Chip packaging structure and electronic equipment

Abstract

The invention provides a chip packaging structure and electronic equipment. The chip packaging structure comprises a packaging cover shell and a bare chip, the packaging cover shell comprises a soaking structure; the soaking structure comprises a first chamber and a second chamber which are communicated with each other, and a cooling medium positioned in the first chamber and the second chamber; the first cavity is in thermal coupling connection with the bare chip, and the first cavity extends in the direction parallel to the bare chip; the second cavity is located on one side, deviating from the bare chip, of the first cavity, and the second cavity extends in the direction perpendicular to the bare chip; the cooling medium is used for absorbing heat transferred by the bare chip to the cavity, close to one side of the bare chip, of the first cavity, and transferring the heat to the cavity, away from one side of the bare chip, of the first cavity and / or the second cavity, so that the soaking capacity and the heat dissipation capacity of the packaging cover shell can be improved by integrating the soaking structure into the packaging cover shell, and the heat dissipation efficiency of the packaging cover shell is improved. Therefore, the heat dissipation capability of the packaging cover shell can meet the heat dissipation requirement of the bare chip under high heat flux.

Description

Technical Field

[0001] The present application relates to the field of chip packaging technology, and in particular to a chip packaging structure and an electronic device. Background Art

[0002] With the explosive growth of chip computing power and the sharp increase in package size and power consumption, people have put forward higher requirements on the heat dissipation capacity of chip packaging structures. Although the existing chip packaging structure can dissipate heat for the bare chip through the metal packaging cover, its heat dissipation capacity still cannot meet the heat dissipation requirements of the bare chip under high heat flux density. Summary of the invention

[0003] The present application discloses a chip packaging structure and an electronic device to solve the problem that the heat dissipation capacity of the packaging cover shell cannot meet the heat dissipation requirement of the bare chip under high heat flux density.

[0004] In a first aspect, the present application discloses a chip packaging structure, comprising a packaging cover shell and a bare chip; the packaging cover shell comprises a heat dissipation structure; the heat dissipation structure comprises a first chamber and a second chamber that are interconnected and a cooling medium located in the first chamber and the second chamber; the first chamber is thermally coupled to the bare chip, and the first chamber extends in a direction parallel to the bare chip; the second chamber is located on a side of the first chamber away from the bare chip, and the second chamber extends in a direction perpendicular to the bare chip; the cooling medium is used to absorb the heat transferred from the bare chip to the cavity of the first chamber close to the side of the bare chip, and transfer the heat to the cavity of the first chamber away from the side of the bare chip and / or the second chamber.

[0005] In this way, by thermally coupling the first chamber of the heat equalizing structure with the die, the heat generated by the die can be transferred to the cavity of the first chamber close to the die side, and the heat of the cavity of the first chamber close to the die side is absorbed by the cooling medium in the first chamber, and the heat is transferred to the cavity of the first chamber on the side away from the die and / or the second chamber, so that the cavity of the first chamber away from the die side and / or the second chamber can transfer the heat to the outside, thereby realizing the heat dissipation and heat equalization effects of the heat equalizing structure, thereby integrating the heat equalizing structure into the packaging cover shell to improve the heat equalization and heat dissipation capabilities of the packaging cover shell, so that the heat dissipation capacity of the packaging cover shell can meet the heat dissipation requirements of the die under high heat flux density, thereby improving the stability and life of the die.

[0006] Moreover, since the heat spreader structure includes not only a first chamber extending in a direction parallel to the die but also a second chamber extending in a direction perpendicular to the die, the heat dissipation area of the heat spreader structure can be increased, thereby improving the heat dissipation capacity of the heat spreader structure, further improving the heat dissipation capacity of the package cover, enabling the heat dissipation capacity of the package cover to meet the heat dissipation requirements of the die under high heat flux density, and improving the stability and lifespan of the die.

