to the outside, avoiding test distortion caused by local overheating. Through the support of the convex platform for the connection terminals, the reverse convex part design and the slip ring conductive design, the stability of the electrical connection between the test electric columns and external test equipment and the reliability of signal transmission can be ensured during the rotation dynamic testing process. The present invention combines centrifugal rotation dynamic testing, multiple-pin synchronous testing and heat dissipation optimization, solves the core problems of the prior art, and significantly improves the efficiency and accuracy of electronic component aging testing. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It shows the overall structural schematic diagram of the electronic component aging test equipment disclosed by the present invention.

[0029] Figure 2 It shows the partial exploded structural schematic diagram of the electronic component aging test equipment disclosed by the present invention.

[0030] Figure 3 It shows the sectional structural schematic diagram of the electronic component aging test equipment disclosed by the present invention.

[0031] Figure 4 Shown is an enlarged structural schematic diagram of the test workbench in the electronic component aging test equipment disclosed by the present invention.

[0032] Figure 5 Shown as Figure 4 a cross-sectional structural schematic diagram of

[0033] Figure 6 Shown is a structural schematic diagram of the cooperation between the connection terminal and the test electric column in the electronic component aging test equipment disclosed by the present invention.

[0034] Figure 7 Shown as Figure 6 a schematic diagram of the connection terminal and the test electric column cooperating to plug in the electronic component in

[0035] Figure 8 Shown is a partial exploded structural schematic diagram of the cooperation between the centrifugal rotation mechanism and the slip ring in the electronic component aging test equipment disclosed by the present invention

[0036] Figure 9 Shown as Figure 8 a structural schematic diagram from another perspective.

[0037] Description of component labels

[0038] Support base 1; Test workbench 2; Test station 21; Through hole 22; Boss 23; Wiring hole 24; Test electric column 3; Centrifugal rotation mechanism 4; Rotating shaft 41; Eccentric wheel 42; Driving motor 5; Slip ring 6; First slip ring 61; Second slip ring 62; Cushion plate 7; Pressure plate 8; Connection terminal 9; Convex part 91; T-shaped flange plate 10; L-shaped hole 101. Specific embodiments

[0039] The following specific embodiments illustrate the implementation manners of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0040] Please refer to Figures 1 to 9It should be noted that the structures, proportions, sizes, etc. shown in the drawings of this specification are only used to cooperate with the content disclosed in the specification for those familiar with this technology to understand and read, and are not used to limit the conditions for the implementation of the present invention. Therefore, they do not have substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size, without affecting the efficacy that the present invention can produce and the purpose that can be achieved, should fall within the scope covered by the technical content disclosed in the present invention. At the same time, the terms such as "upper", "lower", "left", "right", "middle", and "one" cited in this specification are only for the convenience of clear narration and are not used to limit the scope for the implementation of the present invention. The change or adjustment of their relative relationships, without substantial change in the technical content, should also be regarded as the scope within which the present invention can be implemented.

