Mixed process efficient double-cavity furnace tube for wafer processing

Abstract

The invention discloses a mixed process efficient double-cavity furnace tube for wafer processing, and relates to the technical field of wafer processing, and the mixed process efficient double-cavity furnace tube for wafer processing comprises a machine body and a conveying structure; according to the technical scheme, the first process cavity and the second process cavity are arranged in parallel, the first process processing device is arranged in the first process cavity, and the second process processing device is arranged in the second process cavity, so that the furnace tube with the double-cavity structure realizes different process steps; the lifting assembly and the mechanical arm group are arranged among the wafer storage part, the first process cavity and the second process cavity, so that the mechanical arm group can realize efficient circulation of wafers among the first process processing device, the second process processing device and the wafer storage part; therefore, the continuous conversion of two processing technologies of the furnace tube with the double-cavity structure is realized, and the production efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer processing, and particularly relates to a high-efficiency dual-chamber furnace tube with a hybrid process for wafer processing. Background Art

[0002] The semiconductor manufacturing process involves multiple steps, such as furnace tube, etching, lithography, ion implantation, deposition, etc. Each wafer needs to be processed on different devices according to the process flow. Among them, the furnace tube process is an important step. Usually, batch production is adopted, during which the wafer cassette needs to access and transfer wafers, and a large amount of time is consumed in the transfer process.

[0003] In order to improve the efficiency of accessing and transferring wafers in the wafer cassette, in related technologies, a double susceptor is used in a cyclic batch manner. However, two susceptors are independently configured for each cavity, which increases the volume of the equipment. Therefore, maintenance needs to be carried out on the side of the equipment, which requires an increase in the side maintenance space and thus increases the floor area of the equipment.

[0004] For example, the patent No. CN118053790A discloses a wafer processing equipment and a wafer processing method with a double-chamber and three-susceptor structure. Through the wafer processing equipment with a double-chamber and three-susceptor structure, by using the process reaction with staggered time sequences and the isolation gate to exchange susceptors, the problems of large space occupation and low process efficiency in related technologies are solved, high-efficiency wafer processing is achieved, and the technical problem of avoiding contamination between adjacent chambers is solved. However, the premise is that the two chambers need to meet the same process configuration. In the semiconductor manufacturing process, there are many continuous furnace tube processes. Thus, since the wafers still need to be transferred between different cavities, the efficiency of semiconductor manufacturing cannot be improved yet. Summary of the Invention

[0005] The main object of the present invention is to propose a high-efficiency dual-chamber furnace tube with a hybrid process for wafer processing, aiming to improve the processing efficiency of semiconductor manufacturing.

[0006] To achieve the above object, the high-efficiency dual-chamber furnace tube with a hybrid process for wafer processing proposed by the present invention includes:

[0007] A body, in which a first process cavity and a second process cavity are arranged in parallel;

[0008] A transfer structure, which includes a lifting component and a robotic arm group. The lifting component is arranged in the body, and the robotic arm group is installed on the lifting component and is located on one side of the wafer storage part to transfer wafers between the wafer storage part and the first process cavity or the second process cavity;

[0009] Among them, the first process cavity is provided with a first process processing device, and the second process cavity is provided with a second process processing device.

[0010] In one embodiment, a lifting chamber for accommodating the conveying structure is provided in the body, a wafer storage unit is provided on one side of the lifting chamber, and the first process chamber and the second process chamber communicating with the lifting chamber are provided on the side of the lifting chamber away from the wafer storage unit;

[0011] Wherein, the lifting component is arranged between the first process chamber and the second process chamber, and the robot arm group is arranged toward the wafer storage part.

[0012] In one embodiment, the robot arm group includes a robot arm and a wafer loading and unloading component, the robot arm is connected to the side of the lifting assembly, and the wafer loading and unloading component is rotatably connected to the robot arm;

[0013] Wherein, the wafer loading and unloading member extends in a direction away from a rotation center of the wafer loading and unloading member.

