Liquid cooling system for semiconductor

Abstract

The invention relates to the field of semiconductor equipment, and discloses a liquid cooling system for semiconductors, which comprises a cold head assembly, the cold head assembly is mounted at the hot end of a semiconductor chip, a water drainage pipe is arranged in the middle of the upper end of the cold head assembly, and a water inlet pipe is arranged on one side of the cold head assembly. The water inlet pipe and the water outlet pipe are used for conveying low-temperature cooling liquid and high-temperature cooling liquid respectively, the other end of the water inlet pipe and the other end of the water outlet pipe are provided with the cold radiator, the water inlet pipe and the water outlet pipe are connected with connectors in the cold radiator, the cold radiator is used for reducing the temperature of the cooling liquid, and auxiliary assemblies are arranged in the middle of the water inlet pipe and the middle of the water outlet pipe. The auxiliary assembly is used for balancing the pressure in the whole device, the liquid cooling system for the semiconductor is provided with the auxiliary assembly, the pipeline pressure can be balanced, pipe explosion is avoided, and the cooling effect is guaranteed; the radiator can be assisted in heat dissipation, the working pressure of the radiator is relieved, the rotating speed of the fan is reduced, and the adaptive working temperature is increased.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor devices, and specifically to a liquid cooling system for semiconductors. Background Art

[0002] In the patent application with the application publication number CN219832643U, it includes a first accommodation cavity, a coolant circulation channel, and a coolant heat dissipation device. An opening is provided on one side of the first accommodation cavity, and the heat dissipation end of the semiconductor refrigeration chip is tightly sealed against the opening. The two ends of the coolant circulation channel are respectively connected to the first accommodation cavity so that the coolant circulates in contact with the heat dissipation end of the semiconductor refrigeration chip. The coolant heat dissipation device is used to cool the coolant in the coolant circulation channel that has absorbed the heat in the first accommodation cavity. The advantages are as follows: Through the internal circulation system formed by the cooperation of the first accommodation cavity, the second accommodation cavity, and the coolant circulation channel, the coolant directly contacts and exchanges heat with the heat dissipation end of the semiconductor refrigeration chip, greatly improving the cooling effect on the semiconductor refrigeration chip, enhancing the working efficiency of the semiconductor refrigeration chip, and prolonging the service life.

[0003] In the prior art including the above patent, when cooling a semiconductor, if the temperature of the semiconductor is too high, it is necessary to increase the flow rate of the coolant to achieve the purpose of rapid cooling. When the flow rate of the coolant increases, not only will it increase the working burden of the pump, but also the long-term high-speed operation of the pump itself will affect the working stability, and it will also reduce the heat dissipation efficiency of the cold radiator. Because after the flow rate of the coolant increases, the residence time of the high-temperature coolant in the cold radiator will decrease. At this time, only by increasing the fan speed can the specified temperature be achieved, but increasing the fan speed will generate relatively large noise. Moreover, in the prior art of the above patent, the contact area between the inside of the first accommodation cavity and the semiconductor wafer is small, and although the common technical means on the market can increase the heat dissipation area, it will affect the flow direction of the water flow to a certain extent, thereby affecting the heat dissipation efficiency. Summary of the Invention

[0004] The problems to be solved by the present invention are: low heat dissipation efficiency, inconvenient for further accelerating the cooling efficiency in the case of high temperature of the semiconductor, and inconvenient for improving the comfort of users during use and reducing the use cost.

[0005] To solve the above technical problems, the technical solution of the present invention is: a liquid cooling system for a semiconductor, including a cold head assembly, the cold head assembly is installed at the hot end of the semiconductor wafer, a drain pipe is arranged in the middle of the upper end of the cold head assembly, a water inlet pipe is arranged on one side of the cold head assembly, the water inlet pipe and the drain pipe are respectively used for transporting low-temperature coolant and high-temperature coolant, the other ends of the water inlet pipe and the drain pipe are provided with a radiator, the water inlet pipe and the drain pipe are connected to the interfaces on the radiator, the radiator is used to reduce the temperature of the coolant, an auxiliary component is arranged in the middle of the water inlet pipe and the drain pipe, and the auxiliary component is used to balance the pressure in the whole device, assist in heat dissipation and store spare coolant; The auxiliary component mainly includes an impeller and a sealing ring arranged inside the mounting seat. The center of the sealing ring and the center of the tee pipe are on the same straight line. A connecting rod is fixedly arranged in the middle of the lower end of the sealing ring. A base is fixedly arranged at the lower end of the connecting rod. The base is also fixedly connected to the mounting seat. Springs are fixedly arranged around the connecting rod at the upper end of the base. A sealing gasket is fixedly arranged at the upper end of the spring. The middle part of the sealing gasket is slidably connected to the connecting rod. There are two sets of sealing mechanisms in the auxiliary component, which are respectively arranged inside the upper and lower mounting seats, and their structures, installation positions and installation methods are exactly the same.