[0041] Example 1. Please refer to Figures 1 - 3 and Figures 8 - 9 . This example provides an electronic component aging test equipment, including two support seats 1 and a test workbench 2 arranged between the two support seats 1. The test workbench 2 has an inner cavity. Centrifugal rotation mechanisms 4 are provided on both of the two support seats 1, and both ends of the test workbench 2 are connected to the centrifugal rotation mechanisms 4. Specifically, both of the two centrifugal rotation mechanisms 4 include a rotating shaft 41 and an eccentric wheel 42 sleeved on the rotating shaft 41. The rotating shaft 41 is installed on the support seat 1 through a rotating connection member, and the test workbench 2 is movably connected to the eccentric wheel 42 through a pin shaft. A driving motor 5 is installed on one of the support seats 1, and the output end of the driving motor 5 is connected to the rotating shaft 41 of the centrifugal rotation mechanism 4 at the corresponding position. A slip ring 6 is provided on the other support seat 1, and the test electric column 3 is rotationally connected to the test equipment through the slip ring 6. A wiring hole 24 is provided at one end of the test workbench 2 close to the slip ring 6, and the wire connected to the test electric column 3 is led out through the wiring hole 24. More specifically, two slip rings 6 are provided. The slip ring 6 at least includes a slip ring and a brush for rotational contact conduction. The two slip rings 6 are a first slip ring 61 and a second slip ring 62. The first slip ring 61 is installed in the area of the eccentric wheel 42 of the centrifugal rotation mechanism 4 far from the rotating shaft 41 and sleeved outside the pin shaft. A T-shaped flange plate 10 is provided at one end of the pin shaft connecting the test workbench 2. An L-shaped hole 101 is provided on the T-shaped flange plate 10. The wire connected to the test electric column 3 is led out through the wiring hole 24 and then connected to the slip ring of the first slip ring 61 after passing through the L-shaped hole 101. The second slip ring 62 is installed in the area where the eccentric wheel 42 is connected to the rotating shaft 41 and sleeved outside the rotating shaft 41. The brush of the second slip ring 62 is electrically connected to the brush of the first slip ring 61 through a wire. The slip ring of the second slip ring 62 is installed on the rotating shaft 41. A central hole axially penetrating the rotating shaft 41 is provided on the rotating shaft 41 where the second slip ring 62 is installed. The slip ring of the second slip ring 62 is electrically connected to the test equipment through a wire passing through the central hole.

[0042] In the present invention, a centrifugal rotation mechanism 4 is installed on a support base 1. The driving motor 5 provides driving force to enable the centrifugal rotation mechanism 4 to drive the test workbench 2 to rotate centrifugally, simulating the dynamic gravitational acceleration environment during aviation flight. And during the simulation process, by adjusting the output speed of the driving motor 5, the gravitational acceleration conditions can be adjusted as required, improving the authenticity of the aging test. The two ends of the test workbench 2 are movably connected to the eccentric wheels 42 through pin shafts to ensure stable rotation. At the same time, the slip ring of the slip ring 6 can rotate with the rotating shaft 41, and the test signals from the test equipment are transmitted to the test electric column 3 through wires, enabling continuous testing of electronic components in a dynamic environment.

[0043] Please refer to Figures 4 - 7 , a plurality of test stations 21 are provided on the test workbench 2. A plurality of connection terminals 9 are provided on a single test station 21. The upper ends of the plurality of connection terminals 9 on the same side are on the same horizontal line, and the lower ends decrease in height in sequence. The lower ends of the connection terminals 9 of a plurality of test stations 21 on the same side and with the same lower-end height are electrically connected and penetrated by a single test electric column 3, and a single test electric column 3 controls a single test item. In the area of the upper end of the test workbench 2 corresponding to the connection terminals 9, through holes 22 are provided, and the pins of the electronic components pass through the through holes 22 and are inserted into the connection terminals 9. In the present invention, by respectively arranging a plurality of connection terminals 9 with decreasing heights on both sides of the same test station 21, the test electric columns 3 respectively penetrated on the plurality of connection terminals 9 can independently control different test items, realizing synchronous testing of multiple pins, and significantly improving the efficiency. The design of the decreasing height of the connection terminals 9 can avoid interference between multiple test electric columns 3 and optimize the test structure layout. And a single test electric column 3 simultaneously penetrates the lower ends of the connection terminals 9 of a plurality of test stations 21 on the same side and with the same lower-end height, enabling synchronous measurement of the electronic components of a plurality of test stations 21 and improving the consistency of batch testing of electronic components.

