Liquid cooling device and server liquid cooling system

Abstract

The invention provides a liquid cooling device and a server liquid cooling system, and the device comprises a box body which is provided with a first phase region and a second phase region in a first direction; a cooling working medium can be arranged in the first phase region and is used for absorbing heat generated by the heating unit in the first phase region, so that the cooling working medium is converted from a liquid state to a gas state and moves to the second phase region; and the condensation part is arranged in the second phase region and used for converting the cooling working medium in the second phase region from the gas state to the liquid state and moving the cooling working medium to the first phase region, so that the first phase region and the second phase region are in a balanced state.

Description

Technical Field

[0001] The present disclosure relates to the technical field of servers, and in particular, to a liquid cooling device and a server liquid cooling system. Background Art

[0002] In modern data centers, with the continuous increase in the power density of servers, traditional air cooling technologies have gradually been unable to meet the requirements of efficient heat dissipation. To address this challenge, liquid cooling technology, as an advanced cooling method, has received extensive attention and application.

[0003] In a liquid cooling system, when the heat generated by the heat generating unit of the server causes the coolant to heat up, the heat is carried away. When the coolant in the box is in a saturated superheated state, local boiling may occur, resulting in local bubble aggregation. The coolant rapidly evaporates and vaporizes in large quantities, the volume expands, the gas-liquid two-phase loses balance, and explosive boiling in the liquid phase region of the box is triggered.

[0004] Due to the strong vibrations caused by the boiling and evaporation of the coolant, these vibrations may damage the electronic components on the server motherboard, thereby affecting the reliability and stability of the system. Therefore, how to avoid excessive explosive boiling and ensure the gas-liquid balance in the box is the core problem to be solved. Summary of the Invention

[0005] The present disclosure provides a liquid cooling device and a server liquid cooling system to solve at least the above technical problems.

[0006] According to a first aspect of the present disclosure, there is provided a liquid cooling device, comprising:

[0007] A box body, which has a first phase region and a second phase region along a first direction;

[0008] The first phase region is capable of arranging a cooling working medium for absorbing the heat generated by the heat generating unit located in the first phase region, so that the cooling working medium changes from a liquid state to a gaseous state and moves to the second phase region;

[0009] A condensation component, which is arranged in the second phase region for changing the cooling working medium located in the second phase region from a gaseous state to a liquid state and moving to the first phase region, so that the first phase region and the second phase region are in a balanced state.

[0010] According to a second aspect of the present disclosure, there is provided a server liquid cooling system, comprising

[0011] A server, which includes a heat generating unit;

[0012] A liquid cooling device, which is connected to the server to dissipate heat from the heat generating unit; the liquid cooling device includes:

[0013] A housing, the housing having a first phase region and a second phase region along a first direction;

[0014] The first phase region can be provided with a cooling working fluid for absorbing heat generated by the heating unit located in the first phase region, so that the cooling working fluid changes from a liquid state to a gaseous state and moves to the second phase region;

[0015] A condensation component, the condensation component is arranged in the second phase region for changing the cooling working fluid located in the second phase region from a gaseous state to a liquid state and moving to the first phase region, so that the first phase region and the second phase region are in a balanced state. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] By reading the following detailed description with reference to the drawings, the above and other objects, features and advantages of the exemplary embodiments of the present disclosure will become readily understood. In the drawings, several embodiments of the present disclosure are shown in an exemplary and non-limiting manner, wherein:

[0017] In the drawings, the same or corresponding reference numerals represent the same or corresponding parts.

[0018] Figure 1 The structural schematic diagram of the liquid cooling device according to the embodiment of the present disclosure is shown Figure 1 ;

[0019] Figure 2 The structural schematic diagram of the liquid cooling device according to the embodiment of the present disclosure is shown Figure 2 ;

[0020] Figure 3 The structural schematic diagram of the first circulation device in the liquid cooling device according to the embodiment of the present disclosure is shown Figure 1 ;

[0021] Figure 4 The structural schematic diagram of the first circulation device in the liquid cooling device according to the embodiment of the present disclosure is shown Figure 2 ;

[0022] Figure 5 The structural schematic diagram of the liquid cooling device according to the embodiment of the present disclosure is shown Figure 3 ;

[0023] Figure 6 The schematic diagram of the condensation component and the second circulation device in the liquid cooling device according to the embodiment of the present disclosure is shown;

[0024] Figure 7 The structural schematic diagram of the liquid cooling device according to the embodiment of the present disclosure is shown Figure 4 ;

[0025] Figure 8 The schematic diagram of the liquid inlet assembly and the liquid discharge assembly in the liquid cooling device according to the embodiment of the present disclosure is shown;

[0026] Figure 9 Shows a schematic diagram of a collection component in a liquid cooling device according to an embodiment of the present disclosure;

[0027] Figure 10 Shows a schematic structure of a liquid cooling device according to an embodiment of the present disclosure Figure 5 ;

[0028] Figure 11 Shows a schematic diagram of a power supply component and a heating component in a liquid cooling device according to an embodiment of the present disclosure;

[0029] Figure 12 Shows a schematic structure of a server liquid cooling system according to an embodiment of the present disclosure Figure 1 ;

[0030] Figure 13 Shows a schematic diagram of the structure of a server liquid cooling system according to an embodiment of the present disclosure;

[0031] Reference numerals: 1 - box body, 2 - first phase region, 3 - second phase region, 4 - condensation component, 5 - heating unit, 6 - first liquid inlet pipe, 7 - first liquid outlet pipe, 8 - first heat exchanger, 9 - first circulation pump, 10 - second liquid inlet pipe, 11 - second liquid outlet pipe, 12 - second heat exchanger, 13 - second circulation pump, 14 - regulating valve, 15 - liquid discharge component, 16 - liquid inlet component, 17 - power supply component; 18 - heating component, 19 - first circulation loop, 20 - first liquid storage tank, 21 - first flowmeter, 22 - first heat dissipation component, 23 - temperature intelligent controller, 24 - first filter, 25 - second circulation loop, 26 - cooling water storage tank, 27 - cooling water filter, 28 - second flowmeter, 29 - second heat dissipation component, 30 - high - speed camera, 31 - recorder, 32 - thermocouple, 33 - liquid inlet, 34 - second filter, 35 - liquid discharge port, 36 - third filter, 37 - electronic device, 38 - server, 39 - visualization window, 40 - pressure sensor, 41 - LED light source. Detailed implementation manners

[0032] To make the objectives, features, and advantages of the present disclosure more obvious and understandable, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present disclosure.

[0033] In the following description, reference is made to "some embodiments", which describe a subset of all possible embodiments. However, it is understood that "some embodiments" may be the same subset or different subsets of all possible embodiments, and may be combined with each other without conflict.

