Computer heat exchange plate and processing method thereof

Abstract

The invention relates to the technical field of computer heat dissipation, in particular to a computer heat exchange plate and a machining method.The computer heat exchange plate comprises a body of a plate-shaped structure, the front face of the body is provided with a positioning supporting part matched with an external component, and the back face of the body is provided with a positioning groove, a heat dissipation groove and a heat conduction groove; the positioning groove is used for fixing and positioning a computer operation module, and a heat conduction block is fixed in the positioning groove; a mounting groove matched with a computer operation module is formed in the heat conduction block; the heat dissipation grooves are arranged around the positioning groove in the circumferential direction, and cooling pipelines used for circulation of heat exchange liquid media are embedded in the grooves. The heat conduction grooves are located between the positioning grooves and the heat dissipation grooves, and sintering heat pipes connected with the cooling pipelines and the heat conduction blocks are fixed in the heat conduction grooves. According to the computer heat exchange plate and the machining method thereof, a computer operation module in intelligent driving can be effectively protected, positioned and supported, and the requirements of an intelligent driving system for high integration level and efficient heat dissipation can be met.

Description

Technical Field

[0001] This application relates to the technical field of computer heat dissipation, and particularly to a computer heat exchange plate and a processing method thereof. Background Art

[0002] Computer heat exchange plates play a crucial role in modern electronic devices, especially in the fields of intelligent driving and in-vehicle chips. Their efficient heat dissipation ability directly affects system stability and safety. With the rapid development of intelligent driving technology, the computing performance of in-vehicle chips has been continuously improved, posing higher requirements for heat management. Efficient heat conduction and dissipation can not only extend the service life of chips but also significantly improve system response speed and stability, providing reliable guarantees for autonomous driving decision-making, data processing, and real-time communication. Therefore, developing heat exchange plates with high thermal conductivity efficiency, good structural stability, and compact design has become an important research direction in the current industry.

[0003] In the prior art, in order to achieve efficient heat dissipation of in-vehicle chips, various means are usually adopted for heat management. On the one hand, heat dissipation fins are arranged on the heat exchange plate to increase the heat dissipation area, and natural convection or forced air cooling is used to take away heat. On the other hand, cooling pipes are arranged inside the heat exchange plate to allow the liquid medium to flow through to achieve rapid heat conduction and dissipation. In addition, there are also solutions to further improve the heat conduction efficiency by filling thermal conductive materials between the chip and the heat exchange plate. At the same time, some designs adopt an integrated structure, combining the positioning device with the heat dissipation function to optimize space utilization. Although these methods have solved the heat dissipation problem to a certain extent, they do not fully meet the dual requirements of high compactness and efficient heat dissipation for high-performance in-vehicle chips.

[0004] However, the heat exchange plates in the prior art generally have the problem of poor heat conduction paths. In particular, the heat exchange efficiency between the chip and the cooling pipe is relatively low, resulting in limited overall heat dissipation performance. At the same time, in various harsh working conditions faced during vehicle driving, ordinary heat dissipation plates cannot effectively protect and position the chip, and lack an integrated design, making it difficult to meet the strict requirements of intelligent driving systems for high integration and efficient heat dissipation. These problems limit the long-term stable operation of in-vehicle chips and urgently need to be improved. Summary of the Invention

[0005] To overcome the deficiencies of the above prior art, this application provides a computer heat exchange plate and a processing method thereof, which can effectively protect and positionally support the computer operation module in intelligent driving, and can also meet the requirements of intelligent driving systems for high integration and efficient heat dissipation.

[0006] This application is realized through the following technical solutions: A computer heat exchange plate, comprising a plate-shaped body. A positioning and supporting part adapted to an external component is provided on the front surface of the body, and a positioning groove, a heat dissipation groove and a heat conduction groove are provided on the back surface; the positioning groove is used for fixing the positioning of a computer operation module, and a heat conduction block is fixed in the positioning groove; an installation groove adapted to the computer operation module is provided in the heat conduction block; the heat dissipation groove is arranged circumferentially around the positioning groove, and a cooling pipe for the circulation of a heat exchange liquid medium is embedded in the groove; a plurality of the heat conduction grooves are located between the positioning groove and the heat dissipation groove, and a sintered heat pipe connecting the cooling pipe and the heat conduction block is fixed in the heat conduction groove.

