Method, system and device for stably mounting element by chip mounter, and medium

Abstract

The invention discloses a method, a system, a device and a medium for a chip mounter to stably mount an element, and the method comprises the following steps: switching the internal air pressure state of a suction nozzle of the chip mounter from the air stop state to the air suction state when the element is sucked, and opening a breaking valve of an air storage tank communicated with an air path of the suction nozzle at the same time, so as to synchronously inflate the air in the air storage tank; after the suction nozzle ascends to a specified position, the breaking valve is closed to stop inflating; after the suction nozzle is controlled to descend to the mounting position according to the mounting instruction, the air pressure state is switched from air suction to air stopping, then the breaking valve is opened, air is blown into the suction nozzle from the air storage tank, and the blowing time corresponds to the type of the suction nozzle, so that the negative pressure in the suction nozzle is broken, and element mounting is achieved; and after the blowing time is up, the breaking valve corresponding to the suction nozzle is closed. According to the scheme, efficient and stable mounting can be realized under the condition that the air pressures of the suction nozzles interfere with one another, and the problem that component deviation or inaccurate mounting is difficult to avoid when micro components are mounted is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic manufacturing equipment, and particularly relates to a method, system, device, and medium for a mounter to stably mount components. Background Art

[0002] As the core equipment for realizing surface mounting, the mounting accuracy and stability of a mounter directly affect the performance and reliability of electronic products. In actual production, the mounter uses a nozzle to suck components by negative pressure (vacuum) and accurately mounts them to a predetermined position. However, during high-speed mounting, due to inaccurate control of the nozzle air pressure, quality problems such as component flying, tilting, and displacement often occur, seriously affecting the production yield and efficiency. This problem is particularly prominent in the production of high-density and high-precision circuit boards and has become an important bottleneck restricting the improvement of the mounter performance and production efficiency. Therefore, there is an urgent need for a mounting solution that can balance high precision and stability during high-speed operation. Summary of the Invention

[0003] In order to solve the problems in the prior art, the purpose of the present invention is to provide a method, system, device, and medium for a mounter to stably mount components.

[0004] To achieve the above purpose, in the first aspect of the present invention, a method for a mounter to stably mount components is provided, including the following steps: When starting to suck a component, change the air pressure state inside the mounter nozzle from air stop to air suction, and at the same time open the break valve of the gas storage tank connected to the nozzle air path to synchronously charge the gas storage tank; After the nozzle rises to a specified position, close the break valve to stop charging; After controlling the nozzle to descend to the mounting position according to the mounting instruction, change the air pressure state from air suction to air stop, then open the break valve, and blow air from the gas storage tank into the nozzle interior. The blowing time corresponds to the nozzle type to break the negative pressure inside the nozzle to achieve component mounting; After reaching the blowing time, close the break valve corresponding to the nozzle, and the blowing ends.

[0005] Preferably, it further includes, After the blowing ends, judge whether the corresponding nozzle needs to wait and the waiting time according to the mounting instruction, and wait according to the waiting time; If there is no need to wait or after the waiting time ends, judge whether mounting is achieved according to the vacuum pressure. After determining that mounting is achieved, allow the nozzle to rise.

[0006] Preferably, the judging whether mounting is achieved according to the vacuum pressure is specifically: obtain the air pressure value inside the nozzle in real time, and judge whether it is greater than the specified air pressure value. If so, judge that mounting is achieved.

[0007] Preferably, both the blowing time and the specified air pressure value are obtained by the binary search method.

[0008] Preferably, the internal pressure of the gas storage tank after being filled with gas is -9 to (-20) Kpa, the blowing time of the suction nozzle is 1 to 10 ms, and the specified air pressure value is -50 to (-5) Kpa.

[0009] Preferably, in the blowing state, the positive pressure inside the suction nozzle remains between 0.05 and 0.3 Mpa.