[0006] Preferably, the cold head assembly includes a housing, the housing is used to install other components in the cold head assembly and connect the drain pipe. Water inlets are fixedly arranged around the upper end of the housing. There are four water inlets in total. A water distribution pipe is arranged outside the water inlets. The water distribution pipe is connected to the water inlet pipe.

[0007] Preferably, an electromagnetic coil is fixedly arranged inside the housing directly below the drain pipe. A propeller blade is rotatably arranged at the lower end of the electromagnetic coil. The propeller blade is also rotatably connected to the housing. A fin is arranged below the propeller blade. The fin is arranged in a threaded shape. A hollow pipe is arranged in the middle of the fin. A copper plate is fixedly arranged at the lower end of the fin. The lower end of the copper plate is in contact with the semiconductor.

[0008] Preferably, the inclination direction of the blade of the propeller blade is opposite to the twisting direction of the fin. The lowermost end of the hollow pipe in the middle of the fin does not contact the copper plate. The middle part of the propeller blade is made of copper.

[0009] Preferably, the mounting seat is divided into two parts, an upper part and an lower part, and three-way pipes are fixedly provided at both upper and lower ends of the two mounting seats, both ends of the upper three-way pipe are connected to the drain pipe, and both ends of the lower three-way pipe are connected to the water inlet pipe, and an impeller is rotatably arranged between the mounting seats, and the lower end of the impeller is located inside the lower mounting seat, and a coil is arranged inside for driving the impeller, and a pipe wall is arranged inside the impeller, and the upper and lower ends of the pipe wall are fixedly connected to the mounting seat, and a filter is arranged at the upper end of the inner part of the pipe wall.

[0010] Preferably, a mounting tube is provided on the inner lower side of the tube wall, the lower end of the mounting tube is fixedly connected to the mounting seat below, and the upper end of the mounting tube is provided with a mounting frame, and the mounting frame is arranged in a cross shape.

[0011] Preferably, a water separation tray is provided below the filter screen and fixedly connected to the pipe wall, a raised frustum is provided in the middle of the upper end of the water separation tray, a spiral tube is fixedly provided at the lower end of the water separation tray and fixedly connected to the pipe wall at the same time.

[0012] Preferably, a counterweight block is slidably provided on the outer surface of the mounting tube, a floating plate is provided below the counterweight block, the floating plate is also slidably connected to the mounting tube, a top block is fixedly provided at the middle upper end of the floating plate, a button is provided above the top block, and the button is fixedly connected to the mounting frame.

[0013] Preferably, the counterweight block can prevent the floating plate from frequently changing height due to the flow of coolant in the auxiliary component. A hollow air bag is also provided in the middle of the floating plate. The wires connected to the button are located in the mounting frame and the mounting tube and are finally connected to the plug interface on one side of the mounting seat.