[0034] In the following description, the terms "first / second" are only used to distinguish similar objects and do not represent a specific order for the objects. It is understood that "first / second" may be interchanged in a specific order or sequence when permitted, so that the embodiments of the present disclosure described herein can be implemented in an order other than that illustrated or described herein.

[0035] Unless otherwise defined, all technical and scientific terms used in this disclosure have the same meaning as commonly understood by those of ordinary skill in the technical field to which this disclosure belongs. The terms used in this disclosure are only for the purpose of describing the embodiments of this disclosure and are not intended to limit this disclosure.

[0036] It should be understood that in various embodiments of the present disclosure, the magnitude of the serial numbers of the respective implementation processes does not imply the order of execution. The order of execution of each process should be determined by its function and internal logic, and should not constitute any limitation to the implementation process of the embodiments of the present disclosure.

[0037] Figure 1 The structural schematic of the liquid cooling device according to the embodiment of the present disclosure is shown Figure 1 ; as Figure 1 shown, the liquid cooling device includes:

[0038] A box body 1, the box body having a first phase region 2 and a second phase region 3 along a first direction;

[0039] The first phase region 2 is capable of setting a cooling working medium for absorbing the heat generated by a heating unit 5 located in the first phase region 2, so that the cooling working medium changes from a liquid state to a gaseous state and moves to the second phase region 3;

[0040] A condensation component 4, the condensation component 4 being arranged in the second phase region 3 for changing the cooling working medium located in the second phase region 3 from a gaseous state to a liquid state and moving to the first phase region 2, so that the first phase region 2 and the second phase region 3 are in an equilibrium state.

[0041] Here, the box body 1 may be a refrigeration box, and the box body 1 has an accommodation space for accommodating a cooling working medium, a heating unit, a server, etc., and is capable of refrigerating and cooling the cooling working medium, the heating unit, the server, etc.

[0042] The first direction is the vertical direction inside the box body 1, or may also be the height direction of the box body 1, and the first phase region 2 is located below the second phase region 3.

[0043] The box body is provided with a plurality of heating units along the second direction, and the plurality of heating units are arranged at intervals along the second direction. The first direction is perpendicular to the second direction; the first direction is the parallel direction inside the box body 1, or it can also be the width direction of the box body 1.

[0044] The division of the first phase region 2 and the second phase region 3 is based on the heat exchange process inside the box body 1 and the physical state change of the cooling medium. In the liquid cooling device, the first phase region 2 is a region inside the box body, where the cooling medium absorbs heat and is converted into a gaseous state. The second phase region 3 is another region inside the box body, which is the flow region of the gaseous medium. The first phase region 2 can also be called the liquid phase region, and the second phase region 3 can also be called the gas phase region.

[0045] Here, the cooling medium is a liquid used to absorb and transfer heat, which helps the heating unit transfer the heat from the heating unit to the external environment, or dissipate heat through other cooling mechanisms. It can undergo physical state changes during the process of absorbing or releasing heat, such as the evaporation of the liquid or the condensation of the gas. The role of the cooling medium is to absorb heat from the heat source (such as the heating unit 5) and take away the heat through conduction, physical state changes, etc., so as to keep the equipment temperature within the safe range. The cooling medium can adopt fluorinated liquid, or other coolants with lower boiling points and higher heat conduction performance, for example, Freon-based coolants, liquid ammonia, etc.

[0046] The liquid cooling device effectively absorbs and transfers heat by utilizing the liquid-gas conversion of the cooling medium in different phase regions. When the heat generated by the heating unit 5 causes the cooling medium to change from a liquid state to a gaseous state and enters the second phase region, the condensation component 4 converts the gaseous medium back to a liquid state and continues to circulate, which can provide a more efficient heat transfer and heat dissipation effect. Compared with traditional air cooling, it can better meet the heat dissipation requirements of the heating unit.

[0047] Here, the condensation component 4 is a component used to cool and convert the gaseous cooling medium (such as steam or gas) into a liquid state. When the hot gas contacts the condensation component 4, it absorbs heat and cools down, and finally becomes a liquid state. The condensation component 4 can adopt a condenser, a condensation coil, etc. The condensation component 4 can be arranged in the second phase region and can contact the gaseous cooling medium to cool the gaseous cooling medium.

[0048] By maintaining the balance state of the first phase region 2 and the second phase region 3, local overheating can be avoided, and the problem of thermal runaway caused by excessive boiling can be prevented. The role of the condensation component 4 enables the balance between gas and liquid to be restored, thus avoiding system failures caused by the imbalance between gas and liquid phases. Moreover, due to the continuous circulation of the phase state conversion of the cooling medium, the stability of the liquid cooling device is improved. The condensation and evaporation processes cooperate with each other, which helps the equipment maintain a stable temperature during long-term operation, thereby improving the reliability and service life of the entire system.

[0049] Among them, the equilibrium state may include: heat dissipation equilibrium, gas-liquid state equilibrium, and gas-liquid circulation equilibrium;

[0050] Heat dissipation equilibrium means that the generated heat is released to the external environment to achieve heat balance.

[0051] Gas-liquid equilibrium means that during the cooling process, the phases of the gas and liquid can maintain a certain proportion, without excessive gas or liquid, to avoid overheating or thermal runaway caused by too much or too little gas.

[0052] Gas-liquid circulation equilibrium means that the circulation process of the gas and liquid in the heat exchange remains stable and does not occur abnormally.

[0053] In the embodiments of the present disclosure, the heat dissipation of the cooling medium can be achieved through the condensation component 4, achieving heat dissipation equilibrium, gas-liquid state equilibrium, and gas-liquid circulation equilibrium, which can effectively avoid the vibration caused by the boiling and evaporation of the cooling medium. This can not only prevent the vibration from damaging the heating unit, but also improve the stability and reliability of the entire system.

[0054] In some embodiments, the box body 1 may further include: a refrigeration component, which can be disposed inside the box body and can refrigerate the first phase region and the second phase region simultaneously. Here, the refrigeration component is a component for reducing the temperature inside the box body, such as an evaporator, a thermoelectric cooler, and an expansion valve.

[0055] In some embodiments, the first phase region 2 is connected to a first circulation device. The first inlet pipe 6 and the first outlet pipe 7 of the first circulation device are arranged at intervals along the first direction and are connected to the box body 1 to form a first circulation loop. The cooling medium in the liquid state in the first phase region 2 dissipates heat through the first circulation loop, so that the cooling medium in the first phase region 2 circulates along the surface of the heating unit.

[0056] Here, the first phase region 2 and the first circulation device form a closed loop, enabling the cooling medium to flow in this closed loop. The first circulation device is a driving system for the flow of the cooling medium, which promotes the cooling medium to flow through the loop and complete the heat exchange task. The first inlet pipe 6 and the first outlet pipe 7 are respectively connected to the box body, and the cooling medium enters and leaves the heat dissipation area through them. The cooling medium enters the heat dissipation area through the first inlet pipe, absorbs heat there, and then leaves through the first outlet pipe and enters the next step of the circulation system.

