Capacitor and method for manufacturing capacitor

Abstract

The invention provides a capacitor and a method for manufacturing the capacitor. The capacitor includes a capacitor element, a bus bar, and an exterior body. The bus bar includes a flat-plate-shaped joining terminal portion that is exposed from the exterior body and to which the external terminal is joined. A partial region of the surface of the joint terminal portion is set as a joint portion to be welded when the external terminal is joined. The surface of the joint terminal part is provided with an indicating part indicating the area of the joint part.

Description

Technical Field

[0001] The present invention relates to a capacitor and a method for manufacturing a capacitor. Background Art

[0002] In the past, a capacitor has been known in which a capacitor element and a bus bar connected to the electrodes of the capacitor element are covered with a resin outer package to improve moisture resistance and impact resistance. Related capacitors include the following types: an outer package is constituted by a resin filled in a case, and a case is provided outside the outer package; an outer package is constituted by resin molding using a casting mold frame, and a case is not provided outside the outer package. In related capacitors, a connection terminal portion is provided at a portion of the bus bar exposed from the outer package, and an external terminal provided in an external device is connected to the connection terminal portion.

[0003] As one of the connection methods between the connection terminal portion and the external terminal, for example, a method based on welding can be used. In this case, one or more connection portions are provided at the connection terminal portion. The external terminal is aligned with the connection terminal portion, and welding is performed at the position of the connection portion. Thereby, the connection terminal portion and the external terminal are connected. A capacitor module that is an example of a related capacitor is described in Patent Document 1.

[0004] In the capacitor module of Patent Document 1, a plate-shaped welding terminal (bus bar) has a standing portion (connection terminal portion) at a portion protruding from the casting resin (outer package). A welding portion (connection portion) is provided at the end of the standing portion so as to protrude from the end. When the terminal (external terminal) of another component (external device) is connected to the standing portion of the welding terminal, the portion of the standing portion including the welding portion and the terminal (external terminal) of another component overlap in their thickness direction, and welding is performed at the position of the welding portion.

[0005] Prior Art Documents

[0006] Patent Documents

[0007] Patent Document 1: JP-A-2015-220789

[0008] In the case where the connection terminal portion and the external terminal are connected by welding as described above, if foreign matter adheres to the connection portion of the connection terminal portion, the foreign matter may interfere with welding. In particular, in the manufacturing process of the capacitor, when forming the outer package with resin in the case or in the casting mold frame, bubbles contained in the resin in the liquid phase state burst near the liquid surface, so that the resin sometimes scatters from the liquid surface, and the scattered resin adheres to the connection portion, which may interfere with welding.

[0009] Therefore, in the completed capacitor, it is considered to check whether foreign matter adheres to the connection portion of the connection terminal portion.

[0010] In the capacitor module of the above-mentioned Patent Document 1, the welding portion has a protruding shape protruding from the end portion of the standing portion. For this reason, it is possible to easily and clearly distinguish the welding portion from other portions of the standing portion, and during the inspection of foreign matter attachment, the inspector can easily grasp the welding portion.

[0011] However, depending on the capacitor, there is sometimes a structure in which a part of the surface of the joint terminal portion having a flat plate shape is set as the joint portion. In the case of such a structure, since it is difficult to distinguish the area of the joint portion from the area other than this on the surface of the joint terminal portion, it is difficult for the inspector to grasp the joint portion, and the inspection may become difficult.

[0012] Furthermore, in the process until the external terminal is joined to the joint portion of the joint terminal portion in the manufacturing process of the capacitor or the like, as long as foreign matter attachment to the joint portion can be prevented, it is not necessary to inspect the presence or absence of foreign matter attachment, and thus it is more desirable.

[0013] The above-mentioned problems also occur in capacitors in which the joint terminal portion and the external terminal are joined by brazing or cladding. Summary of the Invention

[0014] For this reason, an object of the present invention is to provide a capacitor capable of easily inspecting the presence or absence of foreign matter attachment to the joint portion of the joint terminal portion. Furthermore, an object of the present invention is to provide a capacitor and a method for manufacturing a capacitor capable of preventing foreign matter from attaching to the joint portion of the joint terminal portion.

[0015] The first aspect of the present invention relates to a capacitor. The capacitor according to this aspect includes: a capacitor element having an electrode; a bus bar connected to the electrode; and an outer package formed of a resin material and covering the capacitor element and a part of the bus bar. Here, the bus bar includes a flat joint terminal portion that is exposed from the outer package and joins an external terminal. A part of the surface of the joint terminal portion is set as a joint portion for welding, cladding, or brazing when joining the external terminal. An indicating portion for indicating the area of the joint portion is provided on the surface of the joint terminal portion.

[0016] The second aspect of the present invention relates to a capacitor. The capacitor according to this aspect includes: a capacitor element having an electrode; a bus bar connected to the electrode; and an outer package formed of a resin material and covering the capacitor element and a part of the bus bar. Here, the bus bar includes a flat joint terminal portion that is exposed from the outer package and joins an external terminal. A part of the surface of the joint terminal portion is set as a joint portion for welding, cladding, or brazing when joining the external terminal. The area of the joint portion is covered by a detachable protective member on the surface of the joint terminal portion.

[0017] A third aspect of the present invention relates to a method for manufacturing a capacitor. The method for manufacturing a capacitor according to this aspect includes: a housing step of housing a capacitor element module including a capacitor element having an electrode and a bus bar connected to the electrode through an opening into a housing having the opening; a resin injection step of injecting a liquid-phase resin through the opening into the housing housing the capacitor element module; and a resin curing step of curing the liquid-phase resin in the housing to form an exterior body covering the capacitor element module. Here, the bus bar includes a flat joint terminal portion for joining an external terminal. A partial area on the surface of the joint terminal portion is set as a joint portion for welding, cladding, or brazing when joining the external terminal. In the resin injection step, the capacitor element and the bus bar are buried in the liquid-phase resin so that the joint terminal portion is exposed from the liquid surface of the liquid-phase resin that becomes the casting surface of the exterior body. The resin injection step and the resin curing step are performed in a state where the joint portion area is covered with a detachable protective member.

[0018] A fourth aspect of the present invention relates to a method for manufacturing a capacitor. The method for manufacturing a capacitor according to this aspect includes: a housing step of housing a capacitor element module including a capacitor element having an electrode and a bus bar connected to the electrode through an opening into a casting mold frame having the opening; a resin injection step of injecting a liquid-phase resin through the opening into the casting mold frame housing the capacitor element module; and a resin curing step of curing the liquid-phase resin in the casting mold frame to form an exterior body covering the capacitor element module. Here, the bus bar includes a flat joint terminal portion for joining an external terminal. A partial area on the surface of the joint terminal portion is set as a joint portion for welding, cladding, or brazing when joining the external terminal. In the resin injection step, the capacitor element and the bus bar are buried in the liquid-phase resin so that the joint terminal portion is exposed from the liquid surface of the liquid-phase resin that becomes the casting surface of the exterior body. The resin injection step and the resin curing step are performed in a state where the joint portion area is covered with a detachable protective member.

[0019] Advantages of the Invention

[0020] According to the present invention, a capacitor capable of easily checking the presence or absence of foreign matter attachment to the joint portion of the joint terminal portion can be provided. Further, according to the present invention, a capacitor capable of preventing foreign matter from attaching to the joint portion of the joint terminal portion and a method for manufacturing a capacitor can be provided.

