Electronic device

Abstract

The embodiment of the invention provides electronic equipment. The electronic equipment comprises a shell, a circuit board, a first fan and a second fan. The shell is provided with a heat dissipation opening. The circuit board is located in the shell. The circuit board is provided with a heating device, a heat dissipation channel is arranged on the circuit board, and the heating device is located in the heat dissipation channel. An air outlet of the first fan is located in the air inlet side of the heat dissipation channel. An air inlet of the second fan is located in the air outlet side of the heat dissipation channel so that air can enter the second fan from the heat dissipation channel. An air outlet of the second fan faces the heat dissipation opening. According to the electronic equipment, the heat dissipation performance of the electronic equipment is improved, and meanwhile the situation that the arrangement of the handwriting pen on the shell is affected by the arrangement of the heat dissipation opening can be avoided.

Description

Technical Field

[0001] This application relates to the technical field of electronic devices, and particularly to an electronic device. Background Art

[0002] With the continuous progress of technology, tablet computers have become one of the essential electronic devices in our lives.

[0003] The heat dissipation performance of a tablet computer directly affects user choices, so the heat dissipation design of tablet computers has become crucial. For this reason, a heat dissipation system is usually provided inside the tablet computer to dissipate heat from the heat-generating components on the circuit board inside the tablet computer, thereby improving the heat dissipation performance of the tablet computer. The greater the heat dissipation capacity of the heat dissipation system, the better the heat dissipation performance of the tablet computer. The smaller the heat dissipation capacity of the heat dissipation system, the worse the heat dissipation performance of the tablet computer. The existing heat dissipation systems of tablet computers usually include a heat dissipation component and a fan. When the tablet computer has a large heat dissipation requirement, the heat-generating components are dissipated by combining the heat dissipation component and a fan. Therefore, generally only one heat dissipation port needs to be provided for existing tablet computers. The heat dissipation port is usually provided on the top wall of the tablet computer. If it is necessary to further improve the heat dissipation performance of the tablet, it is necessary to increase the heat dissipation capacity of the heat dissipation system. At this time, two fans and two heat dissipation ports need to be provided.

[0004] However, for the convenience of user operation, a stylus is generally configured for the tablet computer. The stylus is usually set at the top of the tablet computer for charging. However, the presence of the stylus has certain limitations on the formation of the two heat dissipation ports on the top wall of the tablet computer. Summary of the Invention

[0005] This application provides an electronic device that can avoid the influence of the setting of the heat dissipation port on the setting of the stylus on the housing while improving the heat dissipation performance of the electronic device.

[0006] An embodiment of this application provides an electronic device, which includes:

[0007] A housing, the circumference of the housing has side plates, and heat dissipation ports are provided on the side plates;

[0008] A circuit board, located inside the housing; the circuit board has heat-generating components, and a heat dissipation channel is provided on the circuit board, and the heat-generating components are located inside the heat dissipation channel;

[0009] A first fan, the air outlet of the first fan is located on the air inlet side of the heat dissipation channel;

[0010] A second fan, the air inlet of the second fan is located on the air outlet side of the heat dissipation channel, so that the second fan takes in air from the heat dissipation channel;

[0011] The air outlet of the second fan faces the heat dissipation port.

[0012] The airflow flowing out of the air outlet of the first fan of the electronic device in this application can flow into the heat dissipation channel to perform air-cooled heat dissipation on the heat-generating components in the heat dissipation channel. Through the arrangement of the second fan in this application, the power relay of the airflow flowing out of the air outlet of the first fan can be realized, the airflow in the heat dissipation channel can be sucked out of the heat dissipation channel, and dissipated to the outside of the electronic device through the heat dissipation opening, so that the airflow flowing out of the air outlet of the first fan can quickly enter the heat dissipation channel to continuously perform air-cooled heat dissipation on the heat-generating components, thereby improving the heat dissipation capacity of the heat dissipation system including the first fan and the second fan for the heat-generating components. While improving the heat dissipation performance of the electronic device, the heat dissipation efficiency of the heat-generating components and the electronic device can also be improved.

[0013] Since the second fan can realize the power relay of the airflow flowing out of the air outlet of the first fan, although the number of fans in the electronic device is increased, the requirement for the number of heat dissipation openings remains unchanged. This application does not need to open two traditional heat dissipation openings on the housing, which can avoid the influence of the setting of the heat dissipation openings on the setting of the stylus on the housing.

[0014] In some embodiments, the side plate has a plurality of heat dissipation holes, and the plurality of heat dissipation holes form a heat dissipation opening. The size of the heat dissipation opening is adapted to the size of the air outlet of the second fan, so that the airflow flowing out of the second air outlet can be quickly dissipated to the outside of the electronic device through the heat dissipation opening without affecting the setting of the stylus on the top of the housing.

[0015] In some embodiments, the shape of the heat dissipation opening is adapted to the shape of the air outlet of the second fan, so that the heat dissipation opening and the second air outlet have a good matching shape to ensure that the airflow flowing out of the second air outlet can quickly pass through the heat dissipation opening and be discharged, so as to further improve the heat dissipation capacity of the heat dissipation system for the heat-generating components.

[0016] In some embodiments, along the width direction of the housing, the side plate has a top wall and a bottom wall, and the top wall is configured to be away from the user when the electronic device is in use;

[0017] The heat dissipation channel is located on one side of the circuit board adjacent to the top wall, and the heat dissipation opening is arranged on the top wall. In this way, while not changing the setting position of the heat dissipation opening on the housing, the distance between the heat dissipation channel and the heat dissipation opening can be shortened, and the airflow flowing out of the second air outlet of the second fan can quickly pass through the heat dissipation opening and be dissipated to the outside of the electronic device. It not only has a small wind resistance, but also while ensuring the air volume of the airflow dissipated from the heat dissipation opening to the outside of the electronic device, the length of the heat dissipation opening can be reduced, so that there is enough space on the top of the housing to set the stylus.

[0018] In some embodiments, the air inlet side and the air outlet side are distributed on both sides of the top wall, which can increase the length of the heat dissipation channel so that the heat generating device can be arranged in the heat dissipation channel; the heat dissipation opening is arranged at a position on the top wall opposite to the air outlet side, which can enable the second air outlet to be arranged face to face with the heat dissipation opening, so as to further shorten the distance between the second air outlet and the heat dissipation opening, and enhance the effects of reducing air resistance and the opening size of the heat dissipation opening.

[0019] In some embodiments, the electronic device further includes a flow guiding component, and the flow guiding component includes a first flow guiding member;

[0020] At least a part of the first flow guiding member is arranged on the board surface of the circuit board and is located on the side of the heat generating device away from the heat dissipation opening; the heat dissipation channel is located in the area surrounded by the first flow guiding member and the circuit board, so that while the heat generating device can be located in the heat dissipation channel, the first flow guiding member can guide the air flow in the heat dissipation channel, so that the air flow flows along the heat dissipation channel to one side of the second fan.

[0021] In some embodiments, one end of the first flow guiding member is located outside the air outlet of the first fan, and the other end is located on the side of the second fan, so as to avoid the air flow flowing out of the first air outlet from diffusing to the outside of the heat dissipation channel, and at the same time, the air flow flowing out of the first air outlet can be guided to the second fan through the first flow guiding member, so as to realize the power relay of the second fan.

[0022] In some embodiments, the flow guiding component includes a second flow guiding member, and the second flow guiding member is located on the side of the heat generating device adjacent to the heat dissipation opening;

[0023] The second flow guiding member, the first flow guiding member and the circuit board jointly enclose the heat dissipation channel.

[0024] The air flow in the heat dissipation channel can be guided through the second flow guiding member and the first flow guiding member, so that the air flow flows along the heat dissipation channel to one side of the second fan, so as to increase the air intake of the second fan, ensure the power relay effect of the second fan, and enable the heat dissipation system to achieve a better heat dissipation effect on the heat generating device.

[0025] In some embodiments, the end of at least one of the first flow guiding member and the second flow guiding member extends to the air inlet of the second fan and is located outside the air inlet of the second fan.

[0026] Through the extension of the end of at least one of the first flow guiding member and the second flow guiding member, the air flow in the heat dissipation channel can be guided to the air inlet of the second fan, so as to further increase the air intake of the second fan, enhance the power relay effect of the second fan, and enhance the heat dissipation effect of the heat dissipation system on the heat generating device.

[0027] In some embodiments, at least a portion of the second flow guide member is disposed on the surface of the circuit board. In this way, while realizing the assembly of the second flow guide member in the housing, the setting method of the second flow guide member can be made more diverse to adapt to the design requirements of different heat dissipation channels for different electronic devices.

[0028] In some embodiments, the electronic device further includes a display screen, and the display screen covers the housing;

[0029] Both the first flow guide member and the second flow guide member are elastic members; the elastic members are in contact with the display screen, and there is a gap between the first fan and the second fan and the display screen to ensure that while the elastic members can buffer the display screen, it is convenient for the second fan to intake air.

[0030] In some embodiments, the elastic member includes foam to realize the contact between the elastic member and the display screen.

[0031] In some embodiments, the electronic device further includes a heat conducting plate assembly, and the heat conducting plate assembly is located in the heat dissipation channel;

[0032] The heat conducting plate assembly covers the side of the heat generating device away from the housing and is in heat conducting contact with the heat generating device; the air outlet of the first fan faces the heat conducting plate assembly.