[0057] Figure 2 The structural schematic of the liquid cooling device according to the embodiments of the present disclosure is shown Figure 2 , such as Figure 2As shown, the first direction may be the vertical direction, that is, the first liquid inlet pipe 6 and the first liquid outlet pipe 7 of the first circulation device are arranged at intervals along the direction perpendicular to the bottom of the box body. The first liquid inlet pipe 6 is located above the first liquid outlet pipe 7, or the first liquid inlet pipe 6 is located below the first liquid outlet pipe 7. There is a certain distance or interval between the first liquid inlet pipe 6 and the first liquid outlet pipe 7 in space, and they are connected to the box body 1 to form a first circulation loop. The first circulation device further includes a first heat exchanger 8 and a first circulation pump 9.

[0058] Figure 3 The structural schematic diagram of the first circulation device in the liquid cooling device according to the embodiment of the present disclosure is shown Figure 1 , such as Figure 3 As shown, the first direction may be the vertical direction. The first liquid inlet pipe 6 is located above the first liquid outlet pipe 7. There is a certain distance or interval between the first liquid inlet pipe 6 and the first liquid outlet pipe 7 in space. The inlet (i.e., the connection port of the first liquid inlet pipe and the box body) and the outlet (i.e., the connection port of the first liquid outlet pipe and the box body) of the first circulation device can be designed in the vertical upper and lower intervals of the chip of the heating unit 5, but the memory module (DIMM, Dual Inline Memory Module) area needs to be avoided to increase the flow rate, so that the cooling working medium can flow in a more open area, thereby reducing the flow resistance, increasing the flow rate, and improving the cooling effect.

[0059] Here, the heating unit 5 is the part that generates heat, which can be the chip of an electronic device, an industrial device, etc. It is necessary to use a cooling working medium to maintain the normal working temperature and prevent failures caused by overheating. The liquid cooling working medium exchanges heat through the surface of the heating unit during flow, taking away the heat generated by the heating unit, so as to achieve the purpose of heat dissipation.

[0060] The liquid cooling working medium can efficiently absorb heat during the circulation process and take away the heat through the pipeline to ensure stable heat dissipation effect. Through continuous circulation, the cooling working medium can continuously take away more heat and avoid heat accumulation on the surface of the heating unit. Since the liquid working medium circulates along the surface of the heating unit 5, it can be evenly distributed to each area, effectively avoiding the formation of hot spots. The temperature balance ensures that the device can operate stably during the working process and will not malfunction due to local overheating.

[0061] In some embodiments, the first circulation device includes:

[0062] A first heat exchanger 8, connected to the first circulation loop, for reducing the temperature of the cooling working medium circulating in the first circulation loop;

[0063] A first circulation pump 9, connected to the first circulation loop, driving the cooling working medium to circulate in the first circulation loop for reducing the temperature of the cooling working medium in the gaseous state in the second phase region.

[0064] As shown Figure 2 in FIG. 1, the first heat exchanger 8 is connected to the first circulation loop. The first heat exchanger 8 transfers the heat in the cooling working fluid by exchanging heat with other media (such as air), thereby reducing the temperature of the cooling working fluid circulating in the first circulation loop. Specifically, the cooling working fluid is brought to the outside by the first circulation device, and the heat is taken away. The heat is dissipated in the first heat exchanger by exchanging heat with the external medium (air or water).

[0065] The first circulation pump 9 is connected in the first circulation loop to drive the cooling working fluid to circulate in the loop. In this way, the first circulation pump 9 can take away the relatively hot cooling working fluid in the box body, obtain the cooling working fluid with a lower temperature after cooling through the first circulation loop, and then supplement the cooling working fluid with a lower temperature into the box body, thereby also being able to reduce the temperature of the cooling working fluid in the gaseous state in the second phase region.

[0066] The first circulation device continuously drives the flow of the cooling working fluid, which can ensure that the cooling working fluid can continuously take away heat. In this way, the heat of the heating unit (such as an electronic device, etc.) is taken away by the cooling working fluid circulating in the loop.

[0067] Since the temperature of the liquid cooling working fluid is lower than that of the gaseous cooling working fluid, that is, the temperature of the second phase region is higher than that of the first phase region, the first circulation pump drives the liquid cooling working fluid to circulate, reducing the temperature of the liquid cooling working fluid, and further reducing the temperature of the gaseous cooling working fluid in the second phase region. Specifically, the flow of the cooling working fluid is realized here through the external first circulation device, the liquid flow rate is increased, the influence of explosive boiling is weakened, and thus the boiling is weakened. Through the external circulation heat dissipation of the cooling working fluid, the temperature of the cooling working fluid can be adjusted according to the heat dissipation requirement, and then the temperature of the steam at the condensation end can be reduced, while avoiding the damage of electronic devices caused by explosive boiling in the liquid phase region. By reducing the temperature of the gaseous cooling working fluid, it can be ensured that the gaseous cooling working fluid can take away more heat in the next circulation process. In this way, the gaseous cooling working fluid can effectively help the device dissipate heat and avoid the failure of the cooling working fluid or the overheating of the device due to too high temperature.

[0068] Figure 4 shows a schematic structure of the first circulation device in the liquid cooling device according to an embodiment of the present disclosure Figure 2 ; As shown Figure 4As shown, the first circulation device may include: a first heat exchanger 8, a first circulation pump 9, a first circulation loop 19 (i.e., the external circulation loop of the cooling working fluid), a first liquid storage tank 20, a first flowmeter 21, a first heat dissipation component 22, and a first filter 24; the first heat exchanger 8 is connected to the first circulation loop 19. The first heat exchanger 8 transfers the heat in the cooling working fluid by exchanging heat with air, and at the same time, the first heat dissipation component 22 can enhance the heat dissipation effect. The first heat dissipation component 22 may include at least one cooling fan. The cooling working fluid can be stored in the first liquid storage tank 20 for a period of time to further dissipate heat. In addition, the first circulation pump 9 may also be provided with a temperature sensor, and the first circulation device is also provided with a first flowmeter 21 to measure the temperature and flow rate of the cooling working fluid in the first circulation loop respectively. And, a first filter 24 is provided in the loop to filter the cooling working fluid.

[0069] The device may further include a temperature intelligent controller 23, a device for realizing the automation of the first circulation device, which can control whether the first circulation pump 9 starts according to a certain parameter (such as the temperature of the cooling working fluid), that is, control whether the first circulation device dissipates heat.

[0070] In some embodiments, the size of the first phase region 2 along the first direction is greater than the size of the second phase region 3 along the first direction;

[0071] The cooling working fluid in a liquid state located in the first phase region 2 can cover the heating unit 5 along the first direction. The heating unit 5 is arranged in the first phase region 2 along the first direction, and the top of the cooling working fluid is kept at a target distance from the top of the heating unit 5;

[0072] When in the equilibrium state, the position of the heating element relative to the box body remains unchanged.

