Multi-parameter layout etching compensation method and device, medium, program product and terminal

By acquiring and processing multi-parameter feature information of the layout pattern, generating and screening etch compensation values, the problem that the etch compensation method in the prior art cannot adapt to multi-parameter coupling is solved, and the accuracy and efficiency of etch compensation are improved.

CN120337849AActive Publication Date: 2025-07-18HUAXINCHENG (HANGZHOU) TECH CO LTD

Patent Information

Application Number
CN202510814825.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-06-18
Publication Date
2025-07-18
Estimated Expiration
2045-06-18

AI Technical Summary

Technical Problem

The existing etch compensation method based on two-dimensional rule tables cannot effectively capture the complex coupling relationship between multiple parameters, resulting in limited compensation accuracy and efficiency, making it difficult to adapt to the etching requirements of modern complex processes.

Method used

By obtaining the layout graphics and compensation script files, multiple feature information and feature parameters of the target compensation coordinates are extracted, comprehensive calculations are performed to generate preliminary compensation values, and filter unreasonable results through filtering conditions, and finally implementing etch compensation operations.

Benefits of technology

The degree of freedom and accuracy of etch compensation is improved, and it can better adapt to the influence of multiple factors and achieve accurate etch compensation.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN120337849A_ABST
    Figure CN120337849A_ABST
Patent Text Reader

Abstract

The invention provides a multi-parameter layout etching compensation method and device, a medium, a program product and a terminal. The method comprises the following steps: acquiring a layout graph containing a target compensation coordinate and a compensation script file; and extracting multiple pieces of feature information and feature parameters corresponding to the target compensation coordinates from the layout graph based on the compensation script file. And for each target compensation coordinate, performing comprehensive calculation on the characteristic parameters according to a preset operation instruction to generate a preliminary compensation value. And filtering unreasonable compensation results by adopting screening conditions. And performing etching compensation operation on the target compensation coordinate according to the target compensation value. The problem that a single two-dimensional etching deviation rule table cannot adapt to the influence of multiple factors in the prior art is solved, and the etching compensation freedom degree and accuracy are improved.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The present application relates to the field of semiconductors, and particularly to a multi-parameter layout etching compensation method, device, medium, program product, and terminal. Background Art

[0002] In the manufacturing process of integrated circuits (ICs), etching compensation refers to the technical means adopted during the etching process to compensate for the line width change or pattern deviation caused by the etching process, which directly affects the manufacturing yield and performance of the chip. However, the existing etching compensation methods have obvious limitations when dealing with the interaction of multi-dimensional parameters. Among traditional compensation strategies, the method based on two-dimensional rule tables is the most typical. Its basic design concept is to describe the mutual influence between process parameters through a discretized table, but it is limited to the modeling of two-parameter combinations.

[0003] Specifically, this method requires establishing an independent two-dimensional rule table for each two-parameter combination of key feature parameters such as line width, line pitch, and pattern length. For example, to accurately capture the variation law between line width and line pitch, a rule table needs to be designed; while analyzing the mutual relationship between line width and pattern length, another rule table is required to express it. Although this mode of constructing rule tables for pairwise parameters simplifies the problem to a certain extent, it has obvious deficiencies: it cannot simultaneously consider the complex coupling effects between multiple process parameters, resulting in the compensation scheme under the comprehensive influence of multiple parameters being difficult to reach the optimal. In addition, with the increase in the parameter dimension and value range, the number of rule tables and the maintenance cost increase exponentially, further restricting the scalability and application scope of the method. These bottlenecks make it difficult for the traditional two-dimensional rule table strategy to achieve accurate and efficient etching compensation in the face of modern complex manufacturing processes. Summary of the Invention

[0004] In view of the above-mentioned disadvantages of the prior art, the purpose of the present application is to provide a multi-parameter layout etching compensation method, device, medium, program product, and terminal, which are used to solve the problem that the existing etching compensation method based on two-dimensional rule tables can only model pairwise parameters and cannot effectively capture the complex coupling relationship between multiple parameters, resulting in limited compensation accuracy and efficiency.

[0005] To achieve the above and other related objectives, a first aspect of the present application provides a multi-parameter layout etching compensation method, including: obtaining a layout pattern and a compensation script file, where the layout pattern contains one or more target compensation coordinates; performing the following operations based on the compensation script file: obtaining multiple feature information corresponding to the target compensation coordinates from the layout pattern, and feature parameters of each feature information; for each target compensation coordinate, performing a compensation calculation operation on the feature parameters of the preset feature information according to an operation instruction to generate a preliminary compensation value; performing a screening and filtering operation on the preliminary compensation value according to a filtering condition to generate a target compensation value; performing an etching compensation operation on the target compensation coordinate according to the target compensation value.