[0007] By adopting the above technical solution, the computer heat exchange plate can effectively dissipate heat from the computer operation module. Specifically, the plate-shaped body combined with the positioning and supporting part on the front surface ensures the stable connection between the heat exchange plate and the external component, improves the reliability of the overall structure, and the positioning and supporting part can support the body to form an interval space when connecting with the external component, ensuring good ventilation and increasing the heat dissipation area; the positioning groove provided on the back surface is used for fixing the computer operation module, ensuring the accuracy of the module position, improving the heat dissipation efficiency at the same time, and the positioning groove can provide all-round protection for the computer operation module, especially the intelligent chip; the heat conduction block in the positioning groove and the installation groove inside it can closely fit the computer operation module to promote rapid heat conduction; the heat dissipation groove is arranged around the positioning groove and the cooling pipe is embedded in it, and through the circulation of the heat exchange liquid medium, efficient heat exchange is achieved; the sintered heat pipe fixed in the heat conduction groove connects the cooling pipe and the heat conduction block, further enhancing the heat transfer efficiency from the heat conduction block to the cooling pipe, reducing the thermal resistance and improving the overall heat dissipation performance.

[0008] Optionally, connection parts for clamping with the heat conduction block and the cooling pipe and increasing the heat conduction contact area are provided at the ends of the evaporation section and the cooling section of the sintered heat pipe.

[0009] By adopting the above technical solution, the connection parts are provided at the ends of the evaporation section and the cooling section of the sintered heat pipe, which can be clamped and fixed with the heat conduction block and the cooling pipe, and can also increase the heat conduction contact area, improve the heat conduction efficiency, reduce the thermal resistance and improve the heat exchange performance.

[0010] Further optionally, the connection part is a protruding block, a recessed part adapted to the protruding block is provided on the side wall of the cooling pipe, and a socket adapted to the protruding block is provided on the heat conduction block.

[0011] By adopting the above technical solution, the connection between the sintered heat pipe of the computer heat exchange plate, the heat conduction block and the cooling pipe is more stable. Specifically, the cooperative design of the block, the concave part and the rabbet significantly increases the heat conduction contact area, thereby improving the heat transfer efficiency. In addition, this structural design effectively reduces the thermal resistance, ensuring that the heat generated by the computer operation module can be quickly conducted to the heat exchange liquid medium in the cooling pipe, and thus improving the overall heat dissipation performance.

[0012] Further optionally, the concave part is filled with graphite.

[0013] By adopting the above technical solution, the connecting part between the sintered heat pipe of the computer heat exchange plate and the cooling pipe adopts a block structure. The side wall of the cooling pipe is provided with a concave part adapted to the block, and the heat conduction block is provided with a rabbet adapted to the block. This structural design effectively increases the heat conduction contact area and improves the heat transfer efficiency. Further, the concave part is filled with graphite. By utilizing the good thermal conductivity and stability of graphite, the heat conduction performance can be significantly improved, the thermal resistance can be reduced, and thus the heat dissipation effect of the entire heat exchange plate can be enhanced.

[0014] Optionally, heat dissipation fins are provided on the outer surface of the bottom of the positioning groove.

[0015] By adopting the above technical solution, heat dissipation fins are provided on the outer surface of the bottom of the positioning groove of the computer heat exchange plate, which can significantly increase the heat exchange area, improve the conduction efficiency of heat from the computer operation module to the external environment, and thus effectively reduce the working temperature of the operation module and improve the stability and service life of the device.

[0016] Further optionally, the side wall of the heat dissipation fin is of a wavy structure.

[0017] By adopting the above technical solution, the heat dissipation fins with a wavy structure can significantly increase the heat dissipation area and improve the heat exchange efficiency. At the same time, the wavy structure helps to optimize the air flow distribution, enabling the cooling air to fully contact the heat dissipation fins during the flow process, further enhancing the heat dissipation effect. In addition, this design can also reduce the material usage and manufacturing cost while ensuring the heat dissipation performance.