[0007] In some embodiments of the present application, the heat spreader structure includes a first cover plate and a second cover plate; the inner wall surfaces of the first cover plate and the second cover plate have capillary structures; the second cover plate includes a first plate portion and a second plate portion connected to each other; the first plate portion extends in a direction parallel to the die; the first plate portion and the first cover plate enclose the first chamber; the second plate portion protrudes from the first plate portion in a direction perpendicular to the die; the second plate portion encloses the second chamber.

[0008] In this way, a heat spreader structure having a first chamber and a second chamber can be realized only by the first cover plate and the second cover plate including the connected first plate portion and second plate portion, which can simplify the manufacturing process of the heat spreader structure and improve the manufacturing efficiency of the heat spreader structure. Moreover, the reflux speed of the condensed cooling medium can be increased by the capillary structures on the inner wall surfaces of the first cover plate and the second cover plate.

[0009] In some embodiments of the present application, the heat spreader structure further includes a plurality of support columns; the plurality of support columns are arranged at intervals between the first cover plate and the first plate portion; the surfaces of the support columns have capillary structures.

[0010] In this way, in the case where the size of the package cover is relatively large, etc., the structural stability of the chambers of the heat spreader structure can be ensured by the plurality of support columns arranged between the first cover plate and the first plate portion, and the reflux speed of the condensed cooling medium can be further increased by the capillary structures on the surfaces of the support columns.

[0011] In some embodiments of the present application, the package cover further includes a liquid cooling structure; the liquid cooling structure is located on a side of the heat spreader structure away from the die; the liquid cooling structure includes a liquid flow channel and cooling liquid flowing in the liquid flow channel; the first chamber is thermally coupled to the liquid flow channel; the second chamber extends into the liquid flow channel; the cooling liquid is used to take away the heat of the first chamber and the second chamber.

[0012] In this way, the heat of the first chamber and the second chamber can be taken away by the cooling liquid flowing in the liquid flow channel, thereby realizing the heat dissipation of the heat distribution structure by the liquid cooling structure. The heat distribution structure and the liquid cooling structure can be integrated into the packaging cover shell at the same time to further improve the heat dissipation capacity of the packaging cover shell, so that the heat dissipation capacity of the packaging cover shell can meet the heat dissipation requirements of the bare chip under high heat flux density, thereby improving the stability and life of the bare chip.

[0013] In some embodiments of the present application, the liquid cooling structure includes a third cover plate, one end of the third cover plate has a liquid inlet, the other end of the third cover plate has a liquid outlet, and the third cover plate and the cover plate on the side of the heat dissipation structure away from the bare chip form the liquid flow channel.

[0014] In this way, the third cover plate and the cover plate on the side of the heat-spreading structure facing away from the die can be used to enclose a liquid flow channel, so that the cover plate on the side of the heat-spreading structure facing away from the die, such as the second cover plate, can be reused. This can not only reduce the thickness of the packaging cover shell, but also enhance the heat conduction rate of the heat-spreading structure and the liquid cooling structure, which is more conducive to improving the heat dissipation capacity of the packaging cover shell.

[0015] In some embodiments of the present application, the heat equalization structure includes a plurality of second chambers; the plurality of second chambers all extend into the liquid flow channel, and the plurality of second chambers are arranged in sequence in the extension direction of the liquid flow channel.

[0016] In this way, by making the heat equalizing structure include multiple second chambers, the heat dissipation area and heat dissipation capacity of the heat equalizing structure can be improved. By making the multiple second chambers extend into the liquid flow channel and making the multiple second chambers arranged in sequence in the extension direction of the liquid flow channel, the ability of the heat equalizing structure to transfer heat to the liquid cooling structure can be further improved, which is more conducive to improving the heat dissipation capacity of the packaging cover shell.

[0017] In some embodiments of the present application, the liquid cooling structure further includes metal foam located in the liquid flow channel, and the metal foam is located between adjacent second chambers.

