Open ear back earphones with haptic vibration drivers and related methods

Abstract

An open ear back earphone includes a headband, a first earmuff at a first end of the headband, and a second earmuff at a second end of the headband. Each of the first and second earmuffs includes a front plate, an acoustic driver mounted on the earmuff, and a tactile vibration driver mounted on the earmuff. Each of the first earmuff and the second earmuff may be configured to be disposed over or above an ear of a user during use of the earphone. Each of the first earmuff and the second earmuff does not include a rear acoustic cavity adjacent to the backside of the acoustic driver. Each of the first earmuff and the second earmuff may be configured to allow ambient noise external to the earmuff to pass through the earmuff to a user's ear during use of the earphone without substantially passive isolation of ambient sound or sound generated by the acoustic driver.

Description

[0001] Cross - Reference to Related Applications

[0002] This application claims the benefit of U.S. Patent Application No. 18 / 414,417, filed on January 16, 2024, entitled "OPEN BACK HEADPHONE WITH TACTILE VIBRATION DRIVER AND RELATED METHODS", the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] The present disclosure generally relates to an open - back headphone including a plurality of vibration members and related methods, which may include, for example, a plurality of acoustic drivers or at least one acoustic driver and at least one tactile vibration driver. More specifically, the disclosed embodiments relate to an open - back headphone including an earcup having at least one acoustic driver, at least one tactile vibration driver, and at least a partially open back, the at least partially open back being configured to facilitate the release of excess energy generated by the at least one acoustic driver and the at least one tactile vibration driver to produce an improved sound response. Background Art

[0004] Headphones including open - back earcups are mainly used to reduce the adverse effects on sound quality. For example, a closed - back headphone system typically has fully enclosed earcups, which can be configured to reduce the impact of ambient noise on the intended listening experience. However, the closed - back of the earcups may produce resonance or low - frequency buildup, which may have a negative impact on sound quality. Open - back headphones allow air to pass through the earcups on the back side of the acoustic drivers, so that a closed acoustic cavity including the headphone audio drivers close to the user's ears is not formed. Summary of the Invention

[0005] In some embodiments, an open - back headphone includes an earcup configured to be disposed above or on top of a user's ear during use of the headphone. The earcup may include a front plate, an acoustic driver mounted on the earcup, and a tactile vibration driver mounted on the earcup. The acoustic driver may have a front side and a back side, and the tactile vibration driver may have a front side and a back side. The earcup does not include a rear acoustic cavity adjacent to the back side of the acoustic driver, and the earcup is configured to allow ambient noise outside the earcup to pass through the earcup to the user's ear during use of the headphone without substantially passively isolating the ambient sound or the sound produced by the acoustic driver.

[0006] An open-back over-ear headphone may include a headband, a first earcup located at a first end of the headband, and a second earcup located at a second end of the headband. Each of the first earcup and the second earcup may include a front plate, an acoustic driver mounted on the earcup, and a haptic vibration driver mounted on the earcup. The acoustic driver has a front side and a back side, and the haptic vibration driver also has a front side and a back side. Each of the first earcup and the second earcup may be configured to be positioned above or on top of a user's ear during use of the headphone. The first earcup and the second earcup do not include a rear sound chamber adjacent to the back side of the acoustic driver, and each of the first earcup and the second earcup may be configured to allow ambient noise outside the earcup to pass through the earcup to the user's ear during use of the headphone without substantially passively isolating the ambient sound or the sound produced by the acoustic driver.