[0033] The heat of the heat generating device can be conducted to the heat conducting plate assembly, and the air flow flowing out from the first air outlet of the first fan can directly blow onto the heat conducting plate assembly, and then carry the heat on the heat conducting plate assembly, and finally be discharged to the outside of the electronic device through the second fan to realize the heat dissipation of the heat generating device. Moreover, through the setting of the heat conducting plate assembly, the heat dissipation area of the heat generating device can be increased to facilitate the rapid heat dissipation of the heat generating device, and further improve the heat dissipation capacity of the heat dissipation system and the heat dissipation performance of the electronic device.

[0034] In some embodiments, the heat conducting plate assembly includes a first heat conducting plate, and the first heat conducting plate covers the side of the heat generating device away from the housing and is in heat conducting contact with the heat generating device so that the heat of the heat generating device can be quickly conducted to the first heat conducting plate to facilitate the rapid heat dissipation of the heat generating device.

[0035] In some embodiments, the end of the first heat conducting plate extends along the heat dissipation channel toward the air outlet side to enable the first heat conducting plate to have a larger heat dissipation area to facilitate the rapid heat dissipation of the heat generating device.

[0036] In some embodiments, the first heat conducting plate is a metal heat conducting plate, and the air outlet of the first fan faces the first heat conducting plate, so that while the heat of the heat generating device can be quickly conducted to the first heat conducting plate, the air flow flowing out from the first air outlet of the first fan can directly blow onto the first heat conducting plate and then carry the heat on the first heat conducting plate.

[0037] In some embodiments, a first heat conducting plate has first diversion channels on a side facing away from the heat generating device. The air outlet of the first fan faces the air inlet end of the first diversion channels, and the air outlet end of the first diversion channels is adjacent to the second fan.

[0038] By providing the first diversion channels, while being able to play a good guiding role for the air flow in the heat dissipation channel, it can increase the heat dissipation area of the first heat conducting plate, further enhancing the heat dissipation capacity of the heat dissipation system and the heat dissipation performance of the electronic device.

[0039] In some embodiments, the number of the first diversion channels is two or more. Along the width direction of the heat dissipation channel, two or more first diversion channels are arranged at intervals on the first heat conducting plate, so as to further increase the heat dissipation area of the first heat conducting plate, enhancing the heat dissipation capacity of the heat dissipation system and the heat dissipation performance of the electronic device.

[0040] In some embodiments, the first heat conducting plate is a vapor chamber, so that when the heat of the heat generating device is conducted to the vapor chamber, the vapor chamber can achieve the heat equalization effect on the heat of the heat generating device, facilitating the rapid heat dissipation of the heat generating device.

[0041] In some embodiments, the heat conducting plate assembly further includes a second heat conducting plate, and the second heat conducting plate covers the side of the first heat conducting plate facing away from the heat generating device;

[0042] The air outlet of the first fan faces the second heat conducting plate. In this way, the heat on the vapor chamber can be transferred to the second heat conducting plate. The air flow flowing out from the first air outlet of the first fan can directly blow onto the second heat conducting plate, and then carry the heat on the second heat conducting plate to achieve the heat dissipation of the heat generating device.

[0043] In some embodiments, the second heat conducting plate has second diversion channels on a side facing away from the heat generating device;

[0044] The air outlet of the first fan faces the air inlet end of the first diversion channels, and the air outlet end of the first diversion channels is adjacent to the second fan.

[0045] By providing the second diversion channels, it can play a good guiding role for the air flow in the heat dissipation channel.

[0046] In some embodiments, the second heat conducting plate is a metal heat conducting plate, enabling the heat on the vapor chamber to be quickly conducted to the second heat conducting plate.

[0047] In some embodiments, the housing further includes a bottom plate, and the side plates surround the circumference of the bottom plate;

[0048] The bottom plate has an air inlet channel, and the air inlet channel is connected to the air inlet of the first fan, so that the air (cold air) outside the electronic device can enter the first fan through the air inlet channel and the first air inlet.

[0049] In some embodiments, the electronic device further includes an air inlet decorative member located outside the housing and covering the air inlet channel;

[0050] The air inlet decorative member has a plurality of air inlet holes communicating with the air inlet channel, so that the air (cold air) outside the electronic device can enter the first fan through the plurality of air inlet holes and the air inlet channel from the first air inlet. Meanwhile, with the arrangement of the air inlet decorative member, it can also prevent the exposure of the air inlet channel and affect the aesthetic appearance of the electronic device.

[0051] In some embodiments, the electronic device further includes a camera assembly, which includes a lens cover plate installed on the bottom plate and exposed outside the housing; the shape of the air inlet decorative member is adapted to that of the lens cover plate, so as to weaken the obtrusiveness of the air inlet decorative member on the housing through the lens cover plate and ensure the aesthetic appearance of the electronic device.

[0052] In some embodiments, the air inlet decorative member is disposed adjacent to the lens cover plate on the bottom plate, so that the air inlet decorative member is adjacent to the lens cover plate, which can further weaken the obtrusiveness of the air inlet decorative member on the housing through the lens cover plate and ensure the aesthetic appearance of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] Figure 1 It is a schematic structural diagram of an electronic device provided by an embodiment of the present application in one form;

[0054] Figure 2 For Figure 1 the schematic structural diagram of the electronic device in another form in;

[0055] Figure 3 For Figure 1 the usage scenario diagram of the electronic device in;

[0056] Figure 4 For Figure 3 the schematic diagram of the setting position of the stylus on the electronic device in;

[0057] Figure 5 It is a schematic internal structure diagram of an electronic device provided by an embodiment of the present application;

[0058] Figure 6 For Figure 5 the schematic structural diagram of the electronic device in another perspective in;

[0059] Figure 7 For Figure 6 the partial cross-sectional schematic diagram of the electronic device in the A-A direction in;

[0060] Figure 8 It is an exploded view of an electronic device provided by an embodiment of the present application;

[0061] Figure 9 For Figure 8 Assembly effect diagram of the air intake decorative part on the electronic device;

[0062] Figure 10 Another assembly effect diagram of the air intake decorative part provided by the embodiment of the present application on the electronic device;

[0063] Figure 11 Internal structure schematic diagram of another electronic device provided by the embodiment of the present application;

[0064] Figure 12 For Figure 11 Structure schematic diagram of the electronic device in in another perspective;

[0065] Figure 13 For Figure 12 Partial cross-sectional schematic diagram of the electronic device in the B-B direction;

[0066] Figure 14 For Figure 13 Enlarged view at C;

[0067] Figure 15 Internal structure schematic diagram of yet another electronic device provided by the embodiment of the present application;

[0068] Figure 16 Partial cross-sectional schematic diagram of still another electronic device provided by the embodiment of the present application;

[0069] Figure 17 For Figure 16 Enlarged view at D.

[0070] Reference numerals:

[0071] 100 - Electronic device;

[0072] 1 - Screen part;

[0073] 11 - Housing; 111 - Bottom plate; 1111 - Air intake channel; 112 - Side plate; 1121 - Top wall; 1122 - Bottom wall; 1123 - Heat dissipation port;

[0074] 12 - Display screen;

[0075] 13 - Rear camera module;

[0076] 14 - Circuit board; 141 - Heating device;

[0077] 15 - Lens cover plate;

[0078] 16 - Bracket;

[0079] 17 - Strip-shaped decorative part;

[0080] 2 - Keyboard base; 21 - Keyboard base body; 22 - Keyboard main body;

[0081] 3 - Stylus;

[0082] 4 - First fan; 41 - First air inlet; 42 - First air outlet;

[0083] 5 - Second fan; 51 - Second air inlet; 52 - Second air outlet;

[0084] 6 - Heat dissipation channel; 61 - Air inlet side; 62 - Air outlet side;

[0085] 7 - Flow guiding component; 71 - First flow guiding member; 72 - Second flow guiding member;

[0086] 8 - Air inlet decorative part;

[0087] 9 - Heat conducting plate assembly; 91 - First heat conducting plate; 911 - First flow guiding groove; 92 - Second heat conducting plate. Detailed implementation manners

[0088] The terms used in the implementation manners part of this application are only used to explain the specific embodiments of this application, and are not intended to limit this application.

[0089] The embodiments of this application provide an electronic device. The electronic device may include, but is not limited to, mobile or fixed terminals such as tablet computers (i.e., pads), laptop computers, netbooks, personal digital assistants (PDAs), ultra-mobile personal computers (UMPCs), handheld computers, smart wearable devices, virtual reality (VR) devices, point of sales (POS), etc.

[0090] Figure 1 Schematically shows the structure of an electronic device 100. Refer to Figure 1 As shown, in the embodiments of this application, the electronic device 100 is taken as an example of a tablet computer for illustration.

[0091] Refer to Figure 1 As shown, the electronic device 100 may include a screen component 1. The screen component 1 may include a housing 11 and a display screen 12. The display screen 12 is assembled on the housing 11 and together with the housing 11 constitutes the screen component 1. When the display screen 12 is assembled on the housing 11, the side of the display screen 12 that is exposed outside the housing 11 is the display surface of the display screen 12. The display screen 12 can be used to display information and provide an interaction interface for users on the display surface.