[0021] The effects or significance of the present invention will become clearer through the description of the embodiments shown below. Among them, the embodiments shown below are merely examples when implementing the present invention, and the present invention is not restricted by any of the descriptions of the following embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a perspective view of a thin film capacitor according to Embodiment 1.

[0023] Figure 2 is a cross-sectional view of the thin film capacitor according to Embodiment 1, cut parallel to the XZ plane at the center in the Y-axis direction.

[0024] Figure 3 is a perspective view of a capacitor element module according to Embodiment 1.

[0025] Figure 4 is a perspective view of a capacitor element module according to Embodiment 1.

[0026] Figure 5 is a cross-sectional view of the capacitor element module according to Embodiment 1, cut parallel to the XY plane at a position on the negative Z-axis side with respect to the insulating member.

[0027] Figure 6 is a perspective view of a first bus bar according to Embodiment 1.

[0028] Figure 7 is a perspective view of a second bus bar according to Embodiment 1.

[0029] Figure 8 (a) is a main part cross-sectional view of the first bus bar cut at the position of the first joint portion, showing the vicinity of the first joint terminal portion according to Embodiment 1. Figure 8 (b) is a main part cross-sectional view of the second bus bar cut at the position of the second joint portion, showing the vicinity of the second joint terminal portion according to Embodiment 1.

[0030] Figure 9 (a) and (b) are perspective views of an insulating member according to Embodiment 1.

[0031] Figure 10 is a perspective view of a housing according to Embodiment 1.

[0032] Figure 11 is a top view of the thin film capacitor in a state where external terminals are joined to the first joint terminal portion and the second joint terminal portion according to Embodiment 1.

[0033] Figure 12It is a perspective view of the thin-film capacitor according to Embodiment 2.

[0034] Figure 13 It is a perspective view of the thin-film capacitor according to Embodiment 3.

[0035] Figure 14 It is a perspective view of the first protective member, the second protective member, and the capacitor element module according to Embodiment 3.

[0036] Figure 15 (a) and (b) are diagrams for explaining the manufacturing method of the thin-film capacitor according to Embodiment 3.

[0037] Figure 16 It is a perspective view of the thin-film capacitor according to Embodiment 4.

[0038] Figure 17 (a) and (b) are diagrams for explaining the manufacturing method of the thin-film capacitor according to Embodiment 4.

[0039] Explanation of reference numerals

[0040] 1 to 4 Thin-film capacitors (capacitors)

[0041] 5 Casting mold frame

[0042] 5a Opening

[0043] 10, 10A Capacitor element modules

[0044] 20 Housing

[0045] 21 Opening

[0046] 30 Filling resin (outer package)

[0047] 31 Casting surface

[0048] 40 Outer package

[0049] 41 Casting surface

[0050] 51 First protective member (protective member)

[0051] 52 Second protective member (protective member)

[0052] 100 Capacitor element

[0053] 110 First electrode (electrode)

[0054] 120 Second electrode (electrode)

[0055] 200, 200A First bus bar (bus bar)

[0056] 230 First bonding terminal portion (bonding terminal portion)

[0057] 231 First bonding portion (bonding portion)

[0058] 232 First groove portion (groove portion, indication portion)

[0059] 300, 300A Second bus bar (bus bar)

[0060] 330 Second bonding terminal portion (bonding terminal portion)

[0061] 331 Second bonding portion (bonding portion)

[0062] 332 Second groove portion (groove portion, indication portion)

[0063] T1, T2 External terminals. Detailed implementation mode

[0064] Hereinafter, a thin film capacitor according to an embodiment of the capacitor of the present invention will be described with reference to the accompanying drawings. In addition, in each figure, an X-axis, a Y-axis, and a Z-axis orthogonal to each other are attached for convenience.

[0065] <Embodiment 1>

[0066] The thin film capacitor 1 according to Embodiment 1 will be described. The thin film capacitor 1 is a so-called case-molded capacitor.

[0067] Figure 1 is a perspective view of the thin film capacitor 1. Figure 2 is a cross-sectional view of the thin film capacitor 1 cut parallel to the XZ plane at the center in the Y-axis direction. In addition, in Figure 2 for convenience, the filling resin 30 is shown in a transparent state.

[0068] The thin film capacitor 1 includes a capacitor element module 10, a case 20, and a filling resin 30. The capacitor element module 10 is housed in the case 20, and the filling resin 30 is filled in the case 20.

[0069] The filling resin 30 is a thermosetting resin such as an epoxy resin. The filling resin 30 is an outer package that covers the capacitor element module 10 in the case 20. The portion of the capacitor element module 10 buried in the filling resin 30 is protected from moisture and impact by the case 20 and the filling resin 30.

[0070] Figure 3 and Figure 4 is a perspective view of the capacitor element module 10. Figure 5 is a cross-sectional view of the capacitor element module 10 cut parallel to the XY plane at a position on the negative Z-axis side with respect to the insulating member 400.Figure 6 is a perspective view of the first bus bar 200. Figure 7 is a perspective view of the second bus bar 300. Figure 8 In (a) of Figure 8 , it is a main part cross-sectional view of the first bus bar 200 cut at the position of the first joint portion 231, showing the vicinity of the first joint terminal portion 230. Figure 8 In (b) of Figure 8 , it is a main part cross-sectional view of the second bus bar 300 cut at the position of the second joint portion 331, showing the vicinity of the second joint terminal portion 330. Figure 9 In (a) and (b) of Figure 9 , they are perspective views of the insulating member 400.

[0071] The capacitor element module 10 includes four capacitor elements 100, a first bus bar 200, a second bus bar 300, and an insulating member 400.

[0072] Regarding the capacitor element 100, two metallized films on which aluminum is vapor-deposited on a dielectric film are overlapped, and the overlapped metallized films are wound or laminated and pressed, thereby forming a shape close to a flat long cylinder. In the capacitor element 100, a first electrode 110 is formed by spraying a metal such as zinc on one end face, and a second electrode 120 is formed in the same manner by spraying a metal such as zinc on the other end face.

[0073] The capacitor element 100 has a peripheral surface 130 that connects the first electrode 110 and the second electrode 120. The peripheral surface 130 includes: two first planes 131 arranged side by side in the short side direction (i.e., the X-axis direction) of the capacitor element 100; two second planes 132 arranged side by side in the long side direction (i.e., the Y-axis direction) of the capacitor element 100; and four arc surfaces 133 existing between the first plane 131 and the second plane 132. The dimension of the first plane 131 in the Y-axis direction is larger than the dimension of the second plane 132 in the X-axis direction.

[0074] In addition, the capacitor element 100 of the present embodiment is formed of a metallized film on which aluminum is vapor-deposited on a dielectric film, but in addition to this, it may also be formed of a metallized film on which other metals such as zinc and magnesium are vapor-deposited. Alternatively, the capacitor element 100 may also be formed of a metallized film on which multiple of these metals are vapor-deposited, or may be formed of a metallized film on which an alloy of these metals is vapor-deposited.

[0075] The four capacitor elements 100 are arranged in two rows side by side in the X-axis direction and the Y-axis direction respectively, such that the peripheral surfaces 130 face each other. In each capacitor element 100, the first electrode 110 faces the negative Z-axis direction, and the second electrode 120 faces the positive Z-axis direction.

[0076] The first bus bar 200 is formed by appropriately cutting and bending a conductive material such as a copper plate, and has a structure in which the first electrode terminal portion 210, the first relay portion 220, and the first joint terminal portion 230 are integrated.

[0077] The first electrode terminal portion 210 has a substantially rectangular flat plate shape that is long in the Y-axis direction. Two corner portions of the first electrode terminal portion 210 in the positive X-axis direction are formed into large arcs. At the end of the first electrode terminal portion 210 in the positive X-axis direction, a substantially U-shaped notch portion 211 is formed at the center.