[0006] In some embodiments of the first aspect of the present application, the process of performing a screening and filtering operation on the preliminary compensation value according to a filtering condition to generate a target compensation value includes: if the preliminary compensation value fails to pass the screening and filtering operation, performing the compensation calculation operation on the preliminary compensation value again and updating the preliminary compensation value; performing the screening and filtering operation on the updated preliminary compensation value again; repeatedly performing the compensation calculation operation and the screening and filtering operation until the updated preliminary compensation value passes the screening and filtering operation.

[0007] In some embodiments of the first aspect of the present application, the process of performing a compensation calculation operation on the feature parameters of the preset feature information according to an operation instruction to generate a preliminary compensation value includes: screening out the preset feature information defined in the operation instruction from the multiple feature information; performing one or more calculations of logical operation, arithmetic operation, topological operation, and relational operation on the preset feature information according to the operation type in the operation instruction to generate a preliminary compensation value.

[0008] In some embodiments of the first aspect of the present application, the operation instruction includes a target compensation coordinate to be calculated, and feature information, an operation type, and a compensation direction associated with the coordinate.

[0009] In some embodiments of the first aspect of the present application, the compensation script file includes an influence factor for each type of feature information. The process of performing an etching compensation operation on the target compensation coordinate according to the target compensation value includes: correcting the target compensation value based on the influence factor to generate a compensation correction value; taking the compensation correction value as a moving distance and performing a displacement operation on the target compensation coordinate in the compensation direction specified in the operation instruction.

[0010] In some embodiments of the first aspect of the present application, the feature information includes one or more of the following layout feature types: pitch, line width, length, corner angle, density distribution, adjacent pitch, adjacent line width, and adjacent length.

[0011] To achieve the above and other related objectives, a multi-parameter layout etching compensation device for a layout according to a second aspect of the present application includes: a data acquisition module for acquiring a layout pattern and a compensation script file, where the layout pattern contains one or more target compensation coordinates; a compensation calculation module for performing the following operations based on the compensation script file: obtaining a plurality of feature information corresponding to the target compensation coordinates and the feature parameters of each piece of feature information from the layout pattern; for each target compensation coordinate, performing a compensation calculation operation on the feature parameters of the preset feature information according to an operation instruction to generate a preliminary compensation value; performing a screening and filtering operation on the preliminary compensation value according to a filtering condition to generate a target compensation value; an etching compensation module for performing an etching compensation operation on the target compensation coordinates according to the target compensation value.

[0012] To achieve the above and other related objectives, a third aspect of the present application provides a computer-readable storage medium, on which a computer program is stored, and when the computer program is executed by a processor, the multi-parameter layout etching compensation method is implemented.

[0013] To achieve the above and other related objectives, a fourth aspect of the present application provides a computer program product, which includes computer program code, and when the computer program code runs on a computer, the computer is enabled to implement the multi-parameter layout etching compensation method.

[0014] To achieve the above and other related objectives, a fifth aspect of the present application provides an electronic terminal, including a memory, a processor, and a computer program stored on the memory; the processor executes the computer program to implement the multi-parameter layout etching compensation method.

[0015] As described above, the multi-parameter layout etching compensation method, device, medium, program product, and terminal of the present application have the following beneficial effects: by acquiring a layout pattern containing target compensation coordinates and a compensation script file. Extracting a plurality of feature information and feature parameters corresponding to the target compensation coordinates from the layout pattern based on the compensation script file. Performing a comprehensive calculation on the feature parameters according to a preset operation instruction for each target compensation coordinate to generate a preliminary compensation value. Using a screening condition to filter unreasonable compensation results. Performing an etching compensation operation on the target compensation coordinates according to the target compensation value. Solving the problem that a single two-dimensional etching deviation rule table in the prior art cannot adapt to the influence of multiple factors, and improving the freedom and accuracy of etching compensation. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 Shows a schematic flowchart of an embodiment of the multi-parameter layout etching compensation method of the present application.

[0017] Figure 2 Shows a schematic structural diagram of an embodiment of the multi-parameter layout etching compensation device of the present application.