[0092] The housing 11 may include a bottom plate 111 (not shown) and side plates 112. The side plates 112 surround the circumference of the bottom plate 111 and are connected to the bottom plate 111 to form the housing 11. The side plates 112 and the bottom plate 111 may also enclose a receiving cavity (not shown). In the width direction of the housing 11, the side plates 112 have a top wall 1121 and a bottom wall 1122. The side plates 112 also have side walls. The side walls are connected between the top wall 1121 and the bottom wall 1122 and, together with the top wall 1121 and the bottom wall 1122, enclose an annular structure. The width direction of the housing 11 can be referred to as the Y direction in Figure 1 and the length direction of the housing 11 can be referred to as the X direction in Figure 1 . For ease of description, hereinafter, the width direction of the housing 11 will be collectively referred to as the Y direction, and the length direction of the housing 11 will be collectively referred to as the X direction. Among them, the top wall 1121 is configured to be away from the user when the electronic device 100 is in use. Correspondingly, the bottom wall 1122 is close to the user when the electronic device 100 is in use.

[0093] The screen member 1 further includes a camera module (not shown). The camera module is located inside the housing 11 to achieve the assembly of the camera module on the screen member 1. When the camera module is located inside the housing 11, it can be exposed outside the display screen 12 to form a front camera module of the electronic device 100. When the camera module is located inside the housing 11, it can also be exposed on the side of the housing 11 where the bottom plate 111 is provided to form a rear camera module 13 (not shown) of the electronic device 100. Alternatively, when the number of camera modules is more than two, the screen member 1 can also be provided with a front camera module and a rear camera module 13 at the same time. In this application, the number of camera modules is not particularly limited.

[0094] Refer to Figure 1 As shown, the electronic device 100 further includes a keyboard base 2. The keyboard base 2 may include a keyboard base body 21 and a keyboard main body 22. The keyboard main body 22 is mounted on the keyboard base body 21. The keyboard main body 22 includes a language input module, a digital input module, a symbol input keyboard, etc. The keyboard base 2 serves as an input device of the electronic device 100, and the user can operate on the keyboard main body 22 to facilitate the input when using the electronic device 100.

[0095] Figure 1 schematically shows the integrated form of the electronic device 100. Figure 2 schematically shows the split form of the electronic device 100. Refer to Figure 1 and Figure 2 As shown, the screen member 1 can be disposed on the keyboard base 2 and can be separated from the keyboard base 2 so that the screen member 1 and the keyboard base 2 can be two independent devices. Thus, when the electronic device 100 is in use, the screen member 1 can be placed on the keyboard base 2 so that the electronic device 100 is in the form of Figure 1Integrated form. This integrated form can also be referred to as the laptop form. After the electronic device 100 is no longer in use, the display screen 12 can be separated from the keyboard base 2 and form two independent devices with the keyboard base 2, so that the sub-devices are in the Figure 2 Detachable form. In the detachable form, the screen unit 1 can be used alone as an electronic device 100. By changing the form of the electronic device 100, the usage requirements of users in more application scenarios can be met.

[0096] For the convenience of separating the screen unit 1 from the keyboard base 2, refer to Figure 1 As shown, the screen unit 1 can be arranged on the keyboard base body 21 of the keyboard base 2 by means of magnetic adsorption. To enhance the stability of the screen unit 1 on the keyboard base body 21, a bracket 16 can also be arranged on the side of the screen unit 1 away from the display screen 12, so as to support the screen unit 1 on the placement platform through the bracket 16. For example, the placement platform can be a desktop or the like.

[0097] Alternatively, in some embodiments, the screen unit 1 can also be detachably connected to the keyboard base 2 through a protective cover, so that the screen unit 1 can be arranged on the keyboard base body 21. At this time, to enhance the stability of the screen unit 1 on the keyboard base body 21, the screen unit 1 can also be magnetically adsorbed on the keyboard base body 21.

[0098] Refer to Figure 2 As shown, in addition to the display screen 12, the screen unit 1 can also include a circuit board 14. The circuit board 14 is located in the accommodation cavity of the housing 11. For example, the circuit board 14 is usually arranged on one side of the accommodation cavity close to the top wall 1121 of the side plate 112. A large number of electronic components are usually arranged on the circuit board 14. The large number of electronic components can include a processor, a charging management module, a power management module, etc. For example, the processor can include, for example, a central processing unit (CPU), an application processor (AP for short), a modem processor, a graphics processing unit (GPU for short), an image signal processor (ISP for short), a controller, a video codec, a digital signal processor (DSP for short), a baseband processor, a display processing unit (DPU for short), and / or a neural-network processing unit (NPU for short), etc.

[0099] The CPU, as the computing and control core of the electronic device 100, is mainly used for data processing and computing in the electronic device 100. The charging management module is used to receive charging input from external devices such as chargers. The charging management module can charge the battery of the electronic device 100 and can also supply power to the electronic device 100 through the power management module. The battery can be arranged in the accommodating cavity of the housing 11. For the position of the battery in the accommodating cavity, reference can be made to existing tablet computers, which will not be elaborated here.

[0100] The power management module receives inputs from the battery and / or the charging management module to supply power to the processor, memory, display screen 12, camera module, etc. The power management module can also be used to monitor parameters such as battery capacity, battery cycle count, and battery health status (leakage, impedance).

[0101] When processors such as the central processing unit, application processor, graphics processor, and display processing unit are working, a large amount of heat will be generated. In addition to these processors, a large amount of heat will also be generated when the power management module is working. Therefore, these processors and the power management module become the main heat-generating components 141 inside the electronic device 100.

[0102] Thermal design power (TDP) refers to the heat generated per unit time by the heat-generating component 141 when it is working. TDP can reflect the heat generation situation of the heat-generating component 141. For the same type of heat-generating component 141, the larger the TDP, the stronger the performance of the processor.

[0103] As the usage time of the electronic device 100 increases, the temperature of the heat-generating component 141 will gradually increase, and the TDP will also be larger. In severe cases, it will even affect the performance of itself and the normal use of the electronic device 100. Therefore, the quality of the heat dissipation performance of the electronic device 100 directly affects the user's choice, making the design of the heat dissipation performance of the electronic device 100 crucial.

[0104] For this reason, a heat dissipation system is usually arranged inside the electronic device 100 to dissipate heat from hardware devices such as the circuit board 14 inside the electronic device 100 and improve the heat dissipation performance of the electronic device 100.

[0105] When designing the heat dissipation of the electronic device 100, TDP is a requirement for the heat dissipation system of the electronic device 100, requiring the heat dissipation system to dissipate the heat generated by the heat-generating component 141. That is to say, it is required that the heat dissipation system needs to provide a heat dissipation capacity not lower than the TDP. Therefore, the TDP can be used to characterize the heat dissipation capacity of the heat dissipation system.

[0106] As is well known, for the same electronic device 100, the greater the heat dissipation capacity of the heat dissipation system, the better the heat dissipation performance of the electronic device 100. The smaller the heat dissipation capacity of the heat dissipation system, the worse the heat dissipation performance of the electronic device 100.

[0107] Taking a tablet computer as an example, the settings of the heat dissipation systems of existing electronic devices will be further described. The heat dissipation systems of existing electronic devices generally include a heat dissipation component and a fan. Among them, the heat dissipation component can include a heat pipe or a vapor chamber. The heat dissipation component covers the heat generating device 141 and can absorb the heat of the heat generating device 141 to dissipate heat from the heat generating device 141.

[0108] The heat of the heat generating device 141 is closely related to the usage scenarios of the electronic device 100. According to different power consumptions, the usage scenarios of the electronic device 100 can be divided into low-power usage scenarios and high-power usage scenarios. Low-power usage scenarios can include relatively simple usage scenarios such as browsing the web and chatting. High-power usage scenarios can include relatively complex usage scenarios such as video calls and heavy-load games.

[0109] When the electronic device 100 is in a low-power usage scenario, the heat generated by the heat generating device 141 is relatively small, and the requirement of the electronic device 100 for the heat dissipation capacity of the heat dissipation system is also relatively small. At this time, the heat generating device 141 can be dissipated by relying only on the heat dissipation component.

[0110] When the electronic device 100 is in a high-power usage scenario, the heat generated by the heat generating device 141 is large, and the requirement of the electronic device 100 for the heat dissipation capacity of the heat dissipation system is also relatively large. At this time, it is necessary to combine the fan and the heat dissipation component to dissipate heat from the heat generating device 141. On the basis of relying on the heat dissipation component to dissipate heat from the heat generating device 141, the fan can dissipate heat from the heat dissipation component, and the airflow (such as wind) flowing out of the fan is dissipated to the outside of the electronic device 100 through the heat dissipation port 1123 of the electronic device 100, so as to continuously and quickly dissipate heat and cool down the heat generating device 141 through the heat dissipation component.

[0111] Since existing electronic devices only have one fan, existing electronic devices only need to set one traditional heat dissipation port. The length of the traditional heat dissipation port is adapted to the length of the air outlet of the fan. It should be noted that the adaptation described in this article can be understood as the same or similar, and will not be described one by one below. That is to say, the length of the traditional heat dissipation port is adapted to the length of the air outlet of the fan. The direction in which the length of the air outlet of the fan is located can refer to the X direction mentioned above.

[0112] The air outlet is usually arranged on the top wall 1121 of the housing 11, so as to be close to the circuit board 14 while being able to keep away from the user. When some existing electronic devices 100 use a combination of a heat sink and a fan to dissipate heat from the heat-generating device 141, the maximum TDP of the heat dissipation system can only support up to 12W. If the heat dissipation capacity of the heat dissipation system is to be further improved, the electronic device 100 needs to be provided with two fans and two heat dissipation openings 1123.

[0113] Figure 3 Schematically shows Figure 1 a usage scenario of the electronic device 100 in Figure 3 As shown, a tablet computer is generally equipped with a stylus 3 for the convenience of user operation. For example, the stylus 3 can be used to replace the finger to operate on the display screen 12, which can not only greatly improve the accuracy and comfort of drawing, but also realize functions such as easy writing of the user on the display screen 12.