[0014] In one embodiment, a positioning groove is provided on the wafer loading and unloading member, and the side wall of the positioning groove is arc-shaped and fits the edge of the wafer.

[0015] In one embodiment, a suction piece is provided on the bottom wall of the positioning groove.

[0016] In one embodiment, the robot arm group includes a plurality of wafer loading and unloading components, the plurality of wafer loading and unloading components are stacked and arranged on the robot arm, and the plurality of wafer loading and unloading components are independently rotatably connected to the robot arm;

[0017] Wherein, the positioning grooves on at least two of the wafer loading and unloading components are arranged opposite to each other.

[0018] In one embodiment, a side of the wafer loading and unloading component facing away from the robot arm is provided with a plurality of sheet structures, and the plurality of sheet structures are hollow.

[0019] In one embodiment, the wafer counting structure includes at least two frames, the two frames are spaced apart from each other on the wafer loading and unloading member, the two frames and the wafer loading and unloading member together form a wafer counting space, and the ends of the two frames facing away from the wafer loading and unloading member are respectively provided with a transmitting end and a receiving end;

[0020] The receiving end receives the signal transmitted by the transmitting end.

[0021] In one embodiment, the robotic arm includes a base and a plurality of rotating arms, the base is connected to the side of the lifting assembly, two adjacent rotating arms are rotatably connected, the rotating arm close to the base is rotatably connected to the base, and the rotating arm away from the base is rotatably connected to the wafer loading and unloading component.

[0022] In one embodiment, a tab detection device is provided on the side of the wafer outlet of the wafer storage part, and the tab detection device extends away from the wafer outlet of the wafer storage part, and there is a spacing between the tab detection device and the wafer outlet of the wafer storage part.

[0023] The technical solution of the present invention arranges the first process cavity and the second process cavity in parallel, and respectively sets the first process processing device in the first process cavity and the second process processing device in the second process cavity, so that the furnace tube with a double cavity structure can realize different process steps. And the lifting component and the robotic arm group are arranged between the wafer storage part, the first process cavity and the second process cavity, so that the robotic arm group can efficiently circulate the wafers between the first process processing device, the second process processing device and the wafer storage part, thereby solving the continuous conversion of the two processing processes of the double cavity structure furnace tube and improving the production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.

[0025] Figure 1 It is a schematic structural diagram of the first embodiment of the high-efficiency double cavity furnace tube for wafer processing provided by the present invention;

[0026] Figure 2 It is a schematic structural diagram of the second embodiment of the high-efficiency double cavity furnace tube for wafer processing provided by the present invention;

[0027] Figure 3 It is a schematic structural diagram of the third embodiment of the high-efficiency double cavity furnace tube for wafer processing provided by the present invention;

[0028] Figure 4 It is a schematic structural diagram of the fourth embodiment of the high-efficiency double cavity furnace tube for wafer processing provided by the present invention;

[0029] Figure 5 It is a schematic structural diagram of the fifth embodiment of the high-efficiency double cavity furnace tube for wafer processing provided by the present invention;

[0030] Figure 6 It is a schematic structural diagram of the sixth embodiment of the high-efficiency double cavity furnace tube for wafer processing provided by the present invention;

[0031] Figure 7 It is a schematic structural diagram of the seventh embodiment of the high-efficiency double cavity furnace tube for wafer processing provided by the present invention.

[0032] Description of the reference numerals in the attached drawings:

[0033] 100. High-efficiency dual-chamber furnace tube for wafer processing; 10. Body; 11. First process chamber; 12. Second process chamber; 20. Wafer storage unit; 30. Ventilation structure; 40. Lifting assembly; 50. Robot arm group; 51. Multiple-piece structure; 52. Wafer loading and unloading part; 53. Second rotating arm; 54. First rotating arm; 55. Positioning groove; 57. Base.

[0034] The realization, functional features and advantages of the object of the present invention will be further described with reference to the embodiments and the attached drawings. Specific embodiments

[0035] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described with reference to the attached drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work belong to the scope of protection of the present invention.