[0018] Figure 3 Shows a schematic structural diagram of an embodiment of the multi-parameter layout etching compensation terminal of the present application. Detailed implementation manners

[0019] The following uses specific specific examples to illustrate the implementation manners of the present application. Those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in this specification. The present application can also be implemented or applied through other different specific implementation manners. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that, without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0020] Before further elaborating on the present invention, the nouns and terms involved in the embodiments of the present invention are described. The nouns and terms involved in the embodiments of the present invention are applicable to the following explanations:

[0021] <1> Layout pattern: The combination of patterns on each layer on the surface of a chip in integrated circuit design, representing the geometric shapes of circuit elements and their interconnections, and is used for manufacturing the chip.

[0022] <2> Corner angle: The angle size at the turning point of a line or an edge, which is a key parameter affecting manufacturing and electrical performance.

[0023] <3> Density distribution: The coverage density of patterns on the surface of a chip, reflecting the distribution of patterns per unit area, and affecting the uniformity and performance of the manufacturing process.

[0024] <4> Adjacent edge spacing: The minimum distance between the edge of a pattern and the edge of an adjacent pattern, ensuring electrical isolation and manufacturing margin.

[0025] <5> Adjacent edge line width: The line width of the part close to the edge, affecting electrical performance and process reliability.

[0026] <6> Adjacent edge length: The length of the line in the edge part, related to electrical and mechanical characteristics.

[0027] <7> Script file: A text file used for automated processing of layout design, verification, or processing, containing programming instructions or command scripts to achieve operation automation and process control.

[0028] <8> YMAL: YMAL (YAML Ain't Markup Language) is a data serialization format that aims to represent data structures in a concise and easy-to-read plain text format. It supports multiple data types such as scalars, sequences, and mappings, and is often used in configuration files and data exchange scenarios.

[0029] To facilitate understanding of the embodiments of the present application, first Figure 1 Detailed description. Figure 1 The flowchart of a multi-parameter layout etching compensation method in an embodiment of the present invention is shown. The multi-parameter layout etching compensation method in this embodiment mainly includes the following steps:

[0030] Step S11: Acquire a layout graphic and a compensation script file, wherein the layout graphic contains one or more target compensation coordinates.

[0031] In one embodiment of the present application, the feature information includes one or more of the following layout feature types: spacing, line width, length, corner angle, density distribution, edge spacing, edge line width, and edge length.

[0032] In this embodiment, spacing refers to the distance between two graphics or lines; line width is the width of the line itself in the layout, indicating the distance from one edge to the other edge of the line; length indicates the size length of the line or graphic, that is, the distance from the starting point to the end point of the line segment; corner angle refers to the turning angle of the line at the ringing node, usually the angle between two line segments; density distribution refers to the area ratio of layout elements or the arrangement density of elements in a predetermined area; the edge spacing feature indicates the distance between the graphic and the adjacent layout edge; edge line width refers to the width control of the line near the edge of the layout; edge length refers to the length dimension of the line near the edge of the layout.

[0033] In one embodiment of the present application, the layout pattern includes one or more target compensation coordinates.

[0034] In this embodiment, the layout graphic includes one or more target compensation coordinates, which are line segment coordinates obtained by segmenting the line segments in the layout graphic. In this embodiment, the line segments in the layout graphic are segmented to decompose the continuous graphic lines into multiple independent line segments, which constitute the basic spatial units for subsequent attribute calculation and position adjustment.

[0035] By dividing the layout into segments, detailed control of each part of the chip layout can be achieved during the etching optimization process, improving the accuracy and efficiency of the layout adjustment process, and further improving the chip design quality and the adaptability of the manufacturing process. This implementation method not only maintains the rationality of the overall layout structure, but also takes into account the flexible adjustment of local areas, meeting the needs of complex semiconductor design for high-precision management of spatial layout.

[0036] Step S12: Perform the following operations based on the compensation script file; obtain multiple feature information corresponding to the target compensation coordinates from the layout pattern, and the feature parameters of each feature information; for each target compensation coordinate, perform a compensation calculation operation on the feature parameters of the preset feature information according to the operation instruction to generate a preliminary compensation value; perform a screening and filtering operation on the preliminary compensation value according to the filtering condition to generate a target compensation value.

[0037] In an embodiment of the present application, multiple feature information corresponding to the target compensation coordinates in the chip layout and their feature parameters are extracted and obtained according to the operation instructions preset in the compensation script file. For each target compensation coordinate, a compensation calculation operation is performed based on the feature parameters to generate a preliminary compensation value, which reflects the comprehensive calculation result of the multi-dimensional feature information of the pattern and the set operation rules. Subsequently, the preliminary compensation value is screened according to the predetermined filtering condition, and the compensation results that do not meet the design or process specifications are excluded to obtain the final target compensation value.