[0114] Figure 4 Schematically shows Figure 3 a schematic diagram of the setting position of the stylus 3 on the electronic device 100 in Figure 4 As shown, in some electronic devices 100, the stylus 3 is adsorbed on the top of the housing 11 for charging. The top wall 1121 of the side plate 112 forms the top of the housing 11. That is to say, the stylus 3 is adsorbed on the top wall 1121 of the side plate 112 for charging. Due to the presence of the stylus 3, only one heat dissipation opening 1123 can be opened in the remaining space at the top of the housing 11. Therefore, the presence of the stylus 3 limits the opening of two heat dissipation openings 1123 on the top of the housing 11.

[0115] Therefore, a first fan 4 and a second fan 5 are arranged in the heat dissipation system of the electronic device 100 according to the embodiments of the present application. By the first fan 4 and the second fan 5, the heat dissipation capacity of the heat dissipation system of the electronic device 100 is improved. While improving the heat dissipation performance of the electronic device 100, the second fan 5 can realize the power relay of the airflow (such as wind) flowing out of the first fan 4, and the airflow flowing out of the second fan 5 can be dissipated to the outside of the electronic device 100 through the heat dissipation opening 1123 of the electronic device 100. Through the arrangement of the first fan 4 and the second fan 5 in the present application, without changing the number of the heat dissipation openings 1123 on the existing electronic device 100, it is possible to avoid the influence of the setting of the heat dissipation openings 1123 on the adsorption charging of the stylus 3 on the housing 11.

[0116] Next, the structure of the electronic device 100 will be further described with reference to the accompanying drawings.

[0117] Figure 5 Schematically shows an internal structure schematic diagram of an electronic device 100. See Figure 5As shown, the electronic device 100 includes a housing 11 and a circuit board 14. As described above, the circumferential direction of the housing 11 has side plates 112. There is a heat dissipation opening 1123 on the side plate 112. The circuit board 14 is located inside the housing 11 to achieve the assembly of the circuit board 14 inside the housing 11. For example, the circuit board 14 can be located inside a receiving cavity (not labeled) of the housing 11. The circuit board 14 has a heat generating device 141. A heat dissipation channel 6 is provided on the circuit board 14, and the heat generating device 141 is located inside the heat dissipation channel 6 to dissipate heat from the heat generating device 141.

[0118] Figure 6 Schematically shows Figure 5 the structure of the electronic device 100 in another perspective. Figure 7 Schematically shows Figure 6 the partial cross-sectional schematic diagram of the electronic device 100 in the A-A direction. Refer to Figure 6 and Figure 7 As shown, the electronic device 100 further includes a first fan 4 and a second fan 5. The air outlet of the first fan 4 is located on the air inlet side 61 of the heat dissipation channel 6, so that the air flow flowing out of the air outlet of the first fan 4 can flow into the heat dissipation channel 6 to perform air cooling on the heat generating device 141 inside the heat dissipation channel 6. The air inlet of the second fan 5 is located on the air outlet side 62 of the heat dissipation channel 6, so that the air flow inside the heat dissipation channel 6 can enter the air inlet of the second fan 5 to achieve the air intake of the second fan 5.

[0119] Both the first fan 4 and the second fan 5 are located inside the receiving cavity of the housing 11 and on the side of the circuit board 14, so that while the first fan 4 and the second fan 5 are assembled inside the housing 11, the air outlet can be located on the air inlet side 61 of the heat dissipation channel 6, and the air inlet of the second fan 5 can be located on the air outlet side 62 of the heat dissipation channel 6.

[0120] It should be noted that the circuit board 14 can be provided with an avoidance notch (not labeled) at at least one of the first fan 4 and the second fan 5, so that while the first fan 4 and the second fan 5 can be arranged on the side of the circuit board 14, the circuit board 14 can make reasonable use of the space inside the housing 11 to achieve the layout of electronic components.

[0121] Figure 8 Schematically shows an exploded view of an electronic device 100. Figure 8 The electronic device 100 in Figure 5 is the same as the electronic device 100 in Figure 8 As shown, the air outlet of the second fan 5 is arranged facing the heat dissipation opening 1123. Since the temperature of the air flow will increase after the air flow flowing out of the air outlet of the first fan 4 performs air cooling on the heat generating device 141, in order to improve the heat dissipation performance of the heat dissipation system, it is necessary to quickly discharge the air flow inside the heat dissipation channel 6 to the outside of the housing 11.

[0122] To this end, through the arrangement of the second fan 5, the present application can achieve the power relay of the air flow flowing out of the air outlet of the first fan 4, suck the air flow in the heat dissipation channel 6 out of the heat dissipation channel 6, and dissipate it to the outside of the electronic device 100 through the heat dissipation port 1123, so that the air flow flowing out of the air outlet of the first fan 4 can quickly enter the heat dissipation channel 6 to continuously perform air cooling on the heat generating device 141, thereby improving the heat dissipation capacity of the heat dissipation system for the heat generating device 141, enhancing the heat dissipation performance of the electronic device 100, and at the same time, improving the heat dissipation efficiency of the heat generating device 141 and the electronic device 100.

[0123] Moreover, since the second fan 5 can achieve the power relay of the air flow flowing out of the air outlet of the first fan 4, although the number of fans in the electronic device 100 is increased, the number requirement for the heat dissipation port 1123 remains unchanged. That is to say, the electronic device 100 of the present application can still be provided with only one traditional heat dissipation port on the housing 11, which can simultaneously meet the air flow dissipation requirements of the first fan 4 and the second fan 5, without the need to open two traditional heat dissipation ports on the housing 11, and will not affect the setting of the stylus 3 on the housing 11.

[0124] The heat generating device 141 may include, but is not limited to, the CPU mentioned above. For example, the heat generating device 141 may further include an AP, a GPU, a charging management module, a power management module, etc. In the present application, the type of the heat generating device 141 is not further limited.

[0125] Figure 8 Only one heat generating device 141 is schematically shown, which does not constitute a limitation on the number of heat generating devices 141. For example, the number of heat generating devices 141 may also be two or more. When the number of heat generating devices 141 is two or more, in the direction from the air inlet side 61 to the air outlet side 62, the heat generating devices 141 may be arranged in sequence in the heat dissipation channel 6 so that the air flow flowing out of the first fan 4 can perform air cooling on each heat generating device 141. At this time, the heat generating device 141 with a larger heat generation amount may be arranged adjacent to the air inlet side 61, and the heat generating device 141 with a smaller heat generation amount may be arranged adjacent to the air outlet side 62, so that the air flow flowing out of the first fan 4 can preferentially dissipate heat from the heat generating device 141 with a larger heat generation amount to improve the heat dissipation efficiency of the electronic device 100. Or, each heat generating device 141 may also be arranged in sequence in the heat dissipation channel 6 along the height of the device. For example, the heat generating device 141 with a smaller device height may be arranged adjacent to the air inlet side 61, and the heat generating device 141 with a larger device height may be arranged adjacent to the air outlet side 62, so that the air flow flowing out of the first fan 4 can flow through each heat generating device 141 in sequence to achieve air cooling of each heat generating device 141 and improve the heat dissipation efficiency of the electronic device 100.

[0126] In some embodiments, when the number of the heating devices 141 is more than two, the heating devices 141 may also be centrally arranged on the air inlet side 61 of the heat dissipation channel 6. In this application, no further elaboration is made on the arrangement manner of the heating devices 141 in the electronic device 100.

[0127] Both the first fan 4 and the second fan 5 are centrifugal fans. In this way, when used for dissipating heat from the heating devices 141, compared with axial fans, the first fan 4 and the second fan 5 can have a smaller thickness and can be arranged in the housing 11 to ensure the thinness and lightness of the electronic device 100.

[0128] See Figure 8 As shown, the electronic device 100 further includes a diversion component 7. The diversion component 7 includes a first diversion member 71. At least a part of the first diversion member 71 is arranged on the board surface of the circuit board 14 and is located on the side of the heating device 141 away from the heat dissipation port 1123, so as to realize the fixation of the first diversion member 71 on the electronic device 100. For example, the first diversion member 71 can be fixed on the board surface of the circuit board 14 by means of adhesion or the like. The heat dissipation channel 6 is located in the area surrounded by the first diversion member 71 and the circuit board 14. In this way, while the heating device 141 can be located in the heat dissipation channel 6, the first diversion member 71 can guide the air flow in the heat dissipation channel 6 so that the air flow flows along the heat dissipation channel 6 to the side of the second fan 5.

[0129] One end of the first diversion member 71 is located outside the air outlet of the first fan 4 (the first air outlet 42), and the other end is located beside the second fan 5. In this way, while preventing the air flow flowing out of the first air outlet 42 from diffusing outside the heat dissipation channel 6, the first diversion member 71 can guide the air flow flowing out of the first air outlet 42 to the second fan 5 to realize the power relay of the second fan 5.

[0130] It should be noted that one end of the first diversion member 71 being located outside the first air outlet 42 means that one end of the first diversion member 71 is located outside the first air outlet 42 in the length direction (X direction).

[0131] The first diversion member 71 can be connected to the first fan 4 to enhance the airtightness of the air inlet side 61 of the heat dissipation channel 6 and ensure the heat dissipation effect of the heating device 141. Or, see Figure 8 As shown, the first diversion member 71 can also be arranged with a gap from the first fan 4 to facilitate the arrangement of the first diversion member 71 on the circuit board 14. Since the first fan 4 is a centrifugal fan, the air flow flowing out of the first air outlet 42 has a certain directionality. In this way, when the first diversion member 71 is arranged with a gap from the first fan 4, a large air flow can still be ensured in the heat dissipation channel 6 to ensure the heat dissipation effect of the heating device 141.