[0018] In this way, the metal foam can be directly used as a heat sink fin for heat exchange, which can increase the heat dissipation area of the liquid cooling structure, and further improve the heat dissipation capacity of the packaging cover shell.

[0019] In some embodiments of the present application, the liquid cooling structure also includes a plurality of heat sinks located in the liquid flow channel; the plurality of heat sinks are arranged in sequence in the extension direction of the liquid flow channel; and the plurality of heat sinks are respectively located between the plurality of second chambers.

[0020] In this way, the heat dissipation area of the liquid cooling structure can be increased through a plurality of heat dissipation fins, and further, the heat dissipation capacity of the package cover can be further improved.

[0021] In some embodiments of the present application, the plurality of heat dissipation fins are integrally formed with the cover plate on the side of the heat dissipation structure facing away from the die.

[0022] In this way, not only can the structural stability of the heat dissipation fins be improved, the manufacturing process of the heat dissipation fins be simplified, but also the heat conduction rate between the second cover plate and the heat dissipation fins can be increased, which is more conducive to improving the heat dissipation capacity of the package cover.

[0023] In a second aspect, the present application discloses an electronic device, including the chip packaging structure as described in any one of the above.

[0024] In this way, by improving the heat dissipation capacity of the chip packaging structure, the stability and service life of the electronic device can be better. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background art, the following will describe the drawings required to be used in the embodiments of the present application or the background art.

[0026] Figure 1 It is a schematic cross-sectional structure diagram of a chip packaging structure disclosed in the present application.

[0027] Figure 2 It is a schematic plan structure diagram of a chip packaging structure disclosed in an embodiment of the present application.

[0028] Figure 3 For Figure 2 the schematic cross-sectional structure diagram of the chip packaging structure shown.

[0029] Figure 4 It is a schematic cross-sectional structure diagram of another chip packaging structure disclosed in an embodiment of the present application.

[0030] Figure 5 It is a schematic cross-sectional structure diagram of another chip packaging structure disclosed in an embodiment of the present application.

[0031] Figure 6 It is a schematic cross-sectional structure diagram of another chip packaging structure disclosed in an embodiment of the present application.

[0032] Figure 7 It is a schematic cross-sectional structure diagram of another chip packaging structure disclosed in an embodiment of the present application.

[0033] Figure 8 It is a schematic plan structure diagram of another chip packaging structure disclosed in an embodiment of the present application.

[0034] Figure 9 Schematic cross-sectional structure diagram of another chip packaging structure disclosed in an embodiment of the present application.

[0035] Figure 10 Schematic cross-sectional structure diagram of another chip packaging structure disclosed in an embodiment of the present application. Detailed implementation manners

[0036] Next, the technical solutions in the embodiments of the present application will be described with reference to the accompanying drawings in the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present application.

[0037] As shown in Figure 1 the figure, Figure 1 Schematic cross-sectional structure diagram of a chip packaging structure disclosed in the present application. The chip packaging structure includes a bare die 10, a packaging substrate 11, and a packaging cover 12. The packaging cover 12 and the packaging substrate 11 enclose an accommodation space, the bare die 10 is located in the accommodation space, and the bare die 10 is electrically connected to the packaging substrate 11. Among them, the packaging cover 12 is a metal cover, and there is a thermal interface material 13 between the packaging cover 12 and the bare die 10. The thermal interface material 13 is used to transfer the heat generated by the bare die 10 to the packaging cover 12, and the packaging cover 12 is used to transfer the heat to the outside to dissipate heat from the bare die 10. Although the metal packaging cover 12 has a certain heat dissipation ability, its heat dissipation ability still cannot meet the heat dissipation requirements of the bare die 10 under high heat flux density.

[0038] Based on this, the present application discloses a chip packaging structure. The chip packaging structure improves the heat spreading ability and heat dissipation ability of the packaging cover by integrating a vapor chamber (VC) structure into the packaging cover, so that the heat dissipation ability of the packaging cover can meet the heat dissipation requirements of the bare die under high heat flux density.