[0038] Further, whether the target compensation coordinates in the layout move is determined based on the comprehensive analysis of its associated feature information and feature parameters. Specifically, based on the screened target compensation value, it is judged whether the condition for triggering the pattern movement is satisfied. If so, the pattern movement operation is performed. The movement amount of the pattern is jointly determined by multiple feature parameters through the established compensation calculation rule. This calculation process fully considers the multi-dimensional features of the attributes of each line segment after line segment segmentation to ensure the accuracy and reasonableness of the compensation. Combining the screening results of the target compensation value, the specific movement amount and movement direction of the pattern are determined to achieve precise adjustment of the layout pattern.

[0039] In an embodiment of the present application, the filtering condition includes but is not limited to: the compensation value is within a preset reasonable numerical range, and the compensation values outside this range are excluded; the absolute value of the compensation value is greater than a predetermined threshold, and the compensation values lower than this threshold are excluded; according to the limitation conditions set by the process specifications, when the combination of feature parameters corresponding to the compensation value does not meet the design specifications, the compensation value is filtered and excluded.

[0040] In an embodiment of the present application, the programming languages that the compensation script file can adopt include, but are not limited to, Python, C++, or JavaScript, etc., and are stored in specific script language file formats such as JSON, XML, or YMAL to achieve structured and easily parsable data management. For the graphics in the chip layout, through a layout parsing tool or processing module, multiple feature information corresponding to the target compensation coordinates is extracted, such as multi-dimensional feature parameters like line segment length, angle, attribute value, etc. The extracted feature information and its corresponding feature parameters are uniformly stored in a predefined data structure, often organized in the form of key-value pairs. Exemplarily, the attribute fields in the JSON format are adopted. This embodiment is only used for the explanation of the present application rather than for limitation.

[0041] Furthermore, in order to achieve an accurate match with the information in the compensation script file, the data structure design of the feature information in the layout is consistent with the parameter naming and hierarchy preset in the compensation script. Specifically, the variable names, feature parameter labels, and data hierarchy defined in the compensation script file correspond to the storage format of the layout feature information. The compensation script can directly reference the feature parameters extracted from the layout through variable mapping or interface calls, avoiding ambiguity and the complexity of data conversion.

[0042] In an embodiment of the present application, the process of performing a screening and filtering operation on the preliminary compensation value according to the filtering conditions to generate the target compensation value includes: if the preliminary compensation value fails to pass the screening and filtering operation, then perform the compensation calculation operation on the preliminary compensation value again and update the preliminary compensation value; perform the screening and filtering operation on the updated preliminary compensation value again; repeat the compensation calculation operation and the screening and filtering operation until the updated preliminary compensation value passes the screening and filtering operation.

[0043] Exemplarily, taking the target positions A, B, and C in the chip layout as an example, optimize their feature parameters in terms of line width and pitch, and generate updated feature parameters with compensation values through complex expression calculations. According to the new feature parameters, calculate the feature results A1, B1, and C1 at each target position. Based on the preset unified screening and filtering conditions, determine the above feature results. Assume that C1 meets the filtering conditions, then confirm the compensation value at the C position; while A1 and B1 do not meet the conditions, then feedback and correct the compensation values at the A and B positions.

[0044] Specifically, for positions A and B that fail the screening, based on the previously calculated compensation values, the compensation calculation operation is performed again. And in the compensation calculation operation, the inherent dimensional characteristic parameters of the target positions are combined, and the adjustment basis for the compensation values is formed through logical operations. Based on the adjusted characteristic parameters, the characteristic results A2 and B2 of positions A and B are calculated again, and the target positions' compensation values are obtained respectively by judging according to the original unified screening and filtering conditions. This embodiment is cycled under the unified screening and filtering conditions, and through the gradual optimization of the characteristic parameters and multiple rounds of correction of the compensation values, until the compensation values of all target positions meet the screening requirements.

[0045] In an embodiment of the present application, the operation instruction includes the target compensation coordinates to be calculated, as well as the characteristic information, operation type, and compensation direction associated with the coordinates.