[0132] SeeFigure 8 As shown, the diversion component 7 may further include a second diversion member 72. The second diversion member 72 is located on the side of the heat generating device 141 adjacent to the heat dissipation port 1123. The second diversion member 72, the first diversion member 71, and the circuit board 14 can jointly enclose a heat dissipation channel 6. So that while the heat generating device 141 is arranged in the heat dissipation channel 6, the second diversion member 72 and the first diversion member 71 can guide the air flow in the heat dissipation channel 6, so that the air flow flows along the heat dissipation channel 6 to one side of the second fan 5, to increase the air intake of the second fan 5, ensure the power relay effect of the second fan 5, and enable the heat dissipation system to achieve a better heat dissipation effect on the heat generating device 141.

[0133] Similar to the first diversion member 71, the second diversion member 72 can be connected to the first fan 4 to enhance the sealing performance of the air inlet side 61 of the heat dissipation channel 6 and ensure the heat dissipation effect of the heat generating device 141. Or, as shown in Figure 8 As shown, the second diversion member 72 can also be arranged with a gap from the first fan 4, so as to facilitate the arrangement of the first diversion member 71 on the circuit board 14. Since the first fan 4 is a centrifugal fan, the air flow flowing out of the first air outlet 42 has a certain directionality. Thus, when the second diversion member 72 is arranged with a gap from the first fan 4, it can still ensure that there is a large air flow in the heat dissipation channel 6 to ensure the heat dissipation effect of the heat generating device 141.

[0134] At least a part of the second diversion member 72 is arranged on the surface of the circuit board 14. For example, as shown in Figure 8 As shown, the second diversion member 72 can be entirely arranged on the surface of the circuit board 14. Or, the second diversion member 72 can be partially arranged on the surface of the circuit board 14 and partially located outside the circuit board 14, so that the end of the second diversion member 72 is closer to the first fan 4 or the second fan 5. In this way, while realizing the assembly of the second diversion member 72 in the housing 11, the setting method of the second diversion member 72 can be made more diverse to adapt to the design requirements of different heat dissipation channels 6 for different electronic devices 100.

[0135] The end of at least one of the first diversion member 71 and the second diversion member 72 can extend to the air inlet of the second fan 5 and be located outside the air inlet of the second fan 5. By extending the end of at least one of the first diversion member 71 and the second diversion member 72, the air flow in the heat dissipation channel 6 can be guided to the air inlet of the second fan 5, to further increase the air intake of the second fan 5, enhance the power relay effect of the second fan 5, and enhance the heat dissipation effect of the heat dissipation system on the heat generating device 141.

[0136] It should be noted that in some embodiments, the first diversion member 71 can also enclose the heat dissipation channel 6 with the circuit board 14 and the side plate 112 of the housing 11.

[0137] Taking the example where the second flow guide member 72, the first flow guide member 71, and the circuit board 14 jointly enclose the heat dissipation channel 6, the structure of the electronic device 100 will be further described.

[0138] The electronic device 100 further includes a display screen 12 (not shown), and the display screen 12 is covered on the housing 11 to enable the electronic device 100 to realize the functions of display and interaction with users on the display screen 12. Both the first flow guide member 71 and the second flow guide member 72 are elastic members. The elastic member abuts against the display screen 12. While enhancing the sealing performance of the heat dissipation channel 6, due to the existence of the elastic member, when the electronic device 100 accidentally drops or is subject to other impact forces, the elastic member can play a buffering role for the display screen 12, so that the electronic device 100 has a certain buffering performance at the display screen 12.

[0139] The elastic member can include foam or the like to realize the abutment between the elastic member and the display screen 12.

[0140] It should be noted that when the electronic device 100 does not have excessive requirements for the buffering performance at the display screen 12, the first flow guide member 71 and the second flow guide member 72 can also be made of non-elastic members. For example, the first flow guide member 71 and the second flow guide member 72 can be made of plastic parts or metal parts, etc.

[0141] There is a gap between the first fan 4 and the second fan 5 and the display screen 12 to ensure that while the elastic member can play a buffering role for the display screen 12, it is convenient for the second fan 5 to intake air.

[0142] See Figure 8 As shown, there are a plurality of heat dissipation holes on the side plate 112. The plurality of heat dissipation holes form a heat dissipation opening 1123. The size of the heat dissipation opening 1123 is adapted to the size of the air outlet of the second fan 5 (the second air outlet 52). That is to say, the size of the heat dissipation opening 1123 is the same as or close to the size of the air outlet of the second fan 5, so that the air flow flowing out of the second air outlet 52 can be quickly dissipated to the outside of the electronic device 100 through the heat dissipation opening 1123 without affecting the setting of the stylus 3 on the top of the housing 11.

[0143] The heat dissipation holes can be strip-shaped, circular or other hole-shaped structures. In this application, the shape of the heat dissipation holes is not particularly limited.

[0144] See Figure 8As shown, the shape of the heat dissipation opening 1123 is adapted to the shape of the air outlet of the second fan 5 (the second air outlet 52). That is to say, the shape of the heat dissipation opening 1123 is the same as or similar to the shape of the air outlet of the second fan 5. This can ensure a good match between the shape of the heat dissipation opening 1123 and the second air outlet 52, so as to ensure that the air flow flowing out of the second air outlet 52 can quickly pass through the heat dissipation opening 1123 and be discharged, thereby further improving the heat dissipation capacity of the heat dissipation system for the heat generating device 141.

[0145] See Figure 8 As shown, the second air outlet 52 can be rectangular, and the heat dissipation opening 1123 is also rectangular. Figure 8 This does not limit the shape of the second air outlet 52. For example, when the second air outlet 52 is rectangular, the second air outlet 52 has two long sides and two wide sides, and the length of the long side is greater than the width of the wide side. At this time, one of the two wide sides of the second air outlet 52 is also inclined to the long side of the second air outlet 52 to form a kind of flared opening. The structure of this flared opening can be referred to the relevant description of the air outlet of the existing centrifugal fan. It will not be elaborated here. At this time, the shape of the heat dissipation opening 1123 can also be this kind of flared opening.

[0146] The same as the second air outlet 52, the first air outlet 42 can be rectangular or the structure of the flared opening mentioned above. In this application, the shape of the first air outlet 42 is not particularly limited.

[0147] Next, taking the first air outlet 42 and the second air outlet 52 as rectangles as an example, the structure of the electronic device 100 will be further elaborated.

[0148] See Figure 8 As shown, when the size of the heat dissipation opening 1123 is adapted to the size of the air outlet of the second fan 5 (the second air outlet 52), the length of the heat dissipation opening 1123 can be the same as or similar to the length of the second air outlet 52, and the width of the heat dissipation opening 1123 can be greater than or equal to half of the width of the side plate 112 and less than the width of the side plate 112. The direction in which the length of the second air outlet 52 is located is parallel to the direction in which the length of the heat dissipation opening 1123 is located, and the X direction can be referred to. The direction in which the width of the heat dissipation opening 1123 is located is parallel to the direction in which the width of the side plate 112 is located, and the Y direction can be referred to.

[0149] By limiting the length and width of the heat dissipation opening 1123, while the length of the heat dissipation opening 1123 can meet the air discharge requirements of the second fan 5, it can ensure the normal setting of the stylus 3 on the top of the housing 11. And by limiting the width of the heat dissipation opening 1123, it can avoid the excessive width of the heat dissipation opening 1123 from affecting the strength of the structure of the housing 11 at the heat dissipation opening 1123.

[0150] See Figure 8As shown, as described above, the top wall 1121 of the side plate 112 is configured to be away from the user when the electronic device 100 is in use. The heat dissipation channel 6 can be located on one side of the circuit board 14 adjacent to the top wall 1121. The heat dissipation opening 1123 can be provided in the top wall 1121. In this way, without changing the setting position of the heat dissipation opening 1123 on the housing 11, the distance between the heat dissipation channel 6 and the heat dissipation opening 1123 can be shortened. For the sake of simplicity of description, hereinafter, the air inlet of the first fan 4 will be collectively referred to as the first air inlet 41, the air outlet of the first fan 4 will be collectively referred to as the first air outlet 42, the air inlet of the second fan 5 will be collectively referred to as the second air inlet 51, and the air outlet of the second fan 5 will be collectively referred to as the second air outlet 52.

[0151] Since the second air inlet 51 is located on the air outlet side 62, after the distance between the heat dissipation channel 6 and the heat dissipation opening 1123 is shortened, the second air outlet 52 can be closer to the heat dissipation opening 1123, so as to shorten the distance between the second air outlet 52 and the heat dissipation opening 1123 in the Y direction. When the distance between the second air outlet 52 and the heat dissipation opening 1123 is shortened, the air flow flowing out from the second air outlet 52 of the second fan 5 can quickly pass through the heat dissipation opening 1123 and be dissipated to the outside of the electronic device 100. It not only has a small air resistance, but also can reduce the length of the heat dissipation opening 1123 while ensuring the air volume of the air flow dissipated from the heat dissipation opening 1123 to the outside of the electronic device 100, so that there is enough space at the top of the housing 11 to arrange the stylus 3 to ensure the normal arrangement of the stylus 3 on the housing 11 (such as normal charging).