[0073] Here, the size of the first phase region 2 along the first direction is greater than the size of the second phase region 3 along the first direction. The first phase region 2 can be a relatively large area, while the second phase region 3 can be relatively small. The second phase region 3 is the region where the cooling working fluid changes from a liquid state to a gaseous state. The first phase region 2 has a relatively large size to provide sufficient space for the liquid cooling working fluid to cover the heating unit 5. In this way, the contact area between the liquid cooling working fluid and the heating unit 5 is effectively increased, and the heat exchange efficiency is enhanced.

[0074] Here, in the first phase region 2, the cooling working fluid is in a liquid state and can cover the heating unit along the first direction, ensuring that the cooling working fluid can fully contact the surface of the heating unit. The liquid cooling working fluid can effectively reduce the temperature of the heating unit 5 in this region.

[0075] The top of the liquid cooling medium maintains a target distance from the top of the heat generating unit 5, indicating that the liquid level of the cooling medium does not directly contact the heat generating unit, but maintains a certain spacing to ensure appropriate heat exchange efficiency and avoid other problems caused by excessive contact. Among them, the target distance refers to the ideal spacing between the top of the liquid cooling medium and the top of the heat generating unit, and this distance can be determined according to the structural design of the liquid cooling device and the flow characteristics of the cooling medium. By maintaining the target distance, it is necessary to ensure that during the gas-liquid conversion process, the liquid cooling medium can always cover the heat generating unit 5 and will not be unable to cover the entire heat generating unit due to too low a liquid level. Moreover, if the top of the liquid cooling medium is too close to the heat generating unit 5, it may cause the temperature of the coolant to rise rapidly and start to evaporate prematurely, and evaporation will cause the coolant to lose its cooling function and reduce the efficiency of the entire cooling system. By maintaining the target distance, it can be ensured that the cooling medium is within an appropriate temperature range and evaporation is avoided.

[0076] Under the equilibrium state of the system, the position of the heat generating unit relative to the box body remains unchanged, indicating that during normal operation, the position of the heat generating unit is fixed and will not change due to changes or flows of the cooling medium, thus ensuring the stability and reliability of the equipment. The first circulation device causes the cooling medium in the box body 1 to flow and circulate near the radiator of the heat generating unit 5, which is beneficial to removing bubbles on the radiator surface to enhance boiling heat transfer and improve the convective heat transfer effect at the same time.

[0077] In some embodiments, a second circulation device is provided at the top of the box body 1, and the second circulation device forms a second circulation loop with the condensation component 4 through the box body to dissipate the condensate of the condensation component through the second circulation loop;

[0078] The boiling point of the cooling medium is less than the boiling point of the condensate.

[0079] Here, the second circulation device can be located in the second phase region 3, can be at the top of the box body, or can be provided at positions such as the left or right side. And the second circulation loop is connected to the condensation component 4, so that the second circulation device and the condensation component 4 jointly form a closed-loop system through the box body for circulating the condensate and promoting heat dissipation.

[0080] The second circulation loop can be used to dissipate heat from the condensate through this loop. The condensate serves as a heat exchange medium in the second circulation loop, absorbing heat from the gaseous cooling medium to cool the gaseous cooling medium, enabling it to change from a gaseous state to a liquid state. During this process, the temperature of the condensate will be relatively high due to heat absorption. Therefore, external circulation through the second circulation loop is required to dissipate heat, ensuring that the heat of the system can be effectively removed and preventing a decrease in system efficiency caused by excessive temperature. The realization of the condensation function mainly depends on the temperature difference in heat exchange. After the condensate absorbs the temperature of the gaseous cooling medium, its own temperature rises and needs to be cooled. By flowing the condensate in the second circulation loop, the temperature of the condensate is reduced. Moreover, the second circulation loop can also carry the condensate to the outside for external circulation cooling.

[0081] Here, the cooling medium plays a role in heat transfer, and its boiling point is lower than that of the condensate. When the heat of the heat-generating unit is transferred to the low-boiling-point cooling medium, when the cooling medium absorbs heat and reaches its boiling point, it will first evaporate into a gas. The vapor rises above the gas-liquid interface, and the heat is absorbed by the condensation component. After the gaseous cooling medium absorbs heat, it condenses into droplets and falls back into the boiling pool in the first phase region. After the condensate is cooled in the condensation component, it continues to dissipate heat through the second circulation loop. The low boiling point of the cooling medium ensures that it can evaporate at a lower temperature, thereby effectively removing more heat.

[0082] In this way, through the setting of the second circulation device and its loop, the temperature of the condensate can be effectively reduced through the heat dissipation process. This design optimizes the efficiency of heat exchange, ensuring that the condensate can quickly release the absorbed heat, thereby improving the thermal management ability of the entire system.

[0083] In one example, the liquid cooling device can dissipate heat only through the condensation component 4. After the cooling medium absorbs the heat of the heat-generating unit 5, its temperature rises. When the temperature reaches the boiling point and generates steam, the gaseous cooling medium rises and contacts the condensation component 4. The condensation component 4 absorbs the heat of the steam and condenses it into droplets, which then fall back into the first phase region, realizing heat dissipation of the cooling medium.

[0084] In another example, the liquid cooling device can cooperate with the first circulation device and the second circulation device to dissipate heat. The first phase region 2 and the first circulation device form a closed loop, and the cooling working fluid flows in this loop. By taking away the relatively hot cooling working fluid in the box body, cooling the working fluid through the first circulation loop to obtain a relatively low-temperature cooling working fluid, and then supplementing the relatively low-temperature cooling working fluid into the box body, the temperature of the cooling working fluid in the first phase region can be reduced, and thus the temperature of the cooled gaseous cooling working fluid in the second phase region is also reduced. At the same time, the second circulation device dissipates heat from the condensate used for heat absorption in the condensing component 4. The condensate acts as a heat exchange medium in the second circulation loop to absorb heat from the gaseous cooling working fluid, causing the gaseous cooling working fluid to cool down. However, as the condensate absorbs heat, its temperature will also rise. Here, the condensate is circulated to cool it down.

[0085] In some embodiments, the second circulation device includes:

[0086] A second heat exchanger 12, connected to the second circulation loop, for reducing the temperature of the condensate circulating in the second circulation loop;

[0087] A second circulation pump 13, connected to the second circulation loop, driving the condensate to circulate in the second circulation loop, for bringing the gaseous cooling working fluid in the second phase region into contact with the surface of the condensing component 4 so that it changes from gaseous to liquid and drips into the first phase region.

[0088] Figure 5 The structural schematic of the liquid cooling device according to the embodiment of the present disclosure is shown Figure 3 , as Figure 5 shown, the second heat exchanger 12 and the second circulation pump 13 form a second circulation loop with the condensing component 4 through the second liquid inlet pipe 10 and the second liquid outlet pipe 11 of the box body, and the second circulation device has the second heat exchanger 12 and the second circulation pump 13.

