Small-size light-weight high-power chip microstructure air cooling radiator

Abstract

The invention provides a small-size light-weight high-power chip microstructure air cooling radiator, and belongs to the technical field of radiators. The present invention comprises: a substrate; the cavity is provided with a liquid working medium with latent heat of vaporization and is arranged on the substrate; the microstructure is arranged on the bottom surface in the cavity; the fins are provided with inner-section fins, middle-section fins and outer-section fins which are arranged on the periphery of the cavity in a crossed manner; and the fan is arranged above the fins. High-strength evaporation and boiling of the microstructure are utilized to strengthen coupling of a phase change heat transfer process and a heat conduction heat transfer process of each section of fins, the heating amount of a high-power chip is shared, the optimal height from a fan to the fins of the radiator is determined by utilizing a fin cross arrangement mode among the sections of fins and by means of the height of a distance cap, and the heat dissipation efficiency is improved. The forced convection heat transfer coefficient between the surfaces of the fins and the air is further improved, the heat transfer resistance of the high-power air-cooled radiator is remarkably reduced, the heat dissipation performance is improved, the weight of the high-power air-cooled radiator is reduced, and the size of the air-cooled radiator is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of radiators, and particularly to a small-volume and lightweight air-cooled radiator with a micro-structure for high-power chips. Background Art

[0002] In the application fields of high-power heat dissipation technologies such as data centers, power semiconductors, and optoelectronic devices, for high-power chips that generate heat, forced air cooling is carried out by combining fins of copper or aluminum metal radiators with fans. Due to its simple structure, easy installation and maintenance, and high reliability, it has long been the most widely used heat dissipation method. Specifically, the high-power chips that generate heat are tightly fixed on the surface of the metal radiator bottom plate. The heat generated by the high-power chips is conducted through the radiator bottom plate to the surface of the radiator fins, and then air is forced to blow through the surface of the radiator fins by the fan. The heat generated by the high-power chips is dissipated into the environment by using the forced convection heat transfer between the air and the surface of the radiator fins. The metal radiators used mainly include metal profile radiators, heat pipe radiators, and heat spreader radiators, etc. However, due to the limited metal thermal conductivity of the existing metal radiators in the market and the low air forced cooling heat transfer coefficient between the fan and the surface of the radiator fins, the heat absorption thermal resistance of the metal radiator, the thermal transport thermal resistance inside the radiator, and the convective heat transfer thermal resistance between the fan and the radiator fins are all relatively large. Therefore, when cooling high-power chips, the radiator needs a larger weight and fin heat dissipation area to make up for these relatively large heat transfer thermal resistances, which results in a large volume, heavy weight, and poor heat dissipation performance of the radiator, and it cannot adapt to and meet the rapid development requirements of the electronic devices in the current fields of artificial intelligence, data centers, new energy, smart grids, optoelectronics, etc., where the volume space is becoming increasingly compact, the weight is becoming increasingly lighter, and the power and power density are becoming increasingly higher.

[0003] For example, for a high-power chip of a data center server with a power of 400W, when the ambient temperature is 20°C, if the temperature of the high-power chip is controlled within 70°C, that is, the temperature rise between the high-power chip and the ambient temperature is controlled within 50°C, the volume of the existing air-cooled radiators that can meet this heat dissipation requirement is all larger than 0.001m 3 , and the weight is all above 2 kg; for high-power chips of data center servers with a power exceeding 400W, the existing air-cooled radiators can no longer meet the cooling requirements. Summary of the Invention

[0004] In view of this, for the heat dissipation of high-power chips, to solve the technical problems of large volume, heavy weight, low heat dissipation power and poor heat dissipation performance existing in the existing air-cooled radiators, the present invention provides a small-volume and lightweight microstructured air-cooled radiator for high-power chips, which utilizes the coupling of the high-strength evaporation and boiling to strengthen the phase change heat transfer process and the heat conduction heat transfer process on the outer surfaces of each section of fins to greatly share the heat generated by the high-power chips. By using the cross-arrangement method of the inner-section fins, middle-section fins and outer-section fins, and further improving the forced convection heat transfer coefficient between the fin surfaces and the air through a fan, the heat transfer thermal resistance of the air-cooled radiator is significantly reduced, the heat dissipation performance is significantly improved, the weight of the air-cooled radiator is greatly reduced, and the volume of the air-cooled radiator is reduced.

