A liquid cooling system for semiconductors

Abstract

The present invention relates to the field of semiconductor equipment and discloses a liquid cooling system for semiconductors, comprising a cold head assembly, wherein the cold head assembly is mounted on the hot end of a semiconductor wafer, a drain pipe is provided in the middle of the upper end of the cold head assembly, a water inlet pipe is provided on one side of the cold head assembly, the water inlet pipe and the drain pipe are respectively used to transport low-temperature coolant and high-temperature coolant, a cold row is provided at the other end of the water inlet pipe and the drain pipe, the water inlet pipe and the drain pipe are connected to an interface on the cold row, the cold row is used to reduce the temperature of the coolant, an auxiliary component is provided in the middle of the water inlet pipe and the drain pipe, the auxiliary component is used to balance the pressure in the entire device, a liquid cooling system for semiconductors provided by the present invention has an auxiliary component, which can balance the pipeline pressure to avoid pipe bursting and ensure the cooling effect; it can also assist the cold row in heat dissipation, reduce the working pressure of the cold row, reduce the fan speed, and increase the adaptable working temperature.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment, and in particular to a liquid cooling system for semiconductors. Background Art

[0002] The patent application, with application publication number CN219832643U, includes a first accommodating chamber, a coolant circulation channel, and a coolant heat sink. The first accommodating chamber has an opening on one side, with the heat sink end of the semiconductor refrigeration chip tightly sealed against the opening. Both ends of the coolant circulation channel are connected to the first accommodating chamber, allowing the coolant to circulate and contact the heat sink end of the semiconductor refrigeration chip. The coolant heat sink is used to cool the coolant in the coolant circulation channel that has absorbed heat from the first accommodating chamber. Advantages include: the internal circulation system formed by the first and second accommodating chambers and the coolant circulation channel allows the coolant to directly contact and exchange heat with the heat sink end of the semiconductor refrigeration chip, significantly improving the cooling effect on the semiconductor refrigeration chip, increasing its operating efficiency, and extending its service life.

[0003] In the prior art including the above-mentioned patents, when cooling the semiconductor, if the temperature of the semiconductor is too high, it is necessary to increase the flow rate of the coolant to achieve the purpose of rapid cooling. When the coolant flow rate increases, it will not only increase the workload of the pump, but the long-term high-speed operation of the pump itself will also affect the stability of the work, and will also reduce the cooling efficiency of the radiator. Because the coolant flow rate increases, the time that the high-temperature coolant stays in the radiator will be reduced. At this time, the specified temperature can only be reached by increasing the fan speed, but increasing the fan speed will generate greater noise. Moreover, in the prior art of the above-mentioned patents, the contact area between the first accommodating cavity and the semiconductor chip is small, and although the common technical means on the market can increase the heat dissipation area, it will affect the direction of the water flow to a certain extent, thereby affecting the heat dissipation efficiency. Summary of the Invention

[0004] The problem to be solved by the present invention is that the heat dissipation efficiency is not high, it is not convenient to further accelerate the cooling efficiency when the semiconductor is at high temperature, and it is not convenient to improve the user's comfort and reduce the cost of use.

[0005] To solve the above technical problems, the technical solution of the present invention is: a liquid cooling system for semiconductors, comprising a cold head assembly, wherein the cold head assembly is mounted on the hot end of the semiconductor wafer, a drain pipe is provided in the middle of the upper end of the cold head assembly, a water inlet pipe is provided on one side of the cold head assembly, the water inlet pipe and the drain pipe are respectively used to transport low-temperature coolant and high-temperature coolant, a cold row is provided at the other end of the water inlet pipe and the drain pipe, the water inlet pipe and the drain pipe are connected to the interface on the cold row, the cold row is used to reduce the temperature of the coolant, an auxiliary component is provided in the middle of the water inlet pipe and the drain pipe, the auxiliary component is used to balance the pressure in the entire device, assist in heat dissipation and store spare coolant;