[0036] It should be noted that if there are directional indications (such as up, down, left, right, front, back...) involved in the embodiments of the present invention, the directional indications are only used to explain the relative positional relationship and movement conditions between components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0037] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In addition, if "and / or" or "and / or" appears throughout the text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or a solution where A and B are satisfied simultaneously. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the fact that those of ordinary skill in the art can implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0038] Semiconductor manufacturing processes involve multiple steps, such as furnace tube processes, etching, lithography, ion implantation, deposition, etc. Each wafer needs to be processed on different equipment according to the process flow. Among them, the furnace tube process is an important part. Usually, batch production is adopted. During this period, the wafer cassette needs to access and transfer wafers, and the transfer process consumes a lot of time.

[0039] In order to improve the efficiency of accessing and transferring wafers in the wafer cassette, in related technologies, a double boat is used in a cyclic batch manner. However, two boats are independently configured for each cavity, which increases the volume of the equipment. Therefore, maintenance needs to be carried out on the side of the equipment, which requires an increase in the side maintenance space and thus increases the floor area of the equipment.

[0040] For example, Patent No. CN118053790A discloses a wafer processing equipment and a wafer processing method with a double cavity and three boats. Through the wafer processing equipment with a double cavity and three boats, by using staggered timing process reactions and isolation gates to exchange boats, the problems of large space occupation and low process efficiency in related technologies are solved, realizing efficient wafer processing and avoiding the technical problem of contamination between adjacent chambers. However, the prerequisite is that the two cavities need to meet the same process configuration. In semiconductor manufacturing processes, there are many continuous furnace tube processes. Thus, since wafers still need to be transferred between different cavities, the efficiency of semiconductor manufacturing cannot be improved yet.

[0041] The present invention proposes a high-efficiency double cavity furnace tube for hybrid processes in wafer processing.

[0042] Please refer to Figure 1 , in an embodiment of the present invention, the high-efficiency double cavity furnace tube for hybrid processes in wafer processing includes:

[0043] A body 10, in which a first process cavity 11 and a second process cavity 12 are arranged in parallel;

[0044] A transfer structure, the transfer structure includes a lifting component 40 and a robotic arm group 50. The lifting component 40 is arranged in the body 10, and the robotic arm group 50 is installed on the lifting component 40 and is located on one side of the wafer storage part 20 to transfer wafers between the wafer storage part 20 and the first process cavity 11 or the second process cavity 12;

[0045] Among them, the first process cavity 11 is provided with a first process processing device, and the second process cavity 12 is provided with a second process processing device.

[0046] It can be understood that the first process chamber 11 and the second process chamber 12 are respectively used to implement different processes in wafer processing. Therefore, the first process processing device is arranged in the first process chamber 11, and the second process processing device is arranged in the second process chamber 12. One process in wafer processing is realized by relying on the first process processing device, and another process in wafer processing is realized by relying on the second process processing device.

[0047] In order to enable the first process chamber 11 and the second process chamber 12 to independently process wafers, an air vent structure 30 is provided in the machine body. The air vent structure 30 includes a first air return device and a second air return device. The first air return device is arranged on the lower side of the first process chamber 11, and the second air return device is arranged on the lower side of the second process chamber 12.

[0048] It can be understood that the first air return device is connected to the first process processing device, and the second air return device is connected to the second process processing device. Therefore, both the first process processing device and the second process processing device can work independently or work in combination.

[0049] Furthermore, independent first intake pipelines, second intake pipelines, and third intake pipelines are respectively arranged in the first process chamber 11 and the second process chamber 12 for introducing reaction gases into different height positions of the susceptor. By adjusting the flow rate of the reaction gases, the concentration of the reaction gases at different positions can be made uniform, so that it is not necessary to change the temperature settings at different points on the susceptor, thereby ensuring the stability and efficiency of wafer process processing.