[0018] Further optionally, heat dissipation holes are provided at the bottom of the positioning groove, and the heat dissipation holes are located between the heat dissipation fins; heat conduction fins adapted to the heat dissipation holes are provided at the bottom of the heat conduction block.

[0019] By adopting the above technical solution, the settings of the heat dissipation holes and the heat conducting fins significantly improve the heat dissipation performance of the heat exchange plate. Specifically, the heat dissipation holes can promote the air circulation at the bottom of the positioning groove and accelerate the heat dissipation; the heat conducting fins are adapted to the heat dissipation holes, further improving the heat conduction efficiency at the bottom of the heat conducting block, so that the heat can be transferred to the external environment more quickly. This structural design effectively reduces the working temperature of the computer operation module and improves the stability and service life of the device.

[0020] Further optionally, the height of the heat dissipation fins is greater than the height of the heat conducting fins; the end face of the heat conducting fins is in a wavy structure.

[0021] By adopting the above technical solution, the height of the heat dissipation fins being greater than the height of the heat conducting fins can effectively increase the heat dissipation area, enabling the heat to be dissipated to the surrounding environment faster, thus enhancing the overall heat dissipation efficiency. At the same time, the end face of the heat conducting fins is in a wavy structure, further increasing the effective contact area of heat conduction, improving the heat conduction efficiency, and helping to optimize the heat flow distribution, reducing the thermal resistance, and ensuring the stable operation of the computer operation module under high load conditions.

[0022] Optionally, at least two positioning grooves are provided on the body, the cooling pipe includes a main pipe and branch pipes, a plurality of water outlets connected to the branch pipes are provided on the main pipe, and a temperature-sensitive valve plate is provided at the water outlet; the temperature-sensitive valve plate is composed of two metal sheets with different coefficients of thermal expansion, the metal sheet with a lower coefficient of thermal expansion is arranged on the side close to the sintered heat pipe, and the deformation free end of the temperature-sensitive valve plate presents an arc structure that can reduce the cross-sectional area of the water outlet for flow; the branch pipes are arranged around the circumferential direction of the positioning groove.

[0023] By adopting the above technical solution, the computer heat exchange plate can achieve precise temperature control of different positioning groove areas. Specifically, the temperature-sensitive valve plate on the main pipe deforms according to the temperature change at its location, and uses the characteristics of the bimetallic sheet to automatically adjust the cross-sectional area of the water outlet for flow, thereby dynamically controlling the flow rate of the cooling liquid medium flowing into each branch pipe; this design not only improves the cooling efficiency but also can self-regulate the flow rate of the medium flowing from the main pipe into each branch pipe, ensuring that the heat in each positioning groove area can be evenly and effectively exported, further enhancing the stability and reliability of the operation of the computer operation module.

[0024] Further optionally, an anodic oxidation layer is provided on the body; fastening threaded holes for connecting with external components are provided on the positioning support part.

[0025] By adopting the above technical solutions, the setting of the anodic oxidation layer on the body can significantly improve the corrosion resistance and wear resistance of the heat exchange plate, thereby extending its service life. The setting of the fastening threaded holes on the positioning and supporting part realizes the stable connection between the heat exchange plate and the external components, improving the stability and reliability of the overall structure.

[0026] A processing method for a computer heat exchange plate according to any one of the above, specifically including the following steps: Manufacture a positioning tooling, on which there are positioning bumps, and the gaps formed between the positioning bumps and the adjacent positioning and supporting parts are adapted; Workpiece front processing, according to the design drawing, process the positioning and supporting part on the front of the blank, and process the fastening threaded hole at the bottom of the supporting part; Workpiece back processing, first fit the blank with the processed positioning and supporting part with the positioning tooling, so that the positioning bumps of the positioning tooling are engaged with the positioning and supporting part, and use the existing fastening threaded holes on the blank to make a fastening connection with the positioning tooling; then process the positioning groove, heat dissipation groove and heat conduction groove on the back of the workpiece; Surface oxidation, perform anodic oxidation treatment on the surface of the workpiece that has completed the front and back processing.