[0089] Here, the second heat exchanger 12 is connected to the second circulation loop for reducing the temperature of the condensate flowing in the second circulation loop. The condensate is cooled by the second heat exchanger 12 so that it can continue to participate in the cooling process of the cooling working fluid after its temperature is reduced. The second circulation pump 13 is connected to the second circulation loop and is responsible for driving the condensate to circulate in the loop, enabling the condensate to flow in the loop, thereby promoting contact with the gaseous cooling working fluid and performing heat exchange.

[0090] In the second circulation loop, the condensing component 4 absorbs the heat of the cooling working fluid through the gaseous contact with the cooling working fluid, and the coolant in the condensing component 4 absorbs the heat of the cooling working fluid, causing the gaseous cooling working fluid to liquefy on the contact surface. This process is part of the heat exchange, that is, the gaseous cooling working fluid is cooled on the surface of the condensing component 4 and changes from gaseous to liquid, and the condensed liquid cooling working fluid will drip into the first phase region 2 to continue its circulation process. Through this mechanism, the cooling working fluid effectively takes away the heat from the second circulation loop, ensuring the efficient operation of the system.

[0091] Figure 6 The figure shows a schematic diagram of the condensing component and the second circulation device in the liquid cooling device according to an embodiment of the present disclosure, as Figure 6 shown, the condensing component 4 can adopt a condensing plate heat exchanger or a condensing coil, and the second circulation device includes: a second heat exchanger 12, a second circulation pump 13, and may further include: a second circulation loop 25 outside the box body, a cooling water storage tank 26, a cooling water filter 27, a second flow meter 28, and a second heat dissipation component 29. The second heat exchanger 12 is connected to the second circulation loop 25, and the second heat exchanger 12 transfers the heat in the condensate (such as cooling water) to the outside by heat exchange with the air. At the same time, the second heat dissipation component 29 can be used to enhance the heat dissipation effect, and the second heat dissipation component 29 can include at least one heat dissipation fan. The condensate can be stored in the cooling water storage tank 26 for a period of time to further dissipate heat. In addition, the second circulation device is also provided with a second flow meter 28 to measure the flow rate of the condensate in the second circulation loop. And, a cooling water filter 27 is provided to filter the cooling water.

[0092] In some embodiments, a regulating valve 14 is provided at the top of the box body, and the regulating valve is connected to the second phase region 3;

[0093] A liquid discharge component 15 is provided at the bottom of the box body, and the liquid discharge component is connected to the first phase region;

[0094] A liquid inlet component 16 is provided on the side of the box body, and the cooling working fluid enters the first phase region through the liquid inlet component.

[0095] Figure 7 The figure shows the structural schematic of the liquid cooling device according to an embodiment of the present disclosure Figure 4 , as Figure 7 shown, a regulating valve 14 is provided at the top of the box body 1, and the regulating valve 14 is connected to the second phase region 3 for controlling the pressure in the second phase region 3, and the regulating valve can be adjusted automatically or manually.

[0096] A liquid discharge component 15 is provided at the bottom of the box body, and the liquid discharge component 15 is connected to the first phase region 2 for discharging the excess cooling working fluid in the first phase region 2. The design of the liquid discharge component 15 ensures the normal flow and treatment of the cooling working fluid, avoiding liquid accumulation causing system failures or performance degradation.

[0097] The side of the box body is provided with a liquid inlet assembly 16 for allowing the cooling working fluid to enter the first phase region 2 through this assembly. The liquid inlet assembly 16 is an important interface for the cooling working fluid to enter the system, which ensures that the cooling working fluid can smoothly enter the first phase region and participate in the heat exchange process.

[0098] Figure 8 The schematic diagram of the liquid inlet assembly and the liquid discharge assembly in the liquid cooling device according to the embodiment of the present disclosure is shown. As Figure 8 shown, the liquid inlet assembly may include: a liquid inlet 33 and a third filter 36; the liquid inlet 33 is connected to the box body 1 through the third filter 36, and the fluorinated liquid is injected through the liquid inlet 33 and flooded to at least 10 cm above the heating unit 5, so that the top of the cooling working fluid is kept at a target distance from the top of the heating unit 5. The liquid discharge assembly includes: a liquid discharge port 35, and the liquid discharge port 35 is connected to the box body 1 through a second filter 34, and the fluorinated liquid flows out from the liquid discharge port 35.

[0099] In some embodiments, the device further includes: a collection component. The box body is provided with a collection area, and the collection component is correspondingly arranged with the collection area for collecting target parameters of the first phase region and the second phase region;

[0100] When in a balanced state, the target parameters satisfying the balance condition include at least one of the following combinations;

[0101] The data parameters of the first phase region satisfy the first balance threshold;

[0102] The data parameters of the second phase region satisfy the second balance threshold;

[0103] The image parameters of the first phase region satisfy the first boiling threshold;

[0104] The image parameters of the second phase region satisfy the second boiling threshold.

[0105] Here, the collection component is used to collect and monitor the target parameters related to the operation state of the device. The target parameters may include various physical quantities and image information, and can comprehensively reflect the state of the cooling working fluid.

[0106] The collection area refers to the area preset in the box body for the collection equipment. Usually, devices such as temperature sensors, pressure sensors, flow velocity sensors, flow meters, and image collectors can be deployed to obtain the working data of the first phase region and the second phase region. Among them, the image collector can be used to collect the boiling degree, bubbles, etc. of the liquid cooling working fluid, and can also collect the gasification phenomena such as the boiling degree and steam degree of the gas state.

[0107] The first phase region and the second phase region represent two different working regions inside the device, involving the alternating use of liquid and gaseous working fluids. In the cooling system, the cooling working fluids in the first phase region and the second phase region are in different thermodynamic states (such as liquid, vapor, etc.), and involve different working fluid flow and phase change phenomena (such as boiling, gasification, etc.).

[0108] When the device is operating, it pursues a balanced state, that is, all target parameters are within the specified threshold range to ensure that the cooling working fluid can flow and transform effectively and stably during the cooling or heat exchange process.

[0109] The balance condition of the target parameters can be related to parameters such as temperature, pressure, flow rate, and flow volume.

[0110] For example, the first balance threshold: The data such as temperature, pressure, flow rate, and flow volume in the first phase region must meet specific thresholds to ensure that this region is in a stable working state.

[0111] The second balance threshold: The data such as temperature, pressure, flow rate, and flow volume in the second phase region must also be within a predetermined range to ensure that this region is in a stable working state and avoid a decrease in system efficiency.

[0112] The image parameters can be related to the gasification and boiling phenomena of the working fluid.