[0014] Compared with the prior art, the technical solution of the present invention has the following advantages: (1) By setting up auxiliary components, firstly, the pressure in the pipeline can be balanced to avoid pipe bursts and cavities in the pipeline, thus preventing the cooling effect from decreasing and becoming unstable; secondly, the use of spiral tubes and impellers can reduce the working pressure of the radiator, avoiding unsatisfactory cooling effects caused by excessively fast flow of coolant, and compared with ordinary liquid cooling systems, at the same temperature, the working pressure of the radiator is low, the fan speed on the radiator is low, and the adaptable working temperature is higher. This can not only delay the time when the radiator fan starts to run at high power, but also reduce the frequency of fan noise to a certain extent. Finally, by setting up the filter, impurities in the coolant can be filtered to reduce the frequency of blockage, thereby reducing the maintenance frequency and extending the service life of the coolant and the device; (2) Through the setting of the cold head assembly, the special shape of the fins can increase the available heat dissipation area within a limited space without overly affecting the flow effect of the coolant. Under the action of the propeller blade, the low-temperature coolant in the inlet pipe can be pumped into the housing and pressurized, enabling the coolant to quickly pass through the fins and be discharged to the drain pipe through the hollow pipe in the middle. This can enhance the heat dissipation efficiency of the cold head assembly. Moreover, under the action of the propeller blade, the opening of the auxiliary assembly can be directly determined by the hydraulic pressure inside the device, eliminating the need for additional sensors or control programs. Description of the Drawings

[0015] Figure 1 Schematic diagram of the overall three-dimensional structure of the present invention; Figure 2 Schematic diagram of the overall structure of the cold head assembly of the present invention; Figure 3 Schematic diagram of the housing and water inlet structure of the present invention; Figure 4 Schematic diagram of the internal structure of the cold head assembly of the present invention; Figure 5 Schematic diagram of the fin and propeller blade structure of the present invention; Figure 6 Schematic diagram of the internal structure of the fin of the present invention; Figure 7 Schematic diagram of the overall structure of the auxiliary assembly of the present invention; Figure 8 Schematic diagram of the sectional structure of the mounting seat of the present invention; Figure 9 For the present invention Figure 8 Enlarged structure schematic diagram at position A in Figure 10 Schematic diagram of the sectional structure of the auxiliary assembly of the present invention; Figure 11 Schematic diagram of the sectional structure (without mounting seat at the upper end) of the auxiliary assembly of the present invention; Figure 12 Schematic diagram of the internal structure of the spiral tube and other components of the auxiliary assembly of the present invention; Figure 13 Schematic diagram of the lower half part of the auxiliary assembly of the present invention; Figure 14 Schematic diagram of the floating plate and related components of the present invention; Figure 15 Schematic diagram of the floating plate and related components (looking up) of the present invention.

[0016] In the figure: 1. Cold head assembly; 101. Outer shell; 102. Water inlet; 103. Water distribution pipe; 104. Electromagnetic coil; 105. Propeller blade; 106. Fins; 107. Copper plate; 2. Auxiliary assembly; 201. Mounting seat; 202. Three-way pipe; 203. Impeller; 204. Pipe wall; 205. Filter screen; 206. Sealing ring; 207. Connecting rod; 208. Base; 209. Spring; 210. Sealing gasket; 211. Water distribution plate; 212. Spiral pipe; 213. Mounting pipe; 214. Mounting bracket; 215. Counterweight; 216. Floating plate; 217. Button; 218. Top block; 3. Radiator; 4. Water inlet pipe; 5. Drain pipe. Detailed implementation manners

[0017] To make the objectives, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present disclosure. Obviously, the described embodiments are some, but not all, of the embodiments of the present disclosure. All other embodiments obtained by those of ordinary skill in the art based on the described embodiments of the present disclosure without creative efforts shall fall within the scope of protection of the present disclosure.