[0007] A method of forming an open-back over-ear headphone may include: providing an earcup configured to be placed above or on top of a user's ear during use of the headphone, the earcup may include a front plate; mounting an acoustic driver to the earcup, the acoustic driver may have a front side and a back side; mounting a haptic vibration driver to the earcup, the haptic vibration driver may have a front side and a back side; configuring the earcup to not include a rear sound chamber adjacent to the back side of the acoustic driver; and configuring the earcup to allow ambient noise outside the earcup to pass through the earcup to the user's ear during use of the headphone without substantially passively isolating the ambient sound or the sound produced by the acoustic driver. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Although the present disclosure concludes with claims particularly pointing out and distinctly claiming certain embodiments, various features and advantages of embodiments within the scope of the present disclosure may be more readily ascertained from the following description when read in conjunction with the accompanying drawings, in which:

[0009] Figure 1 is a view of an audio system, which includes a side view of an open-back over-ear headphone;

[0010] Figure 2 is Figure 1 a perspective bottom view of a first earcup of the open-back over-ear headphone of

[0011] Figure 3 is Figure 1 a perspective bottom view of a second earcup of the open-back over-ear headphone of

[0012] Figure 4 is Figure 1 a cross-sectional side view of the open-back over-ear headphone of

[0013] Figure 5 is Figure 1 a rear view of the open-back over-ear headphone of Detailed Implementation Modes

[0014] The illustrations presented in this disclosure are not actual views of any particular open-back over-ear headphone or its components, but merely idealized representations for describing illustrative embodiments. Accordingly, the drawings are not necessarily drawn to scale.

[0015] Embodiments of an open-back over-ear headphone are disclosed, including: a haptic vibration driver configured to provide a haptic vibration sensation and increase the perceived bass quality of the open-back over-ear headphone; and an earcup that can be opened on the backside of the acoustic driver and the backside of the haptic vibration driver to reduce the effects of resonance and low-frequency buildup during the listening experience. More specifically, the open-back over-ear headphone of the disclosed embodiments may include at least one earcup, and the at least one earcup may include an acoustic driver and a haptic vibration driver mounted on the earcup. The earcup may not include a rear sound cavity adjacent to the backside of the acoustic driver and the backside of the haptic vibration driver, and the earcup may be configured to allow ambient noise outside the earcup to pass through the earcup to the user's ear during use of the headphone without substantially passively isolating the ambient sound or the sound generated by the acoustic driver.

[0016] Passive isolation is achieved by isolating the user from ambient noise without using active noise cancellation technology. For example, if the earcups of the headphone partially or fully cover or surround the user's ears, or if the shape of the earcup perfectly fits the user's ears, the user's perception of external ambient noise can be attenuated. Generally, passive isolation may be more effective in reducing the intensity of incoming mid- and high-frequency sounds than in reducing the intensity of incoming low-frequency sounds.

[0017] Figure 1 is a view of an audio system 100, including a side view of an open-back over-ear headphone 102 configured to receive an audio signal from a media player 104. The open-back over-ear headphone 102 may include a headband 106, a first earcup 108 suspended on the headband 106 near a first end 110 of the headband 106, and a second earcup 112 suspended on the headband 106 near a second end 114 of the headband 106. The size and shape of the headband 106 may be designed such that the headband 106 is placed on the user's head, and the first earcup 108 and the second earcup 112 may be configured to be placed above or on top of the user's ears during use of the open-back over-ear headphone 102. The first earcup 108 and the second earcup 112 may not have passive isolation. For example, the first earcup 108 and the second earcup 112 may reduce the intensity level of incoming sound by approximately 15 dB or less.

[0018] Each of the first earcup 108 and the second earcup 112 may include an acoustic driver 132 having a front side facing the user's ear and an opposite back side. The acoustic driver 132 may be configured to produce audible sound in response to an audio signal received from the media player 104. Each of the first earcup 108 and the second earcup 112 may further include a haptic vibration driver 134 having a front side facing the user's ear and an opposite back side. The haptic vibration driver 134 may be configured to produce a haptic vibration in response to at least a bass component of the audio signal received from the media player 104. In other embodiments, each of the first earcup 108 and the second earcup 112 may include another acoustic driver. For example, each earcup 108 and 112 may include: a first acoustic driver 132A, which may be configured to emit sound within a wide range of audible frequencies (e.g., from high to low frequencies) and is configured to produce audio playback in response to an audio signal received from the media player 104; and a second acoustic driver 132B, which may be particularly suitable for bass playback and is configured to produce audio playback in response to at least a bass component of the audio signal received from the media player 104.