[0010] The second aspect of the present invention provides a component mounting system for a mounter, including a vacuum pump, a gas storage tank, a suction nozzle, a control board, and a vacuum pressure detection board; The vacuum pump, the gas storage tank, and the suction nozzle are sequentially connected through air pipes. A vacuum valve is provided on the air pipe between the vacuum pump and the gas storage tank to control the connection between the vacuum pump and the gas storage tank and the suction nozzle; a break valve is provided on the air pipe between the gas storage tank and the suction nozzle to control the connection between the gas storage tank and the suction nozzle; The control board is used to execute the above method; The vacuum pressure detection board is used to obtain the air pressure in each air pipe in real time and upload the air pressure data to the control board.

[0011] Preferably, the capacity of the gas storage tank is selected to be 1 - 10 L, the diameter of the air pipe between the vacuum pump and the gas storage tank is 2.5 mm to 8 mm; the diameter of the air pipe between the gas storage tank and the suction nozzle is 1.5 mm to 2 mm.

[0012] The third aspect of the present invention provides a device for stably mounting components on a mounter, including An air suction and inflation module, configured to, when starting to suck a component, switch the air pressure state inside the suction nozzle of the mounter from gas stop to air suction, and at the same time open the break valve of the gas storage tank connected to the air path of the suction nozzle, so that the gas storage tank is inflated synchronously; A stop inflation module, configured to close the break valve to stop inflation after the suction nozzle rises to a specified position; A blowing and mounting module, configured to, according to the mounting instruction, after controlling the suction nozzle to descend to the mounting position, switch the air pressure state from air suction to gas stop, then open the break valve, and blow air from the gas storage tank into the suction nozzle. The blowing time corresponds to the type of the suction nozzle to break the negative pressure inside the suction nozzle to achieve component mounting; A stop blowing module, configured to close the break valve corresponding to the suction nozzle after reaching the blowing time, and the blowing ends.

[0013] The fourth aspect of the present invention provides a computer-readable storage medium, on which a computer program is stored, and when the program is executed by a processor, the above method is implemented.

[0014] Through the above technical solution, based on the gas path structure of the above system, air is filled into the air storage tank during the component suction process, so as to blow air into the inside of the nozzle during the mounting process, that is, air is filled in advance before mounting, which not only ensures the ability to suck components while improving the mounting efficiency, but also improves the mounting stability; by selecting different blowing times for different nozzle types, the parameters are selected based on the nozzle type rather than the component type, which not only reduces the complexity of the judgment conditions but also reduces the mutual influence of multiple nozzle gas paths, effectively improving the stability under high-speed mounting; this application meets the requirements of efficient and stable mounting under the condition of air pressure interference between each nozzle, overcomes the problem of inevitable component offset or inaccurate mounting when mounting micro-components, and is applicable to the application scenarios of chip mounters in high-speed and large-scale production.

[0015] Other features and advantages of the embodiments of the present invention will be described in detail in the following specific implementation manners. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings are used to provide a further understanding of the embodiments of the present invention, and constitute a part of the specification. Together with the following specific implementation manners, they are used to explain the embodiments of the present invention, but do not constitute a limitation to the embodiments of the present invention. In the drawings: Figure 1 is a schematic structural diagram of the system according to the embodiment of the present invention; Figure 2 is a schematic diagram of the process control for mounting components according to the embodiment of the present invention; Figure 3 is the air pressure control process for mounting components according to the embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0017] The following will describe in detail the specific implementation manners of the embodiments of the present invention with reference to the drawings. It should be understood that the specific implementation manners described herein are only used to illustrate and explain the embodiments of the present invention, and are not used to limit the embodiments of the present invention.