[0027] By adopting the above technical solutions, the processing method can efficiently and accurately prepare the computer heat exchange plate. Specifically, by manufacturing the positioning tooling and using the cooperation between the positioning bumps and the positioning and supporting part, the precise positioning of the workpiece during the processing is realized, effectively avoiding the processing error and improving the yield rate of the product; in the workpiece front processing step, the positioning and supporting part and the fastening threaded hole are processed on the blank, providing a reliable connection basis for the subsequent back processing and simplifying the assembly process; in the workpiece back processing step, through the engagement and fastening connection of the positioning tooling, the processing accuracy of the positioning groove, heat dissipation groove and heat conduction groove is ensured, and at the same time, the installation space consistency of components such as the cooling pipe and the sintered heat pipe is guaranteed; the surface oxidation treatment enhances the corrosion resistance and wear resistance of the body, extending the service life of the computer heat exchange plate.

[0028] In summary, the present application includes at least one of the following beneficial technical effects: In the present application, by arranging the heat conduction block in the positioning groove and connecting the heat conduction block and the cooling pipe with the sintered heat pipe, the rapid conduction and dissipation of the chip heat are realized, significantly improving the heat exchange efficiency and solving the problem of unsmooth heat conduction path in the prior art; 1. In the present application, the heat dissipation grooves are arranged around the positioning groove, combined with the circulation of the heat exchange liquid medium in the cooling pipe, forming an efficient heat dissipation circulation system, effectively meeting the requirements of high-performance vehicle machine chips for compactness and efficient heat dissipation; 2. The heat dissipation grooves of the present application are arranged around the positioning grooves, and combined with the circulation of the heat exchange liquid medium in the cooling pipe, an efficient heat dissipation cycle system is formed, effectively meeting the requirements of high-performance in-vehicle computer chips for compactness and efficient heat dissipation; 3. The design of the positioning and supporting part and the positioning groove of the present application is integrated, which not only enhances the structural stability, but also optimizes the space layout, provides reliable protection and positioning for the chip, and adapts to the harsh working conditions during vehicle driving. Description of the Drawings

[0029] Figure 1 is the overall structural schematic diagram of the computer heat exchange plate described in Embodiment 1; Figure 2 is the structural schematic diagram of the front of the body described in Embodiment 1; Figure 3 is the structural schematic diagram of the back of the body described in Embodiment 1; Figure 4 is the structural schematic diagram of the heat conduction block described in Embodiment 1; Figure 5 is the structural schematic diagram of the cooling pipe described in Embodiment 1; Figure 6 is the layout structural schematic diagram of the sintered heat pipe described in Embodiment 1; Figure 7 is the layout structural schematic diagram of the sintered heat pipe described in Embodiment 2; Figure 8 is the layout structural schematic diagram of the graphite described in Embodiment 2; Figure 9 is the structural schematic diagram of the cooling pipe described in Embodiment 2; Figure 10 is the structural schematic diagram of the front of the body described in Embodiment 3; Figure 11 is the structural schematic diagram of the back of the body described in Embodiment 3; Figure 12 is the structural schematic diagram of the bottom of the heat conduction block described in Embodiment 3; Figure 13 is the layout structural schematic diagram of the positioning groove and the heat dissipation groove described in Embodiment 4; Figure 14 is the structural schematic diagram of the main pipe described in Embodiment 4; Figure 15 is the layout structural schematic diagram of the temperature-sensitive valve plate described in Embodiment 4; Figure 16 is the structural schematic diagram of the temperature-sensitive valve plate described in Embodiment 4.

[0030] In the figure: 1. Body; 2. Positioning and supporting part; 21. Fastening threaded hole; 3. Positioning groove; 31. Heat dissipation fin; 32. Heat dissipation hole; 4. Heat dissipation groove; 5. Heat conduction groove; 6. Cooling pipe; 61. Main pipe; 62. Branch pipe; 63. Temperature sensing valve plate; 631. Active layer; 632. Passive layer; 633. Deformation free end; 64. Concave part; 7. Heat conduction block; 71. Installation groove; 72. Heat conduction fin; 73. Tongue-and-groove joint; 74. Wire groove; 8. Sintered heat pipe; 81. Connection part; 9. Graphite; 10. Cover plate. Detailed implementation mode

[0031] The technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope protected by the present application.