[0005] To achieve the above object, the present invention provides the following technical solutions: A small-volume and lightweight microstructured air-cooled radiator for high-power chips, comprising: A substrate for connecting with a high-power chip; A cavity with a liquid working medium having a latent heat of vaporization, which is arranged on the substrate; A microstructure arranged on the bottom surface inside the cavity, for causing the liquid working medium to undergo a high-strength evaporation and boiling to strengthen the phase change heat transfer process on the surface of the microstructure under the action of the heat generated by the high-power chip; Fins, which have inner-section fins, middle-section fins and outer-section fins cross-arranged around the cavity, and the inner-section fins, middle-section fins and outer-section fins are arranged in sequence along the direction away from the cavity; Wherein, the length of the inner-section fins is preferably 0-100 mm; the length of the middle-section fins is preferably 0-100 mm; the length of the outer-section fins is preferably 0-100 mm; The thickness of the fins is preferably 0-5 mm; The gap between the fin sections is preferably 0-8 mm; A fan arranged above the fins, for causing forced convection heat transfer between the fin surfaces and the ambient air.

[0006] Preferably, it further comprises: A cover plate with a packaging nozzle thereon, for covering the cavity; A spacing cap sleeved on the packaging nozzle, for determining the height of the fan from the fins; The height of the spacing cap is preferably 3-15 mm; The material of the spacing cap is preferably a heat-resistant material, such as copper, aluminum, stainless steel, ceramic, silica gel.

[0007] Preferably, the microstructure is a groove in the shape of a micro-cone or a micro-cylinder opened on the bottom surface.

[0008] Preferably, the diameter of the groove is 0 - 2 mm, the depth is 0 - 5 mm, and the distance between the centers of adjacent grooves is 0 - 10 mm.

[0009] Preferably, the liquid working medium is a single-component or multi-component organic or inorganic liquid.

[0010] Preferably, the liquid working medium is at least one of ethanol, water, acetone, and Freon.

[0011] Preferably, columns for fixedly connecting the fan are further provided on the substrate.

[0012] Preferably, a boss is provided on the outer edge of the cavity, and a round hole is provided on the boss.

[0013] Preferably, the lower surface of the substrate is closely attached to the high-power chip through a thermal interface material.

[0014] Preferably, the air-cooled radiator can meet the heat dissipation requirements of high-power optoelectronic high-power chips of 1000 - 2000 W.

[0015] The present invention has the following beneficial effects compared with the prior art: (1) The small-volume and lightweight high-power chip micro-structure air-cooled radiator provided by the present invention significantly reduces the heat transfer resistance of the radiator when the high-power chip transfers heat to the outer surface of the fins through the traditional single-path heat conduction method by utilizing the high-intensity evaporation and boiling on the bottom surface of the central cavity micro-structure to enhance the phase change heat transfer process, and the synergistic effect of the heat conduction heat transfer process from the substrate outside the central cavity region to the outer surfaces of each section of fins. In addition, by adopting a segmented fin design and the cross-arrangement method between the inner-section, middle-section, and outer-section fins, and with the help of the fan, and determining the optimal height of the fan from the radiator fins by means of the height of the spacing cap, the forced convection heat transfer coefficient between the fin surface and the air is further improved. These measures together result in a significant reduction in the overall heat transfer resistance of the high-power chip air-cooled radiator, thereby achieving a significant improvement in the heat dissipation performance of the high-power chip air-cooled radiator, while significantly reducing the weight of the radiator and shrinking its volume.

[0016] (2) Without changing the volume and weight of the radiator, the present invention can significantly improve the heat dissipation efficiency of the air-cooled radiator, and the increase in its heat dissipation power can even exceed 100%.