[0006] The auxiliary component mainly includes an impeller and a sealing ring arranged inside the mounting seat, the center of the sealing ring and the center of the tee are on the same straight line, a connecting rod is fixedly provided at the middle of the lower end of the sealing ring, the lower end of the connecting rod is fixedly provided with a base, and the base is fixedly connected to the mounting seat at the same time, the upper end of the base is fixedly provided with a spring around the connecting rod, the upper end of the spring is fixedly provided with a sealing gasket, the middle part of the sealing gasket is slidably connected to the connecting rod, and there are two groups of sealing mechanisms in the auxiliary component, which are respectively arranged inside the upper and lower mounting seats, and their structure, installation position and installation method are exactly the same, the upper and lower ends of the upper and lower mounting seats are fixedly provided with tee pipes, the two ends of the upper tee pipe are connected to the drain pipe, and the lower The two ends of the square three-way pipe are connected to the water inlet pipe, and an impeller is rotatably arranged between the mounting seat, and the lower end of the impeller is located at the mounting seat below and a coil is provided inside the mounting seat for driving the impeller. A pipe wall is provided inside the impeller, and the upper and lower ends of the pipe wall are fixedly connected to the mounting seat, and a filter is provided at the upper end of the inner upper end of the pipe wall, and a mounting pipe is provided on the lower side of the inner inner side of the pipe wall, and the lower end of the mounting pipe is fixedly connected to the mounting seat below, and the upper end mounting frame of the mounting pipe is arranged in a cross shape, and a water distribution plate is provided below the filter, and the water distribution plate is fixedly connected to the pipe wall, and a raised frustum is provided in the middle of the upper end of the water distribution plate, and a spiral tube is fixedly provided at the lower end of the water distribution plate, and the spiral tube is fixedly connected to the pipe wall at the same time.

[0007] Preferably, the cold head assembly includes a shell, which is used to install other components in the cold head assembly and connect the drain pipe. Water inlets are fixedly provided around the upper end of the shell. There are four water inlets in total. A water distribution pipe is provided on the outside of the water inlet, and the water distribution pipe is connected to the water inlet pipe.

[0008] Preferably, an electromagnetic coil is fixedly installed inside the shell just below the drain pipe, and a propeller blade is rotatably installed at the lower end of the electromagnetic coil. The propeller blade is also rotatably connected to the shell, and a fin is provided below the propeller blade. The fin is threaded, and a hollow tube is provided in the middle of the fin. A copper plate is fixedly installed at the lower end of the fin, and the lower end of the copper plate is in contact with the semiconductor.

[0009] Preferably, the propeller blade has an inclination direction opposite to the twisting direction of the fin, the lowermost end of the hollow tube in the middle of the fin does not contact the copper plate, and the middle part of the propeller blade is made of copper.

[0010] Preferably, a counterweight block is slidably provided on the outer surface of the mounting tube, a floating plate is provided below the counterweight block, and the floating plate is also slidably connected to the mounting tube, a top block is fixedly provided at the middle upper end of the floating plate, a button is provided above the top block, and the button is fixedly connected to the mounting frame.

[0011] Preferably, the counterweight block can prevent the floating plate from frequently changing height due to the flow of coolant in the auxiliary component. A hollow air bag is also provided in the middle of the floating plate. The wires connected to the button are located in the mounting frame and the mounting tube and are finally connected to the plug interface on one side of the mounting seat.

[0012] Compared with the prior art, the technical solution of the present invention has the following advantages:

[0013] (1) By setting up auxiliary components, firstly, the pressure in the pipeline can be balanced, preventing pipe bursts and cavities from forming in the pipeline, thereby preventing the cooling effect from decreasing and becoming unstable; secondly, the use of spiral tubes and impellers can reduce the working pressure of the radiator, avoiding unsatisfactory cooling effects caused by excessively fast coolant flow rates, and compared to ordinary liquid cooling systems, at the same temperature, the radiator's working pressure is low, the fan speed on the radiator is low, and the adaptable working temperature is higher. This not only delays the time when the radiator fan starts running at high power, but also reduces the frequency of fan noise to a certain extent. Finally, by setting up the filter, impurities in the coolant can be filtered, reducing the frequency of blockages, thereby reducing the maintenance frequency and thus extending the service life of the coolant and the device;