[0078] The first relay portion 220 relays between the first electrode terminal portion 210 and the first joint terminal portion 230. The first relay portion 220 has a substantially rectangular flat plate shape that is long in the Y-axis direction, and extends perpendicularly to the Z-axis positive direction from the end of the first electrode terminal portion 210 in the negative X-axis direction. The dimension of the first relay portion 220 in the Z-axis direction is larger than the dimension of the capacitor element 100 in the Z-axis direction, that is, the direction in which the first electrode 110 and the second electrode 120 are arranged side by side.

[0079] In the first relay portion 220, two protrusion portions 221 are respectively provided at two positions on the surface on the positive X-axis side, closer to the first electrode terminal portion 210 side than the center in the Z-axis direction, on the positive Y-axis side and the negative Y-axis side, and are arranged side by side in the Y-axis direction. The four protrusion portions 221 have a flat substantially cylindrical shape and protrude toward the positive X-axis side from the surface of the first relay portion 220 on the positive X-axis side. The front end surface 221a of each protrusion portion 221 has a flat shape, and the outer peripheral edge of the front end surface 221a is chamfered in an arc shape. Further, at the end on the positive Y-axis side and the end on the negative Y-axis side in the first relay portion 220, first protruding pieces 222 protruding toward the positive Y-axis direction and the negative Y-axis direction are respectively formed near the first joint terminal portion 230.

[0080] The first joint terminal portion 230 has a substantially rectangular flat plate shape that is elongated in the Y-axis direction, and extends perpendicularly to the X-axis negative direction from the end of the first relay portion 220 in the Z-axis positive direction. At two positions side by side in the Y-axis direction in the inner portion of the surface of the first joint terminal portion 230, first joint portions 231 for welding when joining external terminals are set. And a substantially square ring-shaped first groove portion 232 that indicates the boundary between the region of the first joint portion 231 and the other regions is provided on the surface of the first joint terminal portion 230, as an indicating portion for indicating the region of each first joint portion 231.

[0081] As Figure 8As shown in (a) thereof, the first groove portion 232 has, for example, a V-shaped cross section. The first groove portion 232 may have a cross-sectional shape other than V-shape such as a semicircle, a U-shape, or a square. In the first joint terminal portion 230, the thickness D1 at the portion of each first groove portion 232 is smaller than the thickness D2 at the portion of each first joint portion 231.

[0082] The second bus bar 300 is formed by appropriately cutting and bending a conductive material such as a copper plate, and has a structure in which the second electrode terminal portion 310, the second relay portion 320, and the second joint terminal portion 330 are integrated.

[0083] The second electrode terminal portion 310 has a substantially square flat plate shape that is long in the Y-axis direction, and the end portion 310a on the negative X-axis side (the second relay portion 320 side) is higher in the Z-axis direction. Two corner portions on the positive X-axis of the second electrode terminal portion 310 are formed into large arcs. At the end on the positive X-axis of the second electrode terminal portion 310, a substantially semicircular notch portion 311 is formed at the center.

[0084] The second relay portion 320 relays between the second electrode terminal portion 310 and the second joint terminal portion 330. The second relay portion 320 has a substantially square flat plate shape that is elongated in the Y-axis direction, and extends perpendicularly to the second electrode terminal portion 310 from the end on the negative X-axis of the second electrode terminal portion 310 in the positive Z-axis direction. Second protruding pieces 321 that protrude in the positive Y-axis direction and the negative Y-axis direction are respectively formed at the end on the positive Y-axis side and the end on the negative Y-axis side in the second relay portion 320.

[0085] The second joint terminal portion 330 has a substantially square flat plate shape that is elongated in the Y-axis direction, and extends perpendicularly to the second relay portion 320 from the end on the positive Z-axis of the second relay portion 320 in the positive X-axis direction. On the inner side portion of the surface of the second joint terminal portion 330, second joint portions 331 for welding when joining external terminals are set at two places side by side in the Y-axis direction. And, on the surface of the second joint terminal portion 330, a substantially square ring-shaped second groove portion 332 that indicates the boundary between the region of the second joint portion 331 and the other regions is provided as an indicating portion for indicating the region of each second joint portion 331.

[0086] As Figure 8 As shown in (b) thereof, the second groove portion 332 has, for example, a V-shaped cross section. The second groove portion 332 may have a cross-sectional shape other than V-shape such as a semicircle, a U-shape, or a square. In the second joint terminal portion 330, the thickness D3 at the portion of each second groove portion 332 is smaller than the thickness D4 at the portion of each second joint portion 331.

[0087] The insulating member 400 is formed of an electrically insulating material such as polyphenylene sulfide (PPS), and has a substantially square plate shape that is long in the Y-axis direction. In the insulating member 400, a first recess 410 and a second recess 420 that are substantially square and long in the Y-axis direction and are recessed with respect to these surfaces are respectively formed on the first surface 400a on the negative X-axis side and the second surface 400b on the positive X-axis side. In the first recess 410, a passage 411 extending to the end on the negative Z-axis side of the insulating member 400 is provided at the end on the positive Y-axis side.

[0088] In the insulating member 400, holding portions 430 are provided at both ends in the Y-axis direction. In each holding portion 430, a first fitting groove 431 that opens in the negative Z-axis direction and the Y-axis direction is provided on the first surface 400a side, and a second fitting groove 432 that opens in the positive Z-axis direction and the Y-axis direction is provided on the second surface 400b side. Further, in the insulating member 400, an eaves portion 440 that extends in the negative X-axis direction is provided at the end on the positive Z-axis side.

[0089] In the capacitor element module 10, the first electrode terminal portion 210 of the first bus bar 200 contacts the first electrodes 110 of the four capacitor elements 100 from the negative Z-axis side. The first electrode terminal portion 210 and the four first electrodes 110 are joined by a joining method such as welding or soldering. Thereby, the first bus bar 200 is electrically connected to the four first electrodes 110.

[0090] The second electrode terminal portion 310 of the second bus bar 300 contacts the second electrodes 120 of the four capacitor elements 100 from the positive Z-axis side. There is a gap between the end portion 310a of the second electrode terminal portion 310 and the second electrode 120. The second electrode terminal portion 310 and the four second electrodes 120 are joined by a joining method such as welding or soldering. Thereby, the second bus bar 300 is electrically connected to the four second electrodes 120.

[0091] The first relay portion 220 of the first bus bar 200 faces the first plane 131 of the peripheral surfaces 130 of the two capacitor elements 100 on the negative X-axis side as a whole between the first electrode 110 and the second electrode 120 from the negative X-axis side. The front end surfaces 221a of the two protruding portions 221 on the positive Y-axis side of the first relay portion 220 abut against the first plane 131 of the capacitor element 100 on the positive Y-axis side at a position closer to the first electrode 110 than the second electrode 120. Similarly, the front end surfaces 221a of the two protruding portions 221 on the negative Y-axis side of the first relay portion 220 abut against the first plane 131 of the capacitor element 100 on the negative Y-axis side at a position closer to the first electrode 110 than the second electrode 120.

[0092] The portion on the positive Z-axis side of the insulating member 400 is interposed between the first relay portion 220 of the first bus bar 200 and the second relay portion 320 of the second bus bar 300 in a state of being in contact with them. In addition, the portion on the negative Z-axis side of the insulating member 400 is interposed between the first relay portion 220 of the first bus bar 200 and the first planes 131 of the two capacitor elements 100 on the negative X-axis side in a state of being in contact with them. Thereby, the insulation between the first relay portion 220 and the second relay portion 320 and the second electrode 120 is ensured.