[0046] In this embodiment, the target compensation coordinates represent the point coordinates or line segment coordinates in the layout that need to be compensated. The characteristic information associated with the coordinates includes, but is not limited to, parameters such as line width value, line spacing value, graphic length, and surrounding environment density. The present application breaks through the limitations of the traditional two-dimensional rule table by means of the operation instructions in the script file, can optimize multiple process parameters simultaneously, and adopt precise compensation strategies according to different characteristic combinations.

[0047] In an embodiment of the present application, the process of performing the compensation calculation operation on the characteristic parameters of the preset characteristic information according to the operation instruction to generate the preliminary compensation value includes: screening out the preset characteristic information defined in the operation instruction from the multiple pieces of characteristic information; according to the operation type in the operation instruction, performing one or more of logical operations, arithmetic operations, topological operations, and relational operations on the preset characteristic information to generate the preliminary compensation value.

[0048] In this embodiment, the process of screening out the preset characteristic information defined in the operation instruction from the multiple pieces of characteristic information includes: performing field matching based on the characteristic identifier field included in the compensation script file. The above characteristic identifier is a unique ID, type code, or descriptor used to indicate the target compensation coordinates. By means of exact matching or pattern matching, the characteristic identifier in the operation instruction is compared with the corresponding field in the characteristic information library. Exemplarily, when the operation instruction includes the identifier "LW_50nm", all the line width characteristic information with this ID is screened out.

[0049] In this embodiment, the process of performing one or more of multiple operations according to the operation type in the operation instruction includes: for arithmetic operations, weighted summation, multiplication, exponential function, logarithmic function, etc. are adopted to calculate the compensation value. Topological operations calculate the spatial relationship and geometric structure between layout elements, such as the minimum distance between the boundaries of two line segments, intersection area, connectivity, etc., as a reference for correcting the compensation amplitude and adjusting the compensation direction. Relational operations compare feature parameters, such as determining whether the line width exceeds a set threshold or the size relationship of multiple groups of parameters, and use the determination result in numerical form to participate in the assignment and adjustment of the compensation amount. Logical operations combine the results or weights of multiple compensation models through logical rules such as AND, OR, and NOT.

[0050] Step S13: Perform an etching compensation operation on the target compensation coordinates according to the target compensation value.

[0051] In an embodiment of the present application, the compensation script file includes the influence factors of each type of feature information. The process of performing an etching compensation operation on the target compensation coordinates according to the target compensation value includes: based on the influence factors, correcting the target compensation value to generate a compensation correction value; according to the compensation direction specified in the operation instruction, using the compensation correction value as the moving distance to perform a displacement operation on the target compensation coordinates.

[0052] In this embodiment, the influence factors reflect the specific influence degree of different feature information on the etching compensation effect. For the target compensation coordinates in the chip layout, various feature information and their size parameters at this position, such as line width and pitch, are automatically measured and calculated, and multiple corresponding compensation values are calculated accordingly. Then, these compensation values are respectively multiplied by the corresponding influence factors, and a comprehensive compensation correction value is formed through weighted summation.

[0053] Taking the position with a narrow line width and a small pitch as an example, the relevant influence factors may increase the comprehensive compensation correction value to compensate for the risk of insufficient etching caused by the small structure. This comprehensive correction value is used to determine the actual moving distance of the target position, and the precise displacement adjustment of the layout is completed in combination with the predetermined compensation direction. Through this embodiment, comprehensive compensation correction based on multiple feature size parameters and their influence weights is achieved.

[0054] It should be noted that in the embodiments of the present application, words such as "exemplary" or "for example" indicate examples, illustrations or explanations. Any embodiment or design solution described as "exemplary" or "for example" in the present application should not be construed as being more preferred or having more advantages than other embodiments or design solutions. Exactly speaking, using words such as "exemplary" or "for example" aims to present relevant concepts in a specific way.

[0055] In the embodiments of the present application, "at least one" means one or more, and "a plurality" means two or more. "And / or" describes the association relationship of associated objects and indicates that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone, where A and B can be singular or plural. The character " / " generally represents an "or" relationship between the associated objects before and after. "At least one (item)" or similar expressions thereof refer to any combination of these items, including any combination of single item (item) or plural items (items). For example, at least one (item) of a, b, or c can represent: a, b, c, a - b, a - c, b - c, or a - b - c, where a, b, and c can be single or multiple.

[0056] Figure 2 is a schematic block diagram of a multi-parameter layout etching compensation device 200 provided by an embodiment of the present application. As Figure 2 shown, the device includes a data acquisition module 201, a compensation calculation module 202, and an etching compensation module 203.