[0018] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure shall have the ordinary meanings understood by those of ordinary skill in the art to which the present disclosure pertains. The terms "including" or "comprising" and the like used in the present disclosure mean that the elements or items appearing before the term cover the elements or items listed after the term and their equivalents, without excluding other elements or items. The terms "connected" or "coupled" and the like are not limited to physical or mechanical connections, and may also include electrical connections, whether direct or indirect. The terms "upper", "lower", "left", "right" and the like are only used to represent relative positional relationships, and when the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0019] As Figures 1 to 15 shown, a liquid cooling system for a semiconductor provided by the present invention includes a cold head assembly 1. The cold head assembly 1 is installed at the hot end of the semiconductor chip. A drain pipe 5 is provided in the middle of the upper end of the cold head assembly 1. A water inlet pipe 4 is provided on one side of the cold head assembly 1. The water inlet pipe 4 and the drain pipe 5 are respectively used to convey low-temperature coolant and high-temperature coolant. The other ends of the water inlet pipe 4 and the drain pipe 5 are provided with a radiator 3. The water inlet pipe 4 and the drain pipe 5 are connected to the interfaces on the radiator 3. The radiator 3 is used to reduce the temperature of the coolant. An auxiliary assembly 2 is provided in the middle of the water inlet pipe 4 and the drain pipe 5. The auxiliary assembly 2 is used to balance the pressure in the whole device, assist in heat dissipation and store spare coolant; The auxiliary component 2 mainly includes an impeller 203 and a sealing ring 206 arranged inside the mounting seat 201. The center of the sealing ring 206 and the center of the tee pipe 202 are on the same straight line. In the middle of the lower end of the sealing ring 206, a connecting rod 207 is fixedly arranged. At the lower end of the connecting rod 207, a base 208 is fixedly arranged. The base 208 is also fixedly connected to the mounting seat 201. Around the connecting rod 207 at the upper end of the base 208, springs 209 are fixedly arranged. At the upper end of the springs 209, a sealing gasket 210 is fixedly arranged. The middle part of the sealing gasket 210 is slidably connected to the connecting rod 207. There are two sets of sealing mechanisms in the auxiliary component 2, which are respectively arranged inside the upper and lower mounting seats 201, and their structures, installation positions and installation methods are exactly the same.

[0020] The cold head component 1 includes a housing 101, which is used to install other components inside the cold head component 1 and connect the drain pipe 5. Around the upper end of the housing 101, water inlets 102 are fixedly arranged. There are four water inlets 102 in total. A water distribution pipe 103 is arranged outside the water inlets 102, and the water distribution pipe 103 is connected to the water inlet pipe 4.

[0021] Inside the housing 101, an electromagnetic coil 104 is fixedly arranged directly below the drain pipe 5. A propeller blade 105 is rotatably arranged at the lower end of the electromagnetic coil 104. The propeller blade 105 is also rotatably connected to the housing 101. Below the propeller blade 105, fins 106 are arranged. The fins 106 are arranged in a spiral shape. A hollow tube is arranged in the middle of the fins 106. At the lower end of the fins 106, a copper plate 107 is fixedly arranged. The lower end of the copper plate 107 is in contact with the semiconductor.

[0022] The inclination direction of the blade of the propeller blade 105 is opposite to the twisting direction of the fins 106. The lowermost end of the hollow tube in the middle of the fins 106 does not contact the copper plate 107. The middle part of the propeller blade 105 is made of copper.

[0023] The mounting seat 201 is divided into upper and lower parts. At the upper and lower ends of the upper and lower mounting seats 201, tee pipes 202 are fixedly arranged. The two ends of the upper tee pipe 202 are connected to the drain pipe 5, and the two ends of the lower tee pipe 202 are connected to the water inlet pipe 4. An impeller 203 is rotatably arranged between the mounting seats 201. Inside the lower mounting seat 201 at the lower end of the impeller 203, a coil is arranged to drive the impeller 203. Inside the impeller 203, a pipe wall 204 is arranged. The upper and lower ends of the pipe wall 204 are both fixedly connected to the mounting seat 201. At the upper end inside the pipe wall 204, a filter screen 205 is arranged.

[0024] At the lower side inside the pipe wall 204, a mounting pipe 213 is arranged. The lower end of the mounting pipe 213 is fixedly connected to the lower mounting seat 201. At the upper end of the mounting pipe 213, a mounting bracket 214 is arranged, and the mounting bracket 214 is arranged in a cross shape.

[0025] Below the filter screen 205, a water distribution tray 211 is provided. The water distribution tray 211 is fixedly connected to the pipe wall 204. In the middle of the upper end of the water distribution tray 211, a convex frustum is provided. At the lower end of the water distribution tray 211, a spiral pipe 212 is fixedly provided, and the spiral pipe 212 is also fixedly connected to the pipe wall 204.

[0026] A counterweight 215 is slidably provided on the outer surface of the installation pipe 213. Below the counterweight 215, a floating plate 216 is provided. The floating plate 216 is also slidably connected to the installation pipe 213. At the upper middle of the floating plate 216, a top block 218 is fixedly provided. Above the top block 218, a button 217 is provided, and the button 217 is fixedly connected to the installation frame 214.