[0019] The media player 104 may store or access at least audio media for playback via the open-back earbud headphones 102. The media player 104 may include, for example, a smart phone, a tablet, a computer, a television, an audio-enabled e-reader, a digital file player, a CD player, a radio, a stereo, a gaming system, etc. The media player 104 may be operably connected to the open-back earbud headphones 102 via a wireless connection 116, a wired connection 118, or both. For example, the open-back earbud headphones 102 may be wirelessly connected to the media player 104 using the Bluetooth® wireless connection protocol and may form a wired connection with the media player 104 using one or more wires 120 having audio jacks 122 at their two opposite ends. One of the audio jacks 122 may be inserted into a corresponding audio plug 124 of the media player 104, and one or more of the other audio jacks 122 may be inserted into corresponding first audio plugs 126A located on each of, for example, the first earcup 108, the second earcup 112, or both the first earcup 108 and the second earcup 112.

[0020] Figure 2 is Figure 1 A perspective elevation view of the first earcup 108 of the open-back earbud headphones 102. The first earcup 108 may include a front plate 128 and a pad 130, when the user wears the open-back earbud headphones 102 (see Figure 1When ( ), the cushion member 130 is located on the side of the front plate 128 closer to the user's ear. The haptic vibration driver 134 can be mounted to the front plate 128. The front plate 128 can be adjacent to the front side of the haptic vibration driver 134. The front plate 128 can include a hole 136 that at least partially passes through the front plate 128. The front plate 128 can be coupled to the back plate 138. In some embodiments, the front plate 128 can be removably coupled to the back plate 138. The haptic vibration driver 134 can be mounted to the back plate 138. The hole 136 can be located on the back plate 138 or the hole 136 can be located on the front plate 128 or a combination thereof. The hole 136 can expose the internal components of the first earcup 108, such as the acoustic driver 132 and the haptic vibration driver 134, at the exterior 142 of the first earcup 108. The first earcup 108 may not include an acoustic cavity adjacent to the front plate 128 or the back plate 138.

[0021] In some embodiments, as Figure 2 shown, the first earcup 108 can include: a first audio plug 126A configured to receive an audio jack 122 (see Figure 1 ); and a second power plug 126B configured to receive a power jack. For example, when the user wears the open-back earpiece headphones 102 (see Figure 1 ), the first audio plug 126A between the cushion member 130 and the back plate 138 can be located near the bottom of the front plate 128 and can be configured as, for example, a tip-ring-sleeve type plug. More specifically, the first audio plug 126A can be configured as a tip-ring-sleeve (TRS), tip-ring-ring-sleeve (TRRS), tip-ring-ring-ring-sleeve (TRRRS), etc., and can be operably coupled to an audio jack 122 having a complementary configuration (see Figure 1 ). When the user wears the open-back earpiece headphones 102 (see Figure 1 ), the second power plug 126B can be located near the first audio plug 126A at the bottom of the front plate 128, and the second power plug 126B can be configured as, for example, a power and data connection type plug, specifically configured to receive power to charge a battery 144, which is configured to supply power to the electrical components of the open-back earpiece headphones 102 (see Figure 1 ). More specifically, the second power plug 126B can be configured as, for example, a Universal Serial Bus (USB), Mini USB, or LIGHTNING® connector. Although specific examples have been provided, the first audio plug 126A or the audio and power plugs 126A and 126B can be configured as any type of plug for receiving the audio jack 122 (see Figure 1 ), which is configured to transmit an audio signal, power, or both. In other embodiments, the second power plug 126B can be further configured to receive an audio signal through the data connection portion of the power and data connection type plug.