[0057] Data acquisition module 201: It is used to acquire a layout pattern and a compensation script file, and the layout pattern contains one or more target compensation coordinates.

[0058] Compensation calculation module 202: It is used to perform the following operations based on the compensation script file; obtain a plurality of feature information corresponding to the target compensation coordinates and the feature parameters of each feature information from the layout pattern; for each target compensation coordinate, perform a compensation calculation operation on the feature parameters of the preset feature information according to the operation instruction to generate a preliminary compensation value; perform a screening and filtering operation on the preliminary compensation value according to the filtering condition to generate a target compensation value.

[0059] Etching compensation module 203: It is used to perform an etching compensation operation on the target compensation coordinates according to the target compensation value.

[0060] It should be understood that the specific processes for each module to execute the above corresponding steps have been described in detail in the above method embodiments. For the sake of brevity, they will not be repeated here.

[0061] It should also be understood that the division of modules in the embodiments of the present application is illustrative, and is only a logical function division. In actual implementation, there can be other division methods. In addition, in each embodiment of the present application, each functional module can be integrated in one processor, or can exist alone physically, or two or more modules can be integrated in one module. The above integrated modules can be implemented in the form of hardware or in the form of software functional modules.

[0062] Figure 3It is a schematic block diagram of an electronic terminal provided by an embodiment of the present application. As Figure 3 shown, the electronic terminal includes: at least one processor 301, a memory 302, at least one network interface 303, and a user interface 305. Each component in the device is coupled together through a bus system 304. It can be understood that the bus system 304 is used to implement the connection and communication between these components. In addition to the data bus, the bus system 304 also includes a power bus, a control bus, and a status signal bus. However, for the sake of clarity, in Figure 3 all kinds of buses are labeled as the bus system.

[0063] Among them, the user interface 305 may include a display, a keyboard, a mouse, a trackball, a click gun, a button, a touchpad, or a touch screen, etc.

[0064] It can be understood that the memory 302 may be a volatile memory or a non-volatile memory, or may include both volatile and non-volatile memories. Among them, the non-volatile memory may be a read-only memory (ROM, Read Only Memory), a programmable read-only memory (PROM, Programmable Read-Only Memory), which is used as an external cache. By way of example but not limitation, many forms of RAM are available, such as static random access memory (SRAM, Static Random Access Memory), synchronous static random access memory (SSRAM, Synchronous Static Random Access Memory). The memory described in the embodiments of the present invention is intended to include but not limited to these and any other suitable categories of memories.

[0065] The memory 302 in the embodiments of the present invention is used to store various types of data to support the operation of the electronic terminal 300. Examples of these data include: any executable program for operating on the electronic terminal 300, such as an operating system 3021 and application programs 3022; the operating system 3021 includes various system programs, such as a framework layer, a core library layer, a driver layer, etc., for implementing various basic services and processing hardware-based tasks. The application programs 3022 may include various application programs, such as a media player (Media Player), a browser (Browser), etc., for implementing various application services. The multi-parameter layout etching compensation method provided by the embodiments of the present invention may be included in the application programs 3022.

[0066] The method disclosed in the embodiments of the present invention above can be applied to the processor 301 or implemented by the processor 301. The processor 301 may be an integrated circuit chip with signal processing capabilities. During implementation, the steps of the above method can be completed by the integrated logic circuit in hardware in the processor 301 or instructions in software form. The above-mentioned processor 301 may be a general-purpose processor, a digital signal processor (DSP), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The processor 301 can implement or execute the various methods, steps, and logic block diagrams disclosed in the embodiments of the present invention. The general-purpose processor 301 may be a microprocessor or any conventional processor, etc. Combining the steps of the fitting optimization method provided in the embodiments of the present invention can be directly embodied as being executed and completed by a hardware decoding processor, or by a combination of hardware and software modules in the decoding processor. The software module may be located in a storage medium, and this storage medium is located in the memory. The processor reads the information in the memory and combines its hardware to complete the steps of the foregoing method.

[0067] In an exemplary embodiment, the electronic terminal 300 may be an application-specific integrated circuit (ASIC), a DSP, a programmable logic device (PLD), or a complex programmable logic device (CPLD) for executing the foregoing method.

[0068] According to the method provided in the embodiments of the present application, the present application also provides a computer program product, which includes: computer program code. When the computer program code runs on a computer, it causes the computer to execute the multi-parameter layout etching compensation method in any one of the above embodiments.