[0093] The thickness D5 of the insulating member 400 is equal to the protruding length D6 of the four protruding portions 221 of the first relay portion 220 (refer to Figure 2 ). Thereby, the first planes 131 of the two capacitor elements 100 and the first relay portion 220 are parallel. A uniform gap S with a fixed width (the width of the amount of the thickness D5 and the protruding length D6) is ensured between the first planes 131 of the two capacitor elements 100 and the first relay portion 220. By maintaining the distance between the two capacitor elements 100 and the first relay portion 220 fixed, that is, by suppressing the deviation of this distance, the electrical characteristics of the thin film capacitor 1 are less likely to deviate.

[0094] The first protruding piece 222 of the first relay portion 220 is inserted into the first insertion groove 431 of the holding portion 430 of the insulating member 400 from the negative Z-axis side, and the first bonding terminal portion 230 abuts against the eaves portion 440 of the insulating member 400 from the negative Z-axis side. The second protruding piece 321 of the second relay portion 320 is inserted into the second insertion groove 432 of the holding portion 430 of the insulating member 400 from the negative Z-axis side, and the second bonding terminal portion 330 abuts against the holding portion 430 from the positive Z-axis side. Thereby, the first bus bar 200, the second bus bar 300, and the insulating member 400 are difficult to separate in the X-axis direction, Y-axis direction, and Z-axis direction.

[0095] Figure 10 is a perspective view of the housing 20.

[0096] The housing 20 is formed of a resin material such as a thermoplastic resin such as polyphenylene sulfide (PPS). The housing 20 may also be formed of a thermosetting resin such as an epoxy resin.

[0097] The housing 20 has a substantially rectangular parallelepiped box shape and includes: a substantially square-shaped opening 21; a substantially square-shaped bottom surface portion 22 opposed to the opening 21; a substantially square-shaped first side surface portion 23 and a second side surface portion 24 that extend from both end portions on the X-axis direction side of the bottom surface portion 22 toward the opening 21 side (positive Z-axis direction) and are opposed to each other; and a square-shaped third side surface portion 25 and a fourth side surface portion 26 that extend from both end portions on the Y-axis direction side of the bottom surface portion 22 toward the opening 21 side (positive Z-axis direction) and are opposed to each other.

[0098] Mounting fins 27 are provided on the first side face 23, the third side face 25, and the fourth side face 26. Insertion through-holes 27a are formed in the respective mounting fins 27. In the insertion through-holes 27a, metal sleeves 27b are inserted to enhance the strength of the holes. Further, positioning fins 28 are provided on the third side face 25 and the fourth side face 26. Each positioning fin 28 has a positioning pin 28a protruding toward the bottom face 22 side. When the film capacitor 1 is disposed in the mounting portion of an external device, the mounting fins 27 are fixed to the mounting portion by screws or the like. At this time, in order to position the film capacitor 1 relative to the mounting portion, the positioning pins 28a are inserted into positioning holes provided in the mounting portion.

[0099] Inside the housing 20, the capacitor element module 10 is arranged such that the first electrodes 110 of the four capacitor elements 100 face the bottom face 22 of the housing 20. The first relay portion 220 of the first bus bar 200 extends along the second side face 24 of the housing 20 from the bottom face 22 side toward the opening 21 side, is led out from the casting surface 31 of the filling resin 30 to the outside of the filling resin 30, and the first connection terminal portion 230 of the first bus bar 200 is exposed from the filling resin 30. Further, the second relay portion 320 of the second bus bar 300 is led out from the casting surface 31 to the outside of the filling resin 30, and the second connection terminal portion 330 of the second bus bar 300 is exposed from the filling resin 30.

[0100] When assembling the film capacitor 1, first, in the housing process, the capacitor element module 10 is housed into the housing 20 through the opening 21. The capacitor element module 10 is positioned at a given position inside the housing 20 by a positioning jig.

[0101] Next, in the resin injection process, the liquid-phase filling resin 30 is injected into the housing 20 through the opening 21 and filled to a position near the opening 21. The first connection terminal portion 230 of the first bus bar 200 and the second connection terminal portion 330 of the second bus bar 300 are exposed from the liquid surface of the liquid-phase filling resin 30 that becomes the casting surface 31 after curing.

[0102] Between the first planes 131 of the two capacitor elements 100 on the negative X-axis direction side and the first relay portion 220 of the first bus bar 200, a gap S with a fixed width is ensured by the insulating members 400 and the four protrusions 221. For this purpose, the injected filling resin 30 easily enters the gap S, and the gap S is sufficiently filled with the filling resin 30, so that it is difficult for air to remain in the gap S. In particular, in the gap S, since the filling resin 30 enters not only from both sides in the Y-axis direction of the first relay portion 220, but also as Figure 2As shown by the dashed arrow, the filling resin 30 enters through the gap between the end portion 310a of the second electrode terminal portion 310 of the second bus bar 300 and the second electrodes 120 of the two capacitor elements 100 on the negative X-axis side, and the gap between the two second electrodes 120. Therefore, the filling resin 30 easily spreads throughout the gap S.

[0103] In addition, the injected filling resin 30 enters the first recess 410 and the second recess 420 of the insulating member 400, and the first recess 410 and the second recess 420 are filled with the filling resin 30.

[0104] Furthermore, in the capacitor element module 10, the notch portion 211 of the first electrode terminal portion 210 of the first bus bar 200 and the notch portion 311 of the second electrode terminal portion 310 of the second bus bar 300 are set to coincide with the space generated in the central portion of the four capacitor elements 100 (refer to Figure 3 , Figure 4 ). For this reason, the injected filling resin 30 easily spreads between the two capacitor element modules 10 and the bottom surface portion 22 of the housing 20 through the two notch portions 211, 311 and the space in the central portion.

[0105] When the filling resin 30 fills the inside of the housing 20, a resin curing process is performed to heat the inside of the housing 20 and heat the filling resin 30. As a result, the filling resin 30 cures inside the housing 20. The filling resin 30 becomes an outer package covering the capacitor element module 10.

[0106] In this way, Figure 1 the film capacitor 1 as shown is completed.

[0107] The peripheral surfaces 130 of the two capacitor elements 100 on the negative X-axis side and the first relay portion 220 are bonded by the filling resin 30 existing in the gap S between them. At this time, since the filling resin 30 existing in the gap S ensures a certain thickness, it is difficult to cause peeling between the peripheral surface 130 of each capacitor element 100 and the filling resin 30, and between the first relay portion 220 and the filling resin 30. In addition, since the gap S is difficult to narrow, it is difficult to generate voids in the filling resin 30 existing in the gap S. Therefore, since it is difficult to reduce the moisture resistance due to moisture intrusion into the peeled portion and voids, the moisture resistance of the film capacitor 1 can be improved. Furthermore, the first relay portion 220 and the insulating member 400 are bonded by the filling resin 30 in the first recess 410, and the second relay portion 320 and the insulating member 400 are bonded by the filling resin 30 in the second recess 420. As a result, moisture is difficult to enter between the first relay portion 220 and the insulating member 400 and between the second relay portion 320 and the insulating member 400, further improving the moisture resistance of the film capacitor 1.