[0152] Refer to again Figure 6 As shown, the air inlet side 61 and the air outlet side 62 can be distributed on both sides of the top wall 1121. The top wall 1121 has a first side (not labeled) and a second side (not labeled) in the X direction. Among them, the first side is the side of the top wall 1121 adjacent to the rear camera module 13. The second side is the side of the top wall 1121 away from the rear camera module 13. For example, when the rear camera module 13 is disposed on the left side of the bottom plate 111 close to the top wall 1121, the first side can be understood as the left side of the top wall 1121 ( Figure 6 the orientation shown in).

[0153] Refer to Figure 6 As shown, one of the air inlet side 61 and the air outlet side 62 can be distributed on the first side of the top wall 1121, and the other can be distributed on the second side of the top wall 1121. Figure 6As shown, the arrangement on both sides of the top wall 1121 through the air inlet side 61 and the air outlet side 62 can increase the length of the heat dissipation channel 6, so that the heat generating device 141 can be arranged in the heat dissipation channel 6, enabling the air flow flowing out from the first fan 4 to achieve air cooling of the heat generating device 141. In the following, in combination with the structure of the electronic device 100, the distribution of the air inlet side 61 and the air outlet side 62 on both sides of the top wall 1121 will be further elaborated.

[0154] See Figure 8 As shown, the housing 11 further includes a bottom plate 111, and side plates 112 surround the circumference of the bottom plate 111. As described above, the bottom plate 111 and the side plates 112 can form the housing 11 and enclose an accommodation cavity. The first fan 4 and the second fan 5 can be arranged on the side of the bottom plate 111 facing the side plates 112 to realize the arrangement of the first fan 4 and the second fan 5 in the housing 11.

[0155] See Figure 8 As shown, the bottom plate 111 has an air inlet channel 1111. The air inlet channel 1111 can be understood as a through hole on the bottom plate 111. The air inlet channel 1111 is connected to the air inlet of the first fan 4 (the first air inlet 41), so that the air (cold air) outside the electronic device 100 can enter the first fan 4 through the air inlet channel 1111 and the first air inlet 41, and flow out from the first air outlet 42 to form an air flow, realizing air cooling of the heat generating device 141.

[0156] It should be noted that the first air inlet 41 can be located at the air inlet channel 1111, so that the connection with the first air inlet 41 is not a direct connection. There is no blocking structure in the housing 11 between the air inlet channel 1111 and the first air inlet 41, so that the air flow can circulate between the air inlet channel 1111 and the first air inlet 41.

[0157] The shape of the air inlet channel 1111 is adapted to the shape of the first air inlet 41, so that the air inlet channel 1111 and the first air inlet 41 have a good degree of matching or similarity, so that the air (cold air) outside the electronic device 100 can quickly enter the first fan 4 through the air inlet channel 1111. While ensuring the air intake volume of the first fan 4, the size of the air inlet channel 1111 can be limited to avoid the size of the air inlet channel 1111 being too large and affecting the appearance effect of the electronic device 100.

[0158] See Figure 8 As shown, the electronic device 100 may further include an air inlet decorative member 8. The air inlet decorative member 8 is located outside the housing 11 and covers the air inlet channel 1111. The assembly effect diagram of the air inlet decorative member 8 on the electronic device 100 can be seen in Figure 9As shown, the air intake decorative member 8 is provided with a plurality of air intake holes (not labeled), and the air intake holes are communicated with the air intake passage 1111, so that the air (cold air) outside the electronic device 100 can enter the first fan 4 from the first air inlet 41 through the plurality of air intake holes and the air intake passage 1111, and flow out from the first air outlet 42 to form an air flow, realizing the air-cooling heat dissipation of the heat-generating device 141.

[0159] Moreover, through the setting of the air intake decorative member 8, it is also possible to prevent the air intake passage 1111 from being exposed and affecting the aesthetic appearance of the electronic device 100.

[0160] See Figure 9 As shown, the electronic device 100 further includes a camera module to realize the camera function of the camera module. The camera module includes a lens cover plate 15, and the lens cover plate 15 is installed on the bottom plate 111 and exposed outside the housing 11. The air intake decorative member 8 is adapted to the shape of the lens cover plate 15. For example, the shape of the lens cover plate 15 is circular, and the shape of the air intake decorative member 8 is also circular. In this way, the shape of the air intake decorative member 8 and the lens cover plate 15 can have a high degree of similarity or consistency, so as to weaken the obtrusiveness of the air intake decorative member 8 on the housing 11 through the lens cover plate 15 to ensure the aesthetic appearance of the electronic device 100.

[0161] The camera module may further include the rear camera module 13 mentioned above, etc. The bottom plate 111 is provided with a through hole (not shown) for installing the rear camera module 13, and the rear camera module 13 is installed in the through hole. At least part of the rear camera module 13 is installed in the through hole on the bottom plate 111, and the lens cover plate 15 covers the through hole and is exposed outside the housing 11. The rear camera module 13 can receive light through the lens cover plate 15 to realize the camera function.

[0162] The air intake passage 1111 may be located at a position on the bottom plate 111 opposite to the first air inlet 41. At this time, the first air inlet 41 can face the air intake passage 1111 to ensure the connection between the first air inlet 41 and the air intake passage 1111 while ensuring that the first fan 4 has sufficient air intake. Alternatively, on the premise of ensuring that the air intake of the first fan 4 can be satisfied, the through hole on the bottom plate 111 for installing the camera module can form the air intake passage 1111, and a plurality of air intake holes can be provided on the lens cover plate 15 to form the air intake decorative member 8.

[0163] Taking the case where the air intake passage 1111 is located at a position on the bottom plate 111 opposite to the first air inlet 41 as an example, the structure of the electronic device 100 will be further described below.

[0164] See Figure 9As shown, when the air inlet side 61 is distributed on the first side of the top wall 1121 and the air outlet side 62 is distributed on the second side of the top wall 1121, the air inlet decorative member 8 can be disposed adjacent to the lens cover plate 15 on the bottom plate 111, so that the air inlet decorative member 8 is adjacent to the lens cover plate 15, and the abruptness of the air inlet decorative member 8 on the housing 11 can be further weakened through the lens cover plate 15 to ensure the aesthetics of the electronic device 100.

[0165] Figure 10 Schematically shows another assembly effect diagram of the air inlet decorative member 8 on the electronic device 100. Refer to Figure 10 As shown, when the air inlet side 61 is distributed on the second side of the top wall 1121 and the air outlet side 62 is distributed on the first side of the top wall 1121, the air inlet decorative member 8 can also be disposed away from the camera assembly on the bottom plate 111. At this time, a strip-shaped decorative member 17 can be disposed between the air inlet decorative member 8 and the lens cover plate 15, and blind holes (not shown) having the same shape as the air inlet holes on the air inlet decorative member 8 can be disposed on the strip-shaped decorative member 17, so that there is continuity between the air inlet decorative member 8 and the lens cover plate 15. The abruptness of the air inlet decorative member 8 on the housing 11 can also be weakened through the strip-shaped decorative member 17 and the lens cover plate 15 to ensure the aesthetics of the electronic device 100.

[0166] Taking the example where the air inlet side 61 is distributed on the first side of the top wall 1121 and the air outlet side 62 is distributed on the second side of the top wall 1121 (the air inlet decorative member 8 is adjacent to the lens cover plate 15 on the bottom plate 111), the structure of the electronic device 100 will be further described.

[0167] Figure 11 Shows a schematic internal structure diagram of another electronic device 100. Refer to Figure 11 As shown, the heat dissipation port 1123 can be disposed at a position on the top wall 1121 opposite to the air outlet side 62. That is to say, the heat dissipation port 1123 can be disposed on the same side of the top wall 1121 as the air outlet side 62 and at the air outlet side 62. Since the second air outlet 52 is disposed facing the heat dissipation port 1123, when the heat dissipation port 1123 is disposed at a position on the top wall 1121 opposite to the air outlet side 62, the second air outlet 52 and the heat dissipation port 1123 can be disposed face to face, so as to further shorten the distance between the second air outlet 52 and the heat dissipation port 1123 in the Y direction and enhance the effects of reducing the air resistance and the opening size of the heat dissipation port 1123.

[0168] Alternatively, in some embodiments, when the heat dissipation capacity of the heat dissipation system can meet the heat dissipation requirements of the heat generating device 141, the heat dissipation port 1123 can also be arranged in a staggered manner with the second air outlet 52 in the X direction on the top wall 1121, and the arrangement of the heat dissipation port 1123 can also be avoided from affecting the arrangement of the stylus 3 on the housing 11.

[0169] When the heat dissipation opening 1123 is arranged on the top wall 1121 and is offset from the second air outlet 52 in the X direction, the heat dissipation opening 1123 and the second air outlet 52 can partially overlap in the Y direction to ensure that the air flow of the second fan 5 can be dissipated to the outside of the electronic device 100 through the heat dissipation opening 1123.

[0170] It should be noted that, in order to solve the problem that the opening of the heat dissipation opening 1123 affects the setting of the stylus 3 on the housing 11, the heat dissipation opening 1123 can also be arranged on the side wall of the side plate 112.

[0171] Taking the heat dissipation opening 1123 arranged at a position on the top wall 1121 opposite to the air outlet side 62 as an example, the structure of the electronic device 100 will be further described.