[0032] Embodiment 1 Refer to Figures 1 - 3 , the embodiment of the present application discloses a computer heat exchange plate, including a plate-shaped body 1. The front of the body 1 is provided with a positioning and supporting part 2 adapted to external components, and the back is provided with a positioning groove 3, a heat dissipation groove 4 and a heat conduction groove 5; the positioning groove 3 is used to fix the positioning of the computer operation module, and a heat conduction block 7 is fixed in the positioning groove 3; an installation groove 71 adapted to the computer operation module is provided in the heat conduction block 7; the heat dissipation groove 4 is arranged around the circumference of the positioning groove 3, and a cooling pipe 6 for the circulation of the heat exchange liquid medium is embedded in the groove; a plurality of heat conduction grooves 5 are located between the positioning groove 3 and the heat dissipation groove 4, and a sintered heat pipe 8 connecting the cooling pipe 6 and the heat conduction block 7 is fixed in the heat conduction groove 5, achieving the effects of improving the heat conduction efficiency, enhancing the structural stability and optimizing the space layout. To protect the computer operation module, the front of the body 1 can be fixed with a cover plate 10 by means of threaded fastening, enclosing the cooling pipe 6 and the computer operation module inside, and positioning grooves for installing other computer operation modules can also be provided on the cover plate 10 to realize a computer heat exchange plate in a three-dimensional structure.

[0033] Specifically, refer to Figures 2 - 3 , the body 1 can be made of aluminum alloy or copper alloy materials, with good heat conductivity and structural strength; the positioning and supporting part 2 includes a plurality of convex structures, such as cylindrical or square bosses, and a fastening threaded hole 21 is provided at the top for connecting with external components; the diameter of the fastening threaded hole 21 can be selected according to actual needs, such as specifications of M4, M6, etc., to adapt to different installation scenarios.

[0034] Refer to Figures 2 - 3, to improve the corrosion resistance and wear resistance of the body 1 and extend its service life, an anodic oxidation layer is provided on the body 1; a fastening threaded hole 21 for connecting with an external member is provided on the positioning and supporting portion 2; specifically, the thickness of the anodic oxidation layer is 10 μm to 25 μm, and its surface presents a uniform oxide film, having good wear resistance and corrosion resistance.

[0035] Refer to Figures 2 - 3 , the cross-section of the positioning groove 3 is a rectangular or circular groove, and its depth and width are customized according to the size of the computer operation module; the heat conducting block 7 is made of a high heat conducting material, for example, it can be formed by die-casting graphite 9, and its surface is polished to reduce the thermal resistance.

[0036] Refer to Figure 4 , the shape of the heat conducting block 7 is adapted to the positioning groove 3, and it can also be flat or arc-shaped to adapt to different types of computer operation modules; the heat conducting block 7 can be formed by die-casting graphite 9, and the installation groove 71 provided in the heat conducting block 7 is a rectangular groove to adapt to different types of computer operation modules, and a wire groove 74 for wire penetration is provided on the side of the port of the installation groove 71.

[0037] Refer to Figure 5 , the heat dissipation groove 4 is an annular groove, and its cross-sectional shape can be rectangular or semi-circular, and it can be specifically designed according to the shape of the cooling pipe 6; the cooling pipe 6 is a metal pipe, such as a copper pipe or a stainless steel pipe, and its outer wall is nickel-plated to improve the corrosion resistance; the cross-sectional shape of the cooling pipe 6 is circular or elliptical, and it can be specifically optimized and designed according to fluid dynamics; the cooling pipe 6 is fixed in the heat dissipation groove 4 by welding or bonding to ensure its stable position.

[0038] Refer to Figure 6 , the sintered heat pipe 8 can be a copper heat pipe, and a working medium, such as water and ammonia, is filled inside; the surface of the sintered heat pipe 8 is coated to improve the heat conduction efficiency; the two ends of the sintered heat pipe 8 are respectively connected to the heat conducting block 7 and the cooling pipe 6 to achieve rapid heat conduction.