[0069] According to the method provided in the embodiments of the present application, the present application also provides a computer-readable storage medium, which stores program code. When the program code runs on a computer, it causes the computer to execute the multi-parameter layout etching compensation method in any one of the above embodiments.

[0070] As used in this specification, the terms "component", "module", "system", etc. are used to denote computer-related entities, hardware, firmware, combinations of hardware and software, software, or software in execution. For example, a component can be, but is not limited to, a process running on a processor, a processor, an object, an executable file, an execution thread, a program, and / or a computer. By way of illustration, both an application running on a computing device and the computing device can be components. One or more components can reside in a process and / or an execution thread, and a component can be located on one computer and / or distributed between two or more computers. Further, these components can execute from various computer-readable media having various data structures stored thereon. A component can communicate, for example, by signals according to one or more data packets (e.g., data from two components interacting with another component in a local system, a distributed system, and / or a network, such as via the Internet interacting with other systems through signals) through local and / or remote processes.

[0071] Those of ordinary skill in the art will appreciate that the various illustrative logical blocks and steps described in connection with the embodiments disclosed herein can be implemented in electronic hardware, or in a combination of computer software and electronic hardware. Whether such functions are implemented in hardware or software depends upon the particular application and design constraints of the technical solution. Skilled artisans may use different methods to implement the described functions for each particular application, but such implementation should not be considered to exceed the scope of this application.

[0072] Those skilled in the art can clearly understand that for the convenience and conciseness of description, the specific working processes of the systems, apparatuses, and units described above can refer to the corresponding processes in the foregoing method embodiments, and will not be elaborated herein.

[0073] In several embodiments provided in this application, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative. For example, the division of units is only a logical function division, and there can be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the couplings or direct couplings or communication connections shown or discussed with each other can be through some interfaces, and the indirect couplings or communication connections of the apparatuses or units can be in electrical, mechanical, or other forms.

[0074] The unit described as a separation component may or may not be physically separated. The component shown as a unit may or may not be a physical unit, that is, it may be located in one place or distributed across multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0075] In addition, each functional unit in various embodiments of the present application can be integrated in a processing unit, or each unit can exist physically alone, or two or more units can be integrated in one unit.

[0076] In the above embodiments, the functions of each functional unit can be implemented in whole or in part by software, hardware, firmware, or any combination thereof. When implemented using software, it can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions (programs). When the computer program instructions (programs) are loaded and executed on a computer, the processes or functions according to the embodiments of the present application are generated in whole or in part. The computer can be a general-purpose computer, a dedicated computer, a computer network, or other programmable devices. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center by wire (such as coaxial cable, optical fiber, Digital Subscriber Line (DSL)) or wirelessly (such as infrared, wireless, microwave, etc.). The computer-readable storage medium can be any available medium that the computer can access or a data storage device such as a server or data center that includes one or more integrated available media. The available medium can be a magnetic medium (for example, floppy disk, hard disk, magnetic tape), an optical medium (for example, high-density digital video disc (Digital Video Disc, DVD)), or a semiconductor medium (for example, solid state disk (Solid State Disk, SSD), etc.).

[0077] If a function is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or a part of this technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this application. The aforementioned storage medium includes: various media such as USB flash drives, mobile hard disks, read-only memories (ROMs), random access memories (RAMs), magnetic disks, or optical discs that can store program codes.

[0078] As described above, the above is only the specific implementation manner of this application, but the protection scope of this application is not limited thereto. Any person skilled in the art within the technical scope disclosed by this application can easily think of changes or substitutions, which should all be covered by the protection scope of this application. Therefore, the protection scope of this application should be subject to the protection scope of the claims.

[0079] In summary, this application provides a multi-parameter layout etching compensation method, device, medium, program product, and terminal. By obtaining a layout pattern and a compensation script file containing target compensation coordinates. Based on the compensation script file, multiple feature information and feature parameters corresponding to the target compensation coordinates are extracted from the layout pattern. For each target compensation coordinate, a comprehensive calculation is performed on the feature parameters according to a preset operation instruction to generate a preliminary compensation value. Screening conditions are used to filter out unreasonable compensation results. An etching compensation operation is performed on the target compensation coordinates according to the target compensation value. It solves the problem that the single two-dimensional etching deviation rule table in the prior art cannot adapt to the influence of multiple factors, and improves the freedom and accuracy of etching compensation. Therefore, this application effectively overcomes various disadvantages in the prior art and has high industrial utilization value.