[0039] As an optional implementation of the disclosure of the present application, an embodiment of the present application discloses a chip packaging structure. As shown in Figure 2 and Figure 3 the figure, Figure 2 Schematic plan view of a chip packaging structure disclosed in an embodiment of the present application, Figure 3 and Figure 2 schematic cross-sectional structure diagram of the chip packaging structure shown in the figure. The chip packaging structure includes a packaging cover 12 and a bare die 10.

[0040] Among them, the encapsulation cover 12 includes a heat spreader structure 120, and the heat spreader structure 120 includes a first chamber 1201 and a second chamber 1202 that are interconnected, as well as a cooling medium (not shown in the figure) located in the first chamber 1201 and the second chamber 1202. Moreover, the first chamber 1201 extends in the direction X parallel to the die 10, and the first chamber 1201 is thermally coupled to the die 10. The second chamber 1202 extends in the direction Y perpendicular to the die 10, and the second chamber 1202 is located on the side of the first chamber 1201 away from the die 10. The cooling medium is used to absorb the heat transferred from the die 10 to the cavity on the side of the first chamber 1201 close to the die 10, and transfer the heat to the cavity on the side of the first chamber 1201 away from the die 10 and / or the second chamber 1202.

[0041] As Figure 3 shown, the cavity on the side of the first chamber 1201 close to the die 10 is thermally coupled to the die 10, and the heat generated by the die 10 will be transferred to the cavity on the side of the first chamber 1201 close to the die 10. The cooling medium in the first chamber 1201 will absorb the heat from the region with a higher temperature, such as the cavity on the side of the first chamber 1201 close to the die 10, and change from liquid to gas. The gaseous cooling medium will move to the region with a lower temperature, such as the cavity on the side of the first chamber 1201 away from the die 10 and / or the second chamber 1202, and condense and release heat in the region with a lower temperature, transferring the heat to the region with a lower temperature to achieve the heat spreading effect of the heat spreader structure 120. Then, the cavity on the side of the first chamber 1201 away from the die 10 and / or the second chamber 1202 will transfer the heat to the outside to achieve the heat dissipation effect of the heat spreader structure 120. Among them, the condensed cooling medium can flow back under the action of gravity, etc., to complete the cycle of the cooling medium.

[0042] Because a high heat flux density will cause the heat of the die 10 to accumulate rapidly, resulting in local overheating of the die 10 and affecting the stability and lifespan of the die 10. Therefore, in the embodiments of the present application, by integrating the heat spreader structure 120 into the encapsulation cover 12, the heat dissipation ability of the encapsulation cover 12 can be improved, and further, the heat dissipation ability of the encapsulation cover 12 can meet the heat dissipation requirements of the die 10 under a high heat flux density, thereby improving the stability and lifespan of the die 10.

[0043] Moreover, because the uneven heat distribution of the die 10 easily causes the temperature of some regions to be too high, which will further reduce the performance and reliability of the die 10. Therefore, in the embodiments of the present application, by integrating the heat spreader structure 120 into the encapsulation cover 12, the heat spreading ability of the encapsulation cover 12 can be improved, and further, the stability and lifespan of the die 10 can be improved.

[0044] In addition, compared with a conventional heat spreader that only extends in one direction, the heat spreading structure 120 in the embodiments of the present application not only includes a first chamber 1201 extending in the direction X parallel to the die 10, but also includes a second chamber 1202 extending in the direction Y perpendicular to the die 10, thereby increasing the heat dissipation area of the heat spreading structure 120, further improving the heat dissipation capacity of the heat spreading structure 120, and further improving the heat dissipation capacity of the encapsulation cover 12.