[0014] (2) Through the setting of the cold head assembly, the special shape of the fins can increase the available heat dissipation area within a limited space without excessively affecting the flow effect of the coolant. Under the action of the propeller blades, the low-temperature coolant in the water inlet pipe can be pumped into the shell and pressurized, so that the coolant can quickly pass through the fins and be discharged from the hollow tube in the middle to the drain pipe, thereby enhancing the heat dissipation efficiency of the cold head assembly. Under the action of the propeller blades, the hydraulic pressure in the device can be directly used to determine whether the auxiliary component is turned on, without the need for additional sensors or control programs. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the present invention;

[0016] Figure 2 This is a schematic diagram of the overall structure of the cold head assembly of the present invention;

[0017] Figure 3 This is a schematic diagram of the housing and water inlet structure of the present invention;

[0018] Figure 4 This is a schematic diagram of the internal structure of the cold head assembly of the present invention;

[0019] Figure 5 Schematic diagram of the fin and propeller blade structure of the present invention;

[0020] Figure 6 Schematic diagram of the internal structure of the fin of the present invention;

[0021] Figure 7 This is a schematic diagram of the overall structure of the auxiliary components of the present invention;

[0022] Figure 8 This is a schematic cross-sectional structural diagram of the mounting base of the present invention;

[0023] Figure 9 For the present invention Figure 8 A in the middle is an enlarged structural diagram;

[0024] Figure 10 This is a schematic cross-sectional view of the auxiliary component of the present invention;

[0025] Figure 11 This is a schematic diagram of the cross-sectional structure of the auxiliary component of the present invention (without the mounting seat at the upper end);

[0026] Figure 12 This is a schematic diagram of the structure of the spiral tube and other components inside the auxiliary components of the present invention;

[0027] Figure 13 This is a schematic structural diagram of the lower half of the auxiliary component of the present invention;

[0028] Figure 14This is a schematic diagram of the structure of the floating plate and related components of the present invention;

[0029] Figure 15 Schematic diagram of the structure of the floating plate and related components (viewed from above) of the present invention.

[0030] In the figure: 1. Cold head assembly; 101. Shell; 102. Water inlet; 103. Water distribution pipe; 104. Electromagnetic coil; 105. Propeller blade; 106. Fin; 107. Copper plate; 2. Auxiliary assembly; 201. Mounting seat; 202. Tee pipe; 203. Impeller; 204. Pipe wall; 205. Filter; 206. Sealing ring; 207. Connecting rod; 208. Base; 209. Spring; 210. Sealing gasket; 211. Water distribution plate; 212. Spiral pipe; 213. Mounting pipe; 214. Mounting frame; 215. Counterweight; 216. Float plate; 217. Button; 218. Top block; 3. Radiator; 4. Water inlet pipe; 5. Drain pipe. DETAILED DESCRIPTION