[0172] The first air outlet 42 can face the heat generating device 141 so that the air flow flowing out of the first fan 4 can directly blow towards the heat generating device 141, carry the heat of the heat generating device 141, and dissipate the air flow carrying the heat of the heat generating device 141 to the outside of the electronic device 100 through the heat dissipation opening 1123 by means of the second fan 5. At this time, by setting the first fan 4 and the second fan 5 in this way, at least while meeting the heat dissipation requirements of the electronic device 100 under low power consumption, there is no need to set a heat spreader or a heat pipe in the electronic device 100, and the cost of the electronic device 100 can also be saved.

[0173] Figure 12 Shows Figure 11 The structural schematic diagram of the electronic device 100 in another perspective in Figure 12 As shown, the electronic device 100 further includes a heat conducting plate assembly 9, and the heat conducting plate assembly 9 is located in the heat dissipation channel 6.

[0174] Figure 13 Schematically shows Figure 12 The partial cross-sectional schematic diagram of the electronic device 100 in the B-B direction in Figure 14 Shows Figure 13 The enlarged view at C. See Figure 13 And Figure 14 As shown, the heat conducting plate assembly 9 covers the side of the heat generating device 141 away from the housing 11 and is in thermal contact with the heat generating device 141. The air outlet of the first fan 4 (the first air outlet 42) faces the heat conducting plate assembly 9. The heat of the heat generating device 141 can be conducted to the heat conducting plate assembly 9, the air flow flowing out of the first air outlet 42 of the first fan 4 can directly blow towards the heat conducting plate assembly 9, and then carry the heat on the heat conducting plate assembly 9, and finally be discharged to the outside of the electronic device 100 through the second fan 5 to realize the heat dissipation of the heat generating device 141. Moreover, through the setting of the heat conducting plate assembly 9, the heat dissipation area of the heat generating device 141 can be increased, so as to facilitate the rapid heat dissipation of the heat generating device 141, and further improve the heat dissipation capacity of the heat dissipation system and the heat dissipation performance of the electronic device 100.

[0175] See Figure 14 As shown, the heat conduction plate assembly 9 may include a first heat conduction plate 91. The first heat conduction plate 91 covers the side of the heat generating device 141 away from the housing 11 and is in thermal contact with the heat generating device 141, so that the heat of the heat generating device 141 can be quickly conducted to the first heat conduction plate 91, facilitating the rapid heat dissipation of the heat generating device 141. For example, the first heat conduction plate 91 may be in thermal contact with the heat generating device 141 through a heat conducting structure such as a heat conducting pad or a heat conducting gel.

[0176] The end of the first heat conduction plate 91 extends along the heat dissipation channel 6 toward the air outlet side 62, so that the first heat conduction plate 91 has a larger heat dissipation area, facilitating the rapid heat dissipation of the heat generating device 141.

[0177] In some embodiments, the first heat conduction plate 91 may be a metal heat conduction plate, and the air outlet of the first fan 4 faces the first heat conduction plate 91. Utilizing the heat conduction characteristics of the metal heat conduction plate, while enabling the heat of the heat generating device 141 to be quickly conducted to the first heat conduction plate 91, the airflow flowing out from the first air outlet 42 of the first fan 4 can directly blow onto the first heat conduction plate 91, and then carry away the heat on the first heat conduction plate 91. For example, the metal heat conduction plate may be made of a metal plate with good heat conductivity such as a copper plate or an aluminum plate.

[0178] See Figure 14 and in combination with Figure 12 As shown, a first flow guiding groove 911 is provided on the surface of the first heat conduction plate 91 away from the heat generating device 141. The air outlet of the first fan 4 faces the air inlet end (not marked) of the first flow guiding groove 911, and the air outlet end (not marked) of the first flow guiding groove 911 is adjacent to the second fan 5. In this way, the airflow flowing out from the first fan 4 can enter the first flow guiding groove 911 through the air inlet end and flow along the first flow guiding groove 911 to the air outlet end of the first flow guiding groove 911, and then enter the second fan 5. Therefore, through the setting of the first flow guiding groove 911, a better flow guiding effect on the airflow in the heat dissipation channel 6 can be achieved.

[0179] Moreover, compared with the first heat conduction plate 91 without the first flow guiding groove 911, through the setting of the first flow guiding groove 911, the heat dissipation area of the first heat conduction plate 91 can be increased, the heat dissipation effect of the heat generating device 141 can be enhanced, and the heat dissipation capacity of the heat dissipation system and the heat dissipation performance of the electronic device 100 can be further improved.

[0180] The first flow guiding groove 911 may include, but is not limited to, Figure 12 the rectangular groove shown in the figure. For example, the first flow guiding groove 911 may also be an arc-shaped groove adapted to the direction of the airflow flowing out from the first air outlet 42. In this application, the structure of the first flow guiding groove 911 is not particularly limited.

[0181] Taking the first diversion channel 911 as a rectangular channel as an example, the structure of the electronic device 100 will be further elaborated below.

[0182] Refer to Figure 12 As shown, the number of the first diversion channels 911 is more than two. For example, the number of the first diversion channels 911 can be two, three, four, etc. The width direction of the heat dissipation channel 6 can refer to the Y direction. Along the width direction of the heat dissipation channel 6, more than two first diversion channels 911 are arranged at intervals on the first heat conducting plate 91, so as to further increase the heat dissipation area of the first heat conducting plate 91, enhance the heat dissipation effect of the heat generating device 141, and improve the heat dissipation capacity of the heat dissipation system and the heat dissipation performance of the electronic device 100.

[0183] Figure 15 The schematic diagram of the internal structure of another electronic device 100 is shown. Refer to Figure 15 As shown, in some other embodiments, the first heat conducting plate 91 can also be a heat pipe, so that when the heat of the heat generating device 141 is conducted to the heat pipe, the liquid working medium in the heat pipe can absorb the heat of the heat generating device 141 and vaporize, and conduct the heat of the heat generating device 141 to the area of the heat pipe far from the heat generating device 141, and then condense back to the area where the heat pipe contacts the heat generating device 141. Through the continuous vaporization and condensation of the liquid working medium, the heat of the heat generating device 141 can be transferred to the area of the first heat conducting plate 91 far from the heat generating device 141, so that the heat of the heat generating device 141 can be conducted to the first heat conducting plate 91, realizing the heat equalization effect of the first heat conducting plate 91 on the heat of the heat generating device 141, facilitating the rapid heat dissipation of the heat generating device 141, and further improving the heat dissipation capacity of the heat dissipation system and the heat dissipation performance of the electronic device 100.

[0184] Moreover, compared with the heat pipe, the heat pipe has a smaller thickness. Therefore, when the first heat conducting plate 91 is a heat pipe, it is also beneficial to the thinning of the electronic device 100.

[0185] The structure of the heat pipe can be determined according to the prior art. In this application, the structure of the heat pipe is not specifically described.

[0186] The air outlet of the first fan 4 can directly face the heat pipe. In this way, the air flow flowing out from the first air outlet 42 of the first fan 4 can directly blow onto the heat pipe, and then carry the heat on the heat pipe.

[0187] Figure 16 The schematic partial cross-sectional view of still another electronic device 100 is shown schematically. Different from the electronic device 100 in Figure 15 , the electronic device 100 has a second heat conducting plate 92. The cross-section formed can refer to the B-B cross-section mentioned above. Figure 16 The cross-section formed can refer to the B-B cross-section mentioned above. Figure 17 For Figure 16Enlarged view at D.

[0188] See Figure 16 and Figure 17 As shown, when the first heat conducting plate 91 is a vapor chamber, the heat conducting plate assembly 9 may further include a second heat conducting plate 92. The second heat conducting plate 92 covers the side of the first heat conducting plate 91 (vapor chamber) away from the heat generating device 141. The size of the second heat conducting plate 92 may be larger than that of the first heat conducting plate 91 so that the second heat conducting plate 92 can cover the first heat conducting plate 91. The air outlet of the first fan 4 faces the second heat conducting plate 92. In this way, the heat on the vapor chamber can be transferred to the second heat conducting plate 92. The air flow flowing out from the first air outlet 42 of the first fan 4 can directly blow onto the second heat conducting plate 92, and then carry the heat on the second heat conducting plate 92 to achieve heat dissipation of the heat generating device 141.

[0189] The second heat conducting plate 92 is a metal heat conducting plate. In order to utilize the heat conduction characteristics of the metal heat conducting plate, while the heat on the vapor chamber can be quickly conducted to the second heat conducting plate 92, the air flow flowing out from the first air outlet 42 of the first fan 4 can directly blow onto the second heat conducting plate 92, and then carry the heat on the second heat conducting plate 92. For example, the second heat conducting plate 92 can be made of a metal plate with good heat conductivity such as a copper plate or an aluminum plate.

[0190] The same as the structure when the first heat conducting plate 91 is a metal heat conducting plate, a second flow guiding groove (not shown) is provided on the surface of the second heat conducting plate 92 away from the heat generating device 141. The air outlet of the first fan 4 faces the air inlet end of the first flow guiding groove 911, and the air outlet end of the first flow guiding groove 911 is adjacent to the second fan 5. In this way, the air flow flowing out from the first fan 4 can enter the second flow guiding groove through the air inlet end and flow along the second flow guiding groove to the air outlet end of the first flow guiding groove 911, and then enter the second fan 5. Therefore, through the setting of the second flow guiding groove, a better guiding effect on the air flow in the heat dissipation channel 6 can be achieved.

[0191] Moreover, compared with the second heat conducting plate 92 without the second flow guiding groove, through the setting of the second flow guiding groove, the heat dissipation area of the second heat conducting plate 92 can be increased, the heat dissipation effect of the heat generating device 141 can be enhanced, and the heat dissipation capacity of the heat dissipation system and the heat dissipation performance of the electronic device 100 can be further improved.