[0018] In the first aspect of the embodiments of the present invention, a method for stably mounting components by a chip mounter is provided, and the gas path structure for implementing this method is as Figure 1As shown in the figure, it includes a vacuum pump, an air pipe, a gas storage tank, a drag chain, a placement head, and a nozzle rod. The vacuum pump is used to provide air pressure to ensure that the nozzle rod can suck components when the nozzle is connected. The vacuum pump, the gas storage tank, and the nozzle are sequentially connected through the air pipe. Exemplarily, an 8th air pipe is used to connect the vacuum pump and the gas storage tank, and 10 4th air pipes are used to connect the gas storage tank and the placement head, so as to reduce the mutual influence during the suction of each axis. The drag chain is used to protect the air pipe and prevent the air pipe from being worn when the mounter is moving. The placement head includes a vacuum pressure detection board, an FPGA control board, a vacuum valve, a destruction valve, a vacuum valve plate, and a filter. The method is implemented based on the FPGA control board. The vacuum pressure detection board uploads the detected air pressure value to the FPGA control board to obtain the air pressure in each air pipe in real time. The FPGA control board controls the vacuum valve and the destruction valve, and then performs the suction and blowing operations of the air pressure inside the nozzle. The vacuum valve plate is used to fix the vacuum pressure detection board, the vacuum valve, and the destruction valve. The filter is used to filter the gas to prevent dust from blocking the air pipe. The nozzle rod, also called the Z-axis, is used to connect different nozzles to suck and place components. When the vacuum valve is powered off and the destruction valve is powered off, the inside of the nozzle is in a gas-stop state; when the vacuum valve is powered off and the destruction valve is powered on, the nozzle blows air and the inside is in a positive pressure state; when the vacuum valve is powered on, regardless of the state of the destruction valve, the nozzle is in a suction state and the inside is in a negative pressure state.

[0019] The method logic of the present invention includes three aspects. One is to pre-inflate during the suction process, the second is to blow air during the placement process, and the third is to control the rising air pressure of the Z-axis where the nozzle is located, including the following steps: When starting to suck components, switch the air pressure state inside the mounter nozzle from gas-stop to suction, and at the same time open the destruction valve of the gas storage tank connected to the nozzle air path to synchronously inflate the gas storage tank; During the suction process, inflating the gas storage tank while sucking is to facilitate the faster destruction of the air pressure environment inside the nozzle during placement. When the FPGA control board receives the instruction to suck components, it controls the Z-axis to descend. After the nozzle sucks the components, it controls the Z-axis to rise, and one suction is completed. During the execution of the instruction to suck components, the initial state of the nozzle is the gas-stop state, the vacuum valve is closed, and the destruction valve is closed. After the Z-axis descends, the vacuum valve and the destruction valve are opened for suction.

[0020] After the nozzle rises to the specified position, close the destruction valve to stop inflation; When the Z-axis rises to the specified position, that is, the XYR movable position, close the destruction valve to stop inflation. Therefore, during the period from the completion of the Z-axis descent to the rise of the Z-axis to the XYR movable position, the destruction valve is in the open state and continuously inflates the gas storage tank. The internal pressure of the gas storage tank after inflation is -9~(-20) Kpa.

[0021] After the nozzle is controlled to descend to the mounting position according to the mounting instruction, the air pressure state is switched from air suction to air stop, and then the breaking valve is opened, and air is blown into the nozzle from the air storage tank. The blowing time corresponds to the nozzle type, so as to destroy the negative pressure inside the nozzle to realize component mounting; The purpose of blowing in the mounting process is to destroy the negative pressure condition inside the current nozzle on the one hand, and to use a short period of blowing to blow off the components so that the components on the nozzle can be mounted to the specified position on the other hand. Because the air pressure of the nozzle is still negative before mounting, it is in a state of sucking the components. If the Z-axis rises directly after stopping the air, the components will be carried away. However, if the Z-axis does not rise directly after reaching the mounting position and stops the air, but waits for the negative pressure inside the nozzle to be released before rising, this will cause the Z-axis to stay at the mounting position for a long time and cannot rise. Because when the nozzle just reaches the mounting position, it is in a state of sucking air and sucking the components. The nozzle is blocked by the component, and the air is stopped directly. The natural release speed of the air pressure is very slow, which will lead to very low mounting efficiency. Therefore, adding a blowing operation to the mounting process can quickly destroy the negative pressure environment. At the same time, using a short period of blowing operation, the components can be blown off the nozzle.