[0039] The implementation principle of this embodiment is as follows: The combination of the plate-shaped body 1 and the positioning and supporting part 2 on the front ensures the stable connection between the heat exchange plate and external components, improves the reliability of the overall structure, and the positioning and supporting part 2 can support the body 1 to form an interval space when connecting with external components, ensuring good ventilation and increasing the heat dissipation area; the positioning groove 3 arranged on the back is used to fix the computer operation module, ensuring the accuracy of the module position, improving the heat dissipation efficiency at the same time, and the positioning groove 3 can provide all-round protection for the computer operation module, especially the intelligent chip; the heat conduction block 7 in the positioning groove 3 and the installation groove 71 inside it can closely fit the computer operation module to promote rapid heat conduction; the heat dissipation grooves 4 are arranged around the positioning groove 3 and are embedded with cooling pipes 6, and through the circulation of the heat exchange liquid medium, efficient heat exchange is achieved; the sintered heat pipe 8 fixed in the heat conduction groove 5 connects the cooling pipe 6 and the heat conduction block 7, further enhancing the heat transfer efficiency from the heat conduction block 7 to the cooling pipe 6, reducing the thermal resistance, and improving the overall heat dissipation performance.

[0040] Embodiment Two Referring to Figures 7 - 9 , the difference between this embodiment and Embodiment One lies in that the ends of the evaporation section and the cooling section of the sintered heat pipe 8 are provided with a connecting part 81 for clamping with the heat conduction block 7 and the cooling pipe 6 and increasing the heat conduction contact area; specifically, the connecting part 81 is a step block, the side wall of the cooling pipe 6 is provided with a recessed part 64 adapted to the step block, and the heat conduction block 7 is provided with a step opening 73 adapted to the step block; in order to further improve the heat conduction efficiency, the recessed part 64 can be filled with graphite 9; the step block is a rectangular or trapezoidal block, and its material is the same as that of the sintered heat pipe 8; the recessed part 64 is a groove matching the shape of the step block, and its depth and width are designed according to the size of the step block; the graphite 9 is filled in the recessed part 64 and abuts against the side wall of the heat dissipation groove 4 or the sintered heat pipe 8, which can increase the heat conduction area between the medium flowing in the cooling pipe 6 and the outside and improve the heat conduction efficiency.

[0041] The implementation principle of this embodiment is as follows: By utilizing the stable connection relationship between the structural characteristics of the sintered heat pipe 8 itself and the heat conduction block 7 and the cooling pipe 6, and the cooperative design of the step block and the recessed part 64 and the step opening 73 significantly increases the heat conduction contact area, thereby improving the heat transfer efficiency; in addition, this structural design effectively reduces the thermal resistance, ensuring that the heat generated by the computer operation module can be quickly conducted to the heat exchange liquid medium in the cooling pipe 6, and thus improving the overall heat dissipation performance.

[0042] Embodiment Three Referring to Figures 10 - 11, the difference between this embodiment and the first embodiment is that heat dissipation fins 31 are provided on the outer surface of the bottom of the positioning groove 3; the side wall of the heat dissipation fin 31 is in a wavy structure, which increases the heat dissipation area; and heat dissipation holes 32 are provided at the bottom of the positioning groove 3, and the heat dissipation holes 32 are located between the heat dissipation fins 31; specifically, the heat dissipation fin 31 is in a thin sheet structure, and its material is the same as that of the body 1; the height difference between the wave crest and the wave trough of the wavy structure is 1 mm to 3 mm, and can be specifically adjusted according to the heat dissipation requirements. The heat dissipation hole 32 is a circular or square hole, and its diameter or side length is 2 mm to 5 mm. The heat conduction fin 72 is a rectangular sheet, and its thickness is 0.5 mm to 1 mm.