[0017] (3) Significantly reduce the volume and weight of the air-cooled radiator for high-power chips, with a reduction of more than 50%, and the material-saving effect is obvious. For example, for optoelectronic chips with a power of 1000W - 2000W, when the ambient temperature is 20°C, if the chip temperature is controlled within 70°C, that is, the temperature rise between the chip and the ambient temperature is controlled within 50°C, the volume of the existing air-cooled radiators that can meet this heat dissipation requirement is greater than 0.003m 3 , and the weight is above 3kg. However, the volume of the 1000W - 2000W air-cooled radiator using the present invention is less than 0.001m 3 , and the weight of the radiator is only 1kg.

[0018] (4) The present invention can significantly reduce the fan power consumption of the air-cooled radiator for high-power chips, achieving a reduction of more than 50%, thus significantly improving the energy-saving effect.

[0019] In summary, under the condition of the same volume and weight of the air-cooled radiator, for the same high-power chips, the heat dissipation performance of the air-cooled radiator for high-power chips can be significantly improved, and the chip operating temperature can be greatly reduced, with a reduction of more than 10°C. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a perspective view of the present invention; Figure 2 is a front view of the present invention; Figure 3 is a top view of the bottom surface; Figure 4 is a proof cross-sectional view of the micro-structure; In the figure, 1, fixed-distance cap; 2, cover plate; 3, boss; 4, round hole; 5, inner-section fin; 6, middle-section fin; 7, outer-section fin; 8, substrate; 9, column; 10, encapsulation nozzle; 11, fan; 12, fixing screw; 13, cavity; 14, bottom surface; 15, high-power chip; 16, inner wall of the cavity; 17, micro-structure; 18, gap; 19, liquid working medium. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0021] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0022] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by terms such as "upper", "lower", "inner", "outer", "top / bottom end", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0023] In the description of the present invention, it should be noted that unless otherwise clearly specified and limited, terms such as "installation", "provided with", "sheathed / connected", "connection", etc. should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0024] As Figure 1-2 shown, the present invention provides a small-sized and lightweight air-cooled radiator for a high-power chip 15 micro-structure 17, including: A substrate 8 for connecting with the high-power chip 15. The diameter range of the substrate 8 is preferably 0 - 500 mm, more preferably 160 mm, and the thickness range of the substrate 8 is preferably 0 - 20 mm, more preferably 5 mm.

[0025] A cavity 13 with a liquid working medium 19 having a latent heat of vaporization, which is arranged on the substrate 8. The diameter range of the cavity 13 is preferably 1 / 5 - 1 / 2 of the diameter of the substrate 8, more preferably 1 / 3.

[0026] As Figure 3-4 shown, a micro-structure 17 is arranged on the bottom surface 14 inside the cavity 13, and is used to cause the liquid working medium 19 to undergo a high-intensity evaporation and boiling enhanced phase change heat transfer process on the surface of the micro-structure 17 under the action of the heat generated by the high-power chip 15. Specifically, it can be: The bottom surface 14 is distributed with grooves of the micro-structure 17 recessed on the bottom surface 14. The grooves are preferably in the shape of micro-cones or micro-cylinders. The diameter d range of the grooves is preferably 0 - 2 mm, more preferably 0.5 - 1.5 mm. The depth h range is preferably 0 - 5 mm, more preferably 1 - 3 mm. The distance p between the centers of adjacent grooves is preferably 0 - 10 mm, more preferably 5 mm. The cavity 13 is hermetically sealed with a liquid working medium 19, and the liquid working medium 19 is preferably a single-component or multi-component organic or inorganic liquid, for example, at least one of ethanol, water, acetone, and freon. More preferably, it is ethanol.