[0022] Furthermore, the mounting process is as follows Figure 2 As shown, air pressure management is Figure 3 As shown, after the suction is completed, the placement head starts to move and sends the component to the top of the placement position. After the FPGA control board receives the component placement instruction, the FPGA control board controls the Z axis to descend and sends the component to the placement position. When the component reaches the placement position, blowing begins, and the blowing time of the suction nozzle is 1~10ms, and the blowing time depends on the type of suction nozzle. The blowing time cannot be too long, otherwise the component will be blown away, and it cannot be too short, otherwise the negative pressure condition inside the suction nozzle cannot be destroyed, and the phenomenon of flying or slow placement may occur. In addition, the speed of air pressure destruction is different for different types of suction nozzles. Therefore, selecting the blowing time according to the type of suction nozzle can effectively reduce the mutual influence between the air paths of each suction nozzle and improve the stability of placement. For the selection of the blowing time, it is selected according to the air path components such as the destruction valve, vacuum valve and vacuum valve plate. The present invention has Figure 1 Based on the gas path structure, the data shown in Table 1 are selected as an example according to the binary search method and the actual component mounting effect.

[0023] Table 1 Blowing time corresponding to different nozzle types Nozzle type Blowing time (unit: milliseconds) 301 6 302 5 303 6 304 7 305 7 311 5 Others 5 .

[0024] When the blowing time is reached, the destroying valve corresponding to the suction nozzle is closed, and the blowing ends.

[0025] In the blowing state, the positive pressure inside the nozzle is maintained between 0.05 and 0.3 Mpa, preferably between 0.13 and 0.14 Mpa. Adjust the positive pressure in the air pipe to provide an appropriate pressure for the following purposes: First, to improve the gas transmission efficiency. A higher positive pressure can increase the gas flow rate and flow, enabling the gas to pass through the pipeline system faster and enhancing the transmission effect. Second, there is a certain distance from the gas storage tank to the nozzle. A higher pressure can reduce energy loss and ensure that the gas can reach the nozzle. Third, to improve the system response speed, making the mounter more rapid and accurate when mounting components. However, the positive pressure cannot be too large, as excessive air pressure will cause the components to be blown away.

[0026] In another preferred embodiment, after the blowing is completed, it is judged whether the corresponding nozzle needs to wait and the waiting time according to the mounting instruction, and wait according to the waiting time; if there is no need to wait or after the waiting time ends, the internal air pressure value of the nozzle is obtained in real time, and it is judged whether it is greater than the specified air pressure value. If so, it is judged that the mounting is achieved, and the nozzle is allowed to rise after determining that the mounting is achieved.

[0027] For special components, after reaching the mounting position, the Z-axis needs to wait at the mounting position for a period of time. First, to allow the component to fully contact the solder paste. Second, to more thoroughly destroy the internal air pressure of the nozzle, and use the suction force of the solder paste to make the component mounting effect better. Therefore, after the blowing is completed, the control logic will judge whether it is necessary to wait for a period of time. If so, wait for a period of time and then start the vacuum pressure judgment to further ensure the stable mounting of the component. The waiting time is specified in the mounting instruction. If no waiting time is set, the default waiting time is 0.

[0028] Although the blowing operation during the mounting process quickly destroys the internal air pressure of the nozzle, when the Z-axis is allowed to rise and leave the mounting position still needs to be judged separately. Therefore, in the present invention, by detecting the internal air pressure of the nozzle and checking whether the air pressure is destroyed, when the air pressure is destroyed to a certain value, the Z-axis is allowed to rise to ensure that the component is stably mounted when the Z-axis rises. The FPGA control board will continuously obtain the air pressure value of the vacuum pressure detection board. When the air pressure inside the nozzle drops to the specified air pressure value, the Z-axis is allowed to rise. The specified air pressure value is -50 to (-5) Kpa. For the selection of the specified air pressure value, if it is too large, it will increase the time-consuming of the mounting process and reduce the mounting efficiency; if the selected value is too small, it means that the internal air pressure of the nozzle is less destroyed, the nozzle is closer to the suction state, and when the Z-axis rises, the component will be taken away. For the selection of the air pressure for the Z-axis to rise, it is selected according to the gas path components such as the destruction valve, vacuum valve, and vacuum valve plate. On the basis of the gas path structure of the present invention, according to the binary search method and the actual component mounting effect, the exemplary selected air pressure values are shown in Table 2. Figure 1 Based on the gas path structure, according to the binary search method and the actual component mounting effect, the exemplary selected air pressure values are shown in Table 2.