[0022] The first earcup 108 may further include a button 146 configured to selectively affect the power - on state or operation of the open - back earbud headphones 102 (see Figure 1 ). The button 146 is located on the front panel 128 between the cushion 130 and the backplate 138. For example, the first earcup 108 may include a power button 148 configured to power on and off the electrical components of the open - back earbud headphones 102 (see Figure 1 ) in response to continuous and / or sustained pressing. Additionally, the first earcup 108 may include a vibration - enhancing button 150 and a vibration - reducing button 152 configured to affect the haptic vibration driver 134. The vibration - enhancing button 150 and the vibration - reducing button may enhance and reduce the intensity of the vibration generated by the haptic vibration driver 134 in response to pressing the vibration - enhancing button 150 or the vibration - reducing button 152.

[0023] Figure 3 is Figure 1 A perspective bottom - up view of the second earcup 112 of the open - back earbud headphones 102. Similar to the first earcup 108 (see Figure 2 ), the second earcup 112 may include a front panel 154 and a cushion 156. When the user wears the open - back earbud headphones 102 (see Figure 1 ), the cushion 130 is located on the side of the front panel 154 closer to the user's ear. The haptic vibration driver 134 may be mounted to the front panel 154. The front panel 154 may include holes 158. The front panel 154 may be coupled to a backplate 160 located on the side of the front panel 154 opposite the cushion 156. The haptic vibration driver 134 may be mounted to the backplate 160. The holes 158 may be located on the backplate 160 or the holes 158 may be located on the front panel 154 or a combination thereof. The holes 158 may at least partially extend through the front panel 154 and the backplate 160. The holes 158 may expose the internal components of the second earcup 112, such as the acoustic driver 132 and the haptic vibration driver 134, at the exterior 164 of the second earcup 112. The open - back earbud headphones 102 may include microphones 140 (see Figure 2 ) and 162 on each earcup 108 (see Figure 2 ) and 112. In other embodiments, only one of the earcups 108 (see Figure 2 ) and 112 may include a microphone 140 (see Figure 2 ) or 162.

[0024] The second earcup 112 may include a multifunction button 166 configured to increase and decrease the volume of the acoustic driver 132, the haptic vibration driver 134, and otherwise affect the operation of the open - back earbud headphones 102 (see Figure 1), the multi - function button 166 is located on the front plate 154 between the gasket 156 and the back plate 160. For example, the multi - function button 166 can include a volume up button 168, a volume down button 170, and a central button 172, which can, for example, increase the volume of the acoustic driver 132, decrease the volume of the acoustic driver 132, start and stop playback, accept a voice call, initiate a voice command, and otherwise affect the operation of the open - ear - back headphone 102 and the associated media player 104 (see Figure 1 ).

[0025] Although specific combinations of features of the respective earcups 108 and 112 have been shown and described in connection with Figures 1 to 3 each other, these features can be placed in different combinations on the earcup 108 or 112. For example, the first audio plug 126A and the second power plug 126B can be located on the earcup 108 or 112, the first audio plug 126A can be located on a different earcup 108 or 112 than the second power plug 126B, the buttons 146 and 166 can be located on the same earcup 108 or 112, and so on. In some embodiments, the first audio plug 126A and the second power plug 126B, and the buttons 146 and 166 can be located on the back plate 138 of the first earcup 108, the back plate 160 of the second earcup 112, in the holes 136 or 158, or any combination of the previously described locations. The holes 136 and 158 can be cylindrical, square, triangular, oval, rectangular, etc., or any combination thereof.