[0027] The fin has inner-section fins 5, middle-section fins 6, and outer-section fins 7 that are arranged crosswise around the periphery of the cavity 13, and the inner-section fins 5, middle-section fins 6, and outer-section fins 7 are sequentially arranged in a direction away from the cavity. The height range of the entire radiator is preferably 0 - 300 mm, more preferably 45 mm. A certain number of fins are evenly distributed along the circumferential direction of the radiator and outside the cavity. Among them, the length range of the inner-section fins 5 is preferably 0 - 100 mm, more preferably 25 - 30 mm. The length range of the middle-section fins 6 is preferably 0 - 100 mm, more preferably 10 mm. The length range of the outer-section fins 7 is preferably 0 - 100 mm, more preferably 15 - 20 mm. The thickness range of the fins is preferably 0 - 5 mm, more preferably 1 mm. The inner-section fins 5, middle-section fins 6, and outer-section fins 7 are arranged crosswise, and the gap 18 between the fin segments is preferably 0 - 8 mm, more preferably 3 - 5 mm. The heights of the inner-section fins 5, middle-section fins 6, and outer-section fins 7 are the height of the entire radiator minus the thickness of the radiator substrate 8. The above fins can transfer heat and couple with the microstructures on the bottom surface of the central cavity microstructure for high-intensity evaporation and boiling enhanced phase change heat transfer processes only within the above-mentioned parameter ranges, while realizing the small volume and light weight of the high-power air-cooled radiator and exerting the heat dissipation performance of the high-power air-cooled radiator.

[0028] The fan 11 is arranged above the fin and is used to cause forced air convection heat transfer between the fin surface and the ambient air.

[0029] The materials used for the high-power chip 15 micro-structure 17 air-cooled radiator provided by the present invention are preferably at least one of copper, aluminum, ceramic, silicon, and stainless steel, and can be selected according to actual needs.

[0030] In the present invention, it further includes: The cover plate 2 has a packaging nozzle 10 thereon and is used to cover the cavity 13.

[0031] The spacer cap 1 is sleeved on the packaging nozzle 10 and is used to determine the height of the fan 11 from the fin.

[0032] In the present invention, the material of the encapsulation nozzle 10 is preferably aluminum or copper, more preferably aluminum. The diameter range of the encapsulation nozzle 10 is preferably 0 - 10 mm, more preferably 5 - 8 mm. The height is preferably 0 - 20 mm, more preferably 8 - 12 mm. The outside of the encapsulation nozzle 10 is sleeved with a spacing cap 1 using fixing glue. The material of the spacing cap 1 is preferably rubber, silicone, plastic, aluminum, copper, stainless steel, ceramic, etc., more preferably silicone. The height range of the spacing cap 1 is preferably 3 - 15 mm, more preferably 10 - 15 mm. The distance H between the fan 11 and the radiator is determined by the height of the spacing cap 11. The spacing cap 1 not only protects and further seals the encapsulation nozzle 10, but also plays a key role in determining the distance between the fan 11 and the upper surface of the radiator, so that the fan 11 can exert the best performance of air convection heat transfer.

[0033] In the present invention, a column 9 structure for fixedly connecting the fan 11 is also provided on the substrate 8. This column 9 structure is designed to stably support the fan 11, and between the fan 11 and the column 9, in order to ensure the reliability of the connection, a fixing screw 12 is preferably used for fixed connection. Through this design, the fan 11 can be effectively prevented from shifting or falling off during operation, thus ensuring the stable operation and safety of the device.

[0034] In the present invention, a boss 3 is provided on the outer edge of the cavity 13, and a round hole 4 is opened on the boss 3. The uses of structures such as the boss 3 and the round hole 4 are for punching and arranging threaded holes required for connecting the radiator and other structural parts, routing electrical lines, and waterproof sealing of the lines.

[0035] In the present invention, the lower surface of the substrate 8 and the high-power chip 15 are closely attached through a thermal interface material. The thermal interface material is preferably thermal conductive silicone grease, which has good thermal conductivity and can effectively conduct the heat generated by the high-power chip 15 during operation, thus ensuring the heat dissipation efficiency of the chip and extending its service life.