[0045] In the embodiments of the present application, as Figure 3 shown, the die 10 can be fixedly connected to the encapsulation cover 12 through a thermal interface material 13 or the like, and heat is transferred to the encapsulation cover 12 through the thermal interface material 13 or the like. Among them, the material of the thermal interface material 13 includes silicone grease or indium, etc. The materials of the cavities of the first chamber 1201 and the second chamber 1202 can both include metals, such as copper, to ensure the heat spreading effect and heat dissipation effect of the heat spreading structure 120.

[0046] In the embodiments of the present application, as Figure 4 shown, Figure 4 is a schematic cross-sectional structure diagram of another chip packaging structure disclosed in the embodiments of the present application. The chip packaging structure may further include a packaging substrate 11 and passive devices 14, etc. The passive devices 14 include capacitors, etc. And the encapsulation cover 12 further includes an encapsulation wall 121. The encapsulation wall 121 surrounds the die 10. The encapsulation wall 121 is fixedly connected to the heat spreading structure 120 by welding or adhesive, etc., or the encapsulation wall 121 and the heat spreading structure 120 are integrally formed. The encapsulation wall 121, the heat spreading structure 120 and the packaging substrate 11 enclose a receiving space for the die 10. Among them, the encapsulation wall 121 can be fixed on the packaging substrate 11 through an adhesive, etc.

[0047] In some embodiments of the present application, as Figure 5 shown, Figure 5 is a schematic cross-sectional structure diagram of another chip packaging structure disclosed in the embodiments of the present application. The heat spreading structure 120 includes a first cover plate 1203 and a second cover plate 1204. The second cover plate 1204 includes a first plate portion 1204a and a second plate portion 1204b connected to each other.

[0048] Among them, the first plate portion 1204a extends in the direction X parallel to the die 10, and the first plate portion 1204a and the first cover plate 1203 enclose the first chamber 1201. The second plate portion 1204b protrudes from the first plate portion 1204a in the direction Y perpendicular to the die 10, and the second plate portion 1204b encloses the second chamber 1202.

[0049] Moreover, the inner wall surfaces of the first cover plate 1203 and the second cover plate 1204 have a capillary structure 1205. This capillary structure 1205 can serve as a medium for transferring the cooling medium. That is to say, the condensed cooling medium can flow back through the capillary structure 1205 to complete the circulation of the cooling medium.

[0050] In this way, only through the first cover plate 1203 and the second cover plate 1204 including the connected first plate portion 1204a and the second plate portion 1204b, a heat dissipation structure 120 with a first chamber 1201 and a second chamber 1202 can be realized, which can simplify the manufacturing process of the heat dissipation structure 120 and improve the manufacturing efficiency of the heat dissipation structure 120.

[0051] It should be noted that the materials of the first cover plate 1203 and the second cover plate 1204 can both include metals, such as metals including copper. The first cover plate 1203 and the second cover plate 1204 can be connected together by welding or other means. The capillary structure 1205 can include copper powder. The copper powder can be formed on the inner wall surfaces of the first cover plate 1203 and the second cover plate 1204 by coating or other means.

[0052] Of course, the present application is not limited to this. In some other embodiments, as Figure 4 shown, the inner wall surfaces of the first cover plate 1203 and the second cover plate 1204 may not have the capillary structure 1205. For example, in the case where the inner wall surfaces of the first cover plate 1203 and the second cover plate 1204 have structures such as flow guiding grooves or micro protrusions, the inner wall surfaces of the first cover plate 1203 and the second cover plate 1204 may not have the capillary structure 1205.

[0053] It should be noted that the thickness of the heat dissipation structure 120, the thicknesses of the first cover plate 1203 and the second cover plate 1204, and the thicknesses of the first chamber 1201 and the second chamber 1202 can be set according to requirements. In some embodiments, the thickness of the heat dissipation structure 120 is about 3 mm; the thicknesses of the first cover plate 1203 and the second cover plate 1204 are the same, and the thickness range is 1 mm - 1.5 mm; the range of the sum of the thicknesses of the first chamber 1201 and the second chamber 1202 is 1 mm - 1.5 mm.