[0026] Figure 4 is Figure 1Cross-sectional side view of the open-back earpiece headphone 102. Front plates 128 and 154 of each earcup 108 and 112 can partially define an interior region 183 within each earcup 108 and 112. The acoustic driver 132 and the haptic vibration driver 134 can be disposed within the interior region 183. The interior region 183 can be configured to communicate directly or indirectly with the external environment such that air and / or sound can enter and exit the interior region 183 when using the open-back earpiece headphone 102. In each of the earcups 108 and 112, respective back plates 138 and 160 can be located opposite the front plates 128 and 154 and at least partially define the interior region 183. The holes 136 in the back plate 138 can be configured to cover only a portion of the back plate 138. In some embodiments, the holes 136 can have a combined cross-sectional area equal to at least twenty-five percent, at least thirty-three percent, at least fifty percent, at least sixty-six percent, at least seventy-five percent, or substantially one hundred percent of the area enclosed by the peripheral edge of the back plate 138. In some embodiments, the back plate 138 can be formed as a continuous part of the front plate 128. In some embodiments, the back plate 138 can be absent such that the open-back of the first earcup 108 is substantially unobstructed. In some embodiments, the back of the first earcup 108 can be fully open. The holes 158 in the back plate 160 can be configured to cover only a portion of the back plate 160. In some embodiments, the holes 158 can have a combined cross-sectional area equal to at least twenty-five percent, at least thirty-three percent, at least fifty percent, at least sixty-six percent, at least seventy-five percent, or substantially one hundred percent of the area enclosed by the peripheral edge of the back plate 160. In some embodiments, the back plate 160 can be formed as a continuous part of the front plate 154. In some embodiments, the back plate 160 can be absent such that the open-back of the second earcup 112 is substantially unobstructed. In some embodiments, the back of the second earcup 112 can be fully open. The drive plate 188 can subdivide the interior region 183. The drive plate 188 can be located between the acoustic driver 132 and the haptic vibration driver 134. The drive plate 188 can include at least one channel 192 to allow air and / or sound to pass through the drive plate. The at least one channel 192 can facilitate the release of pressure and sound accumulation within the interior region 183 during operation of the open-back earpiece headphone 102.

[0027] Figure 5Shows a rear view of the second earcup 112. The second earcup 112 may include holes 158. The holes 158 may be located on the backplate 160. In some embodiments, the front plate 154 may include the holes 158. The holes 158 may expose internal components such as the acoustic driver 132 and the haptic vibration driver 134. The holes 158 may be evenly distributed on the second earcup 112. The evenly distributed holes 158 may facilitate the uniform release of at least a portion of the audible noise outside the expected audible response of the acoustic driver 132 and / or the haptic vibration driver 134 to transmit at least a portion of the audible noise from the inside of the front plate 154 to the outside of the front plate 154. The holes 136 may be configured to facilitate the first earcup 108 to achieve the same effect as the holes 158 of the second earcup 112 described above.

[0028] A method of forming the open-back earpiece headphones 102 may include providing a first earcup 108 and / or a second earcup 112, each earcup 108 and 112 being configured to be placed over or on top of a user's ear during use of the open-back earpiece headphones 102. The earcups 108 and 112 include respective front plates 128 and 154. The method may include: mounting an acoustic driver 132 to the earcups 108 and 112, the acoustic driver 132 having a front side and a back side; and mounting a haptic vibration driver 134 to the earcups 108 and 112, the haptic vibration driver 134 having a front side and a back side. The method may include: configuring the earcups 108 and 112 to not include a rear sound cavity adjacent to the back side of the acoustic driver 132 and the back side of the haptic vibration driver 134; and configuring the earcups 108 and 112 to allow ambient noise outside the earcups 108 and 112 to pass through the earcups 108 and 112 to the user's ears during use of the headphones without substantially passively isolating the ambient sound or the sound generated by the acoustic driver 132. The method may further include mounting backplates 138 and 160 to the respective earcups 108 and 112.

[0029] While specific illustrative embodiments have been described with reference to the accompanying drawings, those of ordinary skill in the art will recognize and understand that the scope of the present disclosure is not limited to those embodiments expressly shown and described in the present disclosure. Instead, many additions, deletions, and modifications may be made to the embodiments described in the present disclosure to produce embodiments within the scope of the present disclosure, such as those expressly claimed, including legal equivalents. Additionally, as envisioned by the inventors, the features of one disclosed embodiment may be combined with the features of another disclosed embodiment while still remaining within the scope of the present disclosure.