[0044] A convex portion 91 is provided on one side of the lower end of the connection terminal 9. The directions of the convex portions 91 provided at the lower ends of two adjacent connection terminals 9 are opposite. The test electric column 3 is penetrated on the convex portion 91. A plurality of convex platforms 23 are provided in the test workbench 2, and the convex platforms 23 support the lower ends of the connection terminals 9. In the present invention, convex portions 91 with opposite directions are provided at the lower ends of the connection terminals 9, and the test electric column 3 is penetrated on the convex portion 91, which can prevent the test electric column 3 from shifting during the dynamic test. At the same time, the convex platforms 23 provided inside the test workbench 2 can support the connection terminals 9, enhancing the installation stability of the connection terminals 9 and the test electric column 3 during the dynamic test.

[0045] Please refer to Figures 1 - 2, a linear pad 7 is provided on the test workbench 2. The pad 7 penetrates through multiple test stations 21 at the same time, and the encapsulation body of the electronic component is placed on the pad 7. A U-shaped pressing plate 8 is fitted to the upper end of the ceramic pad 7, and the pressing plate 8 presses against the upper ends of multiple electronic component encapsulation bodies at the same time; the pad 7 and the pressing plate 8 are detachably connected by bolts. Both the pad 7 and the pressing plate 8 are made of ceramic materials with heat conduction and insulation properties. The linear ceramic pad 7 and the U-shaped ceramic pressing plate 8 can cooperate to fix the electronic components, improving the reliability of the placement of the electronic components relative to the test workbench 2 during the dynamic test; and the heat conduction and insulation characteristics of the ceramic material can quickly conduct the heat of the electronic component encapsulation body, avoiding temperature concentration and improving the accuracy of the test data.

[0046] The test process of the present invention is as follows: 1) Place multiple electronic components to be tested on the test stations 21 of the test workbench 2 in sequence. The encapsulation body of the electronic component to be tested is placed on the ceramic pad 7, and the pins pass through the through holes 22 and are inserted into the connection terminals 9. Since multiple connection terminals 9 on the same side of a single test station (21) are respectively connected to different test guide posts 3, multiple pins of a single electronic component to be tested can be electrically connected to different test guide posts 3;

[0047] 2) Press the ceramic pressing plate 8 against the upper end of the encapsulation body of the electronic component to be tested. The two ends of the ceramic pressing plate 8 are detachably connected to the ceramic pad 7 by bolts, thereby fixing the electronic component to be tested;

[0048] 3) Drive the rotation of the rotating shaft 41 of the centrifugal rotation mechanism 4 through the drive motor 5. The eccentric wheel 42 installed on the rotating shaft 41 drives the test workbench 2 to perform rotational centrifugal activities, dynamically simulating the gravitational acceleration environment during the flight of an aircraft;

[0049] 4) During the dynamic test, the test equipment is rotationally connected to the test guide post 3 through the slip ring 6 and transmits different test signals. For example, in a certain test, four pins of an electronic component are respectively connected to connection terminals 9 at different heights. The test item progress should correspond to three test items of voltage, current, and impedance. The test equipment transmits voltage, current, and impedance test signals to three of the test posts 3 corresponding to the four pins of the electronic component through the slip ring 6, realizing multi-item detection synchronously;

[0050] 5) After the test is completed, the test equipment collects and analyzes the corresponding test data; the ceramic pressing plate 8 can be removed to pull out the tested electronic component.

[0051] Embodiment 2, based on Embodiment 1, this embodiment tests the dynamic gravitational acceleration simulation and component performance to verify the aging effect of the centrifugal rotation mechanism 4 on electronic components in the simulated aircraft gravitational acceleration environment.

[0052] The test conditions are as follows:

[0053] Device parameters: The rotational speed range of the centrifugal rotating mechanism is 0 - 2000 rpm, the radius of the eccentric wheel is 50 mm, and the test temperature is 25°C ± 2°C.

[0054] Components under test: Aviation-grade capacitors (rated voltage 50V, capacitance value 100 μF), a total of 10 samples.

[0055] Test items: Capacitance decay rate, leakage current change.