[0054] In some embodiments of the present application, as Figure 6 shown, Figure 6Schematic cross-sectional structure diagram of another chip packaging structure disclosed in the embodiments of the present application. The heat spreader structure 120 may further include a plurality of support columns 1206. For example, when the size of the encapsulation cover 12 is relatively large, the heat spreader structure 120 may further include a plurality of support columns 1206. The plurality of support columns 1206 are arranged at intervals between the first cover plate 1203 and the first plate portion 1204a. Among them, the plurality of support columns 1206 are used to support the first plate portion 1204a or the second cover plate 1204 to ensure the structural stability of the chamber of the heat spreader structure 120.

[0055] Moreover, the surface of the support column 1206 also has a capillary structure 1205. By means of the capillary structure 1205 on the surface of the support column 1206 to guide the condensed cooling medium, the reflux speed of the condensed cooling medium can be further increased. Of course, the present application is not limited to this. In some other embodiments, as Figure 4 shown, the heat spreader structure 120 may also not include a plurality of support columns 1206. For example, when the size of the encapsulation cover 12 is relatively small, the heat spreader structure 120 may also not include a plurality of support columns 1206.

[0056] Among them, the plurality of support columns 1206 can be arranged in an array or irregularly. Moreover, the upper and lower ends of the support column 1206 can be welded to the first cover plate 1203 and the second cover plate 1204 respectively; the diameter range of the support column 1206 can be 2 mm - 4 mm; the number range of the support columns 1206 can be 25 - 30; the spacing between adjacent support columns 1206 can be determined by simulation according to relevant flow parameters of the cooling medium, etc.

[0057] In some embodiments of the present application, as Figure 7 shown, Figure 7 Schematic cross-sectional structure diagram of another chip packaging structure disclosed in the embodiments of the present application. The encapsulation cover 12 further includes a liquid cooling structure 122. The liquid cooling structure 122 is located on the side of the heat spreader structure 120 away from the die 10. The liquid cooling structure 122 includes a liquid flow channel 1220 and a cooling liquid (not shown in the figure) flowing in the liquid flow channel 1220. Among them, the first chamber 1201 is thermally coupled to the liquid flow channel 1220; the second chamber 1202 extends into the liquid flow channel 1220; the cooling liquid is used to take away the heat of the first chamber 1201 and the second chamber 1202.

[0058] In this way, the heat spreader structure 120 and the liquid cooling structure 122 can be integrated into the encapsulation cover at the same time, so that the heat dissipation capacity of the encapsulation cover 12 can be further improved. Furthermore, the heat dissipation capacity of the encapsulation cover 12 can meet the heat dissipation requirements of the die 10 under high heat flux density, and further improve the stability and lifespan of the die 10.

[0059] In some embodiments of the present application, Figure 7 As shown, the liquid cooling structure 122 includes a third cover plate 1221, one end of the third cover plate 1221 has a liquid inlet 1221a, the other end of the third cover plate 1221 has a liquid outlet 1221b, and the third cover plate 1221 and the cover plate on the side of the heat distribution structure 120 away from the bare chip 10, i.e., the second cover plate 1204, form a liquid flow channel 1220.

[0060] like Figure 7 As shown, after the cooling liquid enters the liquid flow channel 1220 from the liquid inlet 1221a, it will flow along the liquid flow channel 1220 to the liquid outlet 1221b. During the flow, it will absorb the heat transferred from the bare chip 10 to the first chamber 1201 and the second chamber 1202, and bring the heat to the outside.

[0061] In this way, the liquid cooling structure 122 and the heat distribution structure 120 can reuse the second cover plate 1204, which can not only reduce the thickness of the packaging cover shell 12, but also enhance the thermal conductivity rate of the heat distribution structure 120 and the liquid cooling structure 122, which is more conducive to improving the heat dissipation capacity of the packaging cover shell 12.