[0113] The first boiling threshold: The image parameters in the first phase region, such as the boiling degree and bubble state of the liquid cooling working fluid, should meet specific thresholds. Monitoring the boiling degree can reflect the gasification degree of the liquid. For example, the appearance of bubbles means that the liquid is undergoing the gasification process, and the number of bubbles is related to the boiling degree, which can also reflect the current temperature situation.

[0114] The second boiling threshold: The image parameters in the second phase region, such as the boiling degree and steam degree of the gaseous cooling working fluid, should meet the second boiling threshold. The steam degree is closely related to the gasification degree. By analyzing the boiling degree through image recognition technology, it is possible to determine whether the steam state of the gas phase is within the expected range.

[0115] The data parameters can be physical quantities measured by sensors to reflect characteristics such as temperature, pressure, flow velocity, and flow rate. The image parameters can be obtained through visual sensors (such as high-precision cameras or infrared imaging) or image collectors such as cameras to understand the boiling or vaporization state of the cooling working fluid during the heat exchange process. The boiling degree can be divided into slight boiling and violent boiling (i.e., bumping). For bumping, it can be determined by combining temperature monitoring and image analysis. For example, when the temperature of the cooling working fluid reaches or approaches its boiling point, the temperature monitoring can obtain the detected temperature. At the same time, through image analysis, the surface of the cooling working fluid can be observed in real time. The bumping phenomenon is usually accompanied by the violent generation of bubbles in the liquid. According to the image analysis, the bubble generation speed can be determined, and whether bumping occurs can be judged by combining the temperature and the bubble generation speed reflected by the image.

[0116] In one example, the data parameter of the first phase region is the temperature of the cooling working fluid in the first phase region (assumed to be T1). The data parameter of the first phase region satisfies the first equilibrium threshold. It can be that the temperature of T1 is within the interval [A, B]. Assuming the boiling point of the cooling working fluid is 45 degrees, then A can be 43 degrees and B can be 45 degrees.

[0117] In another example, the image parameter of the first phase region is the boiling condition of the cooling working fluid in the first phase region (such as judged by the speed of bubble formation, evaporation, etc.). The image parameter of the first phase region satisfies the first boiling threshold. It can be the boiling degree determined according to the collected image, and this boiling degree satisfies the first boiling threshold, such as no boiling or slight boiling.

[0118] Figure 9 The schematic diagram of the acquisition component in the liquid cooling device according to the embodiment of the present disclosure is shown; as Figure 9 shown, the acquisition component may include: a high-speed camera 30, which can collect image data and send it to the electronic device 37 for analysis, and the electronic device can be a computer. The acquisition component may further include: a thermometer or a temperature sensor or a thermocouple 32, which collects the temperatures of the liquid cooling working fluid in the first phase region 2 and the gaseous cooling working fluid in the second phase region 3, and sends the collected results to the recorder 31. The recorder 31 may have a display and can display various target parameters detected. The collected data can also be sent to the electronic device 37 for analysis. The electronic device 37 and the recorder 31 can also receive the data of the first flowmeter and the second flowmeter to understand the flow rates of the cooling working fluid and the condensate.

[0119] In some embodiments, a heating component 18 is provided on one side of the first phase region 2 away from the second phase region 3 for preheating the cooling working fluid;

[0120] Power supply component, the power supply component 17 is electrically connected to the heating component 18; the power supply component 17 is electrically connected to the heating unit 5, and the heat generated by the operation of the heating unit.

[0121] Figure 10 It shows a schematic diagram of the electrical connection between a power supply component and a heating component; as Figure 10 shown, the power supply component 17 is electrically connected to the heating component 18 and the heating unit 5. The heating component 18 can be arranged below the heating unit 5. Taking the cooling medium as fluorinated liquid (boiling point is 47 degrees) as an example, the purpose of preheating is to make the temperature of the cooling medium reach about 40 degrees to avoid too low temperature. If it is too low (such as 20 degrees), that is, when the chip suddenly has high power consumption in a low-power environment, the chip temperature will suddenly rise, and it is difficult to reach the temperature for the external circulation device to dissipate heat, which will cause the inability to dissipate heat or poor heat dissipation effect, and then cause chip damage. And when heated to 40 degrees, when the temperature rises by a few degrees, the external circulation device (assuming the external circulation device starts at 43 degrees) will immediately start circulating for heat dissipation.

[0122] Figure 11 It shows a schematic diagram of the power supply component and the heating component in the liquid cooling device according to the embodiment of the present disclosure, as Figure 11 shown, the heating component 18 is a heating rod, and a low-voltage and high-power dry-type auxiliary heating rod is adopted to preheat the cooling medium. The power supply component 17 can be powered by a DC power supply.

[0123] In some embodiments, the device further includes: a control component, configured to control the first circulation device and / or the second circulation device to start working according to the target parameters of the first phase region and the second phase region collected.

[0124] Here, the control component may include: a controller for the first circulation pump 9 in the first circulation loop (such as the temperature intelligent controller 23), and a controller for the second circulation pump 13 in the second circulation loop.

[0125] Suppose the boiling point of the cooling working fluid is set as T1, the starting temperature of the first circulation device is set as T2, the circulation stop temperature is set as T3, and the heating rod stop working temperature is set as T4; generally, T1 > T2 > T3 > T4 is satisfied. Taking fluorinated liquid as an example, T1 can be 47 °C, T2 can be 46 °C, T3 can be 44 °C, and T4 can be 38 °C or 40 °C. When the temperature of the cooling working fluid reaches or exceeds its boiling point (T1 = 47 °C), the liquid will turn into gas and enter the boiling state. When the temperature is slightly lower than the boiling point (such as T2 = 46 °C and T3 = 44 °C), the gasification process will occur on the liquid surface, but it does not belong to violent boiling but gradual evaporation. When the temperature drops to T4 (38 °C or 40 °C), the liquid is no longer in the evaporation or boiling state and will be in a lower temperature liquid state. The control component can automatically adjust the start and operation of the circulation pump of the circulation device according to the collected target data and the above-set temperature conditions to ensure that the first circulation device and the second circulation device only work when necessary, thus avoiding unnecessary energy waste; and, adjust the working state according to the real-time collected parameters, so that the system can quickly respond to environmental changes or demand changes and maintain the system stability.

[0126] Figure 12 The structural schematic diagram of the server liquid cooling system according to an embodiment of the present disclosure is shown, as Figure 12 shown, the server liquid cooling system includes:

[0127] A server, the server includes a heating unit 5;

[0128] A liquid cooling device, connected to the server 38 to dissipate heat from the heating unit 5; the liquid cooling device includes:

[0129] A box body 1, the box body has a first phase region 2 and a second phase region 3 along a first direction;

[0130] The first phase region 2 can be provided with a cooling working fluid for absorbing the heat generated by the heating unit 5 located in the first phase region 2, so that the cooling working fluid changes from a liquid state to a gaseous state and moves to the second phase region 3;

[0131] A condensation component 4, the condensation component 4 is arranged in the second phase region 3 for changing the cooling working fluid located in the second phase region 3 from a gaseous state to a liquid state and moving to the first phase region 2, so that the first phase region 2 and the second phase region 3 are in a balanced state.