Claims

1. An open-back over-ear headphone, comprising: An earcup configured to be disposed above or on top of a user's ear during use of the headphone, the earcup including a front panel; An acoustic driver mounted on the earcup, the acoustic driver having a front side and a back side; and A haptic vibration driver mounted on the earcup, the haptic vibration driver having a front side and a back side; and Wherein the earcup does not include a rear sound chamber adjacent to the back side of the acoustic driver, and the earcup is configured to allow ambient noise outside the earcup to pass through the earcup to the user's ear during use of the headphone without substantially passively isolating the sound generated by the acoustic driver.

2. The open-earpiece earphone according to claim 1, wherein, The earcup further includes a back panel coupled to the front panel, the front panel and the back panel defining an interior region within the earcup, and the acoustic driver and the haptic vibration driver are disposed within the interior region of the earcup.

3. The open earpiece headphone according to claim 2, wherein, The back panel is detachably coupled to the front panel.

4. The open earpiece headset according to claim 2, wherein, The back panel includes a plurality of holes extending therethrough.

5. The open earpiece headphone according to claim 4, wherein, The combined cross-sectional area of the plurality of holes is equal to at least twenty-five percent of the area enclosed by the peripheral edge of the back panel.

6. The open earmuff headphone according to claim 2, wherein, The haptic vibration driver is mounted on the back panel.

7. The open earpiece headphone according to claim 4, wherein, The holes are cylindrical.

8. The open earpiece headphone according to claim 1, wherein, The front panel of the earcup includes at least one hole extending therethrough.

9. The open earpiece headphone according to claim 8, wherein, The front panel of the earcup includes a plurality of holes extending therethrough.

10. An open-back over-ear headphone, comprising: A headband; A first earcup located at a first end of the headband; A second earcup located at a second end of the headband; and Wherein each of the first earcup and the second earcup includes: A front panel; An acoustic driver mounted on the earcup, the acoustic driver having a front side and a back side; and A haptic vibration driver mounted on the earcup, the haptic vibration driver having a front side and a back side; and Wherein each of the first earcup and the second earcup is configured to be disposed above or on top of a user's ear during use of the headphone, each of the first earcup and the second earcup does not include a rear sound chamber adjacent to the back side of the acoustic driver, and each of the first earcup and the second earcup is configured to allow ambient noise outside the earcup to pass through the earcup to the user's ear during use of the headphone without substantially passively isolating the sound generated by the acoustic driver. The haptic vibration driver is configured to vibrate at a frequency below 250 Hz.

11. The open earpiece headphone according to claim 10, wherein, Each of the first earcup and the second earcup further includes a back panel coupled to the front panel, the front panel and the back panel defining an interior region within the earcup, and the acoustic driver and the haptic vibration driver are disposed within the interior region of the earcup.

12. The open earpiece headset according to claim 10, wherein, The back panel is detachably coupled to the front panel.

13. The open earpiece headphone according to claim 12, wherein, The back panel includes a plurality of holes extending therethrough.

14. The open earpiece headset according to claim 12, wherein, The combined cross-sectional area of the plurality of holes is equal to at least twenty-five percent of the area enclosed by the peripheral edge of the back panel.

15. The open earpiece headset according to claim 14, wherein, The haptic vibration driver is mounted on the back panel.

16. The open earpiece headset according to claim 12, wherein, The holes are cylindrical.

17. The open earpiece headset according to claim 14, wherein, ​ 18. A method of forming an open-back over-ear headphone, the method comprising: Providing an earcup configured to be disposed over or on top of a user's ear during use of the headphone, the earcup including a front panel; Mounting an acoustic driver on the earcup, the acoustic driver having a front side and a back side; Mounting a haptic vibration driver on the earcup, the haptic vibration driver having a front side and a back side; Configuring the earcup to not include a rear sound cavity adjacent to the back side of the acoustic driver; And Configuring the earcup to allow ambient noise outside the earcup to pass through the earcup to the user's ear during use of the headphone without substantially passively isolating the sound produced by the acoustic driver.

19. The method according to claim 18, further comprising: Mounting a backplate to the earcup.

20. The method according to claim 18, wherein Providing the earcup includes providing a first earcup and a second earcup.

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