[0050] It can be understood that susceptors are arranged in both the first process chamber 11 and the second process chamber 12. When the robotic arm group 50 transfers the wafers in the wafer storage unit 20 into the first process chamber 11 or the second process chamber 12, the robotic arm group 50 places the wafers on the susceptor in the first process chamber 11 or the susceptor in the second process chamber 12, thereby facilitating the transfer of the susceptor carrying the wafers into the first process chamber 11 or the second process chamber 12, or the robotic arm group 50 transfers the wafers processed on the susceptor to the wafer storage unit 20.

[0051] As Figure 1 and Figure 2 shown, the wafer storage unit 20 includes a plurality of storage units. The plurality of storage units are stacked on each other in the machine body 10, and the openings on the storage units all face the transfer structure.

[0052] It can be understood that multiple of the storage units are used to store wafers. The lifting assembly 40 drives the robotic arm group 50 to lift through power output, so as to facilitate the robotic arm group 50 to select or store wafers in multiple stacked storage units.

[0053] Furthermore, a control module is also provided inside the body 10. The control module includes a control system, and the control system includes an independent process operation logic and a combined process operation logic.

[0054] Among them, in the independent process operation logic, the robotic arm group 50 is controlled to cooperate with the lifting assembly 40 to transfer the wafer from the wafer storage section 20 to the susceptor in the first process chamber 11 or the susceptor in the second process chamber 12, and the wafer processing process is realized by the first process processing device in the first process chamber 11 or the second process processing device in the second process chamber 12. After the process is completed, the robotic arm group 50 transfers the wafer back to the wafer storage section 20.

[0055] Among them, in the combined process operation logic, the robotic arm group 50 is controlled to cooperate with the lifting assembly 40 to transfer the wafer from the wafer storage section 20 to the susceptor in the first process chamber 11. The first process processing device in the first process chamber 11 performs a process operation. After the first process operation is completed, the robotic arm group 50 transfers the wafer to the susceptor in the second process chamber 12. The second process processing device in the second process chamber 12 performs a process operation. After the second process operation is completed, the robotic arm group 50 transfers the wafer into the wafer storage section 20.

[0056] It can be seen that by controlling the process time of the first process chamber and the second process chamber, the control module automatically judges and executes the two process operation logics to achieve an efficient cyclic process operation.

[0057] The technical solution of the present invention arranges the first process chamber 11 and the second process chamber 12 in parallel, and respectively arranges the first process processing device in the first process chamber 11 and the second process processing device in the second process chamber 12, so that the furnace tube with a double-chamber structure can realize different process steps. The lifting assembly 40 and the robotic arm group 50 are arranged between the wafer storage section 20, the first process chamber 11 and the second process chamber 12, so as to facilitate the robotic arm group 50 to achieve an efficient cycle of wafers between the first process processing device, the second process processing device and the wafer storage section 20, thereby solving the continuous conversion of the two processing processes of the double-chamber structure furnace tube and improving the production efficiency.

[0058] In one embodiment, a lifting chamber for accommodating the conveying structure is provided in the machine body 10, a wafer storage unit 20 is provided on one side of the lifting chamber, and the first process chamber 11 and the second process chamber 12 communicating with the lifting chamber are provided on the side of the lifting chamber away from the wafer storage unit 20;

[0059] The lifting assembly 40 is disposed between the first process chamber 11 and the second process chamber 12 , and the robot arm group 50 is disposed toward the wafer storage unit 20 .

[0060] It can be understood that the lifting chamber is used to carry the lifting assembly 40 and the robotic arm group 50 , and provide a movement space for the robotic arm group 50 to move on the lifting assembly 40 .

[0061] At the same time, the first process chamber 11 and the second process chamber 12 are both connected to the lifting chamber, and the first process chamber 11 and the second process chamber 12 are arranged side by side on the top of the machine body 10. When the robot arm group 50 can be driven by the lifting assembly 40 to rise to one side of the first process chamber 11 or the second process chamber 12, the robot arm group 50 can place or take the wafer in the first process chamber 11 or the second process chamber 12.