[0027] The counterweight 215 can prevent the floating plate 216 from frequently changing its height due to the flow of the coolant in the auxiliary component 2. A hollow airbag is also provided in the middle of the floating plate 216. The wire connected to the button 217 is located inside the installation frame 214 and the installation pipe 213 and finally connected to the socket on one side of the installation base 201.

[0028] The working principle and usage process of the present invention: When dissipating heat from the semiconductor, there are three situations in total: When the temperature of the semiconductor is within the normal working temperature range: The propeller blades 105 in the auxiliary component 2 and the cold head component 1 do not start, and only the cold radiator 3 can meet the heat dissipation requirements. When the temperature of the semiconductor exceeds the normal working temperature but does not reach the "high temperature" standard: The electromagnetic coil 104 in the cold head component 1 is energized, and at this time the propeller blades 105 start to rotate. After the propeller blades 105 start, it can assist the original pump in the system to accelerate the flow rate of the coolant in the cold head. When the temperature of the semiconductor reaches the "high temperature" standard: the power supply of the electromagnetic coil 104 will increase, and as a result, the flow rate of the coolant will further accelerate. At this time, the water inlet pipe 4 will be in a low-pressure state, and the drain pipe 5 will be in a high-pressure state. In this way, the pressure difference inside the pipes can be used to open the upper and lower gaskets 210; at this time, the drain pipe 5 can not only transport the coolant to the radiator 3, but also discharge the excess coolant that the radiator 3 cannot receive into the pipe wall 204. When the high-temperature coolant enters the pipe wall 204, it will first pass through the filter screen 205, which can filter out the impurities in the coolant. Then the coolant passes through the water distribution plate 211 and enters the spiral pipe 212, and finally enters the lower part of the pipe wall 204; while the water inlet pipe 4 can not only transport the low-temperature coolant discharged from the radiator 3 to the cold head assembly 1, but also use the low pressure inside the pipe to pump out the standby low-temperature coolant stored in the pipe wall 204 to meet the working requirements of the cold head assembly 1. At this time, the liquid level of the pipe wall 204 will correspondingly decrease. After the liquid level decreases, the floating plate 216 will move down accordingly, and the top block 218 will no longer be able to hold down the button 217. After the button 217 is released, the coil in the mounting seat 201 starts and drives the impeller 203 outside the pipe wall 204 to rotate. After the impeller 203 starts, it can blow the external air towards the pipe wall 204. In this way, it can not only cool the high-temperature coolant in the spiral pipe 212, but also cool the coolant in the lower half of the pipe wall 204.

[0029] The above embodiments are only exemplary embodiments of the present invention and are not used to limit the present invention. The protection scope of the present invention is defined by the claims. Those skilled in the art can make various modifications or equivalent replacements within the essence and protection scope of the present invention, and such modifications or equivalent replacements should also be regarded as falling within the protection scope of the present invention.

Claims

1. A liquid cooling system for a semiconductor, comprising a cold head assembly (1), characterized in that: The cold head assembly (1) is installed at the hot end of the semiconductor chip. A drain pipe (5) is provided in the middle of the upper end of the cold head assembly (1). A water inlet pipe (4) is provided on one side of the cold head assembly (1). The water inlet pipe (4) and the drain pipe (5) are respectively used for transporting low-temperature coolant and high-temperature coolant. The other ends of the water inlet pipe (4) and the drain pipe (5) are provided with a cold radiator (3). The water inlet pipe (4) and the drain pipe (5) are connected to the interfaces on the cold radiator (3). The cold radiator (3) is used to reduce the temperature of the coolant. An auxiliary assembly (2) is provided in the middle of the water inlet pipe (4) and the drain pipe (5). The auxiliary assembly (2) is used to balance the pressure inside the whole device, assist in heat dissipation and store spare coolant; The auxiliary assembly (2) mainly includes an impeller (203), a water distribution plate (211), a spiral pipe (212) and a sealing ring (206) arranged inside the mounting seat (201). The center of the sealing ring (206) and the center of the three-way pipe (202) are on the same straight line. A connecting rod (207) is fixedly arranged in the middle of the lower end of the sealing ring (206). A base (208) is fixedly arranged at the lower end of the connecting rod (207). The base (208) is also fixedly connected to the mounting seat (201). Springs (209) are fixedly arranged around the connecting rod (207) at the upper end of the base (208). A sealing gasket (210) is fixedly arranged at the upper end of the springs (209). The middle part of the sealing gasket (210) is slidably connected to the connecting rod (207). There are two groups of sealing mechanisms in the auxiliary assembly (2), which are respectively arranged inside the upper and lower mounting seats (201), and their structures, installation positions and installation methods are exactly the same.