[0043] Referring to Figure Figures 11 - 12 , a heat conduction fin 72 adapted to the heat dissipation hole 32 is provided at the bottom of the heat conduction block 7; the height of the heat dissipation fin 31 is greater than the height of the heat conduction fin 72; the end surface of the heat conduction fin 72 is in a wavy structure, so that a double-wavy ventilation flow channel is formed on the side surface and the bottom surface between the heat dissipation fins 31.

[0044] The implementation principle of this embodiment is as follows: Through bending or folding, the wavy structure can increase the actual surface area of the fins under the same projected area, thereby providing more heat dissipation area in contact with the air. Compared with straight fins, the heat dissipation efficiency can be increased by 10% - 30%; and the wavy fins will disrupt the laminar flow state of the air flow, forcing the air to generate more turbulence when flowing through the fins, thereby breaking the thermal boundary layer. Turbulence can significantly increase the convective heat transfer coefficient and accelerate the transfer of heat from the fin surface to the air.

[0045] Embodiment Four Referring to Figures 13 - 15 , the difference between this embodiment and the first embodiment is that two positioning grooves 3 are provided on the body 1, and the cooling pipeline 6 includes a main pipe 61 and branch pipes 62. An outlet for connecting the branch pipes 62 is provided on the main pipe 61, and a temperature-sensitive valve plate 63 is provided on the side wall of the outlet close to the sintered heat pipe 8. The temperature-sensitive valve plate 63 is composed of two metal sheets with different coefficients of thermal expansion.

[0046] Specifically, referring to Figures 15 - 16 , the temperature-sensitive valve plate 63 includes an active layer 631 and a passive layer 632. The active layer 631 is made of a material with a high coefficient of thermal expansion, such as manganese-nickel alloy; the passive layer 632 is made of a material with a low coefficient of thermal expansion, such as invar alloy; if cost is to be saved, a combination of brass and steel can also be used; among them, the active layer 631 with a high coefficient of thermal expansion is on the side away from the sintered heat pipe 8, and the deformation free end of the temperature-sensitive valve plate 63 presents an arc structure that can reduce the cross-sectional area of the outlet flow. When the temperature of the temperature-sensitive valve plate 63 rises, the active layer 631 changes greatly, driving the arc structure to stretch and move towards the direction close to the fixed pipe wall, thereby increasing the cross-sectional area of the flow to achieve autonomous flow distribution.

[0047] The implementation principle of this embodiment is as follows: The computer heat exchange plate can achieve precise temperature control of different positioning groove 3 areas. Specifically, the temperature sensing valve plate 63 on the main pipe 61 deforms according to the temperature change at its location, and uses the characteristics of the bimetallic sheet to automatically adjust the flow area of the water outlet, thereby dynamically controlling the flow rate of the cooling liquid medium flowing to each branch pipe 62. This design not only improves the cooling efficiency, but also ensures that the heat in each positioning groove 3 area can be evenly and effectively exported, further enhancing the stability and reliability of the computer operation module.

[0048] Embodiment Five This application embodiment also discloses a processing method based on the above computer heat exchange plate, which specifically includes the following steps: manufacturing a positioning tooling, on which there are positioning bumps that are adapted to the gap space formed between adjacent positioning support parts 2; machining the front surface of the workpiece, according to the design drawing, machining the positioning support part 2 on the front surface of the blank, and machining fastening threaded holes 21 at the bottom of the support part; machining the back surface of the workpiece, first fitting the blank with the processed positioning support part 2 to the positioning tooling, so that the positioning bumps of the positioning tooling engage with the positioning support part 2, and using the existing fastening threaded holes 21 on the blank to tightly connect with the positioning tooling; then machining the positioning groove 3, heat dissipation grooves 4 and heat conduction grooves 5 on the back surface of the workpiece; surface oxidation, performing anodic oxidation treatment on the surface of the workpiece that has completed the front and back surface machining.

[0049] The implementation principle of this application embodiment is: Through precise processing technology, the structural accuracy and functionality of the computer heat exchange plate are ensured, and the production efficiency and product quality are improved.

[0050] Finally, it should be noted that: The above embodiments are only used to illustrate the technical solutions of this application, rather than to limit them; Although this application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: They can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; And these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the technical solutions of this application embodiment.