[0108] When injecting the liquid-phase filling resin 30 into the housing 20 through the resin injection process, a large amount of air is involved, resulting in a large number of bubbles being generated in the liquid-phase filling resin 30 inside the housing 20. These bubbles burst near the liquid surface, and sometimes the resin scatters from the liquid surface, and the scattered resin may adhere to the first joint portion 231 of the first joint terminal portion 230 and the second joint portion 331 of the second joint terminal portion 330 that exist near the liquid surface. Furthermore, during various processes until the film capacitor 1 is completed, foreign substances such as dust may also adhere to the first joint portion 231 and the second joint portion 331.

[0109] When the first joint terminal portion 230 and the second joint terminal portion 330 are joined to the external terminals, welding is performed within the regions of the first joint portion 231 and the second joint portion 331. For this reason, in the completed film capacitor 1, if foreign substances such as resin and dust adhere to the first joint portion 231 and the second joint portion 331, it may become an obstacle to welding.

[0110] For this reason, in the completed film capacitor 1, an inspection is performed to check whether foreign substances adhere to the first joint portion 231 and the second joint portion 331. In the film capacitor 1 of the present embodiment, on the surface of the first joint terminal portion 230, the boundary between the region of the first joint portion 231 and the other regions is indicated by the first groove portion 232 as an indicating portion. Similarly, on the surface of the second joint terminal portion 330, the boundary between the region of the second joint portion 331 and the other regions is indicated by the second groove portion 332 as an indicating portion. For this reason, the inspector can easily grasp the first joint portion 231 and the second joint portion 331, and can easily perform an inspection for the presence or absence of foreign substance adhesion. Moreover, the inspector can easily detect the adhesion of foreign substances, especially resin, to the first joint portion 231 and the second joint portion 331.

[0111] The film capacitor 1 is mounted on an external device. An external terminal T1 corresponding to the first joint terminal portion 230 of the first bus bar 200 and an external terminal T2 corresponding to the second joint terminal portion 330 of the second bus bar 300 are provided in the external device. The external terminal T1 is joined to the first joint terminal portion 230 by welding, and the external terminal T2 is joined to the second joint terminal portion 330 by welding.

[0112] Figure 11 It is a top view of the film capacitor 1 showing a state in which the external terminals T1 and T2 are joined to the first joint terminal portion 230 and the second joint terminal portion 330.

[0113] The external terminal T1 overlaps with the surface of the first joint terminal portion 230 so as to cover two first joint portions 231. The joint surface of the external terminal T1 that contacts the first joint terminal portion 230 is flat. Similarly, the external terminal T2 overlaps with the surface of the second joint terminal portion 330 so as to cover two second joint portions 331. The joint surface of the external terminal T2 that contacts the second joint terminal portion 330 is flat.

[0114] Welding (such as laser welding, resistance welding, etc.) using a welding device is performed within the regions of each of the first joint portions 231 and each of the second joint portions 331. Thereby, the external terminal T1 is joined to the first joint terminal portion 230, and the external terminal T2 is joined to the second joint terminal portion 330.

[0115] The actual welded portion P becomes a shape that is long in the long side direction (Y-axis direction) of the first joint terminal portion 230 and the second joint terminal portion 330. Therefore, corresponding to the shape of the welded portion P, each of the first joint portions 231 and each of the second joint portions 331 has a substantially rectangular shape. In addition, due to assembly tolerances, component tolerances, etc. in the film capacitor 1, the position of the welded portion P may deviate slightly. Therefore, considering the amount of deviation of the position of the welded portion P, the sizes of each of the first joint portions 231 and each of the second joint portions 331 are made larger than the size of the welded portion P. Also, if the shape of the welded portion P is changed, correspondingly, the shapes of each of the first joint portions 231 and each of the second joint portions 331 can also be changed.

[0116] The indicating portion that indicates each of the first joint portions 231 is the first groove portion 232 and does not protrude from the surface of the first joint terminal portion 230. Therefore, the contact of the joint surface of the external terminal T1 with the surface of the first joint terminal portion 230 is not obstructed by the indicating portion. In addition, in the first joint terminal portion 230, the thickness D1 at the portion of each of the first groove portions 232 is smaller than the thickness D2 at the portion of each of the first joint portions 231 (refer to Figure 8 of (a)). For this reason, since heat is difficult to propagate at the portion of each of the first groove portions 232, the heat generated at each of the first joint portions 231 during welding is difficult to dissipate from each of the first joint portions 231. Therefore, welding can be efficiently performed at each of the first joint portions 231.

[0117] Similarly, the indicating portion that indicates each of the second joint portions 331 is the second groove portion 332 and does not protrude from the surface of the second joint terminal portion 330. Therefore, the contact of the joint surface of the external terminal T2 with the surface of the second joint terminal portion 330 is not obstructed by the indicating portion. In addition, in the second joint terminal portion 330, the thickness D3 at the portion of each of the second groove portions 332 is smaller than the thickness D4 at the portion of each of the second joint portions 331 (refer to Figure 8(b)). For this reason, since heat hardly propagates in the portions of the second groove portions 332, the heat generated at the second joint portions 331 during welding hardly dissipates from the second joint portions 331. Therefore, welding can be efficiently performed at the second joint portions 331.

[0118] In addition, since the first joint portion 231 and the second joint portion 331 are indicated by the first groove portion 232 and the second groove portion 332, the welding device can also determine the areas of the first joint portion 231 and the second joint portion 331 by image recognition and perform welding.

[0119] <Effects of Embodiment 1>

[0120] As described above, according to Embodiment 1, the following effects are achieved.

[0121] The thin film capacitor 1 includes: a capacitor element 100 having a first electrode 110 and a second electrode 120; a first bus bar 200 and a second bus bar 300 connected to the first electrode 110 and the second electrode 120; and an exterior body (filled resin 30) formed of a resin material and covering the capacitor element 100 and a part of the first bus bar 200 and the second bus bar 300. The first bus bar 200 and the second bus bar 300 include flat first joint terminal portions 230 and second joint terminal portions 330 that are exposed from the exterior body and joined to the external terminals T1 and T2. A part of the surfaces of the first joint terminal portions 230 and the second joint terminal portions 330 is set as the first joint portion 231 and the second joint portion 331 where welding is performed when joining the external terminals T1 and T2. Indicating portions (first groove portion 232 and second groove portion 332) for indicating the areas of the first joint portion 231 and the second joint portion 331 are provided on the surfaces of the first joint terminal portions 230 and the second joint terminal portions 330.

[0122] According to this structure, when checking whether foreign matter that hinders welding adheres to the first joint portion 231 and the second joint portion 331, it is easy for the inspector to grasp the areas of the first joint portion 231 and the second joint portion 331 on the surfaces of the first joint terminal portions 230 and the second joint terminal portions 330. Therefore, the inspector can easily perform the inspection.

[0123] Furthermore, the indicating portion is an annular first groove portion 232 formed on the surface of the first joining terminal portion 230 to indicate the boundary between the region of the first joining portion 231 and the other regions, and is also an annular second groove portion 332 formed on the surface of the second joining terminal portion 330 to indicate the boundary between the region of the second joining portion 331 and the other regions. In the first joining terminal portion 230, the thickness D1 at the portion of the first groove portion 232 is smaller than the thickness D2 at the portion of the first joining portion 231. In the second joining terminal portion 330, the thickness D3 at the portion of the second groove portion 332 is smaller than the thickness D4 at the portion of the second joining portion 331.