[0132] Here, the heating unit 5 can include: a PCB board (Printed Circuit Board), a chip mounted on the PCB board, and a radiator. The PCB board is placed in the refrigeration box and is perpendicular to the bottom surface of the refrigeration box. The chip conducts heat through the radiator, and the radiator is in contact with the cooling working fluid.

[0133] Here, the liquid cooling device may adopt any one of the liquid cooling devices described above. The specific structure thereof is detailed in the embodiments of the liquid cooling device and will not be described in detail here.

[0134] Figure 13 A schematic diagram of the structure of a server liquid cooling system according to an application embodiment of the present disclosure is shown. Figure 13 As shown, the liquid cooling device includes: a box body 1, a condensing component 4, a first circulation device, and a second circulation device.

[0135] The box body 1 may be a refrigeration box, in which a cooling medium is placed. The cooling medium in the first phase region 2 does not contain the heating unit 5 and the heating assembly 18 .

[0136] Here, the heating unit 5 includes a PCB board, a chip, and a radiator. The radiator can adopt a multi-scale radiator boiling heat dissipation, wherein the server 38 can be immersed in the box 1 as a whole, or the heating unit 5 of the server 38 can be immersed in the box 1 to enhance the cooling medium vaporization core and realize efficient heat dissipation of the server chip. The box 1 is a two-phase immersion box for heat dissipation, which can be designed with a metal frame, and the whole adopts a metal alloy structure. The six surfaces are respectively fixed and sealed with metal alloy plates and polycarbonate plates or quartz plates through plastic O-rings and hexagon socket bolts. The front surface is composed of a fully transparent polycarbonate plate or quartz plate; the top surface, back surface and bottom surface are composed of metal alloy plates; the left and right surfaces are divided into upper and lower parts, the upper part is composed of a metal plate, and the lower part is composed of a transparent plate and a metal frame, forming a visual window 39, which is convenient for high-speed camera 30 to observe. A circular hole is drilled on the right side of the box 1, and a sealed plug is used to connect the wire to power the heating unit 5 in the refrigeration box (i.e., the box 1). The PCB board of the server is placed vertically at the bottom of the box and fixed to the back surface by screws. The heating component 18 uses a low-voltage and high-power dry auxiliary heating rod to preheat the cooling medium before testing.

[0137] Here, the cooling medium can be a low-boiling-point fluorinated liquid, which is injected from the liquid inlet 33 and submerged to at least 10 cm above the heating unit 5, thereby forming two regions inside the box 1, the second phase region 3 at the top and the first phase region 2 at the bottom. A regulating valve 14 (such as an adjustable pressure relief valve) is installed on the top surface of the box 1, and a pressure sensor 40 is provided. A drain port 35 is provided in the bottom metal plate and connected to the valve to facilitate the drainage of the cooling medium. The liquid inlet 33 and the drain port 35 are respectively built-in with a second filter 34 and a second filter 36 to filter tiny impurities in the cooling medium.

[0138] In some embodiments, the condensation component 4 employs a condensation plate heat exchanger or a condensation coil. When the heat of the heating unit 5 is transferred to the low-boiling-point fluorinated liquid, when the temperature of the fluorinated liquid reaches the boiling point, it changes from a liquid to a vapor. The vapor rises above the vapor-liquid interface, where the fluorinated liquid vapor contacts the surface of the condensation component 4, releases the heat absorbed by the condenser, and the fluorinated liquid vapor condenses into droplets and falls back into the boiling pool in the first-phase region 2.

[0139] The condensation component 4 is connected to an external second circulation device through a pipeline. The second circulation device includes: a second heat exchanger 12, a second circulation pump 13, a second circulation loop 25 outside the box body, a cooling water storage tank 26, a cooling water filter 27, a second flowmeter 28, and a second heat dissipation component 29. The second heat exchanger 12 is connected to the second circulation loop 25. The second heat exchanger 12 transfers the heat in the condensate (such as cooling water) to the air through heat exchange with the air and discharges it into the air to achieve efficient heat dissipation. At the same time, the second heat dissipation component 29 can enhance the heat dissipation effect. The condensate can be stored in the cooling water storage tank 26 for a period of time for further heat dissipation, and the condensate (such as cooling water) can be injected at the opening of the cooling water storage tank 26. The second circulation pump 13 in the loop drives the cooling water to circulate and exchange heat with the high-temperature steam in the box body 1. A thermometer and a second flowmeter 28 are provided in the loop to measure the temperature and flow rate of the condensate in the second circulation loop. And a cooling water filter 27 is provided to filter the cooling water.

[0140] In some embodiments, the first circulation device includes: a first heat exchanger 8, a first circulation pump 9, a first circulation loop 19 (i.e., the external circulation loop of the cooling working medium), a first storage tank 20, a first flowmeter 21, a first heat dissipation component 22, and a first filter 24. An opening in the first-phase region 2 of the box body 1 is connected to the external first circulation device through a pipeline to form a first circulation loop 19. The cooling working medium in the loop is driven by the first circulation pump 9. The first heat exchanger 8 is connected to the first circulation loop 19. The first heat exchanger 8 transfers the heat in the cooling working medium to the air through heat exchange with the air. At the same time, the first heat dissipation component 22 can enhance the heat dissipation effect. The cooling working medium can be stored in the first storage tank 20 for a period of time for further heat dissipation. In addition, a thermometer and a first flowmeter 21 are provided in the loop to measure the temperature and flow rate of the cooling working medium in the first circulation loop. And a first filter 24 is provided to filter the cooling working medium.

[0141] The device may further include a temperature intelligent controller 23, which is a device for automating the first circulation device. It can control whether the first circulation pump 9 starts according to a certain parameter (such as the temperature of the cooling working medium), that is, control whether the first circulation device participates in heat dissipation. The temperature intelligent controller 23 may also include a temperature sensor placed in the first phase region 2 to measure the temperature of the cooling working medium. When the temperature of the cooling working medium is higher than the preset temperature, the temperature intelligent controller 23 outputs voltage and current to the first circulation pump 9 to start the first circulation pump 9 to drive the cooling working medium to circulate. Through the external circulation heat dissipation of the cooling working medium, the temperature of the cooling working medium can be adjusted according to the heat dissipation requirement, thereby reducing the steam temperature at the condensation end and avoiding damage to the electronic devices of the heating unit 5 caused by boiling in the first phase region.

[0142] Here, the cooling effect of the cooling working medium is improved by the first circulation device. The condensation component 4 can use low-power components to turn the gaseous cooling working medium into a liquid state to achieve circulation, reducing the PUE (Power Usage Effectiveness) value of the system.