[0080] The above embodiments are only illustrative of the principles and effects of this application, and are not used to limit this application. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of this application. Therefore, all equivalent modifications or changes completed by those with ordinary knowledge in the technical field without departing from the spirit and technical idea disclosed by this application should still be covered by the claims of this application.

Claims

1. A multi-parameter layout etching compensation method, characterized in that Including: Obtain a layout pattern and a compensation script file, where the layout pattern contains one or more target compensation coordinates; Perform the following operations based on the compensation script file: obtain multiple feature information corresponding to the target compensation coordinates and the feature parameters of each feature information from the layout pattern; for each target compensation coordinate, perform a compensation calculation operation on the feature parameters of the preset feature information according to the operation instruction to generate a preliminary compensation value; perform a screening and filtering operation on the preliminary compensation value according to the filtering condition to generate a target compensation value; Perform an etching compensation operation on the target compensation coordinates according to the target compensation value.

2. The multi-parameter layout etching compensation method according to claim 1, wherein The process of performing a screening and filtering operation on the preliminary compensation value according to the filtering condition to generate a target compensation value includes: If the preliminary compensation value fails to pass the screening and filtering operation, perform the compensation calculation operation on the preliminary compensation value again and update the preliminary compensation value; perform the screening and filtering operation on the updated preliminary compensation value again; Repeat the compensation calculation operation and the screening and filtering operation until the updated preliminary compensation value passes the screening and filtering operation.

3. The multi-parameter layout etching compensation method according to claim 1, characterized in that, The process of performing a compensation calculation operation on the feature parameters of the preset feature information according to the operation instruction to generate a preliminary compensation value includes: Screen out the preset feature information defined in the operation instruction from the multiple feature information; According to the operation type in the operation instruction, perform one or more calculations of logical operation, arithmetic operation, topological operation, and relational operation on the preset feature information to generate a preliminary compensation value.

4. The multi-parameter layout etching compensation method according to claim 1, characterized in that The operation instruction includes the target compensation coordinates to be calculated, as well as the feature information, operation type, and compensation direction associated with the coordinates.

5. The multi-parameter layout etching compensation method according to claim 4, wherein The compensation script file includes the influence factor of each feature information. The process of performing an etching compensation operation on the target compensation coordinates according to the target compensation value includes: Based on the influence factor, correct the target compensation value to generate a compensation correction value; According to the compensation direction specified in the operation instruction, use the compensation correction value as the moving distance and perform a displacement operation on the target compensation coordinates.

6. The multi-parameter layout etching compensation method according to claim 1, wherein The feature information includes one or more of the following layout feature types: Pitch, line width, length, corner angle, density distribution, adjacent pitch, adjacent line width, and adjacent length.

7. A layout etching compensation device with multiple parameters for a layout, characterized in that, Including: Data acquisition module: used to obtain a layout pattern and a compensation script file, where the layout pattern contains one or more target compensation coordinates; Compensation calculation module: used to perform the following operations based on the compensation script file: obtain multiple feature information corresponding to the target compensation coordinates and the feature parameters of each feature information from the layout pattern; for each target compensation coordinate, perform a compensation calculation operation on the feature parameters of the preset feature information according to the operation instruction to generate a preliminary compensation value; perform a screening and filtering operation on the preliminary compensation value according to the filtering condition to generate a target compensation value; Etching compensation module: used to perform an etching compensation operation on the target compensation coordinates according to the target compensation value.

8. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the multi-parameter layout etching compensation method according to any one of claims 1 to 6.

9. A computer program product, characterized in that, The computer program product includes computer program code which, when run on a computer, causes the computer to implement the multi-parameter layout etching compensation method according to any one of claims 1 to 6.

10. An electronic terminal, comprising a memory, a processor, and a computer program stored on the memory, characterized in that, The processor executes the computer program to implement the multi-parameter layout etching compensation method according to any one of claims 1 to 6.

Citation Information

Patent Citations

  • Dynamic etching compensation method for circuit of printed circuit board

    CN117794089A

  • Multi-pattern etching compensation method and device, medium, program product and terminal

    CN118299285A

  • Layout etching compensation method and system, computer equipment and computer medium

    CN118483868A

  • Layout etching compensation method and device, electronic equipment and storage medium

    CN119275123A

  • Etching deviation compensation method and related product

    CN120012700A

Cited By

  • Cooperative etching compensation method and device based on multilayer layout and CMP morphology prediction, medium, program product and terminal

    CN121503408A