[0124] According to this structure, the contact of the joining surface of the external terminal T1 with the surface of the first joining terminal portion 230 is not obstructed by the first groove portion 232. In addition, the heat generated in the first joining portion 231 during soldering is difficult to dissipate from the first joining portion 231, and efficient soldering can be performed. Similarly, the contact of the joining surface of the external terminal T2 with the surface of the second joining terminal portion 330 is not obstructed by the second groove portion 332. In addition, the heat generated in the second joining portion 331 during soldering is difficult to dissipate from the second joining portion 331, and efficient soldering can be performed.

[0125] Furthermore, the exterior body (the potting resin 30) includes a casting surface 31, and the first joining terminal portion 230 and the second joining terminal portion 330 are exposed from the casting surface 31.

[0126] When forming the exterior body, the resin scattered near the liquid surface of the potting resin 30 in the liquid phase state that becomes the casting surface 31 may adhere to the first joining portion 231 and the second joining portion 331. According to this structure, it is possible to easily detect the adhesion of the resin to the first joining portion 231 and the second joining portion 331.

[0127] <Embodiment 2>

[0128] Describe the thin film capacitor 2 according to Embodiment 2. The thin film capacitor 2 is a so-called shell-less capacitor.

[0129] Figure 12 It is a perspective view of the thin film capacitor 2. In the present embodiment, the same reference numerals are given to the same structures as those in the above Embodiment 1.

[0130] In the thin film capacitor 2, different from the thin film capacitor 1 of the above Embodiment 1, it does not have a shell, and the capacitor element module 10 is only covered by the exterior body 40.

[0131] The exterior body 40 is formed of a thermosetting resin such as epoxy resin and has a substantially rectangular parallelepiped shape. The exterior body 40 includes a casting surface 41, and the first joint terminal portion 230 of the first bus bar 200 and the second joint terminal portion 330 of the second bus bar 300 are exposed from the casting surface 41. The first joint terminal portion 230 has first joint portions 231 indicated by first groove portions 232 as indicating portions at two positions, and the second joint terminal portion 330 has second joint portions 331 indicated by second groove portions 332 as indicating portions at two positions.

[0132] To form the exterior body 40, a square box-shaped casting mold frame having an opening is used.

[0133] First, in the housing process, the capacitor element module 10 is housed in the casting mold frame through the opening. The capacitor element module 10 is positioned at a given position in the casting mold frame by a positioning jig.

[0134] Next, in the resin injection process, the resin in a liquid phase state is injected into the casting mold frame through the opening. The first joint terminal portion 230 of the first bus bar 200 and the second joint terminal portion 330 of the second bus bar 300 are exposed from the liquid surface of the resin that becomes the casting surface 41 after curing.

[0135] Next, in the resin curing process, the resin in the casting mold frame is heated to heat the resin. As a result, the resin cures in the casting mold frame to form the exterior body 40. After that, the casting mold frame is disassembled. In this way, Figure 12 the film capacitor 2 as shown is completed.

[0136] The film capacitor 2 is mounted on an external device. Similar to the above-described Embodiment 1, the external terminal T1 is joined to the first joint terminal portion 230 by welding at the two first joint portions 231, and the external terminal T2 is joined to the second joint terminal portion 330 by welding at the two second joint portions 331.

[0137] <Effects of Embodiment 2>

[0138] According to the present Embodiment 2, the same effects as those of the above-described Embodiment 1 can be achieved.

[0139] <Embodiment 3>

[0140] The film capacitor 3 according to Embodiment 3 will be described. The film capacitor 3 is a so-called case-molded capacitor.

[0141] Figure 13 is a perspective view of the film capacitor 3. Figure 14It is a perspective view of the first protective member 51, the second protective member 52, and the capacitor element module 10A. In the present embodiment, the same reference numerals are given to the same structures as those in the above-described Embodiment 1.

[0142] The thin film capacitor 3 includes a capacitor element module 10A, a housing 20, a filling resin 30, two first protective members 51, and two second protective members 52. The capacitor element module 10A includes four capacitor elements 100, a first bus bar 200A, a second bus bar 300A, and an insulating member 400.

[0143] The first bus bar 200A is the same as the first bus bar 200 in the above-described Embodiment 1, and includes a first electrode terminal portion 210, a first relay portion 220, and a first bonding terminal portion 230. And, on the surface of the first bonding terminal portion 230, Figure 14 as shown by the one-dot chain virtual line L1 in, two first bonding portions 231 having a substantially rectangular shape long in the Y-axis direction are set. However, the first bus bar 200A is different from the first bus bar 200 in the above-described Embodiment 1, and does not have an indicating portion on the surface of the first bonding terminal portion 230 that indicates the boundary between the region where the two first bonding portions 231 are located and the other region.

[0144] The second bus bar 300A is the same as the second bus bar 300 in the above-described Embodiment 1, and includes a second electrode terminal portion 310, a second relay portion 320, and a second bonding terminal portion 330. And, on the surface of the second bonding terminal portion 330, Figure 14 as shown by the one-dot chain virtual line L2 in, two second bonding portions 331 having a substantially rectangular shape long in the Y-axis direction are set. However, the second bus bar 300A is different from the second bus bar 300 in the above-described Embodiment 1, and does not have an indicating portion on the surface of the second bonding terminal portion 330 that indicates the boundary between the region where the two second bonding portions 331 are located and the other region.

[0145] The capacitor element module 10A is buried in the filling resin 30 in the housing 20. The first bonding terminal portion 230 and the second bonding terminal portion 330 are exposed from the casting surface 31 of the filling resin 30.

[0146] Two first protective members 51 are attached to the surface of the first bonding terminal portion 230 so as to cover the entire two first bonding portions 231. Similarly, two second protective members 52 are attached to the surface of the second bonding terminal portion 330 so as to cover the entire two second bonding portions 331.

[0147] The first protective member 51 and the second protective member 52 are formed into a film shape by a resin such as polyethylene terephthalate (PET), for example, have a substantially rectangular shape that is long in the Y-axis direction, and have substantially the same dimensions as the first joint portion 231 and the second joint portion 331. The first protective member 51 and the second protective member 52 are respectively adhered to the surfaces of the first joint terminal portion 230 and the second joint terminal portion 330 by an adhesive coated on their back surfaces and can be detached from these surfaces.

[0148] The first protective member 51 and the second protective member 52 are respectively equipped at the positions of the regions set for the first joint portion 231 in the first joint terminal portion 230 and the regions set for the second joint portion 331 in the second joint terminal portion 330, for example, after the capacitor element module 10A is completed and before it is housed in the housing 20, using a dedicated attaching device.

[0149] Figure 15 Figures (a) and (b) are diagrams for explaining the manufacturing method of the thin film capacitor 3.

[0150] When assembling the thin film capacitor 3, first, a housing process is performed. As Figure 15 shown in Figure (a), the capacitor element module 10A is housed in the housing 20 through the opening 21. At this time, the two first joint portions 231 of the first joint terminal portion 230 are in a state covered by the first protective member 51, and the two second joint portions 331 of the second joint terminal portion 330 are in a state covered by the second protective member 52. The capacitor element module 10A is positioned at a given position in the housing 20 by a positioning jig.

[0151] Next, a resin injection process is performed. As Figure 15 shown in Figure (b), the liquid-phase filling resin 30 is injected into the housing 20 through the opening 21 and filled to a position close to the opening 21. The first joint terminal portion 230 and the second joint terminal portion 330 are exposed from the liquid surface of the liquid-phase filling resin 30 that becomes the casting surface 31 after curing.

[0152] When the housing 20 is filled with the filling resin 30, a resin curing process is performed, and the housing 20 is heated to heat the filling resin 30. As a result, in the housing 20, the filling resin 30 cures. The filling resin 30 becomes an outer package covering the capacitor element module 10A.