[0062] Of course, the present application is not limited to this. In other embodiments, the liquid cooling structure 122 may also include a fourth cover plate, which is located between the third cover plate 1221 and the second cover plate 1204 , and the fourth cover plate and the third cover plate 1221 form a liquid flow channel 1220 .

[0063] In some embodiments of the present application, Figure 7 As shown, the heat distribution structure 120 includes a plurality of second chambers 1202, and the plurality of second chambers 1202 extend into the liquid flow channel 1220. In this way, the ability of the heat distribution structure 120 to transfer heat to the liquid cooling structure 122 can be further improved, thereby further improving the heat dissipation ability of the package cover 12.

[0064] In some embodiments of the present application, Figure 2 As shown, the second chamber 1202 is a rectangular chamber, and a plurality of second chambers 1202 are arranged in sequence in the extension direction of the liquid flow channel 1220. Of course, the present application is not limited thereto. In other embodiments, such as Figure 8 As shown, Figure 8 This is a schematic diagram of a planar structure of another chip packaging structure disclosed in an embodiment of the present application. The second chamber 1202 may also be a circular chamber, and multiple second chambers 1202 are arranged in an array. In other embodiments, the second chamber 1202 may also be a square or triangular chamber, etc. In other embodiments, multiple second chambers 1202 may also be arranged irregularly, which will not be described one by one here.

[0065] In some embodiments of the present application,Figure 9 As shown Figure 9 FIG. Figure 9 is a schematic cross-sectional structure diagram of another chip packaging structure disclosed in an embodiment of the present application. The liquid cooling structure 122 further includes a metal foam 1222 located in the liquid flow channel 1220, and the metal foam 1222 is located between adjacent second chambers 1202. Among them, the metal foam 1222 includes, but is not limited to, copper foam. In this way, the metal foam 1222 can be directly used as a heat dissipation fin for heat exchange, which can increase the heat dissipation area of the liquid cooling structure 122, and further improve the heat dissipation capacity of the packaging cover 12.

[0066] Of course, the present application is not limited to this. In some other embodiments, such as Figure 10 As shown Figure 10 FIG. Figure 10 is a schematic cross-sectional structure diagram of another chip packaging structure disclosed in an embodiment of the present application. The liquid cooling structure 122 further includes a plurality of heat dissipation fins 1223 located in the liquid flow channel 1220. The plurality of heat dissipation fins 1223 are arranged in sequence in the extending direction of the liquid flow channel 1220. The plurality of heat dissipation fins 1223 are respectively located between a plurality of second chambers 1202. In this way, the heat dissipation area of the liquid cooling structure 122 can be increased through the plurality of heat dissipation fins 1223, and further the heat dissipation capacity of the packaging cover 12 can be improved.

[0067] Among them, the thickness range of the heat dissipation fin 1223 can be 0.1 mm - 1 mm, the height range of the heat dissipation fin 1223 can be 1 mm - 10 mm; the spacing range of the heat dissipation fins 1223 can be 0.1 mm - 1.5 mm.

[0068] In some other embodiments, the plurality of heat dissipation fins 1223 can also be arranged in an array. In the structure shown in Figure 10 FIG. Figure 10 , the heat dissipation fin 1223 is a flat fin. However, the present application is not limited to this. In some other embodiments, the heat dissipation fin 1223 can also be a U-shaped fin, etc. In some other embodiments, there can also be a metal foam 1222 between adjacent heat dissipation fins 1223.

[0069] In some embodiments of the present application, such as Figure 10 As shown in FIG. Figure 10 , a plurality of heat dissipation fins 1223 are integrally formed with the cover plate on the side of the heat dissipation structure 120 facing away from the bare chip 10, such as the second cover plate 1204. In this way, not only can the structural stability of the heat dissipation fin 1223 be improved, the manufacturing process of the heat dissipation fin be simplified, but also the heat conduction rate between the second cover plate 1204 and the heat dissipation fin 1223 can be increased, which is more conducive to improving the heat dissipation capacity of the packaging cover 12.