[0036] In the present invention, the described air-cooled radiator has excellent performance to meet the heat dissipation requirements of high-power optoelectronic high-power chips 15 with a power of 1000 - 2000W. Under the condition that the standard ambient temperature is 20 degrees Celsius, the radiator can effectively maintain the temperature of the chip below 70 degrees Celsius, which means it can control the temperature difference between the chip and the surrounding environment within 50 degrees Celsius. In addition, the volume of the radiator is very compact, not exceeding 0.001 m 3 and its weight is quite light, only 1 kg.

[0037] The air-cooled radiator involved in the present invention includes multiple key components in its design, and these components include a substrate 8, a cavity 13, a microstructure 17, a boss 3, a column 9, an inner-section fin 5, a middle-section fin 6, and an outer-section fin 7. These parts are all manufactured by a preferred processing method, that is, an integral processing technique. The integral processing technique means that the components of these radiators are processed and formed in a continuous manufacturing process, thus ensuring a high degree of compatibility and precise fit between the various parts. This design not only improves the overall performance of the radiator, but also simplifies the production process and reduces the manufacturing cost.

[0038] The working principle or process of the present invention is as follows: The high-power chip 15 is closely attached to the lower surface of the substrate 8 through a thermal interface material such as thermal grease. The heat generated by the high-power chip 15 is conducted in two parallel paths through the lower surface of the substrate 8 to the bottom surface 14 of the cavity 13 and the bottoms of the inner-section fin 5, the middle-section fin 6, and the outer-section fin 7 on the upper surface of the substrate 8 outside the cavity 13 region.

[0039] Among them, the heat generated by the high-power chip 15 is conducted in one parallel path to the bottom surface 14 of the cavity 13. Since the cavity 13 is hermetically sealed in a vacuum state with a liquid working medium 19 having a certain latent heat of vaporization for phase change heat transfer, the bottom surface 14 of the cavity 13 is distributed with grooves of the microstructure 17 recessed in the bottom surface 14. The grooves can be in the shape of micro-cones or micro-cylinders. These grooves are immersed in the liquid. The heat conducted to the bottom surface 14 causes the liquid working medium 19 to undergo a high-intensity evaporation and boiling enhanced phase change heat transfer process on the surface of the grooves of the microstructure 17. After the liquid undergoes a phase change and becomes steam, it thus carries away heat from the bottom surface 14. The steam carrying a large amount of heat diffuses isothermally to the surface of the inner wall 16 of the cavity. The steam condenses into a liquid on the surface of the inner wall 16 of the cavity, and the liquid flows back to the bottom surface 14 again, simultaneously releasing the carried heat and transferring it to the surface of the inner wall 16 of the cavity. Then, through the inner-section fin 5 connected to the side wall of the cavity 13, the heat is conducted to the surface of the inner-section fin 5. With the help of the fan 11, forced air convection heat transfer occurs between the fin surface and the ambient air, and finally this part of the chip heat generation is dissipated to the external environment.

[0040] Among them, the other parallel path of the heat generated by the high-power chip 15 is conducted to the bottoms of the inner-section fin 5, the middle-section fin 6, and the outer-section fin 7 on the upper surface of the substrate 8 outside the cavity 13 region, and is transferred to the entire outer surface of each of the inner-section fin 5, the middle-section fin 6, and the outer-section fin 7 through heat conduction. Then, with the help of the fan 11, forced air convection heat transfer occurs between the fin surface and the ambient air, and finally this part of the chip heat generation is dissipated to the external environment.