[0062] Furthermore, if Figure 3 As shown, the openings for storing and accessing wafers in the wafer storage unit 20 are all facing the robot arm group 50, so that the robot arm group 50 can directly access the wafers.

[0063] In one embodiment, the robot arm assembly 50 includes a robot arm and a wafer loading and unloading member 52, wherein the robot arm is connected to a side of the lifting assembly 40, and the wafer loading and unloading member 52 is rotatably connected to the robot arm;

[0064] The wafer loading and unloading member 52 extends in a direction away from a rotation center of the wafer loading and unloading member 52 .

[0065] like Figure 6 and Figure 7 As shown, the robotic arm is used to drive the wafer loading and unloading component 52 so that the wafer loading and unloading component 52 moves close to the access unit to realize the access and placement of the wafer, or the wafer loading and unloading component 52, driven by the lifting assembly 40 and the robotic arm, places the wafer on the wafer boat or takes the processed wafer from the wafer boat.

[0066] It should be noted that multiple wafers are stacked in the access unit. Therefore, when accessing the wafers, one end of the wafer loading and unloading member 52 needs to be extended to lengthen the length of the wafer loading and unloading member 52. Then, when accessing the wafers, the wafer loading and unloading member 52 can be inserted between two wafers, and the access to the wafers can be realized by adsorption or support, thus ensuring the efficiency of wafer access and avoiding damage to the wafers during the access process.

[0067] In one embodiment, multiple access units are stacked on top of each other, and at the same time, multiple access units are arranged side by side to increase the storage capacity of wafers in the body 10.

[0068] Furthermore, due to the arrangement of multiple access units, when accessing the wafers through the wafer loading and unloading member 52, the rotation of the robotic arm needs to be relied on to adjust the orientation of the wafer loading and unloading member 52, facilitating the access between different access units.

[0069] It can be understood that the wafer loading and unloading member 52 is rotatably connected to the robotic arm, which facilitates the turning of the wafer loading and unloading member 52 on the robotic arm, so as to drive the wafer loading and unloading member 52 to face the wafer to be taken, ensuring the efficiency and safety of wafer access.

[0070] It can be understood that the robotic arm is connected to the lifting assembly 40, and the power output of the lifting assembly 40 is relied on to drive the robotic arm to move between the wafer access section 20, the first process chamber, and the second process chamber to realize the access of wafers.

[0071] In one embodiment, the wafer loading and unloading member 52 is provided with a positioning groove 55, and the side wall of the positioning groove 55 is arc-shaped and fits the edge of the wafer.

[0072] To avoid the risk of collision during wafer transfer, most of the multiple wafers are neatly stacked in the storage unit. To prevent collision between the transferred wafer and the stored wafers during the wafer transfer process, the transferred wafer needs to be accurately fixed and supported on the wafer loading and unloading member 52.

[0073] Therefore, the positioning groove 55 is provided on the wafer loading and unloading member 52.

[0074] It can be understood that when the wafer loading and unloading member 52 picks up a wafer, during the process of moving the wafer loading and unloading member 52, the wafer is inserted into the positioning groove 55 until the edge of the wafer fits against the side wall of the positioning groove 55, thus realizing the positioning drive of the wafer and ensuring the stability and safety of wafer picking.

[0075] Further, the edge of the wafer is arc-shaped, and the side wall of the positioning groove is arranged in an arc shape, so as to improve the fitting efficiency between the wafer and the side wall of the positioning groove.

[0076] In one embodiment, the center of the positioning groove 55 is at the end of the wafer loading and unloading member 52, and the radius of the positioning groove 55 is equal to the radius of the wafer. Thus, when the wafer is located in the positioning groove 55 and the edge of the wafer contacts the side wall of the positioning groove 55, the positioning of the wafer is achieved.

[0077] In one embodiment, an adsorbing member is provided on the bottom wall of the positioning groove 55.