[0056] Test steps

[0057] 1) Fix the capacitor samples on the ceramic backing plate 7 of the test workbench 2, and insert the pins into the connection terminals 9;

[0058] 2) Set the rotational speed of the centrifugal rotating mechanism 4 to 1000 rpm, which is used to simulate 3G acceleration, and continuously operate for 48 hours;

[0059] 3) Measure the capacitance value (LCR tester) and leakage current (high resistance meter) every 12 hours.

[0060] The test data is shown in the following table:

[0061]

[0062] As can be seen from the above table, under 3G acceleration, the capacitance decay rate of the capacitor linearly increases with time, and the increase in leakage current is stable, verifying the accelerating effect of the dynamic gravity environment on component aging, which meets the simulation requirements of the aviation application scenario.

[0063] Example 3, based on Example 1, this example verifies the multi-pin parallel test efficiency for verifying the multi-pin parallel test efficiency.

[0064] The test conditions are as follows:

[0065] Components under test: Three-pin MOSFET (model IRF540N), a total of 20 samples.

[0066] Test items: On-resistance (R DS(on) ), threshold voltage (V GS(th) ), reverse recovery time (t rr ).

[0067] Comparison method: Traditional single-pin step-by-step test and the multi-pin synchronous test of the present invention.

[0068] The traditional method measures the parameters of each pin sequentially, with a single test taking 3 minutes / component; the method of the present invention synchronously connects to three test posts through connection terminals at different heights, with a single test taking 1 minute / component; record the total test time and data consistency of the two methods.

[0069] The test data are shown in the following table:

[0070]

[0071]

[0072] As can be seen from the above table, the method of the present invention improves the test efficiency to 3 times that of the traditional method, and has better data consistency, with the standard deviation reduced by 40%, which can prove the effectiveness of multi-pin synchronous testing.

[0073] Example 4: Based on Example 1, in this example, the temperature control test of the ceramic heat dissipation material is carried out to verify the optimization effect of the ceramic backing plate and the pressing plate on the heat dissipation of the components during the test.

[0074] The test conditions are as follows:

[0075] Equipment parameters: The thermal conductivity of the ceramic backing plate is 30 W / m·K, and the test current of 5 A is continuously applied;

[0076] Components to be measured: Power resistors (10 Ω / 50 W), with a total of 10 samples;

[0077] Control group: A metal backing plate group without ceramic heat dissipation design.

[0078] Test steps

[0079] 1) The two groups of samples are respectively fixed on the ceramic backing plate and the metal backing plate, and a current of 5 A is applied continuously for 1 hour;

[0080] 2) Use an infrared thermal imager to record the surface temperature distribution of the components, and collect data every 10 minutes.

[0081] The test data are shown in the following table:

[0082]

[0083] As can be seen from the above table, the peak temperature of the ceramic backing plate group is reduced by 28% compared with the metal group, and there is no overheat protection trigger, which proves that its thermal conductivity and insulation performance can effectively suppress local temperature rise and avoid test distortion.

[0084] Combining Examples 2 - 4, the present invention verifies the authenticity of environmental simulation through the correlation between acceleration data and component performance changes; multi-project parallel testing can achieve double improvements in efficiency and data accuracy, meeting the rapid detection requirements of complex components; the ceramic material heat dissipation structure can significantly reduce the temperature rise while fixing electronic components, ensuring the long-term reliability of test data.

[0085] In summary, the present invention drives the test workbench 2 to rotate centrifugally through the centrifugal rotation mechanism 4, and can accurately simulate the gravitational acceleration environment during aviation flight; multiple connection terminals 9 with decreasing heights are arranged at the same test station 21, which can penetrate multiple test electric columns 3 to realize the synchronous test of multiple pins of a single electronic component; the design of the backing plate 7 and the pressing plate 8 made of thermally conductive insulating ceramic material can not only fix the electronic component but also conduct heat evenly to the outside, avoiding test distortion caused by local overheating; through the design of the boss 23 to support the connection terminal 9, the reverse convex part 91 and the conductive design of the slip ring 6, the stability of the electrical connection between the test electric column 3 and the external test equipment and the reliability of signal transmission can be ensured during the rotating dynamic test process. The present invention combines centrifugal rotation dynamic test, multi-pin synchronous test and heat dissipation optimization, solves the core problems of the prior art, and significantly improves the efficiency and accuracy of the aging test of electronic components. Therefore, the present invention effectively overcomes various shortcomings in the prior art and has high industrial utilization value.