[0029] Table 2 Specified air pressure values for the Z-axis to allow upward movement of different nozzle types Nozzle type Z-axis rising air pressure (unit: Kpa) 301 -20 302 -20 303 -20 304 -20 305 -20 311 -20 Others -20 。

[0030] Using the method of the embodiment proposed in this application to implement the component mounting process, under the condition that the process parameter is set to the maximum movement speed of 1670 mm / s, the system can achieve a peak mounting rate of 46000 CPH. After conducting mass production-level reliability verification on more than 10000 electronic components, the standard deviation σ of the mounting position accuracy is measured to be ≤ 25 μm (3σ principle), and the yield rate reaches 100% of the process standard. The experimental data shows that no typical process defects such as component misalignment and component loss occur during the chip placement process, and the key quality indicators (CQI) fully meet the requirements of the IPC-A-610G Class III electronic assembly standard. Currently, this invention has been applied to actual products and has been used stably for a long time without any problems.

[0031] Based on the same inventive concept, the second aspect of the embodiment of the present invention provides a component mounting system for a mounter, as Figure 1 shown, including a vacuum pump, an air storage tank, a nozzle, a control board, and a vacuum pressure detection board; The vacuum pump, the air storage tank, and the nozzle are sequentially connected through air pipes. A vacuum valve is provided on the air pipe between the vacuum pump and the air storage tank to control the connection between the vacuum pump and the air storage tank and the nozzle; a break valve is provided on the air pipe between the air storage tank and the nozzle to control the connection between the air storage tank and the nozzle; The control board is used to execute the method for the mounter to stably mount components as described above; The vacuum pressure detection board is used to obtain the air pressure in each air pipe in real time and upload the air pressure data to the control board.

[0032] Further, the capacity of the air storage tank is selected to be 1 - 10 L, the diameter of the air pipe between the vacuum pump and the air storage tank is 2.5 mm - 8 mm, preferably an 8 - numbered air pipe; the diameter of the air pipe between the air storage tank and the nozzle is 1.5 mm - 2 mm, preferably a 4 - numbered air pipe.

[0033] The third aspect of the embodiment of the present invention provides a device for a mounter to stably mount components, including An air suction and inflation module, configured to switch the air pressure state inside the mounter nozzle from air stop to air suction when starting to suck components, and at the same time open the break valve of the air storage tank communicated with the nozzle air path to synchronously inflate the air storage tank; A stop inflation module, configured to close the break valve to stop inflation after the nozzle rises to a specified position; The blowing and mounting module is configured to control the nozzle to descend to the mounting position according to the mounting instruction. After that, the air pressure state is switched from suction to gas stop, and then the breaking valve is opened, and the air storage tank blows air into the nozzle. The blowing time corresponds to the nozzle type to break the negative pressure inside the nozzle to achieve component mounting. The blowing stop module is configured to close the breaking valve corresponding to the nozzle after reaching the blowing time, and the blowing ends.

[0034] In the fourth aspect of the embodiments of the present invention, a computer-readable storage medium is provided, on which a computer program is stored. When the program is executed by a processor, the above method is implemented.

[0035] In summary, the technical solution of the present invention has the following beneficial effects: (1) Based on the air circuit structure of the above system, air is simultaneously filled into the air storage tank during the component suction process so as to blow air into the nozzle during the mounting process, that is, air is filled in advance before mounting, which not only ensures the ability to suck components while improving the mounting efficiency, but also improves the mounting stability; (2) By selecting different blowing times, different Z-axis waiting times, and different specified air pressure values allowing the Z-axis to rise according to different nozzle types, the selection of the above parameters is based on the nozzle type rather than the component type, which not only reduces the complexity of the judgment conditions but also reduces the mutual influence of multiple nozzle air circuits, effectively improving the stability under high-speed mounting; (3) This application meets the requirements of efficient and stable mounting under the condition of air pressure interference among various nozzles, overcomes the problem of difficult-to-avoid component offset or inaccurate mounting during the mounting of micro-components, and is applicable to the application scenarios of pick-and-place machines in high-speed and large-batch production.