[0078] It should be noted that when the wafer is placed in the positioning groove 55, the wafer needs to be fixed and restricted to avoid accidental dropping of the wafer during the process of transporting the wafer, so as to ensure the stable progress of the transportation.

[0079] For this reason, an adsorbing member is provided on the bottom wall of the positioning groove 55. When the wafer enters the positioning groove 55 and the wafer contacts the side wall of the positioning groove 55, the adsorbing member works to adsorb and fix the wafer on the wafer loading and unloading member 52.

[0080] In one embodiment, the adsorbing member can be an electric suction cup.

[0081] In one embodiment, the robotic arm group 50 includes a plurality of wafer loading and unloading members 52. The plurality of wafer loading and unloading members 52 are stacked on the robotic arm, and the plurality of wafer loading and unloading members 52 are all independently rotatably connected to the robotic arm;

[0082] It should be noted that using a single wafer loading and unloading member 52 to access the wafer is not conducive to the efficiency of wafer processing.

[0083] For this reason, a plurality of wafer loading and unloading members 52 are stacked on the robotic arm group 50. By driving the plurality of wafer loading and unloading members 52 to work simultaneously, it is convenient for the plurality of wafer loading and unloading members 52 to access the wafer simultaneously, thereby improving the transfer efficiency of the wafer.

[0084] In order to avoid mutual influence among the plurality of wafer loading and unloading members 52 during movement, the plurality of wafer loading and unloading members 52 are all relatively independently rotatably connected to the robotic arm, and each wafer loading and unloading member 52 can be independently driven to move. In this way, both the plurality of wafer loading and unloading members 52 can access a plurality of wafers simultaneously, and a single wafer loading and unloading member 52 can access a single wafer.

[0085] As Figure 6 shown, the wafer loading and unloading member.

[0086] In one embodiment, the positioning grooves 55 on at least two of the wafer pick-up members 52 are oppositely arranged. There are two wafers between the two wafer pick-up members 52. The two wafer pick-up members 52 are respectively adsorbed and fixed to the two wafers, facilitating the access and transfer of multiple wafers.

[0087] In another embodiment, multiple wafer pick-up members 52 are stacked, and the positioning grooves 55 on the multiple wafer pick-up members 52 all face one direction.

[0088] It can be understood that the multiple wafer pick-up members 52 are simultaneously rotated to the same orientation to cooperate with the movement of the robotic arm. The multiple wafer pick-up members 52 are respectively inserted into one side of the stacked multiple wafers, thereby facilitating the simultaneous access of multiple wafers.

[0089] In one embodiment, a plurality of sheet structures 51 are provided on the side of the wafer pick-up member 52 facing away from the robotic arm, and the plurality of sheet structures 51 are hollow.

[0090] As Figure 7 shown, the plurality of sheet structures 51 are installed on the wafer pick-up member 52 facing away from the robotic arm, and the plurality of sheet structures 51 are provided at one end of the wafer pick-up member 52 facing away from the suction member.

[0091] When the plurality of sheet structures 51 need to be used, the multiple wafer pick-up members 52 are simultaneously driven to rotate, and the multiple wafer pick-up members 52 all face one side, so that there is no wafer pick-up member 52 in the projection direction of the plurality of sheet structures 51 facing the robotic arm.

[0092] It can be understood that the plurality of sheet structures 51 are hollow. When it is necessary to count the wafers in the stack, the lifting assembly 40 drives the plurality of sheet structures 51 to lift. When the plurality of sheet structures 51 lift up and down in the stack of wafers, relevant wafers can be detected, or the plurality of sheet structures 51 can detect the susceptor on the first process chamber or the susceptor on the second process chamber, avoiding the collision risk caused by abnormal situations such as incorrect wafer positions or broken wafers and preventing wafer scrapping.