[0086] The above embodiments are only illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical ideas disclosed by the present invention should still be covered by the claims of the present invention.

Claims

1. An electronic component aging test equipment, comprising two support seats (1) and a test workbench (2) disposed between the two support seats (1); It is characterized in that: Centrifugal rotation mechanisms (4) are provided on both of the two support seats (1), and two ends of the test workbench (2) are connected to the centrifugal rotation mechanisms (4), and the test workbench (2) is driven by the centrifugal rotation mechanisms (4) to rotate centrifugally to simulate the gravitational acceleration environment during an aviation flight process; A plurality of test stations (21) are provided on the test workbench (2), and a plurality of connection terminals (9) are provided on a single test station (21), and the lower ends of the plurality of connection terminals (9) on the same side decrease in height in sequence; The lower ends of the connection terminals (9) of a plurality of test stations (21) on the same side and with the same lower end height are electrically connected and penetrated by a test electric column (3), and a single test electric column (3) controls a single test item correspondingly.

2. The electronic component aging test equipment according to claim 1, wherein: Both of the two centrifugal rotation mechanisms (4) include a rotating shaft (41) and an eccentric wheel (42) sleeved on the rotating shaft (41), the rotating shaft (41) is installed on the support seat (1) through a rotating connecting member, and the test workbench (2) is movably connected to the eccentric wheel (42) through a pin shaft.

3. The electronic component aging test equipment according to claim 2, wherein: A driving motor (5) is installed on one of the support seats (1), and the output end of the driving motor (5) is connected to the rotating shaft (41) of the centrifugal rotation mechanism (4) at the corresponding position; A slip ring (6) is provided on the other support seat (1), and the test electric column (3) is rotationally connected to the test equipment through the slip ring (6).

4. The electronic component aging test equipment according to claim 1, characterized in that: A wiring hole (24) is provided at one end of the test workbench (2) close to the slip ring (6), and the wire connected to the test electric column (3) is led out through the wiring hole (24).

5. The electronic component aging test equipment according to claim 1, characterized in that: A linear pad (7) is provided on the test workbench (2), and the pad (7) penetrates through a plurality of test stations (21) at the same time, and the encapsulation main body of the electronic component is placed on the pad (7).

6. The electronic component aging test equipment according to claim 5, characterized in that: A U-shaped pressing plate (8) is matched with the upper end of the ceramic pad (7), and the pressing plate (8) presses on the upper ends of a plurality of electronic component encapsulation main bodies at the same time; the pad (7) and the pressing plate (8) are detachably connected by bolts.

7. The electronic component aging test equipment according to claim 6, characterized in that: Both the pad (7) and the pressing plate (8) are made of ceramic materials with heat conduction and insulation properties.

8. The electronic component aging test equipment according to claim 1, characterized in that: Through holes (22) are provided in the upper end area of the test workbench (2) corresponding to the connection terminals (9), and the pins of the electronic components pass through the through holes (22) and are inserted into the connection terminals (9).

9. The electronic component aging test equipment according to claim 1, characterized in that: A convex portion (91) is provided on one side of the lower end of the connection terminal (9), and the directions of the convex portions (91) provided at the lower ends of two adjacent connection terminals (9) are opposite; the test electric column (3) is penetrated on the convex portion (91).

10. The electronic component aging test equipment according to claim 9, characterized in that: A plurality of bosses (23) are provided in the test workbench (2), and the bosses (23) support the lower ends of the connection terminals (9).

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