[0070] Of course, the present application is not limited thereto. In other embodiments, the plurality of heat dissipation fins 1223 may also be welded or screwed to a cover plate such as the second cover plate 1204 on the side of the heat dissipation structure 120 away from the die 10 .

[0071] As another optional implementation of the disclosure of the present application, an embodiment of the present application discloses an electronic device, which includes a chip packaging structure disclosed in any of the above embodiments. The electronic device can be a smart phone, a tablet computer, a digital camera, a server, etc. Because the chip packaging structure has a good heat dissipation capacity, the electronic device can have better stability and a longer life.

[0072] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0073] The above embodiments only express several implementation methods of this specification, and the descriptions are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of this specification, which all belong to the protection scope of this specification. Therefore, the protection scope of the patent of this specification shall be based on the attached claims.

Claims

1. A chip packaging structure, characterized in that, Comprising a package cover and a die; The package cover includes a heat spreader structure; the heat spreader structure includes a first chamber and a second chamber that communicate with each other and a cooling medium located in the first chamber and the second chamber; The first chamber is thermally coupled to the die, and the first chamber extends in a direction parallel to the die; the second chamber is located on a side of the first chamber away from the die, and the second chamber extends in a direction perpendicular to the die; The cooling medium is configured to absorb heat transferred from the die to a cavity on a side of the first chamber close to the die and transfer the heat to a cavity on a side of the first chamber away from the die and / or the second chamber.

2. The chip packaging structure according to claim 1, wherein The heat spreader structure includes a first cover plate and a second cover plate; inner wall surfaces of the first cover plate and the second cover plate have capillary structures; The second cover plate includes a first plate portion and a second plate portion connected to each other; the first plate portion extends in a direction parallel to the die; the first plate portion and the first cover plate enclose the first chamber; the second plate portion protrudes from the first plate portion in a direction perpendicular to the die; the second plate portion encloses the second chamber.

3. The chip packaging structure according to claim 2, wherein The heat spreader structure further includes a plurality of support columns; the plurality of support columns are spaced apart between the first cover plate and the first plate portion; surfaces of the support columns have capillary structures.

4. The chip packaging structure according to claim 1, wherein The package cover further includes a liquid cooling structure; the liquid cooling structure is located on a side of the heat spreader structure away from the die; the liquid cooling structure includes a liquid flow channel and a cooling liquid flowing in the liquid flow channel; the first chamber is thermally coupled to the liquid flow channel; the second chamber extends into the liquid flow channel; the cooling liquid is configured to take away heat of the first chamber and the second chamber.

5. The chip packaging structure according to claim 4, wherein, The liquid cooling structure includes a third cover plate, one end of the third cover plate has a liquid inlet, the opposite end of the third cover plate has a liquid outlet, and the third cover plate and a cover plate on a side of the heat spreader structure away from the die enclose the liquid flow channel.

6. The chip package structure according to claim 4 or 5, characterized in that, The heat spreader structure includes a plurality of second chambers; the plurality of second chambers all extend into the liquid flow channel, and the plurality of second chambers are arranged in sequence in an extending direction of the liquid flow channel.

7. The chip packaging structure according to claim 6, wherein The liquid cooling structure further includes a metal foam located in the liquid flow channel, and the metal foam is located between adjacent second chambers.

8. The chip package structure according to claim 6, wherein, The liquid cooling structure further includes a plurality of heat dissipation fins located in the liquid flow channel; the plurality of heat dissipation fins are arranged in sequence in an extending direction of the liquid flow channel; the plurality of heat dissipation fins are respectively located between the plurality of second chambers.

9. The chip packaging structure according to claim 8, wherein The plurality of heat dissipation fins are integrally formed with a cover plate on a side of the heat spreader structure away from the die.

10. An electronic device, characterized in that, Including the chip package structure according to any one of claims 1 to 9.

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