[0153] In this way, Figure 13 the thin film capacitor 3 as shown is completed.

[0154] In the resin injection process, when injecting the liquid-phase filling resin 30 into the housing 20, a large number of bubbles are generated in the liquid-phase filling resin 30 inside the housing 20 due to air entrainment. These bubbles burst near the liquid surface, and thus the resin sometimes scatters from the liquid surface, and the scattered resin may adhere to the first joint terminal portion 230 and the second joint terminal portion 330 existing near the liquid surface. However, in the present embodiment, the two first joint portions 231 of the first joint terminal portion 230 are covered by two first protection members 51, and the two second joint portions 331 of the second joint terminal portion 330 are covered by two second protection members 52. For this purpose, it is possible to prevent the resin adhering to the first joint terminal portion 230 and the second joint terminal portion 330 from adhering to the respective first joint portions 231 and the respective second joint portions 331. Further, after the film capacitor 3 is completed, it is also possible to prevent foreign matters such as dust from adhering to the respective first joint portions 231 and the respective second joint portions 331.

[0155] The film capacitor 3 is mounted on an external device. In the film capacitor 3, after being set in the external device, the two first protection members 51 are removed from the surface of the first joint terminal portion 230, and the two second protection members 52 are removed from the surface of the second joint terminal portion 330. Similar to the first embodiment described above, the external terminal T1 is joined to the first joint terminal portion 230 by welding at the two first joint portions 231, and the external terminal T2 is joined to the second joint terminal portion 330 by welding at the two second joint portions 331. At this time, since foreign matters are hardly attached to the respective first joint portions 231 and the respective second joint portions 331, welding can be performed well.

[0156] In addition, in the film capacitor 3 of the present embodiment, after completion, it is not necessary to check whether foreign matters are attached to the first joint portion 231 and the second joint portion 331.

[0157] <Effects of Embodiment 3>

[0158] As described above, according to Embodiment 3, the following effects are achieved.

[0159] The film capacitor 3 includes: a capacitor element 100 having a first electrode 110 and a second electrode 120; a first bus bar 200A and a second bus bar 300A connected to the first electrode 110 and the second electrode 120; and an exterior body (filled resin 30) formed of a resin material and covering the capacitor element 100 and a part of the first bus bar 200A and the second bus bar 300A. The first bus bar 200A and the second bus bar 300A include flat first joint terminal portions 230 and second joint terminal portions 330 that are exposed from the exterior body and joined to external terminals T1 and T2. A part of the interior of the surfaces of the first joint terminal portions 230 and the second joint terminal portions 330 is set as first joint portions 231 and second joint portions 331 where welding is performed when joining the external terminals T1 and T2. On the surfaces of the first joint terminal portions 230 and the second joint terminal portions 330, the regions of the first joint portions 231 and the second joint portions 331 are covered by detachable first protection members 51 and second protection members 52.

[0160] According to this structure, foreign matter that obstructs welding can be prevented from adhering to the first joint portions 231 and the second joint portions 331.

[0161] Furthermore, the exterior body (filled resin 30) includes a casting surface 31, and the first joint terminal portions 230 and the second joint terminal portions 330 are exposed from the casting surface 31.

[0162] According to this structure, when forming the exterior body, resin that scatters near the liquid surface of the filled resin 30 in the liquid phase state of the casting surface 31 can be prevented from adhering to the first joint portions 231 and the second joint portions 331.

[0163] Furthermore, the manufacturing method of the thin film capacitor 3 includes: a housing process of housing a capacitor element module 10A including a capacitor element 100 having a first electrode 110 and a second electrode 120, a first bus bar 200A connected to the first electrode 110 and the second electrode 120, and a second bus bar 300A into a housing 20 having an opening 21 through the opening 21; a resin injection process of injecting a liquid-phase resin into the housing 20 housing the capacitor element module 10A through the opening 21; and a resin curing process of curing the liquid-phase resin in the housing 20 to form an outer package (filled resin 30) covering the capacitor element module 10A. The first bus bar 200A and the second bus bar 300A include flat first joint terminal portions 230 and second joint terminal portions 330 for joining external terminals T1 and T2. A partial area inside the surfaces of the first joint terminal portion 230 and the second joint terminal portion 330 is set as first joint portions 231 and second joint portions 331 for welding when joining the external terminals T1 and T2. In the resin injection process, the capacitor element 100, the first bus bar 200A, and the second bus bar 300A are buried in the liquid-phase resin so that the first joint terminal portion 230 and the second joint terminal portion 330 are exposed from the liquid surface of the liquid-phase resin that becomes the casting surface 31 of the outer package. The resin injection process and the resin curing process are performed in a state where the first joint portions 231 and the second joint portions 331 are covered by detachable first protection members 51 and second protection members 52.

[0164] According to this manufacturing method, when forming the outer package, it is possible to prevent resin scattered near the liquid surface of the liquid-phase filled resin 30 that becomes the casting surface 31 from adhering to the first joint portion 231 and the second joint portion 331.

[0165] <Embodiment 4>

[0166] Describe the thin film capacitor 4 according to Embodiment 4. The thin film capacitor 4 is a so-called shell-less capacitor.

[0167] Figure 16 It is a perspective view of the thin film capacitor 4. In the present embodiment, the same reference numerals are given to the same structures as those in the above Embodiment 3.

[0168] In the thin film capacitor 4, different from the thin film capacitor 3 in the above Embodiment 3, it does not have a housing, and the capacitor element module 10A is only covered by an outer package 40.

[0169] The outer package 40 is formed of a thermosetting resin such as epoxy resin and has a substantially rectangular parallelepiped shape. The outer package 40 includes a casting surface 41, and the first joint terminal portion 230 of the first bus bar 200 and the second joint terminal portion 330 of the second bus bar 300 are exposed from the casting surface 41.

[0170] Figure 17 Figs. (a) and (b) are diagrams for explaining the manufacturing method of the thin film capacitor 4.

[0171] In order to form the outer package 40, a square box-shaped casting mold frame 5 having an opening 5a is used.

[0172] First, a housing process is performed. As shown in Figure 17 Fig. (a), the capacitor element module 10A is housed into the casting mold frame 5 through the opening 5a. At this time, the two first joint portions 231 of the first joint terminal portion 230 are in a state of being covered by the first protection member 51, and the two second joint portions 331 of the second joint terminal portion 330 are in a state of being covered by the second protection member 52. The capacitor element module 10A is positioned at a given position within the casting mold frame 5 by a positioning jig.

[0173] Next, a resin injection process is performed. As shown in Figure 17 Fig. (b), a liquid-phase resin is injected into the casting mold frame 5 through the opening 5a. The first joint terminal portion 230 and the second joint terminal portion 330 are exposed from the liquid surface of the liquid-phase resin that becomes the casting surface 41 after curing.

[0174] Next, a resin curing process is performed, and the resin in the casting mold frame 5 is heated to cure the resin. Thereby, within the casting mold frame 5, the resin cures to form the outer package 40. After that, the casting mold frame 5 is disassembled.

[0175] In this way, Figure 16 the thin film capacitor 4 as shown is completed.

[0176] The thin film capacitor 4 is mounted on an external device. Similar to the above-described Embodiment 3, in the thin film capacitor 4, after being set on the external device, the two first protection members 51 are removed from the surface of the first joint terminal portion 230, and the two second protection members 52 are removed from the surface of the second joint terminal portion 330. Then, the external terminal T1 is joined to the first joint terminal portion 230 by welding at the two first joint portions 231, and the external terminal T2 is joined to the second joint terminal portion 330 by welding at the two second joint portions 331. At this time, since foreign matter is hardly attached to each of the first joint portions 231 and each of the second joint portions 331, welding can be performed well.