[0036] It should also be noted that the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, commodity or device including a series of elements not only includes those elements but also includes other elements not explicitly listed, or further includes elements inherent to such process, method, commodity or device.

[0037] The above are only the embodiments of the present application and are not used to limit the present application. For those skilled in the art, various changes and modifications can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included within the scope of the claims of the present application.

Claims

1. A method for stably mounting components on a mounter, characterized in that, It includes the following steps: When starting to pick up components, switch the internal air pressure state of the pick-and-place nozzle from air stop to air suction, and at the same time open the rupture valve of the gas storage tank connected to the nozzle air path, so that the gas storage tank is filled with gas synchronously; After the nozzle rises to the specified position, close the rupture valve to stop inflation; After controlling the nozzle to descend to the placement position according to the placement instruction, the air pressure state is switched from air suction to air stop, then open the rupture valve, and blow air from the gas storage tank into the inside of the nozzle. The blowing time corresponds to the type of nozzle to break the negative pressure inside the nozzle to achieve component placement; After reaching the blowing time, close the rupture valve corresponding to the nozzle, and the blowing ends.

2. The method according to claim 1, wherein It also includes After the blowing ends, judge whether the corresponding nozzle needs to wait and the waiting time according to the placement instruction, and wait according to the waiting time; If there is no need to wait or after the waiting time ends, judge whether placement is achieved according to the vacuum pressure. After determining that placement is achieved, allow the nozzle to rise.

3. The method according to claim 2, wherein The judgment of whether placement is achieved according to the vacuum pressure is specifically as follows: obtain the internal air pressure value of the nozzle in real time, and judge whether it is greater than the specified air pressure value. If so, judge that placement is achieved.

4. The method according to claim 3, characterized in that, Both the blowing time and the specified air pressure value are obtained by the binary search method.

5. The method according to claim 4, characterized in that The internal pressure of the gas storage tank after inflation is -9~(-20)Kpa, the blowing time of the nozzle is 1~10ms, and the specified air pressure value is -50~(-5)Kpa.

6. The method according to any one of claims 1 to 5, characterized in that, Under the blowing state, the positive pressure inside the nozzle remains between 0.05~0.3Mpa.

7. A placement system for a mounter, characterized in that, It includes a vacuum pump, a gas storage tank, a nozzle, a control board and a vacuum pressure detection board; The vacuum pump, the gas storage tank and the nozzle are sequentially connected through air pipes. A vacuum valve is provided on the air pipe between the vacuum pump and the gas storage tank to control the connection between the vacuum pump and the gas storage tank and the nozzle; a rupture valve is provided on the air pipe between the gas storage tank and the nozzle to control the connection between the gas storage tank and the nozzle; The control board is used to execute the method according to any one of claims 1-6; The vacuum pressure detection board is used to obtain the air pressure in each air pipe in real time and upload the air pressure data to the control board.

8. The system according to claim 7, wherein The capacity of the gas storage tank is selected to be 1-10L, the diameter of the air pipe between the vacuum pump and the gas storage tank is 2.5mm~8mm; the diameter of the air pipe between the gas storage tank and the nozzle is 1.5mm~2mm.

9. A device for stably mounting components on a chip mounter, characterized in that, It includes An air suction and inflation module, configured to switch the internal air pressure state of the pick-and-place nozzle from air stop to air suction when starting to pick up components, and at the same time open the rupture valve of the gas storage tank connected to the nozzle air path, so that the gas storage tank is filled with gas synchronously; A stop inflation module, configured to close the rupture valve to stop inflation after the nozzle rises to the specified position; A blowing and placement module, configured to control the nozzle to descend to the placement position according to the placement instruction, switch the air pressure state from air suction to air stop, then open the rupture valve, and blow air from the gas storage tank into the inside of the nozzle. The blowing time corresponds to the type of nozzle to break the negative pressure inside the nozzle to achieve component placement; A stop blowing module, configured to close the rupture valve corresponding to the nozzle after reaching the blowing time, and the blowing ends.

10. A computer-readable storage medium having a computer program stored thereon, wherein the program, when executed by a processor, implements the method according to any one of claims 1-6.

Images