[0093] In one embodiment, the plurality of sheet structures 51 include at least two frames. The two frames are spaced apart on the wafer pick-up member 52. The two frames and the wafer pick-up member 52 enclose a sheet counting space. One end of each of the two frames facing away from the wafer pick-up member 52 is respectively provided with a transmitting end and a receiving end;

[0094] Wherein, the receiving end receives the signal emitted by the transmitting end.

[0095] As Figure 4 、 Figure 5 And Figure 6As shown, the two frames are connected to the side of the wafer loading and unloading member 52 at intervals, and the several spaces formed by surrounding are convenient for the penetration of the wafers.

[0096] It can be understood that, in order to facilitate the penetration of the wafers and for the several structures 51 to detect the wafers, the transmitting end and the receiving end are arranged at the end of the frame far from the wafer loading and unloading member 52. The transmitting end continuously emits signals, and the receiving end receives signals. During the process of the wafers penetrating the several spaces, if the receiving end does not receive the signals from the transmitting end, it means that the wafers placed here are deviated and there is a risk of collision.

[0097] In an embodiment, the robotic arm includes a base 57 and multiple rotating arms. The base 57 is connected to the side of the lifting assembly 40. Adjacent two rotating arms are rotatably connected. The rotating arm close to the base 57 is rotatably connected to the base 57, and the rotating arm away from the base 57 is rotatably connected to the wafer loading and unloading member 52.

[0098] It can be understood that the base 57 is connected to the lifting assembly 40, and the power output of the lifting assembly 40 drives the base 57 to move along the lifting assembly 40, so as to facilitate driving the rotating arms and the wafer loading and unloading member 52 to move.

[0099] It can be understood that one rotating arm is rotatably connected to the base 57, adjacent two rotating arms are rotatably connected to each other, and one or multiple wafer loading and unloading members 52 are rotatably connected to the rotating arm away from the base 57.

[0100] As Figure 6 shown, the rotation positions on one rotating arm are all located at the end of the rotating arm.

[0101] It can be understood that since the rotation positions on the rotating arm are all located at the end of the rotating arm, during the relative rotation of the rotating arms, it is convenient to control the distance between the circular loading and unloading member 52 and the lifting assembly 40, and it is convenient for the wafer loading and unloading member 52 to grasp the wafers on the storage space with multi-angle openings.

[0102] As Figure 6 shown, the rotating arm includes a first rotating arm 54 and a second rotating arm 53. One end of the first rotating arm 54 is rotatably connected to the base 57, the other end of the first rotating arm 54 is rotatably connected to the second rotating arm 53, and the other end of the second rotating arm 53 is rotatably connected to the wafer loading and unloading member 52.

[0103] To achieve the movement of the lifting assembly 40, the lifting assembly 40 includes a bracket, a lifting track, and a power member. The lifting track is arranged along the lifting direction of the base 57, and the output end of the power member is connected to the lifting track, and the base 57 is connected to the lifting track.

[0104] It can be understood that when the power member outputs power, the power drives the lifting track to move, and then drives the base 57 to output movement, so that the base 57 moves along the lifting track, and controls the lifting of the robotic arm and the wafer loading and unloading member 52 to realize the transfer of the wafer.

[0105] It should be noted that the power member is a motor, and / or the lifting track is an electric guide rail.

[0106] In an embodiment, a tab detection device is provided on the side of the wafer outlet of the wafer storage portion 20, and the tab detection device extends away from the wafer outlet of the wafer storage portion 20, and there is a spacing between the tab detection device and the wafer outlet of the wafer storage portion 20.

[0107] It should be noted that the tab detection device is used to detect wafers.

[0108] It can be understood that the wafer outlet of the wafer storage portion 20 is the wafer loading and unloading groove, so that the tab detection device is located directly above and / or directly below the wafer outlet of the wafer storage portion 20. When the wafer in the wafer storage portion 20 protrudes 3 to 4 mm from the wafer storage portion, after being detected by the tab detection device, a signal is generated and sent, so that the robotic arm stops running, preventing the risk of collision during the transfer of the wafer and preventing the wafer from being scrapped.