[0041] By implementing two-way parallel high-power heat transfer, where the bottom surface 14 of the micro-structure 17 in the cavity 13 region enhances the phase change heat transfer process through high-intensity evaporation and boiling, and the heat conduction heat transfer process from the substrate 8 outside the cavity 13 region to the outer surfaces of each section of the fins act synergistically, the heat transfer thermal resistance of the high-power chip 15 radiator in the traditional single-way heat conduction mode is significantly reduced. In addition, by adopting a segmented fin design and the cross-arrangement between the inner, middle, and outer section fins 7, in combination with the use of the fan 11, and by determining the optimal height of the fan 11 from the radiator fins 5, 6, 7 with the help of the height of the spacer cap 1, the forced convection heat transfer coefficient between the fin surface and the air is further improved. These measures work together to result in a significant reduction in the overall heat transfer thermal resistance of the high-power chip 15 air-cooled radiator, thereby achieving a significant improvement in the heat dissipation performance, while significantly reducing the weight of the radiator and shrinking its volume.

[0042] As described above, it is only the preferred specific embodiment of the present invention; however, the protection scope of the present invention is not limited thereto; any person skilled in the art within the technical scope disclosed by the present invention; according to the technical solution of the present invention and its improved concept, making equivalent substitutions or changes; should be covered by the protection scope of the present invention.

Claims

1. A high-power chip micro-structure air-cooled radiator with small volume and light weight, characterized in that, Comprising: A substrate for connecting with a high-power chip; A cavity with a liquid working medium having a latent heat of vaporization, which is arranged on the substrate; A microstructure arranged on the bottom surface inside the cavity, for enabling the liquid working medium to undergo a high-intensity evaporation and boiling enhanced phase change heat transfer process on the surface of the microstructure under the action of the heat generated by the high-power chip; Fins, which have inner-section fins, middle-section fins and outer-section fins arranged in a cross pattern around the cavity, and the inner-section fins, middle-section fins and outer-section fins are arranged in sequence in a direction away from the cavity; Wherein, the length of the inner-section fins is preferably 0 - 100 mm; the length of the middle-section fins is preferably 0 - 100 mm; the length of the outer-section fins is preferably 0 - 100 mm; The thickness of the fins is preferably 0 - 5 mm; The gap between fin segments is preferably 0 - 8 mm; A fan arranged above the fins, for enabling forced air convection heat transfer between the surface of the fins and the ambient air.

2. The air-cooled radiator for a high-power chip microstructure with small volume and light weight according to claim 1, wherein Further comprising: A cover plate with a packaging nozzle thereon, for covering the cavity; A spacing cap sleeved on the packaging nozzle, for determining the height of the fan from the fins; The height of the spacing cap is preferably 3 - 15 mm; The material of the spacing cap is preferably a heat-resistant material, such as copper, aluminum, stainless steel, ceramic, silica gel.

3. A small-volume and lightweight high-power chip micro-structure air-cooled radiator according to claim 1, characterized in that, The microstructure is a groove in the shape of a micro-cone or a micro-cylinder opened on the bottom surface.

4. A small-volume and lightweight high-power chip micro-structure air-cooled heat sink according to claim 3, characterized in that, The diameter of the groove is 0 - 2 mm, the depth is 0 - 5 mm, and the distance between the centers of adjacent grooves is 0 - 10 mm.

5. The small-volume and lightweight high-power chip micro-structure air-cooled radiator according to claim 1, characterized in that, The liquid working medium is a single-component or multi-component organic or inorganic liquid.

6. The small-volume and lightweight high-power chip micro-structure air-cooled radiator according to claim 5, characterized in that, The liquid working medium is at least one of ethanol, water, acetone and freon.

7. A small-volume and lightweight high-power chip micro-structure air-cooled radiator according to claim 1, characterized in that, Columns for fixedly connecting the fan are further arranged on the substrate.

8. The small-volume and lightweight high-power chip micro-structure air-cooled radiator according to claim 1, characterized in that, A boss is arranged on the outer edge of the cavity, and a round hole is opened on the boss.

9. A small-volume and lightweight high-power chip micro-structure air-cooled radiator according to claim 1, characterized in that, The lower surface of the substrate is closely attached to the high-power chip through a thermal interface material.

10. A small-volume and lightweight high-power chip micro-structure air-cooled radiator according to claim 1, characterized in that, The air-cooled radiator can meet the heat dissipation requirements of high-power optoelectronic high-power chips of 1000 - 2000 W.

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