[0177] <Effects of Embodiment 4>

[0178] According to the present Embodiment 4, the same effects as those of the above-described Embodiment 3 can be achieved.

[0179] <Modification Example>

[0180] The above has described the embodiments of the present invention. However, the present invention is not limited to the above embodiments. In addition, the application examples of the present invention can also be variously modified in addition to the above embodiments.

[0181] For example, in the above Embodiments 1 to 4, the first bonding terminal portion 230 and the second bonding terminal portion 330 each have two first bonding portions 231 and second bonding portions 331, respectively. However, the first bonding portions 231 and the second bonding portions 331 can be any number. Further, the shapes of the first bonding portions 231 and the second bonding portions 331 may not be rectangular and can be any shape.

[0182] Further, in the above Embodiments 1 to 4, when the external terminals T1 and T2 are bonded to the first bonding terminal portion 230 and the second bonding terminal portion 330, welding is performed at the first bonding portions 231 and the second bonding portions 331. However, other joining methods such as ultrasonic deposition or soldering can also be used.

[0183] Further, in the above Embodiments 1 and 2, the first groove portion 232 and the second groove portion 332, which are annular and indicate the boundaries of the first bonding portions 231 and the second bonding portions 331, are respectively provided in the first bonding terminal portion 230 and the second bonding terminal portion 330 as indication portions. However, as the indication portion, a circular line indicating the boundary can also be printed with ink or the like. In this structure, the indication portion also does not protrude from the first bonding terminal portion 230 and the second bonding terminal portion 330 so as not to interfere with the bonding of the external terminals T1 and T2.

[0184] Further, in the above Embodiments 3 and 4, the first protection member 51 and the second protection member 52 respectively have substantially the same dimensions as the first bonding portions 231 and the second bonding portions 331. However, the first protection member 51 and the second protection member 52 can also respectively have dimensions larger than the first bonding portions 231 and the second bonding portions 331. In this case, an adhesive can also be applied to the regions on the back surfaces of the first protection member 51 and the second protection member 52 that are more outward than the first bonding portions 231 and the second bonding portions 331. In this way, it is not necessary to worry about the adhesive remaining on the sides of the first bonding portions 231 and the second bonding portions 331 after the first protection member 51 and the second protection member 52 are removed.

[0185] Furthermore, in the above-described Embodiments 3 and 4, no indicating portion for indicating the boundary between the region where the first joint portion 231 is not provided on the surface of the first joint terminal portion 230 and the other regions is provided, and no indicating portion for indicating the boundary between the region where the second joint portion 331 is not provided on the surface of the second joint terminal portion 330 and the other regions is provided. However, the first groove portion 232 and the second groove portion 332 may be respectively provided on the surfaces of the first joint terminal portion 230 and the second joint terminal portion 330 in the same manner as in Embodiments 1 and 2 described above as the indicating portions. In this way, it is possible to visually confirm whether the first protective member 51 and the second protective member 52 are mounted in a state deviated from the first joint portion 231 and the second joint portion 331.

[0186] Furthermore, the structures of the first bus bars 200, 200A and the second bus bars 300, 300A are not limited to the structures shown in the above-described Embodiments 1 to 4, and may be any structures.

[0187] Furthermore, in the above-described Embodiments 1 to 4, four capacitor elements 100 are provided in the film capacitors 1 to 4. However, the number of the capacitor elements 100 also includes the case where the number is one, and can be appropriately changed.

[0188] Furthermore, in the above-described Embodiments 1 to 4, two metallized films obtained by vapor-depositing aluminum on a dielectric film are overlapped, and the overlapped metallized films are wound or laminated to form the capacitor element 100. However, in addition to this, a metallized film having aluminum vapor-deposited on both surfaces of a dielectric film and an insulating film may be overlapped, and the same may be wound or laminated to form these capacitor elements 100.

[0189] Furthermore, in the above-described Embodiments 1 to 4, the film capacitors 1 to 4 are cited as an example of the capacitor of the present invention. However, the present invention can also be applied to capacitors other than the film capacitors 1 to 4.

[0190] In addition, the embodiments of the present invention can be appropriately modified within the scope of the technical idea shown in the claims.

[0191] Industrial Applicability

[0192] The present invention is useful for capacitors used in various electronic devices, electrical devices, industrial devices, vehicle electrical equipment, and the like.

Claims

1. A capacitor, comprising: A capacitor element having electrodes; A bus bar connected to the electrodes; and An outer package formed of a resin material and covering the capacitor element and a part of the bus bar, The bus bar includes a flat joint terminal portion that protrudes from the outer package and is for joining an external terminal, A part of the surface of the joint terminal portion is set as a joint portion for welding, cladding or brazing when joining the external terminal, An indication portion indicating the area of the joint portion is provided on the surface of the joint terminal portion.

2. The capacitor according to claim 1, wherein The indication portion is an annular groove portion formed on the surface of the joint terminal portion and indicating the boundary between the area of the joint portion and the other areas, The thickness at the groove portion of the joint terminal portion is smaller than the thickness at the joint portion.

3. A capacitor, comprising: A capacitor element having electrodes; A bus bar connected to the electrodes; and An outer package formed of a resin material and covering the capacitor element and a part of the bus bar, The bus bar includes a flat joint terminal portion that protrudes from the outer package and joins an external terminal, A part of the surface of the joint terminal portion is set as a joint portion for welding, cladding or brazing when joining the external terminal, On the surface of the joint terminal portion, the area of the joint portion is covered by a detachable protective member.

4. The capacitor according to any one of claims 1 to 3, wherein The outer package includes a casting surface, The joint terminal portion protrudes from the casting surface.

5. A method for manufacturing a capacitor, comprising: A housing step of housing a capacitor element module including a capacitor element having electrodes and a bus bar connected to the electrodes into a housing having an opening through the opening; A resin injection step of injecting a liquid-phase resin into the housing housing the capacitor element module through the opening; And A resin curing step of curing the liquid-phase resin in the housing to form an outer package covering the capacitor element module, The bus bar includes a flat joint terminal portion for joining an external terminal, A part of the surface of the joint terminal portion is set as a joint portion for welding, cladding or brazing when joining the external terminal, In the resin injection step, the capacitor element and the bus bar are buried in the liquid-phase resin so that the joint terminal portion protrudes from the liquid surface of the liquid-phase resin that becomes the casting surface of the outer package, The resin injection step and the resin curing step are performed in a state where the area of the joint portion is covered by a detachable protective member.

6. A method for manufacturing a capacitor, comprising: A housing step of housing a capacitor element module including a capacitor element having electrodes and a bus bar connected to the electrodes into a casting mold frame having an opening through the opening; A resin injection step of injecting a liquid-phase resin into the casting mold frame housing the capacitor element module through the opening; And A resin curing process cures the resin in the liquid phase state within the mold frame for casting to form an exterior body covering the capacitor element module. The bus bar includes a flat bonding terminal portion for bonding to an external terminal. A part of the surface of the bonding terminal portion is set as a bonding portion for welding, cladding, or brazing when bonding to the external terminal. In the resin injection process, the capacitor element and the bus bar are buried in the resin in the liquid phase state such that the bonding terminal portion is exposed from the liquid surface of the resin in the liquid phase state that becomes the casting surface of the exterior body. The resin injection process and the resin curing process are performed in a state where the region of the bonding portion is covered by a detachable protective member.

Images