[0109] The above are only exemplary embodiments of the present invention, and do not limit the patent scope of the present invention. Any equivalent structural transformation made under the technical concept of the present invention by using the content of the specification and drawings of the present invention, or directly / indirectly applied in other related technical fields, is included in the patent protection scope of the present invention.

Claims

1. An efficient double-chamber furnace tube with a hybrid process for wafer processing, characterized in that, include: A machine body, wherein a first process chamber and a second process chamber are arranged in parallel in the machine body; A conveying structure, the conveying structure comprising a lifting assembly and a robot arm group, the lifting assembly is arranged in the body, the robot arm group is installed on the lifting assembly and is located on one side of the wafer storage part to transfer wafers between the wafer storage part and the first process chamber or the second process chamber; The first process chamber is provided with a first process processing device, and the second process chamber is provided with a second process processing device.

2. The high-efficiency double-chamber furnace tube for wafer processing with a hybrid process according to claim 1, wherein A lifting chamber for accommodating the conveying structure is provided in the body, a wafer storage unit is provided on one side of the lifting chamber, and the first process chamber and the second process chamber communicating with the lifting chamber are provided on the side of the lifting chamber away from the wafer storage unit; Wherein, the lifting component is arranged between the first process chamber and the second process chamber, and the robot arm group is arranged toward the wafer storage part.

3. The high-efficiency double-chamber furnace tube for wafer processing with a hybrid process according to claim 1, characterized in that, The robot arm group includes a robot arm and a wafer loading and unloading component, the robot arm is connected to the side of the lifting assembly, and the wafer loading and unloading component is rotatably connected to the robot arm; Wherein, the wafer loading and unloading member extends in a direction away from a rotation center of the wafer loading and unloading member.

4. The high-efficiency dual-chamber furnace tube for wafer processing with a hybrid process as claimed in claim 3, wherein The wafer loading and unloading member is provided with a positioning groove, the side wall of which is arc-shaped and fits the edge of the wafer.

5. The high-efficiency double-chamber furnace tube for wafer processing with a hybrid process as claimed in claim 4, wherein, An adsorption piece is arranged on the bottom wall of the positioning groove.

6. The high-efficiency double-chamber furnace tube for wafer processing with a hybrid process according to claim 3, characterized in that, The robot arm group includes a plurality of wafer loading and unloading components, and the plurality of wafer loading and unloading components are stacked and arranged on the robot arm, and the plurality of wafer loading and unloading components are independently rotatably connected to the robot arm.

7. The high-efficiency double-chamber furnace tube for wafer processing with a hybrid process as claimed in claim 3, wherein A plurality of sheet structures are arranged on the side of the wafer loading and unloading component away from the robot arm, and the plurality of sheet structures are hollow.

8. The high-efficiency double-chamber furnace tube for wafer processing using the hybrid process according to claim 7, wherein The wafer counting structure comprises at least two frames, the two frames are spaced apart and arranged on the wafer loading and unloading member, the two frames and the wafer loading and unloading member enclose a wafer counting space, and the ends of the two frames facing away from the wafer loading and unloading member are respectively provided with a transmitting end and a receiving end; The receiving end receives the signal transmitted by the transmitting end.

9. The high-efficiency dual-chamber furnace tube for wafer processing with a hybrid process according to any one of claims 3 to 8, characterized in that The robotic arm includes a base and a plurality of rotating arms, wherein the base is connected to the side of the lifting assembly, two adjacent rotating arms are rotatably connected, the rotating arm close to the base is rotatably connected to the base, and the rotating arm away from the base is rotatably connected to the wafer loading and unloading component.

10. The high-efficiency double-chamber furnace tube for wafer processing using the hybrid process according to any one of claims 1 to 2, characterized in that, A convex chip detection device is provided at the side of the wafer outlet of the wafer storage unit, and the convex chip detection device extends away from the wafer outlet of the wafer storage unit, and a distance is provided between the convex chip detection device and the wafer outlet of the wafer storage unit.

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