2. The liquid cooling system for a semiconductor according to claim 1, wherein: The cold head assembly (1) includes a housing (101). The housing (101) is used to install other components inside the cold head assembly (1) and connect the drain pipe (5). Water inlets (102) are fixedly arranged around the upper end of the housing (101). There are four water inlets (102) in total. A water distribution pipe (103) is arranged outside the water inlets (102). The water distribution pipe (103) is connected to the water inlet pipe (4).

3. The liquid cooling system for a semiconductor according to claim 2, characterized in that: An electromagnetic coil (104) is fixedly arranged inside the housing (101) directly below the drain pipe (5). A propeller blade (105) is rotatably arranged at the lower end of the electromagnetic coil (104). The propeller blade (105) is also rotatably connected to the housing (101). Fins (106) are arranged below the propeller blade (105). The fins (106) are arranged in a threaded shape. A hollow tube is arranged in the middle of the fins (106). A copper plate (107) is fixedly arranged at the lower end of the fins (106). The lower end of the copper plate (107) is in contact with the semiconductor.

4. A liquid cooling system for a semiconductor according to claim 3, characterized in that: The inclination direction of the blade of the propeller blade (105) is opposite to the twisting direction of the fins (106). The lowermost end of the hollow tube in the middle of the fins (106) is not in contact with the copper plate (107). The middle part of the propeller blade (105) is made of copper.

5. The liquid cooling system for a semiconductor according to claim 1, wherein: The mounting base (201) is divided into upper and lower parts. Three-way pipes (202) are fixedly arranged at both the upper and lower ends of the upper and lower mounting bases (201). The two ends of the upper three-way pipe (202) are connected to the drain pipe (5), and the two ends of the lower three-way pipe (202) are connected to the water inlet pipe (4). An impeller (203) is rotatably arranged between the mounting bases (201). A coil for driving the impeller (203) is arranged inside the lower end of the impeller (203) within the lower mounting base (201). A pipe wall (204) is arranged inside the impeller (203). Both the upper and lower ends of the pipe wall (204) are fixedly connected to the mounting base (201). A filter screen (205) is arranged at the upper end inside the pipe wall (204).

6. The liquid cooling system for a semiconductor according to claim 5, characterized in that: An installation pipe (213) is arranged at the lower side inside the pipe wall (204). The lower end of the installation pipe (213) is fixedly connected to the lower mounting base (201). An installation frame (214) is arranged at the upper end of the installation pipe (213). The installation frame (214) is arranged in a cross shape.

7. A liquid cooling system for a semiconductor according to claim 5, characterized in that: A water distribution plate (211) is arranged below the filter screen (205). The water distribution plate (211) is fixedly connected to the pipe wall (204). A raised frustum is arranged in the middle of the upper end of the water distribution plate (211). A spiral pipe (212) is fixedly arranged at the lower end of the water distribution plate (211). The spiral pipe (212) is also fixedly connected to the pipe wall (204).

8. The liquid cooling system for a semiconductor according to claim 6, characterized in that: A counterweight (215) is slidably arranged on the outer surface of the installation pipe (213). A floating plate (216) is arranged below the counterweight (215). The floating plate (216) is also slidably connected to the installation pipe (213). A top block (218) is fixedly arranged at the middle upper end of the floating plate (216). A button (217) is arranged above the top block (218). The button (217) is fixedly connected to the installation frame (214).

9. The liquid cooling system for a semiconductor according to claim 8, characterized in that: The counterweight (215) can prevent the floating plate (216) from frequently changing its height due to the flow of the coolant inside the auxiliary component (2). A hollow airbag is also arranged in the middle of the floating plate (216). The wire connected to the button (217) is located inside the installation frame (214) and the installation pipe (213) and is finally connected to the socket on one side of the mounting base (201).

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