[0031] To make the purpose, technical solutions and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0032] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the usual meanings understood by persons of ordinary skill in the field to which this disclosure belongs. The words “including” or “comprising” and the like used in this disclosure mean that the elements or objects preceding the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. The words “connected” or “connected” and the like are not limited to physical or mechanical connections, but may also include electrical connections, whether direct or indirect. “Up”, “down”, “left”, “right” and the like are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0033] like Figures 1 to 15As shown, the present invention provides a liquid cooling system for semiconductors, including a cold head assembly 1, which is installed at the hot end of the semiconductor chip, a drain pipe 5 is provided in the middle of the upper end of the cold head assembly 1, and a water inlet pipe 4 is provided on one side of the cold head assembly 1, the water inlet pipe 4 and the drain pipe 5 are used to transport low-temperature coolant and high-temperature coolant respectively, and a cold row 3 is provided at the other end of the water inlet pipe 4 and the drain pipe 5, the water inlet pipe 4 and the drain pipe 5 are connected to the interface on the cold row 3, and the cold row 3 is used to reduce the temperature of the coolant, and an auxiliary assembly 2 is provided in the middle of the water inlet pipe 4 and the drain pipe 5. The auxiliary assembly 2 is used to balance the pressure in the entire device, assist in heat dissipation and store spare coolant, and the upper and lower ends of the upper and lower mounting seats 201 are fixedly provided with a tee pipe 202, the two ends of the upper tee pipe 202 are connected to the drain pipe 5, and the two ends of the lower tee pipe 202 are connected to the water inlet pipe 4, and the mounting seat 201 is provided with a tee pipe 202. An impeller 203 is rotatably arranged between the mounting seats 201. The lower end of the impeller 203 is located inside the mounting seat 201 below, and a coil is arranged inside for driving the impeller 203. A pipe wall 204 is arranged inside the impeller 203. The upper and lower ends of the pipe wall 204 are fixedly connected to the mounting seat 201. A filter screen 205 is provided at the upper end of the inner part of the pipe wall 204. A mounting pipe 213 is provided on the lower side of the inner part of the pipe wall 204. The lower end of the mounting pipe 213 is fixedly connected to the mounting seat 201 below. The upper end of the mounting pipe 213 is equipped with a mounting frame 214, and the mounting frame 214 is arranged in a cross shape. A water diversion plate 211 is arranged below the filter screen 205, and the water diversion plate 211 is fixedly connected to the pipe wall 204. A raised frustum is provided in the middle part of the upper end of the water diversion plate 211. A spiral tube 212 is fixedly arranged at the lower end of the water diversion plate 211, and the spiral tube 212 is also fixedly connected to the pipe wall 204.

[0034] The auxiliary component 2 mainly includes an impeller 203 and a sealing ring 206 arranged inside the mounting seat 201. The center of the sealing ring 206 is located in the same straight line as the center of the tee pipe 202. A connecting rod 207 is fixedly provided in the middle of the lower end of the sealing ring 206. A base 208 is fixedly provided at the lower end of the connecting rod 207. The base 208 is also fixedly connected to the mounting seat 201. The upper end of the base 208 is located around the connecting rod 207 and a spring 209 is fixedly provided. A sealing gasket 210 is fixedly provided at the upper end of the spring 209. The middle part of the sealing gasket 210 is slidably connected to the connecting rod 207. There are two groups of sealing mechanisms in the auxiliary component 2, which are respectively arranged in the upper and lower mounting seats 201, and their structure, installation position and installation method are completely consistent.

[0035] The cold head assembly 1 includes an outer shell 101, which is used to install other components in the cold head assembly 1 and connect the drain pipe 5. Water inlets 102 are fixedly provided around the upper end of the outer shell 101. There are four water inlets 102 in total. A water distribution pipe 103 is provided on the outside of the water inlet 102, and the water distribution pipe 103 is connected to the water inlet pipe 4.

[0036] An electromagnetic coil 104 is fixedly installed inside the shell 101, just below the drain pipe 5. A propeller blade 105 is rotatably installed at the lower end of the electromagnetic coil 104. The propeller blade 105 is also rotatably connected to the shell 101. A fin 106 is provided below the propeller blade 105. The fin 106 is threaded and a hollow tube is provided in the middle of the fin 106. A copper plate 107 is fixedly installed at the lower end of the fin 106, and the lower end of the copper plate 107 is in contact with the semiconductor.

[0037] The propeller blade 105 has an inclination direction opposite to the twisting direction of the fin 106 . The lowermost end of the hollow tube in the middle of the fin 106 does not contact the copper plate 107 . The middle part of the propeller blade 105 is made of copper.

[0038] A counterweight block 215 is slidingly provided on the outer surface of the mounting tube 213, and a floating plate 216 is provided below the counterweight block 215. The floating plate 216 is also slidingly connected to the mounting tube 213. A top block 218 is fixedly provided at the middle upper end of the floating plate 216, and a button 217 is provided above the top block 218. The button 217 is fixedly connected to the mounting frame 214.