[0143] In some embodiments, the device may further include: a recorder 31. The recorder 31 is connected to the pressure sensor 40 and the thermocouple 32, and can collect data such as pressure and temperature at the same time. Each data collection device is provided with power-off protection, and all data is stored in the memory. The real-time data and historical data curves can be displayed, and the data supports external transfer. The thermocouple 32 is arranged in the first phase region 2 and the second phase region 3 for collecting temperature and then sending it to the recorder 31.

[0144] The device may further include: an LED light source 41, a high-speed camera 30, an electronic device 37, and a power supply component 17. The software on the electronic device 37 controls and adjusts parameters, and obtains the video data of real-time imaging, which can be used to analyze the bubble evolution process during the heat exchange of the radiator, providing theoretical support for the radiator design. The power supply component 17 uses an adapted DC power supply to supply power to the heating unit 5 and the heating component 17. The LED light source 41 and the high-speed camera 30 are oppositely arranged on the side of the visualization window 39. The LED light source 41 provides illumination to facilitate the high-speed camera 30 to collect clear images.

[0145] With the above liquid cooling device, on the one hand, the control of the boiling point is achieved through the first circulation device, which concentrates it in the middle area, avoiding the generation of excessive bubbles. This precise control can improve the cooling efficiency and prevent poor cooling effect caused by excessive bubbles. On the other hand, the problem of premature boiling downstream of high-power devices is effectively avoided, which ensures that the cooling liquid maintains an appropriate temperature throughout the system, ensuring the heat dissipation efficiency and the safety of the device. In addition, the realization of the circulation through the first circulation device itself also helps to cool down. The appropriate flow helps the small chips to dissipate heat effectively. Even for small chips with low power consumption, they can maintain a low temperature through the flow of the liquid cooling device, ensuring their stable operation. For high-power devices, the circulating flow can quickly take away the heat generated by the high-power devices and help the rapid discharge of bubbles to enhance boiling heat transfer, while improving the convective heat transfer effect and avoiding excessive bubbles from affecting the heat dissipation effect.

[0146] It should be understood that the terms "first" and "second" recorded in this disclosure are only for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of this disclosure, "a plurality of" means two or more unless otherwise specifically defined.

[0147] The above is only the specific implementation manner of this disclosure, but the protection scope of this disclosure is not limited thereto. Any person skilled in the art within the technical scope disclosed by this disclosure can easily think of changes or substitutions, which should all be covered within the protection scope of this disclosure. Therefore, the protection scope of this disclosure should be subject to the protection scope of the claims.

Claims

1. A liquid cooling device, comprising: A box body, which has a first phase region and a second phase region along a first direction; The first phase region can be provided with a cooling working medium for absorbing the heat generated by a heating unit located in the first phase region, so that the cooling working medium changes from a liquid state to a gaseous state and moves to the second phase region; A condensation component, which is arranged in the second phase region for changing the cooling working medium located in the second phase region from a gaseous state to a liquid state and moving to the first phase region, so that the first phase region and the second phase region are in an equilibrium state.

2. The liquid cooling device according to claim 1, wherein the first phase region is connected to a first circulation device, and a first liquid inlet pipe and a first liquid outlet pipe of the first circulation device are arranged at intervals along the first direction and are connected to the box body to form a first circulation loop. The liquid cooling working medium in the first phase region dissipates heat through the first circulation loop, so that the cooling working medium in the first phase region circulates along the surface of the heating unit.

3. The liquid cooling device according to claim 2, wherein the first circulation device comprises: A first heat exchanger, which is connected to the first circulation loop for reducing the temperature of the cooling working medium circulating in the first circulation loop; A first circulation pump, which is connected to the first circulation loop and drives the cooling working medium to circulate in the first circulation loop for reducing the temperature of the cooling working medium in a gaseous state located in the second phase region.

4. The liquid cooling device according to claim 1, wherein the size of the first phase region along the first direction is larger than the size of the second phase region along the first direction; The liquid cooling working medium located in the first phase region can cover the heating unit along the first direction. The heating unit is arranged in the first phase region along the first direction, and the top of the cooling working medium keeps a target distance from the top of the heating unit; When in the equilibrium state, the position of the heating element remains unchanged compared with the box body.

5. The liquid cooling device according to claim 1 or 2, wherein a second circulation device is arranged on the top of the box body, and the second circulation device forms a second circulation loop with the condensation component through the box body, so that the condensate of the condensation component dissipates heat through the second circulation loop; The boiling point of the cooling working medium is less than the boiling point of the condensate.

6. The liquid cooling device according to claim 5, wherein the second circulation device comprises: A second heat exchanger, which is connected to the second circulation loop for reducing the temperature of the condensate circulating in the second circulation loop; A second circulation pump, which is connected to the second circulation loop and drives the condensate to circulate in the second circulation loop for bringing the cooling working medium in a gaseous state located in the second phase region into contact with the surface of the condensation component to change from a gaseous state to a liquid state and drip into the first phase region.

7. The liquid cooling device according to claim 1, wherein a regulating valve is arranged on the top of the box body, and the regulating valve is connected to the second phase region; A liquid discharging assembly is arranged at the bottom of the box body, and the liquid discharging assembly is connected to the first phase region; A liquid inlet assembly is provided on the side of the box body, and the cooling working fluid enters the first phase region through the liquid inlet assembly.

8. The liquid cooling device according to claim 1 further comprises: A collection assembly, the box body is provided with a collection area, and the collection assembly is correspondingly arranged with the collection area for collecting target parameters of the first phase region and the second phase region; When in a balanced state, the target parameters satisfying the balance condition include at least one of the following combinations; The data parameters of the first phase region satisfy the first balance threshold; The data parameters of the second phase region satisfy the second balance threshold; The image parameters of the first phase region satisfy the first boiling threshold; The image parameters of the second phase region satisfy the second boiling threshold.

9. The liquid cooling device according to claim 1, wherein a heating assembly is provided on a side of the first phase region away from the second phase region for preheating the cooling working fluid; A power supply assembly, the power supply assembly is electrically connected to the heating assembly; the power supply assembly is electrically connected to the heat generating unit, and the heat generated by the operation of the heat generating unit.

10. A server liquid cooling system, comprising A server, the server includes a heat generating unit; A liquid cooling device, connected to the server to dissipate heat from the heat generating unit; the liquid cooling device includes: A box body, the box body has a first phase region and a second phase region along a first direction; The first phase region can be provided with a cooling working fluid for absorbing the heat generated by the heat generating unit located in the first phase region, so that the cooling working fluid changes from a liquid state to a gaseous state and moves to the second phase region; A condensation component, the condensation component is arranged in the second phase region for changing the cooling working fluid located in the second phase region from a gaseous state to a liquid state and moving to the first phase region, so that the first phase region and the second phase region are in a balanced state.

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