Claims

1. A computer heat exchange plate, characterized in that, It includes a main body (1) in a plate-like structure. A positioning and supporting part (2) adapted to an external component is provided on the front surface of the main body (1), and a positioning groove (3), a heat dissipation groove (4) and a heat conduction groove (5) are provided on the back surface; the positioning groove (3) is used for fixing the positioning of a computer operation module, and a heat conduction block (7) is fixed in the positioning groove (3); an installation groove (71) adapted to the computer operation module is provided in the heat conduction block (7); the heat dissipation groove (4) is arranged around the circumference of the positioning groove (3), and a cooling pipe (6) for the circulation of a heat exchange liquid medium is embedded in the groove; a plurality of the heat conduction grooves (5) are located between the positioning groove (3) and the heat dissipation groove (4), and a sintered heat pipe (8) connecting the cooling pipe (6) and the heat conduction block (7) is fixed in the heat conduction groove (5).

2. The computer heat exchange plate according to claim 1, characterized in that Connection parts (81) for clamping with the heat conduction block (7) and the cooling pipe (6) and increasing the heat conduction contact area are provided at the ends of the evaporation section and the cooling section of the sintered heat pipe (8).

3. The computer heat exchange plate according to claim 2, wherein The connection part (81) is a step block. A recessed part (64) adapted to the step block is provided on the side wall of the cooling pipe (6), and a step opening (73) adapted to the step block is provided on the heat conduction block (7).

4. The computer heat exchange plate according to claim 3, wherein Graphite (9) is filled in the recessed part (64).

5. The computer heat exchange plate according to claim 1, wherein Heat dissipation fins (31) are provided on the outer surface of the bottom of the positioning groove (3).

6. The computer heat exchange plate according to claim 5, wherein, The side wall of the heat dissipation fin (31) has a wavy structure.

7. The computer heat exchange plate according to claim 5, wherein, Heat dissipation holes (32) are provided at the bottom of the positioning groove (3), and the heat dissipation holes (32) are located between the heat dissipation fins (31); heat conduction fins (72) adapted to the heat dissipation holes (32) are provided at the bottom of the heat conduction block (7).

8. The computer heat exchange plate according to claim 7, characterized in that, The height of the heat dissipation fin (31) is greater than the height of the heat conduction fin (72); the end surface of the heat conduction fin (72) has a wavy structure.

9. The computer heat exchange plate according to claim 1, wherein At least two positioning grooves (3) are provided on the main body (1). The cooling pipe (6) includes a main pipe (61) and branch pipes (62). A plurality of water outlets connected to the branch pipes (62) are provided on the main pipe (61), and a temperature-sensitive valve plate (63) is provided at the water outlet; the temperature-sensitive valve plate (63) is composed of two metal sheets with different coefficients of thermal expansion. The metal sheet with a lower coefficient of thermal expansion is arranged on the side close to the sintered heat pipe (8), and the deformation free end of the temperature-sensitive valve plate (63) presents an arc structure that can reduce the cross-sectional area of the water outlet for circulation; the branch pipes (62) are arranged around the circumference of the positioning groove (3).

10. A processing method of the computer heat exchange plate according to any one of claims 1 to 9, characterized in that, Specifically, it includes the following steps: Manufacture a positioning tooling. The positioning tooling is provided with positioning bumps, and the positioning bumps are adapted to the clearance space formed between adjacent positioning and supporting parts (2); Workpiece front processing. According to the design drawing, a positioning and supporting part (2) is processed on the front surface of the blank, and a fastening threaded hole (21) is processed at the bottom of the supporting part; For the machining of the back surface of the workpiece, first, the blank with the machined positioning and supporting part (2) is fitted with the positioning tooling, so that the positioning protrusion of the positioning tooling engages with the positioning and supporting part (2), and the existing fastening threaded hole (21) on the blank is used for fastening connection with the positioning tooling; then, the positioning groove (3), heat dissipation groove (4) and heat conduction groove (5) are machined on the back surface of the workpiece. Surface oxidation: The surface of the workpiece after the front and back surface machining is subjected to anodic oxidation treatment.

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