[0039] The counterweight block 215 can prevent the floating plate 216 from frequently changing height due to the flow of coolant in the auxiliary component 2. A hollow air bag is also provided in the middle of the floating plate 216. The wires connected to the button 217 are located in the mounting frame 214 and the mounting tube 213 and are finally connected to the plug interface on one side of the mounting seat 201.

[0040] The working principle and use process of the present invention: When dissipating heat from a semiconductor, there are three situations:

[0041] When the temperature of the semiconductor is within the normal operating temperature range: the propeller blades 105 in the auxiliary component 2 and the cold head component 1 are not activated, and the heat dissipation requirement can be met only by the radiator 3;

[0042] When the temperature of the semiconductor exceeds the normal operating temperature but does not reach the "high temperature" standard: the electromagnetic coil 104 in the cold head assembly 1 is energized, and the propeller blades 105 begin to rotate. When the propeller blades 105 start to rotate, they can assist the existing pump in the system and speed up the flow rate of the coolant in the cold head;

[0043] When the temperature of the semiconductor reaches the "high temperature" standard: the power supply of the electromagnetic coil 104 will increase, and the flow rate of the coolant will be further accelerated. At this time, the water inlet pipe 4 will be in a low pressure state, and the drain pipe 5 will be in a high pressure state, so that the pressure difference in the pipe can be used to open the upper and lower sealing gaskets 210; at this time, the drain pipe 5 can not only transport coolant to the radiator 3, but also discharge the excess coolant that the radiator 3 cannot receive into the pipe wall 204. When the high-temperature coolant enters the pipe wall 204, it will first pass through the filter 205, and the filter 205 can filter out impurities in the coolant. Then the coolant passes through the water diversion plate 211 into the spiral tube 212, and finally enters the pipe wall 204. Below; the water inlet pipe 4 can not only transport the low-temperature coolant discharged from the radiator 3 to the cold head assembly 1, but also use the low pressure in the pipe to draw out the spare low-temperature coolant stored in the tube wall 204 to meet the working needs of the cold head assembly 1. At this time, the liquid level of the tube wall 204 will drop accordingly. After the liquid level drops, the float plate 216 will move down accordingly, and the top block 218 will not be able to support the button 217. After the button 217 is released, the coil in the mounting seat 201 is started and drives the impeller 203 outside the tube wall 204 to rotate. After the impeller 203 is started, the external air can be blown to the tube wall 204, which can not only cool the high-temperature coolant in the spiral tube 212, but also cool the coolant in the lower half of the tube wall 204.

[0044] The above embodiments are merely exemplary embodiments of the present invention and are not intended to limit the scope of the present invention. The scope of protection of the present invention is defined by the claims. Those skilled in the art may make various modifications or equivalent substitutions to the present invention within the spirit and scope of protection of the present invention, and such modifications or equivalent substitutions shall also be deemed to fall within the scope of protection of the present invention.