[0192] The structure of the second flow guiding groove is the same as that of the first flow guiding groove 911, and will not be further described here. The number of the second flow guiding grooves and their arrangement on the second heat conducting plate 92 can refer to the relevant description of the first flow guiding groove 911 above, and will not be further described here.

[0193] It should be noted that due to the presence of the heat pipe, when the heat conduction component includes the second heat conduction plate 92, the thickness of the second heat conduction plate 92 can be smaller than that of the first heat conduction plate 91, so that there is a gap between the second heat conduction plate 92 and the display screen 12. When the first flow guide member 71 and the second flow guide member 72 are elastic members, they can play a buffering role for the display screen 12.

[0194] When the heat dissipation system only includes the first fan 4 and the second fan 5, when the electronic device 100 is in the low-power usage scenario mentioned above, the first fan 4 and the second fan 5 start, and can meet the heat dissipation requirements of the heat-generating device 141. When the electronic device 100 is in the high-power usage scenario mentioned above, the first fan 4 and the second fan 5 also start simultaneously to perform cold air heat dissipation on the heat-generating device 141 or the first heat conduction plate 91 (metal heat conduction plate). The TDP that the heat dissipation system can support is at least equivalent to the heat dissipation capacity of the existing heat dissipation system.

[0195] When the heat dissipation system includes a heat pipe in addition to the first fan 4 and the second fan 5, when the electronic device 100 is in the low-power usage scenario mentioned above, the heat-generating device 141 can be dissipated by relying only on the heat pipe. At this time, the first fan 4 and the second fan 5 do not need to start. In this way, while meeting the heat dissipation requirements of the heat-generating device 141, the purpose of quietness and power saving can be achieved. When the electronic device 100 is in the high-power usage scenario mentioned above, at this time, the first fan 4 and the second fan 5 start, and at least cooperate with the heat pipe (the second heat conduction plate 92 can also be included) to achieve high-performance heat dissipation of the heat-generating device 141. At this time, the heat dissipation capacity of the heat dissipation system is the largest, and the TDP that the heat dissipation system can support is at least 15W, which is a significant improvement compared to the maximum 12W that the existing heat dissipation system can support.

[0196] The processor on the circuit board 14 can detect the power consumption of the usage scenario of the electronic device 100. There is also a temperature sensor on the circuit board 14, and the temperature of the heat-generating device 141 can be detected through the temperature sensor. The processor can determine whether the electronic device 100 is in a low-power usage scenario or a high-power usage scenario according to the detected power consumption and the temperature of the heat-generating device 141 detected by the temperature sensor, so that the processor can control the opening and closing of the first fan 4 and the second fan 5 according to the determined usage scenario of the electronic device 100.

[0197] It should be noted that for the control of the opening and closing of the first fan 4 and the second fan 5 by the processor, reference can be made to the relevant settings in the existing electronic devices, and no further elaboration will be made here.

[0198] In the description of the present application, it should be understood that the orientation or positional relationships indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings. These are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present application.

[0199] In the description of the present application, it should be understood that the terms "comprising" and "having" used herein and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, display structure, product or device that comprises a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or are inherent to these processes, methods, products or devices.

[0200] The term "and / or" used in the present application is merely a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " herein generally represents an "or" relationship between the associated objects before and after.

[0201] Unless otherwise clearly specified and defined, the terms "mounted", "connected" and "coupled" shall be construed broadly. For example, it can be a fixed connection, or an indirect connection through an intermediate medium, and can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0202] The terms "first", "second", "third", "fourth", etc. (if any) in the description of the embodiments of the present application, the claims and the above drawings are used to distinguish similar objects, and do not necessarily have to be used to describe a specific order or sequence.

Claims

1. An electronic device, characterized in that, Comprising: A housing, the circumference of the housing having side plates, and the side plates having heat dissipation openings; A circuit board located within the housing; the circuit board having heat generating devices, and the circuit board being provided with a heat dissipation channel, the heat generating devices being located within the heat dissipation channel; A first fan, the air outlet of the first fan being located on the air inlet side of the heat dissipation channel; A second fan, the air inlet of the second fan being located on the air outlet side of the heat dissipation channel, such that the second fan takes in air from the heat dissipation channel; the air outlet of the second fan is arranged facing the heat dissipation opening.

2. The electronic device according to claim 1, wherein The side plates have a plurality of heat dissipation holes, and the plurality of heat dissipation holes form the heat dissipation opening, the size of the heat dissipation opening being adapted to the size of the air outlet of the second fan.

3. The electronic device according to claim 1 or 2, characterized in that The shape of the heat dissipation opening is adapted to the shape of the air outlet of the second fan.

4. The electronic device according to any one of claims 1 to 3, characterized in that, Along the width direction of the housing, the side plates have a top wall and a bottom wall, and the top wall is configured to be away from the user when the electronic device is in use; The heat dissipation channel is located on one side of the circuit board adjacent to the top wall, and the heat dissipation opening is arranged on the top wall.

5. The electronic device according to claim 4, wherein The air inlet side and the air outlet side are distributed on both sides of the top wall, and the heat dissipation opening is arranged at a position opposite to the air outlet side of the top wall.

6. The electronic device according to any one of claims 1-5, characterized in that, It further includes a flow guiding assembly, and the flow guiding assembly includes a first flow guiding member; At least a part of the first flow guiding member is arranged on the board surface of the circuit board and is located on the side of the heat generating device away from the heat dissipation opening; the heat dissipation channel is located in the region surrounded by the first flow guiding member and the circuit board.

7. The electronic device according to claim 6, wherein One end of the first flow guiding member is located outside the air outlet of the first fan, and the other end is located on the side of the second fan.

8. The electronic device according to claim 6 or 7, characterized in that, The flow guiding assembly includes a second flow guiding member, and the second flow guiding member is located on the side of the heat generating device adjacent to the heat dissipation opening; The second flow guiding member, the first flow guiding member, and the circuit board together enclose the heat dissipation channel.

9. The electronic device according to claim 8, wherein At least one of the ends of the first flow guiding member and the second flow guiding member extends to the air inlet of the second fan and is located outside the air inlet of the second fan.

10. The electronic device according to claim 8 or 9, characterized in that, At least a part of the second flow guiding member is arranged on the board surface of the circuit board.

11. The electronic device according to any one of claims 8-10, characterized in that, It further includes a display screen, and the display screen covers the housing; Both the first flow guiding member and the second flow guiding member are elastic members; the elastic members are in contact with the display screen, and there is a gap between the first fan and the second fan and the display screen.

12. The electronic device according to claim 11, wherein The elastic member includes foam.

13. The electronic device according to any one of claims 1-12, characterized in that, It further includes a heat conducting plate assembly, and the heat conducting plate assembly is located within the heat dissipation channel; The heat conducting plate assembly covers the side of the heat generating device away from the housing and is in heat conducting contact with the heat generating device; the air outlet of the first fan faces the heat conducting plate assembly.

14. The electronic device according to claim 13, characterized in that, The heat conducting plate assembly includes a first heat conducting plate, and the first heat conducting plate covers the side of the heat generating device away from the housing and is in heat conducting contact with the heat generating device.

15. The electronic device according to claim 14, wherein The end of the first heat conducting plate extends along the heat dissipation channel towards the air outlet side.

16. The electronic device according to claim 14 or 15, characterized in that, The first heat conducting plate is a metal heat conducting plate, and the air outlet of the first fan faces the first heat conducting plate.

17. The electronic device according to claim 16, wherein One side of the first heat conducting plate away from the heat generating device has a first flow guiding groove, the air outlet of the first fan faces the air inlet end of the first flow guiding groove, and the air outlet end of the first flow guiding groove is adjacent to the second fan.

18. The electronic device according to claim 17, wherein The number of the first flow guiding grooves is more than two, and more than two first flow guiding grooves are arranged on the first heat conducting plate at intervals along the width direction of the heat dissipation channel.

19. The electronic device according to claim 14 or 15, characterized in that, The first heat conducting plate is a vapor chamber.

20. The electronic device according to claim 19, wherein The heat conducting plate assembly further includes a second heat conducting plate, and the second heat conducting plate covers the side of the first heat conducting plate away from the heat generating device; The air outlet of the first fan faces the second heat conducting plate.

21. The electronic device according to claim 20, wherein One side of the second heat conducting plate away from the heat generating device has a second flow guiding groove; The air outlet of the first fan faces the air inlet end of the first flow guiding groove, and the air outlet end of the first flow guiding groove is adjacent to the second fan.

22. The electronic device according to claim 20 or 21, characterized in that, The second heat conducting plate is a metal heat conducting plate.

23. The electronic device according to any one of claims 1-22, characterized in that, The housing further includes a bottom plate, and the side plates are arranged around the circumferential direction of the bottom plate; The bottom plate has an air inlet channel, and the air inlet channel is communicated with the air inlet of the first fan.

24. The electronic device according to claim 23, characterized in that, It further includes an air inlet decorative part, and the air inlet decorative part is located outside the housing and covers the air inlet channel; The air inlet decorative part has a plurality of air inlet holes, and the air inlet holes are communicated with the air inlet channel.

25. The electronic device according to claim 24, characterized in that, It further includes a camera assembly, and the camera assembly includes a lens cover plate, and the lens cover plate is installed on the bottom plate and exposed outside the housing; The shape of the air inlet decorative part is adapted to the shape of the lens cover plate.

26. The electronic device according to claim 25, wherein The air inlet decorative part is arranged on the bottom plate adjacent to the lens cover plate.

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