Claims

1. A liquid cooling system for a semiconductor, comprising a cold head assembly (1), characterized in that: The cold head assembly (1) is mounted on the hot end of the semiconductor chip, a drain pipe (5) is provided in the middle of the upper end of the cold head assembly (1), a water inlet pipe (4) is provided on one side of the cold head assembly (1), the water inlet pipe (4) and the drain pipe (5) are used to transport low-temperature coolant and high-temperature coolant respectively, a cold row (3) is provided at the other end of the water inlet pipe (4) and the drain pipe (5), the water inlet pipe (4) and the drain pipe (5) are connected to the interface on the cold row (3), the cold row (3) is used to reduce the temperature of the coolant, an auxiliary assembly (2) is provided in the middle of the water inlet pipe (4) and the drain pipe (5), the auxiliary assembly (2) is used to balance the pressure in the entire device, assist in heat dissipation and store spare coolant; The auxiliary component (2) mainly comprises an impeller (203), a water distribution plate (211), a spiral tube (212), and a sealing ring (206) arranged inside the mounting seat (201). The center of the sealing ring (206) and the center of the tee tube (202) are located on the same straight line. A connecting rod (207) is fixedly provided at the middle of the lower end of the sealing ring (206). A base (208) is fixedly provided at the lower end of the connecting rod (207). The base (208) is also fixedly connected to the mounting seat (201). The upper end of the base (208) is located at the connecting rod (207). Springs (209) are fixedly provided around the spring (209), and a sealing gasket (210) is fixedly provided on the upper end of the spring (209). The middle part of the sealing gasket (210) is slidably connected to the connecting rod (207). There are two sets of sealing mechanisms in the auxiliary component (2), which are respectively provided inside the upper and lower mounting seats (201). The structures, mounting positions and mounting methods thereof are completely consistent. The upper and lower ends of the upper and lower mounting seats (201) are fixedly provided with three-way pipes (202). The two ends of the upper three-way pipe (202) are connected to the drain pipe (5), and the lower three-way pipe (202) is connected to the drain pipe (5). The two ends of the three-way pipe (202) are connected to the water inlet pipe (4), and an impeller (203) is rotatably arranged between the mounting seat (201). The lower end of the impeller (203) is located in the mounting seat (201) below. A coil is arranged inside the impeller (203) for driving the impeller (203). A pipe wall (204) is arranged inside the impeller (203). The upper and lower ends of the pipe wall (204) are fixedly connected to the mounting seat (201). A filter screen (205) is arranged on the upper end of the pipe wall (204). A mounting pipe (213) is arranged on the lower side of the pipe wall (204). ), the lower end of the mounting tube (213) is fixedly connected to the mounting seat (201) below, the upper end of the mounting tube (213) is mounted on a mounting frame (214), and the mounting frame (214) is arranged in a cross shape. A water separation plate (211) is arranged below the filter screen (205), and the water separation plate (211) is fixedly connected to the pipe wall (204). A raised frustum is arranged in the middle of the upper end of the water separation plate (211), and a spiral tube (212) is fixedly arranged at the lower end of the water separation plate (211), and the spiral tube (212) is also fixedly connected to the pipe wall (204).

2. A liquid cooling system for semiconductors according to claim 1, characterized in that: The cold head assembly (1) comprises a shell (101), the shell (101) being used to install other components in the cold head assembly (1) and to connect a drain pipe (5), a water inlet (102) being fixedly provided around the upper end of the shell (101), a total of four water inlets (102), a water distribution pipe (103) being provided outside the water inlet (102), and the water distribution pipe (103) being connected to the water inlet pipe (4).

3. A liquid cooling system for semiconductors according to claim 2, characterized in that: An electromagnetic coil (104) is fixedly provided inside the housing (101) and located directly below the drain pipe (5). A propeller blade (105) is rotatably provided at the lower end of the electromagnetic coil (104). The propeller blade (105) is rotatably connected to the housing (101). A fin (106) is provided below the propeller blade (105). The fin (106) is threaded. A hollow tube is provided in the middle of the fin (106). A copper plate (107) is fixedly provided at the lower end of the fin (106). The lower end of the copper plate (107) is in contact with the semiconductor.

4. A liquid cooling system for semiconductors according to claim 3, characterized in that: The propeller blade (105) has an inclination direction opposite to the twisting direction of the fin (106), the lowermost end of the hollow tube in the middle of the fin (106) does not contact the copper plate (107), and the middle part of the propeller blade (105) is made of copper.

5. The liquid cooling system for semiconductors according to claim 1, characterized in that: A counterweight (215) is slidably provided on the outer surface of the mounting tube (213), a floating plate (216) is provided below the counterweight (215), and the floating plate (216) is also slidably connected to the mounting tube (213), a top block (218) is fixedly provided at the middle upper end of the floating plate (216), a button (217) is provided above the top block (218), and the button (217) is fixedly connected to the mounting frame (214).

6. A liquid cooling system for semiconductors according to claim 5, characterized in that: The counterweight (215) can prevent the floating plate (216) from frequently changing height due to the flow of coolant in the auxiliary component (2). A hollow air bag is also provided in the middle of the floating plate (216). The wire connected to the button (217) is located in the mounting frame (214) and the mounting tube (213) and is finally connected to the plug interface on one side of the mounting seat (201).

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